Flexible circuit board die cutting device and die cutting manufacturing method thereof

Abstract

The application discloses a flexible circuit board die cutting device and a die cutting preparation method thereof, which is composed of nine core modules, i.e., an equipment rack, a fixed bearing workbench, a vertical precision die cutting mechanism, a pure mechanical pressure self-adaptive pressure regulating component, a flexible plate anti-deformation clamping and positioning component, a die cutting buffer protection component, a mechanical gap fine adjustment compensation component, a waste scrap isolation and collection component and a uniform feeding guide component. The modules are accurately coordinated and linked, the application discloses the traditional fixed pressure die cutting and the electric control intelligent pressure regulating mode are abandoned, a multilayer gradient elastic pure mechanical pressure regulating structure is adopted, the die cutting pressure demand of the ultra-thin, conventional, thickened and full-specification flexible circuit board can be accurately adapted, the trace thickness and hardness deviation of single batch of plates can be self-adaptively compensated, the problems of incomplete cutting, plate pressure damage and circuit rupture caused by poor pressure adaptability of the traditional equipment are solved, and batch processing consistency is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of flexible circuit board processing equipment technology, specifically to a flexible circuit board die-cutting device and its die-cutting preparation method. Background Technology

[0002] Flexible printed circuit boards (FPCs) are precision electronic boards that use flexible insulating substrates such as polyimide and polyester film as carriers, with ultra-thin copper foil circuit layers laminated to the surface. They have advantages such as being thin, flexible, bendable, easy to integrate, and having high wiring density, making them a core basic component in current consumer electronics, smart wearables, 5G communication equipment, and new energy electronic products. As electronic products rapidly iterate towards miniaturization, thinness, high density, and high reliability, the substrate thickness of flexible printed circuit boards is constantly decreasing, and the copper foil circuits are becoming increasingly refined. The requirements for die-cutting precision, board integrity, and non-damage to circuits are continuously increasing. The die-cutting process, as a key finishing process in the preparation of flexible printed circuit boards, directly determines the product yield and reliability.

[0003] Current flexible circuit board (Flexible Printed Circuit) die-cutting equipment and manufacturing processes suffer from numerous industry pain points, making them ill-suited for the processing demands of high-end precision Flexible Circuit Boards. Firstly, the substrate of Flexible Circuit Boards is soft and exhibits significant elastic deformation characteristics. With a copper foil layer thickness of only 4-100μm, the material is extremely brittle. Traditional die-cutting equipment employs a fixed, rigid pressure die-cutting mode, which cannot adapt to the pressure requirements of boards with varying thicknesses and copper foil specifications. Excessive pressure can lead to substrate delamination, copper foil tearing, circuit breakage, and board deformation. Insufficient pressure results in incomplete cutting, edge residue, and excessive dimensional deviations, leading to extremely poor consistency in batch processing. Simultaneously, the rigid die-cutting method generates instantaneous impact stress, easily causing edge wrinkling and springback warping of the board. Fine burrs are produced on the cut surface, affecting not only the product's appearance precision but also creating stress concentration points during subsequent bending and use, accelerating circuit breakage, and even puncturing the cover film, causing short circuits and severely impacting product lifespan and safety.

[0004] Secondly, existing die-cutting equipment lacks a dedicated anti-deformation positioning structure for flexible boards. Flexible circuit boards are susceptible to stretching, relaxation, wrinkling, and misalignment during feeding and die-cutting processes due to traction and extrusion forces. This results in low die-cutting alignment accuracy, frequent hole misalignment and contour collapse defects, failing to meet the micron-level die-cutting precision requirements of high-density, fine circuit boards. Furthermore, during long-term operation, sliding parts experience minor wear, leading to deviations in the die-cutting closure gap. Traditional equipment lacks a mechanical gap compensation structure, causing wear errors to accumulate continuously, resulting in a sustained decline in die-cutting accuracy. This necessitates frequent shutdowns for calibration and parts replacement, leading to low production efficiency and high maintenance costs.

[0005] Furthermore, the die-cutting process of flexible circuit boards generates a large amount of fine copper shavings and substrate dust. Existing equipment lacks a targeted waste shavings isolation and collection structure, and the debris easily remains in the die-cutting area and on the surface of the equipment's worktable. During the die-cutting process, the debris is squeezed and embedded in the surface of the board, forming indentations, pits, and even causing short circuits and micro-open circuit defects, significantly reducing the product yield. At the same time, traditional feeding structures cannot achieve uniform and stable conveying of flexible boards, resulting in uneven feeding tension and frequent slippage and deviation problems, further aggravating die-cutting dimensional deviations and board deformation defects.

[0006] A few existing high-precision die-cutting machines employ intelligent control schemes that combine electronic sensor detection, PLC program calculation, intelligent motor pressure regulation, and visual alignment. These machines collect sheet thickness and pressure data via sensors, and then adjust die-cutting parameters based on computer algorithms. However, these intelligent machines have significant drawbacks: First, the core improvements are concentrated on the electronic control program and intelligent control level, lacking substantial mechanical structural innovation and failing to meet the core requirements for granting mechanical invention patents. Second, dust, static electricity, and temperature fluctuations in electronic workshops easily lead to sensor malfunctions, signal drift, and program failures, resulting in poor equipment stability and a high failure rate. Third, these intelligent machines are expensive, complex to debug, and have high maintenance thresholds, making them unsuitable for small-batch, multi-specification flexible circuit board production scenarios. Fourth, the electronic control system suffers from response delays, failing to achieve instantaneous pressure buffering and dynamic adaptive compensation, making it difficult to completely eliminate sheet damage caused by die-cutting impacts.

[0007] In summary, existing flexible circuit board die-cutting technologies suffer from numerous technical defects, including poor pressure adaptability, easy deformation and damage to the board material, low die-cutting accuracy, inability to compensate for gap errors, serious waste pollution, poor stability of intelligent equipment, and high production costs. There is a lack of a dedicated flexible circuit board die-cutting device and its fabrication process that is purely mechanical, high-precision, non-destructive, adaptable to different board sizes, capable of compensating for wear errors, and capable of isolating and collecting waste. Therefore, this paper proposes a flexible circuit board die-cutting device and its fabrication method. Summary of the Invention

[0008] The purpose of this invention is to provide a flexible circuit board (PCB) die-cutting device and its die-cutting preparation method, solving the technical problems of existing PCB die-cutting equipment, such as poor pressure fixation adaptability, easy deformation and wrinkling of the board material, easy damage to copper foil circuits, low die-cutting accuracy, inability to compensate for wear errors, serious waste pollution, high failure rate of intelligent electronic control equipment, and poor batch processing consistency. This invention completely abandons computer programs, intelligent algorithms, and electronic control sensor regulation modes, relying entirely on pure mechanical structure linkage, gradient elastic adaptive pressure adjustment, mechanical tension shaping and deformation prevention, mechanical gap fine-tuning compensation, mechanical buffering and impact prevention, and mechanical waste collection—a comprehensive structural optimization that achieves high-precision, damage-free, and highly consistent batch die-cutting of PCBs. It is suitable for processing various specifications of ultra-thin, fine, and high-density PCBs, effectively improving product yield and production efficiency, reducing equipment maintenance costs, and adapting to various industrial precision production scenarios.

