An electronic product with high infrared transmission effect and high transmission of a camera hole and a preparation method thereof

Abstract

The application provides an electronic product with high infrared-transmitting effect and high-transmitting camera hole and a preparation method thereof, and belongs to the technical field of product surface processing. The preparation method comprises the following steps: performing UV transfer printing treatment on the surface of the electronic product to obtain a product containing a transfer printing layer; printing a removable adhesive on the large surface of the product containing the transfer printing layer, performing laser hollowing treatment on the position of the camera hole, and then using a vacuum evaporation method or a magnetron sputtering method to plate a single layer of silicon; removing the removable adhesive on the large surface of the product, immersing the product in an infrared color paste for dip dyeing treatment, and then drying to obtain the electronic product with high infrared-transmitting effect and high-transmitting camera hole. The method effectively avoids the appearance problems such as orange peel, bubbles and color difference caused by directly printing infrared ink on the large surface, and has strong process stability; the infrared-transmitting effect of the large surface of the product is realized, and the high-transmitting performance of the camera hole is accurately ensured, the appearance quality and use performance of the finished product are significantly improved, and the high-precision processing demand of large-size products is met.

Description

Technical Field

[0001] This invention relates to the field of product surface processing technology, and in particular to an electronic product with large-area infrared transmission and high camera aperture transmission, and its preparation method. Background Technology

[0002] In existing product processing technologies, for products requiring large-area infrared transmission and high-transmittance camera holes, the conventional approach is to directly print infrared ink and then process the camera holes using a die-cutting process. However, this process has significant drawbacks when applied to large-size products: large-area infrared (IR) ink printing easily results in appearance defects such as orange peel, bubbles, and discoloration, failing to meet the product's appearance quality requirements and making it difficult to adapt to the production needs of high-precision, high-appearance-quality products. Therefore, a completely new processing technology is needed to solve these technical problems. Summary of the Invention

[0003] The purpose of this invention is to provide an electronic product with large-area infrared transmission and high-transmittance camera aperture, and a method for its preparation, thereby solving the problem of poor appearance caused by direct printing of infrared ink in the existing processing technology of large-area infrared transmission products, while ensuring the high-transmittance effect of the camera aperture.

[0004] To achieve the above-mentioned objectives, the present invention provides the following technical solution: This invention provides a method for manufacturing an electronic product with large-area infrared transmission and high camera aperture transmittance, comprising the following steps: 1) The surface of electronic products is treated with UV transfer printing to obtain products containing a transfer layer; 2) Print removable adhesive on the large surface of the product containing the transfer layer, and after laser-cutting the camera hole position, deposit a single layer of silicon using vacuum evaporation or magnetron sputtering. 3) Remove the peelable adhesive from the large areas of the product, immerse the product in infrared pigment for dyeing treatment, and then dry it to obtain an electronic product with a large area of ​​infrared transmission and high camera hole transmission.

[0005] Preferably, the transfer layer is made of UV adhesive and has a thickness of 15~20μm.

[0006] Preferably, the printing is screen printing, with a screen spacing of 1~7mm, a squeegee angle of 72~77°, a screen size of 90~110T, a squeegee angle of 40~60°, and a printing speed of 100~500mm / s.

[0007] Preferably, the thickness of the peelable adhesive is 20~30μm, and the peelable adhesive is a thermosetting peelable adhesive.

[0008] Preferably, in the laser hollowing process, the laser power is 30~50W and the speed is 800~1500mm / s; the thickness of the single-layer silicon is 50~80nm, and the light transmittance of the camera hole after the single-layer silicon is deposited is ≥95%.

[0009] Preferably, the wavelength of the infrared pigment is 850~900nm, the temperature of the dyeing treatment is 25~30℃, and the time is 15~20min.

[0010] Preferably, the infrared pigment is composed of the following components by mass fraction: 32-38% infrared composite inorganic pigment, 26-30% resin, 6-10% polymeric dispersant, 20-24% mixed solvent, 2-4% leveling agent, 1-3% defoamer, and 1-3% adhesion promoter; the resin is acrylic resin or polyester resin, and the solid content of the resin is 45-55%.

[0011] The present invention also provides an electronic product with large-area infrared transmission effect and high camera aperture prepared by the preparation method described above.

