A copper foil transportation packaging method based on microstructure anti-skid and edge stress release

Abstract

The application discloses a copper foil transportation packaging method and structure based on microstructure anti-skid and edge stress release, and belongs to the technical field of metal material transportation packaging. In view of the problems of interlayer slippage and inverted triangular wrinkle prone to occur in the transportation of ultra-thin lithium battery copper foil, the application proposes a trinity collaborative scheme of "microstructure anti-skid isolation film + edge wave pretreatment + axial dynamic tensioning". Firstly, wave-shaped pre-wrinkling forming is carried out on the two side edges of the copper foil before winding, so as to release the transportation stress; secondly, the high-friction-coefficient isolation film with micron-level rhombic convex patterns is laid between layers, so as to realize mechanical and friction combined anti-skid; finally, the damping fixing parts with disc springs are installed at both ends of the coiled material, so as to provide constant axial pretightening force to adapt to environmental changes. The method cuts off the wrinkle generation chain from the root, realizes nearly zero slippage, reduces the inverted triangular defect occurrence rate to below 1%, avoids the pressure injury problem of traditional hard packaging, and is completely anti-skid and wrinkle-free.

Description

Technical Field

[0001] This invention relates to the field of copper foil packaging technology, and in particular to a copper foil transport packaging method based on microstructure anti-slip and edge stress release. Background Technology

[0002] Lithium-ion battery copper foil, especially ultra-thin copper foil (≤6μm), is easily affected by vibration during transportation, and the interlayer is prone to slight relative displacement. Existing technologies mostly solve this problem by physical compression (such as packing straps or wooden boards), but rigid compression can cause local stress concentration at the edges of the copper foil, forming inverted triangular wrinkles.

[0003] Currently, there is a lack of a non-rigid pressing technology that achieves absolute interlayer anti-slip through microstructural modification while simultaneously releasing edge stress.

[0004] To address these issues, we propose a copper foil transport packaging method based on microstructure anti-slip and edge stress release. Summary of the Invention

[0005] The purpose of this invention is to provide a copper foil transport packaging method based on microstructure anti-slip and edge stress release, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A copper foil transport packaging method based on microstructure anti-slip and edge stress relief includes the following steps: S1: After the copper foil is cut and before it is wound up, the two side edges of the copper foil are pre-formed in a wavy shape to form a continuous elastic buffer structure. The wave height is 0.8mm ~ 1.2mm, the wavelength is 4mm ~ 6mm, and the width of the forming process is 5mm ~ 10mm inside the edge of the copper foil. S2: When the copper foil is wound up, a layer of anti-slip isolation film with a micron-level textured structure is laid between each layer of copper foil. The substrate of the isolation film is PET or PE film with a thickness of 0.05mm to 0.08mm. S3: Install axial tension damping fasteners on both ends of the copper foil roll and apply a preload to the fasteners to provide a constant axial clamping force of 500N to 2000N to the copper foil roll.

[0007] Furthermore, in step S1, the wavy preforming is achieved by rolling with a set of guide rollers that are paired with concave and convex shapes, and the pressure applied between the guide rollers is 0.2MPa ~ 0.5MPa.

[0008] Furthermore, in step S2, the anti-slip isolation film has an array of diamond-shaped raised textures on its main working surface. The height of the diamond-shaped raised textures is 20μm to 30μm, and the center-to-center distance between adjacent diamond-shaped raised textures is 1mm to 2mm.

[0009] Furthermore, the diamond-shaped texture is made of silicone with a high coefficient of friction or modified thermoplastic polyurethane (TPU).

[0010] Furthermore, the anti-slip isolation film has an edge reinforcement strip with a width of 10mm to 15mm on each side along its width direction, and this area does not contain the diamond-shaped ridges; for copper foil rolls weighing ≤500kg, the edge reinforcement strip is a pressure-sensitive anti-slip adhesive layer; for copper foil rolls weighing >500kg, the edge reinforcement strip is an annular raised toothed structure.

[0011] Furthermore, in step S3, the axial tension damping fastener includes a main body plug and at least one set of disc spring plates installed inside the plug; the fastener is connected to the copper foil roll core by an interference fit.

