Composite processing technology of temperature control plate

Abstract

The present application aims to provide a kind of composite processing technology of temperature control plate.The process of the present application comprises the following steps: step A, blanking: material is selected from AL6061 material, which has good heat conductivity and is easy to process;the length, width and height are appropriately reserved for processing allowance;step B, CNC rough machining: double-sided rough milling, removing material scale and tool marks, the length, width and height of the outer shape are reserved for about allowance after rough milling, all slots, screw holes and counterbores are rough machined;step C, material stress relief: annealing treatment, releasing internal stress of machining, preventing machining deformation;step D, CNC semi-finishing: semi-finishing of the outer shape, reserving machining allowance for the length, width and height, completing machining of the back surface at one time, retaining ordinary milling marks, finely finishing slots to ensure accuracy tolerance;reserving machining allowance for the front surface for precise mirror milling.The present application is applied to the technical field of temperature control plate processing.

Description

Technical Field

[0001] This invention relates to the technical field of temperature control board processing, and particularly to a composite processing technology for temperature control boards. Background Technology

[0002] The temperature control board, acting as the "smart manager" of the equipment, is specifically responsible for sensing temperature and directing the heating or cooling elements to maintain a stable temperature within the set range. Unlike a simple switch, it contains sensors and a control chip that automatically switches the circuit on and off based on temperature changes. The temperature control board requires high mechanical performance: its application involves mechanical friction, with approximately 1 kg of force acting on the soft thermally conductive material and rubbing against it in only one direction. Therefore, it needs to minimize frictional losses between the soft thermally conductive material and the temperature control board. Consequently, the temperature control board requires a sufficiently high surface finish and a low coefficient of friction. Furthermore, because the friction is only in one direction, it must be machined with grooves in only one direction; if the grooves are required to be vertical, horizontal grooves are not permitted.

[0003] However, existing processing technologies struggle to simultaneously meet both mechanical and temperature performance requirements. To achieve high surface finish, current methods often involve a two-step process: milling followed by polishing. However, this polishing process introduces textured lines in different directions, resulting in a disordered grain pattern on the processed material and preventing the creation of a uniform texture in one direction. For example, Chinese patent CN1977068A discloses a spray head electrode assembly for a plasma processing device, which also fails to simultaneously meet both mechanical and temperature performance requirements. Therefore, it is necessary to provide a composite processing technology for temperature control boards that satisfies both surface finish and vertical texture requirements in a single milling operation, while also meeting extremely high temperature stability requirements. Furthermore, by hot-pressing, the heat source is directly bonded to the back of the part, reducing thermal resistance during heat transfer and achieving rapid and precise temperature control. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a composite processing technology for temperature control board. Through a single milling process, the requirements for surface finish and vertical texture are met, and the requirements for extremely high temperature stability are met. The heat source is directly attached to the back of the part by hot pressing, which reduces the thermal resistance in the heat transfer process and achieves fast and accurate temperature control.

[0005] The technical solution adopted in this invention is as follows: the process includes the following steps: Step A, Material preparation: AL6061 material is selected, which has good thermal conductivity and is easy to process; appropriate processing allowances are reserved for length, width and height; Step B, CNC rough machining: Double-sided rough milling to remove oxide scale and tool marks from the material. After rough milling, leave a margin for the length, width and height of the outer shape. Roughly machine all slots, screw holes and countersunk holes. Step C, Material stress relief: Annealing treatment to release internal stress during machining and prevent deformation during processing; Step D, CNC semi-finishing: Semi-finishing of the outer shape, with machining allowances reserved for length, width and height, the back side is machined in one go, retaining ordinary milling marks, and the holes and slots are finely finished to ensure accuracy tolerances; machining allowances are reserved for the front side for precision mirror milling. Step E, CNC precision mirror milling: Use a high-speed machining center with zircon inserts, small depth of cut, high speed for precision machining. Note that the tool marks are vertical and the tool marks only appear in specific areas. Only machine the front side, with a surface roughness of Ra0.1 and a flatness of less than 0.05 for the entire board. The machining should be completed in one go without polishing. If polishing is performed in a second machining step, the texture will be disordered after machining, and the vertical lines in one direction cannot be guaranteed. Step F, Deburring and Chamfering: Chamfer sharp edges, orifices, and grooves to prevent sharp corner penetration and film chipping defects during hard oxidation; Step G, Hard Anodizing: Strictly control the temperature, time, and other conditions of low-temperature sulfuric acid hard anodizing. The film thickness is 30µm to 40µm. This thickness is conducive to forming a low surface deformation, while meeting the requirements of suitable wear resistance and a low coefficient of friction. The back side retains the oxidation micropores to ensure the bonding strength of the silicone vulcanization. The front, sides, and all inner walls of the grooves are sealed at room temperature to improve corrosion resistance and stain resistance. After oxidation, the surface is cleaned with pure water in multiple stages and dried at low temperature, requiring no residue, no whitening, and no powdering. The surface roughness after hard anodizing is no higher than Ra0.4. The smoothness is tested by wrapping a soft thermally conductive material with a 1kg weight, and the coefficient of friction is no higher than 0.21. Step H: High-temperature vulcanization and hot-pressing of silicone.

