A continuous drilling and tapping device for mold material production

Abstract

The application discloses a die material continuous drilling and tapping equipment for die production and belongs to the technical field of machining equipment, which comprises a machine tool main body, the machine tool main body is provided with an intelligent chip removal detection and control module, and the intelligent chip removal detection and control module comprises a central control console, an inlet iron chip detection unit, a terminal iron chip detection unit, a chip suction flow detection unit, a negative pressure detection unit, an axial position detection unit and a rotation angle detection unit, so that the pertinence of processing hole chip removal position selection and control action execution is improved, the recognition capability for normal chip removal, iron chip retention, delayed chip removal and abnormal chip removal channel state is enhanced, the reliability of processing hole cleaning result judgment is improved, local residual chips and invalid blowing are reduced, and the influence of residual iron chips on subsequent tapping quality is reduced.

Description

Technical Field

[0001] This invention relates to the field of machining equipment technology, and more specifically, to a continuous drilling and tapping device for mold materials used in mold production. Background Technology

[0002] In mold manufacturing, continuous machining processes such as drilling and tapping are typically required on the mold material. Drilling and tapping operations generate strip-shaped, curled, or fragmented metal chips within the machined holes. Some of these chips are expelled with the tool or cutting fluid, while others tend to remain on the hole walls, thread grooves, and bottom. For machined holes with small diameters, large depths, or closed bottoms, the space for chip removal is limited, making the residue problem more pronounced.

[0003] Iron filings remaining in machined holes can affect subsequent tapping or assembly operations. When iron filings are stuck between the tool and the hole wall, they can cause scratches on the hole wall, damage to the thread profile, and accelerated tool wear. When iron filings accumulate at the bottom of the hole, they can also increase the resistance to tool movement, and in severe cases, cause the tool to jam or break. Therefore, after drilling or tapping, it is usually necessary to clean the machined hole to remove iron filings.

[0004] Existing methods for cleaning chips from machined holes mainly include manual blowing with an air gun, continuous injection of compressed air into the machined hole, and cleaning using air blowing combined with a chip suction device. The cleaning effect of manual blowing largely depends on the operator's experience, making it difficult to ensure consistent cleaning between different machined holes. Although continuous air blowing can remove some chips from the hole wall, the airflow direction and location are relatively fixed, resulting in limited cleaning effectiveness for chips adhering to localized areas on the hole wall, inside thread grooves, or at the bottom of the hole; the blown-off chips may also re-scatter within the hole.

[0005] Combining air blowing and negative pressure suction can improve chip removal efficiency to some extent. However, existing equipment typically performs chip removal operations according to pre-set air blowing positions, times, and frequencies. Since the quantity, shape, attachment location, and accumulation degree of chips vary in different machined holes, fixed chip removal parameters are difficult to adapt to the actual chip residue situation within the machined holes. Insufficient air blowing time or frequencies can easily lead to chip residue; excessive air blowing time or frequencies increase chip removal time and air consumption, affecting continuous processing efficiency.

[0006] Furthermore, during the discharge process, iron filings may remain in the suction pipe, or fail to enter the collection device properly due to pipe blockage, air leakage, or insufficient negative pressure. Existing equipment typically lacks effective judgment of the cleaning process and results, making it difficult to accurately distinguish whether the machined hole has been cleaned, whether iron filings remain in the machined hole, or whether there are abnormalities in the chip removal channel. Therefore, the cleaning process may end before the machined hole is completely cleaned, or the machined hole that has already been cleaned may be repeatedly blew.

[0007] Therefore, existing die drilling and tapping equipment still suffers from problems such as insufficient targeting of cleaning locations, difficulty in adapting cleaning parameters to actual residual chip conditions, difficulty in identifying abnormal chip discharge, and difficulty in reliably confirming cleaning results during the chip removal process of machined holes. It is necessary to further improve the chip removal device and its control method for machined holes. Summary of the Invention

[0008] To address the shortcomings of existing die-drilling and tapping equipment, which uses fixed blowing positions and chip removal parameters, making it difficult to adapt to uneven chip distribution within the machined hole and unable to accurately determine whether chips have been discharged, remain in the chip removal channel, or whether the machined hole has been cleaned, leading to problems such as localized chip residue, repeated blowing, and low chip removal efficiency, this paper proposes a continuous die-drilling and tapping equipment for die production. This equipment improves the targeting of chip removal position selection and control actions, enhances the ability to identify normal chip removal, chip retention, delayed chip removal, and abnormal states of the chip removal channel, improves the reliability of judging the cleaning results of the machined hole, reduces localized chip residue and ineffective blowing, and reduces the impact of residual chips on the subsequent tapping quality.

[0009] To solve the above problems, the present invention adopts the following technical solution.

[0010] A continuous drilling and tapping device for mold materials used in mold production includes a machine tool body with a central control panel and a drilling and tapping module. A chip removal device is installed on one side of the drilling and tapping module. The chip removal device includes a linear module, the moving end of which has a rotary drive assembly. The output end of the rotary drive assembly is connected to a chip suction pipe for driving the chip suction pipe to rotate around its own axis. The upper end of the chip suction pipe is sealed and rotatably connected to a negative pressure transfer pipe. A support is provided in the middle of the chip suction pipe, and a chip blowing pipe is provided in the middle of the support. The upper end of the chip blowing pipe is sealed and rotatably connected to a chip blowing transfer pipe. The lower part of the chip blowing pipe has a hard chip blowing section. The machine tool has multiple chip blowing holes. A chip suction hose is connected to the upper end of the negative pressure transfer pipe, and a high-pressure air pump is connected to the end of the chip blowing hose. The other end of the chip suction hose is connected to a collection box, which is connected to a negative pressure source. The machine tool body is equipped with an intelligent chip removal detection and control module. This module includes a central control panel, an inlet chip detection unit, an end chip detection unit, a chip suction flow detection unit, a negative pressure detection unit, an axial position detection unit, and a rotation angle detection unit. By integrating an axially movable, rotating chip blowing and negative pressure chip suction structure next to the drilling and tapping module, chip removal from the machining hole and continuous machining are completed in tandem, improving chip removal efficiency and reducing downtime for cleaning.

