Glass cover plate of electronic device and processing method thereof

Abstract

The embodiment of the present application provides a glass cover plate of an electronic device and a processing method thereof, the method comprising: obtaining a glass substrate, one side surface of the glass substrate comprising a frame area, a display area and at least one device hole area, the surface of the device hole area being a smooth surface, and the surface of an adjacent area of the device hole area being provided with an AG layer; using a first screen printing plate to screen annular shielding ink on the glass substrate around each device hole area to form a shielding ring to obtain a semi-finished product, the shielding ring corresponding to the device hole area one by one and being arranged in the corresponding center, and the inner ring edge and the outer ring edge of the shielding ring being located on the inside and the outside of the boundary of the corresponding device hole area respectively; using a second screen printing plate to screen shielding ink on the outer surface of the semi-finished product to form a shielding layer, the shielding layer being provided with a position avoidance hole, and the boundary of the position avoidance hole being between the inner ring edge and the outer ring edge of the shielding ring; and performing curing treatment on the shielding ink to be cured. The embodiment can improve the alignment accuracy of the device hole area and the position avoidance hole and reduce the processing difficulty.

Description

Technical Field

[0001] This invention relates to the field of glass processing technology, and more particularly to a glass cover plate for an electronic device and its processing method. Background Technology

[0002] Electronic devices typically have a glass cover on the outside of the display module for protection, and anti-glare (AG) treatment of this glass cover has become a standard practice to improve the visual experience. However, for electronic devices with sensing components such as cameras and sensors located on the inside of the glass cover, to ensure that these sensing components can clearly perceive external environmental information through the glass cover, the corresponding area on the glass cover (called the "device aperture area," usually located in the frame area of ​​the glass cover, but possibly also in the display area) must maintain extremely high optical transparency and clarity. In other words, the device aperture area should avoid AG treatment.

[0003] In addition, during the processing of the glass cover, masking ink is usually screen-printed around the frame area and the device hole area on the outer surface of the glass substrate to form a masking layer to cover other components on the inner side of the glass cover. For this purpose, it is also necessary to design clearance holes for the device hole area at the corresponding position of the ink layer. During the screen printing process, it is also necessary to ensure that the clearance holes are precisely aligned with the center of the device hole area.

[0004] However, the inventors discovered during implementation that the traditional method of screen printing ink layers involves directly screen printing the masking layer onto the outer surface of the glass substrate in a single step after the AG processing. However, since the device hole area has not undergone AG processing, there is a height difference and surface energy difference between it and the surrounding AG area. When screen printing the ink layer, the pressure of the screen printing squeegee can easily cause local stretching or deformation of the edge of the screen adjacent to the device hole area, resulting in uneven ink transfer, blurry pattern edges, or positional deviations. Consequently, the formed clearance window cannot be accurately aligned with the center of the device hole area. Summary of the Invention

[0005] The technical problem to be solved by the embodiments of the present invention is to provide a processing method for a glass cover plate of an electronic device, which can improve the alignment accuracy between the device hole area and the avoidance hole of the shielding layer and reduce the processing difficulty.

[0006] A further technical problem to be solved by the embodiments of the present invention is to provide a glass cover plate for an electronic device that can improve the alignment accuracy between the device hole area and the avoidance hole of the shielding layer, and reduce the processing difficulty.

[0007] To address the aforementioned technical problems, the present invention first provides the following technical solution: a method for processing a glass cover plate for an electronic device, comprising the following steps: A glass substrate is obtained by a previous process. One side surface of the glass substrate includes a frame area located at the edge, a display area located in the middle, and at least one device hole area disposed in the frame area or the display area. The surface of the device hole area is a smooth surface without AG treatment, while the surface of the adjacent area of ​​the device hole area is formed with an AG layer. A semi-finished product is obtained by screen printing a ring of masking ink around each of the device hole areas on the glass substrate using a first screen printing stencil. The masking ring corresponds one-to-one with the device hole areas and is centered accordingly. The width of the masking ring is 0.6-1mm and the inner and outer ring edges of the masking ring are located inside and outside the boundary of the corresponding device hole area, respectively. A second screen printing stencil is used to screen print masking ink onto the outer surface of the semi-finished product, corresponding to and covering the border area and the outer edge of the masking ring, to form a masking layer. The masking layer has recessed holes centered on the masking ring, the boundaries of which are located between the inner and outer edges of the masking ring. The masking ink to be cured is subjected to a curing process.

