MGP full-automatic plastic packaging molding press

Abstract

The application relates to the technical field of plastic packaging die pressing machines, in particular to an MGP full-automatic plastic packaging die pressing machine which comprises a machining table, an outer box and a preheating part arranged at the upper end of the machining table, multiple groups of the preheating part are arranged at intervals in the outer box, a substrate and semiconductor workpieces are placed at the upper end of the preheating part, a suction moving part is arranged on the inner wall of the upper end of the outer box, an upper die part is arranged on the inner wall of the upper end of the outer box, an adjusting assembly is arranged on the inner side of the outer box, cleaning assemblies are arranged at the two ends of the adjusting assembly, a lower die is arranged at the upper end of the machining table, and two groups of dust suction parts are arranged on the lower die; a cavity is arranged on the upper end of the lower die. The adjusting assembly and the cleaning assembly are arranged, the cleaning efficiency is improved, the dead angle problem caused by airflow turbulence can be avoided, cleaning is not needed, the possibility of damage of the semiconductor workpieces is obviously reduced, the dead angle which cannot be blown by airflow can be covered through reverse rotation of the second communication plate, the cleaning effect is improved, and the invalid airflow energy consumption is reduced.

Description

Technical Field

[0001] This invention relates to the field of molding press technology, and in particular to an MGP fully automatic molding press. Background Technology

[0002] Plastic molding machines are a type of mechanical equipment widely used in fields such as electronic manufacturing, semiconductor packaging, and photovoltaic modules. Semiconductor plastic molding is a technology that uses heat and pressure to inject molding materials such as epoxy resin into a mold and cure them to protect the chip and wire bonding.

[0003] For example, Chinese Patent No. CN218557785U discloses a cleaning mechanism for a laminator, which includes a sixth frame, a sixth cleaning device, and a sixth driving device; wherein the sixth frame is connected to the corresponding laminator body; the sixth cleaning device is connected to the sixth frame and is used to clean the mold platform of the laminator body; the sixth driving device connects the sixth cleaning device to the sixth frame and drives the sixth cleaning device to move back and forth relative to the mold platform, with the straight line in the direction of movement of the sixth cleaning device as the sixth straight line.

[0004] The aforementioned device achieves cleaning of the cavity through the arrangement of brushes and dust collection components. However, in the process of encapsulating semiconductor workpieces, both the semiconductor workpiece and the cavity need to be cleaned before feeding and injection molding. Since semiconductor workpieces are relatively fragile, cleaning them with brushes can easily damage the workpieces. Furthermore, brushes are not only difficult to cover multiple dead corners in the cavity, resulting in poor cleaning effect, but the brush bristles are also prone to breakage, leading to additional residues. The residual debris will affect the subsequent encapsulation molding process, resulting in poor encapsulation effect. Summary of the Invention

[0005] The purpose of this invention is to solve the problem that cleaning with a brush in the prior art is prone to damaging the workpiece and leaving residue, resulting in poor plastic encapsulation effect on semiconductor workpieces. Therefore, an MGP fully automatic plastic encapsulation molding machine is proposed.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an MGP fully automatic molding press, comprising a processing table and an outer box and a preheating section disposed on the upper part of the processing table, wherein multiple sets of preheating sections are spaced apart inside the outer box, the substrate and semiconductor workpiece are placed on the upper part of the preheating section, an adsorption moving section is disposed on the inner wall of the upper part of the outer box, an upper mold section is disposed on the inner wall of the upper part of the outer box, an adjustment component is disposed on the inner side of the outer box, a cleaning component is disposed through both ends of the adjustment component, a lower mold and two sets of dust suction sections are disposed on the upper part of the processing table, and the lower mold is spaced between the two sides of the adjustment component and the two sets of dust suction sections, and a cavity is opened at the upper end of the lower mold; The cleaning assembly includes two sets of second and third electric telescopic rods fixedly connected at intervals to the upper end of the processing table. The upper ends of the two sets of second electric telescopic rods are detachably and fixedly connected to a first rack, and the two sets of third electric telescopic rods are detachably and fixedly connected to a second rack. The teeth of the second rack are segmented. A connecting component is provided through the adjusting assembly. One end of the connecting component is connected to the first rack, and the other end of the connecting component is provided with a communicating component. One end of the communicating component is in contact with the second rack. Multiple sets of rotating cleaning components are provided through the outer surface of the communicating component. Each of the multiple sets of rotating cleaning components is provided with a scraping component at its end.

