A MEMS all-solid-state piezoelectric radiator and a heat dissipation channel

Abstract

The application discloses a MEMS all-solid-state piezoelectric radiator and a radiator flow channel. The MEMS all-solid-state piezoelectric radiator adopts an all-solid-state structure design, uses an efficient driving structure and an internal flow channel, and has the advantages of compact structure, simple driving method, low driving energy consumption and simple manufacturing mode under the premise of ensuring reliability, and solves the technical problems of high manufacturing cost and high manufacturing process requirement of the micro radiator in the prior art.

Description

Technical Field

[0001] This application relates to the fields of microelectromechanical systems (MEMS) and semiconductor heat dissipation technology, and in particular to a MEMS all-solid-state piezoelectric heat sink and heat dissipation channel. Background Technology

[0002] The miniature heat sink, manufactured using MEMS (Micro-Electro-Mechanical Systems) technology, achieves heat dissipation by generating airflow through the oscillation of a cavity and an oscillator.

[0003] In existing technologies, some traditional micro heat sinks are manufactured using metallic materials (such as copper and aluminum) combined with traditional MEMS processes, which has the following limitations:

[0004] Metal oscillators are limited by the material's ductility, making it difficult to achieve ultra-thin (millimeter-level) structures and integrate with silicon-based chips. Metal piezoelectric drives require high voltages (typically >5V), increasing system power consumption and requiring external drive circuits.

[0005] On the other hand, some traditional micro heat sinks are manufactured using MEMS technology. Due to the complexity of the driving circuit, multiple special waveform driving signals need to be accurately generated and synchronized. In addition, the manufacturing precision requirements are high, and the size of the oscillator structure must be consistent. Otherwise, it is difficult to achieve precise phase control between the oscillators. Summary of the Invention

[0006] The main objective of this application is to provide a MEMS all-solid-state piezoelectric heat sink and heat dissipation channel. The MEMS all-solid-state piezoelectric heat sink adopts an all-solid-state structure design and uses a high-efficiency driving structure and internal flow channel. Under the premise of ensuring reliability, the structure is more compact, the driving method is simpler, the driving energy consumption is lower, and the manufacturing method is simpler, so as to solve the technical problems of high manufacturing cost and high manufacturing process requirements of micro heat sinks in the prior art.

[0007] To achieve the above objectives, in a first aspect, this application proposes a MEMS all-solid-state piezoelectric heat sink, comprising:

[0008] A flow channel layer, wherein the flow channel layer is provided with at least one channel that extends through itself;

[0009] One end of the channel is completely covered by the bottom plate, and the other end of the channel is partially covered by the drive layer. The flow channel layer, the bottom plate, and the drive layer together form the flow channel.

[0010] The driving layer is provided with an oscillator that cooperates with the channel. The oscillator does not completely cover the channel and forms an opening with the channel or the body of the driving layer. The oscillator is provided with a piezoelectric film. The oscillator is configured to vibrate under the drive of the piezoelectric film to change the volume of the flow channel and generate a heat dissipation airflow that enters or exits the flow channel from the opening.

[0011] Furthermore, the driving layer includes a body, an oscillator, a piezoelectric thin film, a driving electrode, and a ground electrode, wherein the body and the oscillator together form the aperture;

[0012] The piezoelectric film, the driving electrode, and the ground electrode together form a circuit. The piezoelectric film is configured to undergo periodic deformation when the driving electrode is connected to a driving signal and a DC bias voltage, so as to drive the oscillator to vibrate, thereby changing the volume of the flow channel and generating a heat dissipation airflow that enters or exits the flow channel from the orifice and whose angle range meets a preset angle range.

[0013] Furthermore, the MEMS all-solid-state piezoelectric heat sink is configured to be fabricated using metal processing or silicon-based processing, and the thickness of the oscillator is less than 100 μm.

[0014] Furthermore, when the MEMS all-solid-state piezoelectric heat sink is fabricated using metal processing, the piezoelectric thin film, the drive motor, and the ground electrode are all generated by coating, the flow channel layer and the base plate are both formed by casting, and the flow channel layer, the base plate, and the drive layer are assembled by bonding to obtain the MEMS all-solid-state piezoelectric heat sink.

[0015] Furthermore, when the MEMS all-solid-state piezoelectric heat sink is fabricated using silicon-based processes, the flow channel layer and the driving layer are integrally etched using SOI processes, the base plate is integrally formed by casting, and the integrally formed flow channel layer, driving layer and base plate are assembled by bonding to obtain the MEMS all-solid-state piezoelectric heat sink.

[0016] Furthermore, the flow channel layer is provided with at least two channels that penetrate itself, and the oscillator corresponding to each channel is configured to vibrate under the drive of the piezoelectric film according to the driving signal, so as to change the volume of the flow channel corresponding to the oscillator, generate heat dissipation airflow that enters or exits the flow channel from the corresponding orifice, and make the heat dissipation airflow generated by each oscillator superimpose to form a composite heat dissipation airflow.

[0017] Secondly, this application also proposes a heat dissipation channel, which is provided with a MEMS all-solid-state piezoelectric heat sink as described in any of the first aspects, and further includes:

[0018] A flow channel frame for connecting a target heat source, the flow channel frame having at least one heat dissipation inlet and at least one heat dissipation outlet, and a heat dissipation cavity connecting the heat dissipation inlet and the heat dissipation outlet being formed inside the flow channel frame;

[0019] The outer frame of the flow channel is provided with at least one of the MEMS all-solid-state piezoelectric heat sinks, so that gas enters the heat sink cavity from the heat sink inlet and then exits the heat sink cavity from the heat sink outlet.

[0020] The heat dissipation cavity is also equipped with fins that work in conjunction with the MEMS all-solid-state piezoelectric heat sink to increase the heat exchange area of ​​the heat dissipation channel and achieve airflow rectification.

[0021] Furthermore, the flow channel outer frame includes an upper plate and a lower plate. One end of the flow channel outer frame is provided with a heat dissipation air inlet, and the other end is provided with a heat dissipation air outlet. The heat dissipation air inlet, the heat dissipation air outlet, and the heat dissipation cavity are all arranged according to the length direction of the heat dissipation flow channel.