[0008] Furthermore, the distance between the inner edge of the shielding ring and the boundary of the corresponding device hole area is no greater than 0.05 mm.

[0009] Furthermore, the distance between the boundary of the clearance hole and the outer ring edge of the shielding ring is 0.3 mm.

[0010] Furthermore, the distance between the inner ring boundary of the shielding ring and the corresponding boundary of the device hole area is 0.01mm-0.05mm.

[0011] Furthermore, the surface of the glass substrate is first cleaned, and then the shielding ring and the shielding layer are sequentially formed on one side surface of the glass substrate. The cleaning process is performed by cleaning with plasma water.

[0012] Furthermore, the mesh count of the second screen printing plate is lower than that of the first screen printing plate.

[0013] Furthermore, the curing treatment of the masking ink to be cured specifically includes: curing the masking ink used to form the masking ring or the masking layer after the masking ring or the masking layer is formed; or, after the masking ring and the masking layer are both formed, performing a joint curing treatment on the masking ink used to form the masking ring and the masking layer.

[0014] Furthermore, the shielding ring and the shielding layer are made using the same shielding ink or shielding inks with similar optical properties that can be co-cured.

[0015] Furthermore, the masking ink to be cured is baked to achieve the curing process, and the baking temperature is 145-155°C and the baking time is 25-35 minutes.

[0016] On the other hand, in order to solve the above-mentioned further technical problems, embodiments of the present invention also provide the following technical solution: a glass cover plate for an electronic device, comprising: A glass substrate, wherein one side surface of the glass substrate includes a frame area located at the edge, a display area located in the middle, and at least one device hole area disposed in the frame area or the display area, wherein the surface of the device hole area is a smooth surface without AG treatment, and an AG layer is formed on the surface of the adjacent area of ​​the device hole area. A shielding ring, wherein each shielding ring corresponds one-to-one with and is centered on the corresponding device aperture area; the width of the shielding ring is 0.6-1mm, and the inner edge and outer boundary of the shielding ring are located inside and outside the boundary of the corresponding device aperture area, respectively; and A masking layer covers the frame area and the outer edge of the masking ring. The masking layer has a clearance hole corresponding to each of the masking rings. The clearance hole is centered with the corresponding masking ring. The boundary of the clearance hole is between the inner and outer ring edges of the masking ring. The masking ring and the masking layer are formed by screen printing masking ink and then cured.

[0017] After adopting the above technical solution, the embodiments of the present invention have at least the following beneficial effects: The embodiments of the present invention first screen print a shielding ring centered around the device hole area on a glass substrate. The width of the shielding ring is designed to be only 0.6-1.0 mm, which is small in size. The area of ​​the first screen printing stencil used is relatively small, resulting in less stencil deformation during screen printing. Furthermore, high-precision alignment can be achieved through simple visual or mechanical positioning, making the concentricity between the shielding ring and the device hole area higher. Additionally, by designing the inner and outer ring edges of the shielding ring to be located inside and outside the corresponding boundaries of the device hole area, respectively, it is ensured that the shielding ring can effectively cover... The edges of the device aperture area are covered to prevent light leakage. Then, a masking layer is formed by secondary screen printing to cover the frame area of ​​the glass substrate and the outer edge of the masking ring. The masking layer is designed with corresponding clearance holes that are centered on the masking ring, and the boundary of the clearance holes is between the inner and outer ring edges of the masking ring to ensure the connection and fusion between the masking inks. During the secondary screen printing, it is only necessary to ensure that the clearance holes are aligned with the masking ring. Even if the boundary of the clearance holes is slightly deformed, the deformed area will not exceed the range of the masking ring, so as not to have a substantial impact on the overall masking effect. This effectively reduces the difficulty of screen printing and facilitates the forming process. Attached Figure Description

[0018] Figure 1 This is a plan view of a glass substrate, representing an optional embodiment of the glass cover processing method for the electronic device of the present invention.