[0012] Furthermore, during installation, the disc spring is pre-compressed by 10% to 15% of its total stroke to provide the constant axial preload.

[0013] Furthermore, an EVA buffer pad with a thickness of 3mm to 5mm is pasted on the part of the axial tension damping fastener that contacts the end face of the copper foil roll.

[0014] A second objective of this invention is to provide a copper foil roll packaging structure for implementing the above-described copper foil transport packaging method, comprising: Copper foil that has undergone wavy preforming treatment; An anti-slip isolation film with a micron-level diamond-shaped textured array structure is disposed between the copper foil layers; Axial tension damping fasteners with built-in disc spring assemblies are installed at both ends of the copper foil roll.

[0015] Furthermore, the anti-slip isolation film is made of PET or PE substrate with a thickness of 0.05mm to 0.08mm, the height of the diamond-shaped ridges on the film is 20μm to 30μm, and the spacing is 1mm to 2mm. An EVA buffer pad is provided between the end face of the axial tension damping fixing member and the end face of the copper foil roll.

[0016] Compared with the prior art, the advantages of this invention are: 1. Thorough anti-slip: The microstructure texture increases the interlayer friction coefficient to over 0.6, which is close to zero compared to ordinary isolation films (around 0.2).

[0017] 2. Elimination of inverted triangles: Edge wave pretreatment directly releases the edge tensile stress that is most likely to occur during transportation. Actual measurements show that the incidence of inverted triangle defects has decreased by more than 95%.

[0018] 3. Better damage reduction: Compared to the squeezing of rigid packaging, this solution is gentler and avoids hard indentations on the edges of the copper foil.

[0019] 4. Low cost: Microstructured membranes can be mass-produced industrially without the need for thickened wooden crates or expensive support structures, resulting in significant cost reduction and efficiency improvement. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall transport packaging structure of the present invention; Figure 2 This is a schematic diagram of the disassembled structure of the axial tension damping fixing component in this invention.

[0021] In the figure: 1. Copper foil roll; 2. Axial tension damping fastener; 21. Main body plug; 22. Disc spring assembly; 23. EVA buffer pad. Detailed Implementation

[0022] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0023] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] This invention provides a copper foil transport packaging method based on microstructured anti-slip and edge stress relief, which adopts a combination of "microstructured anti-slip film + edge wave pretreatment", as detailed below: I. Microstructured anti-slip isolation film layer This module achieves physical interlocking anti-slip between copper foil layers through microstructural modification, replacing traditional rigid extrusion, and is the core technology for solving the problem of relative displacement between layers.

[0026] Substrate selection and thickness design The preferred substrate is 0.05mm-0.08mm thick PET or PE film: PET substrate has high mechanical strength and good temperature resistance (-20℃~120℃), which is suitable for the temperature difference environment of long-distance sea / land transportation; PE substrate has better flexibility and lower cost, which is suitable for short-distance, light-load transportation scenarios.

[0027] Thickness control criteria: When the thickness is <0.05mm, the film is prone to tearing under winding tension, and the microstructure is prone to deformation and failure; when the thickness is >0.08mm, it will significantly increase the overall diameter of the copper foil roll, reduce the single roll loading capacity, and increase packaging costs.

[0028] Micron-scale rhomboid textured array design Structure selection: A diamond-shaped embossed pattern is used instead of a circular or square embossed pattern because the slanted edge structure of the diamond shape can simultaneously restrict the lateral and longitudinal slippage between copper foil layers, increasing the interlocking area by more than 40% compared to the circular embossed pattern, resulting in a more balanced anti-slip effect.

[0029] Table 1 Key Parameters and Design Logic

[0030] Material: The embossed texture is made of high-friction coefficient silicone or modified TPU. Silicone has a stable coefficient of friction (0.7-0.8) and strong aging resistance; modified TPU has good elasticity and wear resistance and can withstand repeated compression during winding. Neither material will chemically react with copper foil and there is no residual pollution.

[0031] Molding process: Roller embossing is preferred (suitable for large-scale mass production, with an accuracy of ±2μm), while screen coating can be used for small-batch customization; the embossing temperature is controlled at 60℃-80℃ to ensure full embossing without damaging the substrate.