[0007] Preferably, the adjustment assembly includes two sets of linear slides fixedly connected to the inner walls on both sides of the outer casing. A transmission plate is fixedly connected to each of the two sets of linear slides. A first electric telescopic rod is fixedly connected through the upper end of each of the two sets of transmission plates. A mounting housing is fixedly connected to the lower end of each of the two sets of first electric telescopic rods. A connecting component and a connecting part pass through both ends of the mounting housing.

[0008] Preferably, the connecting component includes a connecting rod that is rotatably connected to the mounting housing and a transmission disk that is fixedly connected to one end of the connecting rod. One end of the transmission disk is embedded and rotatably connected to a transmission rod, and one end of the transmission rod is fixedly connected to a second gear, which meshes with the lower surface of the first rack.

[0009] Preferably, a rotating block is fixedly connected to one end of the transmission rod, and a clearance groove is provided inside the transmission disc to allow the rotating block to rotate 30 degrees.

[0010] Preferably, the connecting component includes an outer air pipe fixedly connected to one end of the connecting rod, an inner air pipe fixedly connected inside the outer air pipe, one end of the inner air pipe passing through the outer air pipe and fixedly connected to a connecting shaft, the connecting shaft passing through and rotatably connected to one end of the mounting housing and fixedly connected to a first gear, and the first gear meshing with the upper end of a second rack.

[0011] Preferably, the outer surface of the end of the inner air pipe extending out of the outer air pipe is rotatably and sealed with a second sealing sleeve, and the inner air pipe and the second sealing sleeve are internally connected. The outer surface of the second sealing sleeve is fixedly and through-connected with a first connecting pipe, which is fixedly and through-connected to the mounting housing. One end of the first connecting pipe is connected to an external air supply structure. The end of the outer air pipe away from the first gear is rotatably and sealed with a first sealing sleeve. The outer surface of the first sealing sleeve is fixedly and through-connected with a second connecting pipe, which is fixedly and through-connected to the mounting housing. One end of the second connecting pipe is connected to an external air extraction and dust removal structure.

[0012] Preferably, the rotating cleaning components are arranged in eight groups at intervals, of which the four longer groups are fixedly connected to the external air pipe and the internal air pipe, and the four shorter groups are fixedly connected to the external air pipe only, and the rotating cleaning components of different lengths are arranged alternately.

[0013] Preferably, the rotating cleaning component includes a first connecting plate that is embedded and fixedly connected to the outer surface of the external air pipe. A connecting sleeve is fixedly connected to one end of the first connecting plate, and a second connecting plate is fixedly connected to one end of the connecting sleeve. The external air pipe, the first connecting plate, the connecting sleeve, and the second connecting plate are all internally connected. A push rod is rotatably connected to the inner wall of the mounting housing through an elastic connector, and the push rod is set on the rotation trajectory of the second connecting plate. The push rod can only rotate counterclockwise.

[0014] Preferably, connecting strips are rotatably connected to both sides of the first connecting plate, and a sliding rod is fixedly connected to one end of the connecting strip. The sliding rod is engaged and slidably connected to one side of the second connecting plate. A fixed housing is fixedly connected to the upper end of the first connecting plate, and multiple sets of fixed housings are arranged at intervals. Multiple sets of elastic ropes are fixedly connected inside each set of fixed housings. One end of each set of elastic ropes is fixedly connected to the upper end of the second connecting plate, and one end of each set of fixed housings is in contact with the upper end of the second connecting plate.

[0015] Preferably, the scraping component includes a cleaning strip and an air pump that are detachably and fixedly connected to the outer surface of one side of the second connecting plate. One end of the cleaning strip extends out of the edge of the second connecting plate and is suspended in the air. An air bag is embedded and fixedly connected to one side of the cleaning strip. The air bag and the air pump are connected through a one-way tube, and the air in the one-way tube flows from the air pump to the air bag. A pressure detector is fixedly installed on the side of the cleaning strip that contacts the second connecting plate.

