A method and apparatus for laser parallel manufacturing of a terahertz traveling wave tube slow wave structure

Abstract

The application provides a terahertz traveling wave tube slow wave structure laser parallel manufacturing method and equipment, relates to the field of precise laser processing technology, and the method first unifies the coordinate system reference of galvanometer processing and laser rotary cutting processing, plans a processing path and parameters and sets galvanometer processing priority start; after workpiece one-time clamping positioning, the micro groove structure with a tapered side wall is prepared by galvanometer processing, laser rotary cutting processing is started to remove the side wall taper after reaching the preset time, and the two processing modes are synchronously and parallelly operated until all the micro groove processing is completed. The equipment integrates independent galvanometer processing modules and laser rotary cutting processing modules, and can realize parallel processing through collaborative motion. The application solves the technical problem that the micro groove side wall is inclined and it is difficult to obtain a high-verticality straight-wall micro groove due to the light diffraction effect of the existing ultraviolet lithography-electroforming-injection molding process, and can prepare a slow wave structure meeting the transmission requirements of the terahertz frequency band.

Description

Technical Field

[0001] This invention relates to the field of precision laser processing technology, and in particular to a method for parallel laser manufacturing of a slow-wave structure for a terahertz traveling-wave tube. Background Technology

[0002] Terahertz technology, situated between microwaves and infrared light, holds significant promise for applications in high-speed communication, radar detection, biomedical imaging, and space science. As a crucial core radiation source, the terahertz traveling wave tube's output power, bandwidth, and efficiency are directly determined by the fabrication precision of its internal folded waveguide slow-wave structure. To ensure stable electromagnetic wave transmission modes, reduce energy loss, and meet miniaturization requirements, this slow-wave structure typically requires the fabrication of micro-groove arrays with high aspect ratios and extremely high sidewall verticality.

[0003] In the field of microstructure fabrication, ultraviolet lithography-electroforming-injection molding (UV-LIGA) is a relatively mature mass production technology. This process begins by spin-coating a layer of UV-sensitive photoresist (such as SU-8 photoresist) onto a flat substrate (such as a silicon wafer or glass). Then, a photomask is used to cover the substrate, and exposure to UV light transfers the microgroove pattern from the photomask to the photoresist layer. After development, the unexposed areas of the photoresist are dissolved, forming a three-dimensional photoresist mold with the desired microgroove structure on the substrate. Next, the electroforming process begins: using the photoresist mold as the cathode, metal is electrochemically deposited (usually nickel) on the inner walls and bottom of the photoresist microgrooves in an electrolyte until the microgrooves are filled and a robust metal layer is formed. Once the metal layer reaches the required thickness, it is separated from the substrate and photoresist to obtain a metal master mold with the microgroove structure. Finally, using this metal master mold, thermoplastic polymers (such as PMMA and PC) are injected into the mold cavity through injection molding. After cooling and solidification, the parts are demolded, and microgroove structures made of polymer materials can be mass-produced.

[0004] However, the aforementioned existing technologies still have certain drawbacks: during ultraviolet lithography, due to the diffraction effect of light, the sidewalls of the exposed pattern in the photoresist depth direction are prone to tilting, rather than the ideal 90-degree vertical walls. Therefore, the sidewall verticality of the final part is difficult to meet the stringent requirements for waveguide transmission characteristics in the terahertz frequency band. Summary of the Invention

