Wafer double-side synchronous thinning and polishing device

Abstract

The application discloses a wafer double-face synchronous thinning and polishing device, and relates to the technical field of wafer thinning and polishing.The wafer double-face synchronous thinning and polishing device comprises a polishing machine, a lower polishing assembly and an upper polishing assembly arranged at the upper end of the polishing machine, the lower polishing assembly comprises a lower polishing frame, the upper end of the lower polishing frame is fixedly connected with a lower polishing disc, and the upper end of the lower polishing disc is provided with a float wheel assembly; the wafer is placed in the feeding hole and is flexibly connected with the placing ring and the built-in spring sheet; when the upper polishing disc and the lower polishing disc exert friction force on the wafer during the processing, the force is transmitted to the placing ring through the wafer and overcomes the restoring force of the built-in spring sheet, so that the placing ring generates radial eccentric displacement relative to the float wheel disc, the size and direction of the eccentric displacement are dynamically and adaptively adjusted according to the change of the force during the processing, the wafer obtains the self-rotation freedom during the processing, each point on the surface of the wafer can be processed more uniformly, and the overall thickness uniformity and the processing quality of the wafer are effectively ensured.

Description

Technical Field

[0001] This invention relates to the field of wafer thinning and polishing technology, specifically to a wafer double-sided synchronous thinning and polishing device. Background Technology

[0002] Wafers are the basic material for semiconductor manufacturing. They are usually thin circular wafers cut and ground from high-purity single-crystal silicon. After precision processing, their surfaces are used to manufacture various chip products such as integrated circuits and power devices. To ensure the smooth progress of subsequent processes and the long-term reliability of chip performance, they need to be thinned and polished to adapt to advanced packaging.

[0003] In traditional double-sided processing equipment, wafers are placed concentrically in a carrier tray. When placed concentrically, the forces acting on the wafers cancel each other out, making it impossible to drive the wafers to rotate within the opening of the carrier. This results in uneven wafer thickness after processing, with the wafer thickness profile being non-rotationally symmetric, ultimately forming a wedge-shaped profile. This affects the quality of the processing operation. Furthermore, the concentrically arranged wafers cannot effectively agitate the polishing fluid, failing to guide fresh fluid to the center of the wafer and promptly remove wear debris and heat. This can easily lead to localized overheating, uneven material removal, and even wafer floating due to localized fluid accumulation, ultimately affecting the flatness of the wafers. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer double-sided synchronous thinning and polishing device to solve the problems mentioned above.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a wafer double-sided synchronous thinning and polishing device, comprising a polishing machine, a lower polishing component and an upper polishing component disposed at the upper end of the polishing machine, wherein the lower polishing component comprises a lower polishing frame, a lower polishing disk is fixedly connected to the upper end of the lower polishing frame, and a cruise wheel component is disposed at the upper end of the lower polishing disk; A cruise ship assembly is movably mounted on the upper end of the lower polishing disk. Three cruise ship assemblies are arranged in a circumferential array. Each cruise ship assembly includes a cruise ship disk, with a feeding hole on its side. A lower splicing disk is located inside the feeding hole, and an upper splicing disk is located above the lower splicing disk. The lower and upper splicing disks are interlocked. An internal groove is located on the side of the upper splicing disk, with an internal spring inside the groove. A placement ring is located inside the upper splicing disk, and an annular groove is located on the outside of the placement ring. One end of the internal spring is located inside the annular groove. A wafer is placed inside the placement ring. The interlocking connection between the lower and upper splicing disks and the internal spring, together, stabilize the position of the placement ring while providing a dynamic adaptive adjustment effect for the wafer.

[0006] In a preferred embodiment, four discharge holes are provided and evenly distributed in a circumferential array. The lower splicing plate is fixedly connected to the side end of the discharge holes. Both the lower splicing plate and the upper splicing plate are provided with meshing teeth and meshing grooves on one side. The meshing teeth and meshing grooves are staggered and arranged in a terraced shape to increase the contact area between the lower splicing plate and the upper splicing plate.