[0022] The lower plate is used to connect to the target heat source and is provided with at least three MEMS all-solid-state piezoelectric heat sinks arranged in the length direction of the heat dissipation channel. The inner side of the upper plate is provided with fins that respectively cooperate with the MEMS all-solid-state piezoelectric heat sinks.

[0023] The channel direction of the MEMS all-solid-state piezoelectric heat sinks arranged in the same direction is consistent with the height direction of the heat dissipation channel. Among the at least three MEMS all-solid-state piezoelectric heat sinks arranged in the same direction, at least one MEMS all-solid-state piezoelectric heat sink is configured as the first heat sink to be set in accordance with the position of the target heat source connected to the lower plate.

[0024] Furthermore, the outer frame of the flow channel is integrally formed, one end of the outer frame of the flow channel is provided with a heat dissipation air inlet, and the other end is provided with a heat dissipation air outlet. The heat dissipation air inlet is set according to the height direction of the heat dissipation flow channel, and the heat dissipation air outlet and the heat dissipation cavity are both set according to the length direction of the heat dissipation flow channel.

[0025] A MEMS all-solid-state piezoelectric heat sink is provided at one end of the outer frame of the flow channel with a heat dissipation air inlet, and the channel direction of the MEMS all-solid-state piezoelectric heat sink is consistent with the length direction of the heat dissipation flow channel.

[0026] The fins are configured to work in conjunction with the target heat source connected to the outer frame of the flow channel.

[0027] Furthermore, the outer frame of the flow channel is integrally formed, one end of the outer frame of the flow channel is provided with a heat dissipation air inlet, and the other end is provided with a heat dissipation air outlet. Both the heat dissipation air inlet and the heat dissipation air outlet are arranged in the height direction of the heat dissipation flow channel, and the heat dissipation cavity is arranged in the length direction of the heat dissipation flow channel.

[0028] The outer frame of the flow channel is provided with a heat dissipation air inlet at one end, and a MEMS all-solid-state piezoelectric heat sink is provided as a second heat sink. The channel direction of the second heat sink is consistent with the length direction of the heat dissipation flow channel.

[0029] The outer frame of the flow channel is provided with a heat dissipation outlet at one end, and a MEMS all-solid-state piezoelectric heat sink is provided as a third heat sink. The channel direction of the third heat sink is consistent with the height direction of the heat dissipation flow channel.

[0030] The fins are configured to work in conjunction with the target heat source connected to the outer frame of the flow channel.

[0031] This application provides a MEMS all-solid-state piezoelectric heat sink and heat dissipation channel. The MEMS all-solid-state piezoelectric heat sink adopts an all-solid-state structure design and uses a high-efficiency driving structure and internal flow channel. Under the premise of ensuring reliability, the structure is more compact, the driving method is simpler, the driving energy consumption is lower, and the manufacturing method is simpler. It solves the technical problems of high manufacturing cost and high manufacturing process requirements of micro heat sinks in the prior art. Attached Figure Description

[0032] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the MEMS all-solid-state piezoelectric heat sink in this application;

[0035] Figure 2 for Figure 1 Corresponding explosion diagram;

[0036] Figure 3 for Figure 1 The corresponding cross-sectional view along the AA direction;

[0037] Figure 4 This is a schematic diagram of the driving layer structure in Embodiment 1 of the MEMS all-solid-state piezoelectric heat sink in this application;

[0038] Figure 5 This is a schematic diagram of the air intake process of Embodiment 1 of the MEMS all-solid-state piezoelectric heat sink in this application;

[0039] Figure 6This is a schematic diagram of the exhaust process of Embodiment 1 of the MEMS all-solid-state piezoelectric heat sink in this application;

[0040] Figure 7 This is a schematic diagram of the air intake and exhaust directions of Embodiment 1 of the MEMS all-solid-state piezoelectric heat sink in this application;

[0041] Figure 8 This is a schematic diagram of the exhaust angle when the driving signal of Embodiment 1 of the MEMS all-solid-state piezoelectric heat sink in this application is superimposed with a negative bias.

[0042] Figure 9 This is a schematic diagram of the exhaust angle when the drive signal of Embodiment 1 of the MEMS all-solid-state piezoelectric heat sink in this application is superimposed with a positive bias.

[0043] Figure 10 This is a schematic diagram showing the change in exhaust angle of Embodiment 1 of the MEMS all-solid-state piezoelectric heat sink in this application;

[0044] Figure 11 This is a schematic diagram of the structure of Embodiment 2 of the MEMS all-solid-state piezoelectric heat sink in this application;

[0045] Figure 12 for Figure 11 Corresponding explosion diagram;

[0046] Figure 13 for Figure 11 A cross-sectional view along the BB direction;

[0047] Figure 14 This is a schematic diagram of the oscillator amplitude-drive signal frequency curve of Embodiment 2 of the MEMS all-solid-state piezoelectric heat sink in this application;

[0048] Figure 15 This is a schematic diagram of the exhaust process of the MEMS all-solid-state piezoelectric heat sink embodiment 2 in this application when the driving signal is 24.2KHz and a +24V positive bias is superimposed.

[0049] Figure 16 This is a schematic diagram of the exhaust process of the MEMS all-solid-state piezoelectric heat sink embodiment 2 in this application when the drive signal is 24.5KHz;

[0050] Figure 17 This is a schematic diagram of the exhaust process of the MEMS all-solid-state piezoelectric heat sink embodiment 2 in this application when the driving signal is 24.8KHz and superimposed with a -24V negative bias;

[0051] Figure 18 This is a schematic diagram of the composite airflow swept area of ​​Embodiment 2 of the MEMS all-solid-state piezoelectric heat sink in this application;

[0052] Figure 19This is a front view of the heat dissipation channel embodiment 3 in this application;

[0053] Figure 20 for Figure 19 Corresponding back structure diagram;

[0054] Figure 21 for Figure 19 Corresponding explosion diagram;

[0055] Figure 22 for Figure 19 Corresponding cross-sectional view in the CC direction;

[0056] Figure 23 This is a front view of the heat dissipation channel embodiment 4 in this application;

[0057] Figure 24 for Figure 23 Corresponding back structure diagram;

[0058] Figure 25 for Figure 23 Corresponding explosion diagram;

[0059] Figure 26 This is a schematic diagram of the heat dissipation channel in Embodiment 5 of this application;

[0060] Figure 27 for Figure 26 Corresponding DD direction cross-sectional view;

[0061] Figure 28 This is a front view of the heat dissipation channel embodiment 6 in this application;

[0062] Figure 29 for Figure 28 Corresponding back structure diagram;

[0063] Figure 30 for Figure 28 Corresponding EE direction section diagram;

[0064] Figure 31 This is an exploded view of embodiment 7 of the heat dissipation channel in this application;

[0065] Figure 32 Figure 31 The corresponding sectional view;

[0066] Figure 33 This is an exploded view of embodiment 8 of the heat dissipation channel in this application;

[0067] Figure 34 for Figure 33 The corresponding sectional view.