[0032] Edge reinforcement strip design A 10mm-15mm non-roughed area is reserved on both sides of the width of the separator. This area is the main stress concentration zone at the edge of the copper foil roll, and the microstructure is prone to failure due to repeated extrusion.

[0033] Two enhancement options: Lightweight rolls (≤500kg): Coated with a 5μm-10μm thick pressure-sensitive anti-slip adhesive layer. The adhesive layer is made of acrylic ester material, leaving no residue and resistant to high and low temperatures; Heavy-duty coils (>500kg): Annular raised teeth (tooth height 0.1mm, tooth pitch 0.5mm) are provided. The teeth and the copper foil edge are mechanically engaged to further enhance the edge anti-slip ability.

[0034] II. Edge wavy pre-pleating process This process eliminates the conditions for the formation of inverted triangular wrinkles at the source by pre-introducing controlled elastic deformation at the edge of the copper foil to form a stress buffer reserve area.

[0035] The principle behind this process is that during the transportation of copper foil, the lateral tensile stress generated by bumps and vibrations concentrates at the edges of the foil. When the stress exceeds the elastic limit of the copper foil, irreversible inverted triangular wrinkles will form. The pre-wrinkling process creates a continuous wavy elastic structure at the edges of the copper foil. The tensile stress during transportation is absorbed by the elastic expansion and contraction of the waves and will not be transmitted to the interior of the copper foil.

[0036] Key points of process implementation and control Implementation timing: After the copper foil slitting process and before the winding process, it is completed by a special edge forming guide roller group. The forming speed is synchronized with the slitting speed (100m / min-300m / min) to ensure the uniformity of the wavy pattern.

[0037] Guide roller structure: The upper and lower rollers are paired with raised and recessed guide rollers. The upper roller has raised protrusions that match the target wave pattern, and the lower roller has grooves at the corresponding positions. The copper foil edge is formed by extrusion between the rollers. The pressure between the rollers is controlled at 0.2MPa-0.5MPa. If the pressure is too low, it cannot be formed, and if the pressure is too high, it will cause micro-cracks or even breakage at the edge of the copper foil.

[0038] Environmental control: The temperature in the molding workshop is maintained at 25℃-35℃ and the relative humidity at 40%-60% to prevent the copper foil from brittlely breaking at low temperatures and oxidizing and discoloring at high temperatures.

[0039] Table 2 Key Parameters and Design Logic

[0040] III. Axial Tension Damping Fixture This module is used to compensate for axial dimensional changes caused by thermal expansion and contraction during the transportation of copper foil rolls, maintaining a tight interlayer state at all times, and forming all-round protection in conjunction with the microstructure anti-slip film.

[0041] Structural details Main plug: Made of ABS engineering plastic or aluminum alloy. ABS is low-cost and has good insulation, making it suitable for regular transportation; aluminum alloy has high strength and impact resistance, making it suitable for large-diameter, heavy copper foil rolls (>3 tons). The plug and the roll core are connected with an H7 / p6 interference fit to ensure a firm and secure installation.

[0042] Core damping component: Internally embedded disc spring plate group, the spring plates are made of 65Mn spring steel and the surface is galvanized for rust prevention; the number and thickness of the spring plates are matched according to the weight of the copper foil roll: 3-5 spring plates with a thickness of 0.3mm are used for rolls under 500kg, and 5-8 spring plates with a thickness of 0.5mm are used for rolls from 500kg to 3 tons.

[0043] Buffer protection: At the contact point between the plug and the copper foil end face, attach a 3mm-5mm thick EVA buffer pad to prevent hard contact damage to the copper foil end face, and at the same time further absorb axial vibration.

[0044] Working parameters and principles Preload control: During installation, the disc spring is pre-compressed by 10%-15% to provide a constant axial preload of 500N-2000N.

[0045] Automatic compensation mechanism: During transportation, the copper foil will expand and contract by ±0.5mm / m due to changes in ambient temperature. The elastic deformation of the disc spring can automatically compensate for this dimensional change, always maintaining a tight fit between the copper foil layers and preventing the core from loosening and the layers from shifting.

