Optoelectronic device marking apparatus and method

Abstract

The application relates to the technical field of optoelectronic manufacturing equipment, in particular to an optoelectronic device marking device and method, which comprises a feeding assembly, a rotating assembly, a marking assembly and a dust removal assembly. The feeding assembly is responsible for conveying the device. The rotating assembly drives the rotating table and the clamping structure clamping device through a rotating motor, clamps the device and realizes 180-degree overturning. The marking assembly marks the device. The dust removal assembly closes the operation area through a control cylinder driving dust removal cavity after marking, blows off dust through a blowing structure and collects the dust through a negative pressure pump. The application can realize automatic double-sided marking of the optoelectronic device, instantly closes and removes dust in the marking process, avoids dust pollution affecting subsequent processing, improves production efficiency and product quality.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic manufacturing equipment technology, and in particular to a marking device and method for optoelectronic devices. Background Technology

[0002] As core components in modern information communication, optoelectronic display, and sensing technologies, the marking process for optoelectronic devices is crucial for product traceability, quality control, and subsequent assembly. In existing optoelectronic device manufacturing processes, the marking process typically uses laser marking machines or pneumatic marking equipment to mark characters or patterns on the device surface. Conventional marking equipment generally includes a conveyor belt for transporting workpieces, a fixture for fixing the workpieces, and a marking head for performing the marking operation. To achieve double-sided marking, existing technologies usually involve manual flipping or a separate secondary loading process. This means that after marking one side, the operator manually removes and flips the device, or a complex robotic arm transfers the device to another station for the second side processing. Simultaneously, to address the fine dust or debris generated during the marking process, existing technologies often employ general ventilation and exhaust systems at the workshop level, or simple dust collection hoods near the marking head, using negative pressure airflow generated by a fan to draw some suspended particles into a collection device.

[0003] However, in the existing technology, due to the lack of integrated automatic flipping and local closed dust removal mechanisms, when performing double-sided continuous processing of optoelectronic devices, not only does it rely on manual intervention or cumbersome transfer processes to reduce production efficiency, but the dust generated by marking is also prone to spread in the open environment and adhere to the device surface or internal precision structure, thereby affecting the subsequent packaging quality or causing a decline in device performance. Summary of the Invention

[0004] The purpose of this invention is to provide a marking device and method for optoelectronic devices, which can solve the technical problems of low automation and easy diffusion of marking dust affecting subsequent processing during double-sided marking of optoelectronic devices.

[0005] The first aspect of this application provides a marking device for optoelectronic devices, including a feeding assembly, a rotating assembly, a marking assembly, and a dust removal assembly. The feeding assembly includes a base, a support platform, and a conveyor line. The support platform is fixed on the base, and the conveyor line is rotatably mounted on the support platform. The rotating assembly includes a rotary motor, a rotary table, and a clamping structure. The rotary table is rotatably mounted on one side of the support platform. The rotary motor drives the rotary table to rotate, and the clamping structure is mounted on the rotary table to clamp the optoelectronic devices fed from the conveyor line. The marking assembly is mounted on one side of the support platform and is used to mark the optoelectronic devices. The dust removal assembly includes a dust removal... The system includes a dust collection chamber, a control cylinder, an air blowing structure, an air duct, a negative pressure pump, and a dust collection box. The dust collection chamber is slidably mounted on one side of the rotating table. The output end of the control cylinder is connected to the dust collection chamber. The air blowing structure is located inside the dust collection chamber and is used to blow air onto the marked optoelectronic devices. The air duct is connected to the dust collection chamber and the negative pressure pump. The dust collection box is connected to the negative pressure pump. After the optoelectronic devices are marked, the control cylinder drives the dust collection chamber to close the rotating table and starts the air blowing structure to blow air onto the marked position to remove dust. The dust is then collected in the dust collection box by the negative pressure pump. Afterward, the rotary motor drives the rotating table to rotate 180° to perform marking and dust removal again.

[0006] The feeding assembly also includes two calibration plate bodies, a second screw, and a second motor. The two calibration plate bodies are slidably arranged on both sides of the conveyor line. The second screw has two opposite threads and is threadedly connected to the two calibration plate bodies. The output end of the second motor is connected to the second screw.

[0007] The clamping structure includes two clamping plates, a clamping screw, and a clamping motor. The two clamping plates are slidably mounted on the rotating table. The clamping screw has two opposite threads and is threadedly connected to the two clamping plates. The output end of the clamping motor is connected to the clamping screw.

[0008] The clamping structure also includes two blocks and a baffle. The two blocks are fixed to the two clamps respectively to prevent subsequent optoelectronic devices from entering when clamping the optoelectronic device. The baffle is set on the rotating table to prevent subsequent optoelectronic devices from entering when rotating.

[0009] The clamping structure also includes a photoelectric sensing unit and a control unit. The photoelectric sensing unit is located on one side of the stop block. The control unit is used to control the conveyor line to stop moving when the photoelectric sensing unit detects that the stop block is in the blocking position, and to control the conveyor line to move when the stop block is detected to be in the open position.

[0010] The marking assembly includes a lifting structure, a marking structure, and a lifting adjustment unit. The lifting structure is slidably mounted on one side of the support platform, the marking structure is mounted on the lifting structure, and the lifting adjustment unit is used to adjust the height of the lifting structure according to the position of the optoelectronic device.

