Hemispherical resonator inner-rod force flow polishing apparatus and polishing method

Abstract

The application discloses a hemispherical resonator inner rod force flow polishing equipment and a polishing method. The polishing equipment comprises a base, a polishing tank, a clamping mechanism and an inner rod polishing mechanism. The inner rod polishing mechanism comprises a polishing paddle assembly and a motor for driving the polishing paddle assembly to rotate. The polishing paddle assembly comprises a rotary transmission shaft and a profiled polishing blade arranged at the bottom of the rotary transmission shaft. The inner side of the profiled polishing blade is provided with a profiled working edge matched with the outer peripheral surface of the hemispherical resonator inner rod. The lower end is provided with a profiled curved surface matched with the inner wall of the hemispherical resonator. Passive flow guide grooves are arranged on the profiled curved surface. During polishing, the profiled polishing blade is inserted into the inner cavity of the hemispherical resonator to be polished. The small gap between the profiled working edge and the hemispherical resonator inner rod and the small gap between the profiled curved surface and the inner wall of the hemispherical resonator are controlled. Then, the profiled polishing blade is driven to rotate, so that high-efficiency and high-quality polishing of the hemispherical resonator inner rod can be realized.

Description

Technical Field

[0001] This invention relates to the field of precision and ultra-precision machining technology, specifically to a force rheological polishing device and polishing method for the inner rod of a hemispherical harmonic oscillator. Background Technology

[0002] Rotating bodies are common structures in engineering applications, such as missile seekers and hemispherical resonators, which are all high-precision rotating bodies. Machining the rotating protrusions inside the cavity of a rotating body is more difficult than machining the outer and inner surfaces, especially for the inner rod of a hemispherical resonator made of hard and brittle materials with high surface requirements. The high hardness and brittleness of the material, the thin-walled characteristics of the structure, and the spherical surface of the inner surface all pose great challenges to efficient and high-quality polishing.

[0003] Currently, flexible polishing methods with good applicability to complex curved surfaces include force rheological polishing, magnetorheological polishing, and ion beam polishing. Force rheological polishing utilizes the high-speed collision and shearing action of abrasive particles on the workpiece surface to polish it. Magnetorheological polishing uses an external magnetic field to control a magnetorheological fluid in the polishing area to generate a flexible "polishing mold" that matches the surface being processed, thus removing material. Ion beam polishing uses an ion beam accelerated and focused by an electromagnetic field to bombard the workpiece surface, removing material layer by layer in a controllable manner through a physical sputtering effect. These polishing methods can all achieve controllable changes in the flexibility of the "polishing mold" by changing the flow field, magnetic field, and ion beam energy. Furthermore, small polishing tools can be used to adapt to changes in the curvature of the working surface, and surface accuracy can be optimized through the residence function. Applying ion beam polishing technology to the machining of the inner rod of a hemispherical harmonic oscillator can achieve atomic-level material removal, but its polishing efficiency is low and its cost is high. Magnetorheological polishing materials offer stable removal functions, minimal subsurface damage, and high efficiency; however, miniaturizing the polishing wheel presents significant challenges, and their application in polishing the inner rods of small hemispherical resonators still faces numerous difficulties. Mechanorheological polishing utilizes the shear thickening effect of non-Newtonian fluids, causing the polishing fluid to form a flexible rheological layer on the polished surface under shear stress, thus achieving material removal. This method enables efficient and high-quality polishing of workpiece surfaces and offers the advantage of low cost. However, currently, there is no mechanorheological polishing equipment specifically designed for polishing the inner rods of small hemispherical resonators. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention proposes a force-rheological polishing device for the inner rod of a hemispherical resonator. By incorporating contour polishing blades that extend into the inner cavity of a small-sized hemispherical resonator, and by providing contour working edges matching the inner rod of the hemispherical resonator on the inner side of the contour polishing blades, the shear thickening effect of the force-rheological polishing fluid can be effectively induced during rotation by controlling the distance between the inner rod and the contour working edges. This achieves efficient and high-quality polishing of the inner rod of the small-sized hemispherical resonator. Furthermore, by providing a contoured curved surface at the lower end of the contour polishing blades and creating passive flow channels on this surface, the force-rheological polishing fluid between the contoured curved surface and the inner wall of the hemispherical resonator, and between the contour working edges and the inner rod, can be replaced in real time during the force-rheological polishing process. This maintains the stability of the force-rheological polishing fluid performance and improves polishing efficiency. Correspondingly, this invention also provides a force-rheological polishing method for the inner rod of a hemispherical resonator using the above-described force-rheological polishing device.