[0011] As a further technical solution of the present invention, the chip suction pipe is connected to the collection box through the chip suction hose to form a chip suction and conveying path extending from the chip suction pipe to the collection box; The inlet chip detection unit is located at the front end of the chip conveying path and is used to acquire the inlet chip signal that enters the chip conveying path from the machining hole. The end-of-line iron chip detection unit is located at the rear section of the chip conveying path and is used to acquire the end-of-line iron chip signal that has reached the chip inlet of the collection box. The chip suction flow detection unit is set on the chip suction conveying path and is used to obtain the real-time chip suction flow within the chip suction conveying path. The negative pressure detection unit is connected to the dust collection and conveying path and is used to obtain the real-time negative pressure within the dust collection and conveying path; The axial position detection unit is used to obtain the axial position of the linear module moving end in order to determine the overall axial position of the chip suction pipe and the chip blowing pipe, as well as the depth of the chip blowing pipe extending into the machining hole. The linear module drives the entire chip suction pipe and chip blowing pipe to move; The rotation angle detection unit is used to obtain the real-time rotation angle of the blow pipe; The chip blowing pipe is connected to a chip blowing air path, and a pulse control valve is installed on the chip blowing air path. The chip suction and conveying path is connected to a negative pressure source. The central control unit is connected to the inlet chip detection unit, the end chip detection unit, the chip suction flow detection unit, the negative pressure detection unit, the axial position detection unit, the rotation angle detection unit, the linear module, the rotary drive assembly, the pulse control valve, and the negative pressure source, respectively. It is used to control the axial position, rotation angle, blowing action, and negative pressure chip suction status of the chip blowing pipe based on the data obtained by each detection unit. By jointly detecting the chip passage status, chip suction flow, negative pressure, axial position, and rotation angle, it can achieve precise control of the chip blowing position, blowing action, and negative pressure status, thereby improving operational stability.

[0012] As a further technical solution of the present invention, the intelligent chip removal detection and control module is configured to perform the following steps: S1. Divide the machining hole into multiple axial sections along the axis, and divide each axial section into multiple cleaning units; control the chip blowing pipe to perform detection blowing on the preset starting cleaning unit, and establish the initial chip conveying delay based on the response time difference between the inlet chip signal and the end chip signal. S2. Control the chip blowing pipe to move sequentially to the corresponding position of each cleaning unit, execute pulse blowing under negative pressure chip suction state, obtain the position data, chip suction flow data and negative pressure data of each cleaning unit, and obtain the inlet chip discharge response and end chip discharge response according to the initial chip conveying delay, and form the corresponding chip removal response parameter group from the inlet chip discharge response, end chip discharge response, chip suction flow data and negative pressure data. S3. Update the initial chip conveying delay according to the correspondence between the inlet chip signal and the end chip signal; associate the end chip removal response with the corresponding cleaning unit according to the updated chip conveying delay and the position data; form the residual chip response distribution of the machining hole according to the inlet chip removal response and the end chip removal response; and generate a fixed-point rescanning path accordingly. S4. Based on the changes in the chip removal response parameter group, determine the current chip removal status of the cleaning unit, and execute the corresponding chip removal control action according to the chip removal status. By establishing and dynamically updating the chip conveying delay, accurately map the chip removal response to each cleaning unit, form a chip distribution and generate a re-sweeping path, and improve the chip positioning and fixed-point cleaning capabilities.

[0013] As a further technical solution of the present invention, the intelligent chip removal detection and control module is further configured to perform the following steps: S5. Perform verification blowing on the cleaning unit that has completed the blowing, obtain the chip removal response parameter group corresponding to the verification blowing, and determine the cleaning result of the corresponding cleaning unit according to the chip removal response parameter group; when all cleaning units have completed cleaning, control the chip blowing pipe to exit the processing hole, and control the chip removal device in the hole to reset. By performing verification blowing on the cleaning unit that has completed the blowing again, and performing exit and reset after all cleaning is completed, the probability of misjudging the completion of cleaning can be reduced, and the reliability of the chip removal closed loop can be improved.

[0014] As a further technical solution of the present invention, in S3, the current chip conveying delay is recursively updated based on the response time difference of the newly obtained mutually matching inlet chip signal and end chip signal. During the update, the previous chip conveying delay is retained and the updated chip conveying delay is determined by combining the newly obtained response time difference. When mutually matching inlet chip signal and end chip signal are not obtained, the current chip conveying delay is kept unchanged. By continuously correcting the chip conveying delay using the newly obtained matching signal, the delay parameter can adapt to changes in negative pressure, flow rate and chip state, reduce chip discharge response mismatch and improve judgment accuracy.

[0015] As a further technical solution of the present invention, in S3, based on the inlet chip removal response, the end chip removal response, the time delay deviation between the inlet chip removal response and the end chip removal response of each cleaning unit, and the response duration after repeated blowing, the residual chip response degree of the j-th cleaning unit is determined according to the following formula: In the formula, This indicates the degree of residue response in the j-th cleaning unit; This represents the normalized value of the inlet chip removal response intensity of the j-th cleaning unit; Normalized value representing the degree of matching between the inlet chip removal response and the end chip removal response; This represents the normalized value of the deviation between the actual response time difference and the current chip conveying delay; This represents the normalized value indicating the degree to which a valid iron filings signal continues to appear after repeated blowing of the j-th cleaning unit; , , and Let represent the weighting coefficients for the ingress response, missing endpoint match, time delay bias, and repeated response, respectively, and satisfy . The corresponding debris response levels are arranged according to the location data of each cleaning unit to form the debris response distribution. The debris level is quantified by integrating the inlet response, end matching, time delay deviation and repetition response, so that the debris situation of different cleaning units can be compared and sorted, thereby improving the accuracy of target screening for re-scanning.

[0016] As a further technical solution of the present invention, in S4, the current chip removal status of the cleaning unit is determined based on the correspondence between the inlet chip removal response and the end chip removal response, as well as the changes in the chip suction flow rate data and negative pressure data. When there are corresponding valid iron chip signals in the inlet chip removal response and the end chip removal response, and the chip suction flow rate data and negative pressure data are within the normal range, it is determined to be a successful chip removal status. When there is an inlet chip removal response but no corresponding end chip removal response is formed, and the chip suction flow rate data and negative pressure data show fluctuations caused by the passage of iron chips, it is determined to be a mid-way stagnation status. When the end chip removal response exceeds the end response time window set according to the current iron chip conveying delay, but can establish a correspondence with the previous inlet chip removal response, it is determined to be a delayed chip removal status. When no valid iron chip signal is detected within both the inlet response time window and the end response time window, and the chip suction flow rate data and negative pressure data are within the normal range, it is determined to be a cleaning completion candidate status. By distinguishing between successful chip removal, mid-way stagnation, delayed chip removal, and cleaning completion candidate status, corresponding control measures can be taken for different chip removal results to reduce ineffective purging and reduce the risk of channel blockage.

