Surface processing system of porous disk body and surface processing method

Abstract

The present disclosure relates to the technical field of component processing of semiconductor process equipment, and provides a surface processing system and method for a multi-hole disc body. The system comprises a loading mechanism having a loading position for arranging the multi-hole disc body; a surface processing device arranged above the loading position and used for performing surface processing on the multi-hole disc body; and a liquid outlet mechanism arranged below the loading position and comprising a liquid outlet portion arranged corresponding to the multi-hole disc body in a direction upward, used for performing liquid outlet to form a continuous fountain penetrating through each of the through holes from bottom to top to clean the hole wall of each of the through holes during the performance of the surface processing; and a liquid pump connected with a liquid source and the liquid outlet portion, used for driving the liquid outlet. Thus, the continuous fountain formed in each of the through holes during the surface processing of the multi-hole disc body can prevent the processing debris from adhering to the hole wall, and the time-consuming process of manually cleaning the hole wall after processing can be omitted, and the processing efficiency is greatly improved.

Description

Technical Field

[0001] This disclosure relates to the field of component processing technology for semiconductor process equipment, and more particularly to a surface processing system and method for porous disks. Background Technology

[0002] The gas distribution disk (Showerhead) is a key component of equipment for thin film deposition and plasma processes such as semiconductor etching, PECVD, and ALD. Its core function is to achieve uniform distribution and stable gas distribution of process gases through an array of micron-sized vias on the disk surface, ensuring the consistency of the gas flow field and temperature field during wafer processing. This directly determines the uniformity, stability, and product yield of semiconductor chip manufacturing processes, making it an indispensable core component in precision semiconductor manufacturing.

[0003] To meet the requirements of high-precision gas distribution, the gas distribution plate undergoes multiple surface processing steps, including grinding and polishing, to ensure the flatness of the plate surface. In traditional processing, the surface processing of the gas distribution plate is affected by factors such as tool cutting, abrasive grinding, and mechanical vibration, which continuously generate a large amount of tiny metal shavings, grinding dust, and particulate impurities.

[0004] Because the gas distribution plate has numerous uniformly distributed through holes, processing debris easily falls off and adheres to the inner walls of these holes, requiring cleaning. Existing cleaning methods mostly employ manual cleaning, but due to the large number of through holes, this is time-consuming and has extremely low cleaning efficiency.

[0005] Therefore, there is an urgent need to design a solution that can effectively address the problem of debris residue in the through-holes of the gas distribution plate. Summary of the Invention

[0006] In view of the shortcomings of the prior art described above, the purpose of this disclosure is to provide a surface processing system and method for porous disks to solve the problems in the related art.

[0007] The first aspect of this disclosure provides a surface processing system for a porous disk, the porous disk having a plurality of through holes radially distributed and extending axially. The surface processing system includes: a loading mechanism having a loading position for arranging the porous disk; a surface processing device disposed above the loading position for performing surface processing on the porous disk; and a liquid dispensing mechanism disposed below the loading position, including: a liquid dispensing section disposed with the liquid dispensing direction facing upwards corresponding to the porous disk, for dispensing liquid during the surface processing to form a continuous fountain penetrating from bottom to top through each of the through holes to clean the hole walls of each of the through holes; and a liquid pump connected to a liquid source and the liquid dispensing section for driving the liquid dispensing.

[0008] In an embodiment of the first aspect, the liquid outlet includes a plurality of liquid outlet holes that correspond one-to-one with the positions of the through holes on the porous disc.

[0009] In the first aspect of the embodiment, the diameter of the liquid outlet hole is larger than that of the through hole, and the inner wall surface of the liquid outlet hole is provided with a vortex guiding structure for forming a swirling liquid outlet along the depth direction. The vortex guiding structure includes a spiral structure or a variable diameter structure.

[0010] In an embodiment of the first aspect, a liquid outlet cavity is formed between the porous disc and the liquid outlet section, and the liquid outlet section is provided with a plurality of liquid outlet holes; the projection of each liquid outlet hole in a plane containing each of the through holes is located at the center of a set of through holes.

[0011] In the first aspect of the embodiment, the diameter of the liquid outlet hole is larger than that of the through hole, and the inner wall surface of the liquid outlet hole is provided with a vortex guiding structure for forming a swirling liquid outlet along the depth direction. The vortex guiding structure includes a spiral structure or a variable diameter structure.

[0012] In an embodiment of the first aspect, the fountain maintains a preset height at the liquid outlet height through the through hole.

[0013] In an embodiment of the first aspect, the pressure of the liquid pump driving the liquid outlet is adjusted so that the liquid outlet height of the fountain in the through hole can be observed / measured and maintained at a preset height.

[0014] In an embodiment of the first aspect, the liquid dispensing mechanism may also be connected to a gas source for driving the liquid mixed with gas to dispensing to form a fountain; and / or, the gas-liquid ratio between the liquid and the gas mixed with it is 1 / 10 to 1 / 9; and / or, the liquid is implemented as a processing fluid suitable for the surface processing.

