A wafer floating type wafer breaking table with a debris collecting function
Patent Information
- Application Number
- CN202611156458.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-31
- Publication Date
- 2026-09-25
AI Technical Summary
[0003]在玻璃掰片过程中,由于掰断动作的冲击力和玻璃材料本身的脆性特征,掰断位置会产生大量细小的玻璃碎屑,这些碎屑散落在工作台面,玻璃碎屑细小不便进行清理,碎屑容易对玻璃造成划痕,影响后续加工和产品质量,玻璃碎屑具有锐利的边缘,对操作人员的皮肤和呼吸系统构成安全隐患
1、通过在掰杆内部设置负压腔,并在掰杆顶端开设吸屑孔,将吸屑功能直接集成在掰杆上,使吸屑口紧邻掰断位置,能够在掰断发生的瞬间即捕获碎屑,吸屑响应速度快、捕集效率高;
Smart Images

Figure CN122809735A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of glass cutting and processing technology, and more specifically, to an air-floating glass breaking table with a debris collection function. Background Technology
[0002] Air-floating glass breaking table is a commonly used glass breaking equipment in the glass deep processing industry. It uses the principle of air flotation to make the glass float on the worktable, which facilitates the positioning and movement of the glass. Then, the glass is broken and separated by the breaking rod after marking.
[0003] During the glass breaking process, due to the impact of the breaking action and the brittleness of the glass material itself, a large number of small glass fragments are generated at the breaking point. These fragments are scattered on the work surface. The glass fragments are small and inconvenient to clean up. The fragments can easily scratch the glass, affecting subsequent processing and product quality. The glass fragments have sharp edges, which pose a safety hazard to the operator's skin and respiratory system.
[0004] Setting up an air blowing device on the breaking table to remove debris will only scatter the debris over a wider area, making it impossible to collect effectively and exacerbating debris contamination. Setting up a dust collection hood around the breaking table is also inefficient because the hood is too far from the breaking point and has low efficiency in capturing the debris generated at the moment of breaking. Summary of the Invention
[0005] To address the above deficiencies, this invention provides an air-floating chip-breaking platform with a chip collection function, thus solving the aforementioned problems.
[0006] To achieve the above objectives, the present invention adopts the following technical solution: An air-floating glass breaking platform with debris collection function includes an air-floating glass breaking platform body and a breaking rod disposed on the air-floating glass breaking platform body. The breaking rod moves up and down to break the glass. The breaking rod is equipped with a chip suction mechanism, and the air-floating chip breaking table body is equipped with a chip blowing mechanism. The chip removal mechanism includes a negative pressure chamber located inside the lever. The top of the lever has multiple chip removal holes that are connected to the negative pressure chamber. The outer wall of the lever is provided with a sealing shell that can move up and down along the outer wall of the lever. The top of the sealing shell is connected to a flexible sealing lip. In the initial state, the top of the sealing shell is flush with the top of the lever. During operation, the lever rises and the flexible sealing lip first adheres to the lower surface of the glass to form a sealing cavity. As the lever continues to rise, the sealing shell slides down, and the top of the lever is exposed and breaks off in contact with the glass. The debris is then sucked into the negative pressure cavity through the debris suction hole.
[0007] Furthermore, the chip suction holes are closely attached to the glass cut, and the chip suction holes are evenly distributed at intervals along the cut direction on the upper surface of the top of the lever, and the negative pressure chamber is arranged to extend longitudinally along the lever.
[0008] After the glass breaks, the chip suction holes are directly exposed to the broken area, and the chips suction holes capture and collect the debris generated at the moment of breaking.
[0009] Furthermore, support plates are fixedly connected to both sides of the lever. The support plates are located below the sealing shell. A guide rod is slidably connected to the support plate. The top end of the guide rod is fixedly connected to the bottom surface of the sealing shell. The bottom end of the guide rod passes through the support plate. A compression spring is fitted on the guide rod. The top end of the compression spring is connected to the bottom surface of the sealing shell. The bottom end of the compression spring is connected to the surface of the support plate. Furthermore, the chip suction mechanism also includes chip suction cavities located inside both sides of the sealing shell. Both ends of the chip suction cavities are connected to chip suction pipes that communicate with the negative pressure chamber. The inner walls on both sides of the sealing shell are provided with chip suction slots that communicate with the chip suction cavities. The chip suction slots are located on both sides of the lever.
[0010] Furthermore, at least two chip suction slots are provided along the inner wall of the sealing shell from top to bottom, and the chip suction slots are strip-shaped openings that extend laterally along the inner wall of the sealing shell.