[0005] This application provides a laser parallel manufacturing method and equipment for terahertz traveling wave tube slow wave structures, which solves the technical problem in the prior art of obtaining high-quality vertical sidewall microgroove structures when processing terahertz traveling wave tube folded waveguide slow wave structures.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a method for parallel laser manufacturing of a terahertz traveling wave tube slow-wave structure, comprising the following steps: S1. Construct coordinate systems for galvanometer processing and laser rotary cutting, and unify their reference systems; S2. Obtain the three-dimensional model of the slow-wave structure of the terahertz traveling wave tube to be processed, and plan the galvanometer processing path and parameters and the laser rotary cutting processing path and parameters respectively. S3. Set the start time for galvanometer processing and laser rotary cutting respectively, wherein the start time for galvanometer processing is earlier than the start time for laser rotary cutting. S4. Clamp the part to be processed onto the processing platform and position it at once; S5. Start the galvanometer processing and process the microgroove structure with tapered sidewalls along the planned path; S6. When the set laser rotary cutting start time is reached, the laser rotary cutting process is started, and the side wall taper is removed along the processed microgroove path to obtain a straight wall microgroove structure. S7. While the laser rotary cutting process is underway, the galvanometer continues to process new microgroove segments in parallel along the unprocessed path until the microgroove structure of the entire part is manufactured.

[0007] Because this method unifies the coordinate system reference of the galvanometer and the laser rotary cutting process and adopts the one-time clamping and positioning of the part, the microgroove structure with tapered sidewalls is first rapidly formed by the galvanometer, and then the laser rotary cutting process is started to remove the tapered sidewall along the processed microgroove. The two processing methods are carried out synchronously and in parallel, so the sidewall tilting problem caused by photolithography diffraction can be avoided, thereby producing a high verticality straight wall microgroove structure. At the same time, parallel processing can also save the time loss of step-by-step processing and improve manufacturing efficiency.

[0008] As a further improvement to the above solution, in step S6, the laser rotary cutting process is only scanned along the two side walls of the microgroove, and each layer is scanned once; this can significantly reduce the laser scanning path and reduce invalid processing actions, while efficiently removing the side wall taper and significantly improving the side wall finishing efficiency.

[0009] As a further improvement to the above scheme, the entire processing is divided into three stages in the depth direction; In the first stage, the shallow microgrooves are formed by galvanometer processing; In the second stage, galvanometer processing and laser rotary cutting are carried out simultaneously. Galvanometer processing is responsible for removing material, while laser rotary cutting is responsible for taper finishing of the sidewalls of the processed section. In the third stage, galvanometer processing and laser rotary cutting continue to be carried out in parallel, ultimately forming a straight-walled microgroove structure; This ensures the structural precision and molding quality of the straight-walled microgroove.

[0010] As a further improvement to the above scheme, the processing depth in the first stage is 0-15μm, and the galvanometer processing scanning speed is 500mm / s; The processing depth in the second stage is 15–75 μm, the scanning speed of the galvanometer is 200 mm / s, and the scanning speed of the laser rotary cutting is 200 mm / s. The processing depth of the third stage is 75-105μm, the scanning speed of the galvanometer is 300mm / s, and the scanning speed of the laser rotary cutting is 500mm / s. Thus, by using shallow rapid prototyping, medium-layer stable processing, and deep high-efficiency fine finishing, the processing efficiency at each stage and the verticality of the microgroove sidewalls can be balanced.

[0011] As a further improvement to the above scheme, during galvanometer processing, the microgroove trajectory is reciprocated within each processing layer, the spacing between adjacent scanning trajectories is 24μm, each layer is reciprocated three times, and the spot diameter of the galvanometer processing is 30μm.

[0012] This invention also discloses a terahertz traveling wave tube slow-wave structure laser parallel manufacturing equipment, which includes a machine tool base, with beds on the left and right sides of the machine tool base, and a Y-axis motion component above each of the left and right beds. A processing platform is located directly above the machine tool base and between the left and right beds. A galvanometer processing module and a laser rotary cutting processing module are straddling the left and right beds. The galvanometer processing module and the laser rotary cutting processing module are respectively connected to the Y-axis motion component and can move back and forth relative to the Y-axis motion component. Since the equipment integrates independent galvanometer and laser rotary cutting processing modules, and the two modules can move independently along the Y-axis, combined with the single-clamp processing platform, there is no need for repeated clamping and secondary positioning, eliminating multi-process positioning errors, simplifying the process flow, and ensuring parallel processing accuracy.