[0068] Explanation of icon numbers:

[0069] 1. Flow channel layer; 12. Channel; 2. Base plate; 3. Drive layer; 31. Oscillator; 32. Piezoelectric film; 33. Drive electrode; 34. Ground electrode; 4. Flow channel; 5. Orifice; 6. Flow channel outer frame; 61. Heat dissipation inlet; 62. Heat dissipation outlet; 63. Heat dissipation cavity; 64. Fin; 65. Upper plate; 66. Lower plate; 7. MEMS all-solid-state piezoelectric heat sink; 8. Target heat source; 9. Interface material; 10. Cold plate; 11. Driver micro-liquid pump.

[0070] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0071] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments. The components of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0072] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0073] Example 1

[0074] like Figures 1 to 10 As shown, this application provides an embodiment of a MEMS all-solid-state piezoelectric heat sink, comprising:

[0075] The flow channel layer 1 is provided with at least one channel 12 that extends through itself;

[0076] One end of the channel 12 is completely covered by the base plate 2, and the other end of the channel 12 is partially covered by the drive layer 3. The flow channel layer 1, the base plate 2, and the drive layer 3 together form the flow channel 4.

[0077] The driving layer 3 is provided with an oscillator 31 that cooperates with the channel 12. The oscillator 31 does not completely cover the channel 12 and forms an opening 5 together with the channel 12 or the body of the driving layer 3. The oscillator 31 is provided with a piezoelectric film 32. The oscillator 31 is configured to vibrate under the drive of the piezoelectric film 32, so as to change the volume of the flow channel 4 and generate a heat dissipation airflow that enters or exits the flow channel 4 from the opening 5.

[0078] Specifically, such as Figure 1 As shown, in this embodiment, a rectangular bar-shaped all-solid-state piezoelectric heat sink with a rectangular parallelepiped structure is provided, such as... Figure 2 As shown, the flow channel layer 1 adopts a rectangular frame structure and has a rectangular channel 12. One end of the channel 12 is completely covered by the rectangular base plate 2. The driving layer 3 has an oscillator 31 corresponding to the rectangular channel 12. The area of ​​the oscillator 31 projected onto the channel 12 is smaller than the cross-sectional area of ​​the channel 12, so that the other end of the channel 12 is only partially covered. Also, the oscillator 31 and the body of the driving layer 3 together form a long rectangular opening 5.

[0079] like Figure 3 As shown, during processing, by controlling the width and length of the orifice 5 and cooperating with the oscillator 31, the direction and magnitude of the final heat dissipation airflow can be controlled.

[0080] It should be noted that the all-solid-state piezoelectric heat sink adopts a rectangular shape in order to reduce the difficulty of processing, reduce the processing cost, and facilitate the control of the direction of the final heat dissipation airflow. The shape of the all-solid-state piezoelectric heat sink, the shape of the channel 12, the shape of the oscillator 31, the shape of the orifice 5, etc. can be other shapes, for example, the channel 12 and the oscillator 31 can be semi-circular, and the orifice 5 can be semi-circular.

[0081] In subsequent embodiments, since MEMS all-solid-state piezoelectric heat sinks will be used in combination, they will be referred to simply as heat dissipation units.

[0082] Furthermore, such as Figure 4 As shown, in an optional embodiment of this example, the driving layer 3 includes a body, an oscillator 31, a piezoelectric film 32, a driving electrode 33, and a ground electrode 34, wherein the body and the oscillator 31 together form the aperture 5;

[0083] The piezoelectric film 32, the driving electrode 33, and the ground electrode 34 together form a circuit. The piezoelectric film 32 is configured to undergo periodic deformation when the driving electrode 33 is connected to a driving signal and a DC bias voltage, so as to drive the oscillator 31 to vibrate, thereby changing the volume of the flow channel 4 and generating a heat dissipation airflow that enters or exits the flow channel 4 from the orifice 5 and whose angle range meets the preset angle range.

[0084] Specifically, the driving layer 3 utilizes the inverse piezoelectric effect of the piezoelectric film 32 to input the driving signal into the driving electrode 33, causing the piezoelectric film 32 to undergo periodic deformation, thereby realizing the vibration of the oscillator 31.

[0085] Alternatively, a bulk piezoelectric block can be provided in the flow channel layer 1 to replace the piezoelectric film 32 in the driving layer 3 to achieve oscillator driving.

[0086] This implementation eliminates the need for external drive circuits, reducing overall power consumption and achieving an ultra-thin millimeter-level structure, which is more conducive to integration and packaging with silicon-based chips. At the same time, the processing difficulty is greatly reduced, making it easier to achieve precise phase control between oscillators.

[0087] Furthermore, in an optional embodiment of this example, the MEMS all-solid-state piezoelectric heat sink is configured to be fabricated using metal processing or silicon-based processing, and the thickness of the oscillator 31 is less than 100 μm.

[0088] By adopting this embodiment, since the thickness of the oscillator 31 is less than 100um and the stiffness is extremely low, the driving power consumption of the oscillator 31 in the resonant state can be greatly reduced, and the unit driving power consumption is less than 100mw.

[0089] Furthermore, in an optional embodiment of this example, when the MEMS all-solid-state piezoelectric heat sink is fabricated using metal processing, the piezoelectric thin film 32, the drive motor 33, and the ground electrode 34 are all generated by coating, the flow channel layer 1 and the base plate 2 are both formed by casting, and the flow channel layer 1, the base plate 2, and the drive layer 3 are assembled by bonding to obtain the MEMS all-solid-state piezoelectric heat sink.