[0016] Compared with existing technologies, the advantages of this invention are: 1. This invention achieves dynamic airflow circulation through the setting of adjustment components, connecting parts, and rotating cleaning parts, and through the staggered arrangement of multiple sets of first connecting plates. The directional blowing of the first connecting plates can blow away the floating dust on the semiconductor workpiece. At this time, the adjacent first connecting plates can quickly suck away the floating dust, forming a local negative pressure environment. By rotating the outer air pipe and the inner air pipe, the angle of air outlet and dust suction can be changed. Compared with traditional unidirectional blowing or static dust removal, this synergistic effect not only improves the cleaning efficiency, but also avoids the dead angle problem caused by airflow turbulence. Cleaning can be performed without contact, which significantly reduces the possibility of damage to semiconductor workpieces. 2. By rotating the cleaning components and the push rod, the present invention adopts a cleaning mode of overall counterclockwise rotation and intermittent clockwise rotation during the cleaning process. This causes the second connecting plate to blow in the opposite direction of movement. Due to the high complexity of the semiconductor structure, the reverse rotation of the second connecting plate can cover the dead corners that the airflow cannot reach during the circular rotation. There is no need to set up other blowing structures, which reduces the space required for the equipment. This not only improves the cleaning effect, but also reduces the ineffective airflow energy consumption. 3. This invention, through the adjustment of the components and the cleaning components, enables switching between two modes: wind-powered cleaning and integrated wind-powered scraping cleaning, by raising and lowering the rotating cleaning component. When the scraping component moves, it can adapt to changes in the slope of the cavity through deformation, scraping away any solidified residue that may remain inside the cavity. At this time, the adhesion between the solidified residue and the inner wall of the cavity is weak, allowing the solidified residue to loosen. Compared with a brush, the scraping component can not only adapt to cavities with different slopes, but also does not generate debris that interferes with the molding process. At the same time, the continuous blowing and suction through the eight sets of first connecting plates can clean both solidified residue and floating dust. The dual-mode cleaning of blowing and suction while scraping improves cleaning efficiency and effect, thereby improving the efficiency of molding semiconductor workpieces. Furthermore, by adjusting the height of the scraping component, it can adapt to different usage scenarios of cavity cleaning and semiconductor workpiece cleaning, improving the applicability of the device. 4. This invention, through the arrangement of the push rod, scraping component, and suction unit, not only scrapes off and removes the adhering substances on the surface of the cleaning strip, but also transmits vibration to the outer and inner air pipes, achieving self-cleaning of the cleaning strip during use and preventing clogging of the outer and inner air pipes. Through the squeezing of the push rod, the wear of the strip can also be monitored and, in conjunction with the micro-pumping of the air pump, self-compensation for the wear of the cleaning strip can be achieved, ensuring good contact between the cleaning strip and the cavity of the lower mold, thereby improving the cleaning effect, extending the service life of the cleaning strip, reducing the frequency of manual maintenance, and improving the overall processing efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of an MGP fully automatic molding press proposed in this invention; Figure 2 This is a top view of the processing table, outer casing, preheating section, and adsorption moving section of an MGP fully automatic molding press proposed in this invention; Figure 3 This is a schematic diagram of the internal structure of the outer casing of an MGP fully automatic molding press proposed in this invention; Figure 4 This is a side view of the internal structure of the outer casing of an MGP fully automatic molding press proposed in this invention; Figure 5 This is a schematic diagram of the adjustment and cleaning components of an MGP fully automatic molding press proposed in this invention; Figure 6 This is a cross-sectional view of the adjustment and cleaning components of an MGP fully automatic molding press proposed in this invention; Figure 7 This is a schematic diagram of the connecting component and rotating cleaning component of an MGP fully automatic molding press proposed in this invention; Figure 8 This is a cross-sectional view of the connecting and linking components of an MGP fully automatic molding press proposed in this invention; Figure 9 For this Figure 8 Enlarged detail image of point A in the middle; Figure 10 This is a schematic diagram of the transmission disc, transmission rod, and rotating block structure of an MGP fully automatic molding press proposed in this invention; Figure 11 This is a cross-sectional view of the external air pipe, internal air pipe, rotating cleaning component, and scraping component of an MGP fully automatic molding press proposed in this invention; Figure 12 This is a structural breakdown diagram of the rotating cleaning component of an MGP fully automatic molding press proposed in this invention; Figure 13 This is a cross-sectional view of the second connecting plate and scraping component of an MGP fully automatic molding press proposed in this invention.