[0013] As a further improvement to the above solution, the galvanometer processing module includes a gantry beam, which cooperates with the Y-axis motion component to form a Y-axis linear motion axis. An X-axis motion component is mounted on the gantry beam to form an X-axis linear motion axis. A slide plate is connected to the X-axis motion component, and a Z-axis motion component is mounted on the slide plate to form a Z-axis linear motion axis. A slider is connected to the Z-axis motion component, and a galvanometer processing head is mounted on the slider. The galvanometer processing head includes a C-axis component, an A-axis component, and a galvanometer. The C-axis component is a C-axis rotary motion axis, and the A-axis component is an A-axis rotary motion axis.

[0014] As a further improvement to the above solution, the galvanometer processing module also includes a laser and a beam transmission system. The laser is an infrared femtosecond laser with a wavelength of 1030nm, a pulse width of 500fs to 10ps, a frequency of 1kHz to 100kHz, and a power of 0 to 20W. The characteristics of this laser pulse and power are adapted to the requirements of high-speed material removal, enabling efficient rough processing of the galvanometer and rapid prototyping of microgrooves.

[0015] As a further improvement to the above solution, the laser rotary cutting module includes a gantry beam II, an X-axis motion component II is mounted on the gantry beam II, a slide plate II is connected to the X-axis motion component II, a Z-axis motion component II is mounted on the slide plate II, a slider II is connected to the Z-axis motion component II, and a laser rotary cutting head is mounted on the slider II.

[0016] As a further improvement to the above solution, the laser rotary cutting module also includes a second laser and a second beam transmission system. The second laser is a green femtosecond laser with a wavelength of 532nm, a pulse width of 300fs to 10ps, a frequency of 1kHz to 100kHz, and a power of 0 to 50W. The laser's focusing accuracy and energy are adapted to the sidewall finishing requirements, which can efficiently remove the taper without damaging the substrate, ensuring that the microgroove sidewalls meet the high verticality requirements.

[0017] As can be seen from the above technical solutions, the present invention has at least the following technical effects or advantages: This method unifies the coordinate system references of the galvanometer and laser rotary cutting, and uses a single-clamping and positioning of the part. First, the galvanometer rapidly forms a microgroove structure with tapered sidewalls. Then, laser rotary cutting removes the sidewall tapering along the pre-processed microgroove. Since both processing methods operate simultaneously and in parallel, the sidewall tilting problem caused by photolithography diffraction can be avoided, thus producing a highly vertical straight-walled microgroove structure. Furthermore, parallel processing eliminates the time lost in step-by-step processing, improving manufacturing efficiency. Because the equipment integrates independent galvanometer and laser rotary cutting modules, and the two modules can move independently along the Y-axis, combined with a single-clamping processing platform, there is no need for repeated clamping and secondary positioning, eliminating multi-process positioning errors, simplifying the process flow, and ensuring the accuracy of parallel processing. Attached Figure Description

[0018] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Figure 1 This is an isometric schematic diagram of the machine tool; Figure 2 yes Figure 1A magnified view of a portion of the laser rotary cutting module; Figure 3 It is a sectional view of the machine tool perpendicular to the X-axis direction; Figure 4 It is a cross-sectional view of the machine tool facing the galvanometer machining head and perpendicular to the Y-axis. Figure 5 This is a top view of a terahertz traveling wave tube folded waveguide slow wave structure; Figure 6 This is a schematic diagram showing the start of operation of the galvanometer processing head; Figure 7 This is a schematic diagram showing the parallel manufacturing of the galvanometer processing head and the rotary cutting head.