[0005] For polishing equipment, the technical solution of this application is as follows:

[0006] A hemispherical resonator inner rod force-rheological polishing device includes a base, a polishing tank on the base, and an inner rod polishing mechanism located above the polishing tank and movable vertically along the base. The polishing tank contains a clamping mechanism for mounting the hemispherical resonator to be polished. The inner rod polishing mechanism includes a rotatable polishing paddle assembly. The polishing paddle assembly includes a rotary drive shaft and a contour polishing blade located at the bottom of the rotary drive shaft. The inner side of the contour polishing blade has a contour working edge that matches the outer circumferential surface of the hemispherical resonator's inner rod. The lower end of the contour polishing blade has a contour curved surface that matches the inner wall of the hemispherical resonator, and a passive guide groove is formed on the contour curved surface. During operation, the contour polishing blade is controlled to descend to the processing position and rotate to... During processing, the contoured working edge maintains a set micro-distance with the outer circumferential surface of the inner rod of the hemispherical resonator, forming the first polishing area. The rheological polishing fluid in this area undergoes shear thickening after being subjected to shearing action, forming a flexible fixed abrasive tool to polish the inner rod of the hemispherical resonator. Meanwhile, the contoured curved surface maintains a set micro-distance with the inner wall of the hemispherical resonator, forming the second polishing area. The rheological polishing fluid in this area flows outward under the squeezing action of the passive guide groove, causing the rheological polishing fluid in the first polishing area to flow downward and replenish the second polishing area. The polishing fluid in the first polishing area is replenished from the side. The rheological polishing fluid in the first polishing area, the second polishing area, and the polishing tank continuously flows, achieving real-time replacement.

[0007] Compared with the prior art, the hemispherical resonator inner rod force rheological polishing device of the present invention has the following advantages: (1) By setting a contour polishing blade for extending into the inner cavity of a small-sized hemispherical resonator, and setting a contour working edge matching the inner rod of the hemispherical resonator on the inner side of the contour polishing blade, the shear thickening effect of the force rheological polishing fluid can be effectively induced during rotation by controlling the distance between the inner rod of the hemispherical resonator and the contour working edge, thereby realizing the force rheological polishing of the inner rod of the small-sized hemispherical resonator, with good polishing quality, and And ordinary force rheological polishing fluid can be used to achieve this, with low material cost and low environmental pollution; (2) A contoured surface is set at the lower end of the contoured polishing blade, and a passive guide groove is opened on the contoured surface to guide the force rheological polishing fluid between the contoured surface and the inner wall of the hemispherical harmonic oscillator outward, so that during the polishing process, the force rheological polishing fluid between the contoured surface and the inner wall of the hemispherical harmonic oscillator and the force rheological polishing fluid between the contoured working edge and the inner rod of the hemispherical harmonic oscillator can be continuously replaced to maintain the stability of the force rheological polishing fluid performance and improve the polishing efficiency.

[0008] As an optimization, in the aforementioned hemispherical resonator inner rod force rheological polishing equipment, a contouring transition section is provided between the contoured curved surface and the contoured working edge. The shape of the contouring transition section matches the transition section between the inner wall of the hemispherical resonator and the root of the inner rod. During processing, the contouring transition section maintains a set micro-distance with the transition section between the inner wall of the hemispherical resonator and the root of the inner rod. This allows for polishing of the root transition section simultaneously with polishing the inner rod of the hemispherical resonator, solving the problem that conventional force rheological polishing equipment struggles to effectively polish the root transition section.