[0015] In an embodiment of the first aspect, the surface processing system includes: a controller communicatively connected to the surface processing apparatus and a liquid pump, which, in response to activation of the surface processing apparatus, controls the liquid pump to dispense liquid at the liquid dispensing mechanism to form the fountain.

[0016] In an embodiment of the first aspect, the porous disk is a gas distribution disk in a semiconductor process apparatus.

[0017] A second aspect of this disclosure provides a surface finishing method for a porous disk, applied to a surface finishing apparatus as described in at least one of the first aspects; the method includes: in response to the execution of surface finishing on the upper surface of the porous disk, forming a continuous fountain extending from bottom to top through each of the through holes to clean the hole walls of each of the through holes.

[0018] As described above, this disclosure relates to the field of component processing technology for semiconductor process equipment, and provides a surface processing system and method for porous disks. The system includes: a loading mechanism having a loading position for arranging the porous disk; a surface processing device disposed above the loading position for performing surface processing on the porous disk; and a liquid dispensing mechanism disposed below the loading position, including: a liquid dispensing section disposed with the liquid dispensing direction facing upwards corresponding to the porous disk, for dispensing liquid during the surface processing to form a continuous fountain penetrating from bottom to top through each of the through holes to clean the hole walls of each of the through holes; and a liquid pump connected to a liquid source and the liquid dispensing section for driving the liquid dispensing. Therefore, by forming a continuous fountain in each through hole during the surface processing of the porous disk, processing debris cannot adhere to the hole walls, eliminating the time-consuming manual cleaning of the hole walls after processing and significantly improving processing efficiency. Attached Figure Description

[0019] Figure 1 A schematic diagram of the structure of a porous disk in one embodiment of the present disclosure is shown.

[0020] Figure 2 A schematic diagram of the surface processing system for a porous disk in one embodiment of the present disclosure is shown.

[0021] Figure 3A A schematic diagram of the limiting mechanism of the porous disk body in one embodiment of the present disclosure is shown.

[0022] Figure 3B A schematic diagram of the clamping mechanism of the porous disk in one embodiment of the present disclosure is shown.

[0023] Figure 4 A schematic diagram showing the structure of the liquid outlet and the porous disc body in one embodiment of the present disclosure is provided.

[0024] Figure 5 A partial structural diagram showing the cooperation between the liquid outlet and the porous disc body in another embodiment of this disclosure is shown.

[0025] Figure 6 A schematic diagram showing the structure of the liquid outlet and the porous disc body in another embodiment of the present disclosure is provided.

[0026] Figure 7 This diagram illustrates the positional relationship between the porous disc and the liquid outlet in the same horizontal plane according to one embodiment of the present disclosure.

[0027] Figure 8 A schematic diagram of the control system in a surface processing system according to an embodiment of the present disclosure is shown.

[0028] Figure 9 A schematic flowchart illustrating a surface processing method for a porous disk in one embodiment of this disclosure is shown.

[0029] Figure 10 A schematic diagram of the structure of a computer device according to an embodiment of the present disclosure is shown. Detailed Implementation

[0030] The following specific examples illustrate the implementation of this disclosure. Those skilled in the art can easily understand other advantages and effects of this disclosure from the information disclosed herein. This disclosure can also be implemented or applied through other different specific embodiments, and various details in this disclosure can be modified or changed according to different viewpoints and application modules without departing from the spirit of this disclosure. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this disclosure can be combined with each other.

[0031] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings, so that those skilled in the art to which this disclosure pertains can readily implement it. This disclosure may be embodied in many different forms and is not limited to the embodiments described herein.

[0032] In this disclosure, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic represented in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. Furthermore, the specific features, structures, materials, or characteristics represented may be combined in any suitable manner in any one or a group of embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples represented in this disclosure, as well as the features of those different embodiments or examples.

[0033] Furthermore, the terms "first" and "second" are used for illustrative purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the representation of this disclosure, "a set" means two or more, unless otherwise explicitly specified.

[0034] For the purpose of clarity, devices unrelated to the description are omitted, and the same or similar components throughout the specification are given the same reference numerals.

[0035] Throughout this specification, when it is said that a device is "connected" to another device, this includes not only "direct connection" but also "indirect connection" by placing other components in between. Furthermore, when it is said that a device "comprises" a certain constituent element, unless otherwise stated otherwise, this does not exclude other constituent elements, but rather implies that other constituent elements may be included.

[0036] While the terms first, second, etc., are used in some examples herein to refer to various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, first interface and second interface, etc., are used. Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to also include the plural forms unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” indicate the presence of the stated feature, step, operation, element, module, item, kind, and / or group, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, modules, items, kinds, and / or groups. The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Thus, “A, B, or C” or “A, B, and / or C” means “any one of: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition will only occur if the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0037] The technical terms used herein are for reference only to specific embodiments and are not intended to limit the scope of this disclosure. The singular form used herein includes the plural form unless the statement explicitly indicates otherwise. The word "comprising" as used in this specification means to specify a particular characteristic, region, integer, step, operation, element, and / or component, and does not exclude the presence or addition of other characteristics, regions, integers, steps, operations, elements, and / or components.