[0007] In a preferred embodiment, the cruise ship assembly comprises three components evenly distributed in a circumferential array. A drive gear is fixedly connected to the outer side of the cruise ship disk, and a gear sleeve is fixedly connected to the outer side of the drive gear. Pads are provided on both the upper and lower sides of the cruise ship disk, and eight pads are evenly distributed in a circumferential array on one side of the cruise ship disk.

[0008] In a preferred embodiment, a limiting hole is formed at one end of the built-in spring, and a fixing post is fixedly connected to the inner side of the built-in groove. Two fixing posts are provided, and the fixing posts are adapted to the limiting hole. The fixing posts are located inside the limiting hole, and an adhesive pad is fixedly connected to the inner side of the placement ring. The inner side of the adhesive pad is in contact with the outer side of the wafer.

[0009] In a preferred embodiment, the lower polishing assembly is disposed on the upper inner side of the polishing machine, and the upper polishing assembly is disposed on the upper side of the lower polishing assembly. The upper polishing assembly includes an upper frame, an upper polishing rack is disposed on the lower end of the upper frame, and an upper polishing disc is movably disposed on the lower end of the upper polishing rack. A polishing plate is disposed on one side of both the upper polishing disc and the lower polishing disc, and an embedded groove is disposed on the side end of the polishing plate.

[0010] In a preferred embodiment, a linkage post is provided in the middle of the lower polishing frame, and the linkage post is adapted to the middle of the upper polishing disc. A multi-stage linkage rod is provided at the lower end of the linkage post, and a linkage gear is fixedly connected to the outer side of the multi-stage linkage rod. A gearbox is provided at the lower end of the multi-stage linkage rod, and one end of the gearbox is fixedly connected to the inside side of the polishing machine. A drive motor is provided at the lower end of the gearbox, and the output end of the drive motor is fixedly connected to one end of the gearbox. The drive motor is fixedly connected to the bottom inner side of the polishing machine.

[0011] In a preferred embodiment, a drive cylinder is fixedly connected to the upper end of the upper frame, the output end of the drive cylinder is fixedly connected to one end of the upper polishing frame, a flow divider is fixedly connected to the lower end of the upper frame, a flow guide pipe is provided between the flow divider and the upper polishing frame, and a drainage pipe is fixedly connected to the upper end of the flow divider.

[0012] In a preferred embodiment, a fixed toothed ring is fixedly connected to the upper end of the polishing machine, the inner side of the fixed toothed ring is movably connected to the outer side of the cruise wheel assembly, a drain ring is provided at the lower end of the fixed toothed ring, the drain ring is located at the lower side of the lower polishing disc, and a drain port is fixedly connected to one end of the drain ring, the drain port extending to the outer side of the polishing machine.

[0013] In a preferred embodiment, a controller is fixedly connected to one side of the upper end of the polishing machine, and an alarm is provided at the upper end of the upper polishing assembly. The alarm is electrically connected to the controller.

[0014] Beneficial effects Compared with the prior art, the present invention has the following beneficial effects: 1. This wafer double-sided synchronous thinning and polishing device places the wafer inside the feeding hole and flexibly connects it with the placement ring and the built-in spring. During the processing, when the upper and lower polishing disks apply friction to the wafer, the force is transmitted through the wafer to the placement ring and overcomes the restoring force of the built-in spring. This causes the placement ring to have a radial eccentric displacement relative to the wheel disk. The magnitude and direction of this eccentric displacement are dynamically and adaptively adjusted according to the changes in force during the processing. This allows the wafer to gain a degree of freedom of rotation during processing, and its surface can be processed more uniformly. This avoids the drawback of the traditional concentric arrangement, which causes the wafer thickness profile to be non-rotationally symmetrical and thus form a wedge profile. At the same time, the flexible design of the built-in spring introduces a controllable degree of freedom of radial micro-vibration to the wafer, upgrading its motion mode from the traditional rigid motion of revolution and rotation to a composite motion of planetary motion and radial micro-vibration. This further improves the processing consistency of each position on the wafer surface and effectively ensures the overall thickness uniformity and processing quality of the wafer. 2. This wafer double-sided synchronous thinning and polishing device breaks the motion symmetry by eccentrically arranging the wafers. During the revolution and rotation of the eccentric wafers, the polishing fluid can be actively guided and transported from the edge to the center, while the grinding debris and heat are discharged outwards. This effectively solves the defect that the wafers cannot effectively agitate the polishing fluid when arranged concentrically, thus failing to guide fresh liquid to the center of the wafer and remove grinding debris and heat in time. It avoids the problems of local overheating, uneven material removal, and wafer floating caused by local liquid accumulation due to poor liquid flow. It significantly improves the uniformity of fluid distribution and temperature distribution in the processing area, thereby maintaining a stable and consistent material removal rate throughout the processing, creating reliable process conditions for improving the final flatness of the wafer.