[0018] In the diagram: 1. Processing table; 2. Outer casing; 3. Preheating section; 4. Adsorption moving section; 5. Upper mold section; 6. Lower mold; 7. Adjustment assembly; 71. Linear slide; 72. Transmission plate; 73. First electric telescopic rod; 74. Mounting housing; 8. Cleaning assembly; 81. Second electric telescopic rod; 82. First rack; 83. Third electric telescopic rod; 84. Second rack; 85. Connecting component; 851. External air pipe; 852. First sealing sleeve; 853. Internal air pipe; 854. Second sealing sleeve; 855. First connecting pipe; 856. First gear; 85 7. Second connecting pipe; 86. Rotating cleaning component; 861. First connecting plate; 862. Connecting sleeve; 863. Second connecting plate; 864. Fixed housing; 865. Elastic rope; 866. Connecting strip; 867. Sliding rod; 87. Connecting component; 871. Connecting rod; 872. Transmission disc; 873. Transmission rod; 874. Second gear; 875. Rotating block; 876. Relief groove; 88. Push rod; 89. Scraping component; 891. Cleaning strip; 892. Air pump; 893. Airbag; 894. Pressure detector; 9. Vacuuming unit. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0020] like Figures 1-13As shown, an MGP fully automatic molding press includes a processing table 1, an outer casing 2 and a preheating section 3 disposed on the upper end of the processing table 1, and multiple sets of preheating sections 3 are spaced apart inside the outer casing 2. The substrate and semiconductor workpiece are placed on the upper end of the preheating section 3. An adsorption moving part 4 is disposed on the upper inner wall of the outer casing 2, an upper mold part 5 is disposed on the upper inner wall of the outer casing 2, an adjustment component 7 is disposed on the inner side of the outer casing 2, and cleaning components 8 are disposed through both ends of the adjustment component 7. A lower mold 6 and two sets of dust suction parts 9 are disposed on the upper end of the processing table 1, and the lower mold 6 is spaced apart between the two sides of the adjustment component 7 and the two sets of dust suction parts 9. A cavity is opened at the upper end of the lower mold 6. It should be noted that the movement of the substrate and semiconductor workpiece by the adsorption moving part 4, the preheating by the preheating section 3, the continuous dust suction by the dust suction parts 9, and the mold closing and opening by the upper mold part 5 and the lower mold 6 are all known prior art. Those skilled in the art are able to conceive of the specific structure. The adjustment component 7 is used to adjust the height and angle of the cleaning component 8, and the cleaning component 8 is used to clean the cavity and semiconductor workpiece under different conditions. The cleaning component 8 includes two sets of second electric telescopic rods 81 and a third electric telescopic rod 83 fixedly connected at intervals to the upper end of the processing table 1. A first rack 82 is detachably and fixedly connected to the upper end of each of the two sets of second electric telescopic rods 81, and a second rack 84 is detachably and fixedly connected to each of the two sets of third electric telescopic rods 83. The teeth of the second rack 84 are segmented. A connecting component 87 is provided through the adjusting component 7, with one end of the connecting component 87 connected to the first rack 82 and the other end of the connecting component 87 provided with a communicating component 85, one end of which contacts the second rack 84. Multiple sets of rotating cleaning components 86 are provided through the outer surface of the connecting component 85. Each set of rotating cleaning components 86 has a scraping component 89 at its end. The second electric telescopic rod 81 and the third electric telescopic rod 83 are used to adjust the height of the first rack 82 and the second rack 84, respectively, so as to adapt to different cleaning modes. The second rack 84 and the first rack 82 can be replaced. The connecting component 85 is used to supply gas flow and drive the rotation. The rotating cleaning components 86 are used to allow air to enter and exit and to contact the cleaning. The connecting component 87 is used for transmission. The scraping component 89 is used to clean the cavity of the lower mold 6.

[0021] The adjustment assembly 7 includes two sets of linear slides 71 fixedly connected to the inner walls of both sides of the outer casing 2. A transmission plate 72 is fixedly connected to the slide of each set of linear slides 71. A first electric telescopic rod 73 is fixedly connected to the upper end of each set of transmission plates 72. A mounting housing 74 is fixedly connected to the lower end of each set of first electric telescopic rods 73. A connecting component 85 and a connecting component 87 pass through both ends of the mounting housing 74. It should be noted that the horizontal linear movement of the transmission plate 72 by the two sets of linear slides 71 is a known prior art. Those skilled in the art are capable of conceiving of the specific structure. The two sets of first electric telescopic rods 73 are used to adjust the height of the mounting housing 74, thereby adjusting the height of the connecting component 85 and the connecting component 87. When the transmission plate 72 moves, it can drive the connecting component 85 and the connecting component 87 to move through the first electric telescopic rod 73 and the mounting housing 74.

[0022] The connecting component 87 includes a connecting rod 871 that is rotatably connected to the mounting housing 74 and a transmission disk 872 that is fixedly connected to one end of the connecting rod 871. One end of the transmission disk 872 is embedded and rotatably connected to a transmission rod 873. One end of the transmission rod 873 is fixedly connected to a second gear 874, and the second gear 874 is meshed with the lower surface of the first rack 82. When the mounting housing 74 moves, it can drive the second gear 874 to roll on the lower surface of the first rack 82, thereby enabling the second gear 874 to rotate, which in turn causes the transmission rod 873 to rotate.

[0023] One end of the transmission rod 873 is fixedly connected to a rotating block 875. The transmission disk 872 has a clearance groove 876 inside, which allows the rotating block 875 to rotate 30 degrees. When the second gear 874 rotates, it will drive the transmission rod 873 and the rotating block 875 to rotate as well. When the rotating block 875 rotates to the side of the clearance groove 876, the rotating block 875 will push the transmission disk 872 to rotate together, thereby causing the connecting rod 871 to rotate as well.