[0038] Although not explicitly defined, all terms, including technical and scientific terms used herein, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms defined in commonly used dictionaries shall be further interpreted as having a meaning consistent with the relevant technical literature and the message of the present disclosure, and shall not be over-interpreted as having an ideal or overly formulaic meaning unless otherwise defined.

[0039] The gas distribution panel (Showerhead) is a key component of semiconductor process equipment. Its main function is to achieve uniform distribution and stable gas distribution of process gases through an array of micron-sized through-holes on the panel, ensuring the consistency of the airflow and temperature fields during wafer processing, which directly determines the uniformity, stability and product yield of semiconductor chip manufacturing process.

[0040] To meet the requirements of high-precision gas distribution, the gas distribution plate undergoes multiple surface processing steps, including grinding and polishing, to ensure the flatness of the plate surface. In traditional processing, the surface processing of the gas distribution plate is affected by factors such as tool cutting, abrasive grinding, and mechanical vibration, which continuously generate a large amount of tiny metal shavings, grinding dust, and particulate impurities.

[0041] Because the gas distribution plate has numerous uniformly distributed through holes, processing debris easily falls off and adheres to the inner walls of these holes, requiring cleaning. Existing cleaning methods mostly employ manual cleaning, but due to the large number of through holes, this is time-consuming and has extremely low cleaning efficiency.

[0042] In view of this, the present disclosure provides a surface processing system for a porous disk. By forming and maintaining a "fountain" of liquid flow in each through hole of the disk during the processing of the porous disk, the debris generated during the processing will be impacted by the fountain and will not adhere to the inner wall of the hole. This makes the debris in the through holes of the processed porous disk extremely small or disappear. This can effectively reduce or even eliminate the manual cleaning of through holes in related technologies and greatly improve processing efficiency.

[0043] like Figure 1 The diagram shown illustrates the structure of a porous disk in one embodiment of this disclosure.

[0044] exist Figure 1 In this context, the porous disk 100 can be a gas distribution disk on a semiconductor process equipment. The gas distribution disk can be used to homogenize and output process gases during semiconductor process execution. The gas distribution disk includes a disk body 110 and a plurality of through holes 120 uniformly distributed on the disk body 110. For example, the disk body can be circular. The through holes 120 are disposed through the disk body along its thickness direction.

[0045] It is worth mentioning that, in other embodiments, the porous disc 100 can also be other types, such as a porous vacuum chuck or chuck, an electrostatic chuck, an adsorption disc, a carrier disc, a filter disc, etc., and is not limited to a gas distribution disc.

[0046] like Figure 2 The diagram shown illustrates the structure of the surface processing system 200 for a porous disk 100 according to an embodiment of the present disclosure.

[0047] The surface processing system 200 includes a loading mechanism 210, a surface processing device 220, a liquid dispensing mechanism 230, and a liquid pump 240.

[0048] The loading mechanism 210 has a loading position for arranging the porous disc 100. The loading position is suspended (i.e., with space below) and has a cutout portion 212 that exposes the lower surface of the porous disc 100 downwards. In this embodiment, the loading mechanism 210 may include a horizontally arranged support member 211, the top surface of which may form a loading position for supporting the porous disc 100.

[0049] The support member 211 also forms a hollow portion 212 at the loading position, exposing the through hole 120 on the porous disk 100 downwards. The annular edge of the hollow portion 212 serves as a support portion 2121 to support the porous disk 100 upwards, so that the porous disk 100 can be suspended. In some embodiments, if the porous disk 100 does not have an edge area where the through hole 120 is provided (e.g. Figure 1 If the radial width (as shown in region A) is sufficient, the annular edge can have the same or relatively shorter radial width, such that its supporting position on region A is within the edge region of the porous disk 100, without exceeding region A and covering the through-holes 120. This allows all through-holes 120 to be exposed below. Alternatively, if the radial width of the edge region of the porous disk 100 without through-holes 120 is insufficient, the supporting portion 2121 can also cover some of the through-holes 120. Optionally, the supporting portion 2121 can be a continuous annular edge. Alternatively, the annular edge can also be composed of multiple annularly extended edge segments spaced apart, so that when the width of the annular edge covers the through-holes 120, the gaps between the edge segments can also expose some through-holes 120, thus reducing the number of covered through-holes 120.

[0050] In some embodiments, the carrier 211 may be provided with a limiting mechanism at the periphery of the horizontal position where the loading position is located, which can restrict the horizontal movement of the porous disk 100. As an example, in Figure 3A In this context, there are multiple stops 261a positioned horizontally in two, three, or more directions to prevent the horizontal movement of the porous disc 100. As another example, in... Figure 2 and Figure 3B In order to minimize movement of the porous disc 100 during processing, a clamping mechanism can be provided around the loading position. The clamping mechanism may include one or more pairs of slidable and positionable clamping members 261b arranged in pairs on opposite sides in the horizontal direction. Each pair of clamping members 261b can slide closer to / away from the loading position and can slide closer to the porous disc 100 to clamp and position the porous disc 100 from the opposite side. The clamping members 261b and the carrier member 211 are slidably engaged. The clamping members 261b and the carrier member 211 can be respectively connected to / equipped with a first sliding portion and a second sliding portion that are slidably engaged. For example, one of the first sliding portion and the second sliding portion can be implemented as a slide rail or a slide groove, and the other can be implemented as a slider, or it can also be a screw and a fixing on a lead screw mechanism. Further optionally, the shapes of the stop 261a and the clamping member 261b can be adapted to the shape of the porous disc 100 so as to fit against the side of the porous disc 100. For example, if the porous disc 100 is a disc, then the stop 261a and the clamping member 261b can be adapted arc-shaped curved surfaces.

