A method for bonding a substrate to a heating plate based on glue height limit

Abstract

The application discloses a kind of based on glue height limit electrostatic chuck substrate and heating plate laminating method, belong to electrostatic chuck technical field, comprising: step S1: substrate pretreatment respectively clean the laminating surface of electrostatic chuck base and the laminating surface of heating plate;Step S2: positioning glue point layout is coated with several UV glue glue points on the laminating surface of electrostatic chuck base;Step S3: glue point pressing is shaped two height limit blocks of demand height are placed near any glue point, and UV glue glue point is pressed using glass plate;Step S4: UV glue glue point pre-solidification is irradiated with ultraviolet light to the UV glue glue point of all pressing completion;Step S5: bonding glue is coated with glue screen to be placed on the laminating surface of electrostatic chuck base with UV glue glue point height limiting, then laminating glue is poured on screen, and back and forth is coated using doctor blade;Step S6: heating plate laminating pressing is placed on the laminating surface of electrostatic chuck base using heating plate laminating surface alignment, and overall pressing is carried out.

Description

Technical Field

[0001] This invention relates to the field of electrostatic chuck technology, and in particular to a method for bonding an electrostatic chuck substrate and a heating plate based on an adhesive height limit. Background Technology

[0002] The base of the electrostatic chuck and the heating plate are bonded together with adhesive to form a single unit. The quality of this bonding directly determines the flatness, adhesion reliability, and heat conduction uniformity of the electrostatic chuck. Currently, the industry commonly uses a process of directly bonding the chuck after applying adhesive, which easily leads to problems such as uneven adhesive thickness, localized insufficient adhesive, adhesive overflow at the edges, and internal air bubbles, resulting in poor ESC flatness and uneven heat conduction. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a bonding method between an electrostatic chuck substrate and a heating plate based on the adhesive height limit, which can improve the uniformity of adhesive layer thickness, and improve bonding strength and product yield.

[0004] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows:

[0005] A method for bonding an electrostatic chuck substrate to a heating plate based on adhesive height limitation, wherein the adhesive height limitation method includes:

[0006] Step S1: Substrate Pretreatment

[0007] Clean the bonding surfaces of the electrostatic chuck base and the heating plate separately, then blow them off with an air gun to ensure that the bonding surfaces are clean and dry. Complete the subsequent glue dispensing operation within 30 minutes after cleaning.

[0008] Step S2: Positioning Adhesive Dots

[0009] A UV adhesive with the same thermal conductivity as the bonding adhesive was selected as the height limiting material, and several UV adhesive dots were applied to the bonding surface of the electrostatic chuck substrate.

[0010] Step S3: Adhesive dot pressing and shaping

[0011] Place two height-limiting blocks of the required height near any adhesive dot. Use a glass plate to press the UV adhesive dot, ensuring that the bottom surface of the glass plate is in contact with the two height-limiting blocks during the pressing process. Press the UV adhesive dot until it is equal to the height of the height-limiting blocks. Repeat the above steps until all other UV adhesive dots are pressed until they are equal to the height of the height-limiting blocks.

[0012] Step S4: UV adhesive dots pre-curing

[0013] All pressed UV adhesive dots are cured by UV irradiation to ensure complete curing. The hardness and height of the cured adhesive dots no longer change, serving as a rigid limiting reference for subsequent bonding adhesives.

[0014] Step S5: Apply bonding adhesive

[0015] Place the glue-applied screen on the bonding surface of the electrostatic chuck base with UV glue dots for height limitation, then pour the bonding adhesive onto the screen and use a scraper to brush back and forth to ensure that the bonding adhesive is evenly spread on the electrostatic chuck base.

[0016] Step S6: Heating plate bonding and pressing

[0017] Place the heating plate, with its bonding surface aligned, onto the bonding surface of the electrostatic chuck base and press them together. During pressing, the bonding surface of the heating plate simultaneously contacts the bonding adhesive and UV adhesive dots. The cured UV adhesive dots provide support and limit the maximum height of the overall adhesive layer. Once the adhesive is fully cured, the bonding operation between the electrostatic chuck base and the heating plate is complete.