[0024] The connecting component 85 includes an outer air pipe 851 fixedly connected to one end of the connecting rod 871. An inner air pipe 853 is fixedly connected inside the outer air pipe 851. One end of the inner air pipe 853 passes through the outer air pipe 851 and is fixedly connected to a connecting shaft. The connecting shaft is rotatably connected to one end of the mounting housing 74 and is fixedly connected to a first gear 856. The first gear 856 meshes with the upper end of a second rack 84. As the mounting housing 74 continues to move, driven by the second gear 874, the connecting rod 871 and the outer air pipe 851... The inner air pipe 853 and the first gear 856 both move to the right in a straight line while rotating counterclockwise. When the first gear 856 moves to the toothed area above the second rack 84, the first gear 856 will rotate clockwise, thereby driving the outer air pipe 851 and the inner air pipe 853 to rotate clockwise. At this time, the rotating block 875 rotates inside the relief groove 876 to avoid rotational conflict, so that the outer air pipe 851 and the inner air pipe 853 can rotate counterclockwise as a whole and intermittently rotate clockwise while moving to the right.

[0025] The outer surface of the inner air pipe 853 extending out of the outer air pipe 851 is sealed and rotatably connected to a second sealing sleeve 854, and the inner air pipe 853 and the second sealing sleeve 854 are connected internally. The outer surface of the second sealing sleeve 854 is fixedly connected to a first connecting pipe 855, which is fixedly connected to the mounting housing 74. One end of the first connecting pipe 855 is connected to an external gas transmission structure, and external gas can enter the inner air pipe 853 through the first connecting pipe 855.

[0026] The end of the external air pipe 851 away from the first gear 856 is sealed and rotatably connected to the first sealing sleeve 852. The outer surface of the first sealing sleeve 852 is fixedly connected to the second connecting pipe 857. The second connecting pipe 857 is fixedly connected to the mounting housing 74. One end of the second connecting pipe 857 is connected to the external air extraction and dust removal structure. The gas between the external air pipe 851 and the inner air pipe 853 can flow to the external air extraction and dust removal structure through the second connecting pipe 857.

[0027] Eight sets of rotating cleaning components 86 are arranged at intervals. The four longer sets are fixedly connected to the outer air pipe 851 and the inner air pipe 853, while the four shorter sets are fixedly connected only to the outer air pipe 851. The rotating cleaning components 86 of different lengths are arranged alternately. The rotating cleaning components 86 connected to both the outer air pipe 851 and the inner air pipe 853 are used for air outlet, while the rotating cleaning components 86 connected only to the outer air pipe 851 are used for air inlet. The alternating arrangement allows the gas flow direction in adjacent rotating cleaning components 86 to be different.

[0028] The rotating cleaning component 86 includes a first connecting plate 861 that is embedded and fixedly connected to the outer surface of the external air pipe 851. A connecting sleeve 862 is fixedly connected to one end of the first connecting plate 861, and a second connecting plate 863 is fixedly connected to one end of the connecting sleeve 862. The external air pipe 851, the first connecting plate 861, the connecting sleeve 862, and the second connecting plate 863 are all internally connected. A push rod 88 is rotatably connected to the inner wall of the mounting housing 74 via an elastic connector. The push rod 88 is positioned on the rotation trajectory of the second connecting plate 863 and can only rotate counterclockwise. Air containing impurities can pass through the first connecting plate 861. The connecting sleeve 862 and the second connecting plate 863 are inserted between the outer air pipe 851 and the inner air pipe 853. The angle of the second connecting plate 863 can be changed by the setting of the connecting sleeve 862. The push rod 88 is used to push the second connecting plate 863 to change its angle. It should be noted that the rotation direction of the push rod 88 is controlled by the elastic connector and the push rod 88 is reset after rotation. This is a known prior art. Those skilled in the art can conceive of the specific structure. Since the push rod 88 can rotate counterclockwise, the push rod 88 will not block the resetting of the connecting part 85 and the rotating cleaning part 86.

