Radiation resistant glass, chemically strengthened radiation resistant glass, radiation resistant glass elements and devices

Abstract

The application provides an anti-radiation glass, a chemically strengthened anti-radiation glass, an anti-radiation glass element and equipment, the anti-radiation glass comprises, in terms of mole percentage, SiO2 60-68%, Na2O 11-14%, Al2O3 8.5-14%, B2O3 2-6%, CeO2 4.5-7%, K2O 1-4.5%, ZnO 0.1-1% and Sb2O3 0.1-0.2%. The anti-radiation glass has excellent anti-radiation discoloration performance, high optical transmittance and good mechanical strength by reasonably compounding components, can be prepared in a thin type, is suitable for harsh radiation working conditions such as aerospace, and has a good application prospect; the anti-radiation glass can be treated by chemical strengthening, after ion exchange strengthening, the surface structure of the anti-radiation glass is rearranged, internal defects are significantly reduced, thereby effectively inhibiting the generation of color centers, and further improving the anti-radiation performance.

Description

Technical Field

[0001] This application relates to the field of radiation-resistant glass materials technology, and in particular to a radiation-resistant glass, chemically strengthened radiation-resistant glass, radiation-resistant glass components and equipment. Background Technology

[0002] During long-term on-orbit operation, spacecraft mainly rely on solar cells for energy supply. As the core energy conversion device of spacecraft, solar cells can continuously convert solar energy in the space environment into electrical energy. They are the main or even the only power source for the operation of satellites and various spacecraft. Therefore, the service life of solar cells directly determines the effective working cycle of spacecraft.

[0003] The space environment is filled with complex and harsh high-energy radiation, including galactic cosmic rays, high-energy solar particles, and rays from Earth's radiation belts. If these high-energy rays directly impact the surface of solar cells, they can easily damage the cell structure, degrade photoelectric conversion performance, and severely shorten the lifespan of the solar cells. To prevent direct damage from high-energy rays, the industry commonly equips solar cells with transparent radiation-resistant glass covers. The shielding properties of the radiation-resistant glass prevent cosmic rays from directly contacting the cell module, thus ensuring the stable operation of the solar cells.

[0004] However, when ordinary silicate radiation-resistant glass is subjected to continuous high-energy radiation for a long period, the high-energy particles generate a large number of free electrons and holes within the radiation-resistant glass matrix through ionization. These ionized electrons and holes easily combine with intrinsic defects within the radiation-resistant glass and stably form color centers. These color centers selectively absorb specific wavelengths of visible light, causing the radiation-resistant glass to gradually discolor and darken, and its optical transmittance to decrease significantly. After the light transmittance of the radiation-resistant glass cover plate deteriorates, the light flux incident on the solar cells is greatly reduced, directly causing a decrease in the photoelectric conversion efficiency of the cells and insufficient power supply. This, in turn, leads to problems such as unstable power supply for spacecraft, making it difficult to meet the requirements of long-term on-orbit service.

[0005] Currently, conventional radiation-resistant glass mostly uses the traditional soda-silicon glass system, and to balance basic protection and structural strength, it generally adopts a relatively large thickness. With the increasing demand for lightweight and low-cost development in the aerospace field, and the increasingly stringent requirements for spacecraft launch cost control, ultra-thin radiation-resistant glass covers have become an industry trend. However, conventional radiation-resistant glass formulations have poor compatibility, and the overall mechanical properties of radiation-resistant glass are significantly weakened after thinning. During processing, assembly, on-orbit installation, and daily operations, it is highly susceptible to breakage and surface micro-cracks, which not only reduces the service life of the radiation-resistant glass cover itself but also affects the overall structural stability of solar cell modules.