[0018] Preferably, in step S2, the plurality of UV adhesive dots include a UV adhesive dot disposed at the center point of the bonding surface of the electrostatic chuck substrate and a plurality of rings of UV adhesive dots evenly arranged along the circumference, wherein the center of the plurality of rings of UV adhesive dots coincides with the center point of the bonding surface of the electrostatic chuck substrate.

[0019] Preferably, in step S4, the illuminance of the ultraviolet light source used for ultraviolet light curing is 800–1200 mW / cm². 2 Irradiation time is 3-8 seconds.

[0020] The above technical solution has the following beneficial effects:

[0021] The height of the adhesive layer is precisely controllable, and the uniformity is greatly improved. By using highly uniform cured UV adhesive dots as limiting supports, the height error of the adhesive layer can be controlled within ±0.01mm, which completely solves the problems of uneven adhesive layer thickness and local over-height / under-height in traditional processes, and significantly improves the flatness and parallelism of the product.

[0022] No additional accessories are required, simplifying the process flow, eliminating the traditional metal / plastic gasket / rubber ring limiting method, reducing the types of materials and manual operation, shortening product processing time, and reducing production line management costs and material loss;

[0023] Stable thermal conductivity and improved product quality: UV adhesive with the same thermal conductivity as the bonding adhesive is used to make the limiting adhesive dots, which has little impact on the thermal conductivity of the product. At the same time, the uniform thickness of the adhesive layer makes the heat dissipation of the heating plate more uniform, avoiding local overcooling / overheating, improving product yield, and improving the stability of the electrostatic chuck operation.

[0024] It is highly adaptable and compatible with existing production lines. The overall process is based on conventional dispensing, pressing, and UV curing equipment, without the need to modify existing production equipment. The process parameters are easy to adjust and can be quickly adapted to different styles of electrostatic chuck products. It is highly versatile and easy to implement in mass production. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the UV adhesive dot arrangement of the present invention;

[0026] Figure 2 This is a cross-sectional structural diagram of the UV adhesive dots with height limitation for this invention;

[0027] Figure 3 This is a cross-sectional view of the electrostatic chuck substrate and the heating plate of the present invention. Detailed Implementation

[0028] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings. It should be noted that these descriptions are for the purpose of aiding understanding the present invention, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0029] refer to Figures 1-3 A method for bonding an electrostatic chuck substrate to a heating plate 5 based on adhesive height limitation, the adhesive height limitation method specifically includes the following steps:

[0030] Step S1: Substrate Pretreatment

[0031] Use isopropyl alcohol (IPA) to clean the bonding surfaces of the electrostatic chuck base 1 and the heating plate 5 to remove dust, oil, and impurities. Then use an air gun to blow away the bonding surfaces of both to ensure that the bonding surfaces are clean and dry. Complete the subsequent glue dispensing operation within 30 minutes after cleaning.

[0032] Step S2: Placement of positioning adhesive dots (for height-restricted foundation work)

[0033] UV adhesive with the same thermal conductivity as bonding adhesive 6 is selected as the height limiting material. Several UV adhesive dots 2 are applied to the bonding surface of the electrostatic chuck base 1 using a syringe. The UV adhesive dots 2 are evenly distributed according to a rule. By controlling the amount of UV adhesive, the amount and diameter of each dot are basically the same.

[0034] Step S3: Adhesive dot pressing and shaping (limiting the reference height)

[0035] Place two height-limiting blocks 3 of the required height near any adhesive dot. Use a transparent glass plate 4 to press the UV adhesive dot 2. During the pressing process, make the bottom surface of the glass plate 4 adhere to the two height-limiting blocks 3. Press the UV adhesive dot 2 until it is equal to the height of the height-limiting blocks 3. Repeat the above steps until all other UV adhesive dots 2 are pressed until they are equal to the height of the height-limiting blocks 3.