[0011] The dust removal assembly also includes a buffer ring and a return spring. The buffer ring is located between the dust removal chamber and the rotary table, and the return spring is located between the control cylinder and the dust removal chamber.

[0012] The air blowing structure includes a fan, an air outlet pipe, and an adjusting sleeve. The air outlet pipe is fixed to the dust removal chamber, the fan is installed inside the air outlet pipe, and the adjusting sleeve is slidably installed on the air outlet pipe to adjust the distance between the adjusting sleeve and the optoelectronic device according to the position of the optoelectronic device.

[0013] The air blowing structure also includes a locking block, an elastic element, and a handle. The locking block is rotatably mounted on the adjusting sleeve, the elastic element is used to press the locking block onto the air outlet pipe, and the handle is fixed to the locking block.

[0014] The second aspect of this application provides a method for marking optoelectronic devices, which employs an optoelectronic device marking apparatus as described in any of the preceding claims.

[0015] This application provides a marking device and method for optoelectronic devices. This solution integrates a feeding component, a rotating component, a marking component, and a dust removal component to construct a fully automated double-sided marking and cleaning closed-loop system. Specifically, the optoelectronic device is delivered to a designated position via a conveyor line and precisely positioned using a clamping structure on the rotating table. The marking component then performs the marking operation. Following this, a control cylinder drives the dust removal chamber to slide to a closed position, forming a partially sealed space. An air blowing structure is then activated to directionally blow away the marking area, removing the adhering dust from the device surface. Simultaneously, a negative pressure pump draws the dust-laden airflow through an air duct to a dust collection box for centralized treatment, effectively preventing dust spillage. Subsequently, a rotary motor drives the rotating table to rotate 180°, flipping the device to the other side and repeating the marking and dust removal process. The seamless execution of this series of actions enables optoelectronic devices to complete high-quality double-sided marking without human intervention. Dust is isolated and removed in real time throughout the process, effectively solving the problems of low efficiency and dust contamination in traditional double-sided processing that relies on manual flipping. This significantly improves the automation level of the production line, the cleanliness of the working environment, and the yield and consistency of the final product.

[0016] In summary, the technical solution provided in this application is logically sound and structurally complete. Through the synergistic effect of mechanical structure and pneumatic control, it achieves fully automated control of the entire process from material feeding, positioning, double-sided marking to instant dust removal, ensuring the efficiency, environmental friendliness and reliability of the optoelectronic device processing. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0018] Figure 1 A schematic diagram of the overall structure of a marking device for optoelectronic devices provided in this application;

[0019] Figure 2 A left-side structural diagram of a marking device for optoelectronic devices provided in this application;

[0020] Figure 3 The right-side structural diagram of a marking device for optoelectronic devices provided in this application;

[0021] Figure 4 A cross-sectional view of a marking device for optoelectronic devices provided in this application;

[0022] Figure 5 A longitudinal cross-sectional view of a marking device for optoelectronic devices provided in this application;

[0023] Figure 6 yes Figure 5 A magnified view of detail A.

[0024] In the diagram: 1-Base; 2-Support platform; 3-Conveyor line; 4-Rotary motor; 5-Rotating table; 6-Clamping structure; 7-Marking assembly; 8-Dust removal chamber; 9-Control cylinder; 10-Blowing structure; 11-Air duct; 12-Negative pressure pump; 13-Dust collection box; 14-Correction plate body; 15-Second screw; 16-Second motor; 17-Clamping plate; 18-Clamping screw; 19-Clamping motor; 20-Stop block; 21-Baffle; 22-Photoelectric sensor unit; 24-Lifting structure; 25-Marking structure; 26-Lifting adjustment unit; 27-Buffer ring; 28-Reset spring; 29-Fan; 30-Outlet pipe; 31-Adjusting sleeve; 32-Locking block; 33-Elastic element; 34-Handle. Detailed Implementation

[0025] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0026] First embodiment:

[0027] In the manufacturing process of optoelectronic devices, it is usually necessary to mark the surface of the devices to record model, batch, or production information. Existing marking equipment mostly uses fixed stations for single-sided operation. When double-sided marking is required, manual intervention is often needed to flip the devices, which not only reduces production efficiency but also easily leads to device damage or inaccurate positioning due to human error. Furthermore, laser marking or mechanical marking generates fine dust or debris. If not cleaned promptly, these residues can adhere to the device surface, affecting subsequent optical performance testing or packaging quality, and even contaminating delicate internal components. Currently, common dust removal methods are mostly open-type blowing, which allows dust to easily diffuse into the workshop environment, lacking an effective collection mechanism and failing to meet the requirements of a high-cleanliness production environment.