[0051] In some embodiments, the clamping member 261b can be slidable by a driving device (such as a cylinder or motor), for example, by pushing the clamping member to move, or by rotating the screw in the lead screw so that the sliding body screwed into the screw can drive the clamping member 261b to move, and the positioning can be achieved by the locking capability of the cylinder or motor itself or by cooperating with mechanical locking (for example, the lead screw can be locked by relying on the self-locking principle of the thread).

[0052] In some embodiments, to prevent the porous disc 100 from rotating horizontally, the stop 261a and the clamping member 261b may be provided with friction-enhancing pads, such as rubber pads, that contact the inner sidewall of the porous disc 100. These pads are pressed against the porous disc 100 by interference fit or clamping, which not only increases friction but also provides a certain buffering and protection effect.

[0053] In some embodiments, the loading mechanism 210 includes a support assembly 213 that supports the suspended carrier 211, the support assembly 213 being integrally or fixedly connected to the carrier 211. The fixed connection may include, but is not limited to, snap-fit ​​and / or screw-locking. As an example, the support assembly 213 may include a group of columns arranged in the same plane, supporting the carrier 211 upwards at different positions. As another example, the carrier 211 may be fixedly connected to an upright frame or base, the frame / base forming a space below the loading position.

[0054] In other embodiments, the support member 211 may also be shaped to accommodate the limiting groove of the porous disc 100. The inner wall of the limiting groove is provided with a friction-enhancing pad for interference fit against the porous disc 100 to restrict its horizontal rotation and translation, allowing the porous disc 100 to be positioned within the limiting groove. The bottom of the limiting groove has a hollow portion 212 to expose the lower surface of the porous disc 100. The annular edge adjacent to the hollow portion 212 can serve as a support portion 2121 to support the porous disc 100 upwards. The depth of the limiting groove may be less than the thickness of the porous disc 100 to facilitate removal of the porous disc 100.

[0055] The surface processing device 220 is disposed above the loading position and is used to perform surface processing on the porous disc 100. As an example, the surface processing device 220 may be implemented as a grinding or polishing device that performs surface processing such as grinding or polishing on the upper surface of the porous disc 100. In some embodiments, the surface processing device 220 may be an electromechanical device or a handheld tool.

[0056] The liquid dispensing mechanism 230 is located below the loading position. The liquid dispensing mechanism 230 includes a liquid dispensing section 231. The liquid dispensing section 231 is disposed with the liquid dispensing direction facing upwards, corresponding to the porous disc 100, and is used to dispense liquid during the surface processing to form a continuous fountain that extends upwards through each of the through holes 120, thereby cleaning the hole walls of each of the through holes 120. In some embodiments, the liquid dispensing section 231 may be a spray disc having multiple liquid dispensing holes 2311 that cooperates with the porous disc 100.

[0057] The liquid pump 240 connects the liquid source 300 and the liquid outlet 231 to drive liquid dispensing. Specifically, the liquid pump 240 is connected to the liquid source 300 and the liquid outlet 231 via a pipeline. Optionally, the pipeline may also be equipped with a liquid valve 300 for switching the liquid source on and off at the liquid outlet 231 or for regulating the liquid flow rate. Further, the liquid valve may be a controllable solenoid valve. In some embodiments, the liquid outlet 231 may have a liquid supply chamber 2312 communicating with each liquid outlet 2311, and the liquid supply chamber 2312 has a pipeline interface for connecting the pipeline to the liquid source 300.

[0058] When the liquid pump 240 operates, it draws liquid from the liquid source 300 and delivers it to the liquid outlet 231. The pump pressure of the liquid pump 240 and the orifice diameter of the liquid outlet 2311 on the liquid outlet 231 are matched to allow the liquid to flow upwards through the through holes 120, thus creating a fountain effect. Figure 2 As indicated by the middle arrow. Optionally, the liquid pump 240 is an electrically adjustable pressure type. The pump pressure of the liquid pump 240 can be controlled by sending a control signal to the liquid pump 240 via an external controller 250. The pump pressure can be selected through trial experiments and set by observation or measurement to maintain the fountain (i.e., the liquid outlet is higher than the upper surface of the porous disc 100). Optionally, through experiments combined with observation or measurement, the target pump pressure can be further determined to maintain the liquid outlet height of the fountain at a preset height. It is worth mentioning that the preset height should not be too low, as this risks failing to cover all the holes of the through-hole 120; nor should the preset height be too high, as this risks interfering with surface processing. Therefore, the preset height can optionally be set to a range from a few millimeters to a few centimeters, such as 5mm~1cm, 1cm~1.5cm, or 1.5cm~2cm, etc.