[0006] As can be seen from the above scheme, this application adopts a single milling process to achieve high surface finish and vertical machining texture. Using a high-hardness zircon end mill, a single milling operation directly achieves a surface finish of Ra0.1 or less after machining. Simultaneously, the machining texture is controlled, with tool marks appearing only in specific areas. No polishing is performed; a single milling operation achieves the required surface finish and vertical machining texture. Surface hard anodizing treatment achieves higher wear resistance and a lower coefficient of friction. Existing materials are typically used directly after machining or surface treatment is usually anodizing. However, no surface treatment or surface anodizing is not the most reasonable approach. To achieve higher wear resistance and a lower coefficient of friction, a hard anodizing surface treatment method is adopted. After a single milling operation and surface hard anodizing treatment, the surface roughness of the part is less than Ra0.4; compared with ordinary anodizing treatment, the hardness is nearly doubled, and the coefficient of friction is lower. Hot-pressed silicone and heating wire on the back of the sheet metal achieve controllable heat source heating capability. Typical structural parts do not have heat sources. If heat conduction is required, they are usually connected to the heat source by heat conduction. This method can meet the temperature requirements in most cases, but it is difficult to meet the stability requirements under high-precision temperature fluctuations. In order to achieve the extremely high temperature stability requirement of ±0.01℃, this application uses hot pressing to directly attach the heat source to the back of the part, which reduces the thermal resistance in the heat transfer process and achieves fast and accurate temperature control.

[0007] A preferred embodiment is that step H includes the following: First, pretreatment is performed: the back is degreased and dusted with acetone or anhydrous ethanol, and coated with aluminum-specific silicone hot vulcanizing primer, and then dried at room temperature until the surface is no longer sticky. Secondly, material stacking and alignment are required, and pre-formed silicone heating wire interlayers are used. Heating wire + semi-raw silicone substrate is precisely adhered to the back of the aluminum plate. Screw holes and wire exit points need to be avoided and protected. Simultaneously, the heating area needs to be segmented. Segmented segmentation means that different heating areas need to be controlled independently, the heating wire is individually controlled, and there are three individually controlled wire exits. The vulcanized silicone is fused together. Segmented segmentation and independent control ensure that temperature fluctuations at all eight temperature points on the control board are within ±0.01℃ of the target temperature. Without segmentation, it is difficult to achieve stable temperatures under the condition of whole-plate vulcanization. Then, high-temperature hot-press vulcanization is carried out, controlling the hot-pressing temperature and maintaining a holding pressure. After holding the pressure, vulcanization is performed. Finally, the mold is cooled and set, and then naturally cooled to below 45°C under pressure before demolding to prevent delamination and bubbling caused by high-temperature stretching. Attached Figure Description

[0008] Figure 1 This is a 3D structural diagram of the temperature control board; Figure 2 This is a diagram showing the processing requirements for the temperature control board; Figure 3 This is a diagram of the hot-pressed heating wire structure on the back of the temperature control board; Figure 4 This is a process flow diagram of the present invention. Detailed Implementation