[0015] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0016] Figure 1 A schematic diagram of the overall three-dimensional structure of the present invention is shown; Figure 2 A three-dimensional structural diagram of the cruise ship component in this invention is shown; Figure 3 A three-dimensional structural diagram of the cruise ship component in this invention is shown. Figure 4 This shows a first cross-sectional schematic diagram of the structure of the cruise ship component in this invention; Figure 5 This shows a second cross-sectional schematic diagram of the cruise ship component structure in this invention; Figure 6 A schematic diagram of the structural state of a cruise ship component in this invention is shown; Figure 7 A schematic diagram of the internal structure of the overall three-dimensional structure of the present invention is shown; Figure 8 A schematic diagram showing the overall three-dimensional structure of the present invention is provided. Figure 9 A second-view schematic diagram of the overall three-dimensional structure of the present invention is shown.

[0017] In the diagram: 100, Polishing machine; 200, Lower polishing assembly; 201, Lower polishing frame; 202, Lower polishing disc; 203, Polishing plate; 204, Embedded groove; 205, Linkage pin; 206, Multi-stage linkage rod; 207, Linkage gear; 208, Gearbox; 209, Drive motor; 300, Upper polishing assembly; 301, Upper frame; 302, Drive cylinder; 303, Upper polishing frame; 304, Upper polishing disc; 305, Guide pipe; 306, Diverter plate; 307, Drainage pipe; 400, Cruise ship Components; 401, cruise wheel disc; 402, drive gear; 403, gear sleeve; 404, discharge hole; 405, splicing lower plate; 406, meshing gear; 407, meshing groove; 408, splicing upper plate; 409, internal groove; 410, internal spring; 411, fixing post; 412, limiting hole; 413, placement ring; 414, fitting pad; 415, annular slot; 416, wafer; 417, pad; 5, fixing gear ring; 6, drain ring; 7, drain port; 8, alarm; 9, controller. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] In the description of this invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", etc., which indicate orientation or positional relationship, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this invention.

[0020] Please see Figures 1-6 The present invention provides a technical solution: a wafer double-sided synchronous thinning and polishing device, including a polishing machine 100, a lower polishing component 200 and an upper polishing component 300 disposed at the upper end of the polishing machine 100, the lower polishing component 200 including a lower polishing frame 201, a lower polishing disk 202 fixedly connected to the upper end of the lower polishing frame 201, and a cruise wheel component 400 disposed at the upper end of the lower polishing disk 202; The cruise ship assembly 400 is movably mounted on the upper end of the lower polishing disc 202. Three cruise ship assemblies 400 are arranged in a circumferential array. Each cruise ship assembly 400 includes a cruise ship disc 401. A material discharge hole 404 is provided on the side of the cruise ship disc 401. A lower splicing disc 405 is provided inside the material discharge hole 404. An upper splicing disc 408 is provided above the lower splicing disc 405. The lower splicing disc 405 and the upper splicing disc 408 are interlocked. An internal groove 409 is provided on the side of the upper splicing disc 408. An internal spring piece 410 is provided inside the internal groove 409. A placement ring 413 is provided inside the upper splicing disc 408. An annular groove 415 is provided on the outer side of the placement ring 413. One end of the internal spring piece 410 is located inside the annular groove 415. A wafer 416 is disposed on the inner side of the ring 413. The meshing connection between the lower splicing plate 405 and the upper splicing plate 408, along with the placement of the built-in spring tabs 410, stabilizes the position of the ring 413 while providing a dynamic adaptive adjustment effect for the wafer 416. Several built-in spring tabs 410 are disposed in a circumferential array and evenly distributed on the inner side of the upper splicing plate 408. One end of each built-in spring tab 410 is movably disposed on the inner side of the annular slot 415. The lower splicing plate 405 and the upper splicing plate 408 are tightly connected by magnetic attraction. At the same time, the wafer 416 is used to press and adhere the pad 414 on the inner side of the ring 413. The overall movement generated during processing is effectively transferred to the connection position between the ring 413 and the built-in spring tabs 410, improving the controllability of the processing operation.