[0028] Based on the above issues, please refer to Figures 1-6 This application provides a marking device for optoelectronic devices, including a feeding assembly, a rotating assembly, a marking assembly 7, and a dust removal assembly. The feeding assembly includes a base 1, a support platform 2, and a conveyor line 3. The support platform 2 is fixed on the base 1, and the conveyor line 3 is rotatably mounted on the support platform 2. The rotating assembly includes a rotary motor 4, a rotary table 5, and a clamping structure 6. The rotary table 5 is rotatably mounted on one side of the support platform 2. The rotary motor 4 drives the rotary table 5 to rotate, and the clamping structure 6 is mounted on the rotary table 5 to clamp the optoelectronic devices fed out from the conveyor line 3. The marking assembly 7 is mounted on one side of the support platform 2 and is used to mark the optoelectronic devices. The dust removal assembly includes a dust removal chamber 8 and a control cylinder 9. The system includes an air blowing structure 10, an air duct 11, a negative pressure pump 12, and a dust collection box 13. The dust removal chamber 8 is slidably mounted on one side of the rotating table 5. The output end of the control cylinder 9 is connected to the dust removal chamber 8. The air blowing structure 10 is located inside the dust removal chamber 8 and is used to blow air onto the marked optoelectronic devices. The air duct 11 is connected to the dust removal chamber 8 and the negative pressure pump 12. The dust collection box 13 is connected to the negative pressure pump 12. After the optoelectronic devices are marked, the control cylinder 9 drives the dust removal chamber 8 to close the rotating table 5 and starts the air blowing structure 10 to blow air onto the marking position to remove dust. The dust is then collected in the dust collection box 13 by the negative pressure pump 12. Afterward, the rotary motor 4 drives the rotating table 5 to rotate 180° to perform marking and dust removal again.

[0029] In this embodiment, the marking component 7 is disposed on one side of the support platform 2 and is used to mark optoelectronic devices. It can be a laser marking machine, inkjet printer, dot matrix marking machine, or chemical etching marking equipment, etc. The mounting position of the marking component 7 can be fixed or movable (e.g., in conjunction with an XYZ axis module), with its working head facing the device processing area on the rotary table 5. The function of the marking component 7 in the system is to perform specific marking operations. By coordinating with the position of the rotary table 5, after marking is completed on the first side of the device, the rotary table 5 is rotated before marking the second side, achieving continuous operation at dual or multiple stations.

[0030] The dust collection chamber 8 is slidably mounted on one side of the rotary table 5. It can be a cover structure with an internal cavity, the shape of which matches the contour of the rotary table 5 to form a relatively sealed space when closed. The sliding fit between the dust collection chamber 8 and the rotary table 5 can be achieved through linear guides, grooves, or guide columns to ensure the accuracy of the movement trajectory. The function of the dust collection chamber 8 is to move to the covering position after marking is completed, sealing the marking area to prevent dust overflow and providing the necessary space environment for internal blowing and suction actions.

[0031] The core innovation of this application lies in the construction of a collaborative system integrating automatic feeding, double-sided flipping marking, and closed negative pressure dust removal. By designing the dust removal chamber 8 as a sliding structure driven by the control cylinder 9, it can flexibly switch between the marking and dust removal processes, ensuring unimpeded marking operation and achieving spatial sealing of the dust removal process. Simultaneously, the rotary motor 4 drives the rotary table 5 to precisely rotate 180°, combined with the stable clamping structure 6, eliminating the uncertainty of manual flipping and fully automating the double-sided marking process.

[0032] The working process and principle of this application are as follows: the optoelectronic device is conveyed to the rotary table 5 via the conveyor line 3, and the clamping structure 6 clamps and fixes the device; then, the marking assembly 7 marks the first side of the device; after marking is completed, the control cylinder 9 pushes the dust removal chamber 8 to slide to the closed position, covering the rotary table 5 and the device. At this time, the blowing structure 10 starts to blow airflow towards the marking position, raising the dust. At the same time, the negative pressure pump 12 is turned on, and the dust-laden gas is drawn into the dust collection box 13 through the air duct 11 for filtration and collection; after dust removal is completed, the control cylinder 9 drives the dust removal chamber 8 to reset and open, and the rotary motor 4 drives the rotary table 5 to rotate 180°, turning the device over; then the above marking and dust removal process is repeated until both sides are processed. Finally, the clamping structure 6 is released, and the conveyor line 3 sends out the finished product.

[0033] As a preferred embodiment, the solution of this application is implemented as follows: Assume that a batch of rectangular optoelectronic devices needs to be laser-marked on both sides. At the start of production, the operator starts the equipment, and the conveyor line 3 transports the first device to the center of the rotary table 5. A photoelectric detection signal (though not detailed in claim 1, it is a standard configuration) triggers the cylinder of the clamping structure 6 to press down, firmly fixing the device to the rotary table 5 via the grippers on both sides. Immediately, the laser marking head located on the side descends to its working height and emits a laser beam to engrave a QR code on the front of the device. At the moment the marking ends, the control system issues a command, controlling the cylinder 9 to extend and push the semi-circular dust collection chamber 8 forward until its edge fits against the sealing groove around the rotary table 5, forming a closed chamber. The annular nozzle inside the chamber immediately sprays high-pressure air, sweeping away the marking point. The raised dust particles are then quickly sucked into the filter bag of the dust collection box 13 by the suction of the negative pressure pump 12 through the bottom-connected air duct 11. After 3 seconds of continuous blowing, the negative pressure pump 12 stops, the control cylinder 9 retracts, and the dust removal chamber 8 returns to its original position. Immediately afterwards, the rotary motor 4 drives the rotary table 5 to rotate 180° clockwise according to a preset program, with the back of the device facing upwards. The laser marking head then completes the back marking, and the dust removal process is repeated once more. After double-sided processing is complete, the grippers release, the conveyor line 3 removes the device, and the next device to be processed is fed in, and the cycle continues.