[0012] The beneficial effects of this invention are: The method of this invention effectively avoids appearance defects such as orange peel, bubbles, and discoloration caused by direct printing of infrared ink on large surfaces, and has strong process stability. Through step-by-step process design, it not only achieves infrared transmission effect on large surfaces of the product, but also precisely ensures the high transmittance performance of the camera hole, significantly improving the appearance quality and performance of the finished product, and adapting to the high-precision processing requirements of large-size products. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of an electronic product with a large infrared transmittance effect and high camera aperture according to the present invention. Detailed Implementation

[0014] This invention provides a method for manufacturing an electronic product with large-area infrared transmission and high camera aperture transmittance, comprising the following steps: 1) The surface of electronic products is treated with UV transfer printing to obtain products containing a transfer layer; 2) Print removable adhesive on the large surface of the outer product containing the transfer layer, and after laser hollowing out the camera hole position, deposit a single layer of silicon using vacuum evaporation or magnetron sputtering. 3) Remove the peelable adhesive from the large areas of the product, immerse the product in infrared pigment for dyeing treatment, and then dry it to obtain an electronic product with a large area of ​​infrared transmission and high camera hole transmission.

[0015] In this invention, the material of the transfer layer is preferably UV adhesive, and the thickness of the transfer layer is preferably 15~20μm, more preferably 16~19μm, and even more preferably 17~18μm.

[0016] In this invention, the printing is preferably screen printing, the screen spacing is preferably 1~7mm, more preferably 2~6mm, more preferably 3~5mm, the squeegee angle is preferably 72~77°, more preferably 75°, the screen plate is preferably 90~110T, more preferably 100T, the squeegee angle is preferably 40~60°, more preferably 45~55°, more preferably 50°, and the printing speed is preferably 100~500mm / s, more preferably 200~400mm / s, more preferably 300mm / s.

[0017] In this invention, the thickness of the peelable adhesive is preferably 20~30μm, more preferably 22~28μm, and even more preferably 25~26μm, and the peelable adhesive is preferably a thermosetting peelable adhesive.

[0018] In this invention, during the laser hollowing process, the laser power is preferably 30-50W, more preferably 35-45W, and even more preferably 40W; the laser hollowing speed is preferably 800-1500mm / s, more preferably 1000-1400mm / s, and even more preferably 1200-1300mm / s; the thickness of the single-layer silicon is preferably 50-80nm, more preferably 60-70nm, and even more preferably 65nm; and the transmittance of the camera hole after the single-layer silicon is deposited is preferably ≥95%.

[0019] In this invention, the parameters for the vacuum evaporation method are as follows: the vacuum degree at the IB start-up vacuum is preferably ≤4.5×10⁻⁶. -5 The anode voltage is preferably 130~150V, more preferably 135~145V, and even more preferably 140V; the anode current is preferably 8~18A, more preferably 10~16A, and even more preferably 13A; the filament current is preferably 27~37A, more preferably 30~35A, and even more preferably 32A; the gas flow rate is preferably 15~30sccm, and even more preferably 20~25sccm; the gas is preferably argon; the cleaning time is preferably 10~20min, more preferably 13~17min, and even more preferably 15min; the ion source type is preferably a Hall ion source (graphite); and the number of ion sources is preferably one.

[0020] In this invention, the parameters of the magnetron sputtering method are as follows: the material is preferably Si; the rotation speed is preferably 75~85 rpm, more preferably 80 rpm; the film thickness is preferably 6~14 nm, more preferably 8~12 nm, more preferably 10 nm; the velocity (A) is preferably 1.66±0.5 Å / s; the coating vacuum degree is preferably 0.02~0.7 Pa, more preferably 0.1~0.5 Pa, more preferably 0.3~0.4 Pa; the power of the silicon target is preferably 3.5~5.5 kW, more preferably 4~5 kW, more preferably 4.5 kW; the voltage of the silicon target is preferably 540~660 V, more preferably 580~620 V, more preferably 600 V; the Ar flow rate in the silicon target is preferably 300~700 sccm, more preferably 400~600 sccm, more preferably 500 sccm; the Ar flow rate in the niobium target is preferably 300~700 sccm, more preferably 400~600 sccm, more preferably 500 sccm; ICP The flow rate of Ar is preferably 500~700 sccm, more preferably 550~650 sccm, and even more preferably 600 sccm; the starting vacuum degree is preferably ≥0.002 Pa.