[0019] Figure 2 This is a cross-sectional schematic diagram of a glass substrate, representing an optional embodiment of the processing method for the glass cover of the electronic device of the present invention.

[0020] Figure 3 This is a partial cross-sectional schematic diagram of a possible embodiment of the processing method of the glass cover of the electronic device of the present invention, after a masking ring is screen-printed on the glass substrate.

[0021] Figure 4 This is a partial cross-sectional schematic diagram of an optional embodiment of the processing method of the glass cover of the electronic device of the present invention, showing a screen-printed masking layer on a glass substrate.

[0022] Figure 5 This is a plan view of a finished glass cover obtained from an optional embodiment of the glass cover processing method for the electronic device of the present invention.

[0023] Figure 6 This is a flowchart of an optional embodiment of the processing method for the glass cover of the electronic device of the present invention.

[0024] Figure 7 This is a flowchart of another optional embodiment of the processing method for the glass cover of the electronic device of the present invention. Detailed Implementation

[0025] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be understood that the following illustrative embodiments and descriptions are only used to explain the present invention and are not intended to limit the present invention. Moreover, the embodiments and features in the embodiments of the present application can be combined with each other unless otherwise specified.

[0026] like Figures 1-5 As shown, an optional embodiment of the present invention provides a method for processing a glass cover plate for an electronic device, comprising the following steps: S1: Obtain a glass substrate 1 obtained by the preceding process. One side surface of the glass substrate 1 includes a frame area 10 located at the edge, a display area 12 located in the middle, and at least one device hole area 14 disposed in the frame area 10 or the display area 12. The surface of the device hole area 14 is a smooth surface without AG treatment, and an AG layer 141 is formed on the surface of the adjacent area of ​​the device hole area 14. S2: A semi-finished product is obtained by using a first screen printing stencil to screen print a ring of masking ink around each of the device hole areas 14 on the glass substrate 1 to form a masking ring 3. The width of the masking ring 3 is 0.6-1mm and the inner ring edge and outer ring boundary of the masking ring 3 are located inside and outside the boundary of the corresponding device hole area, respectively. S3: Using a second screen printing plate, masking ink is screen printed on the outer surface of the semi-finished product, corresponding to the outer edge of the frame area 10 and the masking ring 3, to form a masking layer 5. The masking layer 5 has a recessed hole 50 centered on the masking ring 3, the boundary of which is between the inner and outer ring edges of the masking ring 3; and S4: Perform a curing process on the masking ink to be cured.

[0027] In this embodiment of the invention, a shielding ring 3 is first screen-printed on a glass substrate 1 to surround and center the device aperture area 14. The width of the shielding ring 3 is designed to be only 0.6-1.0 mm, which is small in size. The area of ​​the first screen printing stencil used is relatively small, resulting in less stencil deformation during screen printing. High-precision alignment can be achieved through simple visual or mechanical positioning, making the concentricity between the shielding ring 3 and the device aperture area 14 higher. Furthermore, by designing the inner and outer ring edges of the shielding ring 3 to be located inside and outside the boundary of the corresponding device aperture area 14, respectively, it is ensured that the shielding ring 3 can effectively cover the edge of the device aperture area 14, preventing light leakage. Then, a secondary screen printing masking layer 5 is used to cover the frame area 10 of the glass substrate 1 and the outer edge of the masking ring 3. The masking layer 5 is designed with corresponding clearance holes 50 that are centered on the masking ring 3, and the boundary of the clearance holes 50 is between the inner and outer ring edges of the masking ring 3, ensuring the connection and fusion between the masking inks. During the secondary screen printing, it is only necessary to ensure that the clearance holes 50 are centered on the masking ring 3. Even if the boundary of the clearance holes 50 is slightly deformed, the deformed area will not exceed the range of the masking ring 3, so as not to have a substantial impact on the overall masking effect, effectively reducing the screen printing difficulty and facilitating the forming process.