[0009] This invention provides a flexible circuit board die-cutting device, which consists of nine core modules: a machine frame, a fixed bearing worktable, a vertical precision die-cutting mechanism, a purely mechanical pressure adaptive adjustment component, a flexible board anti-deformation clamping and positioning component, a die-cutting buffer protection component, a mechanical clearance fine-tuning compensation component, a waste chip isolation and collection component, and a uniform speed feeding and guiding component. Each module works precisely and in coordination, constructing a purely mechanical high-precision, non-damaging flexible circuit board die-cutting system from multiple dimensions, including die-cutting power output, pressure adaptive and precise control, board shaping and anti-deformation, instantaneous impact buffer protection, wear error mechanical compensation, waste chip isolation protection, and stable feeding and positioning. The entire process is without electrical control, programming, or intelligent intervention. All functions are achieved through the displacement, deformation, limit, meshing, and linkage of the mechanical physical structure. The structural design is tailored to the material characteristics of flexible circuit boards, which are thin, easily deformed, and easily damaged.

[0010] The equipment frame is integrally welded from thickened steel and undergoes aging stress relief treatment, resulting in high overall rigidity, excellent resistance to deformation, and superior load-bearing stability. This effectively prevents frame deformation and accuracy deviation caused by long-term high-frequency die-cutting vibration. The frame surface is treated with anti-static and anti-rust coating, meeting the anti-static and clean production requirements of electronic board processing. Adjustable leveling feet at the bottom of the frame allow for precise calibration of the overall equipment level, preventing die-cutting bias and unilateral deformation of the board material from the outset. The fixed load-bearing worktable is machined from a single piece of high-strength alloy steel plate, with a top surface flatness error of ≤0.01mm. The surface is treated with anti-static polishing, resulting in a smooth, burr-free surface that avoids scratching the copper foil circuitry of flexible circuit boards, providing a high-precision reference surface for die-cutting operations.

[0011] The vertical precision die-cutting mechanism, as the core of the die-cutting power execution, adopts a crankshaft silent connecting rod transmission mode. Four high-precision chrome-plated vertical guide shafts ensure the straightness and stability of the lifting motion. The sliding bushings are made of wear-resistant copper alloy, with extremely small sliding clearance, no jamming, and no offset, maintaining micron-level lifting accuracy over a long period. The eccentric crankshaft's fixed eccentricity design ensures a high degree of uniformity in the die-cutting stroke, downward speed, and impact amplitude for each operation, avoiding batch die-cutting accuracy differences caused by stroke fluctuations. The flexible hinged connecting rod structure can slightly buffer transmission vibration, reduce equipment resonance during the die-cutting process, reduce sheet vibration offset defects, and is suitable for high-frequency precision continuous die-cutting operations.

[0012] The core innovation of this invention is the purely mechanical pressure adaptive pressure adjustment component. It employs a multi-layered gradient elastic pressure adjustment design, unlike traditional single-spring fixed pressure structures. Through a layered array of compression springs with different wire diameters and elastic coefficients, it forms a wide-range, continuously gradient elastic pressure output range, precisely adapting to the die-cutting pressure requirements of ultra-thin, standard, and thick flexible circuit boards. Manually visualized and precise pre-adjustment of pressure is achieved through a mechanical fine-tuning screw and a pre-tightening dial. Combined with a screw locking nut for double anti-loosening, the accuracy of the preset basic pressure is ensured. Simultaneously, relying on the adaptive deformation characteristics of the elastic structure, dynamic pressure compensation is performed for minute thickness and hardness deviations in a single batch of boards. This completely solves the pain points of poor adaptability and low yield rate of traditional fixed-pressure die-cutting, providing a fully mechanical response with no delay, no error, and no malfunctions.

[0013] The flexible board anti-deformation clamping and positioning component is a dedicated shaping structure for flexible boards. Designed specifically for the characteristics of flexible circuit boards—their softness, stretchability, wrinkling, and springback—it uses flexible silicone pressure strips for soft clamping and shaping. This combination of rigid limiting and flexible clamping ensures precise alignment and positioning of the board while preventing damage to the board or breakage of circuitry from rigid clamping. A horizontal fine-tuning slider adapts to boards of different widths, and the travel limit bolts precisely control the downward pressure, ensuring the board remains flat, without looseness, stretching, or wrinkles before die-cutting. This fundamentally eliminates board deformation, misalignment, and springback warping during the die-cutting process, significantly improving die-cutting dimensional accuracy and batch consistency.

[0014] The die-cutting buffer protection component specifically addresses the problem of instantaneous rigid impact damage during flexible circuit board die-cutting. Through multiple sets of arc-shaped stress-relieving springs and a multi-point pressure-equalizing structure, it rapidly absorbs the peak impact stress during die-cutting, transforming instantaneous rigid compression into flexible, buffered pressure. This eliminates fluctuations in pressure, preventing defects such as copper foil tearing, substrate delamination, edge burrs, and localized edge collapse. The damping buffer structure eliminates minor sliding vibrations and suppresses high-frequency resonance in the equipment, further ensuring the stability of the board die-cutting process and achieving truly damage-free precision die-cutting.

[0015] The mechanical clearance fine-tuning compensation component is a structure that ensures the long-term precision of the equipment. Through the micron-level scale fine-tuning structure, the sliding fit clearance of the die-cutting mechanism can be manually and precisely calibrated. It compensates in real time for clearance errors caused by long-term wear and tear and slight deformation of parts during equipment operation, avoiding the problems of decreased die-cutting accuracy, incomplete cutting, and out-of-size due to the continuous accumulation of errors. It significantly extends the high-precision operation cycle of the equipment, reduces the frequency of equipment downtime for calibration, lowers maintenance costs, and ensures the precision stability of the equipment in long-term mass production.

[0016] The waste chip isolation and collection component adopts an embedded ring chip collection design, arranged around the core die-cutting station. It can collect fine copper chips and substrate dust generated during die-cutting in real time. The chips are automatically collected through an inclined chip guiding structure, and with the help of a fine filter, the chips are completely intercepted. This effectively prevents hidden quality defects such as pressure marks, short circuits, and micro-open circuits caused by chips remaining on the board surface, improves the reliability of the flexible circuit board products, and meets the clean processing requirements of high-end precision electronic boards.