[0017] As a further technical solution of the present invention, in step S5, the inlet response time window and the end response time window corresponding to the verification blowing are set according to the updated iron chip conveying delay, and the cleaning result is determined according to the chip removal response parameter group corresponding to the verification blowing. When no valid iron chip signal is detected in either the inlet response time window or the end response time window, and the chip suction flow rate data and negative pressure data are within the normal range, the corresponding cleaning unit is determined to have completed cleaning. When a valid iron chip signal is detected, the corresponding cleaning unit is re-added to the fixed-point re-scanning path. When the chip suction flow rate data and negative pressure data are abnormal, the channel is cleared, and the verification blowing is re-executed after the negative pressure chip suction state returns to normal. By simultaneously verifying the iron chip signal, chip suction flow rate, and negative pressure state during the verification stage, the cleaning units that have not completed cleaning or have abnormal channels are reprocessed, thereby improving the reliability of the final cleaning result.

[0018] As a further technical solution of the present invention, the upper outer wall of the chip suction tube is provided with a first annular protrusion, and the lower end of the negative pressure transfer tube is provided with a first sleeve block sleeved on the outer side of the upper end of the chip suction tube. The inner wall of the first sleeve block is provided with a first annular groove adapted to the first annular protrusion. The first annular protrusion is rotatably embedded in the first annular groove. The lower end of the chip suction tube gradually expands in diameter in the downward direction to form a trumpet-shaped chip suction cover with the opening facing downward. The upper outer wall of the chip blowing pipe is provided with a second annular protrusion, and the lower end of the chip blowing transfer pipe is provided with a second sleeve block sleeved on the outer side of the upper end of the chip blowing pipe. The inner wall of the second sleeve block is provided with a second annular groove that matches the second annular protrusion. The second annular protrusion is rotatably embedded in the second annular groove. A stable rotational connection is formed between the annular protrusion and the annular groove. The chip suction range of the orifice is expanded by using a trumpet-shaped chip suction cover, which can take into account both rotational sealing performance and chip collection efficiency.

[0019] As a further technical solution of the present invention, the collection box includes a box body, a chip collection filter cylinder is provided inside the box body, a chip inlet is provided at the upper end of the chip collection filter cylinder, a chip inlet pipe is provided at the upper end of the box body, one end of the chip inlet pipe is connected to the chip suction hose, and the other end of the chip inlet pipe is correspondingly provided with the chip inlet. A negative pressure cavity is formed between the outer wall of the chip collection filter and the inner wall of the box. The side of the box is provided with an air extraction pipe that communicates with the negative pressure cavity. The air extraction pipe is connected to the negative pressure source. The chip collection filter separates the iron chips and forms a negative pressure cavity on its outside, so that the iron chips are collected in a concentrated manner while the airflow is continuously discharged, reducing the amount of iron chips entering the negative pressure source and improving the maintenance convenience of the collection box.

[0020] Compared with the prior art, the advantages of this invention are: This invention provides a chip removal device for the hole on one side of the drilling and tapping module of the machine tool body. A linear module and a rotary drive assembly are used to drive the chip blowing pipe to move axially and rotate for cleaning. At the same time, a negative pressure chip suction path is formed by the chip suction pipe, chip suction hose, collection box and negative pressure source. This allows the die material to be directly cleaned of chips inside the hole after drilling and tapping, reducing downtime for cleaning and workpiece transfer, and improving continuous processing efficiency.

[0021] The chip blowing pipe can move to different cleaning areas according to the depth and circumferential position of the machined hole. A high-pressure air pump supplies air to the chip blowing pipe via a flexible blowing hose, directing the airflow to clean areas prone to chip accumulation, such as the hole walls, thread grooves, and hole bottom. The chip suction pipe, under negative pressure, promptly collects the blown-off chips, reducing the possibility of chip re-scattering and secondary accumulation. By using an intelligent chip removal detection and control module to zone the machined hole and establish a correspondence between cleaning units and chip blowing positions, the overall unified blowing process can be transformed into zoned control, improving the targeted selection of blowing positions.

[0022] The central control console combines data such as the chip passing signal, chip suction flow rate, negative pressure, axial position, and rotation angle to comprehensively judge the chip removal process and the status of the chip suction channel. By establishing and updating the chip conveying delay, it associates the delayed chip removal response with the corresponding cleaning unit, thereby reducing response mismatch.

[0023] Based on the inlet and end chip removal responses, a residual chip response distribution is generated, and a fixed-point re-sweeping path is created. Areas with high residual chip levels, chip retention, or delayed chip removal can be prioritized for re-cleaning, reducing ineffective blowing. By distinguishing different chip removal states, the movement of the chip blowing pipe, enhanced blowing, extended chip suction, channel unblocking, and verification blowing can be controlled, forming a closed loop of chip removal, re-sweeping, and verification.

[0024] The cooperation between the first annular protrusion and the first sleeve block, and the second annular protrusion and the second sleeve block, can maintain the continuity and sealing stability of the pipeline during rotation. The trumpet-shaped chip suction hood at the lower end of the chip suction pipe can expand the chip suction range. The chip collection filter cartridge inside the box cooperates with the negative pressure chamber to separate iron chips from the airflow and reduce the entry of iron chips into the negative pressure source.

[0025] This improves the integrity, reliability, and automation of chip removal from machined holes, reduces the impact of residual chips on the hole wall, threads, and cutting tools, and balances the efficiency of continuous equipment operation and ease of maintenance. Attached Figure Description

[0026] Figure 1 This is a three-dimensional schematic diagram of the entire invention; Figure 2 This is a three-dimensional schematic diagram of the internal chip removal device of the present invention; Figure 3 This is a three-dimensional exploded view of the internal chip removal device of the present invention; Figure 4 This is a partial half-section perspective view of the dust suction tube of the present invention; Figure 5 for Figure 4 A magnified three-dimensional schematic diagram of part A; Figure 6 for Figure 4 A magnified 3D representation of part B; Figure 7 This is a partial half-section perspective view of the collection box of the present invention; Figure 8 This is a schematic diagram of the working process of the intelligent chip removal detection and control module of the present invention.

