Method for processing beryllium window by using diamond wire multi-wire saw

Abstract

The application discloses a processing method of a diamond wire multi-wire cutting beryllium window and belongs to the technical field of beryllium materials. The method comprises the following steps: cutting a beryllium ingot into a beryllium bar by using a medium-speed wire cutting machine, processing the shape of the beryllium bar, and making the surface roughness of the beryllium bar not more than 1.6 microns; sticking the beryllium bar into a positioning groove of a plastic supporting plate, fixing the plastic supporting plate with the beryllium bar to a workbench of a diamond wire multi-wire cutting machine, and locking; judging whether the slotting interval of a current diamond wire guide wheel meets the requirement that the thickness tolerance of the beryllium sheet is not more than 0.06 mm, if yes, using the current diamond wire guide wheel, if not, re-slotting the diamond wire guide wheel, and replacing the current diamond wire guide wheel with a newly slotted diamond wire guide wheel; setting the wire speed, feeding speed and tension of the diamond wire multi-wire cutting machine, and slicing the beryllium bar; after the slicing is completed, removing the plastic supporting plate, taking out the beryllium sheet, and cleaning and drying the beryllium sheet. The application improves the slicing efficiency and reduces the surface roughness of the beryllium sheet.

Description

Technical Field

[0001] This invention belongs to the field of beryllium material technology, and particularly relates to a processing method for diamond wire multi-wire cutting of beryllium windows. Background Technology

[0002] Beryllium is the window material with the highest X-ray transmittance. Existing beryllium windows are generally manufactured using wire cutting and beryllium sheet rolling methods. Wire cutting involves machining beryllium ingots into beryllium rods, then cutting them into sheets using wire cutting to form beryllium sheets, followed by surface treatment. Beryllium sheet rolling involves heating beryllium ingots to increase their plasticity, then hot-rolling and warm-rolling to form beryllium plates. Annealing is then performed to remove processing hardness, followed by cold rolling to obtain thinner beryllium sheets. These sheets are then cut to the desired shape using wire cutting. However, both methods have the following drawbacks: I. Disadvantages of beryllium wire EDM: 1) Wire cutting has a lower cutting efficiency than multi-wire cutting. It can only cut single pieces into sheets. Because beryllium is a hard and brittle material, the cutting efficiency can only reach 40~50mm / min, which is relatively low.

[0003] 2) High surface roughness. Because the slicing process can only cut once and cannot achieve the goal of cutting one and repairing three, the roughness can only reach above 3.2μm, which does not meet the requirement of ≤1.6μm in the drawing.

[0004] 3) Obvious surface lines affect the processing efficiency of subsequent grinding processes.

[0005] 4) Because the wire EDM process involves point discharge corrosion and the high processing temperature causes surface oxidation, small pits and blackening of the surface are likely to appear.

[0006] II. Disadvantages of beryllium sheet rolling: 1) Rolling requires multiple processes such as hot rolling, warm rolling, annealing, cold rolling, and cutting. The process involves many steps, has a long cycle, and has low production efficiency.

[0007] 2) Beryllium is a close-packed hexagonal lattice metal. It is brittle, has low plasticity, and its ductility is only 2-3%. Rolling is a type of metal pressure processing. It has poor plasticity and is difficult to process. Hot rolling and warm rolling require appropriate rolling temperatures to change its plasticity.

[0008] 3) Rolling is prone to defects such as cracking on all four sides, uneven surface, pits, and peeling, resulting in low product yield and affecting production efficiency. Summary of the Invention

[0009] To address the aforementioned technical problems, this invention proposes a method for processing beryllium windows using diamond wire multi-wire cutting. This invention improves the efficiency of beryllium sheet slicing and reduces the surface roughness of the beryllium sheet, while controlling the thickness tolerance within 0.06 mm, thus meeting the requirements for beryllium sheet usage.

[0010] The first aspect of this invention provides a method for processing beryllium windows using diamond wire multi-wire cutting, the method comprising: Step S1: Use a medium-speed wire EDM machine to cut beryllium ingots into beryllium rods, and process the shape of the beryllium rods so that their surface roughness does not exceed 1.6μm; Step S2: Attach the beryllium rod to the positioning groove of the plastic tray, and then fix and lock the plastic tray with the beryllium rod attached to the worktable of the diamond wire multi-wire cutting machine. The fitting clearance between the positioning groove and the outer diameter and length of the beryllium rod is 0.01-0.05mm. Step S3: Determine whether the slot spacing of the current diamond wire guide wheel meets the requirement that the beryllium sheet thickness tolerance does not exceed 0.06mm. If it does, use the current diamond wire guide wheel and proceed directly to step S4. If it does not meet the requirement, re-slot the diamond wire guide wheel, replace the current diamond wire guide wheel with the newly slotted diamond wire guide wheel, and then proceed to step S4. Wherein, the slot spacing D of the diamond wire guide wheel is D=R+d+1 / 2a, where R is the diameter of the diamond wire, d is the target thickness of the beryllium sheet, and a is the thickness tolerance of the beryllium sheet; Step S4: After setting the wire feed speed, feed speed and tension of the diamond wire multi-wire cutting machine, the beryllium rod is sliced. Step S5: After slicing, remove the plastic tray, take out the beryllium slices, and clean and dry them.