[0028] In specific implementation, the preceding process refers to the AG processing process, which can be a common process for forming the AG layer 141 on the surface of the glass substrate 1, such as AG spraying or AG etching. In addition, the width of the shielding ring 3 is preferably 0.6 mm. Furthermore, the device hole area 14, the shielding ring 3, and the clearance hole 50 are usually circular for easy processing.

[0029] In an optional embodiment of the present invention, the distance between the inner edge of the shielding ring 3 and the boundary of the corresponding device aperture area 14 is no greater than 0.05 mm. In this embodiment, by reasonably designing the size of the inner edge of the shielding ring 3 extending beyond the boundary of the device aperture area 14, it can be ensured that the shielding ring 3 can effectively cover the edge of the device aperture area 14, thus preventing light leakage.

[0030] In an optional embodiment of the present invention, the distance between the boundary of the clearance hole 50 and the outer ring edge of the shielding ring 3 is 0.3 mm. In this embodiment, the above dimensions are used to ensure that the edge of the clearance hole 50 of the shielding layer 5 can completely cover the outer ring edge of the shielding ring 3, avoiding exposure of the inner glass substrate 1, and making screen printing easier.

[0031] In an optional embodiment of the present invention, the distance between the inner ring boundary of the shielding ring 3 and the boundary of the corresponding device aperture area 14 is 0.01mm-0.05mm. This embodiment rationally designs the distance between the inner ring edge of the shielding ring 3 and the boundary of the device aperture area 14, ensuring that the shielding ring 3 effectively covers the edge of the device aperture area 14, preventing light leakage. Furthermore, this distance parameter is easy to handle in screen printing. In this embodiment, the distance between the inner ring edge of the shielding ring 3 and the inner side of the boundary of the device aperture area 14 is 0.05mm.

[0032] In an optional embodiment of the present invention, the surface of the glass substrate is first cleaned, and then the masking ring 3 and the masking layer 5 are sequentially formed on one side surface of the glass substrate 1. The cleaning process is performed using plasma water cleaning. In this embodiment, the surface of the glass substrate 1 is cleaned first, and then the masking ring 3 and the masking layer 5 are screen-printed sequentially. Plasma water cleaning can quickly clean the surface of the glass substrate, improve the surface energy of the glass substrate 1, and ensure that the masking ink can be stably bonded to the glass substrate.

[0033] In an optional embodiment of the present invention, the mesh count of the second screen printing stencil is lower than that of the first screen printing stencil. In this embodiment, the high-mesh-count first screen printing stencil has a small ink leakage and a fine and uniform coating, which can accurately form a narrow-edge annular masking ring 3, so that the inner edge of the masking ring 3 can stably maintain a minimum distance of ≤0.05mm from the boundary of the device hole area 14, with neat boundary lines, no ink overflow, and no jagged offset; while the low-mesh-count second screen printing stencil has a larger ink volume per stroke and a thicker coating. The formed outer masking layer 5 covers the outer side of the masking ring 14 and the frame area 10 of the glass substrate 1, which can significantly improve the thickness and mechanical strength of the overall ink composite layer and enhance the adhesion between the ink layer and the glass substrate 1.

[0034] In an optional embodiment of the present invention, the curing process of the masking ink to be cured specifically includes: after each formation of the masking ring 3 or the masking layer 5, the masking ink forming the masking ring 3 or the masking layer 5 is cured, such as... Figure 6 Steps S4a and S4b are shown; or, after the shielding ring 3 and the shielding layer 5 are both formed, the shielding ink forming the shielding ring 3 and the shielding layer 5 is subjected to a co-curing treatment, such as... Figure 7 The step S4 shown is illustrated. This embodiment provides two curing process arrangements: the masking ring 3 and the masking layer 5 can be cured immediately after their respective screen printing, i.e., two curing processes are performed. This is particularly suitable for situations where the masking ring 3 and the masking layer 5 are screen printed with different masking inks, and therefore require different process conditions and parameters for separate curing. When the masking ring 3 and the masking layer 5 are screen printed with the same or similar masking inks, from the perspective of material properties, the same process conditions and parameters can be used for curing. Although two curing processes can also be performed separately, from the perspective of reducing processes and improving efficiency, it is preferable to achieve joint curing through a single curing process after both the masking ring 3 and the masking layer 5 have been screen printed.