[0009] As an optimization, in the aforementioned hemispherical harmonic oscillator inner rod force rheological polishing equipment, a temperature sensor for detecting the temperature of the force rheological polishing fluid is installed inside the polishing tank; the polishing tank has a hollow structure, and a heat exchange tube is installed inside the tank; the inlet and outlet of the heat exchange tube are respectively connected to the thermal management control system to form a circulation loop; a water pump is installed in the circulation loop. Therefore, the temperature of the force rheological polishing fluid can be precisely controlled during the polishing process, keeping it in a shear thickening state to ensure polishing efficiency.

[0010] As an optimization, in the aforementioned hemispherical resonator inner rod force rheological polishing equipment, the bottom of the rotary drive shaft is provided with two centrally symmetrical contour polishing blades. On the one hand, this facilitates the effective entry of the force rheological polishing fluid between the contour working part and the hemispherical resonator inner rod, thereby causing a significant shear thickening phenomenon and improving polishing efficiency; on the other hand, it ensures that the hemispherical resonator inner rod is subjected to uniform force, improving polishing quality.

[0011] As an optimization, in the aforementioned hemispherical resonator inner rod force rheological polishing equipment, the clamping mechanism includes an ER chuck and a nut; the bottom of the polishing tank is provided with a fixed seat; the lower end of the ER chuck is inserted into the fixed seat to clamp the hemispherical resonator; the nut is sleeved on the ER chuck and the fixed seat and is threadedly connected to the fixed seat. Therefore, when changing workpieces, there is no need to drain or remove the force rheological polishing fluid; the workpiece can be loaded and unloaded directly by tightening the nut, thus simplifying the operation process, reducing non-processing time, and avoiding waste and frequent handling of the force rheological polishing fluid. Furthermore, the ER chuck is also provided with a protective sleeve adapted to the outer spherical surface of the hemispherical resonator. This protective sleeve can absorb and buffer the impact or vibration from some of the contour polishing blades, preventing the force rheological polishing fluid and abrasive particles from directly impacting or accumulating in localized areas, causing uneven wear.

[0012] As an optimization, in the aforementioned hemispherical resonator internal rod force rheological polishing equipment, the polishing paddle assembly is driven by a motor to rotate; the motor is fixed on a vertical adjustment mechanism and can move up and down along the base under the drive of the vertical adjustment mechanism; the rotary transmission shaft is connected to the output shaft of the motor; the vertical adjustment mechanism is a ball screw slide, and the motor is fixed on the slider of the ball screw slide. In this case, the structure is simple and easy to assemble and disassemble. Furthermore, the output shaft of the motor is a hexagonal output shaft; the rotary transmission shaft is connected to the hexagonal output shaft through an adapter sleeve. In this case, only a standard hexagonal hole needs to be machined on the adapter sleeve, and then the hexagonal shaft can be inserted into the corresponding hexagonal hole, greatly simplifying the assembly process.

[0013] Regarding the polishing method, the technical solution of this application is as follows:

[0014] A force-rheological polishing method for the inner rod of a hemispherical resonator, implemented using the aforementioned force-rheological polishing equipment of this application, includes the following steps: Step 1, mounting the hemispherical resonator to be polished onto a clamping mechanism; Step 2, pouring force-rheological polishing liquid into a polishing tank to immerse the hemispherical resonator; Step 3, controlling the contour polishing blade to extend into the force-rheological polishing liquid and engage with the hemispherical resonator; after the contour polishing blade moves into position, a small gap exists between the contour working edge of the contour polishing blade and the inner rod of the hemispherical resonator, forming a first polishing area, and a small gap exists between the contour curved surface and the inner wall of the hemispherical resonator, forming a second polishing area; Step 4, controlling the rotation of the contour polishing blade; at this time, the inner rod of the first polishing area... The rheological polishing slurry undergoes shear thickening under shearing action, forming a flexible, fixed abrasive tool to polish the inner rod of the hemispherical harmonic oscillator. Meanwhile, the rheological polishing slurry in the second polishing region flows outward under the pressure of the passive guide channel, causing the rheological polishing slurry in the first polishing region to flow downward, replenishing the second polishing region. The polishing slurry in the first polishing region is replenished from the side. The rheological polishing slurry in the first polishing region, the second polishing region, and the polishing tank continuously flows, achieving real-time replacement. Simultaneously, a temperature sensor monitors the temperature of the rheological polishing slurry in real time. When the temperature rise exceeds a set threshold, a water pump is activated, allowing the heat exchange liquid to enter the heat exchange tube and exchange heat with the rheological polishing slurry in the polishing tank.

[0015] Compared with existing technologies, the hemispherical resonator inner rod mechanical rheological polishing method of the present invention extends the contour polishing blade into the inner cavity of a small-sized hemispherical resonator, controls the gap between the inner rod of the hemispherical resonator and the contour working part, and then drives the contour polishing blade to rotate, inducing the shear thickening effect of the mechanical rheological polishing fluid. This achieves efficient and high-quality polishing of the inner rod of a small-sized hemispherical resonator, overcoming the core obstacle of applying mechanical rheological polishing technology to the surface processing of the inner rod of a hemispherical resonator. In addition, during the polishing process, the passive guide groove on the contour surface guides the flow, realizing the real-time replacement of the polishing fluid in the polishing area. At the same time, when the temperature of the mechanical rheological polishing fluid rises too high, heat exchange is carried out between the mechanical rheological polishing fluid and the heat exchange tube, so that the mechanical rheological polishing fluid can always be in a shear thickening state, resulting in high polishing efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the rheological polishing device for the inner rod of the hemispherical harmonic oscillator of this application;

[0017] Figure 2 This is a cross-sectional view of the polishing groove in an embodiment of this application;

[0018] Figure 3 This is a schematic diagram of the clamping mechanism in the embodiments of this application;

[0019] Figure 4This is a schematic diagram of the polishing mechanism in the embodiments of this application;

[0020] Figure 5 yes Figure 4 An enlarged schematic diagram of part A in the diagram;

[0021] Figure 6 This is a diagram illustrating the fit between the contour-polished blade and the hemispherical harmonic oscillator in an embodiment of this application.

[0022] Figure 7 This is a cross-sectional view of the polishing paddle assembly and the hemispherical resonator in an embodiment of this application;

[0023] Figure 8 This is a schematic diagram showing the flow direction of the force-rheological polishing slurry during processing;

[0024] Figure 9 This is a flowchart illustrating the force rheological polishing method for the inner rod of the hemispherical harmonic oscillator described in this application.

[0025] The labels in the attached diagram are as follows: 1-base; 2-polishing groove; 21-fixed seat; 3-clamping mechanism; 31-ER chuck; 32-nut; 33-protective sleeve; 4-inner rod polishing mechanism; 41-motor; 42-rotary drive shaft; 43-contouring polishing blade; 431-contouring working edge; 432-contouring curved surface; 433-passive guide channel; 434-contouring transition section; 44-adapter sleeve; 5-vertical adjustment mechanism; 6-thermal management control system; 7-heat exchange tube; 701-inlet; 702-outlet; 8-hemispherical resonator; 81-inner rod; 82-outer rod. Detailed Implementation

[0026] The present application will be further described below with reference to the accompanying drawings and embodiments, but this should not be construed as limiting the present application. Contents not described in detail in the following embodiments are all common knowledge in the art.