[0034] Through the above technical solution, this application achieves the following beneficial effects: Because the dust removal chamber 8, driven by the control cylinder 9, is combined with the air blowing structure 10 and the negative pressure pump 12, a local sealed space can be formed in the marking area during the dust removal stage, effectively preventing dust from spreading to the surrounding environment. Therefore, the dust removal efficiency is significantly improved and the cleanliness of the working environment is protected. Because a rotating table 5 driven by a rotary motor 4 and a clamping structure 6 are installed, the workpiece can be automatically rotated 180°. Therefore, double-sided marking can be completed without manual intervention, solving the problems of low efficiency and positioning errors caused by manual flipping in traditional equipment, thereby improving the automation level of production and product consistency. Because the components are arranged compactly and logically on the base 1 and support platform 2, the feeding, clamping, marking, dust removal, and flipping actions can be seamlessly connected, thus realizing a continuous and efficient assembly line operation mode.

[0035] Furthermore, the feeding assembly also includes two calibration plate bodies 14, a second screw 15, and a second motor 16. The two calibration plate bodies 14 are slidably disposed on both sides of the conveyor line 3. The second screw 15 has two opposite threads and is threadedly connected to the two calibration plate bodies 14. The output end of the second motor 16 is connected to the second screw 15.

[0036] When the optoelectronic device is conveyed forward along conveyor line 3 to the loading station, if the device is misaligned to the left or right, the control system issues a command to start the second motor 16. The second motor 16 drives the second screw 15 to rotate. Since the two threads on the second screw 15 rotate in opposite directions, the two alignment plate bodies 14 connected to it move synchronously towards each other along the width of conveyor line 3. The inner surfaces of the two alignment plate bodies 14 gradually approach and contact the side walls of the optoelectronic device, applying a guiding force to force the device to move towards the center position until it is aligned. At this time, the positional accuracy of the device is guaranteed. Then, the rotary table 5 rotates or the clamping structure 6 moves to fix the device. After the alignment is completed, the second motor 16 rotates in the opposite direction, driving the second screw 15 to reverse, and the two alignment plate bodies 14 synchronously separate outward, releasing the device from its position and preparing it for the input of the next device. The entire process achieves automatic, fast, and high-precision alignment through the linkage of purely mechanical structures.

[0037] Furthermore, the clamping structure 6 includes two clamping plates 17, a clamping screw 18, and a clamping motor 19. The two clamping plates 17 are slidably mounted on the rotary table 5. The clamping screw 18 has two opposite threads and is threadedly connected to the two clamping plates 17. The output end of the clamping motor 19 is connected to the clamping screw 18.

[0038] Once the optoelectronic device is transported to the designated position on the rotary table 5, the control system issues a command to start the clamping motor 19. The clamping motor 19 drives the clamping screw 18 to rotate. Because the clamping screw 18 has two opposing threads, the two clamping plates 17 connected to it slide synchronously towards each other under the guidance of the rotary table 5 until they are tightly fitted against both sides of the optoelectronic device, completing the clamping and fixing. At this point, the optoelectronic device is securely held on the rotary table 5, ready for subsequent marking operations. When it is necessary to release the device, the clamping motor 19 rotates in the opposite direction, driving the clamping screw 18 to reverse, and the two clamping plates 17 slide synchronously in opposite directions, releasing the constraint on the optoelectronic device.

[0039] This application achieves the technical effect of driving two clamping plates 17 to move synchronously and symmetrically using a bidirectional threaded screw transmission mechanism. By employing a clamping screw 18 with two opposing threads, the two clamping plates 17 maintain equidistant movement during clamping, solving the problems of clamping center offset and uneven force caused by traditional single-sided driving. This achieves the goal of stable, centered, and damage-free clamping of optoelectronic devices, significantly improving the accuracy and adaptability of marking operations.

[0040] Furthermore, the clamping structure 6 also includes two stops 20 and a baffle 21. The two stops 20 are respectively fixed to the two clamping plates 17 to prevent subsequent optoelectronic devices from entering when clamping optoelectronic devices. The baffle 21 is set on the rotary table 5 to prevent subsequent optoelectronic devices from entering when rotating.

[0041] When the conveyor line 3 transports the optoelectronic device to the processing position on the rotary table 5, the control system starts the clamping motor 19, drives the clamping screw 18 to rotate, and drives the two clamping plates 17 to move towards each other to clamp the optoelectronic device. During this process, the two stops 20 fixed on the clamping plates 17 move synchronously with the clamping plates 17, moving from the open position to the blocking position. At this time, the stops 20 protrude above or to the side of the path of the conveyor line 3, physically blocking the continued movement of subsequent optoelectronic devices. Subsequently, when double-sided marking is required, the rotary motor 4 starts to drive the rotary table 5 to rotate. During this rotation, the stops 21 fixed on the rotary table 5 are always in the preset blocking area. Even if a workpiece tries to slide in due to inertia, it will be intercepted by the stops 21, thus ensuring that the rotation is completed safely in an undisturbed environment. After the rotation and marking dust removal process is completed, the clamping plates 17 are released, and the stops 20 return to the open position, releasing the blockage of the conveyor line 3 and allowing the next optoelectronic device to enter.