[0009] like Figures 1 to 4 As shown, in this embodiment, the process includes the following steps: Step A, Material preparation: AL6061 material is selected, which has good thermal conductivity and is easy to process; appropriate processing allowances are reserved for length, width and height; Step B, CNC rough machining: Double-sided rough milling to remove oxide scale and tool marks from the material. After rough milling, leave a margin for the length, width and height of the outer shape. Roughly machine all slots, screw holes and countersunk holes. Step C, Material stress relief: Annealing treatment to release internal stress during machining and prevent deformation during processing; Step D, CNC semi-finishing: Semi-finishing of the outer shape, with machining allowances reserved for length, width and height, the back side is machined in one go, retaining ordinary milling marks, and the holes and slots are finely finished to ensure accuracy tolerances; machining allowances are reserved for the front side for precision mirror milling. Step E, CNC precision mirror milling: Use a high-speed machining center with zircon inserts, small depth of cut, high speed for precision machining. Note that the tool marks are vertical and the tool marks only appear in specific areas. Only machine the front side, with a surface roughness of Ra0.1 and a flatness of less than 0.05 for the entire board. The machining should be completed in one go without polishing. If polishing is performed in a second machining step, the texture will be disordered after machining, and the vertical lines in one direction cannot be guaranteed. Step F, Deburring and Chamfering: Chamfer sharp edges, orifices, and grooves to prevent sharp corner penetration and film chipping defects during hard oxidation; Step G, Hard Anodizing: Strictly control the temperature, time, and other conditions of low-temperature sulfuric acid hard anodizing. The film thickness is 30µm to 40µm. This thickness is conducive to forming a low surface deformation, while meeting the requirements of suitable wear resistance and a low coefficient of friction. The back side retains the oxidation micropores to ensure the bonding strength of the silicone vulcanization. The front, sides, and all inner walls of the grooves are sealed at room temperature to improve corrosion resistance and stain resistance. After oxidation, the surface is cleaned with pure water in multiple stages and dried at low temperature, requiring no residue, no whitening, and no powdering. The surface roughness after hard anodizing is no higher than Ra0.4. The smoothness is tested by wrapping a soft thermally conductive material with a 1kg weight, and the coefficient of friction is no higher than 0.21. Step H: High-temperature vulcanization and hot-pressing of silicone.

[0010] like Figure 4 As shown, in this embodiment, step H includes the following: First, pretreatment is performed: the back is degreased and dusted with acetone or anhydrous ethanol, and coated with aluminum-specific silicone hot vulcanizing primer, and then dried at room temperature until the surface is no longer sticky. Secondly, material stacking and alignment are required, and pre-formed silicone heating wire interlayers are used. Heating wire + semi-raw silicone substrate is precisely adhered to the back of the aluminum plate. Screw holes and wire exit points need to be avoided and protected. Simultaneously, the heating area needs to be segmented. Segmented segmentation means that different heating areas need to be controlled independently, the heating wire is individually controlled, and there are three individually controlled wire exits. The vulcanized silicone is fused together. Segmented segmentation and independent control ensure that temperature fluctuations at all eight temperature points on the control board are within ±0.01℃ of the target temperature. Without segmentation, it is difficult to achieve stable temperatures under the condition of whole-plate vulcanization. Then, high-temperature hot-press vulcanization is carried out, controlling the hot-pressing temperature and maintaining a holding pressure. After holding the pressure, vulcanization is performed. Finally, the mold is cooled and set, and then naturally cooled to below 45°C under pressure before demolding to prevent delamination and bubbling caused by high-temperature stretching.

[0011] The above process has the following beneficial effects: 1. In terms of process, it can produce aluminum plates with specific smoothness and low friction system. The hard anodized film is 30-40um thick, the surface roughness should be less than or equal to Ra0.4, the smoothness is tested by wrapping a soft thermally conductive material with a 1kg weight, and the coefficient of friction should be less than or equal to 0.21. 2. In terms of technology, it achieves individual block control of multiple heating wires, and in terms of function, it can achieve high-precision temperature control. In the oven, the control board can control temperature fluctuations with an accuracy of ±0.01℃.