[0027] To address the technical challenges of poor accessibility and difficulty in achieving effective and stable polishing of the inner rod of a hemispherical resonator using existing force rheological polishing technology, this invention provides a force rheological polishing device for the inner rod of a hemispherical resonator. This device features a contour polishing blade 43 that can extend into the inner cavity of a small-sized hemispherical resonator, and a contour working edge 431 matching the inner rod of the hemispherical resonator is provided on the inner side of the contour polishing blade 43. During polishing, by controlling the gap between the inner rod of the hemispherical resonator and the contour working edge 431, and by inducing a shear thickening effect of the force rheological polishing fluid in the gap through the rotation of the contour polishing blade 43, efficient and high-quality polishing of the inner rod of a small-sized hemispherical resonator can be achieved.

[0028] Example:

[0029] See Figures 1 to 5The hemispherical resonator inner rod force rheological polishing device of the present invention includes a base 1, a polishing groove 2 disposed on the base 1, and an inner rod polishing mechanism 4 disposed above the polishing groove 2 and movable vertically along the base 1; the polishing groove 2 is provided with a clamping mechanism 3 for mounting the hemispherical resonator to be polished; the inner rod polishing mechanism 4 includes a polishing paddle assembly and a motor 41 for driving the polishing paddle assembly to rotate; the motor 41 is fixed on a vertical adjustment mechanism 5 and can move up and down under the drive of the vertical adjustment mechanism 5; the polishing paddle assembly includes a rotary transmission shaft 42 and a contour polishing blade 43 disposed at the bottom of the rotary transmission shaft 42; the rotary transmission shaft 42 is connected to the output shaft of the motor 41; the inner side of the contour polishing blade 43 is provided with a contour working edge that matches the outer peripheral surface of the inner rod of the hemispherical resonator; the lower end of the contour polishing blade 43 is provided with a contour curved surface 432 that matches the inner wall of the hemispherical resonator, and a passive guide groove 433 is opened on the contour curved surface 432.

[0030] In this embodiment, a contouring transition portion 434 is provided between the contoured curved surface 432 and the contoured working edge 431. The shape of the contouring transition portion 434 matches the transition section between the inner wall of the hemispherical resonator and the root of the inner rod. Therefore, when polishing the inner rod of the hemispherical resonator, it is only necessary to maintain a small gap between the contouring transition portion 434 and the transition section between the inner wall of the hemispherical resonator and the root of the inner rod to polish the root transition section.

[0031] In this embodiment, the polishing tank 2 is equipped with a temperature sensor (which can be fixed to the inner wall of the polishing tank 2) for detecting the temperature of the mechanorheological polishing fluid; the polishing tank 2 has a hollow structure, and a heat exchange tube 7 is installed inside the tank; the inlet 701 and outlet 702 of the heat exchange tube 7 are respectively connected to the thermal management control system 6 to form a circulation loop, and a water pump is installed in the circulation loop. Therefore, the temperature of the mechanorheological polishing fluid can be precisely controlled during the polishing process, keeping it in a shear thickening state to ensure polishing efficiency.

[0032] See Figure 4 The bottom of the rotary drive shaft 42 is elliptical, and two centrally symmetrical contour polishing blades 43 are provided at the bottom of the rotary drive shaft 42. On the one hand, this facilitates the effective entry of the rheological polishing fluid into the contour working part and between the inner rod of the hemispherical harmonic oscillator, thereby causing a significant shear thickening phenomenon and improving polishing efficiency; on the other hand, it can make the inner rod of the hemispherical harmonic oscillator uniformly stressed, thus improving polishing quality.