[0019] Explanation of reference numerals in the attached drawings: 1. Machine tool base; 2. Bed; 3. Y-axis motion assembly; 4. Galvanometer machining module; 41. Gantry beam; 42. X-axis motion assembly; 43. Slide; 44. Z-axis motion assembly; 45. Slider; 46. Galvanometer machining head; 461. C-axis assembly; 462. A-axis assembly; 463. Galvanometer; 47. Laser; 48. Beam transmission system; 5. Laser rotary cutting module. 51. Gantry beam II; 52. X-axis motion assembly II; 53. Slide plate II; 54. Z-axis motion assembly II; 55. Slider II; 56. Laser rotary cutting head; 57. Laser II; 58. Beam transmission system II; 6. Processing platform; 7. Workpiece; 71. Microgroove structure; 711. Roughing microgroove; 712. Fine machining microgroove; 72. Workpiece substrate; 81. Infrared femtosecond laser beam; 82. Green femtosecond laser beam. Detailed Implementation

[0020] To enable those skilled in the art to better understand the technical solutions of this invention, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this patent, other embodiments obtained by those skilled in the art without creative effort are all within the scope of protection of this patent.

[0021] Example 1 This embodiment discloses a laser parallel manufacturing apparatus for a terahertz traveling wave tube slow-wave structure. Please refer to [link / reference]. Figures 1 to 4The terahertz traveling wave tube slow-wave structure laser parallel manufacturing equipment provided by this invention includes a machine tool base 1. Beds 2 are fixedly mounted on the left and right sides of the machine tool base 1, and Y-axis motion components 3 are arranged above each of the bed 2. A processing platform 6 for fixing a workpiece 7 is installed directly above the machine tool base 1, between the left and right bed 2. A galvanometer processing module 4 and a laser rotary cutting processing module 5 are arranged across the left and right bed 2. The galvanometer processing module 4 and the laser rotary cutting processing module 5 are independently connected to the Y-axis motion components 3 on both sides, thereby enabling them to be driven by the Y-axis motion components 3 along the Y-axis direction (i.e.,...). Figure 1 Independent movement in the front-to-back direction.

[0022] Specifically, the galvanometer processing module 4 includes a gantry beam 41. Both ends of the gantry beam 41 are respectively engaged with the Y-axis motion components 3 on both sides, thereby forming a Y-axis linear motion axis. An X-axis motion component 42 is mounted on the gantry beam 41, thus forming an X-axis linear motion axis. A slide plate 43 is connected to the X-axis motion component 42. A Z-axis motion component 44 is mounted on the slide plate 43 to form a Z-axis linear motion axis. A slider 45 is connected to the Z-axis motion component 44, and a galvanometer processing head 46 is mounted on the slider 45. The galvanometer processing head 46 integrates a C-axis component 461, an A-axis component 462, and a galvanometer 463. The C-axis component 461 can realize rotational motion around the Z-axis (C-axis), and the A-axis component 462 can realize rotational motion around the X-axis (A-axis). Therefore, through the cooperation of the X-axis motion component 42, Y-axis motion component 3, Z-axis motion component 44, C-axis component 461, and A-axis component 462, the galvanometer machining head 46 can achieve five-axis linkage machining, ensuring that the galvanometer laser beam 81 can process complex three-dimensional trajectories at the optimal angle. Furthermore, the galvanometer machining module 4 also includes a laser 47 and a beam transmission system 48. In this embodiment, the laser 47 is an infrared femtosecond laser, the output infrared femtosecond laser beam 81 has a wavelength of 1030nm, a pulse width adjustable between 500fs and 10ps, a repetition frequency adjustable between 1kHz and 100kHz, and an output power adjustable between 0 and 20W.

[0023] The laser rotary cutting module 5 includes a gantry beam 51. An X-axis motion component 52 is mounted on the gantry beam 51, and a slide plate 53 is connected to the X-axis motion component 52. A Z-axis motion component 54 is mounted on the slide plate 53, and a slider 55 is connected to the Z-axis motion component 54. A laser rotary cutting head 56 is mounted on the slider 55. The laser rotary cutting module 5 can achieve three-dimensional translational positioning of the processing head through the X-axis motion component 52, the Y-axis motion component 3, and the Z-axis motion component 54. Furthermore, the laser rotary cutting module 5 also includes a laser 57 and a beam transmission system 58. In this embodiment, the laser 57 is a green femtosecond laser, and the output green femtosecond laser beam 82 has a wavelength of 532nm, a pulse width adjustable between 300fs and 10ps, a repetition frequency adjustable between 1kHz and 100kHz, and an output power adjustable between 0 and 50W.