[0042] This application achieves a dual blocking mechanism combining movement and stillness by setting a stop 20 that is linked with the clamping plate 17 and a baffle 21 fixed to the rotary table 5. Therefore, it can effectively isolate subsequent incoming materials during clamping operations and prevent foreign objects from entering during rotation operations. This solves the technical problem of subsequent workpieces accidentally entering the work area and causing collisions or interference during the clamping or rotation process of the current workpiece. It achieves the technical effects of improving equipment operation safety, avoiding component accumulation and jamming, and enhancing system operation stability.

[0043] Furthermore, the clamping structure 6 also includes a photoelectric sensing unit 22 and a control unit. The photoelectric sensing unit 22 is disposed on one side of the stop 20. The control unit is used to control the conveyor line 3 to stop moving when the photoelectric sensing unit 22 detects that the stop 20 is in the blocking position, and to control the conveyor line 3 to move when the stop 20 is detected to be in the open position.

[0044] During the marking process of optoelectronic devices, when the rotary table 5 drives the clamping structure 6 to complete a clamping action, the two clamping plates 17 move towards each other to clamp the workpiece, and the stop block 20 fixed on the clamping plate 17 moves to the blocking position. At this time, the photoelectric sensing unit 22 located on one side of the stop block 20 detects the blocking signal of the stop block 20 and immediately sends a trigger command to the control unit. After receiving the command, the control unit immediately determines that the current area has entered a closed protection state, and outputs a stop signal to the conveyor line 3, causing the conveyor line 3 to stop rotating and no longer feed in new optoelectronic devices. After the marking and dust removal processes are completed, the clamping structure 6 is released, the stop block 20 returns to the open position, the optical path of the photoelectric sensing unit 22 is restored, and a reset signal is sent to the control unit. Based on this, the control unit determines that the obstruction has been released, and outputs a start signal again to drive the conveyor line 3 to run, starting the next round of feeding cycle.

[0045] Through the above technical solution, this application achieves the goal that the start and stop actions of the conveyor line 3 can strictly follow the actual physical position of the stop block 20 by introducing the linkage mechanism between the photoelectric sensing unit 22 and the control unit. This solves the technical problems that may occur in traditional timed control or manual operation, such as interference caused by feeding too early or affecting the cycle time by feeding too late. This achieves the technical effects of improving equipment operation safety, realizing fully automatic and precise cycle time control, and reducing the risk of misoperation.

[0046] Furthermore, the marking assembly 7 includes a lifting structure 24, a marking structure 25, and a lifting adjustment unit 26. The lifting structure 24 is slidably disposed on one side of the support platform 2, the marking structure 25 is disposed on the lifting structure 24, and the lifting adjustment unit 26 is used to adjust the height of the lifting structure 24 according to the position of the optoelectronic device.

[0047] The lifting adjustment unit 26 refers to the power and control mechanism used to drive the lifting structure 24 to generate displacement. The lifting adjustment unit 26 is used to adjust the height of the lifting structure 24 according to the position of the optoelectronic device, to accommodate optoelectronic devices of different thicknesses, packaging forms, or placement postures. In this application, the lifting adjustment unit 26 is connected to the lifting structure 24 via a transmission connection, and its function is to provide precise height adjustment capability, ensuring that the focus or point of action of the marking structure 25 always accurately falls on the marking surface of the optoelectronic device. The cooperation relationship between the lifting adjustment unit 26 and the lifting structure 24 is as follows: the lifting adjustment unit 26 outputs rotational motion or linear thrust, which is converted into linear lifting motion of the lifting structure 24 along the side of the support platform 2. Regarding the specific implementation of the lifting adjustment unit 26, it can be a servo motor with a ball screw pair, a stepper motor with a gear rack, a cylinder with a position sensor, or even a manually adjustable handwheel with a locking mechanism. These are all conventional techniques in the art, and this application embodiment does not impose any special limitations on them.

[0048] When the optoelectronic device to be marked needs to be processed, the photoelectric sensing unit 22 first detects the position of the stop 20 to confirm that the workpiece is in place. Then, the control system sends a control signal to the lifting adjustment unit 26 according to the model of the optoelectronic device or the preset process parameters. The lifting adjustment unit 26 is activated, driving the lifting structure 24 to slide along the guide on one side of the support platform 2, thereby raising or lowering the marking structure 25 mounted on it to the preset working height. Once the height is adjusted, the marking structure 25 can perform the marking operation on the optoelectronic device. This process achieves dynamic matching between the marking height and the workpiece position, ensuring the accuracy of the marking operation.

[0049] Furthermore, the dust removal assembly also includes a buffer ring 27 and a return spring 28. The buffer ring 27 is disposed between the dust removal chamber 8 and the rotary table 5, and the return spring 28 is disposed between the control cylinder 9 and the dust removal chamber 8.

[0050] After the photoelectronic device is marked, the control cylinder 9 is activated, pushing the dust removal chamber 8 to slide towards the rotary table 5. When it approaches the closed position, the buffer ring 27 set at the edge of the dust removal chamber 8 first contacts the surface of the rotary table 5 and undergoes elastic compression, forming a sealing barrier. Then the blowing structure 10 is activated, and the airflow raises dust in the sealed space. The negative pressure pump 12 works simultaneously to extract the dust-laden gas. After the operation is completed, the control cylinder 9 retracts or depressurizes. At this time, the reset spring 28 extends or contracts, applying a reverse force to the dust removal chamber 8, causing it to quickly detach from the rotary table 5 and return to the initial position, ready for the next 180° rotation marking and dust removal cycle.

