An adaptive contact vacuum suction platform
Patent Information
- Application Number
- CN202611318499.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-08-28
- Publication Date
- 2026-09-25
AI Technical Summary
[0002]现有市面上的真空吸附平台,普遍采用的是分区域实现多路真空,但都是整个分区吸附,自适应能力差,只能兼容指定产品尺寸,若后续需临时增加新型产品需要更换吸附板则不能兼容
[0014]有益效果:本发明在实际中,可以通过电磁阀直接控制边缘的每块吸附板是否抽真空,也可以通过手动阀控制每排真空逻辑阀是否抽真空,进而根据产品的尺寸大小,在单个分区域未全部遮住时,可以选择性的关闭对应的真空逻辑阀,减少漏真空情况的发生,可以灵活兼容不同产品的吸附,适用于多种规格基板与工艺环境。同时,本发明可以通过三个UVW平台实现整个吸附板平台的调平校正,也可以通过水平调节螺丝实现单个吸附板的调平校正,灵活性强,可以保证吸附产品时的稳定性。
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Figure CN122807822A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of vacuum adsorption platform technology, and specifically relates to an adaptive contact vacuum adsorption platform. Background Technology
[0002] Existing vacuum adsorption platforms on the market generally use a zoned approach to achieve multi-channel vacuum, but these are all zone-wide adsorption, resulting in poor adaptability and compatibility only with specific product sizes. If new products need to be added later and the adsorption plates need to be replaced, they will not be compatible. When a single zone is not completely covered, the remaining uncovered vacuum holes will not stop adsorption, resulting in vacuum leakage. Summary of the Invention
[0003] The purpose of this invention is to provide an adaptive contact vacuum adsorption platform to solve the above-mentioned problems existing in the prior art.
[0004] To achieve the above objectives, the present invention adopts the following technical solution: An adaptive contact vacuum adsorption platform includes a bottom platform, an intermediate platform, and a vacuum adsorption platform connected sequentially from bottom to top. The vacuum adsorption platform includes an upper platform base plate, an airflow valve plate platform, and an adsorption plate platform arranged sequentially from bottom to top. The airflow valve plate platform includes multiple bottom airflow valve plates arranged in a rectangular array. The adsorption plate platform includes multiple adsorption plates arranged in a rectangular array. Each bottom airflow valve plate has an adsorption plate connected to its upper end. Each adsorption plate is connected to the upper platform base plate by multiple horizontal adjustment screws that penetrate the bottom airflow valve plate, so as to level the adsorption plate by adjusting the horizontal adjustment screws. Three UVW platforms are installed on the bottom platform to adjust the flatness of the intermediate platform. Each adsorption plate has multiple rows of adsorption holes, and a row of vacuum logic valves is embedded in the bottom airflow valve plate below each row of adsorption holes. Each vacuum logic valve corresponds to one adsorption hole. Below each adsorption plate located at the edge of the adsorption plate platform, there is a manual shut-off valve assembly installed between the intermediate platform and the upper platform substrate. The manual shut-off valve assembly has multiple manual valves, and each row of vacuum logic valves is connected to one of the manual valves below it through a pipe. A vent valve assembly connected to a vacuum source is also installed between the intermediate platform and the upper platform substrate. The vent valve assembly has multiple solenoid valves, and each solenoid valve is connected to a manual shut-off valve assembly through a pipe.
[0005] As a preferred technical solution of the present invention, the vacuum logic valves corresponding to the multiple adsorption plates located in the middle of the adsorption plate platform are all connected to a solenoid valve through pipes.
[0006] As a preferred technical solution of the present invention, the multiple adsorption plates located in the middle of the adsorption plate platform are all central adsorption plates. Each central adsorption plate is provided with a manual shut-off valve assembly installed between the intermediate platform and the upper platform substrate. The manual shut-off valve assembly is provided with multiple manual valves. Each row of vacuum logic valves is connected to a manual valve below it through a pipe. The manual valve on each manual shut-off valve assembly is connected to a solenoid valve through a pipe.