[0059] In some embodiments, the liquid outlet 231 and the porous disc 100 can have various structural combinations, so that the liquid outlet 2311 and the through hole 120 are in various positional combinations, which can meet the cleaning needs of the through hole 120 under different requirements.

[0060] like Figure 4The diagram shown illustrates the structure of the liquid outlet 231 and the porous disc 100 in one embodiment of this disclosure.

[0061] In this embodiment, the liquid outlet section 231 includes a plurality of liquid outlet holes 2311 corresponding one-to-one with the positions of the through holes 120 on the porous disk 100. The liquid outlet section 231 can be fitted to or maintain a short gap with the porous disk 100, and each liquid outlet hole 2311 on the liquid outlet section 231 can be connected to the through holes 120 on the porous disk 100 at corresponding vertical positions, so that the liquid transported in the liquid outlet section 231 can directly enter the corresponding liquid outlet hole 2311 to form an ejection.

[0062] In some alternative examples, the liquid outlet section 231 can be manufactured according to the same hole distribution specifications as the porous disc 100, or the solid part of the liquid outlet section 231 (such as a plate or disc) can be designed according to requirements, with only the individual liquid outlet holes 2311 designed according to the distribution structure of the through holes 120 on the porous disc 100. This allows the position and structure of each liquid outlet hole 2311 on the manufactured liquid outlet section 231 to be the same as the corresponding through hole 120 on the porous disc 100, thereby reducing the design cost of the liquid outlet section 231. Of course, in addition to the distribution of the liquid outlet holes 2311, the thickness (which also corresponds to the depth of the liquid outlet holes 2311), area, shape, etc. of the liquid outlet section 231 can be adjusted according to actual needs and are not limited to the above.

[0063] To improve the efficiency of adjusting the liquid outlet 231 and the porous disc 100 to their corresponding positions, several methods can be provided to facilitate vertical alignment. As an example, if the hole distribution structure is the same, alignment can be achieved simply by observing the alignment of two or more liquid outlet holes 2311 and through holes 120. As another example, paired markers for vertical alignment can also be provided on both the liquid outlet 231 and the porous disc 100.

[0064] like Figure 5 The diagram shows a partial structural schematic of the liquid outlet 231 and the porous disc 100 in another embodiment of the present disclosure.

[0065] exist Figure 5 The diagram illustrates the detailed structure of the liquid outlet section 231 and the porous disc body 100 by taking the cooperation of a pair of liquid outlet holes 2311 and through holes 120 as an example.

[0066] In this embodiment, when the diameter of the liquid outlet 2311 is sufficient (depending on the diameter of the through hole) to be suitable for processing the vortex guiding structure 23111, the vortex guiding structure 23111 is provided on the inner wall surface of the liquid outlet 2311 along the depth direction of the hole, so as to guide the liquid in the liquid outlet 2311 to rise along the vortex guiding structure 23111 and form a vortex (as shown by the arrow in the figure), and spray out from the liquid outlet 2311 and enter the through hole 120. The vortex will remain in the through hole 120 for a period of time under the action of kinetic energy, which is more conducive to the cleaning effect on the hole wall.

[0067] In some embodiments, the vortex guiding structure 23111 may include a helical structure, such as a continuous thread / groove. Specifically, the vortex guiding structure 23111 includes a helical groove, which allows the liquid to rotate and propel along the helical surface, forming a stable vortex. Alternatively, the helical structure may also include a structure with intermittent helical ribs.

[0068] In other embodiments, the vortex guiding structure 23111 may include a variable diameter structure. Specifically, the variable diameter structure may include a narrowing section, etc. For example, the diameter of the liquid outlet 2311 gradually narrows and then widens along the depth direction, generating a Venturi effect, which causes a sudden increase in liquid velocity at the narrowing throat and boundary layer separation, forming a central vortex and annular vortex.

[0069] The above is merely an example of the implementation of the eddy current guiding structure 23111. In actual scenarios, it can be changed according to the requirements and is not limited to the above example.

[0070] like Figure 6 The diagram shown illustrates the structure of the liquid outlet 231 and the porous disc 100 in another embodiment of the present disclosure.

[0071] In this embodiment, a liquid outlet cavity 214 can be formed between the porous disc 100 and the liquid outlet section 231, and the plurality of liquid outlet holes 2311 of the liquid outlet section 231 communicate with the liquid outlet cavity 214. Exemplarily, the liquid outlet cavity 214 can be formed by a sealed enclosure between the porous disc 100, the loading mechanism 210, and the liquid outlet section 231. As an example, in... Figure 6In this design, the loading mechanism 210 and the liquid outlet 231 are integrated into a cylindrical body (or a disc) with an internal space. The upper end of the cylindrical body serves as the loading position for the loading mechanism 210, forming a loading area with a perforated portion 212 at the bottom. The internal space is formed below the perforated portion 212. A liquid outlet 231 is spaced below the perforated portion 212 within the internal space. The liquid outlet 231 and the side wall of the cylindrical body can be integrally connected or sealed and fixedly connected. The internal space is divided into a liquid outlet chamber 214 located between the perforated portion 212 and the porous disc 100, and a liquid supply chamber 2312 located between the bottom of the porous disc 100 and the bottom wall of the cylindrical body. The liquid supply chamber 2312 and the liquid outlet 231 can constitute the liquid outlet mechanism 230. The cylindrical body wall can be provided with an inlet 23121 communicating with the liquid supply chamber 2312. The inlet 23121 can be connected to a liquid pump 240 to obtain liquid filling. The liquid in the supply chamber 2312 can be driven by the liquid pump 240 to pass upward through the outlet hole 2311 into the outlet chamber 214, and then driven from the outlet chamber 214 through the through hole 120 on the porous disc 100 to form a fountain.