[0035] In an optional embodiment of the present invention, the shielding ring 3 and the shielding layer 5 are made of the same shielding ink or shielding inks with similar optical properties that can be co-cured. In this embodiment, the shielding ring 3 and the shielding layer 5 use the same shielding ink, or shielding inks with similar optical properties that can be co-cured. The shielding ring 3 and the shielding layer 5 are less prone to color difference, and they form a visually integrated structure on the surface of the glass substrate 1. Furthermore, they can be easily co-cured in a single curing process, reducing the number of steps. Specifically, the shielding ink comprises, by weight percentage: 45%–55% modified acrylic resin, 15%–25% reactive diluent monomer, 6%–10% black opaque pigment, 3%–6% photoinitiator, 1%–3% functional additives, and the remainder being solvent.

[0036] In an optional embodiment of the present invention, the masking ink to be cured is baked to achieve the curing process. The baking temperature is 145-155°C, and the baking time is 25-35 minutes. In this embodiment, when the masking ink is a thermosetting ink, the above baking parameters can be used to bake the glass substrate 1 to achieve the curing process. Specific experiments have shown that the masking ink can be effectively cured, and the curing effect is good. In specific implementation, the preferred baking temperature is 150°C, and the baking time is 30 minutes. It is understood that if a photocurable masking ink is used, UV light irradiation can be considered for curing.

[0037] On the other hand, such as Figures 1-5 As shown, another optional embodiment of the present invention also provides a glass cover for an electronic device, comprising: A glass substrate 1, one side surface of which includes a frame area 10 located at the edge, a display area 12 located in the middle, and at least one device hole area 14 disposed in the frame area 10 or the display area 12. The surface of the device hole area 14 is a smooth surface without AG treatment, and an AG layer 141 is formed on the surface of the adjacent area of ​​the device hole area 14. A shielding ring 3 is provided, which corresponds one-to-one with and is centered on the device hole area 14. The width of the shielding ring 3 is 0.6-1mm, and the inner and outer ring edges of the shielding ring 3 are located inside and outside the boundary of the corresponding device hole area 14, respectively. The masking layer 5 covers the outer edge of the frame area 10 and the masking ring 3. The masking layer 5 has a clearance hole 50 corresponding to each of the masking rings 3. The clearance hole 50 is centered with the corresponding masking ring 3. The boundary of the clearance hole 50 is between the inner and outer ring edges of the masking ring 3. The masking ring 3 and the masking layer 5 are formed by screen printing masking ink and then cured.

[0038] In this embodiment, the traditional masking layer is divided into two parts: a masking ring 3 and a masking layer 5, as described in this invention. This facilitates the process of first screen printing the masking ring 3 and then screen printing the masking layer 5. The masking ring 3 is centered with the device aperture area 14. Due to the small size of the masking ring 3, the area of ​​the first screen printing plate used is correspondingly smaller, resulting in less deformation during printing. High-precision alignment can also be achieved through simple visual or mechanical positioning, making the concentricity between the masking ring 3 and the device aperture area 14 higher. Furthermore, the inner and outer ring edges of the masking ring 3 are respectively located at the corresponding... The inner and outer sides of the boundary of the device hole area 14 ensure that the shielding ring 3 can effectively cover the edge of the device hole area 14 to prevent light leakage; while the boundary of the avoidance hole 50 designed on the shielding layer 5 is between the inner and outer ring edges of the shielding ring 3, thereby ensuring the connection and fusion between the shielding inks. During the secondary screen printing, it is only necessary to ensure that the avoidance hole 50 is aligned with the shielding ring 3. Even if the boundary of the avoidance hole 50 is slightly deformed, the deformed area will not exceed the range of the shielding ring 3, thus not having a substantial impact on the overall shielding effect, effectively reducing the difficulty of screen printing and facilitating molding.