[0011] Furthermore, a sliding seal is provided between the inner wall of the sealing shell and the outer wall of the lever.
[0012] The sliding seal prevents negative pressure from leaking through the sliding gap between the sealing shell and the lever, ensuring efficient chip removal.
[0013] Furthermore, the chip blowing mechanism includes a chip blowing groove formed on the surface of the air-float chip breaking table body. The chip blowing groove is formed around the breaking rod, and the surface of the chip blowing groove is lower than the surface of the air-float chip breaking table body. A chip blowing pipe is installed on the chip blowing groove. The top surface of the chip blowing pipe is at the same level as the surface of the air-float chip breaking table body. The chip blowing pipe has a plurality of chip blowing holes facing the breaking rod. The chip blowing pipe is connected to an external fan through an air supply pipeline.
[0014] Airflow blows out from the blow hole, blowing loose debris and dust on the table towards the break bar and gathering it in the vicinity of the break bar. The debris and dust are then collected by the dust suction mechanism, which can clean the table surface below the broken glass.
[0015] Furthermore, an inclined sealing plate is fixedly connected to the bottom of the negative pressure chamber, and an external negative pressure source is connected to the upper side of the negative pressure chamber through a negative pressure pipeline. A filter screen is installed at the connection between the negative pressure pipeline and the negative pressure chamber. A debris outlet is connected to the inclined end of the inclined sealing plate, and a dust collection bag is connected to the debris outlet.
[0016] The filter effectively traps dust and fine debris, preventing them from entering the external negative pressure source and causing damage. Under the action of gravity, the debris slides down the inclined surface of the inclined sealing plate to the debris outlet and enters the dust collection bag for collection. The dust collection bag is easy to disassemble and replace.
[0017] The beneficial effects of this invention are: 1. By setting a negative pressure chamber inside the break bar and opening a chip suction hole at the top of the break bar, the chip suction function is directly integrated into the break bar, so that the chip suction port is close to the break position, and the chip can be captured at the moment the break occurs. The chip suction response speed is fast and the collection efficiency is high. 2. By setting a sealing shell and a flexible sealing lip, sealing can be performed before breaking. When the breaking rod rises, the flexible sealing lip first adheres to the lower surface of the glass to form a sealing cavity. Negative pressure is started to suck up the chips before breaking, reducing the amount of chips generated at the moment of breaking. When the breaking rod continues to rise, the sealing shell slides down along the breaking rod, and the top of the breaking rod is exposed to perform the breaking action. At this time, the chip suction hole is directly exposed to the breaking area, realizing the simultaneous breaking and chip suction. Glass chips will not fall on the table, avoiding scratches to the glass and improving product quality. Glass chips will also prevent workers from being injured, thus improving safety. 3. The chip collection area is expanded by the chip collection slots, which can collect chips from both sides of the lever at the same time, enhancing the chip collection effect and improving the chip collection efficiency. The design of multiple chip collection slots ensures that even if some slots are blocked during the sliding of the sealing shell, the remaining slots can still collect chips normally, ensuring the continuity and stability of the chip collection effect. Attached Figure Description
[0018] Figure 1 This is a top view of an air-floating chip-breaking platform with chip collection function as described in this invention; Figure 2 This is a side sectional view of the air-float breaking table body; Figure 3 This is a schematic diagram of the inner wall of the sealed shell; Figure 4 This is a diagram showing the initial state of the chip removal mechanism; Figure 5 This is a diagram showing the state of the dust collection mechanism in contact with the glass; Figure 6 It is an enlarged sectional view of the lever; Figure 7 This is a top sectional view of the chip blower; Figure 8 yes Figure 7 Enlarged view of point A in the middle; In the diagram, 1. Air-float chip breaking table body; 2. Breaking rod; 3. Negative pressure chamber; 4. Chip suction hole; 5. Sealing shell; 6. Flexible sealing lip; 7. Support plate; 8. Guide rod; 9. Compression spring; 10. Chip suction chamber; 11. Chip suction pipe; 12. Chip suction slot; 13. Sliding seal; 14. Chip blowing slot; 15. Chip blowing pipe; 16. Chip blowing hole; 17. Air supply line; 18. Inclined sealing plate; 19. Negative pressure line; 20. Filter screen; 21. Chip outlet; 22. Dust collection bag. Detailed Implementation
[0019] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0020] This application provides an air-floating chip-breaking platform with debris collection function. Please refer to [link / reference]. Figures 1-8 The glass includes an air-floating glass breaking platform body 1 and a breaking rod 2 mounted on the air-floating glass breaking platform body 1. The breaking rod 2 is raised and lowered to break the glass. The breaking rod 2 is equipped with a chip suction mechanism, and the air-floating glass breaking platform body 1 is equipped with a chip blowing mechanism. The dust collection mechanism includes a negative pressure chamber 3 located inside the lever 2. The top of the lever 2 is provided with a plurality of dust collection holes 4, which are connected to the negative pressure chamber 3. The outer wall of the lever 2 is provided with a sealing shell 5, which can be raised and lowered along the outer wall of the lever 2. The top of the sealing shell 5 is connected to a flexible sealing lip 6. In the initial state, the top of the sealing shell 5 is flush with the top of the lever 2. During operation, the lever 2 rises and the flexible sealing lip 6 first adheres to the lower surface of the glass to form a sealing cavity. The lever 2 continues to rise, causing the sealing shell 5 to slide down. The top of the lever 2 is exposed and breaks off in contact with the glass. The debris is sucked into the negative pressure cavity 3 through the debris suction hole 4.