[0072] In some embodiments, to make the fountain heights at each through-hole 120 similar, the liquid pressure at each through-hole 120 needs to be similar. For this purpose, the liquid outlet holes 2311 on the liquid outlet section 231 can be arranged to have a uniform relative positional relationship with each of the through-holes 120. For example, as shown in previous embodiments, each liquid outlet hole 2311 can correspond to one through-hole 120. Of course, the number of liquid outlet holes 2311 does not necessarily have to be the same as the number of through-holes 120; in other embodiments, each liquid outlet hole 2311 can be arranged in a one-to-many manner with multiple through-holes 120.

[0073] like Figure 7 The diagram illustrates the positional relationship between the porous disc 100 and the liquid outlet 231 projected onto the same horizontal plane in one embodiment of this disclosure. In this embodiment, the diameter of the liquid outlet hole 2311 is larger than the diameter of the through hole 120. The projected position of each liquid outlet hole 2311 can be located at the center of a group of circumferentially arranged through holes 120. A group of through holes 120 may include 3, 4, 5, 6, or other numbers, for example... Figure 8 In the diagram, a liquid outlet 2311 is provided at the middle position of a set of through holes 120 in each area of ​​the square distribution shown in the figure. Some of the liquid outlets 2311 are illustrated by dashed lines in the figure. Figure 7 The diagram schematically shows the location of some of the liquid outlet holes 2311. In reality, the distribution of the liquid outlet holes 2311 can be designed according to the distribution of the through holes 120 on the porous disc 100, and is not limited to the diagram.

[0074] exist Figure 6 and Figure 7In one embodiment, optionally, a vortex guiding structure 23111 can still be formed on the inner wall of the liquid outlet 2311, so that the liquid outlet 2311 can form a vortex that enters the liquid supply chamber 2312, thereby driving the corresponding number of vortices to be generated in the liquid supply chamber 2312. In this embodiment, since the diameter of the liquid outlet 2311 is larger than the diameter of the through hole 120, compared with the previous Figure 5 In this embodiment, the liquid outlet 2311 makes it easier to process the vortex guiding structure 23111.

[0075] Under the influence of this vortex, the liquid will enter the through-hole 120 in a certain circumferential motion, and at least a portion of the through-hole 120 will maintain swirling flow in the depth direction, although compared to Figure 5 In this embodiment, the one-to-one correspondence between the liquid outlet 2311 and the through hole 120 for flow supply means that the flow supplied by one liquid outlet 2311 to a group of through holes 120 will result in some loss of swirling energy within the through holes 120. However, compared to direct current cleaning, the swirling flow can still improve the cleaning effect on the hole walls. Furthermore, by compressing the volume of the liquid supply chamber 2312 (e.g., reducing the distance between the liquid outlet 231 and the loading position), the stroke of the swirling flow can be reduced, thereby reducing the energy loss of the swirling flow generated within the through holes 120 and enhancing the cleaning effect.

[0076] In some embodiments, the liquid is implemented as a processing fluid suitable for the surface processing. For surface processing such as grinding and polishing, cutting fluid is already required for cooling and lubrication. Therefore, the liquid forming the fountain can be implemented as a cutting fluid. Whether or not cutting fluid is sprayed on the porous disc 100, the fountain can assist the grinding and polishing process after spraying out of the through hole 120, providing cooling and lubrication effects.

[0077] In some alternative embodiments, the liquid dispensing mechanism 230 may also be connected to a gas source via a pipeline, in which a gas pump and a gas valve may be installed to deliver gas to the liquid dispensing mechanism 230 to form a liquid mixed with gas to create the fountain. By mixing gas into the liquid, the amount of liquid used can be reduced.

[0078] In some embodiments, only a small amount of gas may be mixed in, resulting in a low gas-liquid ratio. As an example, the gas-liquid ratio between the liquid and the mixed gas can be controlled to be between 1 / 10 and 1 / 9.

[0079] like Figure 8 The diagram shown illustrates the structure of the control system in a surface processing system 200 according to an embodiment of this disclosure.

[0080] Preferably, in this embodiment, the control system can be implemented to automatically control the formation of the fountain in conjunction with the execution of surface processing.

[0081] Specifically, in the control system, the controller 250 is communicatively connected to the surface processing device 220 and the liquid pump 240, and is used to control the liquid pump 240 to start and open the liquid valve 260 in response to the start of the surface processing device 220, so that the liquid source 300 supplies liquid to the liquid outlet mechanism 230 to form the fountain.