[0090] In another alternative embodiment, when the MEMS all-solid-state piezoelectric heat sink is fabricated using silicon-based processes, the channel layer 1 and the driving layer 3 are integrally etched using SOI processes, the base plate 2 is integrally formed by casting, and the integrally formed channel layer 1, driving layer 3 and base plate 2 are assembled by bonding to obtain the MEMS all-solid-state piezoelectric heat sink.

[0091] By adopting the above implementation method, manufacturing costs and manufacturing difficulty can be further reduced while ensuring reliability.

[0092] Specifically, in this embodiment, when operating at an unbiased exhaust angle, the drive signal frequency is 24.5±0.3KHz, and the AC voltage amplitude of the drive signal is 3.3-24V. The oscillator 31 resonates under this drive signal, vibrating at high speed, changing the volume of the flow channel 4. Intake and exhaust are completed through pressure changes within the flow channel 4. The intake state is as follows: Figure 5As shown, the state during exhaust is as follows Figure 6 As shown.

[0093] like Figure 5 As shown, the displacement amplitude of the oscillator 31 during its movement is defined as A, with upward movement being positive and downward movement being negative. In the initial stage of the air intake process, the oscillator 31 is located at displacement -A, with zero velocity, and begins to move upward. The upward movement of the oscillator 31 causes the volume of the flow channel 4 to increase, the air pressure in the flow channel 4 to decrease, and the airflow flows downward into the flow channel 4 along the orifice 5 until the oscillator 31 moves to displacement +A, at which point the air intake process ends.

[0094] like Figure 6 As shown, in the initial stage of the exhaust process, the oscillator 31 is located at displacement +A with zero velocity and begins to move downward. The downward movement of the oscillator 31 reduces the volume of the flow channel 4 and increases the air pressure in the flow channel 4. After the airflow is accelerated by the compression between the edge of the oscillator 31 and the outer wall of the flow channel 4, it is discharged upward along the orifice 5 into the flow channel 4 until the oscillator 31 moves to a displacement of -A, at which point the exhaust process ends.

[0095] like Figure 7 As shown, during the exhaust process, the airflow is accelerated by the edge of the oscillator 31 and the outer wall of the channel 4. The exhaust flow velocity is much higher than the intake flow velocity. At the same time, the exhaust flow is guided by the normal direction of the line connecting the center of the edge of the oscillator 31 and the upper end of the outer wall of the channel 4 when the oscillator 31 moves at its maximum speed, as specified by the orifice 5. The exhaust direction is perpendicular to the plane of the oscillator 31. Finally, this embodiment can realize the airflow direction of intake along the plane of the oscillator 31 and exhaust perpendicular to the plane of the oscillator 31, completing a large angle conversion of the intake and exhaust airflow directions of approximately 90°.

[0096] In this embodiment, when a DC bias voltage is applied, the oscillator 31 will undergo static deflection. The bias voltage when the oscillator 31 undergoes inward static deflection under the bias voltage is defined as negative bias, and the bias voltage when it undergoes outward static deflection is defined as positive bias. The absolute value of the deflection angle is positively correlated with the absolute value of the DC bias voltage. Combining the above features of this embodiment, the exhaust angle can be further adjusted by adjusting the drive signal and the DC bias voltage.

[0097] In this embodiment, the range of the DC bias voltage superimposed on the drive signal is ±24V. After the DC bias voltage is superimposed on the drive signal, the position of the oscillator with the maximum velocity changes, thereby changing the orifice direction and the exhaust angle. Figure 8 This refers to the exhaust angle when the drive signal is superimposed with a negative bias in this embodiment. Figure 9 This refers to the exhaust angle when the drive signal is superimposed with a positive bias in this embodiment.

[0098] Figure 10This is a schematic diagram showing the change in exhaust angle after the drive signal is superimposed with a DC bias voltage in this embodiment. By adjusting the DC bias voltage superimposed on the drive signal, the orifice direction can be changed over a wide range, thus affecting the exhaust angle. Since the outer wall of the flow channel 4 obstructs the exhaust airflow under negative bias to a certain extent, the maximum exhaust angle under negative bias is smaller than the maximum exhaust angle under positive bias. In this embodiment, the exhaust angle can be deflected 45° to the left when the bias voltage is positive bias and the voltage is +24V, and the exhaust angle can be deflected 25° to the right when the bias voltage is negative bias and the voltage is -24V, for a total exhaust angle adjustment range of 70° (45° + 25°). This allows this embodiment to achieve 70° sweeping or air delivery at any fixed angle within the 70° range.

[0099] In summary, this embodiment achieves efficient exhaust heat dissipation and a near 90° airflow direction conversion between intake and exhaust airflow through an all-solid-state structure and extremely small volume, especially a very small thickness. This feature makes it possible to deploy in confined spaces for extended periods. At the same time, the sweeping function of this embodiment expands the coverage area of ​​the exhaust airflow, which has a positive effect on improving the heat dissipation effect. This embodiment is particularly suitable for heat dissipation conditions where the target heat source is placed in an open space and can freely exchange gases with the external environment.

[0100] Example 2

[0101] like Figures 11 to 18 As shown, based on Embodiment 1, this application provides an embodiment of a MEMS all-solid-state piezoelectric heat sink. In this embodiment:

[0102] The flow channel layer 1 is provided with at least two channels 12 that pass through itself. The oscillator 31 corresponding to each channel 12 is configured to vibrate under the drive of the piezoelectric film 32 according to the driving signal, so that the volume of the flow channel 4 corresponding to the oscillator 31 changes, generating heat dissipation airflow that enters or exits the flow channel 4 from the corresponding orifice 5, and the heat dissipation airflow generated by each oscillator 31 is superimposed to form a composite heat dissipation airflow.

[0103] Specifically, Embodiment 2 is formed by two Embodiment 1 units arranged back to back in an array. A central anchoring region is formed through the inner wall of the flow channel 4 shared by the two Embodiment 1 units. Thanks to the central anchoring region, the oscillators of the two Embodiment 1 units have different but similar resonant frequencies due to energy coupling.

[0104] Example 2 uses the same drive signal to drive two back-to-back Example 1 units simultaneously. By changing the frequency of the drive signal, the direction of the combined heat dissipation airflow of the two airflows discharged from the two back-to-back Example 1 units can be changed. Based on the sweeping function of Example 1, a larger sweeping range than that of Example 1 can be achieved.