[0036] Specifically, two height-limiting blocks 3 with the required height are placed near any adhesive dot. The two height-limiting blocks 3 can be set symmetrically or relative to the UV adhesive dot 2 to better support the transparent glass plate 4 and press the UV adhesive dot 2 to the same height as the height-limiting block 3. The height of the height-limiting block 3 limits the height of the UV adhesive dot 2 after curing, and the thickness of the adhesive used for bonding is limited according to its cured height.

[0037] Step S4: UV adhesive dots 2 pre-curing

[0038] All UV adhesive dots 2 that have been pressed are cured by UV light irradiation, so that the pressed UV adhesive dots 2 are completely cured and the hardness and height of the cured adhesive dots no longer change, serving as a rigid limiting reference for subsequent bonding adhesive 6.

[0039] The height of the adhesive layer is precisely controllable, and the uniformity is greatly improved. By using highly uniform cured UV adhesive dots 2 as limiting supports, the height error of the adhesive layer can be controlled within ±0.01mm, which completely solves the problems of uneven adhesive layer thickness and local over-high / under-high in traditional processes, and significantly improves the flatness and parallelism of the product.

[0040] Step S5: Apply bonding adhesive

[0041] Place the glue-applied screen on the bonding surface of the electrostatic chuck base 1 with UV glue dots 2 for height limitation, then pour the bonding adhesive 6 onto the screen and use a scraper to brush it back and forth to ensure that the bonding adhesive 6 is evenly spread on the electrostatic chuck base 1 before lifting the screen upwards.

[0042] Step S6: Press and bond heating plate 5 together

[0043] Place the heating plate 5, with its mating surface aligned, onto the mating surface of the electrostatic chuck base 1. Use a constant temperature pressing device to perform overall pressing, with the pressing pressure and temperature executed according to the product standard process parameters. During pressing, the mating surface of the heating plate 5 simultaneously contacts the bonding adhesive 6 and the UV adhesive dots 2. The cured UV adhesive dots 2, which are evenly distributed according to rules, provide support and limit the maximum height of the overall adhesive layer. Once the adhesive is completely cured, the mating operation between the electrostatic chuck base 1 and the heating plate 5 is completed.

[0044] The above method is used to bond the electrostatic chuck base 1 and the heating plate 5 without the need for additional accessories, simplifying the process flow, eliminating the traditional metal / plastic gasket / rubber ring limiting method, reducing the types of materials and manual operation, shortening the product processing time, and reducing production line management costs and material loss.

[0045] Furthermore, the prepared electrostatic chuck has stable thermal conductivity and improved product quality. The use of UV adhesive with the same thermal conductivity as the bonding adhesive 6 to make the limiting adhesive points has little impact on the product's thermal conductivity. At the same time, the uniform thickness of the adhesive layer makes the heat dissipation of the heating plate 5 more uniform, avoiding local overcooling / overheating, improving product yield, and enhancing the operational stability of the electrostatic chuck.

[0046] It is highly adaptable and compatible with existing production lines. The overall process is based on conventional dispensing, pressing, and UV curing equipment, without the need to modify existing production equipment. The process parameters are easy to adjust and can be quickly adapted to different styles of electrostatic chuck products. It is highly versatile and easy to implement in mass production.

[0047] In some embodiments, in step S2, the plurality of UV adhesive dots 2 include UV adhesive dots 2 disposed at the center point of the bonding surface of the electrostatic chuck substrate 1 and a plurality of circles of UV adhesive dots 2 evenly arranged along the circumferential direction, wherein the center of the plurality of circles of UV adhesive dots 2 coincides with the center point of the bonding surface of the electrostatic chuck substrate 1.