[0006] Meanwhile, existing radiation-resistant glass has limited resistance to high-energy particle erosion. Under prolonged exposure to continuous bombardment from high-energy particles in space, the microstructure of the radiation-resistant glass surface is easily damaged, leading to a continuous deterioration in surface flatness and smoothness. This results in increased interfacial reflectivity and intensified scattering, further causing overall light transmittance loss and continuously weakening the power generation efficiency of solar cells. Furthermore, traditional radiation-resistant glass generally suffers from problems such as a high coefficient of thermal expansion, insufficient mechanical strength, and poor spectral transmittance matching. It cannot simultaneously achieve excellent radiation resistance, ultra-thin structural strength, high light transmittance, and environmental adaptability, making it difficult to meet the stringent radiation requirements of various fields such as aerospace, nuclear industry, and medical irradiation.

[0007] It is important to note that the techniques described in this section are not necessarily those previously conceived or adopted. Unless otherwise specified, no technique described in this section should be assumed to be prior art simply because it is included in this section. Similarly, unless otherwise specified, the issues mentioned in this section should not be considered to be recognized in any prior art. Summary of the Invention

[0008] This application provides a radiation-resistant glass, a chemically strengthened radiation-resistant glass, radiation-resistant glass components and equipment, aiming to solve at least one of the technical problems of existing radiation-resistant glass, such as poor radiation resistance and discoloration, insufficient mechanical strength after thinning, and surface degradation due to high-energy particle erosion leading to decreased light transmittance. Furthermore, it is difficult to simultaneously achieve high optical transmittance, low coefficient of thermal expansion and good adaptability, thus failing to meet the long-term use requirements of harsh radiation conditions such as aerospace.

[0009] To achieve the above objectives, a first aspect of this application provides a radiation-resistant glass, wherein the components of the radiation-resistant glass are expressed as mole percentages and include: SiO2: 60%~68%; Na2O: 11%~14%; Al2O3: 8.5%~14%; B2O3: 2%~6%; CeO2: 4.5%~7%; K2O: 1%~4.5%; ZnO: 0.1%~1%; and Sb2O3: 0.1%~0.2%.

[0010] Optionally, the molar percentage of each component is: SiO2: 60%~68%; Na2O: 11%~14%; Al2O3: 8.5%~12%; B2O3: 2%~5%; CeO2: 4.5%~7%; K2O: 2%~4.5%; ZnO: 0.1%~1%; Sb2O3: 0.1%~0.2%.

[0011] Optionally, the molar percentage of CeO2 is 4.5% to 6.5%.

[0012] Optionally, the molar percentage of CeO2 is 4.5% to 5.5%.

[0013] Optionally, the radiation-resistant glass further includes: Fluorine is introduced in the form of NaF, with a NaF content of 0-2%.

[0014] Optionally, the NaF content is 0.5% to 1%.

[0015] Optionally, the density of the radiation-resistant glass is 2.51 g / cm³ to 2.56 g / cm³.

[0016] Optionally, the refractive index Nd of the radiation-resistant glass is 1.51 to 1.53.

[0017] Optionally, within a temperature range of 20℃ to 150℃, the coefficient of thermal expansion α of the radiation-resistant glass is not greater than 9.0 × 10⁻⁶. -6 / ℃.

[0018] Optionally, the radiation-resistant glass has an irradiation discoloration rate of ≤0.8%.

[0019] Optionally, the flexural strength of the radiation-resistant glass is 130 MPa to 178 MPa.

[0020] Optionally, when the thickness of the radiation-resistant glass is 0.3mm to 0.35mm, the transmittance of the radiation-resistant glass is <1% in the 330nm band, ≥89% in the 400nm band, ≥90% in the 450nm band, and the average transmittance is ≥92% in the 500nm to 2000nm band.

[0021] Optionally, the glass transition temperature of the radiation-resistant glass is 542℃~582℃, and the softening temperature is 603℃~675℃.