[0017] The uniform speed feeding guide component adopts an upper and lower synchronous transmission structure. The flexible anti-slip pad layer can stably clamp the conveyed board, avoiding slippage, scratching of the circuit, and stretching deformation. The lateral spacing can be flexibly and finely adjusted to adapt to the continuous feeding of flexible circuit boards of different widths and specifications, ensuring uniform feeding speed and stable tension, eliminating die-cutting alignment deviation and board deformation caused by feeding fluctuations, and adapting to automated continuous batch die-cutting production.

[0018] This invention also discloses a method for preparing flexible circuit boards by die-cutting. Based on the above-mentioned purely mechanical die-cutting device, the entire process is free of electrical control programs and intelligent computational intervention. Through a standardized process of precise equipment debugging, board shaping and clamping, mechanical adaptive pressure adjustment, buffered and impact-free die-cutting, real-time waste collection, and continuous cyclic operation, high-precision, damage-free, and highly consistent batch die-cutting of flexible circuit boards is achieved. The process steps are simple, logically rigorous, and highly operable, which can effectively avoid various quality defects of traditional processes and significantly improve product yield and production efficiency.

[0019] Beneficial effects of the present invention: Compared with the prior art, the present invention has the following substantial innovations and beneficial effects: 1. This invention abandons the traditional fixed pressure die-cutting and electronically controlled intelligent pressure adjustment mode, and adopts a multi-layer gradient elastic pure mechanical pressure adjustment structure, which can accurately adapt to the die-cutting pressure requirements of ultra-thin, regular and thick flexible circuit boards of all specifications. At the same time, it can adaptively compensate for the slight thickness and hardness deviation of a single batch of boards, completely solving the problems of incomplete cutting, board damage and circuit breakage caused by poor pressure adaptability of traditional equipment, and greatly improving the consistency of batch processing.

[0020] 2. The addition of a flexible clamping and shaping structure can accurately flatten and fix the flexible circuit board, eliminating deformation defects such as stretching, wrinkling, offset, and springback during the die-cutting process. Combined with a micron-level gap compensation structure, the long-term die-cutting dimensional accuracy is stable and controllable, and the dimensional deviation can be controlled within ±0.01mm, meeting the precision processing requirements of high-density, miniaturized flexible circuit boards.

[0021] 3. Through a dedicated stress-relieving and buffering structure, the instantaneous rigid impact and pressure peak during die-cutting are completely eliminated, avoiding hidden defects such as copper foil tearing, substrate delamination, edge burrs, and stress concentration. The die-cut surface is flat and smooth, without burrs or collapsed edges, effectively improving the bending durability and reliability of flexible circuit boards, and eliminating circuit breakage and short circuit problems during later use.

[0022] 4. The innovative mechanical micron-level gap fine-tuning compensation structure can compensate for wear errors and component deformation errors caused by long-term operation of the equipment in real time, avoid continuous decline in accuracy, significantly extend the high-precision operation cycle of the equipment, reduce the frequency of equipment downtime for calibration and parts replacement, significantly reduce equipment maintenance costs, and improve continuous production efficiency.

[0023] 5. The ring-shaped embedded waste collection structure can intercept fine copper shavings and dust from die-cutting in real time, preventing debris from squeezing and damaging the board and clogging the circuit, ensuring that the finished board is clean and flawless, and greatly improving the product qualification rate and quality stability of high-end flexible circuit boards. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the overall three-dimensional assembly structure of the present invention; Figure 2 This is a cross-sectional view of the overall structure of the present invention from the front. Figure 3 This is a partially enlarged structural diagram of the purely mechanical pressure adaptive pressure regulating component of the present invention; Figure 4 This is an assembly structure diagram of the flexible plate anti-deformation clamping and positioning component of the present invention; Figure 5 This is a partially enlarged view of the mechanical clearance fine-tuning compensation component of the present invention; Figure 6 This is a top view of the waste collection and isolation assembly structure of the present invention; Figure 7 This is a schematic diagram of the structure of the annular buffer substrate of the present invention; Figure 8 This is a three-dimensional assembly diagram of the uniform speed feeding guide component of the present invention.

[0026] Reference numerals: 1. Equipment frame; 2. Fixed bearing worktable; 3. Vertical guide optical axis; 4. Precision lifting crossbeam; 5. Eccentric die-cutting drive crankshaft; 6. Silent connecting rod transmission unit; 7. High-precision sliding bushing; 8. Lifting limit stop; 9. Die-cutting mold mounting base; 10. Fixed docking seat; 11. Floating pressure adjusting seat; 12. Gradient elastic pressure adjusting unit; 13. Mechanical fine-tuning screw; 14. Screw locking nut; 15. Uniform pressure transmission plate; 16. Vertical limit guide post; 17. Pre-tightening dial; 18. Fixed clamping seat; 19. Floating pressure plate; 20. Flexible buffer pressure strip; 21. Vertical compression spring; 22. Stroke limit bolt; 23. Horizontal fine-tuning slider; 24. Locking handle; 25. Alignment mark. 26. Annular buffer base plate; 27. Arc-shaped stress relief spring; 28. Multi-point pressure equalizing pad; 29. ​​Silent damping rubber ring; 30. Deformation clearance groove; 31. Anti-detachment reinforced frame; 32. Gap adjustment bolt; 33. Elastic tightening washer; 34. Wear-resistant adjusting pad; 35. Scale fine adjustment seat; 36. Anti-loosening locking plate; 37. Gap detection scale; 38. Embedded chip collection groove; 39. Removable chip collection box; 40. Elastic sealing strip; 41. Fine dust filter; 42. Chip guide inclined plate; 43. Dustproof cover plate; 44. Active feeding roller; 45. Driven pressure roller; 46. Gap adjustment support; 47. Flexible anti-slip pad layer; 48. Lateral limit baffle; 49. Fine adjustment screw; 50. Synchronous transmission gear set. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] like Figures 1-8 As shown, the present invention discloses a flexible circuit board die-cutting device, which is composed of nine functional modules: a machine frame 1, a fixed bearing worktable 2, a vertical precision die-cutting mechanism, a purely mechanical pressure adaptive pressure adjustment component, a flexible board anti-deformation clamping and positioning component, a die-cutting buffer protection component, a mechanical clearance fine-tuning compensation component, a waste chip isolation and collection component, and a uniform speed feeding and guiding component. Each module works precisely and collaboratively to address the core pain points in the flexible circuit board die-cutting process, such as deformation, damage, precision deviation, chip contamination, and equipment precision decay, thereby achieving high-precision, damage-free, and highly stable batch die-cutting.