[0007] As a preferred technical solution of the present invention, each row of vacuum logic valves has a long strip of air groove at the top of the bottom airflow valve plate, and the top of each row of vacuum logic valves is located in the long strip of air groove.
[0008] As a preferred technical solution of the present invention, an exhaust hole is also provided in the elongated air groove, and a pressure relief hole is provided on the adsorption plate above the elongated air groove.
[0009] As a preferred technical solution of the present invention, an optical fiber sensor for detecting whether there is a product above the adsorption plate is installed inside the adsorption plate.
[0010] As a preferred technical solution of the present invention, a CCD camera module that cooperates with the UVW platform for leveling is mounted on the intermediate platform and / or upper platform substrate.
[0011] As a preferred technical solution of the present invention, each adsorption plate is equipped with three sets of horizontal adjustment screws. The three sets of horizontal adjustment screws are evenly arranged along the length direction of the adsorption plate, and each set of horizontal adjustment screws includes two horizontal adjustment screws that are spaced apart in the width direction of the adsorption plate.
[0012] As a preferred technical solution of the present invention, a filter is installed at the outlet of each vacuum logic valve.
[0013] As a preferred technical solution of the present invention, each adsorption plate and the upper platform substrate are abutted by a plurality of springs that penetrate the bottom airflow valve plate.
[0014] Beneficial effects: In practice, this invention allows for direct control of vacuuming of each edge adsorption plate via solenoid valves, or manual control of vacuuming of each row of vacuum logic valves. Furthermore, depending on the product size, when a single area is not fully covered, the corresponding vacuum logic valve can be selectively closed, reducing vacuum leakage. This invention is flexible and compatible with the adsorption of different products, and is suitable for various substrate sizes and process environments. Simultaneously, this invention allows for leveling and calibration of the entire adsorption plate platform via three UVW platforms, or leveling and calibration of individual adsorption plates via horizontal adjustment screws, offering high flexibility and ensuring stability during product adsorption. Attached Figure Description
[0015] Figure 1 This is a three-dimensional schematic diagram of the present invention; Figure 2 This is the front view of the present invention; Figure 3 This is a partial structural schematic diagram of the present invention.
[0016] In the diagram: 1-bottom platform; 2-middle platform; 3-upper platform base plate; 4-bottom airflow valve plate; 401-vacuum logic valve; 5-adsorption plate; 501-adsorption hole; 6-level adjustment screw; 7-UVW platform; 8-manual shut-off valve assembly; 9-ventilation valve assembly. Detailed Implementation
[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the present invention will be briefly introduced below in conjunction with the accompanying drawings and descriptions of the embodiments or the prior art. Obviously, the following description of the structure of the accompanying drawings is only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It should be noted that the description of these embodiments is for the purpose of helping to understand the present invention, but does not constitute a limitation of the present invention. Example
[0018] like Figure 1 , Figure 2 and Figure 3 As shown, this embodiment provides an adaptive contact vacuum adsorption platform, including a bottom platform 1, a middle platform 2, and a vacuum adsorption platform connected sequentially from bottom to top. The vacuum adsorption platform includes an upper platform substrate 3, an airflow valve plate platform, and an adsorption plate platform arranged sequentially from bottom to top. The airflow valve plate platform includes multiple bottom airflow valve plates 4 arranged in a rectangular array. The adsorption plate platform includes multiple adsorption plates 5 arranged in a rectangular array. The adsorption plates 5 are arranged in a regular pattern, which can be applied to the adsorption requirements of most products and also makes it easy to select the adsorption plate 5 for adsorbing products based on the product size.
[0019] Each bottom airflow valve plate 4 has a corresponding adsorption plate 5 connected to its upper end, for example, by adhesive or screws. Each adsorption plate 5 is connected to the upper platform substrate 3 by multiple horizontal adjustment screws 6 that pass through the bottom airflow valve plate 4. The adsorption plate 5 can be leveled by adjusting the horizontal adjustment screws 6, achieving individual leveling of each adsorption plate 5. At the same time, three UVW platforms 7 are installed on the bottom platform 1 to adjust the flatness of the middle platform 2. A CCD camera module that works with the UVW platform 7 for leveling can also be installed on the middle platform 2 and / or the upper platform substrate 3, or a CCD camera module can be set externally. The three UVW platforms 7 work in conjunction with the CCD camera module to achieve the correction and leveling of the entire middle platform 2 and all the adsorption plates 5 connected above.