[0021] Four discharge holes 404 are evenly distributed in a circumferential array. The lower splicing plate 405 is fixedly connected to the side end of the discharge holes 404. Both the lower splicing plate 405 and the upper splicing plate 408 are provided with meshing teeth 406 and meshing grooves 407 on one side. The meshing teeth 406 and meshing grooves 407 are staggered and arranged in a terraced pattern to increase the contact area between the lower splicing plate 405 and the upper splicing plate 408. The two sides of the meshing teeth 406 are symmetrically inclined. The lower and upper splicing disks 405 and 408 are both equipped with magnetic materials to facilitate a tight fit between them. When the lower and upper splicing disks 405 and 408 are in contact, and when the entire device is polishing the wafer 416, the meshing connection between the lower and upper splicing disks 405 and 408 is used to achieve an effective connection between the wafer 416 and the wheel disk 401, avoiding problems such as derailment or misconnection during polishing.

[0022] The cruise wheel assembly 400 has three components evenly distributed in a circular array. A drive gear 402 is fixedly connected to the outer side of the cruise wheel disk 401, and a gear sleeve 403 is fixedly connected to the outer side of the drive gear 402. Pads 417 are provided on both the upper and lower sides of the cruise wheel disk 401. Eight pads 417 are evenly distributed in a circular array on one side of the cruise wheel disk 401. A gear sleeve 403 is fitted over the outer side of the drive gear 402. When the drive gear 402 is connected to the inner side of the fixed gear ring 5 and the outer side of its linkage gear 207, it achieves a buffering and stabilizing effect, reduces drive wear, and reduces the activity gap between linkage drives. This stabilizes the overall rotation and movement of the cruise wheel disk 401, making its overall drive more stable and avoiding problems such as unstable drive, large activity errors, and affecting the use and overall polishing effect of the cruise wheel disk 401.

[0023] One end of the built-in spring 410 has a limiting hole 412. A fixing post 411 is fixedly connected to the inner side of the built-in groove 409. There are two fixing posts 411. The fixing posts 411 and the limiting hole 412 are mutually adapted to each other. The fixing posts 411 are located inside the limiting hole 412. A bonding pad 414 is fixedly connected to the inner side of the placement ring 413. The inner side of the bonding pad 414 is in contact with the outer side of the wafer 416. When the wafer 416 is placed into the feeding hole 404, the wafer 416 squeezes the bonding pad 414. The bonding pad 414 stabilizes the placement of the wafer 416 and prevents the wafer 416 from shaking at this position, which would affect the accuracy of the polishing operation on both sides of the wafer 416. The fixing post 411 is used to stabilize the position of the built-in spring 410 inside the built-in groove 409.

[0024] It is important to note that, in combination Figure 6The figure shows the actual working condition of the equipment. Marks S1 and S2 are schematic diagrams of the positional changes of the built-in spring 410, placement ring 413 and wafer 416. The equipment can adjust the corresponding positions according to the requirements.

