PCB punching vibration suppression buffer tooling

Abstract

The application relates to the technical field of PCB punching buffering tool, in particular to a vibration suppression buffering tool for PCB punching, which comprises a vibration suppression buffering tool, a bottom merging shell, a workpiece bearing workbench and a buffering assembly. The fixing position on the vibration suppression buffering tool is connected with the bottom merging shell. The mounting position on the bottom merging shell is provided with the workpiece bearing workbench. The mounting position on the buffering assembly is assembled with the bottom merging shell and the workpiece bearing workbench. Airtight gas film components are installed on the workpiece bearing workbench. In the application, a corrugated telescopic shield which can synchronously stretch and shrink with the workpiece bearing workbench is adopted to dynamically coat a pre-pressed disc spring group, continuously block the invasion of cutting fluid dust into the buffering module, and synchronously stretch and shrink with the workpiece bearing workbench when the workpiece bearing workbench slightly sinks or resets, so that the coating protection of the pre-pressed disc spring group is always maintained.

Description

Technical Field

[0001] This invention relates to the technical field of PCB punching buffer fixtures, specifically a vibration suppression buffer fixture for PCB punching. Background Technology

[0002] The PCB punching buffer fixture integrates YOLOv8s and Transformer deep learning algorithms to achieve high-precision recognition of PCB micro-hole mark points, with a positioning recognition accuracy of ±10μm. This provides a visual input basis for high-precision alignment punching by robotic arms. It is equipped with a buffer and vibration damping mechanism to actively cancel the punching impact vibration, controlling the vibration amplitude during the punching process to <5μm and eliminating the disturbance of punching impact on positioning accuracy.

[0003] Existing PCB punching buffer fixtures are prone to air leakage, resulting in uneven stress on thin PCBs, board movement, incomplete vacuum adsorption, and failure of protection when the worktable sinks due to slight buffer displacement. Cutting fluid, chips, and dust generated during punching fall directly into the buffer cavity, causing disc spring corrosion and aging of damping seals. Summary of the Invention

[0004] The purpose of this invention is to provide a vibration suppression buffer fixture for PCB punching to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A vibration suppression and buffer fixture for PCB punching includes a vibration suppression and buffer fixture, a bottom merging housing, a workpiece carrying worktable, and a buffer assembly. The bottom merging housing is connected to a fixed point on the vibration suppression and buffer fixture. The workpiece carrying worktable is mounted on a mounting point on the bottom merging housing. The buffer assembly is fitted with the bottom merging housing and the workpiece carrying worktable at a mounting point. The assembly also includes [further details about the additional details]. A sealed air film assembly is installed on the workpiece-bearing worktable; A protective covering assembly is disposed on the workpiece-bearing worktable; The workpiece bearing workbench is equipped with a preloaded disc spring assembly fixed at the support, and a support rod is installed around the preloaded disc spring assembly. A closing die is connected to the threaded part of the support rod, and an upper die is provided at the mounting part of the closing die.

[0006] The vibration suppression and buffering fixture for PCB punching described above: the upper die and the closing die are supported by support rods.

[0007] The vibration suppression and buffering fixture for PCB punching as described above: the workpiece carrying table is supported and installed at the bottom end of the die by a preloaded disc spring assembly.

[0008] The vibration suppression and buffering fixture for PCB punching as described above: the sealed air film assembly includes a sealed air cantilever interlayer fixedly installed inside the die, a locking nut is provided at the threaded part of the upper die, and a fine-tuning thread is installed at the threaded part of the locking nut.

[0009] The vibration suppression and buffering fixture for PCB punching as described above: the fine-tuning thread and the locking nut thread snap onto the upper die.

[0010] The vibration suppression and buffering fixture for PCB punching as described above: the protective covering assembly includes a bottom circulating water channel assembly fixedly connected inside the bottom merging housing, a flange assembly is provided at the threaded part of the workpiece bearing workbench, and a corrugated telescopic cover is fixed at the mounting point on the flange assembly.