[0020] In a more detailed manner, each adsorption plate 5 is provided with multiple rows of adsorption holes 501 to facilitate stable adsorption of products. Each row of adsorption holes 501 is provided with a row of vacuum logic valves 401 embedded in the bottom airflow valve plate 4. Each vacuum logic valve 401 is corresponding to an adsorption hole 501 so that a vacuum can be drawn by aligning the vacuum logic valve 401 with the adsorption hole 501 to achieve product adsorption.
[0021] It should be noted that, for vacuum adsorption platforms, the central area is generally the most frequently used area, while the edge areas are selected for use based on the product size. Therefore, this invention mainly focuses on the edge areas, such as... Figure 1 As shown, if the adsorption plate platform adopts a 4x4 arrangement of adsorption plates 5, then the adsorption plates 5 other than the four adsorption plates 5 in the middle are all adsorption plates 5 located at the edge of the adsorption plate platform. Each adsorption plate 5 located at the edge of the adsorption plate platform is provided with a manual shut-off valve assembly 8 installed between the middle platform 2 and the upper platform substrate 3. The manual shut-off valve assembly 8 is provided with multiple manual valves. Each row of vacuum logic valves 401 is connected to a manual valve below it through a pipe, which facilitates manual control of whether each row of vacuum logic valves 401 is evacuated according to the product size. A vent valve assembly 9 connected to a vacuum source is also installed between the middle platform 2 and the upper platform substrate 3. The vent valve assembly 9 is provided with multiple solenoid valves. Each solenoid valve is connected to a manual shut-off valve assembly 8 through a pipe, which facilitates direct control of whether each adsorption plate 5 at the edge is evacuated through the solenoid valve, thereby controlling the ventilation and shut-off status of the edge area under different conditions.
[0022] In practice, this invention allows for direct control of vacuuming of each edge adsorption plate 5 via solenoid valves, or manual control of vacuuming of each row of vacuum logic valves 401. Furthermore, depending on the product size, when a single area is not fully covered, the corresponding vacuum logic valve 401 can be selectively closed to reduce vacuum leakage. This provides flexible compatibility with the adsorption of different products and is suitable for various substrate sizes and process environments. Simultaneously, this invention allows for leveling and calibration of the entire adsorption plate platform via three UVW platforms 7, or leveling and calibration of a single adsorption plate 5 via horizontal adjustment screws 6, offering high flexibility and ensuring stability during product adsorption.
[0023] As a preferred embodiment of this implementation, it should be further explained that the vacuum logic valves 401 corresponding to the multiple adsorption plates 5 located in the middle of the adsorption plate platform are all connected to a solenoid valve through pipes. As the main adsorption platform area, the air supply and air cut-off status can be controlled by a solenoid valve, which is simple and quick to operate.
[0024] As a preferred embodiment of this implementation, it should be further explained that the multiple adsorption plates 5 located in the middle of the adsorption plate platform are all central adsorption plates. Each central adsorption plate is provided with a manual shut-off valve assembly 8 installed between the intermediate platform 2 and the upper platform substrate 3. The manual shut-off valve assembly 8 is provided with multiple manual valves. Each row of vacuum logic valves 401 is connected to a manual valve below it through a pipe. The manual valve on each manual shut-off valve assembly 8 is connected to a solenoid valve through a pipe, so that the central adsorption plate can also be flexibly controlled according to the actual situation, improving the overall flexibility.