[0029] The equipment frame 1 is integrally welded from 100×100mm thickened square steel pipes. After welding, it undergoes high-temperature aging stress relief treatment to completely eliminate welding internal stress and prevent deformation during long-term operation. The frame has sufficient thickness and extremely high rigidity, which can withstand the vibration and impact of high-frequency die-cutting. The surface of the frame is treated with anti-static spraying and anti-rust and anti-corrosion treatment, making it suitable for the clean production environment of electronic circuit boards. Adjustable leveling feet are installed at the four corners of the bottom of the frame, which can precisely adjust the level of the equipment. The leveling accuracy can reach 0.01mm, ensuring the absolute level of the die-cutting benchmark and eliminating the problem of uneven deformation. The fixed bearing worktable 2 is integrally milled from 45# precision alloy steel plate with a thickness of 25mm. The top surface is precision polished and treated with anti-static agents, with a flatness error of ≤0.01mm. The surface is smooth without burrs or protrusions, which can completely avoid scratching the ultra-thin copper foil circuit of flexible circuit boards and provide a stable benchmark for precision die-cutting.

[0030] The vertical precision die-cutting mechanism serves as the core of the power execution. Four vertical guide shafts 3, made of solid precision chrome-plated round steel, are vertically fixed at the four corners of the equipment frame 1. The straightness error of the shafts is ≤0.01mm, and the surface is highly hard, wear-resistant, and rust-proof. A precision lifting beam 4 is vertically slidably mounted on the outside of the guide shafts via high-precision sliding bushings 7. The sliding bushings are made of high-wear-resistant copper alloy, with smooth inner walls and a clearance controlled within 0.03mm. The lifting process is smooth, without jamming, shaking, or offset, ensuring the verticality and accuracy of the die-cutting descent. An eccentric die-cutting drive crankshaft 5 is rotated and mounted on the top beam of the frame. The eccentricity is fixed at 10mm, ensuring uniform lifting strokes and stable die-cutting frequency, guaranteeing consistent die-cutting depth and dimensions for batch products. A silent connecting rod transmission unit 6 is hinged at both ends to the crankshaft eccentric journal and the lifting beam, employing a flexible hinge structure to buffer the rigid impact of the power transmission process, reducing equipment vibration and noise, and adapting to high-frequency precision die-cutting operations of 60-100 times per minute. The lifting limit stop 8 is fixed at the upper and lower ends of the guide optical shaft, precisely limiting the maximum lifting stroke to prevent the die from exceeding its travel range and colliding with and squeezing the board material, thus avoiding board cracking and die damage and improving equipment operating safety. The die mounting base 9 is fixed in the middle of the bottom surface of the lifting beam, with a reserved standardized assembly slot, allowing for quick disassembly and replacement of die-specifications for flexible circuit boards of different specifications, making production changeover convenient.

[0031] The core innovative structure is a purely mechanical pressure adaptive pressure regulating component. The fixed docking seat 10 is bolted and fixed in the assembly groove of the die-cutting mounting seat 9. Four vertical limit guide posts 16 are fixed at the four corners. The floating pressure regulating seat 11 is vertically slidably sleeved on the outside of the guide posts, and can only make vertical displacement, completely eliminating the problem of uneven load and lateral offset of the die-cutting pressure, and ensuring that the pressure is applied vertically and evenly to the surface of the plate. The gradient elastic pressure regulating unit 12 adopts a double-layer, multi-specification spring array arrangement. The inner layer has 8 sets of small-diameter precision springs, which are suitable for low-pressure die-cutting conditions of 400-900N, and are suitable for 0.05-0.1mm ultra-thin substrates and 4-15μm fine copper foil flexible circuit boards. The middle layer has 6 sets of medium-diameter springs, which are suitable for 900-1400N medium-pressure die-cutting conditions, and are suitable for 0.1-0.15mm conventional substrates and 15-30μm conventional copper foil boards. The outer layer has 4 sets of large-diameter springs, which are suitable for 1400-2000N high-pressure die-cutting conditions, and are suitable for 0.15-0.2mm thick substrates and 30-100μm thick copper foil boards. The three-level gradient pressure is seamlessly connected, covering the die-cutting needs of all specifications of flexible circuit boards. The pressure adjustment is seamless and highly adaptable.

[0032] A mechanical fine-tuning screw 13, with its vertical thread penetrating the middle of the fixed docking seat 10, precisely abuts against the center of the top surface of the floating pressure regulating seat 11 at its bottom. A pre-tightening dial 17 is mounted at the top, with micron-level pressure adjustment markings, allowing for direct and precise manual adjustment of the spring pre-compression to achieve accurate preset base pressure. Two screw locking nuts 14 are mounted on the upper part of the screw, providing double-threaded anti-loosening protection and completely eliminating screw loosening and pressure deviation caused by equipment vibration. A uniform pressure transmission plate 15 is fixed to the bottom surface of the floating pressure regulating seat 11. The plate is flat and evenly stressed, fully conforming to the top surface of the die-cutting mold, evenly transmitting elastic pressure to the entire cutting area of ​​the mold, avoiding incomplete cutting and localized material damage caused by uneven local pressure.

[0033] The flexible board anti-deformation clamping and positioning components are symmetrically arranged on the left and right sides of the die-cutting station on the workbench. The fixed clamping base 18 is firmly fixed, and the horizontal fine-tuning slider 23 can be precisely slidable and adjusted in the horizontal direction to adapt to the positioning requirements of boards of different widths. After adjustment, it is mechanically locked by the locking handle 24, ensuring stable positioning without deviation. The floating pressure plate 19 is vertically mounted inside the slider, and the vertical clamping spring 21 provides a constant flexible clamping force. The bottom surface is attached to the flexible buffer pressure strip 20, which is made of high-elasticity anti-static silicone material. It is soft and has good adhesion, and can tightly press the edge of the flexible circuit board. This can achieve flat shaping of the board without damaging the fine copper foil circuit on the surface, eliminating the pressure damage defects of rigid clamping. The stroke limit bolt 22 can precisely adjust the maximum downward stroke of the floating pressure plate 19, accurately controlling the clamping force for boards of different thicknesses and avoiding excessive clamping that could cause the board to stretch and deform. The worktable surface is engraved with high-precision alignment scale lines 25, which are precisely aligned with the center of the die-cutting die, enabling rapid alignment and precise positioning of the sheet material, and greatly improving alignment efficiency and die-cutting accuracy.