[0011] The vibration suppression and buffer fixture for PCB punching as described above: the corrugated telescopic cover and the flange assembly are installed outside the preloaded disc spring assembly.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows: Users can add buffer pads to the support end faces of the upper die and the closing die to absorb minor impacts, facilitating the disassembly and replacement of the sealed air suspension beam interlayer inside the upper die and the closing die. All punching loads are transferred to the workpiece bearing worktable by the outer peripheral support rods of the upper die and the closing die. The sealed air suspension beam interlayer does not bear the punching load, achieving decoupling of load bearing and air buoyancy. The upper die and the closing die, together with the workpiece bearing worktable, form a closed sealed air suspension beam interlayer. After pressurization, a uniform air film is formed in the cavity. The air buoyancy cavity is not subject to impact, the seal is not easily damaged, the air film gap remains stable, the life of the air buoyancy components is extended, compressed air consumption is reduced, and thin plate displacement and tearing defects are reduced.

[0013] The corrugated telescopic cover, which extends and retracts synchronously with the workpiece-bearing table, can dynamically cover the preloaded disc spring assembly and continuously prevent cutting fluid and dust from entering the buffer module. When the workpiece-bearing table experiences a slight sinking or reset during buffering, the corrugated telescopic cover extends and retracts synchronously, always maintaining the coverage and protection of the preloaded disc spring assembly. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 For the present invention Figure 1 Enlarged structural diagram at point A in the middle; Figure 3 This is a schematic diagram of the structure of the sealed air film assembly of the present invention; Figure 4 This is a schematic diagram of the bottom fused shell structure of the present invention; Figure 5 This is a schematic diagram of the structure of the protective covering component of the present invention.

[0015] In the diagram: 1. Vibration damping and buffer fixture; 2. Bottom merging shell; 3. Workpiece bearing worktable; 4. Upper die; 5. Preloaded disc spring assembly; 6. Closing die; 7. Support rod; 8. Fine-tuning thread; 9. Locking nut; 10. Sealed air cantilever interlayer; 11. Bottom circulating water channel assembly; 12. Corrugated telescopic cover; 13. Flange assembly. Detailed Implementation

[0016] Various exemplary embodiments, features, and aspects of this application will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0017] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0018] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods, means, and elements well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0019] Please see Figures 1-5 A vibration suppression buffer fixture for PCB punching is proposed, including a vibration suppression buffer fixture 1, a bottom merging shell 2, a workpiece carrying worktable 3, and a buffer assembly.

[0020] The vibration damping and buffering fixture 1 is fixedly connected to a bottom merging shell 2. A workpiece bearing worktable 3 is installed at the mounting point on the bottom merging shell 2. The buffer assembly is equipped with the bottom merging shell 2 and the workpiece bearing worktable 3 at the mounting point. A sealed air film assembly is installed on the workpiece bearing worktable 3. A protective covering assembly is installed on the workpiece bearing worktable 3. The workpiece carrying worktable 3 is installed on the bottom combined shell 2 and the vibration suppression buffer fixture 1, so that the vibration suppression buffer fixture 1 is arranged as a whole in the internal cavity of the bottom combined shell 2. The workpiece carrying worktable 3 is mounted on the bottom combined shell 2 and the vibration suppression buffer fixture 1. The workpiece carrying worktable 3 extends into the opening of the bottom combined shell 2 and the vibration suppression buffer fixture 1. The workpiece carrying worktable 3 can perform micron-level vertical buffering and floating relative to the bottom combined shell 2 and the vibration suppression buffer fixture 1. Among them, a preloaded disc spring group 5 is fixed at the support on the workpiece bearing workbench 3, a support rod 7 is installed around the preloaded disc spring group 5, a closing die 6 is connected to the threaded part on the support rod 7, and an upper die 4 is provided at the mounting part on the closing die 6.

[0021] In this embodiment, the preloaded disc spring assembly 5 is fixedly installed on the workpiece bearing worktable 3. When the workpiece bearing worktable 3 floats up and down at the micron level through the bottom merging shell 2 and vibration suppression buffer fixture 1, the upper die 4 and the closing die 6 are installed on the workpiece bearing worktable 3 through the support rod 7. The preloaded disc spring assembly 5 is fixed on the workpiece bearing worktable 3. The PCB board is positioned on the upper surface of the upper die 4 and the closing die 6. The upper die 4 and the closing die 6 move downward to press the PCB board and close the die with the workpiece bearing worktable 3 to complete the punching of the PCB outline and inner hole.