[0027] Explanation of the labels in the diagram: 1. Machine tool body; 2. Central control console; 3. Drilling and tapping module; 4. In-hole chip removal device; 401. Linear module; 402. Rotary drive assembly; 403. Chip suction pipe; 404. Negative pressure transfer pipe; 405. Support; 406. Chip blowing pipe; 407. Chip blowing transfer pipe; 408. First annular protrusion; 409. First sleeve block; 410. Second annular protrusion; 411. Second sleeve block; 5. Chip suction hose; 6. Chip blowing hose; 7. High-pressure air pump; 8. Collection box; 801. Box body; 802. Chip collection filter cartridge; 803. Chip inlet pipe; 804. Air extraction pipe; 9. Negative pressure source. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Example 1 like Figure 1-8 As shown, this embodiment provides a continuous drilling and tapping equipment for mold production, including a machine tool body 1, a central control table 2 and a drilling and tapping module 3 on the machine tool body 1, and a chip removal device 4 installed on one side of the drilling and tapping module 3 for blowing and sucking chips from the machined holes after drilling or tapping.

[0030] The internal chip removal device 4 includes a linear module 401. The moving end of the linear module 401 is equipped with a rotary drive assembly 402. The output end of the rotary drive assembly 402 is connected to the chip suction pipe 403 for driving the chip suction pipe 403 to rotate around its own axis. The upper end of the chip suction pipe 403 is sealed and rotatably connected to the negative pressure transfer pipe 404 and communicates with it. The negative pressure transfer pipe 404 is connected to the collection box 8 through the chip suction hose 5. The collection box 8 is connected to the negative pressure source 9, thereby forming a negative pressure chip suction channel.

[0031] A support 405 is provided in the middle of the chip suction pipe 403, and a chip blowing pipe 406 is installed in the middle of the support 405, so that the chip blowing pipe 406 can rotate synchronously with the chip suction pipe 403. The upper end of the chip blowing pipe 406 is sealed and rotatably connected to the chip blowing transfer pipe 407 and communicates with it. The chip blowing transfer pipe 407 is connected to the high-pressure air pump 7 through the chip blowing hose 6. The lower part of the chip blowing pipe 406 is provided with a hard chip blowing section, on which multiple chip blowing holes are opened for spraying compressed air onto the hole wall, thread groove and bottom of the machined hole.

[0032] The upper outer wall of the chip suction pipe 403 is provided with a first annular protrusion 408, and the lower end of the negative pressure transfer pipe 404 is provided with a first sleeve block 409. The first annular protrusion 408 is rotatably embedded in the first annular groove on the inner wall of the first sleeve block 409. The upper outer wall of the chip blowing pipe 406 is provided with a second annular protrusion 410, and the lower end of the chip blowing transfer pipe 407 is provided with a second sleeve block 411. The second annular protrusion 410 is rotatably embedded in the second annular groove on the inner wall of the second sleeve block 411, thereby maintaining the corresponding air passage connection when the chip suction pipe 403 and the chip blowing pipe 406 rotate. The lower end of the chip suction pipe 403 gradually expands in diameter to form a trumpet-shaped chip suction hood to expand the chip suction range at the opening of the machining hole.

[0033] The collection box 8 includes a box body 801, inside which is a chip collection filter cartridge 802. The chip inlet pipe 803 at the upper end of the box body 801 is connected to the chip suction hose 5 and the chip inlet of the chip collection filter cartridge 802, respectively. A negative pressure chamber is formed between the chip collection filter cartridge 802 and the box body 801. The air extraction pipe 804 on the side of the box body 801 is connected to the negative pressure source 9, so that the iron filings are trapped in the chip collection filter cartridge 802 and the airflow is discharged through the negative pressure chamber.

[0034] In use, after the drilling and tapping module 3 completes its machining, the central control unit 2 controls the linear module 401 to drive the chip blowing pipe 406 into the machining hole, and positions the lower end of the chip suction pipe 403 at the opening of the machining hole. The high-pressure air pump 7 supplies air to the chip blowing pipe 406, and the rotary drive assembly 402 drives the chip suction pipe 403 and the chip blowing pipe 406 to rotate. Simultaneously, the linear module 401 drives both to move along the axial direction of the machining hole, so that the chip blowing hole can blow away chips at different depths and circumferential positions within the machining hole. The blown-away iron chips enter the chip suction pipe 403 under the action of the negative pressure airflow formed by the negative pressure source 9, and are then transported to the chip collection filter cartridge 802 via the chip suction hose 5.

[0035] Example 2 Based on Example 1, such as Figure 8 As shown, in this embodiment, the intelligent chip removal detection and control module uses the central control console 2 as the control core.

[0036] The chip suction pipe 403 is connected to the collection box 8 through the chip suction hose 5, forming a chip suction and conveying path extending from the machining hole to the collection box 8. When the negative pressure source 9 is working, it forms a negative pressure airflow in the chip suction and conveying path to blow the iron chips blown away from the inner wall of the machining hole by the chip blowing pipe 406 and convey them to the collection box 8.

[0037] The inlet chip detection unit is located on the side of the chip conveying path near the machining hole. It is used to detect chips entering the chip conveying path from the machining hole and output an inlet chip signal. The end chip detection unit is located on the side of the chip conveying path near the chip inlet end of the collection box 8. It is used to detect chips arriving at the collection box 8 and output an end chip signal.

[0038] In this embodiment, both the inlet and end chip detection units employ inductive chip detectors. Each inductive chip detector includes a non-metallic detection tube segment connected in series in the chip conveying path, a detection coil sleeved on the outside of the non-metallic detection tube segment, and a signal conditioning circuit connected to the detection coil. When chips pass through the non-metallic detection tube segment with the negative pressure airflow, the induced signal of the detection coil changes. The signal conditioning circuit amplifies, filters, and performs analog-to-digital conversion on the induced signal, and sends the resulting chip detection waveform to the central control unit 2.

[0039] When the chip conveying path is under stable negative pressure and no chips pass through, the central control unit 2 acquires the reference signal from the corresponding detection unit and sets a chip signal judgment threshold based on the fluctuation range of the reference signal. When the chip detection waveform first reaches the chip signal judgment threshold, the corresponding time is determined as the response time of the chip signal; when the chip detection waveform recovers to within the chip signal judgment threshold, the corresponding time is determined as the end time of the chip signal, and the signal duration is determined based on the time difference between the end time and the response time. The central control unit 2 determines the signal strength based on the degree of deviation of the chip detection waveform from the reference signal, and determines the number of occurrences of the chip signal based on the number of mutually spaced effective chip detection waveforms.

[0040] The inlet chip detection unit and the end chip detection unit use the same sampling frequency and are provided with a unified timing reference by the central control unit 2. The central control unit 2 obtains the response time, duration, signal strength and occurrence number of the inlet chip signal and the end chip signal based on this reference, and forms the corresponding inlet chip removal response and end chip removal response.