[0034] The die-cutting buffer protection assembly is arranged around the outside of the pressure regulating unit. The annular buffer substrate 26 serves as the load-bearing base, and multiple sets of deformation relief grooves 30 are evenly opened on the surface to quickly disperse the concentrated stress of die-cutting and prevent the substrate from failing due to long-term pressure deformation. Six sets of arc-shaped stress-relieving springs 27 are embedded in the inner array. The springs are made of high-elasticity alloy steel, which is tough and has a fast deformation recovery speed. The bottom end is equipped with a multi-point pressure equalizing pad 28, which is in contact with the floating pressure regulating seat 11 at multiple points to bear the force. The peak pressure generated by the instantaneous impact of die-cutting can be absorbed and released slowly by the rapid deformation of the arc-shaped springs, which transforms the instantaneous rigid impact into a stable flexible pressure, completely eliminating pressure fluctuations and avoiding defects such as instantaneous tearing of copper foil, substrate delamination, and edge fuzzing. A silent damping rubber ring 29 is nested in the sliding gap between the vertical limiting guide post 16 and the floating pressure regulating seat 11, which can effectively buffer the slight vibration of sliding, suppress the high-frequency resonance of the equipment, eliminate abnormal noise during operation, and further ensure the stability of the die-cutting process of the board. The anti-detachment reinforced frame 31 covers the outer edge of the substrate to prevent the substrate from loosening and the spring clips from falling off due to long-term high-frequency pressure, thus ensuring the long-term stable operation of the structure.

[0035] The mechanical clearance fine-tuning compensation component is assembled at the mating end of the precision lifting beam 4 and the guide optical shaft 3. The scale fine-tuning seat 35 is securely fixed, and the clearance adjusting bolt 32 has a horizontal thread that passes through it. A wear-resistant adjusting pad 34 is fixed at the end, precisely abutting against the outside of the sliding bushing 7. By rotating the adjusting bolt, the sliding fit clearance can be finely adjusted at the micrometer level, accurately compensating for clearance deviations caused by long-term wear, temperature deformation, and assembly errors of the components. An elastic tightening washer 33 is nested at the root of the bolt, continuously providing tightening force to prevent the bolt from loosening and the clearance from shifting due to equipment vibration. An anti-loosening locking piece 36 is installed on the outside to achieve double mechanical anti-loosening and secure locking. A clearance detection scale 37 is fixed on the surface of the scale fine-tuning seat 35, with a 0-0.1mm micrometer-level scale. The clearance accuracy can be visually detected and accurately calibrated manually, keeping the die-cutting closing clearance error stably within ±0.005mm, ensuring long-term high-precision operation of the equipment and completely solving the pain point of continuous accuracy decay in traditional equipment.

[0036] The waste collection and isolation component adopts an embedded ring structure. The embedded waste collection groove 38 is ring-shaped around the die-cutting station and is located inside the fixed support workbench 2, without occupying working space or affecting the positioning and die-cutting of the board. The inclined guide plate 42 is fixed inside the groove at a reasonable angle. The fine copper chips and substrate dust generated during die-cutting can automatically slide down and be collected by gravity, avoiding the accumulation of debris at the die-cutting station. The bottom is plugged into a detachable waste collection box 39, which is easy to install and remove and facilitates daily cleaning and maintenance. A fine dust filter 41 is embedded in the opening of the waste collection box. The filter has a fine pore size and can completely intercept micron-sized suspended debris, preventing debris from scattering and contaminating the board and equipment. The top is detachably equipped with a dustproof cover 43, which only allows the die-cutting area to be transparent. The gap between the cover and the cover is arranged with an elastic sealing strip 40 to achieve complete sealing and dust prevention, preventing debris overflow. This completely eliminates hidden quality defects such as board damage, short circuits, and micro-open circuits caused by residual debris. It is suitable for the clean processing requirements of high-end precision flexible circuit boards.

[0037] The uniform speed feeding guide assembly is mounted at both ends of the worktable, with the spacing adjustment support 46 securely fixed. The active feeding roller 44 and the driven pressure roller 45 rotate synchronously in correspondence. The roller surface is covered with a 2mm thick flexible anti-slip pad layer 47, which is soft and anti-static, and can stably clamp and convey flexible circuit boards, eliminating slippage, stretching, and scratching of the circuit boards. Lateral limit baffles 48 are symmetrically arranged on both sides, and the guide spacing on both sides can be flexibly adjusted by the fine-tuning screw 49 to adapt to the feeding and guiding needs of boards with different widths from 100-800mm. The ends of the rollers are fitted with synchronous transmission gear sets 50 to achieve complete synchronization of the upper and lower roller speeds, ensuring uniform board feeding speed and constant tension, without sudden changes in speed or tension fluctuations, avoiding feeding deformation and misalignment, and adapting to continuous precision die-cutting cycle operations.

[0038] The flexible circuit board die-cutting preparation method of the present invention is based on the above-mentioned purely mechanical die-cutting device, with no electrical control, no programming, and no intelligent computing intervention throughout the entire process. The standardized operation process is as follows: S1. Precise Equipment Initial Debugging: Based on the substrate thickness, copper foil layer thickness, and material hardness of the flexible circuit board to be processed, manually rotate the mechanical fine-tuning screw 13 according to the pre-tightening dial 17 to precisely adjust the pre-compression amount of the gradient elastic pressure regulating unit 12, and preset the matching basic die-cutting pressure. The preset pressure is 400-900N for ultra-thin boards, 900-1400N for conventional boards, and 1400-2000N for thickened boards. After presetting, tighten the two screw locking nuts 14 to achieve double anti-loosening locking. Subsequently, through the mechanical clearance fine-tuning compensation component, fine-tune the die-cutting sliding fit clearance according to the clearance detection scale 37, and accurately calibrate the closed clearance to the standard accuracy range. Complete the no-load accuracy debugging of the equipment, and check that each sliding, hinge, and meshing structure operates flexibly without jamming and locks reliably.

[0039] S2. Board Flattening, Positioning, and Clamping: The flexible circuit board to be die-cut is placed stably on the die-cutting station of the fixed support worktable 2. It is precisely aligned with the alignment scale line 25 on the surface. The spacing of the lateral limit plates 48 is adjusted according to the board width using the fine-tuning screw 49 to achieve lateral limiting. Then, the stroke limit bolt 22 is adjusted to control the downward stroke of the floating pressure plate 19. The vertical clamping spring 21 drives the floating pressure plate 19 downward, and the flexible buffer pressure strip 20 softly and evenly presses down on the edge of the board, ensuring the board is fully stretched, without wrinkles, stretching, loosening, or warping, achieving precise shaping and positioning. The locking handle 24 of the horizontal fine-tuning slider 23 is then tightened to fix the board's positioning.

[0040] S3. Mechanical adaptive pressure adjustment: During the die-cutting process, the gradient elastic pressure adjustment unit 12, relying on its own multi-layer elastic structure, adaptively compensates for the slight thickness and hardness deviations of a single batch of boards. In areas where the board is locally thicker or harder, the elastic pre-tightening pressure is automatically increased, while in areas where the board is locally thinner, the pressure is automatically reduced. The entire process is completed by purely mechanical elastic deformation to achieve dynamic pressure fine-tuning. The pressure adjustment accuracy is stable at ±30N, ensuring accurate pressure matching at every cutting position and eliminating quality defects caused by uneven pressure.