[0025] In this embodiment of the invention, the wafer 416, the placement ring 413, and the wheel disk 401 are connected by built-in springs 410 evenly distributed along the circumference. The built-in springs 410 allow the wafer 416 and the placement ring 413 to have a certain amount of eccentric displacement in the radial direction relative to the wheel disk 401. When the device processes the wafer 416, the wafer 416 is evenly distributed inside the feed hole 404 opened on the side of the wheel disk 401. Its eccentric arrangement breaks the symmetry. The upper polishing disk 304 and the lower polishing disk 202 apply frictional force to the wafer 416, and this force is transmitted to the placement ring 413 through the wafer 416. Overcoming the restoring force of the built-in spring 410, the roller disk 401 drives the wafer 416 to generate an eccentric displacement. The magnitude and direction of this eccentric displacement will dynamically and adaptively adjust with the change of force during the processing, thereby continuously generating a uniform pumping effect and driving the wafer 416 to rotate. The rotation of the wafer 416 allows all points on its surface to be processed more uniformly, fundamentally avoiding the generation of wedge thickness. When the eccentric wafer 416 revolves and rotates, it can actively guide and transport the polishing fluid from the edge to the center, while discharging the grinding debris and heat outward, thereby significantly improving the uniformity of fluid and temperature in the processing area.

[0026] In contrast to the rigid motion of traditional devices that can only perform revolution and rotation, the overall device introduces a controllable radial micro-vibration degree of freedom to the wafer 416 through the flexible design of the built-in spring 410. This makes its motion mode closer to the composite motion of planetary motion and radial micro-vibration, thereby more effectively breaking the boundary layer, improving fluid distribution, increasing processing efficiency, and ensuring processing quality.

[0027] Reference Figures 7-9 Specifically, the lower polishing assembly 200 is located on the upper inner side of the polishing machine 100, and the upper polishing assembly 300 is located on the upper end of the lower polishing assembly 200. The upper polishing assembly 300 includes an upper frame 301, an upper polishing frame 303 is located at the lower end of the upper frame 301, and an upper polishing disc 304 is movably located at the lower end of the upper polishing frame 303. Polishing plates 203 are provided on one side of both the upper polishing disc 304 and the lower polishing disc 202. An embedded groove 204 is provided on the side end of the polishing plate 203. The polishing plate 203 is used to perform effective polishing operations on the wafer 416, and its embedded groove 204 is used to facilitate the flow of polishing fluid and the flow and discharge of polishing debris.

[0028] A linkage post 205 is provided in the middle of the lower polishing frame 201. The linkage post 205 is adapted to the middle of the upper polishing disk 304. The linkage post 205 is used to drive the upper polishing disk 304 to rotate synchronously, thereby effectively polishing the upper end of the wafer 416. A multi-stage linkage rod 206 is provided at the lower end of the linkage post 205. A linkage gear 207 is fixedly connected to the outer side of the multi-stage linkage rod 206. A gearbox 208 is provided at the lower end of the multi-stage linkage rod 206. One end of the gearbox 208 is fixedly connected to the inside side of the polishing machine 100. A drive motor 209 is provided at the lower end of the gearbox 208. The output end of the drive motor 209 is fixedly connected to one end of the gearbox 208. The drive motor 209 is fixedly connected to the bottom inner side of the polishing machine 100.

[0029] In this embodiment of the invention, the drive motor 209 is electrically connected to the controller 9, and the controller 9 controls the working state of the drive motor 209. The output end of the drive motor 209 is fixedly connected to one end of the gearbox 208. The output end of the gearbox 208 is provided with three linkage gears 207, each with a different gear ratio. By utilizing the cooperation between the three linkage gears 207 and the multi-stage linkage rod 206 and the linkage gears 207 located on the outer side of the multi-stage linkage rod 206, the multi-stage linkage rod 206 can be adjusted to different speeds, so that the rotation speeds of the lower polishing disc 202, the upper polishing disc 304, and the polishing wheel disc 401 are different, which facilitates the polishing operation.

[0030] Reference Figures 7-9 Specifically, a drive cylinder 302 is fixedly connected to the upper end of the upper frame 301. The output end of the drive cylinder 302 is fixedly connected to one end of the upper polishing frame 303. A distribution plate 306 is fixedly connected to the lower end of the upper frame 301. A guide pipe 305 is provided between the distribution plate 306 and the upper polishing frame 303. A drain pipe 307 is fixedly connected to the upper end of the distribution plate 306. The drive cylinder 302 is used to drive the upper polishing frame 303 and the upper polishing disc 304 to move up and down. The position changes are controlled according to the needs of different stages. The drain pipe 307 is used to guide the polishing liquid into the interior of the distribution plate 306, and then it is discharged through the guide pipe 305. The output end of the guide pipe 305 extends to the gap between the upper polishing frame 303 and the upper polishing disc 304. The inner side of the embedded groove 204 opened on the side of the upper polishing disc 304 is provided with a through hole to facilitate the flow of polishing liquid to the processing area.