[0021] In this invention, the wavelength of the infrared pigment is preferably 850-900 nm, more preferably 860-890 nm, and even more preferably 870-880 nm; the temperature of the immersion dyeing treatment is preferably 25-30°C, more preferably 26-29°C, and even more preferably 27-28°C; and the immersion dyeing treatment time is preferably 15-20 min, more preferably 16-19 min, and even more preferably 17-18 min.

[0022] In this invention, the infrared pigment paste is composed of the following components by mass fraction: 32-38% infrared composite inorganic pigment, preferably 34-36%, more preferably 35%; 26-30% resin, preferably 27-29%, more preferably 28%; 6-10% polymeric dispersant, preferably 7-9%, more preferably 8%; 20-24% mixed solvent, preferably 21-23%, more preferably 22%; 2-4% leveling agent, preferably 2.5-3.5%, more preferably 3%; 1-3% defoamer, preferably 1.5-2.5%, more preferably 2%; and 1-3% adhesion promoter, preferably 1.5-2.5%, more preferably 2%. The resin is preferably acrylic resin or polyester resin, and the solid content of the resin is 45-55%, preferably 47-52%, more preferably 50%.

[0023] In this invention, UV transfer printing ensures that the transfer layer evenly covers the product surface, achieving the required adhesion. Large-area printing requires guaranteed peelable printing quality. During the camera hole perforation process, laser power and speed are controlled to prevent defects such as jagged edges and roughening. A single layer of silicon is deposited at the camera hole location to improve its light transmittance and protection. The peelable adhesive on the large-area printing is then removed, exposing the product's base surface and preventing damage. The entire product is then immersed in infrared pigment, creating an infrared-transparent effect on the large surface, while the camera hole area, due to the previous silicon plating, remains uncolored and maintains high transparency.

[0024] The present invention also provides an electronic product with large-area infrared transmission effect and high camera aperture prepared by the preparation method described above.

[0025] The method of the present invention is applicable to achieving infrared transmission on the surface of large-sized products, while ensuring high transmittance of the camera aperture.

[0026] The technical solutions provided by the present invention will be described in detail below with reference to the embodiments, but they should not be construed as limiting the scope of protection of the present invention.

[0027] In the infrared pigments of the following examples, the infrared composite inorganic pigment is iron chromate black FeCr2O4, the polymeric dispersant is TEGO Dispers 685, the mixed solvent is ethyl acetate and propylene glycol methyl ether in a mass ratio of 3:1, the leveling agent is BYK-358, the defoamer is TEGO Airex 931, and the adhesion promoter is BYK-4510.

[0028] Example 1

[0029] The surface of a large-size electronic product casing (touch panel, 8 inches) is transferred using a conventional UV transfer process. The UV adhesive layer (18μm thick) is evenly covered on the casing surface, and the adhesion meets the standards.

[0030] A high-precision screen printing machine was used to print removable adhesive (thermosetting peelable adhesive, model ZY-kbj136) on the large surface of the outer casing. The screen printing parameters were: screen distance 4mm, squeegee angle 75°, screen size 100T, squeegee angle 50°, printing speed 300mm / s, and printing thickness 25μm. Subsequently, the camera hole position was laser-cut out. During the cutting process, the laser power was 40W and the speed was 1200mm / s to avoid defects such as jagged edges and roughness on the camera hole edges.

[0031] A single layer of silicon was deposited at the camera aperture using vacuum evaporation, with a thickness of 65 nm. The parameters for the vacuum evaporation method were: the vacuum level at IB startup was 4.0 × 10⁻⁶. -5Torr, anode voltage 140V, anode current 13A, filament current 32A, gas flow rate 25sccm, gas is argon; cleaning time 15min; ion source type is Hall ion source (graphite); number of ion sources is 1; vacuum evaporation method ensures camera aperture transmittance ≥95%.

[0032] Using a specialized adhesive-removing tool, gently peel off the removable adhesive on the large surface of the outer shell to avoid damaging the product surface. Prepare an infrared colorant (wavelength 880nm) composed of the following components by mass percentage: 35% infrared composite inorganic pigment, 28% acrylic resin SK6405 (50% solids), 8% polymeric dispersant, 22% mixed solvent, 3% leveling agent, 2% defoamer, and 2% adhesion promoter. Immerse the outer shell in the infrared colorant at 27℃ for 17 minutes. After removal and drying, a uniform infrared transmittance effect is achieved on the large surface of the outer shell. Due to the silicon coating layer, the camera aperture shows no coloring and maintains high transmittance.