[0024] Example 2 Based on the above equipment, this embodiment discloses a laser parallel manufacturing method for a terahertz traveling wave tube slow-wave structure, such as... Figure 5 As shown, the terahertz traveling wave tube folded waveguide slow wave structure has a meandering microgroove channel, which requires the perpendicularity of the sidewalls. The specific steps of this embodiment are as follows: S1. Within the control system, a galvanometer machining coordinate system and a laser rotary cutting coordinate system are constructed respectively. Through precision measurement and calibration technology, the references (origin and axis) of the two coordinate systems are unified to ensure that they work under the same spatial reference. This is a prerequisite for achieving subsequent parallel machining and ensuring accuracy.

[0025] S2. Obtain a three-dimensional model of the slow-wave structure to be processed (e.g., Figure 5 Based on the model, the scanning path, layer depth, scanning speed, and other parameters for galvanometer processing are planned separately, as well as the scanning path (especially for sidewalls), cutting timing, scanning speed, and other parameters for laser rotary cutting. During planning, it is necessary to ensure that the two processing paths are matched in space and time.

[0026] S3. Set the start time for galvanometer processing and laser rotary cutting. The start time of galvanometer processing (T0) is earlier than the start time of laser rotary cutting (T1), that is, galvanometer processing starts first to open up the initial microgroove channel for laser rotary cutting.

[0027] S4. Clamp the workpiece 7 (such as a metal block) to be processed onto the processing platform 6 in one go, and perform precise alignment and positioning. This "one-time clamping" ensures that all subsequent processing steps are based on the same datum, avoiding errors caused by repeated clamping.

[0028] S5. Start the galvanometer processing module 4. The control system drives the galvanometer processing head 46 to move according to the planned path. At the same time, the infrared femtosecond laser beam 81 emitted by the laser 47 is guided by the beam transmission system 48 and focused by the galvanometer 463 onto the surface of the workpiece 7. The galvanometer processing adopts a high-speed scanning method to quickly remove material and process the prototype of the microgroove structure 71 along the planned path (i.e., Figure 6 The rough-machined microgroove 711 shown is an example. Due to the characteristics of galvanometer processing, the sidewalls of the rough-machined microgroove 711 formed in this stage have a certain taper. In this embodiment, the spot diameter of the galvanometer processing is set to 30 μm. Within each processing layer, the infrared femtosecond laser beam 81 reciprocates along the microgroove trajectory, with a spacing of 24 μm between adjacent scanning trajectories. Each layer is reciprocated three times to ensure sufficient material removal.

[0029] S6. When the processing reaches the preset time T1, the laser rotary cutting module 5 is started. At this time, the galvanometer processing head 46 has already processed a microgroove with tapered sidewalls. The laser rotary cutting head 56 scans the two sidewalls of the microgroove segment processed by the galvanometer according to the planned path. The green femtosecond laser beam 82 emitted by the laser 2 57 is output from the laser rotary cutting head 56 via the beam transmission system 2 58. The green femtosecond laser beam 82 operates in a rotary cutting mode, and the angle between the beam and the sidewall can be adjusted to precisely remove the sidewall material, thereby shaping the tapered sidewall into a vertical sidewall, resulting in a finely finished microgroove 712 (e.g., ...). Figure 7 In this step, the laser rotary cutting process only scans along the two side walls of the microgroove, and each layer and each side wall only needs to be scanned once, which is highly efficient.