[0029] Both sides of the first connecting plate 861 are rotatably connected to connecting strips 866. One end of each connecting strip 866 is fixedly connected to a sliding rod 867, which engages and slides with one side of the second connecting plate 863. A fixed housing 864 is fixedly connected to the upper end of the first connecting plate 861, and multiple sets of fixed housings 864 are spaced apart. Multiple sets of elastic ropes 865 are fixedly connected inside each set of fixed housings 864. One end of each set of elastic ropes 865 is fixedly connected to the upper end of the second connecting plate 863, and one end of each set of fixed housings 864 contacts the upper end of the second connecting plate 863. The fixed housing 864 is used to limit the rotation direction of the second connecting plate 863. The multiple sets of elastic ropes 865 can pull the second connecting plate 863 to prevent it from rotating, and the connecting strips 866 and sliding rods 867 can limit the rotation range of the second connecting plate 863. The scraping component 89 includes a cleaning strip 891 and an air pump 892 that are detachably and fixedly connected to the outer surface of one side of the second connecting plate 863. One end of the cleaning strip 891 extends out of the edge of the second connecting plate 863 and is suspended in the air. An air bladder 893 is embedded and fixedly connected to one side of the cleaning strip 891. The air bladder 893 and the air pump 892 are connected by a one-way tube, and air in the one-way tube flows from the air pump 892 to the air bladder 893. A pressure detector 894 is fixedly installed on the side of the cleaning strip 891 that contacts the second connecting plate 863. The cleaning strip 891 is used to scrape off the solidified residue in the cavity of the lower mold 6. The air pump 892 can send air into the air bladder 893 to make it expand. The expansion of the air bladder 893 can compensate for the wear of the cleaning strip 891 after long-term use.

[0030] In this invention, during the molding process of semiconductor workpieces, the adsorption moving part 4 can move the semiconductor workpiece and substrate to the upper end of the lower mold 6. When cleaning of the semiconductor workpiece is required, the linear slide 71 causes the mounting housing 74 and cleaning assembly 8 to move linearly above the lower mold 6. At this time, the cleaning strip 891 does not contact the semiconductor workpiece. Driven by the second gear 874 and the first gear 856, the external air pipe 851 and the internal air pipe 853 move to the right while rotating counterclockwise as a whole, and intermittently rotating clockwise. During this process, the external cleaning gas can be blown toward the semiconductor workpiece through the four sets of first connecting plates 861, which can blow the floating dust on the semiconductor workpiece into the surrounding air. At the same time, the external suction dust removal structure The system can extract air through four additional sets of first connecting plates 861, which can quickly remove floating dust from the surrounding air. Compared with the unidirectional airflow of the prior art, the staggered arrangement of multiple sets of first connecting plates 861 achieves dynamic airflow circulation. The directional blowing of the first connecting plate 861 can blow away the floating dust on the semiconductor workpiece. At this time, the adjacent first connecting plates 861 can quickly suck away the floating dust, forming a local negative pressure environment. By rotating the outer air pipe 851 and the inner air pipe 853, the angle of air outlet and dust suction can be changed. Compared with traditional unidirectional blowing or static dust removal, this synergistic effect not only improves cleaning efficiency, but also avoids dead angle problems caused by airflow turbulence. Cleaning can be performed without contact, which significantly reduces the possibility of damage to semiconductor workpieces. During the cleaning process, when the second connecting plate 863 rotates to the position of the push rod 88, the push rod 88 will squeeze the cleaning strip 891. The push rod 88 can make the second connecting plate 863 rotate, thereby making the second connecting plate 863 blow in the opposite direction of the moving direction. At this time, the air outlet direction of the second connecting plate 863 is blowing to the left, which can blow to the places that cannot be reached when rotating in a ring, thus expanding the cleaning range. As the external air pipe 851 continues to rotate counterclockwise, when the second connecting plate 863 passes the push rod 88, it can be reset under the pull of multiple sets of elastic ropes 865. Due to the high complexity of the semiconductor structure, the reverse rotation of the second connecting plate 863 can cover the dead corners that the airflow cannot reach when rotating in a ring, eliminating the need for other blowing structures, reducing the space required for the equipment, improving the cleaning effect and reducing ineffective airflow energy consumption. After the molding process is completed, the processed workpiece is unloaded by the adsorption moving part 4. Then, the connecting part 85, the rotating cleaning part 86 and the connecting part 87 are all moved downward by the first electric telescopic rod 73. At the same time, the first rack 82 and the second rack 84 move synchronously with the second gear 874 and the first gear 856, so that the edge of the cleaning strip 891 is embedded in the cavity of the lower mold 6. Since the cavity where the substrate is placed is relatively flat, when the cleaning strip 891 moves, the cleaning strip 891 can adapt to the slope change of the cavity by deformation, which can scrape away any solidified residue that may remain in the cavity, so that the solidified residue is loosened. Compared with a brush, the cleaning strip 891 can not only adapt to the cavity with different slopes and generate debris that interferes with the molding process, but also continuously blow and suck through the eight sets of first connecting plates 861, which can clean the solidified residue and floating dust. The dual-mode cleaning of blowing and sucking while scraping improves the cleaning efficiency and effect, thereby improving the efficiency of molding semiconductor workpieces. After cleaning, the cleaning assembly 8 is reset. At this time, both the connecting component 85 and the rotating cleaning component 86 are located above the suction unit 9. The linear slide 71 causes the connecting component 85 and the rotating cleaning component 86 to move back and forth linearly. During this time, the push rod 88 will continuously rotate back and forth. When the second connecting plate 863 and the cleaning strip 891 scrape against the surface of the push rod 88 multiple times, the impurities adhering to the surface of the cleaning strip 891 can be scraped off. The impurities can be removed by the suction unit 9 and the first connecting plate 861, realizing the self-cleaning of the cleaning strip 891 without stopping the machine for manual cleaning, thus improving processing efficiency. When the through plate 863 contacts the push rod 88, an impact occurs, and the vibration is transmitted to the outer air tube 851 and the inner air tube 853. This promotes the removal of dust adhering to the inner wall of the cavity between the outer air tube 851 and the inner air tube 853, reducing the possibility of blockage during long-term use. When the suspended end of the cleaning strip 891 scrapes across the push rod 88, the end of the cleaning strip 891 bends and passes over the push rod 88. During this process, the cleaning strip 891 squeezes the pressure detector 894. The change in force on the cleaning strip 891 can be determined by the detection result of the pressure detector 894. When the cleaning strip 891 is used for a long time... When the cleaning strip 891 wears out after use, the deformation required to pass the push rod 88 decreases, resulting in a smaller force and reading on the pressure detector 894. At this time, air is pumped into the airbag 893 by the air pump 892, causing the airbag 893 to slightly inflate. This lifts the upper part of the cleaning strip 891, compensating for the wear. The deformation is detected each time the cleaning strip 891 passes the push rod 88. Multiple small-volume air injections by the air pump 892 into the airbag 893 adjust the deformation to a preset range. The combination of the push rod 88 and the scraping component 89 not only lifts the cleaning strip 891 but also... The surface of the cleaning strip 891 is scraped off and sucked away, and the vibration is also transmitted to the outer air pipe 851 and the inner air pipe 853. This achieves self-cleaning of the cleaning strip 891 during use and prevents blockage of the outer air pipe 851 and the inner air pipe 853. By squeezing the push rod 88, the wear of the strip can be monitored and, in conjunction with the micro-pumping of the air pump 892, the wear of the cleaning strip 891 can be self-compensated. This ensures good contact between the cleaning strip 891 and the cavity of the lower mold 6, thereby improving the cleaning effect, extending the service life of the cleaning strip 891, reducing the frequency of manual maintenance, and improving the overall processing efficiency.