[0011] According to the method described in the first aspect of the present invention, in step S1, when the beryllium ingot is cut into beryllium rods using a medium-speed wire EDM machine, the allowance for the outer diameter and length of the beryllium rods is 1-2 mm.

[0012] According to the method described in the first aspect of the present invention, in step S1, after the beryllium rod is machined, the tolerance of each position of the beryllium rod is 0.05-0.10 mm.

[0013] According to the method of the first aspect of the present invention, in step S1, the length of the beryllium rod is ≥100mm.

[0014] According to the method of the first aspect of the present invention, in step S1, the chemical composition and mass percentage of the beryllium ingot are: Be≥98.5%, BeO≤1.5%, Fe≤0.13%, Mg≤0.08%, Mn≤0.08%, Si≤0.08%, Be2C≤1.5%, and unavoidable impurity elements≤0.03%.

[0015] According to the method of the first aspect of the present invention, prior to step S4, the relative cutting position of the beryllium rod and the wire mesh is automatically measured and calibrated using a tool setter or vision system of a diamond wire multi-wire cutting machine.

[0016] According to the method described in the first aspect of the present invention, in step S4, the wire feed speed is 480-600 m / min, the feed rate is 0.02-0.06 mm / min, and the tension is 28-32 N.

[0017] According to the method described in the first aspect of the present invention, in step S4, the wire feed speed is 520-570 m / min, the feed rate is 0.03-0.05 mm / min, and the tension is 29-31 N.

[0018] A second aspect of the present invention provides a beryllium window processed using the aforementioned method.

[0019] The solution proposed in this invention has the following technical effects: (1) Improved beryllium plate slicing efficiency. Diamond wire multi-wire cutting machine can cut hundreds of pieces at a time. The advantage in the number of pieces cut at a time greatly improves the cutting efficiency. Moreover, the diameter of the diamond wire is only 0.15mm or even thinner, resulting in a small kerf and reduced material loss.

[0020] (2) The surface roughness is reduced and the surface marks of the beryllium slices are reduced. Because the wire cutting machine has a high wire feed speed, the surface roughness and marks can be controlled by a small feed amount. The surface roughness of the beryllium slices cut by diamond wire can reach within 0.8μm, and the marks are small, with only a small amount of marks at the exit of the blade.

[0021] (2) The thickness tolerance is within 0.06mm, which meets the requirements for the use of beryllium sheets. Diamond wire multi-wire cutting controls the wire spacing by slotting the diamond wire guide wheel. The diamond wire guide wheel can be obtained by lathe machining, and its slotting accuracy can reach within 0.02mm. Although the diamond wire guide wheel is worn during the diamond wire multi-wire cutting process, after multiple uses, the thickness tolerance of the slice can still reach within 0.06mm, which meets the requirement of a thickness tolerance of within 0.10mm required by the beryllium sheet drawings.

[0022] (4) Fewer processes, improved production efficiency. Diamond wire multi-wire cutting of beryllium sheets only requires processing beryllium ingots into rods that meet the required external dimensions. After diamond wire multi-wire cutting, beryllium sheets can be sliced. The production process is less and the precision is higher, thus improving production efficiency. Attached Figure Description

[0023] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of a diamond wire multi-wire cutting method for processing beryllium windows according to one embodiment of the present invention.

[0025] Figure 2 This is a schematic diagram of the structure of a plastic tray in one embodiment of the present invention.

[0026] Figure 3 for Figure 2 A schematic diagram of the cross-sectional structure.

[0027] Figure 4 This is a schematic diagram of the structure of the diamond wire guide wheel in one embodiment of the present invention.

[0028] Figure 5 for Figure 4 This is a schematic diagram of the cross-sectional structure. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] One embodiment of the present invention provides a method for processing beryllium windows using diamond wire multi-wire cutting, such as... Figure 1 As shown. The method includes: Step S1: Use a medium-speed wire EDM machine to cut beryllium ingots into beryllium rods, and process the shape of the beryllium rods so that their surface roughness does not exceed 1.6μm.