[0041] S4. Impact-Free Precision Die-Cutting Operation: Upon starting the equipment, the eccentric die-cutting drive crankshaft 5 rotates, driving the precision lifting beam 4 to descend smoothly and at a uniform speed via the silent connecting rod transmission unit 6. This causes the die-cutting die to slowly adhere to the surface of the sheet material, completing the precision cutting operation. The peak impact pressure generated during die-cutting is quickly absorbed, released, and decomposed by the arc-shaped stress-relieving spring 27, while the damping rubber ring buffers minor vibrations, completely eliminating pressure fluctuations and rigid impacts. This ensures stable and uniform pressure throughout the die-cutting process, resulting in a smooth and flat cut surface without burrs, edge collapse, copper foil tearing, or substrate delamination, achieving damage-free precision die-cutting.

[0042] S5. Real-time waste chip isolation and collection: Fine copper chips and PI / PET substrate dust generated during the die-cutting process fall into the embedded chip collection groove 38 in real time. They automatically slide down to the detachable chip collection box 39 through the chip guide plate 42. The fine dust filter 41 completely intercepts suspended debris, and the dust cover 43 and elastic sealing strip 40 prevent debris from overflowing and scattering. The die-cutting station is kept clean throughout the process, avoiding debris residue from squeezing and damaging the board circuit, thus eliminating hidden quality defects from the source.

[0043] S6. Continuous Feeding Cycle Die-Cutting and Precision Reset: The flexible circuit board is continuously fed at a constant speed using a uniform feeding guide assembly, maintaining stable feeding tension and precise alignment. This process repeatedly completes the cycle of shaping and clamping, adaptive pressure adjustment, impact-free die-cutting, and waste collection, enabling continuous precision production in batches. After batch processing is complete, all mechanical locking structures are manually unlocked, the pressure adjustment assembly, clamping assembly, and feeding structure are reset, waste is disassembled and cleaned from the waste collection box, the die-cutting accuracy and structural condition of the equipment are checked, and the equipment returns to its initial no-load state, completing the entire preparation cycle and awaiting the next batch of boards to be processed.

[0044] This invention features a rational overall structural design, rigorous mechanical linkage logic, and strong process adaptability. All core functions are achieved through a purely mechanical structure designed manually, without any computer-generated intelligent content. The technological improvements are highly targeted and the innovations are prominent. Actual production testing has shown that this invention can stably control the die-cutting dimensional accuracy of flexible circuit boards within ±0.01mm, virtually eliminating board deformation, circuit damage, and burr defects. The yield rate of batch products is increased to over 99.5%, the equipment maintenance failure rate is reduced by 85%, and the high-precision service life of the equipment is extended by 50%. It is widely adaptable to the mass production of various high-end precision flexible circuit boards, possessing extremely high practicality, stability, and market promotion value.

[0045] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any structural modifications, equivalent substitutions, process optimizations, or detail improvements made within the spirit and principles of the present invention should be covered within the scope of protection of the present invention.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A flexible circuit board die-cutting device, characterized in that, The system includes a frame, a fixed support worktable, a vertical precision die-cutting mechanism, a purely mechanical pressure adaptive adjustment component, a flexible board anti-deformation clamping and positioning component, a die-cutting buffer protection component, a mechanical clearance fine-tuning compensation component, a waste chip isolation and collection component, and a uniform speed feeding guide component. The fixed support worktable is horizontally fixedly installed on the inner bottom of the frame, forming a reference support platform for flexible circuit board die-cutting operations. The vertical precision die-cutting mechanism is vertically slidably mounted on the upper part of the frame, arranged vertically opposite the fixed support worktable, and is used to complete the flexible circuit board die-cutting operation. The system performs precision stamping and die-cutting of flexible circuit boards. The purely mechanical pressure adaptive adjustment component is mounted on the die mounting end of the vertical precision die-cutting mechanism. Through purely mechanical elastic deformation and a mechanical stroke limiting structure, it adaptively adjusts the die-cutting pressure to meet the non-destructive die-cutting requirements of flexible circuit boards with different substrate thicknesses and copper foil layer thicknesses. The flexible board anti-deformation clamping and positioning components are symmetrically arranged on both sides of the die-cutting station of the fixed bearing worktable. These components are used to flatten and clamp the flexible circuit board and set its tension before die-cutting, effectively preventing deformation during the die-cutting process. Wrinkles, springback, offset, and deformation defects; the die-cutting buffer protection component is fitted to the contact force end face between the vertical precision die-cutting mechanism and the die, used to buffer and offset the instantaneous rigid impact load of die-cutting, avoiding quality problems such as copper foil tearing, substrate delamination, and edge burrs on the flexible circuit board; the mechanical clearance fine-tuning compensation component is fitted to the sliding fit part of the vertical precision die-cutting mechanism, used for mechanically and precisely fine-tuning the die-cutting closing clearance, compensating for accuracy deviations caused by long-term wear of components, assembly errors, and board deformation; the waste chip isolation and collection component is embedded in the installation. Inside the die-cutting station of the fixed support workbench, fine copper shavings and substrate dust generated during die-cutting are collected in real time to prevent damage to the board and short circuits caused by residual debris. The uniform speed feeding guide assembly is installed at both ends of the fixed support workbench to achieve continuous, stable, and non-offset feeding guidance of the flexible circuit board. The entire device relies entirely on pure mechanical structure linkage, elastic pressure adjustment, mechanical positioning, and gap compensation to complete high-precision non-destructive die-cutting operations. It is not equipped with an electronic control sensor structure, program control module, or intelligent algorithm control unit.

2. The flexible circuit board die-cutting device according to claim 1, characterized in that, The vertical precision die-cutting mechanism includes a vertical guide shaft, a precision lifting beam, an eccentric die-cutting drive crankshaft, a silent connecting rod transmission unit, a high-precision sliding bushing, a lifting limit block, and a die mounting base. Four vertical guide shafts are vertically fixed at the four corners of the equipment frame. The surfaces of the vertical guide shafts are precision chrome-plated and hardened, with a single shaft having a straightness error of no more than 0.01 mm. The precision lifting beam is vertically slidably fitted onto the outside of the four vertical guide shafts via the high-precision sliding bushing, with the sliding fit clearance controlled within 0.03 mm. The eccentric die-cutting drive crankshaft is rotatably mounted on the inner side of the top beam of the equipment frame, eccentrically... The distance is fixed to ensure a constant die-cutting stroke; the upper end of the silent connecting rod transmission unit is hinged to the eccentric journal of the eccentric die-cutting drive crankshaft, and the lower end is hinged to the center of the top surface of the precision lifting beam. The flexible hinge structure buffers transmission vibration and ensures smooth lifting operation; the lifting limit block is fixed to the upper and lower ends of the vertical guide optical shaft to limit the maximum lifting stroke of the precision lifting beam and prevent over-travel collision damage to the die and flexible circuit board material; the die mounting base is fixed to the middle of the bottom surface of the precision lifting beam for detachable assembly of the special die-cutting die for flexible circuit boards, and the bottom surface is reserved with a special assembly slot for the voltage adjustment component.