[0022] The second aspect of this application discloses a chemically strengthened radiation-resistant glass, wherein the chemically strengthened radiation-resistant glass is made by chemically strengthening the radiation-resistant glass according to any one of claims 1 to 11, wherein the chemical strengthening adopts a potassium ion exchange process, and the strengthened chemically strengthened radiation-resistant glass has a surface compressive stress of 650 MPa to 980 MPa, a compressive stress of 40 MPa to 62 MPa at 50 μm below the surface, a stress layer depth of 70 μm to 95 μm, a central tensile stress of 40 MPa to 56 MPa, an average tensile stress of 35 MPa to 48 MPa, a tensile stress linear density of 18000 MPa / mm to 29000 MPa / mm, and a flexural strength of 450 MPa to 540 MPa.

[0023] Optionally, the chemically strengthened radiation-resistant glass is made by a single chemical strengthening process, wherein the mass fraction of KNO3 in the chemical strengthening salt bath is ≥99.5%3, the strengthening temperature is 400℃~430℃, and the strengthening time is 200min~250min.

[0024] A third aspect of this application provides a radiation-resistant glass element, which is made of any of the radiation-resistant glass described above, or of any of the chemically strengthened radiation-resistant glass described above, and is used as an optical window or protective lens in aerospace, nuclear industry or medical radiation environments.

[0025] A fourth aspect of this application provides an apparatus comprising any of the radiation-resistant glass described above, or comprising any of the chemically strengthened radiation-resistant glass described above, or comprising radiation-resistant glass elements described above, wherein the apparatus is aerospace equipment, nuclear detection equipment, or medical irradiation equipment. The radiation-resistant glass of this application comprises 60%~68% SiO2, 11%~14% Na2O, 8.5%~14% Al2O3, 2%~6% B2O3, 4.5%~7% CeO2, 1%~4.5% K2O, 0.1%~1% ZnO, and 0.1%~0.2% Sb2O3. The rational blending of these components gives the radiation-resistant glass excellent radiation resistance, effectively suppressing color centers generated by high-energy radiation bombardment, reducing discoloration and darkening, and ensuring high optical transmittance. Simultaneously, it enhances the mechanical strength of the radiation-resistant glass, adapting to the requirements of thin-film manufacturing and preventing breakage during processing and installation. The synergistic optimization of each component optimizes the structural stability of the radiation-resistant glass, making it suitable for harsh radiation conditions in aerospace, nuclear industry, and other fields, extending its service life, and demonstrating promising application prospects.

[0026] It should be understood that the description in this section is not intended to identify key or important features of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Detailed Implementation

[0027] To make the inventive objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0029] In the description of the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. The term "multiple" means two or more, unless otherwise explicitly specified. The term "comprising" indicates the presence of the described feature, whole, step, operation, element, and / or component, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or sets thereof. The term "and / or" describes the relationship between related objects, indicating that three relationships may exist. For example, A and / or B may include three cases: A existing alone, A and B existing simultaneously, and B existing alone. The character " / " generally indicates that the related objects before and after are in an "or" relationship.

[0030] Unless otherwise defined, all technical terms used in the embodiments of this application have the same meaning as commonly understood by one of ordinary skill in the art; the terms used in the embodiments of this application are for the purpose of describing specific embodiments only and are not intended to limit this application; the terms "comprising" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusion.

[0031] Furthermore, terms such as "exemplary," "for example," and "optional" are used to indicate illustrative purposes. Any technical solution described by the above terms in the embodiments of this application should not be construed as being more preferred or advantageous than other technical solutions. Specifically, these terms are intended to present the relevant technical concepts in terms of specific implementation methods.

[0032] This application provides a radiation-resistant glass, the composition of which, expressed as molar percentage, includes 60%~68% SiO2, 11%~14% Na2O, 8.5%~14% Al2O3, 2%~6% B2O3, 4.5%~7% CeO2, 1%~4.5% K2O, 0.1%~1% ZnO, and 0.1%~0.2% Sb2O3.

[0033] SiO2, as the network formant of radiation-resistant glass, accounts for approximately 60% to 68%. SiO2 provides a stable skeletal structure for radiation-resistant glass, determining its basic mechanical properties and chemical stability. Excessive SiO2 content will increase the difficulty of melting radiation-resistant glass and reduce its formability; while insufficient SiO2 content will result in a loose structure of radiation-resistant glass, leading to poor mechanical strength and radiation resistance.