[0025] As a preferred embodiment of this implementation, it should be further explained that each row of vacuum logic valves 401 has a long strip of air groove at the top of its bottom airflow valve plate 4. The top of each row of vacuum logic valves 401 is located in the long strip of air groove, which can connect the air paths of the row of vacuum logic valves, simplify the air path connection structure, reduce the layout of scattered pipes, reduce the risk of air path leakage, and facilitate unified air pressure regulation, so that the adsorption state of the row of adsorption plates remains consistent, further improving the stability and convenience of overall adsorption control.
[0026] As a preferred embodiment of this implementation, it should be further explained that the elongated air groove is also provided with an exhaust port, and the adsorption plate 5 above the elongated air groove is provided with a pressure relief port. When the vacuum adsorption needs to be terminated, the solenoid valve is closed, and the outside air can enter the elongated air groove through the exhaust port, and then quickly reach the gap between the adsorption plate and the adsorbed workpiece through the pressure relief port. This can balance the air pressure in the adsorption area in a short time, achieve rapid pressure relief, and allow the workpiece to be detached smoothly, avoiding the problem of material handling jamming caused by slow pressure relief, and improving the efficiency of loading and unloading operations.
[0027] As a preferred embodiment of this invention, it should be further explained that an optical fiber sensor is installed inside the adsorption plate 5 to detect whether there is a product above the adsorption plate 5. When the optical fiber sensor detects that a workpiece is placed in the corresponding area of the adsorption plate, the solenoid valve corresponding to that area opens, connecting the air path of the corresponding vacuum logic valve, so that the adsorption plate in the corresponding area forms a negative pressure to complete the adsorption of the workpiece. If no workpiece is detected in the corresponding area, the corresponding solenoid valve remains closed, and no negative pressure adsorption is formed in that area. This design can automatically activate the adsorption function of the corresponding area according to the actual placement position of the workpiece, without the need for additional adjustment of the adsorption area division. This reduces the generation of ineffective negative pressure, reduces the waste of vacuum energy, and can adapt to workpieces of different sizes and placement positions, improving the adaptability and flexibility of the vacuum adsorption platform.
[0028] As a preferred embodiment of this implementation, it should be further explained that each adsorption plate 5 is equipped with three sets of horizontal adjustment screws 6. The three sets of horizontal adjustment screws 6 are evenly arranged along the length of the adsorption plate 5. Each set of horizontal adjustment screws 6 includes two horizontal adjustment screws 6 spaced apart in the width direction of the adsorption plate 5. The horizontal adjustment screws 6 are threadedly connected to the adsorption plate 5. By rotating the horizontal adjustment screws 6 at different positions, the height of the corresponding adsorption plate 5 can be finely adjusted, thereby adjusting the levelness of the entire adsorption working surface.
[0029] As a preferred embodiment of this implementation, it should be further explained that a filter is installed at the outlet of each vacuum logic valve 401. The filter can filter the airflow entering the vacuum logic valve, intercepting debris, dust and other impurities mixed in the airflow, and preventing impurities from entering the vacuum logic valve and causing valve core jamming or air passage blockage. This ensures the stable operation of the vacuum logic valve, extends the service life of the vacuum logic valve, and reduces the subsequent maintenance frequency and maintenance cost of the vacuum adsorption platform.
[0030] As a preferred embodiment of this implementation, it should be further explained that each adsorption plate 5 is abutted against the upper platform substrate 3 by multiple springs that penetrate the bottom airflow valve plate 4. The springs are evenly distributed along the lower surface of the adsorption plate 5. In its natural state, the springs push the adsorption plate 5 upward, so that the adsorption plate 5 can retain a small floating space under the joint limitation of the upper platform substrate 3 and the springs. When the surface of the product to be processed has slight unevenness, the adsorption plates 5 at different positions can adaptively adjust their height accordingly to ensure that all adsorption plates 5 can be stably and sealed to the product surface, thereby improving the adaptability of the entire vacuum adsorption platform to products with different flatness.
[0031] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.