[0030] At the same time, such as Figure 7 As shown, the galvanometer machining does not stop, but continues to move forward along the unprocessed path, machining new microgrooving segments. This creates a parallel manufacturing mode where galvanometer machining roughs the surface in front, while laser rotary cutting finishes the sidewalls behind. The two processes maintain a certain spatial distance and overlap in time until all microgrooving structures on the entire part are machined.

[0031] Furthermore, to optimize processing efficiency and quality, in this embodiment, the entire processing can be divided into three stages in the depth direction, and different processing parameters can be configured. This embodiment specifically uses the processing of a terahertz traveling wave tube folded waveguide slow wave structure with a depth of 105μm and a groove width of approximately 73μm as an example for illustration.

[0032] First stage (depth 0-15μm): This stage is the initial forming stage, in which the shallow contour of the microgroove is quickly delineated by galvanometer at a high scanning speed of 500mm / s.

[0033] Second stage (depth 15–75 μm): This stage is the main material removal stage. Galvanometer machining continues to remove material at a speed of 200 mm / s. Simultaneously, laser rotary cutting is initiated and follows at a speed of 200 mm / s to synchronously correct the sidewall taper generated by galvanometer machining.

[0034] The third stage (depth 75-105μm): This stage is the final shaping and sidewall finishing stage. The galvanometer processing speed is increased to 300mm / s to complete the bottom shaping, while the laser rotary cutting processing speed is increased to 500mm / s to quickly complete the final depth of sidewall verticality finishing.

[0035] Through the aforementioned methods and equipment, this invention achieves an organic combination of high-speed galvanometer processing and precision laser rotary cutting. Specifically, the galvanometer processing module 4, utilizing its high-speed scanning characteristics, undertakes most of the material removal tasks, significantly improving processing efficiency; the laser rotary cutting module 5 is dedicated to sidewall finishing, effectively eliminating taper and obtaining high-quality vertical sidewalls. The galvanometer processing module 4 and the laser rotary cutting module 5 are integrated on a single piece of equipment and operate in parallel, eliminating repetitive positioning and clamping errors inherent in traditional step-by-step processing, simplifying the process flow, and significantly improving overall manufacturing efficiency while ensuring the critical dimensional accuracy of the terahertz traveling wave tube slow-wave structure.

[0036] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in its embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novelty disclosed herein.

Claims

1. A method for parallel laser manufacturing of a slow-wave structure for a terahertz traveling-wave tube, characterized in that, Includes the following steps: S1. Construct coordinate systems for galvanometer processing and laser rotary cutting, and unify their reference systems; S2. Obtain the three-dimensional model of the slow-wave structure of the terahertz traveling wave tube to be processed, and plan the galvanometer processing path and parameters and the laser rotary cutting processing path and parameters respectively. S3. Set the start time for galvanometer processing and laser rotary cutting respectively, wherein the start time for galvanometer processing is earlier than the start time for laser rotary cutting. S4. Clamp the part to be processed onto the processing platform and position it in one go; S5. Start the galvanometer processing and process the microgroove structure with tapered sidewalls along the planned path; S6. When the set laser rotary cutting start time is reached, the laser rotary cutting process is started, and the side wall taper is removed along the processed microgroove path to obtain a straight wall microgroove structure. S7. While the laser rotary cutting process is underway, the galvanometer continues to process new microgroove segments in parallel along the unprocessed path until the microgroove structure of the entire part is manufactured.

2. The laser parallel manufacturing method for slow-wave structure terahertz traveling-wave tube according to claim 1, characterized in that: In step (6), the laser rotary cutting process is only scanned along the two side walls of the microgroove, and each layer is scanned once.

3. The laser parallel manufacturing method for slow-wave structure terahertz traveling-wave tube according to claim 1, characterized in that: The entire processing is divided into three stages in the depth direction; In the first stage, the shallow microgrooves are formed by galvanometer processing; In the second stage, galvanometer processing and laser rotary cutting are carried out simultaneously. Galvanometer processing is responsible for removing material, while laser rotary cutting is responsible for taper finishing of the sidewalls of the processed section. In the third stage, galvanometer processing and laser rotary cutting continue to be carried out in parallel, ultimately forming a straight-walled microgroove structure.