[0031] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An MGP fully automatic molding press, comprising a processing table (1) and an outer casing (2) and a preheating section (3) disposed on the upper end of the processing table (1), wherein the preheating section (3) is provided in multiple sets at intervals inside the outer casing (2), a substrate and a semiconductor workpiece are placed on the upper end of the preheating section (3), and an adsorption moving section (4) is provided on the inner wall of the upper end of the outer casing (2), characterized in that, The upper inner wall of the outer box (2) is provided with an upper mold part (5), the inner side of the outer box (2) is provided with an adjustment component (7), the two ends of the adjustment component (7) are provided with a cleaning component (8), the upper end of the processing table (1) is provided with a lower mold (6) and two sets of dust suction parts (9), and the lower mold (6) is spaced between the two sides of the adjustment component (7) and the two sets of dust suction parts (9), and the upper end of the lower mold (6) is provided with a cavity; The cleaning component (8) includes two sets of second electric telescopic rods (81) and a third electric telescopic rod (83) fixedly connected at intervals to the upper end of the processing table (1). The upper ends of the two sets of second electric telescopic rods (81) are detachably fixedly connected to a first rack (82), and the two sets of third electric telescopic rods (83) are detachably fixedly connected to a second rack (84). The teeth of the second rack (84) are segmented. A connecting component (87) is provided through the adjusting component (7). One end of the connecting component (87) is connected to the first rack (82), and the other end of the connecting component (87) is provided with a connecting component (85). One end of the connecting component (85) is in contact with the second rack (84). Multiple sets of rotating cleaning components (86) are provided through the outer surface of the connecting component (85). Each end of the multiple sets of rotating cleaning components (86) is provided with a scraping component (89).

2. The MGP fully automatic molding press according to claim 1, characterized in that, The adjustment assembly (7) includes two sets of linear slides (71) fixedly connected to the inner walls on both sides of the outer casing (2). A transmission plate (72) is fixedly connected to each of the two sets of linear slides (71). A first electric telescopic rod (73) is fixedly connected to the upper end of each of the two sets of transmission plates (72). A mounting housing (74) is fixedly connected to the lower end of each of the two sets of first electric telescopic rods (73). A connecting component (85) and a connecting component (87) pass through both ends of the mounting housing (74).