[0046] V. Working Principle Interlayer locking mechanism: From "sliding friction" to "micro-interlocking integration" The nature of failure of traditional separators The interlayer contact of ordinary smooth PET / PE release films is surface-to-surface, with the actual effective contact area accounting for only 5%-10% of the theoretical area (affected by surface micro-roughness), and the static friction coefficient is only 0.15-0.25. When the vibration acceleration exceeds 0.5g during transportation, the interlayer static friction is insufficient to resist the tangential inertial force, and it will instantly change from "static friction" to "dynamic friction" (the dynamic friction coefficient is only 60%-70% of the static friction coefficient), resulting in irreversible interlayer relative displacement. This displacement is amplified at the edge of the copper foil roll, forming shear force, which is the initial cause of inverted triangular wrinkles.

[0047] Composite anti-slip mechanism of microstructured texture The rhomboid textured array of this invention achieves dual anti-slip properties through "micro-penetration engagement + high-friction material adhesion," upgrading the interlayer action from simple friction to a composite force of mechanical engagement and friction. Micro-elastic indentation effect: Under winding tension (typically 50N-150N), the 20μm-30μm high silicone / TPU texture will penetrate the copper foil surface, forming an elastic indentation of approximately 3μm-5μm depth (the elastic deformation limit of the copper foil is approximately 8μm; this indentation can be completely recovered under subsequent slitting and coating tension without leaving permanent damage). There are approximately 25-100 engagement points per square centimeter, increasing the effective contact area to 8-10 times that of ordinary release films.

[0048] • Adhesion effect of high-friction materials: The interfacial adhesion between silicone / TPU material and copper foil is much greater than that between plastic and copper foil. On the basis of micro-indentation, the tangential resistance is further increased, so that the overall static friction coefficient is stabilized at 0.6-0.8.

[0049] Omnidirectional locking with a diamond-shaped structure: The hypotenuse of the diamond-shaped ridge forms a 45° angle with both the transverse and longitudinal directions of the copper foil, which can simultaneously restrict slippage in both the X and Y directions. Compared with circular ridges (which can only restrict normal slippage), the omnidirectional anti-slip capability is improved by more than 60%.

[0050] The "dam-breaking" function of edge reinforcement strips Interlayer slippage in copper foil rolls always begins at the edges (where there is no constraint and the stress concentration factor is 3-5 times that of the center). The anti-slip adhesive layers / annular serrations on both sides of the release film are specifically designed for the edge area. Through stronger adhesion or mechanical interlocking, they form an "edge locking band" to prevent slippage from spreading from the edge to the center, thus avoiding a chain reaction of "edge misalignment → overall unwinding".

[0051] II. Edge Pressure Relief Mechanisms: From "Stress Concentration" to "Elastic Buffering" The mechanical principle of inverted triangle fold formation The yield strength of ultrathin copper foil (≤6μm) is only 220MPa-280MPa, and the edges have a large number of microcracks due to slitting marks, resulting in a stress concentration factor as high as 5-8. When a small displacement (≥0.5mm) occurs between layers, the edges of the copper foil will be subjected to uneven transverse tensile stress. The shear force generated by the displacement is converted into tensile stress at the edge, which is concentrated at the tip of the slitting mark; When the local tensile stress exceeds the yield strength of the copper foil, plastic deformation will occur; Subsequent continuous vibration will cause plastic deformation to accumulate, eventually forming an "inverted triangular fold" with the tip pointing towards the core.

[0052] Stress relief mechanism of wavy pre-folds This process transforms the copper foil edge from a "rigid, flat structure" to an "elastic, wavy structure" by introducing controlled elastic deformation in advance, thus eliminating the conditions for stress concentration at the source. Elastic reserve space: The wave-shaped structure with a wave height of 0.8mm-1.2mm has an elastic expansion margin of about 0.3mm-0.5mm under natural conditions. When subjected to lateral tensile stress, the wave crests are straightened and the troughs are compressed, absorbing stress energy through its own elastic deformation, rather than allowing the copper foil body to undergo plastic deformation.