[0041] The chip suction flow rate detection unit is used to continuously acquire chip suction flow rate data within the chip suction conveying path, and the negative pressure detection unit is used to continuously acquire negative pressure data within the chip suction conveying path. The axial position detection unit is used to detect the axial position of the chip blowing pipe 406, and the rotation angle detection unit is used to detect the real-time rotation angle of the chip blowing pipe 406.

[0042] Based on the detection results from the axial position detection unit and the rotation angle detection unit, the central control unit 2 controls the linear module and the rotary drive assembly 402 to move the chip blowing pipe 406 to different insertion depths and rotation angles within the machining hole. The pulse control valve on the chip blowing air circuit is used to control the chip blowing pipe 406 to perform probing blowing, pulse blowing, and verification blowing.

[0043] S1. The central control unit 2 obtains the hole depth of the machined hole. Taking the hole opening as the axial starting position, the machined hole is divided into multiple axial segments along the hole depth direction at preset axial intervals. Then, according to the preset angle intervals of the chip blower 406 rotating around its own axis, each axial segment is divided into multiple cleaning units circumferentially. Each cleaning unit corresponds to the target insertion depth and target rotation angle of the chip blower 406. Based on this, the central control unit 2 establishes the correspondence between the cleaning units and the position data.

[0044] According to the preset chip removal sequence, the preset starting cleaning unit is determined. The central control unit 2 controls the linear module and the rotary drive assembly 402 to move the chip blowing pipe 406 to the position corresponding to the preset starting cleaning unit, and controls the negative pressure source 9 to start. When the chip suction flow rate and negative pressure in the chip suction and conveying path reach a stable state, the central control unit 2 controls the pulse control valve to open, so that the chip blowing pipe 406 performs detection blowing.

[0045] When the detected iron filings blown away by the air enter the chip conveying path, the inlet iron filings detection unit outputs an inlet iron filings signal; when the iron filings reach the chip inlet end of the collection box 8, the end iron filings detection unit outputs an end iron filings signal. The central control console 2 pairs the corresponding inlet iron filings signal and end iron filings signal according to the execution time of the air blowing and the response time of the inlet iron filings signal and the end iron filings signal.

[0046] During multiple air-blowing tests, multiple sets of corresponding inlet and outlet chip signals are obtained. The central control unit 2 acquires these signals and uses the response time difference between each inlet and outlet chip signal as a time delay sample. The central control unit 2 determines the median of all time delay samples, calculates the absolute deviation between each sample and the median, and determines the median of all absolute deviations as the median absolute deviation. If the absolute deviation of any time delay sample is greater than the product of the median absolute deviation and a preset anomaly determination coefficient, the sample is identified as abnormal and discarded. The preset anomaly determination coefficient is determined through multiple calibration tests under normal chip suction flow and negative pressure conditions. When the median absolute deviation is zero, time delay samples with an absolute deviation greater than the median are identified as abnormal data. The preset maximum allowable deviation is determined based on the time delay fluctuation range under normal chip suction conditions. After removing abnormal data, the central control console 2 determines the initial chip conveying delay based on the average value of the remaining valid delay samples, specifically calculated according to the following formula: In the formula, Indicates the initial chip conveying delay; This indicates the number of valid signal pairs retained after removing outlier data; Indicates the first The response time of the chip signal at the group inlet; Indicates the relationship with the first The response time of the terminal chip signal corresponding to the inlet chip signal; Indicates the first The conveying time required for a group of iron filings to travel from the front section to the rear section of the chip suction conveyor path.

[0047] The initial chip conveying delay established in this way is used to determine the time correspondence between the subsequent inlet chip removal response and the end chip removal response.

[0048] S2, the central control unit 2 selects each cleaning unit sequentially according to the preset chip removal sequence. Based on the correspondence between the cleaning unit and the position data, it controls the linear module and the rotary drive assembly 402 to adjust the position of the chip blowing pipe 406 through the chip suction pipe 403. The axial position detection unit obtains the actual insertion depth of the chip blowing pipe 406, and the rotation angle detection unit obtains the actual rotation angle of the chip blowing pipe 406. When the actual insertion depth and the actual rotation angle reach the position range corresponding to the current cleaning unit, it is determined that the chip blowing pipe 406 has moved to the corresponding position of the current cleaning unit.

[0049] The central control unit 2 controls the negative pressure source 9 to continue operating, continuously acquiring chip suction flow rate and negative pressure data through the chip suction flow rate detection unit and the negative pressure detection unit. When both the chip suction flow rate data and the negative pressure data are within their corresponding normal fluctuation ranges within a preset stable time, it is determined that a stable negative pressure has been formed within the chip suction conveying path.

[0050] Under stable negative pressure suction, the central control panel 2 controls the pulse control valve to cause the blowing pipe 406 to perform pulse blowing, and associates the execution time of the pulse blowing with the current position data of the cleaning unit. The position data includes the actual insertion depth detected by the axial position detection unit and the actual rotation angle detected by the rotation angle detection unit.

[0051] An inlet response time window is set based on the execution time of pulse blowing, and a relatively delayed end response time window is set according to the initial chip conveying delay. Valid inlet chip signals acquired within the inlet response time window form the inlet chip removal response, and valid end chip signals acquired within the end response time window form the end chip removal response. The inlet chip removal response and the end chip removal response each include the response time, duration, signal strength, and number of occurrences of the corresponding chip signal.

[0052] The central control unit 2 synchronously acquires the dust suction flow rate and negative pressure data before, during, and after pulse blowing. It also forms a dust removal response parameter group based on the inlet dust removal response, end dust removal response, dust suction flow rate data, and negative pressure data corresponding to the current cleaning unit, thus linking the dust removal response parameter group with the location data of the corresponding cleaning unit.

[0053] S3. During the sequential pulse blowing process for each cleaning unit, the central control console 2 matches the inlet and end chip signals based on the execution time of each pulse blowing, the response time of the inlet chip signal, and the response time of the end chip signal. When the response time difference between the end chip signal and the inlet chip signal is within the allowable range corresponding to the current chip conveying delay, the two are determined to be corresponding chip signals.

[0054] For the The central control unit 2 uses the newly matched inlet and outlet chip signals to recursively correct the chip conveying delay of the previous moment based on the response time difference of these signals, obtaining the updated chip conveying delay, specifically calculated according to the following formula: In the formula, Indicates according to the first The group of valid signals corresponds to the updated chip delivery delay; This indicates the delay in the iron filings transport before the update. hour, Take the initial iron chip conveying delay ; This represents the delay smoothing coefficient, and ; Indicates the first The response time difference of a pair of valid signals satisfies When no matching inlet and outlet chip signals are available, the current chip conveying delay remains unchanged.