[0051] Because a buffer ring 27 is installed between the dust removal chamber 8 and the rotary table 5, the airtightness when the two are closed is significantly improved, effectively preventing secondary pollution caused by the leakage of marking dust. Because a return spring 28 is installed between the control cylinder 9 and the dust removal chamber 8, not only is the load on the cylinder return stroke reduced, but also a mechanical reset guarantee is provided, ensuring that the dust removal chamber 8 can avoid the dust in a timely manner when it is not in operation, thereby improving the reliability and safety of the entire marking and dust removal process.

[0052] Furthermore, the air blowing structure 10 includes a fan 29, an air outlet pipe 30, and an adjusting sleeve 31. The air outlet pipe 30 is fixed inside the dust removal chamber 8, the fan 29 is installed inside the air outlet pipe 30, and the adjusting sleeve 31 is slidably installed on the air outlet pipe 30 to adjust the distance between the adjusting sleeve 31 and the optoelectronic device according to the position of the optoelectronic device.

[0053] When dust removal is required for optoelectronic devices of different sizes or locations, the adjusting sleeve 31 is first manually or automatically slid along the air outlet duct 30 according to the actual height of the device or the marking position. If the device is small or located close to the device, the adjusting sleeve 31 is moved away from the device to increase the distance between the air outlet and the device, preventing excessive air pressure from causing the device to shift or be damaged. If the device is large or located far away, the adjusting sleeve 31 is moved closer to the device to decrease the distance, thereby improving the concentration of airflow and the blowing force. After the fan 29 is started, the airflow is led out through the air outlet duct 30 and sprayed out through the outlet formed by the adjusting sleeve 31, directly acting on the marking area to blow the attached dust off the surface of the device. Subsequently, the dust is sucked into the dust collection box 13 by the negative pressure pump 12. Throughout the process, the sliding adjustment of the adjusting sleeve 31 enables flexible adaptation of the blowing distance, ensuring the effectiveness of the dust removal component under different operating conditions.

[0054] Because of the sliding adjustment sleeve 31, the air blowing structure 10 can flexibly adjust the distance between the air outlet and the device according to the specific position and size of the optoelectronic device. This solves the technical problem that the fixed air blowing pipe cannot adapt to the variable workpiece size, resulting in poor dust removal effect or easy damage to the device. It achieves the technical effects of improving the targeting of dust removal, protecting the device safety and enhancing the adaptability of the equipment.

[0055] Furthermore, the air blowing structure 10 also includes a locking block 32, an elastic element 33, and a handle 34. The locking block 32 is rotatably mounted on the adjusting sleeve 31, the elastic element 33 is used to press the locking block 32 onto the air outlet pipe 30, and the handle 34 is fixed to the locking block 32.

[0056] In the marking and dust removal operation of optoelectronic devices, the operator first pulls the handle 34 outward or upward according to the specific location and marking angle requirements of the optoelectronic device, causing the locking block 32 to rotate around its rotation center. At this time, the locking block 32 compresses or stretches the elastic element 33, separating it from the outer surface of the air outlet duct 30 and releasing the locking constraint on the adjusting sleeve 31. Subsequently, the operator slides the adjusting sleeve 31 along the axial direction of the air outlet duct 30 to change the distance or angle between the end of the air outlet duct 30 and the optoelectronic device. After adjusting to the predetermined position, the operator releases the handle 34, and the elastic element 33 pushes the locking block 32 to rotate in the opposite direction under the action of the restoring force, so that the pressing surface of the locking block 32 is tightly attached to the outer wall of the air outlet duct 30, generating sufficient frictional resistance to prevent the adjusting sleeve 31 from sliding relative to the surface. At this point, the air blowing structure 10 has completed its position locking. After the fan 29 is started, it can blow air stably to the designated position through the air outlet pipe 30 to remove the dust generated by marking. This allows the adjusting sleeve 31 to be quickly locked in any position and not easily loosened. This solves the technical problem in the prior art that the air blowing structure 10 is prone to displacement due to vibration after adjustment, resulting in unstable dust removal effect. It achieves the technical effect of improving the stability of device operation and ease of operation.

[0057] The second embodiment of this application also provides a method for marking optoelectronic devices, which adopts an optoelectronic device marking device according to any of the foregoing embodiments.

[0058] Step 1: The optoelectronic device is conveyed to the clamping position of the rotating assembly using a feeding component. The feeding component includes a base 1, a support platform 2, and a conveyor line 3 rotatably mounted on the support platform 2. This step refers to the process of conveying the optoelectronic device to be processed from the feed end to a preset station on one side of the rotating table 5 by the rotation of the conveyor line 3. During the conveying process, the optoelectronic devices can enter one by one sequentially or in a continuous arrangement. Specifically, when the optoelectronic device reaches the designated position, the conveyor line 3 stops operating or maintains a low speed to facilitate subsequent clamping actions. For example, the conveyor line 3 can use a belt conveyor or a chain conveyor to smoothly transport the optoelectronic device to the edge area of ​​the rotating table 5, ensuring that the center of gravity of the device is within the effective range of the clamping structure 6. Through this step, automated feeding of the optoelectronic device is achieved, providing a foundation for subsequent precise clamping and marking.