[0105] The dimensions of Example 2 are 10*6*0.6mm, and the structural diagram of Example 2 is as follows. Figure 11 As shown. The exploded view of Example 2 is shown below. Figure 12 As shown, Figure 13 The simplified cross-sectional diagram of BB in Example 2 is shown below. The simplified part is the driving layer 3. The simplified cross-sectional diagram includes the piezoelectric film 32, the oscillator 31, and the orifice 5, which belong to the driving layer 3 and are symmetrical from left to right. The inner wall of the flow channel 4 shared by the flow channel layer 1, the outer wall of the flow channel 4 which are symmetrical from left to right, the flow channel 4 which are symmetrical from left to right, and the bottom plate 2. The lower surface of the symmetrical oscillator 31, the orifice 5, the flow channel layer 1 and the bottom plate 2 together constitute the flow channel 4 of Example 2.

[0106] The preparation method of Example 2 is the same as that of Example 1. When Example 2 is working, the driving signal frequency is 25±0.8KHz, and the AC voltage amplitude of the driving signal is 3.3-24V. The left and right oscillators resonate under this driving signal. After superimposing the DC bias voltage, in Example 2, the orifices 5 of both units can achieve ±45° air sweeping function, with a total exhaust angle adjustment range of 45°+45° (90°). Compared with the exhaust angle adjustment range of 45°+25° (70°) in Example 1, Example 2 achieves a significant increase in the air sweeping area.

[0107] Example 2: Vibration amplitude of left and right oscillators 31 at different excitation frequencies, as shown below. Figure 14 As shown, the exhaust operation states of Example 2 under several different drive signal frequencies and bias voltages are illustrated, such as... Figure 15 , Figure 16 , Figure 17 As shown.

[0108] Figure 14 The amplitude-frequency response curves of the left and right oscillators are shown. The resonant frequencies of the left and right oscillators 31 differ by 1 kHz. By changing the frequency of the driving signal in Embodiment 2, the amplitudes of the left and right oscillators 31 can be alternating. By alternating the amplitudes, the pressure distribution near the two symmetrical orifices 5 can be changed, thereby realizing the basic air-sweeping function of Embodiment 2.

[0109] Figure 15 The figure shows the exhaust operation state of Example 2 when the drive signal frequency is 24.2KHz and a +24V positive bias voltage is superimposed. The arrows in the figure indicate the exhaust angle of each orifice. At this time, the amplitude of the left oscillator 31 is 35μm, and the amplitude of the right oscillator 31 is almost zero and can be ignored. The combined heat dissipation airflow direction is 45° to the left of the vertical direction.

[0110] Figure 16 The figure shows the exhaust operation state of Example 2 when the driving signal frequency is 24.5KHz. The arrows in the figure indicate the exhaust angle of each orifice. At this time, the amplitude of the left oscillator 31 is 40μm, and the amplitude of the right oscillator 31 is lower, at 5μm. The combined heat dissipation airflow direction is vertical.

[0111] Figure 17 The figure shows the exhaust operation state of Example 2 when the drive signal frequency is 24.8KHz and a negative bias voltage of -24V is superimposed. The arrows in the figure indicate the exhaust angle of each orifice. At this time, the amplitude of the left oscillator 31 is 35μm and the amplitude of the right oscillator 31 is 15μm. After the negative bias voltage is superimposed, the large amount of airflow discharged through the left orifice 5, which has already deflected to the right by 25°, is attracted by the low-pressure area formed by the small amount of airflow discharged near the right orifice 5, and thus achieves a larger angle of deflection to the right. Finally, the combined heat dissipation airflow of the left and right orifices 5 is deflected to the right by 45° in the vertical direction.

[0112] In Example 2, the left and right units of Example 1 are arranged back-to-back. The exhaust operation state when the drive signal frequency is 25.2-25.8 kHz and a ±24V bias voltage is applied is basically the same as the exhaust operation state described above when the frequency is 24.2-24.8 kHz and a ±24V bias voltage is applied, but the exhaust direction is symmetrical. Figure 18 This is a schematic diagram of the heat dissipation airflow sweeping in Example 2. The airflow can be completed through the relay of left and right orifices 5. Figure 18 The large-area airflow from point A to point B significantly increases the heat dissipation area.

[0113] Example 3

[0114] like Figures 19 to 22 As shown, this application provides an embodiment of a heat dissipation channel, which includes a MEMS all-solid-state piezoelectric heat sink as described in any of the embodiments of Embodiment 1 or Embodiment 2, and further includes:

[0115] The flow channel frame 6 is used to connect the target heat source. The flow channel frame 6 is provided with at least one heat dissipation inlet 61 and at least one heat dissipation outlet 62. The interior of the flow channel frame 6 forms a heat dissipation cavity 63 that connects the heat dissipation inlet 61 and the heat dissipation outlet 62.

[0116] The outer frame 6 of the flow channel is provided with at least one of the MEMS all-solid-state piezoelectric heat sinks 7 so that gas enters the heat sink cavity 63 from the heat sink inlet 61 and then exits the heat sink cavity 63 from the heat sink outlet 62.

[0117] The heat dissipation cavity 63 is also provided with fins 64 that cooperate with the MEMS all-solid-state piezoelectric heat sink 7, so as to increase the heat exchange area of ​​the heat dissipation channel and achieve the airflow rectification effect.

[0118] Furthermore, in an optional embodiment of this example, the flow channel frame 6 includes an upper plate 65 and a lower plate 66. One end of the flow channel frame 6 is provided with a heat dissipation air inlet 61, and the other end is provided with a heat dissipation air outlet 62. The heat dissipation air inlet 61, the heat dissipation air outlet 62, and the heat dissipation cavity 63 are all arranged according to the length direction of the heat dissipation flow channel.

[0119] The lower plate 66 is used to connect to the target heat source and is provided with at least three MEMS all-solid-state piezoelectric heat sinks 7 arranged in the length direction of the heat dissipation channel. The inner side of the upper plate 65 is provided with fins 64 that respectively cooperate with the MEMS all-solid-state piezoelectric heat sinks 7.

[0120] The channel 12 of the MEMS all-solid-state piezoelectric heat sinks 7 arranged in the same direction is consistent with the height direction of the heat dissipation channel. Among the at least three MEMS all-solid-state piezoelectric heat sinks 7 arranged in the same direction, at least one MEMS all-solid-state piezoelectric heat sink 7 is configured as the first heat sink to be set in accordance with the position of the target heat source connected to the lower plate 66.