[0012] In this embodiment, the temperature control board also requires high temperature performance: the application scenario is for temperature conduction. When the flexible thermally conductive material is pressed into contact with the temperature control board, the temperature needs to be quickly and smoothly conducted from the temperature control board to the flexible thermally conductive material. Therefore, the temperature board needs to have sufficiently high thermal conductivity and stable temperature maintenance capability. In terms of manufacturing process, it requires the ability to generate and control heat. In practical implementation, heating wires need to be evenly distributed on the back of the control board, and the heating wires need to be very tightly bonded to the control board to form a single unit.

[0013] Although the embodiments of the present invention are described with reference to actual solutions, they do not constitute a limitation on the meaning of the present invention. Modifications to the embodiments and combinations with other solutions based on this specification will be obvious to those skilled in the art.

Claims

1. A composite processing technology for a temperature control board, characterized in that: The process includes the following steps: Step A, Material preparation: AL6061 material is selected, which has good thermal conductivity and is easy to process; appropriate processing allowances are reserved for length, width and height; Step B, CNC rough machining: Double-sided rough milling to remove oxide scale and tool marks from the material. After rough milling, leave a margin for the length, width and height of the outer shape. Roughly machine all slots, screw holes and countersunk holes. Step C, Material stress relief: Annealing treatment to release internal stress during machining and prevent deformation during processing; Step D, CNC semi-finishing: Semi-finishing of the outer shape, with machining allowances reserved for length, width and height, the back side is machined in one go, retaining ordinary milling marks, and the holes and slots are finely finished to ensure accuracy tolerances; machining allowances are reserved for the front side for precision mirror milling. Step E, CNC precision mirror milling: Use a high-speed machining center with zircon inserts, small depth of cut, high speed for precision machining. Note that the tool marks are vertical and the tool marks only appear in specific areas. Only the front side is machined, the surface roughness meets Ra0.1, the flatness of the whole plate is less than 0.05, and the machining is completed in one go without polishing. Step F, Deburring and Chamfering: Chamfer sharp edges, orifices, and grooves to prevent sharp corner penetration and film chipping defects during hard oxidation; Step G, Hard Anodizing: Strictly control the temperature, time, and other conditions of low-temperature sulfuric acid hard anodizing. The film thickness is 30µm to 40µm. This thickness is conducive to forming a low surface deformation, while meeting the requirements of suitable wear resistance and a low coefficient of friction. The back side retains the oxidation micropores to ensure the bonding strength of the silicone vulcanization. The front, sides, and all inner walls of the grooves are sealed at room temperature to improve corrosion resistance and stain resistance. After oxidation, the surface is cleaned with pure water in multiple stages and dried at low temperature, requiring no residue, no whitening, and no powdering. The surface roughness after hard anodizing is no higher than Ra0.

4. The smoothness is tested by wrapping a soft thermally conductive material with a 1kg weight, and the coefficient of friction is no higher than 0.

21. Step H: High-temperature vulcanization and hot-pressing of silicone.

2. The composite processing technology of the temperature control board according to claim 1, characterized in that: Step H includes the following: First, pretreatment is performed: the back is degreased and dusted with acetone or anhydrous ethanol, and coated with aluminum-specific silicone hot vulcanizing primer, and then dried at room temperature until the surface is no longer sticky. Secondly, material stacking and alignment are required, and pre-formed silicone heating wire interlayers are used. Heating wire + semi-raw silicone substrate is precisely adhered to the back of the aluminum plate. Screw holes and wire exit points need to be avoided and protected. Simultaneously, the heating area needs to be segmented. Segmented segmentation means that different heating areas need to be controlled independently, the heating wire is individually controlled, and there are three individually controlled wire exits. The vulcanized silicone is fused together. Segmented segmentation and independent control ensure that temperature fluctuations at all eight temperature points on the control board are within ±0.01℃ of the target temperature. Without segmentation, it is difficult to achieve stable temperatures under the condition of whole-plate vulcanization. Then, high-temperature hot-press vulcanization is carried out, controlling the hot-pressing temperature and maintaining a holding pressure. After holding the pressure, vulcanization is performed. Finally, the mold is cooled and set, and then naturally cooled to below 45°C under pressure before demolding to prevent delamination and bubbling caused by high-temperature stretching.

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