[0059] Step Two: The optoelectronic device is clamped and fixed using the clamping structure 6 of the rotating assembly. The clamping structure 6 is mounted on the rotary table 5 and is used to clamp the optoelectronic device delivered from the conveyor line 3. This step can involve activating the clamping structure 6, causing its actuator to move towards the center or close, thereby firmly gripping the optoelectronic device. The clamping structure 6 may include two opposing clamping plates 17, which are driven by a screw to move towards each other to clamp the sides of the device; or a pneumatic clamp can be used to directly apply clamping force to the device. For example, when the optoelectronic device is in place, the clamping motor 19 drives the clamping screw 18 with two opposite threads to rotate, driving the two clamping plates 17 to move inward synchronously until the surface of the clamping plates 17 is in close contact with the sidewall of the optoelectronic device, completing the fixation. This step ensures that the optoelectronic device will not shift or loosen during high-speed rotation and marking, guaranteeing processing accuracy.

[0060] Step 3: Marking the first surface of the optoelectronic device using marking component 7. Marking component 7 is located on one side of the support platform 2 and is used to mark the optoelectronic device. This step involves controlling the marking component 7 to approach the held optoelectronic device and activating the marking head to engrave marking information on the first surface of the device. The marking component 7 can adjust its height and horizontal position according to a preset program to accommodate optoelectronic devices of different specifications. For example, the lifting adjustment unit 26 drives the lifting structure 24 to descend based on the device position detected by the sensor, so that the marking structure 25 is close to the device surface. Subsequently, the laser generator emits a laser beam or a mechanical engraving knife presses down, forming clear characters or QR codes on the device surface. This step completes the information marking on one side of the optoelectronic device and is a key link in product traceability and quality identification.

[0061] Step 4: Perform the first dust removal treatment on the marked optoelectronic devices using a dust removal assembly. The dust removal assembly includes a dust removal chamber 8, a control cylinder 9, a blowing structure 10, an air duct 11, a negative pressure pump 12, and a dust collection box 13. This step can refer to immediately starting the dust removal program after marking to remove the dust generated during marking. The specific process is as follows: the output end of the control cylinder 9 extends, causing the dust removal chamber 8 to slide and close the area of ​​the rotating table 5, forming a relatively sealed space; then, the blowing structure 10 set in the dust removal chamber 8 is activated, spraying airflow towards the marking position to blow up the dust adhering to the surface and surrounding area of ​​the device; at the same time, the negative pressure pump 12 connecting the air duct 11 and the dust removal chamber 8 starts working, generating negative pressure suction, sucking the blown dust along with the airflow into the air duct 11, and finally collecting it in the dust collection box 13. For example, the fan 29 blows high-pressure gas onto the surface of the device through the air outlet duct 30, which, together with the suction action of the negative pressure pump 12, removes fine dust within milliseconds. This step effectively avoids dust residue interfering with subsequent processes or product performance, and improves the cleanliness of the product.

[0062] Step 5: Control the rotary motor 4 to drive the rotary table 5 to rotate 180°, thus flipping the optoelectronic device. The rotary motor 4 is used to drive the rotary table 5 to rotate. This step can refer to driving the rotary motor 4 to rotate at a preset angle after completing the marking and dust removal of the first side, thereby changing the spatial orientation of the optoelectronic device. The rotary table 5 rotates precisely 180 degrees under the drive of the motor, so that the originally upward-facing marked side turns downward, while the unmarked back side turns upward, and the device is still firmly fixed by the clamping structure 6. For example, after receiving a control signal, the rotary motor 4 drives the rotary table 5 to rotate at a uniform speed for half a revolution and accurately stop at the predetermined position. At this time, the second side of the optoelectronic device is facing the marking assembly 7. This step realizes the automatic flipping of the device, allowing for double-sided processing without manual intervention, significantly improving production efficiency.

[0063] Step Six: The marking component 7 is used to re-mark the second side of the optoelectronic device; the marking component 7 then operates on the flipped optoelectronic device again. The execution logic of this step is similar to the above, that is, after the device is flipped, the marking component 7 is repositioned and performs the marking operation on the second side. The marking component 7 adjusts its height and focal length according to the position parameters of the second side to perform the engraving action. For example, the lifting structure 24 descends again, and the marking structure 25 engraves the corresponding batch number or specification code on the back of the optoelectronic device. This step ensures that both sides of the optoelectronic device have complete marking information, meeting the application requirements of multi-faceted recognition.

[0064] Step Seven: The optoelectronic device, after the second marking is completed, undergoes a second dust removal process using a dust removal assembly. The dust removal assembly is restarted to remove the dust generated during the second marking. This step repeats the dust removal logic described above. The control cylinder 9 drives the dust removal chamber 8 to close the rotating table 5, the air blowing structure 10 blows the second marking area, and the negative pressure pump 12 sucks the generated dust into the dust collection box 13. For example, at the moment the second marking ends, the dust removal chamber 8 quickly closes, and the fan 29 and the negative pressure pump 12 work together to thoroughly remove any newly generated debris. This step ensures that the entire surface of the optoelectronic device is free of dust residue after double-sided processing, avoiding short circuits or decreased optical performance caused by dust accumulation.