[0053] Stress dispersion effect: The continuous wave-like structure evenly distributes the tensile stress, which was originally concentrated at a single point, throughout the entire wave cycle, reducing the local maximum stress by more than 70%. Finite element analysis shows that under the same tensile stress, the maximum stress at the pre-wrinkled edge is only 25%-30% of that at the straight edge, far lower than the yield strength of the copper foil.

[0054] Microcrack passivation effect: The edge microcracks generated during slitting are passivated by slight plastic deformation during wave forming. The stress concentration factor at the crack tip is reduced from 5-8 to 2-3, which greatly reduces the risk of crack propagation.

[0055] Key logic of parameter matching Wave height < 0.8mm: Insufficient elastic expansion margin, unable to absorb the stress generated by large amplitude vibration; Wave height > 1.2mm: Edge flatness exceeds the standard, which will cause "thick edge" defects during subsequent lithium battery coating, affecting the consistency of the electrode sheet; Wavelength 4mm-6mm: This balances stress dispersion with molding difficulty. Too short a wavelength can easily lead to edge fatigue fracture, while too long a wavelength will result in insufficient stress dispersion.

[0056] III. Axial Stability Mechanism: From "Rigid Fixation" to "Dynamic Tension Compensation" Failure problems of traditional axial fixation Traditional rigid wooden / plastic plugs are fixed using an interference fit + packing strap compression method, which has two fatal flaws: Thermal expansion and contraction mismatch: The coefficient of linear expansion of copper foil is And wood is Plastic is During long-distance transportation, the temperature difference environment (-20℃~60℃) causes inconsistent dimensional changes between the copper foil roll and the end cap. This can result in gaps that cause the core to loosen, or excessive tightness that squeezes the edges of the copper foil and causes indentations.

[0057] Vibration loosening: Continuous axial vibration will gradually cause the interference fit of the rigid plug to fail, the packing strap to loosen, and eventually the whole roll of copper foil to become loose.

[0058] Dynamic compensation principle of disc spring damping components The axial tension damping fastener utilizes the "variable stiffness constant elastic force" characteristic of disc springs to achieve real-time compensation for changes in the axial dimensions of the copper foil roll. Constant preload output: Within a compression deformation range of 10%-70%, the spring force change rate of the disc spring is <5%, providing an approximately constant axial preload. Pre-compression of 10%-15% during installation keeps the spring in its optimal operating range, outputting a stable preload of 500N-2000N.

[0059] Automatic thermal expansion and contraction compensation: When the temperature rises and the copper foil roll elongates axially, the spring is further compressed, and the elastic force remains basically unchanged; when the temperature drops and the copper foil roll shortens axially, the spring rebounds, always maintaining close contact with the end face of the copper foil. It can compensate for axial dimensional changes of ±2mm, completely covering the deformation caused by temperature differences during transportation.

[0060] Axial vibration absorption: The disc spring and the EVA buffer pad on the end face form a "spring-damping" system, which can absorb more than 80% of axial impact vibration and avoid damage to the copper foil end face due to collision.

[0061] IV. The Principle of Tripartite Collaborative Protection The three technical modules do not work independently, but form a closed-loop failure prevention system, completely severing the chain of generation of the inverted triangle folds: Base layer: Axial damping maintains tight interlayer fit and ensures that the microstructure protrusions are always in an effective interlocking state, providing the preconditions for interlayer locking; Core layer: The microstructured isolation membrane achieves absolute interlayer locking, controlling the interlayer displacement to within 0.1mm, thus eliminating the cause of edge tensile stress from the source; Protective layer: The edge pre-folds serve as the last line of defense. Even under extreme vibration, minor stress fluctuations can be absorbed through elastic deformation, preventing plastic deformation.

[0062] Table 3. Essential differences between this invention and traditional technologies

[0063] Verified over 15,000 kilometers of combined sea and land transport, this system can reduce the interlayer displacement of copper foil to <0.1mm, the maximum tensile stress at the edge to <50MPa (far below the yield strength), and reduce the incidence of inverted triangle defects from the traditional 20%-30% to below 1%.

[0064] Application example: It is used for export transportation of 6μm ultrathin lithium battery copper foil.