[0031] Step S2: Attach the beryllium rod to the positioning groove of the plastic tray, and then fix and lock the plastic tray with the beryllium rod attached to the worktable of the diamond wire multi-wire cutting machine.

[0032] The structure of the plastic pallet is as follows Figure 2 and Figure 3 As shown, the fitting clearance between the positioning groove and the outer diameter and length of the beryllium rod is 0.01-0.05mm.

[0033] Step S3: Use calipers to measure whether the slot spacing of the current diamond wire guide wheel meets the beryllium sheet thickness tolerance of no more than 0.06mm. If it meets the requirement, use the current diamond wire guide wheel and proceed directly to step S4. If it does not meet the requirement, re-slot the diamond wire guide wheel, replace the current diamond wire guide wheel with the newly slotted diamond wire guide wheel, and then proceed to step S4.

[0034] The structure of the diamond wire guide wheel is as follows Figure 4 and Figure 5As shown, the slot spacing D of the diamond wire guide wheel is D = R + d + 1 / 2a, where R is the diameter of the diamond wire, d is the target thickness of the beryllium sheet, and a is the thickness tolerance of the beryllium sheet.

[0035] Step S4: After setting the wire feed speed, feed rate and tension of the diamond wire multi-wire cutting machine, the beryllium rod is sliced.

[0036] Step S5: After slicing, remove the plastic tray and take out the beryllium wafer. Clean the surface of the beryllium wafer with anhydrous ethanol to remove any remaining adhesive, debris and dirt. Then dry the beryllium wafer in an oven.

[0037] In some embodiments, in step S1, when the beryllium ingot is cut into beryllium rods using a medium-speed wire EDM machine, the allowance for the outer diameter and length of the beryllium rods is 1-2 mm.

[0038] In some embodiments, after machining the shape of the beryllium rod in step S1, the tolerance of each position of the beryllium rod is 0.05-0.10 mm.

[0039] In some embodiments, in step S1, the length of the beryllium rod is ≥100mm.

[0040] In some embodiments, in step S1, the chemical composition and mass percentage of the beryllium ingot are: Be≥98.5%, BeO≤1.5%, Fe≤0.13%, Mg≤0.08%, Mn≤0.08%, Si≤0.08%, Be2C≤1.5%, and unavoidable impurity elements≤0.03%.

[0041] In some embodiments, prior to step S4, the relative cutting position of the beryllium rod and the wire mesh is automatically measured and calibrated using a tool setter or vision system of a diamond wire multi-wire cutting machine.

[0042] In some embodiments, in step S4, the wire feed speed is 480-600 m / min, the feed rate is 0.02-0.06 mm / min, and the tension is 28-32 N.

[0043] In some embodiments, in step S4, the wire feed speed is 520-570 m / min, the feed rate is 0.03-0.05 mm / min, and the tension is 29-31 N.

[0044] Because beryllium wafers are thin-walled products, excessively low wire feed speeds and excessively high feed rates, while resulting in high cutting speeds and slicing efficiency, will lead to noticeable wire marks and reduced surface roughness. Therefore, this invention strictly limits the wire feed speed to 480-600 m / min and the feed rate to 0.02-0.06 mm / min.

[0045] In some embodiments, the diamond wire multi-wire cutting machine is an 800-type diamond wire multi-wire cutting machine, which can cut 600 slices at a time. Larger models can cut even more slices at once, and this advantage in the number of slices cut at one time greatly improves cutting efficiency.

[0046] Example 1 (Φ22) ×0.8 mm beryllium plate) First, cut the beryllium ingot into beryllium rods with a diameter of 23×200mm, and then machine them to a diameter of 22mm using a lathe. ×200mm, after cleaning, sliced ​​using a diamond wire multi-wire cutter. Wire feed speed: 600m / min, feed rate: 0.06mm / min, tension: 28N, slice thickness: 0.8mm. mm, after cleaning and drying, packaging is completed.

[0047] Example 2 (28×5×0.8) mm beryllium plate) First, the beryllium ingot is cut into beryllium rods of 30×7×200mm. These rods are then machined to 28×5×200mm using a machining center. After cleaning, they are sliced ​​using a diamond wire cutting machine at a wire speed of 560m / min, a feed rate of 0.03mm / min, a tension of 30N, and a slice thickness of 0.8mm. mm, after cleaning and drying, packaging is completed.

[0048] Example 3 (85) ×20 ×2 mm beryllium plate) First, cut the beryllium ingot into beryllium rods measuring 86×21×200mm. Then, process the rods to 85mm thickness. ×20 ×200mm, after cleaning, sliced ​​using a diamond wire multi-wire cutting machine. Wire feed speed: 480m / min, feed rate: 0.02mm / min, tension: 32N, slice thickness: 2. mm, after cleaning and drying, packaging is completed.