[0065] Step 8: Release the clamping structure 6 and unload the optoelectronic devices that have undergone double-sided marking and dust removal; release the clamping force of the clamping structure 6 on the optoelectronic devices. This step can refer to the reverse drive of the clamping structure 6 after all processing and cleaning processes are completed, causing the clamping plate 17 to open or the clamp to loosen, thus releasing the fixation on the optoelectronic devices. Subsequently, the finished product can be moved out of the rotary table 5 area by means of robotic gripping, gravity dropping, or reverse / forward transmission of the conveyor line 3. For example, the clamping motor 19 reverses to drive the clamping plate 17 to separate, and the optoelectronic devices fall into the receiving box below or are pushed into the conveyor belt of the next process by a push rod. This step completes the closed loop of the entire marking method, realizing the fully automated flow of optoelectronic devices from raw materials to finished products.

[0066] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that implementing all or part of the above embodiments and making equivalent changes in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A marking device for optoelectronic devices, characterized in that, The system includes a feeding assembly, a rotating assembly, a marking assembly, and a dust removal assembly. The feeding assembly includes a base, a support platform, and a conveyor line. The support platform is fixed to the base, and the conveyor line is rotatably mounted on the support platform. The rotating assembly includes a rotary motor, a rotary table, and a clamping structure. The rotary table is rotatably mounted on one side of the support platform, and the rotary motor drives the rotary table to rotate. The clamping structure is mounted on the rotary table and is used to clamp the optoelectronic devices fed out from the conveyor line. The marking assembly is located on one side of the support platform and is used to mark the optoelectronic devices. The dust removal assembly includes a dust removal chamber, a control cylinder, an air blowing structure, an air duct, a negative pressure pump, and a dust collection box. The dust removal chamber is slidably disposed on one side of the rotating table. The output end of the control cylinder is connected to the dust removal chamber. The air blowing structure is disposed in the dust removal chamber and is used to blow air onto the marked optoelectronic devices. The air duct is connected to the dust removal chamber and the negative pressure pump. The dust collection box is connected to the negative pressure pump. After the optoelectronic devices are marked, the control cylinder drives the dust removal chamber to close the rotating table and activates the air blowing structure to blow air onto the marking position to remove dust, which is then collected in the dust collection box by the negative pressure pump. Afterward, the rotary motor drives the rotating table to rotate 180° to perform marking and dust removal again.

2. The marking device for optoelectronic devices as described in claim 1, characterized in that, The feeding assembly also includes two calibration plate bodies, a second screw, and a second motor. The two calibration plate bodies are slidably disposed on both sides of the conveyor line. The second screw has two opposite threads and is threadedly connected to the two calibration plate bodies. The output end of the second motor is connected to the second screw.

3. The marking device for optoelectronic devices as described in claim 2, characterized in that, The clamping structure includes two clamping plates, a clamping screw, and a clamping motor. The two clamping plates are slidably disposed on the rotating platform. The clamping screw has two opposite threads and is threadedly connected to the two clamping plates. The output end of the clamping motor is connected to the clamping screw.

4. The marking device for optoelectronic devices as described in claim 3, characterized in that, The clamping structure also includes two blocks and a baffle. The two blocks are respectively fixed to the two clamps to prevent subsequent optoelectronic devices from entering when clamping the optoelectronic device. The baffle is disposed on the rotating table to prevent subsequent optoelectronic devices from entering during rotation.

5. The marking device for optoelectronic devices as described in claim 4, characterized in that, The clamping structure also includes a photoelectric sensing unit and a control unit. The photoelectric sensing unit is disposed on one side of the stop block. The control unit is used to control the conveyor line to stop moving when the photoelectric sensing unit detects that the stop block is in the blocking position, and to control the conveyor line to move when the stop block is detected to be in the open position.

6. The marking device for optoelectronic devices as described in claim 5, characterized in that, The marking assembly includes a lifting structure, a marking structure, and a lifting adjustment unit. The lifting structure is slidably disposed on one side of the support platform, the marking structure is disposed on the lifting structure, and the lifting adjustment unit is used to adjust the height of the lifting structure according to the position of the optoelectronic device.

7. The marking device for optoelectronic devices as described in claim 6, characterized in that, The dust removal assembly also includes a buffer ring and a return spring. The buffer ring is disposed between the dust removal chamber and the rotary table, and the return spring is disposed between the control cylinder and the dust removal chamber.

8. The marking device for optoelectronic devices as described in claim 7, characterized in that, The air blowing structure includes a fan, an air outlet pipe, and an adjusting sleeve. The air outlet pipe is fixed to the dust removal chamber, the fan is disposed inside the air outlet pipe, and the adjusting sleeve is slidably disposed on the air outlet pipe to adjust the distance between the adjusting sleeve and the optoelectronic device according to the position of the optoelectronic device.

9. The marking device for optoelectronic devices as described in claim 8, characterized in that, The air blowing structure also includes a locking block, an elastic element, and a handle. The locking block is rotatably mounted on the adjusting sleeve, the elastic element is used to press the locking block onto the air outlet pipe, and the handle is fixed to the locking block.

10. A marking method for optoelectronic devices, characterized in that, The optoelectronic device marking device according to any one of claims 1-9 is used.

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