[0033] Example 2

[0034] The surface of the vehicle display panel is treated with conventional UV transfer printing process. The UV adhesive transfer layer (15μm thick) is evenly covered on the surface of the vehicle display panel, which is wear-resistant, scratch-resistant and has good adhesion.

[0035] A high-precision screen printing machine was used to print removable adhesive (thermosetting peelable adhesive, model ZY-kbj136) on the large surface of the display panel. The screen printing parameters were: screen distance 3mm, squeegee angle 73°, screen size 95T, squeegee angle 45°, printing speed 200mm / s, and printing thickness 25μm. Subsequently, the camera holes were cut out by a CNC milling machine with a spindle speed of 45000rpm, a cutting line speed of 170m / min, and a feed speed of 2500mm / min to ensure the accuracy of the hole positions and the flatness of the edges.

[0036] A single layer of silicon was deposited at the camera aperture using magnetron sputtering, with a thickness of 65 nm, to improve the weather resistance and light transmittance of the camera aperture. The parameters for magnetron sputtering were as follows: material: Si; rotation speed: 80 rpm; film thickness: 10 nm; velocity (Å): 1.66 Å / s; deposition vacuum: 0.1 Pa; silicon target power: 4.5 kW; voltage: 600 V; Ar flow rate in silicon target: 500 sccm; Ar flow rate in niobium target: 500 sccm; Ar flow rate in ICP: 600 sccm; starting vacuum: 0.003 Pa; and the light transmittance of the camera aperture after single-layer silicon deposition was 96%.

[0037] Using low-temperature heating (40℃) to assist in peeling off the adhesive, large areas of peelable adhesive can be easily removed without residue.

[0038] Infrared pigment paste (wavelength 870nm) was prepared, consisting of the following components by mass fraction: 33% infrared composite inorganic pigment, 27% saturated polyester resin R680 (55% solid content), 9% polymeric dispersant, 24% mixed solvent, 2.5% leveling agent, 2.5% defoamer, and 2% adhesion promoter. The display panel was immersed in the infrared pigment paste at 30℃ for 22 minutes. After drying, the display panel achieved infrared transmission over a large area, with high transmittance through the camera aperture and no visible defects.

[0039] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for manufacturing an electronic product with large-area infrared transmission and high camera aperture, characterized in that, It includes the following steps: 1) The surface of electronic products is treated with UV transfer printing to obtain products containing a transfer layer; 2) Print removable adhesive on the large surface of the product containing the transfer layer, and after laser-cutting the camera hole position, deposit a single layer of silicon using vacuum evaporation or magnetron sputtering. 3) Remove the peelable adhesive from the large areas of the product, immerse the product in infrared pigment for dyeing treatment, and then dry it to obtain an electronic product with a large area of ​​infrared transmission and high camera hole transmission.

2. The preparation method according to claim 1, characterized in that, The transfer layer is made of UV adhesive and has a thickness of 15~20μm.

3. The preparation method according to claim 1 or 2, characterized in that, The printing is screen printing, with a screen spacing of 1~7mm, a squeegee angle of 72~77°, a screen size of 90~110T, a squeegee angle of 40~60°, and a printing speed of 100~500mm / s.

4. The preparation method according to claim 3, characterized in that, The thickness of the peelable adhesive is 20~30μm, and the peelable adhesive is a thermosetting peelable adhesive.

5. The preparation method according to claim 4, characterized in that, In the laser hollowing process, the laser power is 30~50W and the speed is 800~1500mm / s; the thickness of the single-layer silicon is 50~80nm, and the light transmittance of the camera hole after the single-layer silicon is deposited is ≥95%.

6. The preparation method according to claim 4 or 5, characterized in that, The wavelength of the infrared pigment is 850~900nm, and the immersion treatment temperature is 25~30℃, and the time is 15~20min.

7. The preparation method according to claim 6, characterized in that, The infrared pigment is composed of the following components by mass fraction: 32-38% infrared composite inorganic pigment, 26-30% resin, 6-10% polymeric dispersant, 20-24% mixed solvent, 2-4% leveling agent, 1-3% defoamer, and 1-3% adhesion promoter; the resin is acrylic resin or polyester resin, and the solid content of the resin is 45-55%.

8. An electronic product with large-area infrared transmittance and high camera aperture prepared by the preparation method according to any one of claims 1 to 7.

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