[0031] A fixed toothed ring 5 is fixedly connected to the upper end of the polishing machine 100. The inner side of the fixed toothed ring 5 is movably connected to the outer side of the cruise wheel assembly 400. A drain ring 6 is provided at the lower end of the fixed toothed ring 5. The drain ring 6 is located at the lower side of the lower polishing disc 202. A drain port 7 is fixedly connected to one end of the drain ring 6. The drain port 7 extends to the outer side of the polishing machine 100. The polishing debris and polishing liquid after polishing are guided to the edge along the embedded groove 204 opened at the side of the lower polishing disc 202 and drip into the interior of the drain ring 6. Then, they are discharged through the drain port 7.

[0032] In this embodiment of the invention, the drive cylinder 302 is electrically connected to the controller 9. The controller 9 controls the working state of the drive cylinder 302. The drive cylinder 302 drives the upper polishing frame 303, which is fixedly connected to its output end, to move up and down. During the movement, the middle part of the upper polishing disc 304 and the lower linkage pin 205 are interlocked and spliced. When the movement reaches the designated position, the polishing liquid flows to the required processing position. The drive motor 209 drives the gearbox 208 and the multi-stage linkage rod 206 to operate synchronously, so that the linkage pin 205 can drive the upper polishing disc 304 to rotate synchronously, thereby effectively polishing the upper end of the wafer 416. At the same time, the rotation of the lower polishing disc 202 and the operation of the entire cruise wheel assembly 400 are used to complete the efficient polishing of the wafer 416.

[0033] A controller 9 is fixedly connected to one side of the upper end of the polishing machine 100, and an alarm 8 is installed at the upper end of the upper polishing component 300. The alarm 8 and the controller 9 are electrically connected. By using the alarm 8 and the controller 9 together, the processing status can be displayed in real time. In case of emergencies or malfunctions, an early warning can be given immediately, so that corresponding countermeasures can be implemented in a timely manner to ensure the overall operation and improve quality.

[0034] Specific usage process: Before operation, the operator first places the wafer 416 to be processed into the feeding hole 404 of the rotary disk 401, placing it on the bonding pad 414 inside the placement ring 413. When the wafer 416 is placed in, it compresses the bonding pad 414, causing a slight deformation to stably hold the wafer 416 and prevent vibration during processing. Simultaneously, the lower splicing disk 405 and the upper splicing disk 408 are tightly bonded by internally provided magnetic materials. The meshing teeth 406 and meshing grooves 407 are arranged in a terraced pattern and interlock with each other, thereby increasing the contact area and ensuring a firm and reliable connection between the wafer 416 and the wheel disk 401, effectively preventing derailment during polishing. The placement ring 413 is movably connected to one end of the built-in spring 410 through the annular groove 415 on its outer side. One end of the built-in spring 410 is stabilized on one side of the fixed post 411 through the limiting hole 412, so that the wafer 416 is in a radially floating state ready for processing. At this time, the built-in spring 410 is in a natural state and is not affected by external forces.

[0035] After the wafer 416 is installed, the controller 9 starts the drive cylinder 302 to push the upper polishing frame 303 and the upper polishing disk 304 downward. The middle part of the upper polishing disk 304 is engaged with the linkage post 205 of the lower polishing assembly 200. When the upper polishing disk 304 moves to the designated processing position, it stops pressing down. Then, the polishing fluid is introduced into the distribution disk 306 through the drainage pipe 307, and then transported to the gap between the upper polishing frame 303 and the upper polishing disk 304 through the guide pipe 305. The polishing fluid flows into the processing area of ​​the wafer 416 through the through hole of the embedded groove 204 on the side end of the upper polishing disk 304.