[0022] Preferably, the upper die 4 and the closing die 6 are supported by the support rod 7. When the upper die 4 and the closing die 6 are installed on the workpiece bearing worktable 3 by the support rod 7, the upper die 4 and the closing die 6 are supported by the support rod 7, and all the punching load of PCB punching is transferred to the workpiece bearing worktable 3 by the support rod 7.

[0023] Preferably, the workpiece bearing worktable 3 is supported and installed at the bottom of the die 6 by a preloaded disc spring assembly 5. The workpiece bearing worktable 3 presses directly on the preloaded disc spring assembly 5, and the preloaded disc spring assembly 5 moves with the workpiece bearing worktable 3 during punching.

[0024] Please refer to Figure 2 and Figure 3 In this embodiment, the sealed air film assembly includes a sealed air suspension beam interlayer 10 fixedly installed inside the concave mold 6, a locking nut 9 is provided at the threaded part of the upper concave mold 4, and a fine-tuning thread 8 is installed at the threaded part of the locking nut 9.

[0025] The locking nut 9 and the fine-tuning thread 8 are threadedly fastened to the closing die 6 and the support rod 7. The closing die 6 and the support rod 7 are snapped onto the upper die 4 by the locking nut 9 and the fine-tuning thread 8, so that the upper die 4, the closing die 6 and the support rod 7 are threaded together. The sealing air suspension beam interlayer 10 is threadedly snapped onto the inner side of the upper die 4 and the closing die 6.

[0026] Preferably, the fine-tuning thread 8 and the locking nut 9 are threaded and snapped onto the upper die 4. When the locking nut 9 and the fine-tuning thread 8 are snapped onto the upper die 4, the user can add buffer pads to the support end faces of the upper die 4 and the closing die 6 to absorb minor impacts. This facilitates the disassembly and replacement of the sealed air suspension beam interlayer 10 inside the upper die 4 and the closing die 6. All punching loads are transferred to the workpiece bearing worktable 3 by the outer peripheral support rods 7 of the upper die 4 and the closing die 6. The sealed air suspension beam interlayer 10 does not bear the punching load, thus achieving decoupling of load-bearing and air buoyancy. The upper die 4 and the closing die 6 and the workpiece bearing worktable 3 form a closed sealed air suspension beam interlayer 5. After pressurization, a uniform air film is formed in the cavity. The air buoyancy cavity is not impacted, the seal is not easily damaged, the air film gap remains stable, the life of the air buoyancy components is extended, compressed air consumption is reduced, and thin plate displacement and tearing defects are reduced.

[0027] Please refer to Figure 4 and Figure 5 In this embodiment, the protective covering assembly includes a bottom circulating water channel assembly 11 fixedly connected inside the bottom combined housing 2, a flange assembly 13 provided at the threaded part of the workpiece bearing workbench 3, and a corrugated telescopic cover 12 fixed at the mounting point on the flange assembly 13.

[0028] The bottom circulating water channel group 11 is distributed and installed inside the bottom merging shell 2. The bottom merging shell 2 integrates the bottom circulating water channel group 11, which continuously dissipates heat from the built-in buffer module, controls the module's working temperature, and ensures stable long-term vibration suppression effect. The corrugated telescopic cover 12 is installed on the workpiece bearing worktable 3 through the flange group 13.

[0029] Preferably, the corrugated telescopic cover 12 and the flange assembly 13 are installed outside the preloaded disc spring assembly 5. The corrugated telescopic cover 12, which extends and retracts synchronously with the workpiece bearing table 3, dynamically covers the preloaded disc spring assembly 5 and continuously prevents cutting fluid and dust from entering the buffer module. When the workpiece bearing table 3 experiences a slight sinking or reset, the corrugated telescopic cover 12 extends and retracts synchronously, always maintaining the coverage and protection of the preloaded disc spring assembly 5.