[0021] In practical applications, the air holes on the surface of the air-floating glass breaking table 1 are blown with air, and the glass is made to float on the worktable by using the air-floating principle, which facilitates the positioning and movement of the glass. Then, the glass is broken and separated by the breaking rod 2. This technology is the existing technology. When lever 2 moves upward, The flexible sealing lip 6 first contacts the lower surface of the glass. As the lever 2 continues to rise, the flexible sealing lip 6 is tightly pressed against the lower surface of the glass, forming a sealing cavity between the top of the sealing shell 5 and the lower surface of the glass 6. At this time, the negative pressure is continuously drawn into the sealing cavity through the chip suction hole 4, and the chip suction operation begins before the glass is broken, effectively reducing the amount of chips generated when it is broken. As the lever 2 continues to rise, the flexible sealing lip 6 is already pressed against the lower surface of the glass 6. The glass exerts a downward reaction force on the flexible sealing lip 6, which is then applied to the sealing shell 5. The sealing shell 5 slides downward along the outer wall of the lever 2, and the top of the lever 2 gradually protrudes from the sealing shell 5. Finally, it contacts the marked position on the glass and applies a breaking force, breaking the glass 6. The chip suction hole 4 is located below the breaking area. The negative pressure captures and collects the chips generated at the moment of breaking through the chip suction hole 4. It can capture chips at the moment of breaking, with a fast chip suction response and high collection efficiency. It will not allow glass chips to fall onto the table, avoid chips from scratching the glass, improve product quality, and prevent glass chips from scratching workers, thus improving safety. After the break is completed, the breaking rod 2 descends and the sealing shell 5 returns to its initial position, preparing for the next breaking operation. Refer to the instruction manual appendix Figure 1 Instruction manual attached Figure 4 Included with instruction manual Figure 5 The dust collection holes 4 are close to the glass cut, and the dust collection holes 4 are evenly distributed at intervals along the cut direction of the upper surface of the top of the lever 2. The negative pressure chamber 3 is set along the longitudinal direction of the lever 2.
[0022] In practical applications, the chip suction holes 4 are close to the glass cut and are evenly distributed along the cut direction on the top surface of the break bar 2 to ensure that effective chip suction is available at each position on the break line. After the glass is broken, the chip suction holes 4 are directly exposed to the break area, and the negative pressure is used to capture and collect the debris generated at the moment of breakage.
[0023] Refer to the instruction manual appendix Figure 3 Instruction manual attached Figure 4 Included with instruction manual Figure 5 Support plates 7 are fixedly connected to both sides of the lever 2. The support plates 7 are located below the sealing shell 5. A guide rod 8 is slidably connected to the support plate 7. The top end of the guide rod 8 is fixedly connected to the bottom surface of the sealing shell 5. The bottom end of the guide rod 8 passes through the support plate 7. A compression spring 9 is fitted on the guide rod 8. The top end of the compression spring 9 is connected to the bottom surface of the sealing shell 5. The bottom end of the compression spring 9 is connected to the surface of the support plate 7. In practical applications, the elastic force of the compression spring 9 makes the top of the sealing shell 5 flush with the top of the lever 2 in a free state. The stiffness of the compression spring 9 is configured to generate a sealing pre-pressure when the flexible sealing lip 6 is pressed against the glass, and the lever 2 can overcome the elastic force of the compression spring 9 to make the sealing shell 5 move down when it continues to rise. After the flexible sealing lip 6 is pressed against the lower surface of the glass 6, the lever 2 continues to rise. The flexible sealing lip 6 transmits the downward reaction force to the compression spring 9 through the sealing shell 5. When the reaction force exceeds the elastic force of the compression spring 9, the sealing shell 5 slides down along the guide rod 8, and the compression spring 9 is compressed. As the sealing shell 5 slides down, the top of the lever 2 gradually protrudes from the sealing shell 5, and finally contacts the marked position of the glass 6 and applies a breaking force to break the glass 6.