[0055] Based on the updated chip conveying delay, the central control unit 2 determines the inlet chip removal response and pulse blowing corresponding to each end chip removal response, and associates the end chip removal response with the corresponding cleaning unit based on the location data associated with the pulse blowing, so as to avoid incorrectly associating delayed chips that arrive in the chip conveying path with subsequent cleaning units.

[0056] Regarding the first For each cleaning unit, the central control console 2 determines the residual chip response level based on its inlet chip removal response, end chip removal response, the time delay deviation between the two chip removal responses, and the response duration after repeated blowing. The specific calculation is as follows: In the formula, Indicates the first The degree of residue response in each cleaning unit; Indicates the first Normalized value of the inlet chip discharge response intensity of each cleaning unit; This represents the normalized value indicating the degree of matching between the inlet chip removal response and the end chip removal response. When no end chip removal response corresponding to the inlet chip removal response is detected, Take zero; This represents the normalized value of the deviation between the actual response time difference and the current chip conveying delay; Indicates the first Normalized value of the degree to which effective iron filings signals continue to appear after repeated blowing of the cleaning unit; , , and Let represent the weighting coefficients for the ingress response, the terminal mismatch, the delay bias, and the repeated response, respectively, and satisfy . .

[0057] , , and All were normalized to to Within that range. Among them, The strength of the inlet chip removal response signal is determined based on the ratio between the cumulative signal strength of the most recent pulse air blowing of the current cleaning unit and the preset upper limit of the inlet response strength. When the ratio is greater than... Time to take The preset upper limit of the inlet response intensity is determined based on the signal intensity generated when a representative iron chip passes through the inlet iron chip detection unit under normal conditions of chip suction flow and negative pressure.

[0058] The determination is based on the proportion of valid inlet chip signals that can establish a corresponding relationship with the end chip signal out of the total number of valid inlet chip signals; when there is a valid inlet chip signal but no corresponding end chip signal is detected... Pick When no valid chip signal is detected within both the inlet and outlet response time windows, and the chip suction flow rate and negative pressure data are within the normal range, Pick .

[0059] The time difference between the actual response time difference of the matched inlet and outlet chip signals relative to the current chip conveying delay is determined by the ratio between this ratio and a preset maximum allowable delay deviation. When this ratio is greater than... Time to take When an inlet chip signal exists but a corresponding end chip signal is not generated, Pick The preset maximum allowable time delay deviation is determined based on the fluctuation range of the chip conveying time delay when the chip conveying path is in normal condition.

[0060] The number of times a valid iron filings signal is detected after repeated air blowing in the current cleaning unit is determined by the ratio of this number to a preset maximum number of repeated air blowing cycles. When this ratio is greater than [a certain value], [the maximum number of cycles is determined by the number of cycles]. Time to take The preset maximum number of repeated air blowing cycles is determined based on the depth of the machined hole, the morphology of the chips, and the results of the chip removal test.

[0061] The larger the value, the higher the likelihood of residual chips or iron filings remaining in the corresponding cleaning unit, or delayed chip removal. The central control unit 2 arranges the corresponding residual chip response levels according to the location data of each cleaning unit, forming a residual chip response distribution for the machined holes. When the residual chip response level of a cleaning unit reaches a preset re-scanning threshold, the cleaning unit is determined to meet the preset re-scanning conditions. The preset re-scanning threshold is determined by conducting chip removal tests on both cleaned and pre-existing machined holes, calibrating based on the difference in residual chip response levels between the two types of holes.

[0062] The central control unit 2 identifies the cleaning units that meet the preset re-scanning conditions as the re-scanning target units, and determines the re-scanning sequence based on the position data, adjacent relationships, and current position of the blow pipe 406 of each re-scanning target unit, generating a fixed-point re-scanning path that includes the target insertion depth, target rotation angle, and re-scanning sequence.

[0063] S4. Dust removal status recognition and dust removal control The central control unit 2 compares the current cleaning unit's cleaning response parameter set after pulse blowing with the stable cleaning state before pulse blowing, and combines the changes in the cleaning response parameter set corresponding to multiple consecutive pulse blowing to determine the current cleaning state of the cleaning unit.

[0064] When both the inlet and end chip removal responses have corresponding valid chip signals, and the chip suction flow rate and negative pressure data are within the normal range, the current cleaning unit is determined to be in a successful chip removal state. The chip removal result is recorded and the chip blowing pipe 406 is controlled to move to the next cleaning unit.

[0065] When there is an inlet chip removal response but no corresponding end chip removal response, and the chip suction flow rate and negative pressure data show fluctuations caused by the passage of iron filings, it is determined that the current cleaning unit is in a state of mid-course stagnation. It is then added to the fixed-point re-sweeping path and enhanced purging is performed. Enhanced purging is achieved by increasing the number of pulse air blows, extending the duration of a single pulse air blow, or extending the negative pressure chip suction time.

[0066] When the end-of-line chip removal response exceeds the end-of-line response time window set according to the current chip conveying delay, but can still establish a correspondence with the previous inlet chip removal response, it is determined that the current cleaning unit is in a delayed chip removal state, the negative pressure chip suction time is extended, and the chip conveying delay is updated again according to the delayed-arriving end-of-line chip signal.

[0067] When no valid iron filings signal is detected within the inlet response time window and the end response time window, and the chip suction flow rate and negative pressure data are within the normal range, the current cleaning unit is determined to be in the cleaning completion candidate state and enters the cleaning verification.

[0068] When the chip suction flow rate is below the normal range, the negative pressure data deviates from the normal range, or both show continuous abnormal fluctuations, it is determined that the chip suction conveying path is in an abnormal state. The central control console 2 suspends the normal blowing of the current cleaning unit and performs channel unblocking. The channel unblocking includes: controlling the negative pressure source 9 to start and stop alternately according to a preset start-stop cycle, so that an alternating negative pressure airflow is formed in the chip suction conveying path; during the start of the negative pressure source 9, controlling the pulse control valve to make the chip blowing pipe 406 perform short-term pulse blowing near the inlet of the chip suction pipe 403 to disturb the iron chips accumulated at the opening of the machining hole or the inlet of the chip suction pipe 403, and the loosened iron chips are transported to the collection box 8 by the negative pressure airflow.

[0069] After each preset start-stop cycle, the central control unit 2 reacquires the dust suction flow rate and negative pressure data. When the dust suction flow rate and negative pressure data return to normal within a preset stabilization time, the channel is confirmed to be cleared, and the current cleaning unit continues to be purged. If the dust suction flow rate and negative pressure data still have not returned to normal after the preset maximum number of purging cycles has been reached, the central control unit 2 stops the current dust removal process and outputs a manual cleaning prompt for the dust suction and conveying path; after the dust suction and conveying path has been manually cleaned and the dust suction status has returned to normal, the current cleaning unit is purged again.