[0065] Step 1: During slitting, press a wavy pattern (1mm wave height, 5mm wavelength) into an 8mm area on both sides of the copper foil.

[0066] Step 2: Rewind, and lay a 0.05mm thick PET release film with diamond-shaped embossing between every two layers of copper foil. Coat the edges of the film with anti-slip adhesive.

[0067] Step 3: Install the damping plug with disc spring to apply axial preload.

[0068] Step 4: Standard cardboard box packaging, no additional heavy-duty reinforcement required.

[0069] After long-distance transportation testing, the copper foil surface showed no inverted triangles or interlayer misalignment, and its edge flatness index was far superior to the industry standard.

[0070] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0071] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A copper foil transport packaging method based on microstructure anti-slip and edge stress relief, characterized in that: Includes the following steps: S1: After the copper foil is cut and before it is wound up, the two side edges of the copper foil are pre-formed in a wavy shape to form a continuous elastic buffer structure. The wave height is 0.8mm ~ 1.2mm, the wavelength is 4mm ~ 6mm, and the width of the forming process is 5mm ~ 10mm inside the edge of the copper foil. S2: When the copper foil is wound up, a layer of anti-slip isolation film with a micron-level textured structure is laid between each layer of copper foil. The substrate of the isolation film is PET or PE film with a thickness of 0.05mm to 0.08mm. S3: Install axial tension damping fasteners on both ends of the copper foil roll and apply a preload to the fasteners to provide a constant axial clamping force of 500N to 2000N to the copper foil roll.

2. The copper foil transport packaging method according to claim 1, characterized in that, In step S1, the wavy preforming is achieved by rolling with a set of guide rollers with paired concave and convex shapes, and the pressure applied between the guide rollers is 0.2MPa ~ 0.5MPa.

3. The copper foil transport packaging method according to claim 1, characterized in that, In step S2, the anti-slip isolation film has an array of diamond-shaped raised textures on its main working surface. The height of the diamond-shaped raised textures is 20μm to 30μm, and the center-to-center distance between adjacent diamond-shaped raised textures is 1mm to 2mm.

4. The copper foil transport packaging method according to claim 3, characterized in that, The diamond-shaped embossed pattern is made of high-friction silicone or modified thermoplastic polyurethane.

5. The copper foil transport packaging method according to any one of claims 3 or 4, characterized in that, The anti-slip isolation film has an edge reinforcement strip with a width of 10mm to 15mm on each side along its width direction, and this area does not contain the diamond-shaped ridges; for copper foil rolls weighing ≤500kg, the edge reinforcement strip is a pressure-sensitive anti-slip adhesive layer; for copper foil rolls weighing >500kg, the edge reinforcement strip is an annular raised toothed structure.

6. The copper foil transport packaging method according to claim 1, characterized in that, In step S3, the axial tension damping fastener includes a main body plug and at least one set of disc spring plates installed inside the main body plug; the axial tension damping fastener is connected to the copper foil roll core by an interference fit.

7. The copper foil transport packaging method according to claim 6, characterized in that, During installation, the disc spring is pre-compressed by 10% to 15% of its total stroke to provide the constant axial preload.

8. The copper foil transport packaging method according to any one of claims 6 or 7, characterized in that, The portion of the axial tension damping fastener that contacts the end face of the copper foil roll is covered with an EVA buffer pad with a thickness of 3mm to 5mm.

9. A copper foil roll packaging structure for implementing the copper foil transport packaging method according to any one of claims 1-8, characterized in that, include: Copper foil that has undergone wavy preforming treatment; An anti-slip isolation film with a micron-level diamond-shaped textured array structure is disposed between the copper foil layers; Axial tension damping fasteners with built-in disc spring assemblies are installed at both ends of the copper foil roll.

10. The copper foil roll packaging structure according to claim 9, characterized in that, The anti-slip isolation film is made of PET or PE substrate with a thickness of 0.05mm to 0.08mm. The height of the diamond-shaped embossed pattern on the film is 20μm to 30μm and the spacing is 1mm to 2mm. An EVA buffer pad is provided between the end face of the axial tension damping fixing member and the end face of the copper foil roll.

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