[0033] See Figure 3In this embodiment, the clamping mechanism 3 includes an ER chuck 31 and a nut 32; the bottom of the polishing groove 2 is provided with a fixed seat 21; the lower end of the ER chuck 31 is inserted into the fixed seat 21 to clamp the outer rod of the hemispherical resonator; the nut 32 is sleeved on the ER chuck 31 and the fixed seat 21 and is threadedly connected to the fixed seat 21. Therefore, when changing workpieces, there is no need to drain or remove the rheological polishing fluid; the workpiece can be loaded and unloaded directly by tightening the nut 32, thus simplifying the operation process, reducing non-processing time, and avoiding waste and frequent handling of the rheological polishing fluid. The ER chuck 31 has a petal-shaped structure; when the nut 32 is tightened, the petal-shaped structure tightens, and the hemispherical resonator is clamped and fixed; when the nut 32 is loosened, the petal-shaped structure opens, and the hemispherical resonator can be removed.

[0034] In this embodiment, the ER chuck 31 is provided with a protective sleeve 33 that is adapted to the outer spherical surface of the hemispherical harmonic oscillator. Therefore, the protective sleeve can absorb and buffer the impact or vibration from some of the contour polishing blades, preventing the rheological polishing fluid and abrasive grains from directly impacting or accumulating in localized areas, thus avoiding uneven wear.

[0035] In this embodiment, the vertical adjustment mechanism 5 is a ball screw slide, and the motor 41 is fixed on the slider of the ball screw slide. This results in small transmission error, high movement accuracy, and ease of disassembly, assembly, maintenance, and upkeep. Furthermore, the output shaft of the motor 41 is a hexagonal output shaft; the rotary transmission shaft 42 is connected to the hexagonal output shaft via an adapter sleeve 44. This simplifies the assembly process by requiring only a standard hexagonal hole to be machined on the adapter sleeve 44 and then inserting the hexagonal shaft into the corresponding hole.

[0036] When polishing the inner rod 81 of the hemispherical resonator 8 using the hemispherical resonator inner rod force rheological polishing equipment in this embodiment, the specific steps include (see...). Figure 9 ).

[0037] Step 1: Install the hemispherical resonator 8 (made of quartz glass) to be polished onto the clamping mechanism 3. Specifically, place the protective sleeve 33 on the ER chuck 31 and loosen the nut 32; then, insert the outer rod 82 of the hemispherical resonator 8 through the through hole on the protective sleeve 33 into the ER chuck 31, and tighten the nut 32 to clamp and fix the hemispherical resonator 8, and then bond and fix the protective sleeve 33 to the outer spherical surface of the hemispherical resonator 8.

[0038] Step 2: Pour the rheological polishing liquid into the polishing tank 2 to immerse the hemispherical harmonic oscillator 8.

[0039] Step 3: The vertical adjustment mechanism 5 drives the polishing mechanism 4 to move downward, controlling the contour polishing blade 43 to extend into the rheological polishing fluid and cooperate with the hemispherical harmonic oscillator 8 (see...). Figure 6 and Figure 7 After the contour polishing blade 43 moves into position, there is a small gap between the contour working edge 431 of the contour polishing blade 43 and the inner rod 81 of the hemispherical resonator, forming a first polishing area 434; and there is a small gap between the contour curved surface 432 and the inner wall of the hemispherical resonator 8, forming a second polishing area 435; there is a small gap between the contour transition portion 434 and the transition section between the root of the inner rod 81 and the inner wall of the hemispherical resonator 8. When implementing the present invention, the above three small gaps are preferably 0.8 to 1.5 mm; in this embodiment, they are all 1 mm.

[0040] Step 4: Start motor 41 to drive the contour polishing blade 43 to rotate at a speed of 150 rpm (in implementing this invention, the speed can be set to 100-300 rpm); at this time, the rheological polishing fluid in the first polishing area 434 undergoes shearing thickening under shearing action, forming a flexible fixed abrasive tool to polish the inner rod 81. The rheological polishing fluid in the second polishing area 435 is squeezed outward by the passive guide groove 433, causing the rheological polishing fluid in the first polishing area 434 to flow downward, replenishing the second polishing area 435. The rheological polishing fluid in the first polishing area 434, the second polishing area 435, and the polishing tank 2 continuously flows, achieving real-time replacement (see...). Figure 8 Meanwhile, the temperature sensor monitors the temperature of the rheological polishing fluid in real time. When the temperature rise is greater than 5°C, the water pump is started to allow the heat exchange fluid to enter the heat exchange tube 7 and exchange heat with the rheological polishing fluid in the polishing tank 2.