[0121] Specifically, this embodiment uses a heat dissipation channel configuration similar to that of Embodiment 1. The front and back sides of Embodiment 3 are shown below. Figure 19 and Figure 20 As shown, the exploded view of Example 3 is as follows. Figure 21 As shown, it consists of an upper plate 65, a lower plate 66, and three MEMS all-solid-state piezoelectric heat sinks 7. The upper plate 65 and the lower plate 66 form the outer frame 6 of the heat dissipation channel. The upper plate 65 is provided with fins 64 on the inner side to increase the heat exchange area and achieve the airflow rectification effect.

[0122] Three MEMS all-solid-state piezoelectric heat sinks 7 are arranged sequentially along the heat dissipation channel in the direction of air intake and exhaust, and are embedded in the lower plate 66. In actual use, the unit spacing and the specific position of the central first heat sink can be adjusted according to the specific location of the target heat source.

[0123] The cross-section of Example 3 is as follows Figure 22 As shown, it characterizes the working mode of the heat dissipation channel. When the MEMS all-solid-state piezoelectric heat sinks 7 on both sides are driven, a positive bias needs to be superimposed to make the exhaust angle deflect to the right, which is used to accelerate the flow rate of gas in the channel along the inlet and outlet directions of the channel.

[0124] The first heat sink in the center is arranged directly above the target heat source 8 to realize the position setting of the target heat source 8 connected by the lower plate 66. When driving, a negative bias needs to be superimposed so that the exhaust angle is deflected to the left or without deflection, which is used to enhance the convective heat dissipation effect of the target heat source area. Embodiment 3 is suitable for heat dissipation conditions where the target heat source is placed in a closed space and there is no convective exchange between the internal gas and the external environment. It can achieve high heat flux density and efficient heat dissipation with a very small structural volume around the target heat source.

[0125] Of course, the total number of MEMS all-solid-state piezoelectric heat sinks 7 and the number of first heat sinks can be set according to the heat generation of the target heat source 8. In addition, the number and position of the first heat sinks can be set according to the number and position of the target heat source 8. In other preferred embodiments, the total number of MEMS all-solid-state piezoelectric heat sinks 7 can be greater than 3, the number of first heat sinks can be greater than 1 and the position is not necessarily in the center, but can be adjusted according to the specific working conditions of the target heat source.

[0126] Furthermore, since the heat dissipation channel in this embodiment is actually "straight line"—the directions of the heat dissipation inlet 61, the heat dissipation outlet 62, and the heat dissipation cavity 63 are the same—the three MEMS all-solid-state piezoelectric heat sinks 7 are arranged in the same direction along the heat dissipation channel. In other preferred embodiments, the heat dissipation channel can be "zigzag line"—the directions of the heat dissipation inlet 61, the heat dissipation outlet 62, and the heat dissipation cavity 63 are not the same. In this case, the multiple MEMS all-solid-state piezoelectric heat sinks 7 can be adjusted and set according to the actual working conditions.

[0127] Example 4

[0128] like Figures 23 to 25 As shown, this embodiment is an improvement on embodiment 3, replacing the central embodiment 1 unit with embodiment 2. The front and back of embodiment 4 are shown as follows. Figure 23 and Figure 24 As shown, the exploded view of the structure is as follows: Figure 25 As shown, after replacing the central Unit 1 of Embodiment 2 with Unit 2 of Embodiment 2, thanks to the fact that Unit 2 of Embodiment 2 can achieve a wider range of air sweeping angles than Unit 1 of Embodiment 2, Unit 4 of Embodiment 4 can achieve a larger area of ​​forced convection heat transfer to the core target heat source area to improve the heat dissipation effect compared to Unit 3 of Embodiment 3. The applicable working conditions of Unit 4 of Embodiment 4 are the same as those of Unit 3 of Embodiment 3.

[0129] Example 5

[0130] like Figures 26 to 27 As shown, this embodiment is a heat dissipation channel equipped with a unit of embodiment 1. In this embodiment, the outer frame 6 of the channel is integrally set. One end of the outer frame 6 of the channel is provided with a heat dissipation air inlet 61 and the other end is provided with a heat dissipation air outlet 62. The heat dissipation air inlet 61 is set in the height direction of the heat dissipation channel, and the heat dissipation air outlet 62 and the heat dissipation cavity 63 are both set in the length direction of the heat dissipation channel.

[0131] The outer frame 6 of the flow channel is provided with a MEMS all-solid-state piezoelectric heat sink 7 at one end of the heat dissipation air inlet 61. The channel 12 of the MEMS all-solid-state piezoelectric heat sink 7 is aligned with the length direction of the heat dissipation flow channel.

[0132] The fins 64 are configured to cooperate with the target heat source 8 connected to the outer frame 6 of the flow channel.

[0133] Specifically, such as Figure 26 As shown, this embodiment consists of a flow channel outer frame 6 and a MEMS all-solid-state piezoelectric heat sink 7 embedded in the side wall of the flow channel outer frame 6, with a cross-section DD as shown. Figure 27 As shown, it characterizes the working mode of the heat dissipation channel. As mentioned above, the MEMS all-solid-state piezoelectric heat sink 7 can achieve a large angle conversion of about 90° between its own air intake and exhaust airflow direction. In this embodiment, the gas is drawn in by the MEMS all-solid-state piezoelectric heat sink 7 placed on the side of the heat dissipation air intake 61. After the MEMS all-solid-state piezoelectric heat sink 7 converts the airflow angle, the gas turns 90° and is discharged along the direction of the heat dissipation air outlet 62. When the airflow flows through the fins 64 above the target heat source 8, it achieves forced convection heat transfer. The fins 64 also have the effect of airflow rectification. Compared with Embodiments 3 and 4, this embodiment provides the principle and feasibility of vertical deployment of the air intake and exhaust ports.

[0134] Example 6

[0135] like Figures 28 to 30 As shown, this embodiment is a heat dissipation channel equipped with two units of Embodiment 1. The outer frame 6 of the channel is integrally formed. One end of the outer frame 6 of the channel is provided with a heat dissipation air inlet 61 and the other end is provided with a heat dissipation air outlet 62. The heat dissipation air inlet 61 and the heat dissipation air outlet 62 are both arranged in the height direction of the heat dissipation channel, and the heat dissipation cavity 63 is arranged in the length direction of the heat dissipation channel.