[0082] In some embodiments, the controller 250 can determine the activation of the surface processing device 220 by detecting an activation signal. The surface processing device 220 may have operating components for user operation to initiate operation, such as physical or virtual buttons. The activation signal may be an electrical signal generated based on user operation of the operating components, such as a voltage / current signal, an encoded signal, etc.

[0083] Optionally, with a gas source 400 and a gas pump 410 provided, the controller 250 can start the gas pump 410 and open the gas valve 420 according to demand / strategy to mix gas into the liquid for discharge. It should be noted that the thick lines between the pump, valve, and source in the figure represent pipeline connections.

[0084] In some embodiments, pressure gauges may be installed in the liquid and gas pipelines to detect the liquid pressure and gas pressure respectively. When the detected liquid pressure and gas pressure are the same, liquid valve 260 and gas valve 420 are activated simultaneously for liquid and gas discharge. Alternatively, liquid valve 260 and gas valve 420 may be activated sequentially / alternately to discharge liquid and gas at different times, which can also form a gas-liquid mixture.

[0085] Specifically, in one scenario, the user activates the surface processing device 220 to process the porous disc 100. Upon detecting the activation signal of the surface processing device 220, the controller 250 starts the liquid pump 240. Assuming the parameters (such as pump pressure) of the liquid pump 240 have been pre-set based on the measured fountain height, the liquid pump 240 will drive the liquid from the liquid source 300 to be delivered to the liquid outlet mechanism 230 and pass through the through-hole 120 of the porous disc 100 to form a fountain.

[0086] In other embodiments, the pump device can also be operated independently. Specifically, the user can operate the pump device to start dispensing liquid to form a fountain in the through hole 120 when the surface processing device 220 is started.

[0087] In some embodiments, this disclosure may also provide a surface finishing method that can be applied to the controller 250 in response to the execution of surface finishing on the upper surface of the porous disc 100 to form a continuous fountain extending from bottom to top through each of the through holes 120 to clean the hole walls of each of the through holes 120.

[0088] As an example, the surface processing method can be applied to the controller 250 so that the controller 250 automatically controls the liquid pump 240 to discharge liquid from the liquid outlet mechanism 230 to form the fountain based on the activation of the surface processing device.

[0089] Of course, in other embodiments, if a fully automated design is not required, the controller 250 may be omitted, and the corresponding devices, such as at least one of the valves and pumps, may be controlled manually instead.

[0090] like Figure 9 The diagram shown illustrates a flow chart of a surface processing method for a porous disk 100 according to an embodiment of the present disclosure.

[0091] exist Figure 9 The surface processing method of the porous disk 100 includes:

[0092] Step S901: Detect the start signal of the surface processing apparatus 220;

[0093] Step S902: In response to the detection of the start signal, the liquid pump 240 is started to cause the liquid outlet mechanism 230 to discharge liquid, forming a fountain in each of the through holes 120 of the porous disc 100.

[0094] It should be specifically noted that the flowchart representations of the embodiments described above in this disclosure can be understood as representing a module, segment, or portion of code comprising one or more executable instructions configured to implement a specific logical function or process. Furthermore, the scope of the preferred embodiments of this disclosure includes other implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the functions involved.

[0095] For example, Figure 9 The order of the steps in the method embodiments may vary in specific scenarios and is not limited to the above representation.

[0096] like Figure 10 The diagram shown illustrates the structure of a computer device according to an embodiment of the present disclosure.

[0097] The controller 250 can be implemented based on the computer device 1000. The computer device 1000 can be implemented as a desktop computer, a laptop computer, an embedded device, or other electronic terminal.

[0098] The computer device 1000 includes a bus 1001, a processor 1002, and a memory 1003. The processor 1002 and the memory 1003 can communicate via the bus 1001. The memory 1003 can store computer programs or instructions. The processor 1002 implements the method flow or function described in the previous embodiments by running the computer program or instructions stored in the memory 1003, for example... Figure 10 The methods and steps in the text.

[0099] Bus 1001 can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of representation, although only one thick line is used in the diagram, this does not indicate that there is only one bus or one type of bus.

[0100] In some embodiments, the processor 1002 may be implemented as a central processing unit (CPU), a microprocessor unit (MCU), a system-on-chip (System-on-Chip), or a field-programmable array (FPGA). The memory 1003 may include volatile memory for temporary data storage during program execution, such as random access memory (RAM).

[0101] The memory 1003 may also include non-volatile memory for data storage, such as read-only memory (ROM), flash memory, hard disk drive (HDD), or solid-state disk (SSD).

[0102] In some embodiments, the computer device 1000 may further include a communicator 1004. The communicator 1004 is used for communication with external devices. In specific examples, the communicator 1004 may include one or more wired and / or wireless communication circuit modules. For example, the communicator 1004 may include one or more of, such as a wired network card, a USB module, a serial interface module, etc. The wireless communication protocols followed by the wireless communication module include, for example, Nearfield communication (NFC) technology, Infrared (IR) technology, Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Time-Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), Bluetooth (BT), Global Navigation Satellite System (GNSS), etc.