[0041] After polishing for 50 minutes, the inner rod of the polished hemispherical resonator and the transition section between the root of the inner rod and the inner wall were measured. The measurement data are shown in the table below.

[0042]

[0043] As can be seen from the table above, the surface roughness and roundness deviation of the inner rod of the hemispherical resonator have decreased significantly after polishing, indicating that the polishing quality is good when the polishing method of the present invention is used to polish the inner rod of the hemispherical resonator.

[0044] The foregoing general description of the invention and its specific embodiments should not be construed as limiting the technical solution of the invention. Those skilled in the art, based on the disclosure of this application, can add, reduce, or combine the disclosed technical features in the foregoing general description and / or embodiments without departing from the constituent elements of the invention, to form other technical solutions within the scope of protection of this application.

Claims

1. A force rheological polishing device for the inner rod of a hemispherical harmonic oscillator, characterized in that: It includes a base (1), a polishing groove (2) provided on the base (1), and an inner rod polishing mechanism (4) provided above the polishing groove (2) and movable vertically along the base (1); The polishing groove (2) is provided with a clamping mechanism (3) for installing the hemispherical harmonic oscillator to be polished; The inner rod polishing mechanism (4) includes a rotatable polishing paddle assembly, which includes a rotary drive shaft (42) and a contour polishing blade (43) located at the bottom of the rotary drive shaft (42). The inner side of the contour polishing blade (43) is provided with a contour working edge (431) that matches the outer circumferential surface of the inner rod of the hemispherical harmonic oscillator. The lower end of the contour polishing blade (43) is provided with a contour curved surface (432) that matches the inner wall of the hemispherical harmonic oscillator, and a passive guide groove (433) is provided on the contour curved surface (432). During operation, the contour polishing blade (43) is controlled to descend to the processing position and rotate to perform processing. During processing, the contour working edge (431) maintains a set small distance from the outer peripheral surface of the inner rod of the hemispherical harmonic oscillator, forming the first polishing area (434). The mechanical rheological polishing fluid in this area undergoes shear thickening after being subjected to shearing action, forming a flexible fixed abrasive tool to polish the inner rod of the hemispherical harmonic oscillator. The contour curved surface (432) maintains a set small distance from the inner wall of the hemispherical harmonic oscillator, forming the second polishing area (435). The mechanical rheological polishing fluid in this area flows outward under the squeezing action of the passive guide groove (433), causing the mechanical rheological polishing fluid in the first polishing area (434) to flow downward and replenish the second polishing area (435). The polishing fluid in the first polishing area (434) is replenished from the side. The mechanical rheological polishing fluid in the first polishing area (434), the second polishing area (435), and the polishing tank (2) flows continuously, realizing real-time replacement.

2. The hemispherical harmonic oscillator internal rod force rheological polishing device according to claim 1, characterized in that: A contour transition section (434) is provided between the contoured curved surface (432) and the contoured working edge (431). The shape of the contour transition section (434) matches the transition section between the inner wall of the hemispherical harmonic oscillator and the root of the inner rod. During processing, the contour transition section (434) maintains a set small distance from the transition section between the inner wall of the hemispherical harmonic oscillator and the root of the inner rod.

3. The hemispherical harmonic oscillator internal rod force rheological polishing device according to claim 1, characterized in that: The polishing tank (2) is equipped with a temperature sensor for detecting the temperature of the rheological polishing fluid; the polishing tank (2) is equipped with a heat exchange tube (7) inside the tank body, and the inlet (701) and outlet (702) of the heat exchange tube (7) are respectively connected to the thermal management control system (6) to form a circulation loop, and a water pump is provided in the circulation loop.