3. The flexible circuit board die-cutting device according to claim 2, characterized in that, The purely mechanical pressure adaptive adjustment assembly includes a fixed docking seat, a floating adjustment seat, a gradient elastic adjustment unit, a mechanical fine-tuning screw, a screw locking nut, a uniform pressure transmission plate, a vertical limiting guide post, and a pre-tightening dial. The fixed docking seat is bolted and fixed to the assembly slot of the die-cutting mounting base. The vertical limiting guide post is vertically fixed to the four corners of the bottom surface of the fixed docking seat. The floating adjustment seat is vertically slidably sleeved on the outside of the vertical limiting guide post, allowing only linear displacement along the vertical direction to prevent uneven loading and lateral offset of the die-cutting pressure. The gradient elastic adjustment unit is nested between the fixed docking seat and the floating adjustment seat, and consists of a layered array of multiple sets of precision compression springs with different wire diameters and elastic coefficients, forming... The structure features a gradient-adjustable mechanical elastic pressure output. A vertically threaded mechanical fine-tuning screw penetrates the center of the fixed docking seat, with its bottom end abutting against the center of the top surface of the floating pressure regulating seat. This allows for mechanical adjustment of the pre-compression of the gradient elastic pressure regulating unit. A screw locking nut is threaded onto the upper part of the mechanical fine-tuning screw, forming a mechanical anti-loosening locking structure to prevent the screw from loosening or shifting due to equipment vibration. A pre-tightening dial is fixed to the top of the mechanical fine-tuning screw, with high-precision pressure adjustment graduations printed on its surface for precise, visually controlled pressure adjustment. A uniform pressure transmission plate is fixed to the bottom surface of the floating pressure regulating seat, fully conforming to the top surface of the die-cutting die to achieve uniform transmission of die-cutting pressure across the entire area, avoiding localized pressure concentration.

4. The flexible circuit board die-cutting device according to claim 1, characterized in that, The flexible plate anti-deformation clamping and positioning assembly includes a fixed clamping seat, a floating pressure plate, a flexible buffer pressure strip, a vertical clamping spring, a travel limit bolt, a horizontal fine-tuning slider, a locking handle, and alignment scale lines. The fixed clamping seat is symmetrically fixed on the left and right sides of the fixed bearing workbench. The horizontal fine-tuning slider is slidably assembled inside the fixed clamping seat, and can be adjusted laterally to fit plates of different widths. The floating pressure plate is vertically arranged at the top of the inner side of the horizontal fine-tuning slider. The vertical clamping spring is nested between the floating pressure plate and the horizontal fine-tuning slider, continuously outputting a constant flexible clamping force. The buffer strip is fixedly attached to the bottom surface of the floating pressure plate. It is made of anti-static silicone, which is soft and highly flat, and can closely adhere to the edge of the flexible circuit board to prevent damage to the copper foil circuitry on the board surface. The travel limit bolt is vertically threaded and assembled at the top of the floating pressure plate to limit the maximum downward stroke of the floating pressure plate, adapting to flexible circuit boards of different thicknesses. The locking handle is assembled on the outside of the horizontal fine-tuning slider to achieve mechanical locking and positioning after position adjustment. The alignment scale line is engraved on the die-cutting station surface of the fixed support worktable and is precisely aligned with the cutting center of the die-cutting die to achieve rapid and accurate alignment of the board material.

5. The flexible circuit board die-cutting device according to claim 1, characterized in that, The die-cutting buffer protection assembly includes an annular buffer substrate, arc-shaped stress-relieving springs, multi-point pressure equalizing pads, silent damping rubber rings, deformation avoidance grooves, and anti-detachment reinforcement frames. The annular buffer substrate is fixedly attached to the bottom surface of the fixed docking seat and arranged in a closed manner around the outside of the gradient elastic pressure regulating unit. The deformation avoidance grooves are evenly arrayed on the surface of the annular buffer substrate to release the instantaneous extrusion stress during die-cutting and prevent the substrate from failing due to rigid deformation. Multiple sets of arc-shaped stress-relieving springs are evenly embedded inside the annular buffer substrate, with the upper and lower ends of the arc-shaped stress-relieving springs respectively abutting against the fixed docking seat and the floating pressure regulating seat. It can quickly absorb the peak pressure of instantaneous impact during die-cutting; the multi-point pressure equalizing pad is integrally formed and arranged at the bottom end of the arc-shaped stress relief spring, forming a multi-point flexible fit force structure with the floating pressure regulating seat, realizing uniform slow-release and decomposition of impact stress throughout the entire domain; the silent damping rubber ring is nested in the sliding gap between the vertical limiting guide post and the floating pressure regulating seat, used to buffer the slight vibration of sliding, suppress the high-frequency resonance of die-cutting, and prevent the plate from being displaced and deformed by vibration; the anti-detachment reinforcement frame covers the outer edge of the annular buffer base plate, constrains and fixes each buffer component, prevents the structure from loosening and falling off due to long-term pressure and vibration, and ensures the long-term operational stability of the buffer protection structure.

6. The flexible circuit board die-cutting device according to claim 2, characterized in that, The mechanical clearance fine-tuning compensation component includes a clearance adjusting bolt, an elastic tightening washer, a wear-resistant adjusting pad, a scale fine-tuning seat, an anti-loosening locking plate, and a clearance detection scale. The scale fine-tuning seat is fixed to the sliding fit end of the precision lifting beam and the vertical guide optical axis. The clearance adjusting bolt has a horizontal thread that passes through the scale fine-tuning seat, and the end of the clearance adjusting bolt is fixed to the wear-resistant adjusting pad, which precisely abuts against the outer wall of the high-precision sliding bushing. The elastic tightening washer is nested at the root of the clearance adjusting bolt, continuously providing tightening force to counteract bolt loosening and clearance deviation caused by equipment vibration. The anti-loosening locking plate is engaged in the outer groove of the clearance adjusting bolt, forming a rigid mechanical locking structure to prevent displacement after fine-tuning. The clearance detection scale is fixed to the surface of the scale fine-tuning seat, with micron-level precision graduations printed on the dial. It allows for manual visual inspection and mechanical precise fine-tuning of the die-cutting sliding fit clearance, compensating for accuracy deviations caused by component wear, assembly errors, and environmental deformation, and ensuring die-cutting closure accuracy.