4. The laser parallel manufacturing method for slow-wave structure terahertz traveling-wave tube according to claim 3, characterized in that: The processing depth in the first stage is 0–15 μm, and the scanning speed of the galvanometer is 500 mm / s. The processing depth in the second stage is 15–75 μm, the scanning speed of the galvanometer is 200 mm / s, and the scanning speed of the laser rotary cutting is 200 mm / s. The processing depth in the third stage is 75–105 μm, the scanning speed of the galvanometer is 300 mm / s, and the scanning speed of the laser rotary cutting is 500 mm / s.

5. The laser parallel manufacturing method for slow-wave structure terahertz traveling-wave tube according to claim 3, characterized in that: During galvanometer processing, the microgroove trajectory is reciprocated within each processing layer, with a spacing of 24μm between adjacent scanning trajectories. Each layer is reciprocated three times, and the spot diameter of the galvanometer processing is 30μm.

6. A laser parallel manufacturing apparatus for a terahertz traveling-wave tube slow-wave structure for implementing the method of any one of claims 1 to 5, characterized in that, The machine tool includes a machine tool base (1), and a bed (2) is provided on the left and right sides of the machine tool base (1). A Y-axis motion assembly (3) is provided on the top of the bed (2) on both sides. A processing platform (6) is provided directly above the machine tool base (1) and between the bed (2) on both sides. A galvanometer processing module (4) and a laser rotary cutting processing module (5) are arranged across the bed (2) on both sides. The galvanometer processing module (4) and the laser rotary cutting processing module (5) are respectively connected to the Y-axis motion assembly (3) and can move back and forth relative to the Y-axis motion assembly (3).

7. The laser parallel manufacturing equipment for terahertz traveling wave tube slow-wave structure according to claim 6, characterized in that: The galvanometer processing module (4) includes a gantry beam (41), which cooperates with the Y-axis motion component (3) to form a Y linear motion axis. An X-axis motion component (42) is provided on the gantry beam (41) to form an X linear motion axis. A slide plate (43) is connected to the X-axis motion component (42). A Z-axis motion component (44) is provided on the slide plate (43) to form a Z linear motion axis. A slider (45) is connected to the Z-axis motion component (44). A galvanometer processing head (46) is installed on the slider (45). The galvanometer processing head (46) includes a C-axis component (461), an A-axis component (462), and a galvanometer (463). The C-axis component (461) is a C-rotational motion axis, and the A-axis component (462) is an A-rotational motion axis.

8. The terahertz traveling wave tube slow-wave structure laser parallel manufacturing equipment according to claim 7, characterized in that: The galvanometer processing module (4) also includes a laser (47) and a beam transmission system (48). The laser (47) is an infrared femtosecond laser with a wavelength of 1030nm, a pulse width of 500fs to 10ps, a frequency of 1kHz to 100kHz, and a power of 0 to 20W.

9. The laser parallel manufacturing equipment for terahertz traveling wave tube slow-wave structure according to claim 6, characterized in that: The laser rotary cutting module (5) includes a gantry beam two (51), an X-axis motion component two (52) is provided on the gantry beam two (51), a slide plate two (53) is connected to the X-axis motion component two (52), a Z-axis motion component two (54) is provided on the slide plate two (53), a slider two (55) is connected to the Z-axis motion component two (54), and a laser rotary cutting head (56) is installed on the slider two (55).

10. The laser parallel manufacturing equipment for terahertz traveling wave tube slow-wave structure according to claim 9, characterized in that: The laser rotary cutting module (5) also includes a second laser (57) and a second beam transmission system (58). The second laser (57) is a green femtosecond laser with a wavelength of 532nm, a pulse width of 300fs to 10ps, a frequency of 1kHz to 100kHz, and a power of 0 to 50W.

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