4. The hemispherical harmonic oscillator internal rod force rheological polishing device according to claim 1, characterized in that: The bottom of the rotary drive shaft (42) is provided with two centrally symmetrical contour polishing blades (43).

5. The hemispherical harmonic oscillator internal rod force rheological polishing device according to claim 1, characterized in that: The clamping mechanism (3) includes an ER chuck (31) and a nut (32); the bottom of the polishing groove (2) is provided with a fixed seat (21); the lower end of the ER chuck (31) is inserted into the fixed seat (21) for clamping the hemispherical resonator; the nut (32) is sleeved on the outside of the ER chuck (31) and the fixed seat (21) and is connected to the fixed seat (21) by a thread.

6. The hemispherical harmonic oscillator internal rod force rheological polishing device according to claim 5, characterized in that: The ER clamp (31) is provided with a protective sleeve (33) that is adapted to the outer spherical surface of the hemispherical harmonic oscillator.

7. The hemispherical harmonic oscillator internal rod force rheological polishing device according to claim 4, characterized in that: The polishing paddle assembly is driven by a motor (41) to rotate; the motor (41) is fixed on the vertical adjustment mechanism (5) and can move up and down along the base (1) under the drive of the vertical adjustment mechanism (5); the rotary transmission shaft (42) is connected to the output shaft of the motor (41); the vertical adjustment mechanism (5) is a ball screw slide, and the motor (41) is fixed on the slider of the ball screw slide.

8. The hemispherical harmonic oscillator internal rod force rheological polishing device according to claim 7, characterized in that: The output shaft of the motor (41) is a hexagonal output shaft; the rotary transmission shaft (42) is connected to the hexagonal output shaft through an adapter sleeve (44).

9. A force-rheological polishing method for the inner rod of a hemispherical harmonic oscillator, characterized in that the method is implemented using the force-rheological polishing equipment described in claim 1; comprising the following steps: Step 1: Install the hemispherical resonator to be polished onto the clamping mechanism (3); Step 2: Pour the rheological polishing liquid into the polishing tank (2) to immerse the hemispherical harmonic oscillator; Step 3: Control the contour polishing blade (43) to extend into the rheological polishing fluid and cooperate with the hemispherical harmonic oscillator; after the contour polishing blade (43) moves down into place, there is a small gap between the contour working edge (431) of the contour polishing blade (43) and the inner rod of the hemispherical harmonic oscillator, forming the first polishing area (434), and there is a small gap between the contour curved surface (432) and the inner wall of the hemispherical harmonic oscillator, forming the second polishing area (435). Step 4: Control the rotation of the contour polishing blade (43); at this time, the rheological polishing fluid in the first polishing area (434) undergoes shearing and thickening, forming a flexible fixed abrasive, which polishes the inner rod of the hemispherical harmonic oscillator. Meanwhile, the rheological polishing fluid in the second polishing area (435) is squeezed outward by the passive guide groove (433), causing the rheological polishing fluid in the first polishing area (434) to flow downward and replenish the second polishing area (435). The polishing fluid in the first polishing area (434) is replenished from the side. The rheological polishing fluid in the first polishing area (434), the second polishing area (435) and the polishing tank (2) flow continuously, realizing real-time replacement.

10. The hemispherical harmonic oscillator internal rod force rheological polishing method according to claim 9, characterized in that: The polishing tank (2) is equipped with a temperature sensor for detecting the temperature of the rheological polishing fluid, and the polishing tank (2) is equipped with a heat exchange tube (7) inside the tank body; the inlet (701) and outlet (702) of the heat exchange tube (7) are respectively connected to the thermal management control system (6) to form a circulation loop, and a water pump is provided in the circulation loop; in step 4, the temperature sensor monitors the temperature of the rheological polishing fluid in real time, and when the temperature rise is greater than the set threshold, the water pump is started to allow the heat exchange fluid to enter the heat exchange tube (7) and exchange heat with the rheological polishing fluid in the polishing tank (2).

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