[0024] Refer to the instruction manual appendix Figure 3 Instruction manual attached Figure 4 Included with instruction manual Figure 5 The chip suction mechanism also includes chip suction cavities 10 located inside both sides of the sealing shell 5. Both ends of the chip suction cavities 10 are connected to chip suction pipes 11 that communicate with the negative pressure chamber 3. The inner walls of both sides of the sealing shell 5 are provided with chip suction slots 12. The chip suction slots 12 are connected to the chip suction cavities 10. The chip suction slots 12 are located on both sides of the lever 2. At least two chip suction slots 12 are provided along the inner wall of the sealing shell 5 from top to bottom. The chip suction slots 12 are strip-shaped openings that extend laterally along the inner wall of the sealing shell 5.
[0025] In practical applications, negative pressure is continuously drawn into the sealed cavity through the chip suction slot 12. While the chip suction hole 4 is suctioning waste chips, the chip suction slot 12 simultaneously assists in suctioning chips from both sides of the lever 2. The chips from both sides are first sucked into the chip suction chamber 10, and the chip suction chamber 10 transports the collected chips to the negative pressure chamber 3 through the chip suction pipe 11. The chip suction slot 12 expands the chip suction coverage area, enabling simultaneous collection of chips from both sides of the lever, enhancing the chip collection effect and improving the chip collection efficiency. The design of multiple chip suction slots 12 ensures that even if some slots are blocked during the sliding of the sealing shell 5, the remaining slots can still suction chips normally, ensuring the continuity and stability of the chip suction effect.
[0026] Refer to the instruction manual appendix Figure 4 Included with instruction manual Figure 5 A sliding seal 13 is provided between the inner wall of the sealing shell 5 and the outer wall of the lever 2.
[0027] In practical applications, the sliding seal 13 can be a sealing ring or a sealing bushing to seal the gap between the sealing shell 5 and the lever 2, preventing negative pressure from leaking through the sliding gap between the sealing shell 5 and the lever 2, and ensuring the chip suction efficiency.
[0028] Refer to the instruction manual appendix Figure 2 Instruction manual attached Figure 7 Included with instruction manual Figure 8The chip blowing mechanism includes a chip blowing groove 14 formed on the surface of the air-float chip breaking table body 1. The chip blowing groove 14 is formed around the chip breaking rod 2. The surface of the chip blowing groove 14 is lower than the surface of the air-float chip breaking table body 1. A chip blowing pipe 15 is installed on the chip blowing groove 14. The top surface of the chip blowing pipe 15 is at the same level as the surface of the air-float chip breaking table body 1. A plurality of chip blowing holes 16 are formed on the chip blowing pipe 15. The chip blowing holes 16 face the chip breaking rod 2. The chip blowing pipe 15 is connected to an external fan through an air supply pipe 17.
[0029] In practical applications, after the break bar 2 descends and the sealing shell 5 returns to its initial position, the external fan supplies air to the chip blowing pipe 15 through the air supply pipe 17. The airflow blows out from the chip blowing hole 16 and blows the loose debris and dust on the table towards the break bar 2, gathering them in the vicinity of the break bar 2. The loose debris and dust are then collected by the chip suction mechanism, which can clean the table below the broken glass location.
[0030] Refer to the instruction manual appendix Figure 5 Included with instruction manual Figure 6 An inclined sealing plate 18 is fixedly connected to the bottom of the negative pressure chamber 3. The upper side of the negative pressure chamber 3 is connected to an external negative pressure source through a negative pressure pipeline 19. A filter screen 20 is installed at the connection between the negative pressure pipeline 19 and the negative pressure chamber 3. A debris outlet 21 is connected to the inclined end of the inclined sealing plate 18. A dust collection bag 22 is connected to the debris outlet 21.
[0031] In practical applications, the external negative pressure source extracts air from the negative pressure chamber 3 through the negative pressure pipeline 19. The negative pressure airflow is filtered by the filter screen 20 and then discharged to the external negative pressure source through the negative pressure pipeline 19. The filter screen 20 effectively traps dust and fine debris, preventing them from entering the external negative pressure source and causing damage. After the external negative pressure source is turned off, the debris slides down the inclined surface of the inclined sealing plate 18 to the debris outlet 21 under the action of gravity and enters the dust collection bag 22 for collection. The dust collection bag 22 is easy to disassemble and replace.