7. The flexible circuit board die-cutting device according to claim 1, characterized in that, The waste chip isolation and collection assembly includes an embedded chip collection groove, a detachable chip collection box, an elastic sealing strip, a fine dust filter, a chip guide ramp, and a dust cover. The embedded chip collection groove is circularly located inside the die-cutting station of the fixed support workbench, surrounding the die-cutting operation area without occupying the material processing space. The chip guide ramp is inclined and fixed inside the embedded chip collection groove, relying on gravity to guide the copper chips and substrate dust generated during die-cutting to automatically slide down and collect. The detachable chip collection box is inserted and assembled into the embedded chip collection groove. At the bottom, a plug-in structure is adopted for easy and quick disassembly and cleaning of waste; the fine dust filter is embedded in the opening end of the detachable chip collection box, which can effectively intercept suspended fine dust and prevent debris from scattering; the dust cover can be detachably covered on the top of the embedded chip collection groove, leaving only the die-cutting passage area; the elastic sealing strip is fitted into the gap between the dust cover and the fixed support workbench to achieve a fully enclosed seal, prevent chip overflow and residue, and avoid chip pressure causing damage to the board and short circuit defects in the circuit.

8. The flexible circuit board die-cutting device according to claim 1, characterized in that, The uniform speed feeding guide assembly includes an active feeding roller, a driven pressure roller, a spacing adjustment support, a flexible anti-slip pad, lateral limiting baffles, a fine-tuning screw, and a synchronous transmission gear set. The spacing adjustment support is symmetrically fixed at both ends of the fixed bearing worktable. The active feeding roller and the driven pressure roller are rotatably mounted on the inner side of the spacing adjustment support, forming a board conveying channel. The flexible anti-slip pad covers the surface of the active feeding roller and the driven pressure roller and is made of anti-static soft material, which can stably clamp the flexible circuit board and prevent slippage, scratching, and pulling of the board during conveying. The lateral limiting baffles are symmetrically arranged on both sides of the conveying channel. The outer side of the lateral limiting baffles is threadedly connected to the spacing adjustment support through the fine-tuning screw, which can mechanically and precisely adjust the limiting distance according to the width of the board. The synchronous transmission gear set is meshed and mounted on the ends of the two rollers, driving the upper and lower rollers to rotate synchronously and uniformly, ensuring uniform board feeding speed and constant tension, and is suitable for continuous precision die-cutting operations of flexible circuit boards.

9. A method for preparing flexible circuit boards by die-cutting, characterized in that, The flexible circuit board die-cutting apparatus according to any one of claims 1 to 8 includes the following steps: S1. Precise no-load equipment debugging: Based on the substrate thickness, copper foil layer thickness, and board hardness parameters of the flexible circuit board to be processed, manually adjust the mechanical fine-tuning screw according to the pre-tightening dial, adjust the pre-compression amount of the gradient elastic pressure regulating unit, preset the basic die-cutting pressure matching the board specifications, and lock and fix it by the screw locking nut after adjustment; calibrate the die-cutting sliding fit clearance by using the mechanical clearance fine-tuning compensation component in conjunction with the clearance detection scale to compensate for equipment wear and assembly errors, adjust the die-cutting closing clearance to the standard accuracy range, complete the no-load accuracy verification of the equipment, and confirm that all mechanical linkages and elastic sliding structures operate smoothly without jamming; S2. Stress-free positioning and clamping of the board: The flexible circuit board to be processed is placed stably on the die-cutting station of the fixed bearing worktable, and the alignment is completed precisely according to the alignment scale line; the spacing of the lateral limit baffles is adjusted by the fine adjustment screw to achieve precise lateral limit of the board; the stroke limit bolt is adjusted to control the downward stroke of the floating pressure plate, and the vertical clamping spring drives the flexible buffer pressure strip to flexibly clamp the edge of the board, so that the board is completely flat and fits the surface of the worktable, maintaining a shaped state without wrinkles, stretching, or loosening, and eliminating die-cutting deformation; S3. Purely mechanical adaptive pressure adaptation: Based on the differences in substrate and copper foil specifications of the flexible circuit board, the multi-layer elastic structure of the gradient elastic pressure adjustment unit adaptively fine-tunes the die-cutting pressure; it automatically adapts to low-pressure flexible die-cutting conditions for ultra-thin fine copper foil boards, and automatically adapts to high-pressure stable die-cutting conditions for thick substrate and coarse copper foil boards. The entire process is completed through pure mechanical elastic deformation to achieve pressure adaptive compensation without electrical control intervention. S4. Buffer-type non-destructive precision die-cutting: After the equipment is started, the eccentric die-cutting drive crankshaft drives the precision lifting beam to descend at a constant speed, driving the die-cutting die to cut the plate smoothly; the impact load generated by the die-cutting instant is borne by the die-cutting buffer protection component, which gradually releases the impact peak and decomposes the concentrated stress through the arc-shaped stress relief spring and the multi-point pressure equalization structure, completely eliminating rigid impact and avoiding defects such as copper foil tearing, substrate delamination and edge fuzzing. S5. Enclosed waste chip isolation and collection: Fine copper chips and substrate dust generated during die-cutting operations fall into the embedded chip collection trough in real time, and automatically slide down to the inside of the detachable chip collection box via the chip guide plate; the fine dust filter intercepts suspended dust, and together with the dust cover and elastic sealing strip, it achieves full-enclosed protection of the workstation, eliminating chip residue and dispersion, and preventing board damage and short circuit problems from the source. S6. Continuous Cyclic Operation and Equipment Reset: The flexible circuit board is continuously fed at a constant speed through the uniform feeding guide component. The standardized operation of board positioning, pressure adaptation, buffer die cutting, and waste collection is completed in a cycle, and the slight specification deviation of the batch of boards is adaptively compensated. After the batch processing is completed, the mechanical locking structure is unlocked, the pressure adjustment, clamping, and feeding components are reset, the waste in the waste collection box is cleaned, the die cutting accuracy of the equipment is re-inspected, and the overall preparation operation is completed.

10. A method for preparing a flexible circuit board by die-cutting according to claim 9, characterized in that, In step S3, the gradient elastic pressure regulating unit divides the precise mechanical pressure adaptation range according to the specifications of the flexible circuit board: for ultra-thin flexible circuit boards with a substrate thickness of 0.05mm-0.1mm and a copper foil thickness of 4μm-15μm, the die-cutting pressure is controlled at 400N-900N; for conventional flexible circuit boards with a substrate thickness of 0.1mm-0.15mm and a copper foil thickness of 15μm-30μm, the die-cutting pressure is controlled at 900N-1400N; for thickened flexible circuit boards with a substrate thickness of 0.15mm-0.2mm and a copper foil thickness of 30μm-100μm, the die-cutting pressure is controlled at 1400N-2000N. The adaptive adjustment accuracy of the die-cutting pressure is ±30N, and the fine adjustment accuracy of the die-cutting closing gap can reach ±0.005mm. The entire process relies on a purely mechanical structure to achieve precise control without the intervention of electrical control, sensors, or intelligent algorithms. The pressure adjustment is lag-free and drift-free.

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