[0036] After the initial liquid supply is completed, it switches to continuous liquid supply. Simultaneously, the controller 9 starts the drive motor 209, which, after being changed speed by the gearbox 208, drives the multi-stage linkage 206 through three linkage gears 207 with different gear ratios. This causes the lower polishing disc 202, upper polishing disc 304, and cruise wheel assembly 400 to achieve different rotational speeds, creating relative motion. When the upper polishing disc 304 and lower polishing disc 202 apply frictional force to the wafer 416, this force is transmitted through the wafer 416 to the placement ring 413, overcoming the restoring force of the built-in spring 410. This causes the placement ring 413 to have a radial eccentric displacement relative to the cruise wheel 401. The magnitude and direction of this eccentric displacement change with the force during the processing. The dynamic adaptive adjustment, with its eccentric arrangement breaking the motion symmetry, gives the wafer 416 a degree of freedom of rotation, resulting in more uniform processing at all points on its surface and fundamentally avoiding the generation of wedge thickness. At the same time, the eccentric wafer 416 actively guides and delivers the polishing fluid from the edge to the center during revolution and rotation, and discharges the wear debris and heat outward, thereby significantly improving the uniformity of fluid and temperature in the processing area. In addition, with the flexible connection of the built-in spring 410, the wafer 416 also obtains a controllable degree of freedom of radial micro-vibration. Its motion mode is upgraded from the traditional rigid motion of revolution and rotation to a composite motion of planetary motion and radial micro-vibration, which continuously disrupts the boundary layer of polishing fluid and further improves processing efficiency and quality.

[0037] During the polishing process, the used polishing fluid and grinding debris are guided to the edge of the lower polishing disc 202 along the embedded groove 204 opened on the side end of the lower polishing disc 202, and then drip into the drain ring 6 set at the lower side end of the lower polishing disc 202. Finally, they are discharged to the outside of the polishing machine 100 through the drain port 7 to keep the processing environment clean. Throughout the entire processing process, the controller 9 and the alarm 8 work together in real time to continuously display the operating status of each component. In case of emergencies or malfunctions, the alarm 8 can issue a warning signal immediately to prompt the operator to implement the corresponding handling plan in a timely manner to ensure the overall operation of the equipment and the quality of the products.

[0038] After processing is completed, the drive cylinder 302 drives the upper polishing frame 303 and the upper polishing disk 304 to move upward, releasing the pressing state on the wafer 416. The operator then removes the processed wafer 416 from the placement ring 413, completing the processing operation for a single batch.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0040] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A wafer double-sided synchronous thinning and polishing apparatus, comprising a polishing machine (100), a lower polishing assembly (200) and an upper polishing assembly (300) disposed at the upper end of the polishing machine (100), characterized in that: The lower polishing assembly (200) includes a lower polishing frame (201), and a lower polishing disc (202) is fixedly connected to the upper end of the lower polishing frame (201). A cruiser assembly (400) is provided at the upper end of the lower polishing disc (202). A cruise ship assembly (400) is movably mounted on the upper end of the lower polishing disc (202). Three cruise ship assemblies (400) are arranged in a circumferential array. Each cruise ship assembly (400) includes a cruise ship disc (401). A material discharge hole (404) is provided on the side of the cruise ship disc (401). A splicing lower disc (405) is provided inside the material discharge hole (404). A splicing upper disc (408) is provided at the upper end of the splicing lower disc (405). The splicing lower disc (405) and the splicing upper disc (408) are interlocked. An internal groove is provided on the side of the splicing upper disc (408). 409), the inner side of the built-in slot (409) is provided with a built-in spring piece (410), the inner side of the splicing upper plate (408) is provided with a placement ring (413), the outer side of the placement ring (413) is provided with an annular slot (415), one end of the built-in spring piece (410) is provided on the inner side of the annular slot (415), and the inner side of the placement ring (413) is provided with a wafer (416). The meshing connection between the splicing lower plate (405) and the splicing upper plate (408) and the setting of the built-in spring piece (410) together stabilize the position of the placement ring (413) and have a dynamic adjustment effect on the wafer (416).