[0070] The cleaning control actions consist of moving to the next cleaning unit, strengthening blowing, extending the negative pressure suction time, entering the cleaning verification, and performing channel unblocking. The central control unit 2 executes the corresponding cleaning control actions according to the determined cleaning status.

[0071] S5. For cleaning units in the cleaning completion candidate state and cleaning units that have completed fixed-point re-scanning, the central control console 2 controls the chip blowing pipe 406 to move back to the insertion depth and rotation angle corresponding to the cleaning unit according to the corresponding position data, and controls the negative pressure source 9 to form a stable negative pressure in the chip conveying path, and then controls the pulse control valve to make the chip blowing pipe 406 perform verification blowing.

[0072] The central control console 2 sets the inlet response time window and end response time window corresponding to the verification air blowing according to the updated iron chip conveying delay, obtains the inlet chip discharge response, end chip discharge response, chip suction flow rate data and negative pressure data after the verification air blowing, and forms the chip cleaning response parameter group corresponding to the verification air blowing.

[0073] When no valid iron filings signal is detected within both the inlet and end response time windows, and the chip suction flow rate and negative pressure data are within the normal range, the corresponding cleaning unit is determined to have completed cleaning.

[0074] When a valid inlet or end chip signal is detected, it is determined that the corresponding cleaning unit has not yet completed cleaning. The cleaning unit is then re-added to the fixed-point re-sweeping path, and the chip removal control action continues. When the chip suction flow rate and negative pressure data are abnormal, the central control console 2 controls the negative pressure source 9 to alternately start and stop according to the channel clearing method described in S4, and controls the chip blowing pipe 406 to perform short-term pulse blowing near the inlet of the chip suction pipe 403. When the chip suction flow rate and negative pressure data return to the normal range and remain stable for a preset time, the verification blowing is performed again on the corresponding cleaning unit. If the chip suction status still does not return to normal after reaching the preset maximum number of clearing attempts, the verification process is stopped, and a manual cleaning prompt for the chip suction conveying path is output. The verification blowing is then performed again after the chip suction status returns to normal.

[0075] When all cleaning units have completed cleaning, the central control panel 2 closes the pulse control valve, controls the chip blowing pipe 406 to exit the machining hole, then controls the negative pressure source 9 to stop working, and controls the linear module and rotary drive assembly 402 to return to the preset initial position, so that the chip removal device 4 in the hole is reset.

[0076] The above description is merely a preferred embodiment of the present invention; however, the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and its improved concepts, should be covered within the scope of protection of the present invention.

Claims

1. A continuous drilling and tapping device for mold materials used in mold production, comprising a machine tool body (1), wherein the machine tool body (1) is provided with a central control panel (2), characterized in that: The machine tool body (1) is provided with a drilling and tapping module (3). A chip removal device (4) is installed on one side of the drilling and tapping module (3). The chip removal device (4) includes a linear module (401). The moving end of the linear module (401) is provided with a rotary drive assembly (402). The output end of the rotary drive assembly (402) is connected to a chip suction pipe (403) for driving the chip suction pipe (403) to rotate around its own axis. The upper end of the chip suction pipe (403) is sealed and rotatably connected to a negative pressure transfer pipe (404). A bracket (405) is provided in the middle of the chip suction pipe (403). A chip blowing pipe (406) is provided in the middle of the bracket (405). The upper end of the chip blowing pipe (406) is sealed and rotatably connected to a chip blowing transfer pipe. The rotating pipe (407) has a hard chip blowing section at the bottom of the chip blowing pipe (406), and multiple chip blowing holes are opened on the hard chip blowing section; the upper end of the negative pressure rotating pipe (404) is connected to a chip suction hose (5), the upper end of the chip blowing rotating pipe (407) is connected to a chip blowing hose (6), the end of the chip blowing hose (6) is connected to a high-pressure air pump (7), the other end of the chip suction hose (5) is connected to a collection box (8), the collection box (8) is connected to a negative pressure source (9), the machine tool body (1) is provided with an intelligent chip removal detection and control module, the intelligent chip removal detection and control module includes a central control console (2), an inlet chip detection unit, an end chip detection unit, a chip suction flow detection unit, a negative pressure detection unit, an axial position detection unit, and a rotation angle detection unit.

2. The continuous drilling and tapping equipment for mold materials used in mold production according to claim 1, characterized in that: The chip suction pipe (403) is connected to the collection box (8) via the chip suction hose (5) to form a chip suction and conveying path extending from the chip suction pipe (403) to the collection box (8); The inlet chip detection unit is located at the front end of the chip conveying path and is used to acquire the inlet chip signal that enters the chip conveying path from the machining hole. The end-of-life iron chip detection unit is located at the rear section of the chip conveying path and is used to acquire the end-of-life iron chip signal that has reached the chip inlet of the collection box (8). The chip suction flow detection unit is set on the chip suction conveying path and is used to obtain the real-time chip suction flow within the chip suction conveying path. The negative pressure detection unit is connected to the dust collection and conveying path and is used to obtain the real-time negative pressure within the dust collection and conveying path; The axial position detection unit is used to obtain the axial position of the moving end of the linear module (401) to determine the overall axial position of the chip suction pipe (403) and the chip blowing pipe (406) and the depth of the chip blowing pipe (406) extending into the machining hole. The linear module (401) drives the chip suction pipe (403) and the chip blowing pipe (406) to move as a whole; The rotation angle detection unit is used to obtain the real-time rotation angle of the blow pipe (406); The chip blowing pipe (406) is connected to a chip blowing air path, and a pulse control valve is provided on the chip blowing air path. The chip suction and conveying path is connected to a negative pressure source (9). The central control unit (2) is connected to the inlet chip detection unit, the end chip detection unit, the chip suction flow detection unit, the negative pressure detection unit, the axial position detection unit, the rotation angle detection unit, the linear module, the rotation drive assembly (402), the pulse control valve and the negative pressure source (9) respectively, and is used to control the axial position, rotation angle, blowing action and negative pressure chip suction status of the chip blowing pipe (406) according to the data obtained by each detection unit.