[0103] This disclosure also provides a computer-readable storage medium storing a computer program or instructions, which, when run, implement the method flow or function of any of the previous embodiments.

[0104] That is, the method steps in the above embodiments are implemented as software or computer code that can be stored in a recording medium (such as CD ROM, RAM, floppy disk, hard disk or magneto-optical disk), or implemented as computer code that is originally stored in a remote recording medium or a non-transitory machine-readable medium and will be stored in a local recording medium after being downloaded via a network, so that the method represented herein can be stored in such software processing on a recording medium using a general-purpose computer, a special processor or programmable or special hardware (such as ASIC or FPGA).

[0105] This disclosure may also provide a computer program product, comprising one or more computer programs or instructions, which, when run, perform all or part of the processes or functions described in this disclosure. The computer program product includes one or more computer programs or instructions.

[0106] Computer programs or instructions can be stored in a readable storage medium or transferred from one readable storage medium to another. For example, the computer program or instructions can be transferred from one website, computer, server, or data center to another website, computer, server, or data center via wired or wireless means. The readable storage medium can be any available medium capable of access, or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium, such as a floppy disk, hard disk, or magnetic tape; an optical medium, such as a digital video optical disc; or a semiconductor medium, such as a solid-state drive. The computer-readable storage medium can be a volatile or non-volatile storage medium, or it can include both volatile and non-volatile types of storage media.

[0107] In summary, this disclosure relates to the field of component processing technology for semiconductor process equipment, and provides a surface processing system and method for porous disks. The system includes: a loading mechanism having a loading position for arranging the porous disk; a surface processing device disposed above the loading position for performing surface processing on the porous disk; and a liquid dispensing mechanism disposed below the loading position, including: a liquid dispensing section disposed with the liquid dispensing direction facing upwards corresponding to the porous disk, for dispensing liquid during the surface processing to form a continuous fountain penetrating from bottom to top through each of the through holes to clean the hole walls of each of the through holes; and a liquid pump connected to a liquid source and the liquid dispensing section for driving the liquid dispensing. Therefore, by forming a continuous fountain in each through hole during the surface processing of the porous disk, processing debris cannot adhere to the hole walls, eliminating the time-consuming manual cleaning of the hole walls after processing and significantly improving processing efficiency.

[0108] The above embodiments are merely illustrative of the principles and effects of this disclosure and are not intended to limit this disclosure. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this disclosure. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this disclosure should still be covered by the protection scope of this disclosure.

Claims

1. A surface processing system for a porous disk, characterized in that, The porous disk has multiple through holes radially distributed and extending axially, and the surface processing system includes: The loading mechanism has a loading position for arranging the porous disc; A surface processing device is located above the loading position and is used to perform surface processing on the porous disk body; The liquid discharge mechanism, located below the loading position, includes a liquid discharge section, which is arranged with the liquid discharge direction facing upwards corresponding to the porous disc body. It is used to discharge liquid during the surface processing to form a continuous fountain that passes through each of the through holes from bottom to top, so as to clean the hole walls of each of the through holes. A liquid pump, connected to a liquid source and the liquid outlet, is used to drive the liquid outflow.

2. The surface processing system according to claim 1, characterized in that, The liquid outlet section includes multiple liquid outlet holes that correspond one-to-one with the positions of the through holes on the porous disc.

3. The surface processing system according to claim 1, characterized in that, A liquid outlet cavity is formed between the porous disc and the liquid outlet section, and the liquid outlet section is provided with multiple liquid outlet holes; the projection of each liquid outlet hole in a plane containing each of the through holes is located at the center of a group of through holes.

4. The surface processing system according to claim 3, characterized in that, The diameter of the liquid outlet hole is larger than that of the through hole, and the inner wall of the liquid outlet hole is provided with a vortex guiding structure for forming a swirling liquid outlet along the depth direction.

5. The surface processing system according to claim 1, characterized in that, The fountain maintains a preset liquid outlet height at the through-hole.

6. The surface processing system according to claim 1, characterized in that, The pressure of the liquid pump driving the liquid outlet is adjusted so that the liquid outlet height of the fountain in the through hole can be observed / measured and maintained at a preset height.

7. The surface processing system according to claim 1, characterized in that, The liquid dispensing mechanism may also be connected to a gas source to drive the liquid mixed with gas to dispensing to form a fountain; and / or, the gas-liquid ratio between the liquid and the gas mixed with it is 1 / 10 to 1 / 9; and / or, the liquid is implemented as a processing fluid suitable for the surface processing.

8. The surface processing system according to claim 1, characterized in that, include: The controller is communicatively connected to the surface processing device and the liquid pump, and in response to the activation of the surface processing device, controls the liquid pump to discharge liquid at the liquid outlet mechanism to form the fountain.

9. The surface processing system according to claim 1, characterized in that, The porous disk is a gas distribution disk in semiconductor process equipment.

10. A surface processing method for a porous disk, characterized in that, Applied to a surface processing apparatus as described in at least one of claims 1 to 9; the method comprises: In response to the surface finishing of the upper surface of the porous disc, a continuous fountain is formed extending from the bottom up through each of the through holes to clean the walls of each of the through holes.

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