2. The wafer double-sided synchronous thinning and polishing apparatus according to claim 1, characterized in that: The discharge hole (404) has four holes and is evenly distributed in a circumferential array. The splicing lower plate (405) is fixedly connected to the side end of the discharge hole (404). Both the splicing lower plate (405) and the splicing upper plate (408) are provided with meshing teeth (406) and meshing grooves (407) on one side. The meshing teeth (406) and the meshing grooves (407) are interleaved. The meshing teeth (406) are arranged in a terraced shape to increase the contact area between the splicing lower plate (405) and the splicing upper plate (408).

3. The wafer double-sided synchronous thinning and polishing apparatus according to claim 2, characterized in that: The cruise ship assembly (400) has three components evenly distributed in a circular array. A drive gear (402) is fixedly connected to the outer side of the cruise ship disc (401). A gear sleeve (403) is fixedly connected to the outer side of the drive gear (402). Pads (417) are provided on both the upper and lower sides of the cruise ship disc (401). Eight pads (417) are provided and evenly distributed in a circular array on one side of the cruise ship disc (401).

4. The wafer double-sided synchronous thinning and polishing apparatus according to claim 3, characterized in that: One end of the built-in spring (410) is provided with a limiting hole (412). A fixing post (411) is fixedly connected to the inner side of the built-in groove (409). There are two fixing posts (411). The fixing posts (411) and the limiting hole (412) are mutually adapted. The fixing posts (411) are located inside the limiting hole (412). A fitting pad (414) is fixedly connected to the inner side of the placement ring (413). The inner side of the fitting pad (414) is in contact with the outer side of the wafer (416).

5. The wafer double-sided synchronous thinning and polishing apparatus according to claim 1, characterized in that: The lower polishing assembly (200) is disposed on the upper inner side of the polishing machine (100), and the upper polishing assembly (300) is disposed on the upper end of the lower polishing assembly (200). The upper polishing assembly (300) includes an upper frame (301), and an upper polishing frame (303) is disposed on the lower end of the upper frame (301). An upper polishing disc (304) is movably disposed on the lower end of the upper polishing frame (303). A polishing plate (203) is disposed on one side of both the upper polishing disc (304) and the lower polishing disc (202). An embedded groove (204) is disposed on the side end of the polishing plate (203).

6. The wafer double-sided synchronous thinning and polishing apparatus according to claim 5, characterized in that: A linkage post (205) is provided in the middle of the lower polishing frame (201). The linkage post (205) is adapted to the middle of the upper polishing disc (304). A multi-stage linkage rod (206) is provided at the lower end of the linkage post (205). A linkage gear (207) is fixedly connected to the outer side of the multi-stage linkage rod (206). A gearbox (208) is provided at the lower end of the multi-stage linkage rod (206). One end of the gearbox (208) is fixedly connected to the inside side of the polishing machine (100). A drive motor (209) is provided at the lower end of the gearbox (208). The output end of the drive motor (209) is fixedly connected to one end of the gearbox (208). The drive motor (209) is fixedly connected to the inner bottom end of the polishing machine (100).

7. The wafer double-sided synchronous thinning and polishing apparatus according to claim 6, characterized in that: A drive cylinder (302) is fixedly connected to the upper end of the upper frame (301). The output end of the drive cylinder (302) is fixedly connected to one end of the upper polishing frame (303). A flow divider (306) is fixedly connected to the lower end of the upper frame (301). A guide pipe (305) is provided between the flow divider (306) and the upper polishing frame (303). A drain pipe (307) is fixedly connected to the upper end of the flow divider (306).

8. The wafer double-sided synchronous thinning and polishing apparatus according to claim 1, characterized in that: The upper end of the polishing machine (100) is fixedly connected to a fixed toothed ring (5), the inner side of the fixed toothed ring (5) is movably connected to the outer side of the cruise ship assembly (400), the lower end of the fixed toothed ring (5) is provided with a drain ring (6), the drain ring (6) is provided at the lower side of the lower polishing disc (202), one end of the drain ring (6) is fixedly connected to a drain port (7), and the drain port (7) extends to the outer side of the polishing machine (100).

9. The wafer double-sided synchronous thinning and polishing apparatus according to claim 1, characterized in that: A controller (9) is fixedly connected to one side of the upper end of the polishing machine (100), and an alarm (8) is provided at the upper end of the upper polishing assembly (300). The alarm (8) is electrically connected to the controller (9).

Images