3. The MGP fully automatic molding press according to claim 2, characterized in that, The connecting component (87) includes a connecting rod (871) that is rotatably connected to the mounting housing (74) and a transmission disk (872) that is fixedly connected to one end of the connecting rod (871). One end of the transmission disk (872) is embedded and rotatably connected to a transmission rod (873). One end of the transmission rod (873) is fixedly connected to a second gear (874), and the second gear (874) meshes with the lower surface of the first rack (82).

4. The MGP fully automatic molding press according to claim 3, characterized in that, One end of the transmission rod (873) is fixedly connected to a rotating block (875), and the transmission disc (872) has a clearance groove (876) inside which the rotating block (875) can rotate thirty degrees.

5. The MGP fully automatic molding press according to claim 3, characterized in that, The connecting component (85) includes an outer air pipe (851) fixedly connected to one end of the connecting rod (871), an inner air pipe (853) fixedly connected inside the outer air pipe (851), one end of the inner air pipe (853) passing through the outer air pipe (851) and fixedly connected to a connecting shaft, the connecting shaft passing through and rotatably connected to one end of the mounting housing (74) and fixedly connected to a first gear (856), the first gear (856) meshing with the upper end of the second rack (84).

6. The MGP fully automatic molding press according to claim 5, characterized in that, The inner air pipe (853) extends out of the outer air pipe (851) and is rotatably connected to a second sealing sleeve (854). The inner air pipe (853) and the second sealing sleeve (854) are internally connected. The outer surface of the second sealing sleeve (854) is fixedly connected to a first connecting pipe (855). The first connecting pipe (855) is fixedly connected to the mounting housing (74). One end of the first connecting pipe (855) is connected to an external air supply structure. The end of the outer air pipe (851) away from the first gear (856) is rotatably connected to a first sealing sleeve (852). The outer surface of the first sealing sleeve (852) is fixedly connected to a second connecting pipe (857). The second connecting pipe (857) is fixedly connected to the mounting housing (74). One end of the second connecting pipe (857) is connected to an external air extraction and dust removal structure.

7. The MGP fully automatic molding press according to claim 6, characterized in that, The rotating cleaning components (86) are arranged in eight groups at intervals. The four groups with longer lengths are fixedly connected to the outer air pipe (851) and the inner air pipe (853), while the four groups with shorter lengths are fixedly connected to the outer air pipe (851) only. The rotating cleaning components (86) with different lengths are arranged alternately.

8. The MGP fully automatic molding press according to claim 5, characterized in that, The rotating cleaning component (86) includes a first connecting plate (861) that is embedded and fixedly connected to the outer surface of the external air pipe (851). A connecting sleeve (862) is fixedly connected to one end of the first connecting plate (861), and a second connecting plate (863) is fixedly connected to one end of the connecting sleeve (862). The external air pipe (851), the first connecting plate (861), the connecting sleeve (862), and the second connecting plate (863) are all connected internally. A push rod (88) is rotatably connected to the inner wall of the mounting housing (74) through an elastic connector. The push rod (88) is set on the rotation trajectory of the second connecting plate (863), and the push rod (88) can only rotate counterclockwise.

9. The MGP fully automatic molding press according to claim 8, characterized in that, Both sides of the first connecting plate (861) are rotatably connected with connecting strips (866), and one end of the connecting strip (866) is fixedly connected with a sliding rod (867). The sliding rod (867) is engaged and slidably connected with one side of the second connecting plate (863). The upper end of the first connecting plate (861) is fixedly connected with a fixed housing (864), and multiple sets of fixed housings (864) are arranged at intervals. Multiple sets of elastic ropes (865) are fixedly connected inside the multiple sets of fixed housings (864). One end of the multiple sets of elastic ropes (865) is fixedly connected to the upper end of the second connecting plate (863), and one end of the multiple sets of fixed housings (864) is in contact with the upper end of the second connecting plate (863).

10. The MGP fully automatic molding press according to claim 8, characterized in that, The scraping component (89) includes a cleaning strip (891) and an air pump (892) that are detachably and fixedly connected to the outer surface of one side of the second connecting plate (863). One end of the cleaning strip (891) extends out of the edge of the second connecting plate (863) and is suspended in the air. An airbag (893) is embedded and fixedly connected to one side of the cleaning strip (891). The airbag (893) and the air pump (892) are connected through a one-way tube, and the air in the one-way tube flows from the air pump (892) to the airbag (893). A pressure detector (894) is fixedly installed on the side of the cleaning strip (891) that contacts the second connecting plate (863).

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