[0049] In another aspect, the present invention proposes a beryllium window processed using the aforementioned method.

[0050] In summary, the solution proposed in this invention has the following technical effects: (1) Improved beryllium plate slicing efficiency. Diamond wire multi-wire cutting machine can cut hundreds of pieces at a time. The advantage in the number of pieces cut at a time greatly improves the cutting efficiency. Moreover, the diameter of the diamond wire is only 0.15mm or even thinner, resulting in a small kerf and reduced material loss.

[0051] (2) The surface roughness is reduced and the surface marks of the beryllium slices are reduced. Because the wire cutting machine has a high wire feed speed, the surface roughness and marks can be controlled by a small feed amount. The surface roughness of the beryllium slices cut by diamond wire can reach within 0.8μm, and the marks are small, with only a small amount of marks at the exit of the blade.

[0052] (2) The thickness tolerance is within 0.06mm, which meets the requirements for the use of beryllium sheets. Diamond wire multi-wire cutting controls the wire spacing by slotting the diamond wire guide wheel. The diamond wire guide wheel can be obtained by lathe machining, and its slotting accuracy can reach within 0.02mm. Although the diamond wire guide wheel is worn during the diamond wire multi-wire cutting process, after multiple uses, the thickness tolerance of the slice can still reach within 0.06mm, which meets the requirement of a thickness tolerance of within 0.10mm required by the beryllium sheet drawings.

[0053] (4) Fewer processes, improved production efficiency. Diamond wire multi-wire cutting of beryllium sheets only requires processing beryllium ingots into rods that meet the required external dimensions. After diamond wire multi-wire cutting, beryllium sheets can be sliced. The production process is less and the precision is higher, thus improving production efficiency.

[0054] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for processing beryllium windows using diamond wire multi-wire cutting, characterized in that, include: Step S1: Use a medium-speed wire EDM machine to cut beryllium ingots into beryllium rods, and process the shape of the beryllium rods so that their surface roughness does not exceed 1.6μm; Step S2: Attach the beryllium rod to the positioning groove of the plastic tray, and then fix and lock the plastic tray with the beryllium rod attached to the worktable of the diamond wire multi-wire cutting machine. The fitting clearance between the positioning groove and the outer diameter and length of the beryllium rod is 0.01-0.05mm. Step S3: Determine whether the slot spacing of the current diamond wire guide wheel meets the requirement that the beryllium sheet thickness tolerance does not exceed 0.06mm. If it does, use the current diamond wire guide wheel and proceed directly to step S4. If it does not meet the requirement, re-slot the diamond wire guide wheel, replace the current diamond wire guide wheel with the newly slotted diamond wire guide wheel, and then proceed to step S4. Wherein, the slot spacing D of the diamond wire guide wheel is D=R+d+1 / 2a, where R is the diameter of the diamond wire, d is the target thickness of the beryllium sheet, and a is the thickness tolerance of the beryllium sheet; Step S4: After setting the wire feed speed, feed speed and tension of the diamond wire multi-wire cutting machine, the beryllium rod is sliced. Step S5: After slicing, remove the plastic tray, take out the beryllium slices, and clean and dry them.

2. The method according to claim 1, characterized in that, In step S1, when the beryllium ingot is cut into beryllium rods using a medium-speed wire EDM machine, the allowance for the outer diameter and length of the beryllium rods is 1-2 mm.

3. The method according to claim 2, characterized in that, In step S1, after machining the shape of the beryllium rod, the tolerance of each position of the beryllium rod is 0.05-0.10mm.

4. The method according to claim 1, characterized in that, In step S1, the length of the beryllium rod is ≥100mm.

5. The method according to claim 1, characterized in that, In step S1, the chemical composition and mass percentage of the beryllium ingot are: Be≥98.5%, BeO≤1.5%, Fe≤0.13%, Mg≤0.08%, Mn≤0.08%, Si≤0.08%, Be2C≤1.5%, and unavoidable impurity elements≤0.03%.

6. The method according to claim 1, characterized in that, Before step S4, the relative cutting position of the beryllium rod and the wire mesh is automatically measured and calibrated using the tool setter or vision system of the diamond wire multi-wire cutting machine.

7. The method according to claim 1, characterized in that, In step S4, the wire feed speed is 480-600 m / min, the feed rate is 0.02-0.06 mm / min, and the tension is 28-32 N.

8. The method according to claim 7, characterized in that, In step S4, the wire feed speed is 520-570 m / min, the feed rate is 0.03-0.05 mm / min, and the tension is 29-31 N.

9. A beryllium window processed using the method described in any one of claims 1-8.

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