[0136] The outer frame 6 of the flow channel is provided with a heat dissipation air inlet 61 at one end, and a MEMS all-solid-state piezoelectric heat sink is provided as a second heat sink. The channel 12 of the second heat sink is aligned with the length direction of the heat dissipation flow channel.

[0137] The outer frame 6 of the flow channel is provided with a heat dissipation outlet 62 at one end, and a MEMS all-solid-state piezoelectric heat sink is provided as a third heat sink. The channel 12 of the third heat sink is aligned with the height direction of the heat dissipation flow channel.

[0138] The fins 64 are configured to work in conjunction with the target heat source connected to the outer frame 6 of the flow channel.

[0139] Specifically, the front and back of the structure are as follows: Figure 28 and Figure 29 As shown, the cross-sectional view is as follows Figure 30 As shown, compared with Embodiment 5, this embodiment adds an Embodiment 1 unit at the exhaust port position, realizing a 90° change in the airflow angle near the exhaust port. Based on Embodiment 5, this embodiment realizes that the plane of the inlet and outlet is perpendicular to the airflow direction in the heat dissipation channel, providing more possibilities for the specific deployment scenarios of the heat dissipation channel.

[0140] Example 7

[0141] like Figures 31 to 32 As shown, in order to adapt to high heat density and distributed heat sources for efficient heat dissipation, this application provides an embodiment of a heat dissipation channel, which consists of a multi-heat dissipation unit array composed of multiple MEMS all-solid-state piezoelectric heat sinks 7 as in embodiment 1, and a channel frame 6 containing fins 64, which is installed above a target heat source 8 of the type of high heat density point heat source. In this embodiment, an interface material 9 is also placed between the target heat source 8 and the target heat source 8 to enhance the thermal conductivity.

[0142] Using this embodiment, the total heat dissipation power can be increased. In addition, each unit in the array can be controlled independently, thereby achieving zoned temperature control.

[0143] The array in Example 7 consists of M×N heat sinks from Example 1. The array's heat dissipation power is increased by approximately M×N times compared to Example 1, which can meet the heat dissipation needs of a distributed heat source consisting of multiple points with a heat density greater than 100W / cm2.

[0144] Independent temperature control of each heat dissipation unit in Embodiment 1 can be achieved by independently controlling the airflow and exhaust angle of each unit. The advantage of independent temperature control of each unit is that it can achieve precise thermal management of the core heat source, while optimizing the energy consumption of the heat dissipation system and reducing the overall driving power.

[0145] The number of units and their arrangement in Example 7 can be flexibly adjusted according to actual heat dissipation requirements.

[0146] Example 8

[0147] like Figures 33 to 34 As shown, this embodiment is an improvement on embodiment 7, by integrating the cold plate 10 with the heat dissipation unit array, and adding the cold plate 10 and its driver micro-liquid pump 11 between the target heat source 8, which is a high heat density point heat source, and the multi-unit heat dissipation array.

[0148] The heat dissipation of the point heat source can be accelerated by the circulation of the working fluid in the cold plate 10 to meet the heat dissipation challenge under higher heat density. The cold plate 10 is driven by multiple driver micro-liquid pumps 11 to quickly and accurately heat the high heat density point heat source, and then the heat is transferred from the cold plate 10 to the air by a multi-unit heat dissipation array.

[0149] In summary, the MEMS all-solid-state piezoelectric heat sink provided in this application adopts an all-solid-state shaftless structure, eliminates the turbine fan shaft motion pair, and adopts an integrated design of piezoelectric film + cantilever oscillator. It has no mechanical wear, operates quietly, has extremely low drive power consumption, significantly improves service life and structural reliability, and can achieve device waterproofing through nano-coating.

[0150] Through miniaturized and efficient flow channel design and the intake and exhaust principle under this flow channel design, the size is extremely compact, with a thickness of only 0.6mm. The airflow is accelerated by the extrusion of the oscillator and the outer wall of the cavity, and the exhaust flow rate is much higher than the intake flow rate, achieving efficient intake and exhaust and outstanding heat dissipation efficiency.

[0151] By turning the intake and exhaust airflow at a large angle, a nearly 90° airflow reversal is achieved, with air intake along the plane of the oscillator and exhaust perpendicular to the plane of the oscillator. This adapts to deployment in narrow enclosed / open spaces and solves the problem of poor space adaptability of traditional heat dissipation solutions.

[0152] A 70° wide-range sweeping is achieved by superimposing a DC bias voltage (Example 1). By adjusting the driving frequency, the dual-unit back-to-back array (Example 2) can further expand the sweeping area, greatly improving airflow coverage and heat dissipation uniformity.

[0153] The heat dissipation channel provided in this application can form a heat dissipation channel system that fully covers open / closed spaces, supports vertical deployment of inlet and outlet ports and series connection of multiple units, and can flexibly adapt to different target heat source locations and installation constraints.

[0154] Meanwhile, the MEMS all-solid-state piezoelectric heat sink and heat dissipation channel support both metal stamping and silicon-based SOI etching fabrication routes. The structure is integrally formed, easy to assemble, and has the capability for large-scale manufacturing and engineering implementation.

[0155] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. A MEMS all-solid-state piezoelectric heat sink, characterized in that, include: The flow channel layer (1) is provided with at least one channel (12) that runs through itself. One end of the channel (12) is completely covered by the bottom plate (2), and the other end of the channel (12) is partially covered by the driving layer (3). The flow channel layer (1), the bottom plate (2) and the driving layer (3) together form the flow channel (4). The driving layer (3) is provided with an oscillator (31) that cooperates with the channel (12). The oscillator (31) does not completely cover the channel (12) and forms an opening (5) together with the channel (12) or the body of the driving layer (3). The oscillator (31) is provided with a piezoelectric film (32). The oscillator (31) is configured to vibrate under the drive of the piezoelectric film (32) so that the volume of the flow channel (4) changes and heat dissipation airflow enters or exits the flow channel (4) from the opening (5).