Claims
1. An adaptive contact vacuum adsorption platform, characterized in that, The system includes a bottom platform (1), an intermediate platform (2), and a vacuum adsorption platform connected sequentially from bottom to top. The vacuum adsorption platform includes an upper platform base plate (3), an airflow valve plate platform, and an adsorption plate platform arranged sequentially from bottom to top. The airflow valve plate platform includes multiple bottom airflow valve plates (4) arranged in a rectangular array. The adsorption plate platform includes multiple adsorption plates (5) arranged in a rectangular array. Each bottom airflow valve plate (4) has an adsorption plate (5) connected to its upper end. Each adsorption plate (5) is connected to the upper platform base plate (3) by multiple horizontal adjustment screws (6) that pass through the bottom airflow valve plate (4) to level the adsorption plate (5) by adjusting the horizontal adjustment screws (6). Three UVW platforms (7) are installed on the bottom platform (1) to adjust the flatness of the intermediate platform (2). Each adsorption plate (5) is provided with multiple rows of adsorption holes (501), and a row of vacuum logic valves (401) is embedded on the bottom airflow valve plate (4) below each row of adsorption holes (501). Each vacuum logic valve (401) is provided with a corresponding adsorption hole (501). Each adsorption plate (5) located at the edge of the adsorption plate platform is provided with a manual shut-off valve assembly (8) installed between the intermediate platform (2) and the upper platform substrate (3). The manual shut-off valve assembly (8) is provided with multiple manual valves. Each row of vacuum logic valves (401) is connected to a manual valve below it through a pipe. A ventilation valve assembly (9) connected to a vacuum source is also installed between the intermediate platform (2) and the upper platform substrate (3). The ventilation valve assembly (9) is provided with multiple solenoid valves. Each solenoid valve is connected to a manual shut-off valve assembly (8) through a pipe.
2. The adaptive contact vacuum adsorption platform according to claim 1, characterized in that, The vacuum logic valves (401) corresponding to the multiple adsorption plates (5) located in the middle of the adsorption plate platform are all connected to a solenoid valve through pipes.
3. The adaptive contact vacuum adsorption platform according to claim 1, characterized in that, The multiple adsorption plates (5) located in the middle of the adsorption plate platform are all central adsorption plates. Each central adsorption plate is provided with a manual shut-off valve assembly (8) installed between the intermediate platform (2) and the upper platform base plate (3). The manual shut-off valve assembly (8) is provided with multiple manual valves. Each row of vacuum logic valves (401) is connected to a manual valve below it through a pipe. The manual valve on each manual shut-off valve assembly (8) is connected to a solenoid valve through a pipe.
4. An adaptive contact vacuum adsorption platform according to any one of claims 1-3, characterized in that, Each row of vacuum logic valves (401) has a long air groove at the top of the bottom airflow valve plate (4), and the top of each row of vacuum logic valves (401) is located in the long air groove.
5. The adaptive contact vacuum adsorption platform according to claim 4, characterized in that, The long strip air groove is also provided with an exhaust hole, and the adsorption plate (5) above the long strip air groove is provided with a pressure relief hole.
6. An adaptive contact vacuum adsorption platform according to any one of claims 1-3, characterized in that, The adsorption plate (5) is equipped with an optical fiber sensor for detecting whether there is a product above the adsorption plate (5).
7. An adaptive contact vacuum adsorption platform according to any one of claims 1-3, characterized in that, A CCD camera module that works in conjunction with the UVW platform (7) for leveling is mounted on the intermediate platform (2) and / or the upper platform substrate (3).
8. An adaptive contact vacuum adsorption platform according to any one of claims 1-3, characterized in that, Each adsorption plate (5) is equipped with three sets of horizontal adjustment screws (6). The three sets of horizontal adjustment screws (6) are evenly arranged along the length of the adsorption plate (5). Each set of horizontal adjustment screws (6) includes two horizontal adjustment screws (6) spaced apart in the width direction of the adsorption plate (5).
9. An adaptive contact vacuum adsorption platform according to any one of claims 1-3, characterized in that, Each vacuum logic valve (401) has a filter installed at its outlet.
10. An adaptive contact vacuum adsorption platform according to any one of claims 1-3, characterized in that, Each adsorption plate (5) is abutted against the upper platform substrate (3) by multiple springs that pass through the bottom airflow valve plate (4).