[0032] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0033] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.
[0034] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0036] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0037] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0038] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
Claims
1. A flotation-type glass breaking platform with debris collection function, comprising a flotation-type glass breaking platform body (1) and a breaking rod (2) disposed on the flotation-type glass breaking platform body (1), wherein the breaking rod (2) rises and falls to break the glass, characterized in that, The breaking rod (2) is equipped with a chip suction mechanism, and the air-floating breaking table body (1) is equipped with a chip blowing mechanism; The chip removal mechanism includes a negative pressure chamber (3) located inside the lever (2). The top of the lever (2) is provided with multiple chip removal holes (4). The chip removal holes (4) are connected to the negative pressure chamber (3). The outer wall of the lever (2) is provided with a sealing shell (5). The sealing shell (5) can be raised and lowered along the outer wall of the lever (2). The top of the sealing shell (5) is connected with a flexible sealing lip (6). In the initial state, the top of the sealing shell (5) is flush with the top of the lever (2). When working, the lever (2) rises and the flexible sealing lip (6) first adheres to the lower surface of the glass to form a sealing cavity. The lever (2) continues to rise, causing the sealing shell (5) to slide down. The top of the lever (2) is exposed and breaks off in contact with the glass. The debris is sucked into the negative pressure cavity (3) through the debris suction hole (4).
2. The air-floating chip-breaking platform with debris collection function according to claim 1, characterized in that, The dust collection holes (4) are close to the glass cut, and the dust collection holes (4) are evenly distributed at intervals along the cut direction of the upper surface of the top of the lever (2). The negative pressure chamber (3) is set along the longitudinal direction of the lever (2).
3. The air-floating chip-breaking platform with debris collection function according to claim 1, characterized in that, The two sides of the lever (2) are fixedly connected to the support plate (7). The support plate (7) is located below the sealing shell (5). The support plate (7) is slidably connected to the guide rod (8). The top end of the guide rod (8) is fixedly connected to the bottom surface of the sealing shell (5). The bottom end of the guide rod (8) passes through the support plate (7). A compression spring (9) is fitted on the guide rod (8). The top end of the compression spring (9) is connected to the bottom surface of the sealing shell (5). The bottom end of the compression spring (9) is connected to the surface of the support plate (7).
4. The air-floating chip-breaking platform with debris collection function according to claim 1, characterized in that, The chip suction mechanism also includes chip suction chambers (10) located inside both sides of the sealing shell (5). Both ends of the chip suction chambers (10) are connected to chip suction pipes (11) that communicate with the negative pressure chamber (3). The inner walls of both sides of the sealing shell (5) are provided with chip suction slots (12). The chip suction slots (12) are connected to the chip suction chambers (10). The chip suction slots (12) are located on both sides of the lever (2).
5. The air-floating chip-breaking platform with debris collection function according to claim 4, characterized in that, At least two chip suction slots (12) are provided along the inner wall of the sealing shell (5) from top to bottom. The chip suction slots (12) are strip-shaped openings that extend laterally along the inner wall of the sealing shell (5).
6. The air-floating chip-breaking platform with debris collection function according to claim 1, characterized in that, A sliding seal (13) is provided between the inner wall of the sealing shell (5) and the outer wall of the lever (2).
7. The air-floating chip-breaking platform with debris collection function according to claim 1, characterized in that, The chip blowing mechanism includes a chip blowing groove (14) opened on the surface of the air-float chip breaking table body (1). The chip blowing groove (14) is opened around the breaking rod (2). The surface of the chip blowing groove (14) is lower than the surface of the air-float chip breaking table body (1). A chip blowing pipe (15) is installed on the chip blowing groove (14). The top surface of the chip blowing pipe (15) is at the same level as the surface of the air-float chip breaking table body (1). A plurality of chip blowing holes (16) are opened on the chip blowing pipe (15). The chip blowing holes (16) face the breaking rod (2). The chip blowing pipe (15) is connected to an external fan through an air supply pipe (17).
8. The air-floating chip-breaking platform with debris collection function according to claim 1, characterized in that, An inclined sealing plate (18) is fixedly connected to the bottom of the negative pressure chamber (3). The upper side of the negative pressure chamber (3) is connected to an external negative pressure source through a negative pressure pipeline (19). A filter screen (20) is installed at the connection between the negative pressure pipeline (19) and the negative pressure chamber (3). A debris outlet (21) is connected to the inclined end of the inclined sealing plate (18). A dust collection bag (22) is connected to the debris outlet (21).