2. The MEMS all-solid-state piezoelectric heat sink as described in claim 1, characterized in that: The driving layer (3) includes a body, an oscillator (31), a piezoelectric film (32), a driving electrode (33), and a ground electrode (34). The body and the oscillator (31) together form the aperture (5). The piezoelectric film (32), the driving electrode (33) and the ground electrode (34) together form a circuit. The piezoelectric film (32) is configured to undergo periodic deformation when the driving electrode (33) is connected to a driving signal and a DC bias voltage, so as to drive the oscillator (31) to vibrate, thereby changing the volume of the flow channel (4) and generating a heat dissipation airflow that enters or exits the flow channel (4) from the orifice (5) and whose angle range meets the preset angle range.

3. The MEMS all-solid-state piezoelectric heat sink as described in claim 2, characterized in that: The MEMS all-solid-state piezoelectric heat sink is configured to be prepared by a metal process or by a silicon-based process, and the thickness of the oscillator (31) is less than 100 μm.

4. The MEMS all-solid-state piezoelectric heat sink as described in claim 3, characterized in that: When the MEMS all-solid-state piezoelectric heat sink is fabricated using metal processing, the piezoelectric thin film (32), driving electrode (33) and ground electrode (34) are all generated by coating, the flow channel layer (1) and the base plate (2) are both formed by casting, and the flow channel layer (1), the base plate (2) and the driving layer (3) are assembled by bonding to obtain the MEMS all-solid-state piezoelectric heat sink.

5. The MEMS all-solid-state piezoelectric heat sink as described in claim 3, characterized in that: When the MEMS all-solid-state piezoelectric heat sink is fabricated using silicon-based technology, the flow channel layer (1) and the driving layer (3) are integrally etched using SOI technology, and the base plate (2) is integrally formed by casting. The integrally formed flow channel layer (1), the driving layer (3), and the base plate (2) are assembled by bonding to obtain the MEMS all-solid-state piezoelectric heat sink.

6. The MEMS all-solid-state piezoelectric heat sink as described in claim 1, characterized in that: The flow channel layer (1) is provided with at least two channels (12) that pass through it. The oscillator (31) corresponding to each channel (12) is configured to vibrate under the drive of the piezoelectric film (32) according to the driving signal, so that the volume of the flow channel (4) corresponding to the oscillator (31) changes, generating heat dissipation airflow that enters or exits the flow channel (4) from the corresponding orifice (5) and superimposing the heat dissipation airflow generated by each oscillator (31) to form a composite heat dissipation airflow.

7. A heat dissipation channel, characterized in that, The MEMS all-solid-state piezoelectric heat sink as described in any one of claims 1 to 6 further includes: The flow channel frame (6) is used to connect the target heat source. The flow channel frame (6) is provided with at least one heat dissipation inlet (61) and at least one heat dissipation outlet (62). The interior of the flow channel frame (6) forms a heat dissipation cavity (63) that connects the heat dissipation inlet (61) and the heat dissipation outlet (62). The outer frame (6) of the flow channel is provided with at least one of the MEMS all-solid-state piezoelectric heat sinks so that gas enters the heat sink cavity (63) from the heat sink inlet (61) and then exits the heat sink cavity (63) from the heat sink outlet (62). The heat dissipation cavity (63) is also provided with fins (64) that cooperate with the MEMS all-solid-state piezoelectric heat sink, so as to increase the heat exchange area of ​​the heat dissipation channel and achieve the airflow rectification effect.

8. The heat dissipation channel as described in claim 7, characterized in that: The outer frame (6) of the flow channel includes an upper plate (65) and a lower plate (66). One end of the outer frame (6) is provided with a heat dissipation air inlet (61) and the other end is provided with a heat dissipation air outlet (62). The heat dissipation air inlet (61), the heat dissipation air outlet (62) and the heat dissipation cavity (63) are all arranged according to the length direction of the heat dissipation flow channel. The lower plate (66) is used to connect to the target heat source and is provided with at least three MEMS all-solid-state piezoelectric heat sinks arranged in the length direction of the heat dissipation channel. The inner side of the upper plate (65) is provided with fins (64) that respectively cooperate with the MEMS all-solid-state piezoelectric heat sinks. The channel (12) directions of the MEMS all-solid-state piezoelectric heat sinks arranged in the same direction are all consistent with the height direction of the heat dissipation channel. Among the at least three MEMS all-solid-state piezoelectric heat sinks arranged in the same direction, at least one of the MEMS all-solid-state piezoelectric heat sinks is configured as the first heat sink to be set in accordance with the position of the target heat source connected to the lower plate (66).

9. The heat dissipation channel as described in claim 7, characterized in that: The outer frame (6) of the flow channel is integrally formed. One end of the outer frame (6) is provided with a heat dissipation air inlet (61) and the other end is provided with a heat dissipation air outlet (62). The heat dissipation air inlet (61) is set according to the height direction of the heat dissipation flow channel, and the heat dissipation air outlet (62) and the heat dissipation cavity (63) are both set according to the length direction of the heat dissipation flow channel. The outer frame (6) of the flow channel is provided with a MEMS all-solid-state piezoelectric heat sink at one end of the heat dissipation air inlet (61), and the channel (12) of the MEMS all-solid-state piezoelectric heat sink is aligned with the length direction of the heat dissipation flow channel. The fins (64) are configured to work in conjunction with the target heat source connected to the outer frame (6) of the flow channel.

10. The heat dissipation channel as described in claim 7, characterized in that: The outer frame (6) of the flow channel is integrally formed. One end of the outer frame (6) is provided with a heat dissipation air inlet (61) and the other end is provided with a heat dissipation air outlet (62). The heat dissipation air inlet (61) and the heat dissipation air outlet (62) are both set according to the height direction of the heat dissipation flow channel. The heat dissipation cavity (63) is set according to the length direction of the heat dissipation flow channel. The outer frame (6) of the flow channel is provided with a heat dissipation air inlet (61) at one end, and a MEMS all-solid-state piezoelectric heat sink is provided as a second heat sink. The channel (12) of the second heat sink is aligned with the length direction of the heat dissipation flow channel. The outer frame (6) of the flow channel is provided with a heat dissipation outlet (62) at one end, and a MEMS all-solid-state piezoelectric heat sink is provided as a third heat sink. The channel (12) of the third heat sink is aligned with the height direction of the heat dissipation flow channel. The fins (64) are configured to work in conjunction with the target heat source connected to the outer frame (6) of the flow channel.

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