[0039] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims. All of these forms are within the scope of protection of the present invention.

Claims

1. A method for processing a glass cover plate for an electronic device, characterized in that, The method includes the following steps: A glass substrate is obtained by a previous process. One side surface of the glass substrate includes a frame area located at the edge, a display area located in the middle, and at least one device hole area disposed in the frame area or the display area. The surface of the device hole area is a smooth surface without AG treatment, while the surface of the adjacent area of ​​the device hole area is formed with an AG layer. A semi-finished product is obtained by screen printing a ring of masking ink around each of the device hole areas on the glass substrate using a first screen printing stencil. The masking ring corresponds one-to-one with the device hole areas and is centered accordingly. The width of the masking ring is 0.6-1mm and the inner and outer ring edges of the masking ring are located inside and outside the boundary of the corresponding device hole area, respectively. A second screen printing stencil is used to screen print masking ink onto the outer surface of the semi-finished product, corresponding to and covering the border area and the outer edge of the masking ring, to form a masking layer. The masking layer has recessed holes centered on the masking ring, the boundaries of which are located between the inner and outer edges of the masking ring. The masking ink to be cured is subjected to a curing process.

2. The method for processing the glass cover of the electronic device as described in claim 1, characterized in that, The distance between the inner edge of the shielding ring and the boundary of the corresponding device hole area is no greater than 0.05 mm.

3. The method for processing the glass cover of an electronic device as described in claim 2, characterized in that, The distance between the boundary of the clearance hole and the outer edge of the shielding ring is 0.3 mm.

4. The method for processing the glass cover of the electronic device as described in claim 2, characterized in that, The distance between the inner ring boundary of the shielding ring and the corresponding boundary of the device hole area is 0.01mm-0.05mm.

5. The method for processing the glass cover of the electronic device as described in claim 1, characterized in that, First, the surface of the glass substrate is cleaned, and then the shielding ring and the shielding layer are formed sequentially on one side surface of the glass substrate. The cleaning process is performed by cleaning with plasma water.

6. The method for processing the glass cover of the electronic device as described in claim 1, characterized in that, The mesh count of the second screen printing plate is lower than that of the first screen printing plate.

7. The method for processing the glass cover of the electronic device as described in claim 1, characterized in that, The curing process of the masking ink to be cured specifically includes: curing the masking ink that forms the masking ring or the masking layer after the masking ring or the masking layer is formed; or, after the masking ring and the masking layer are both formed, performing a joint curing process on the masking ink that forms the masking ring and the masking layer.

8. The method for processing the glass cover of the electronic device as described in claim 1 or 7, characterized in that, The shielding ring and the shielding layer are made of the same shielding ink or shielding ink with similar optical properties that can be cured together.

9. The method for processing the glass cover of the electronic device as described in claim 1 or 7, characterized in that, The masking ink to be cured is baked to achieve the curing process. The baking temperature is 145-155°C and the baking time is 25-35 minutes.

10. A glass cover for an electronic device, comprising: A glass substrate, wherein one side surface of the glass substrate includes a frame area located at the edge, a display area located in the middle, and at least one device hole area disposed in the frame area or the display area, wherein the surface of the device hole area is a smooth surface without AG treatment, and an AG layer is formed on the surface of the adjacent area of ​​the device hole area. The glass cover plate is characterized in that it further includes: A shielding ring, wherein each shielding ring corresponds one-to-one with and is centered on the corresponding device hole area; the width of the shielding ring is 0.6-1mm, and the inner and outer edges of the shielding ring are located inside and outside the boundary of the corresponding device hole area, respectively; and A masking layer covers the frame area and the outer edge of the masking ring. The masking layer has a clearance hole corresponding to each of the masking rings. The clearance hole is centered with the corresponding masking ring. The boundary of the clearance hole is between the inner and outer ring edges of the masking ring. The masking ring and the masking layer are formed by screen printing masking ink and then cured.

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