3. The continuous drilling and tapping equipment for mold materials used in mold production according to claim 2, characterized in that: The intelligent chip removal detection and control module is configured to perform the following steps: S1. Divide the machining hole into multiple axial sections along the axial direction, and divide each axial section into multiple cleaning units; control the chip blowing pipe (406) to perform detection blowing on the preset initial cleaning unit, and establish the initial chip conveying delay based on the response time difference between the inlet chip signal and the end chip signal. S2. Control the chip blowing pipe (406) to move sequentially to the corresponding position of each cleaning unit, perform pulse blowing under negative pressure chip suction state, obtain the position data, chip suction flow data and negative pressure data corresponding to each cleaning unit, and obtain the inlet chip discharge response and end chip discharge response according to the initial chip conveying delay, and form the corresponding chip removal response parameter group from the inlet chip discharge response, end chip discharge response, chip suction flow data and negative pressure data; S3. Update the initial chip conveying delay according to the correspondence between the inlet chip signal and the end chip signal; associate the end chip removal response with the corresponding cleaning unit according to the updated chip conveying delay and the position data; form the residual chip response distribution of the machining hole according to the inlet chip removal response and the end chip removal response; and generate a fixed-point rescanning path accordingly. S4. Determine the current cleaning status of the cleaning unit based on the changes in the cleaning response parameter group, and execute the corresponding cleaning control action based on the cleaning status.

4. The continuous drilling and tapping equipment for mold materials used in mold production according to claim 3, characterized in that: The intelligent chip removal detection and control module is also configured to perform the following steps: S5. Perform verification blowing on the cleaning unit that has completed the blowing, obtain the chip removal response parameter group corresponding to the verification blowing, and determine the cleaning result of the corresponding cleaning unit according to the chip removal response parameter group; when all cleaning units have completed cleaning, control the chip removal pipe (406) to exit the processing hole, and control the chip removal device (4) in the hole to reset.

5. A continuous drilling and tapping device for mold materials used in mold production according to claim 3, characterized in that: In S3, the current chip conveying delay is recursively updated based on the response time difference of the newly obtained matching inlet chip signal and end chip signal. During the update, the previous chip conveying delay is retained and the updated chip conveying delay is determined by combining the newly obtained response time difference. When no matching inlet chip signal and end chip signal are obtained, the current chip conveying delay remains unchanged.

6. The continuous drilling and tapping equipment for mold materials used in mold production according to claim 3, characterized in that: In step S3, based on the inlet chip removal response, the end chip removal response, the time delay deviation between the inlet and end chip removal responses of each cleaning unit, and the duration of the response after repeated blowing, the residual chip response level of the j-th cleaning unit is determined according to the following formula: In the formula, This indicates the degree of residue response in the j-th cleaning unit; This represents the normalized value of the inlet chip removal response intensity of the j-th cleaning unit; Normalized value representing the degree of matching between the inlet chip removal response and the end chip removal response; This represents the normalized value of the deviation between the actual response time difference and the current chip conveying delay; This represents the normalized value indicating the degree to which a valid iron filings signal continues to appear after repeated blowing of the j-th cleaning unit; , , and Let represent the weighting coefficients for the ingress response, missing endpoint match, time delay bias, and repeated response, respectively, and satisfy . The corresponding debris response levels are arranged according to the location data of each cleaning unit to form the debris response distribution.

7. A continuous drilling and tapping device for mold materials used in mold production according to claim 3, characterized in that: In S4, the current cleaning status of the cleaning unit is determined based on the correspondence between the inlet and end chip removal responses and the changes in chip suction flow rate and negative pressure data. When there are corresponding valid chip signals in the inlet chip removal response and the end chip removal response, and the chip suction flow rate data and negative pressure data are within the normal range, the chip removal state is determined to be successful. When there is an inlet chip removal response but no corresponding end chip removal response is formed, and the chip suction flow rate data and negative pressure data show fluctuations caused by the passage of chips, the state is determined to be intermediate stagnation. When the end chip removal response exceeds the end response time window set according to the current chip conveying delay, but can establish a correspondence with the previous inlet chip removal response, the state is determined to be delayed chip removal. When no valid chip signals are detected within both the inlet response time window and the end response time window, and the chip suction flow rate data and negative pressure data are within the normal range, the state is determined to be a candidate state for cleaning completion.

8. A continuous drilling and tapping device for mold materials used in mold production according to claim 4, characterized in that: In step S5, the inlet response time window and the end response time window corresponding to the verification air blowing are set according to the updated iron chip conveying delay, and the cleaning result is determined according to the chip removal response parameter group corresponding to the verification air blowing; when no effective iron chip signal is detected in the inlet response time window and the end response time window, and the chip suction flow rate data and negative pressure data are within the normal range, it is determined that the corresponding cleaning unit has completed cleaning. When a valid iron filings signal is detected, the corresponding cleaning unit is re-added to the fixed-point re-scanning path; when the chip suction flow rate data and negative pressure data are abnormal, the channel is cleared, and the verification blowing is re-executed after the negative pressure chip suction state returns to normal.

9. A continuous drilling and tapping device for mold materials used in mold production according to claim 1, characterized in that: The upper outer wall of the dander suction tube (403) is provided with a first annular protrusion (408), and the lower end of the negative pressure transfer tube (404) is provided with a first sleeve block (409) sleeved on the outer side of the upper end of the dander suction tube (403). The inner wall of the first sleeve block (409) is provided with a first annular groove that matches the first annular protrusion (408). The first annular protrusion (408) is rotatably embedded in the first annular groove. The lower end of the dander suction tube (403) gradually expands in diameter in the downward direction to form a trumpet-shaped dander suction cover with the opening facing downward. The upper outer wall of the chip blowing pipe (406) is provided with a second annular protrusion (410), and the lower end of the chip blowing transfer pipe (407) is provided with a second sleeve block (411) sleeved on the outer side of the upper end of the chip blowing pipe (406). The inner wall of the second sleeve block (411) is provided with a second annular groove that matches the second annular protrusion (410), and the second annular protrusion (410) is rotatably embedded in the second annular groove.

10. A continuous drilling and tapping device for mold materials used in mold production according to claim 1, characterized in that: The collection box (8) includes a box body (801), a chip collection filter (802) is provided inside the box body (801), a chip inlet is provided at the upper end of the chip collection filter (802), a chip inlet pipe (803) is provided at the upper end of the box body (801), one end of the chip inlet pipe (803) is connected to the chip suction hose (5), and the other end of the chip inlet pipe (803) is correspondingly provided with the chip inlet. A negative pressure cavity is formed between the outer wall of the chip collection filter cartridge (802) and the inner wall of the box body (801). The side of the box body (801) is provided with an air extraction pipe (804) that communicates with the negative pressure cavity. The air extraction pipe (804) is connected to the negative pressure source (9).

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