[0030] As can be seen from the above, during use, when the workpiece bearing worktable 3 floats up and down at the micron level through the bottom merging shell 2 and vibration suppression buffer fixture 1, the upper concave mold 4 and the closing concave mold 6 are installed on the workpiece bearing worktable 3 through the support rod 7, the pre-compression disc spring group 5 is fixed on the workpiece bearing worktable 3, the PCB board is positioned on the upper surface of the upper concave mold 4 and the closing concave mold 6, the upper concave mold 4 and the closing concave mold 6 move downward to press the PCB board, the bottom merging shell 2 integrates the bottom circulating water channel group 11 to continuously dissipate heat from the built-in buffer module, control the module's working temperature, and ensure the long-term stable vibration suppression effect.

[0031] When the workpiece bearing worktable 3 experiences a slight dip or reset, the corrugated telescopic cover 12 extends and retracts synchronously, always maintaining the protection of the preloaded disc spring assembly 5. The outer peripheral support rods 7 of the upper die 4 and the closing die 6 transmit all punching loads to the workpiece bearing worktable 3. The sealed air suspension beam interlayer 10 does not bear the punching load, achieving decoupling of load-bearing and air buoyancy. The upper die 4 and the closing die 6, together with the workpiece bearing worktable 3, form a sealed air suspension beam interlayer 5. After pressurization, a uniform air film is formed in the cavity. The air buoyancy cavity is not impacted, the seal is not easily damaged, the air film gap remains stable, the life of the air buoyancy components is extended, compressed air consumption is reduced, and thin plate displacement and tearing defects are reduced.

[0032] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0033] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A vibration suppression and buffer fixture for PCB punching, comprising a vibration suppression and buffer fixture (1), a bottom merging housing (2), a workpiece carrying worktable (3), and a buffer assembly, wherein the bottom merging housing (2) is fixedly connected to the vibration suppression and buffer fixture (1), the workpiece carrying worktable (3) is mounted on the bottom merging housing (2), and the bottom merging housing (2) and the workpiece carrying worktable (3) are mounted on the buffer assembly, characterized in that: It also includes settings, A sealed air film assembly is installed on the workpiece bearing worktable (3); A protective covering assembly is disposed on the workpiece bearing worktable (3); Among them, a preloaded disc spring assembly (5) is fixed at the support on the workpiece bearing worktable (3), a support rod (7) is installed around the preloaded disc spring assembly (5), a closing die (6) is connected to the thread on the support rod (7), and an upper die (4) is provided at the mounting point on the closing die (6).

2. The vibration suppression and buffer fixture for PCB punching according to claim 1, characterized in that, The upper die (4) and the closing die (6) are supported by a support rod (7).

3. The vibration suppression and buffer fixture for PCB punching according to claim 1, characterized in that, The workpiece bearing worktable (3) is supported and installed at the bottom of the die (6) by a pre-compressed disc spring assembly (5).

4. The vibration suppression and buffer fixture for PCB punching according to claim 1, characterized in that, The sealed air film assembly includes a sealed air suspension beam interlayer (10) fixedly installed inside the concave mold (6), and a locking nut (9) is provided at the threaded part of the upper concave mold (4), and a fine adjustment thread (8) is installed at the threaded part of the locking nut (9).

5. The vibration suppression buffer fixture for PCB punching according to claim 4, characterized in that, The fine-tuning thread (8) and the locking nut (9) are threaded onto the upper die (4).

6. The vibration suppression buffer fixture for PCB punching according to claim 1, characterized in that, The protective covering assembly includes a bottom circulating water channel assembly (11) fixedly connected inside the bottom combined shell (2), a flange assembly (13) is provided at the threaded part of the workpiece bearing workbench (3), and a corrugated telescopic cover (12) is fixed at the mounting part of the flange assembly (13).

7. A vibration suppression buffer fixture for PCB punching according to claim 6, characterized in that, The corrugated telescopic cover (12) and the flange assembly (13) are installed outside the preloaded disc spring assembly (5).

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