[0048] Specifically, the bonding surface of the electrostatic chuck base 1 is circular, and the bonding surface of the heating plate 5 can also be circular. UV adhesive dots 2 are arranged on the circular bonding surface of the electrostatic chuck base 1, including UV adhesive dots 2 set in the center and several rings of UV adhesive dots 2 evenly arranged along the circumference. The specific number of rings can be determined according to the radius of the electrostatic chuck base 1, including at least the UV adhesive dots 2 at the center, the outermost ring of UV adhesive dots 2, and the ring of UV adhesive dots 2 between the center and the outermost edge. Specifically, each ring of UV adhesive dots 2 can be evenly arranged at a circumferential angle.

[0049] In some embodiments, in step S4, the illuminance of the ultraviolet light source used for ultraviolet light curing is 800–1200 mW / cm². 2 The irradiation time is 3–8 seconds; specifically, the illuminance of the UV light source used for UV curing is 800 mW / cm². 2 Or 1200mW / cm 2 It can also be 1000mW / cm 2 The irradiation time is 3 to 8 seconds. The duration of ultraviolet light irradiation is 3 seconds or 8 seconds, or it can be 5 seconds.

[0050] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and these variations still fall within the protection scope of the present invention.

Claims

1. A method for bonding an electrostatic chuck substrate to a heating plate based on an adhesive height limit, characterized in that, The adhesive height limiting method includes: Step S1: Substrate Pretreatment Clean the bonding surfaces of the electrostatic chuck base and the heating plate separately, then blow them off with an air gun to ensure that the bonding surfaces are clean and dry. Complete the subsequent glue dispensing operation within 30 minutes after cleaning. Step S2: Positioning Adhesive Dots A UV adhesive with the same thermal conductivity as the bonding adhesive was selected as the height limiting material, and several UV adhesive dots were applied to the bonding surface of the electrostatic chuck substrate. Step S3: Adhesive dot pressing and shaping Place two height-limiting blocks of the required height near any adhesive dot. Use a glass plate to press the UV adhesive dot, ensuring that the bottom surface of the glass plate is in contact with the two height-limiting blocks during the pressing process. Press the UV adhesive dot until it is equal to the height of the height-limiting blocks. Repeat the above steps until all other UV adhesive dots are pressed until they are equal to the height of the height-limiting blocks. Step S4: UV adhesive dots pre-curing All pressed UV adhesive dots are cured by UV irradiation to ensure complete curing. The hardness and height of the cured adhesive dots no longer change, serving as a rigid limiting reference for subsequent bonding adhesives. Step S5: Apply bonding adhesive Place the glue-applied screen on the bonding surface of the electrostatic chuck base with UV glue dots for height limitation, then pour the bonding adhesive onto the screen and use a scraper to brush back and forth to ensure that the bonding adhesive is evenly spread on the electrostatic chuck base. Step S6: Heating plate bonding and pressing Place the heating plate, with its bonding surface aligned, onto the bonding surface of the electrostatic chuck base and press them together. During pressing, the bonding surface of the heating plate simultaneously contacts the bonding adhesive and UV adhesive dots. The cured UV adhesive dots provide support and limit the maximum height of the overall adhesive layer. Once the adhesive is fully cured, the bonding operation between the electrostatic chuck base and the heating plate is complete.

2. The bonding method between an electrostatic chuck substrate and a heating plate based on adhesive height limitations according to claim 1, characterized in that, In step S2, the UV adhesive dots include UV adhesive dots set at the center point of the bonding surface of the electrostatic chuck substrate and several rings of UV adhesive dots evenly arranged along the circumference, with the center of the rings of UV adhesive dots coinciding with the center point of the bonding surface of the electrostatic chuck substrate.

3. The bonding method between an electrostatic chuck substrate and a heating plate based on adhesive height limitations according to claim 1, characterized in that, In step S4, the illuminance of the ultraviolet light source used for ultraviolet light curing is 800–1200 mW / cm². 2 Irradiation time is 3-8 seconds.

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