[0034] When the molar percentage of SiO2 is less than 60%, the network skeleton structure of radiation-resistant glass tends to be loose, the mechanical strength and chemical stability decrease significantly, the radiation resistance deteriorates, and high-energy rays can easily damage the glass network, leading to an increased probability of color center formation. At the same time, although the melting temperature is further reduced and the forming fluidity is enhanced, the excessively low SiO2 content will significantly increase the tendency of glass liquid crystallization, and problems such as deformation, uneven thickness, and even cracking are likely to occur during thin-film forming, making it difficult to meet the basic mechanical and radiation resistance requirements, and only suitable for non-critical scenarios with extremely low performance requirements.

[0035] When the molar percentage of SiO2 exceeds 68%, the melting difficulty of radiation-resistant glass increases significantly, requiring a substantial increase in melting temperature or a prolonged melting time. Excessively high viscosity of the molten glass leads to a sharp decrease in forming fluidity, significantly increasing the risk of warping, breakage, and crystallization during thin-film fabrication. Although the density of the network skeleton continues to increase, excessively high SiO2 content can increase the brittleness and reduce the toughness of radiation-resistant glass, potentially even decreasing its mechanical strength. At the same time, the improvement in radiation resistance and chemical stability is limited. In practical applications, this results in higher process costs and yield losses, typically only suitable for specific scenarios with extremely stringent requirements for corrosion resistance and radiation resistance, but lower requirements for forming efficiency.

[0036] Furthermore, the molar percentage of SiO2 can be approximately 60%~65%, 60%~62%, 61%~64%, 63%~67%, 64%~65%, or 62%~64%, etc. Even further, the molar percentage of SiO2 can be approximately 60%, 61%, 62%, 63%, 64%, 65%, 66%, 67%, or 68%, etc.

[0037] Na₂O, as a network modifier, accounts for approximately 11% to 14%. Na₂O can lower the melting temperature of radiation-resistant glass, improve its forming properties, and simultaneously provide sufficient Na₂O for ion exchange in subsequent chemical strengthening processes. + Excessive content of this substance will reduce the chemical stability and radiation resistance of radiation-resistant glass; while insufficient content will lead to difficulties in melting and poor formability of radiation-resistant glass.

[0038] When the molar percentage of Na₂O is less than 11%, the network structure of the radiation-resistant glass is too complete, the melting temperature increases significantly, the viscosity of the molten glass is too high, and the fluidity becomes poor. This makes it difficult to remove bubbles and eliminate streaks during the melting process, resulting in difficulties in forming, which is particularly unfavorable for the preparation of thin products. Simultaneously, due to the presence of Na₂O... + Insufficient supply leads to a decrease in ion exchange capacity during subsequent chemical strengthening processes, making it difficult to form a sufficiently deep exchange layer and high surface compressive stress. This weakens the mechanical strength and scratch resistance of radiation-resistant glass. Although chemical stability and radiation resistance may be slightly improved in the short term, this comes at the cost of process feasibility and mechanical strengthening potential, resulting in low actual production yields. It is only suitable for special applications with extremely low forming requirements and no need for chemical strengthening.

[0039] When the molar percentage of Na₂O exceeds approximately 14%, although the melting temperature further decreases and the forming fluidity improves, excessive Na₂O will excessively damage the silicon-oxygen network framework, leading to a significant decrease in chemical stability and a poorer resistance to acid and alkali corrosion. In humid or corrosive environments, the surface is prone to precipitating alkali, whitening, or mold growth. Simultaneously, radiation resistance deteriorates significantly, the number of non-bridging oxygen atoms increases, and high-energy rays are more likely to excite color centers, causing a rapid decrease in the light transmittance of radiation-resistant glass. Furthermore, excessively high Na₂O content will also lower the strain point and softening point of radiation-resistant glass, weaken its thermal stability, and may cause surface Na₂O to degrade during chemical strengthening. + Excessive concentration leads to difficulties in controlling ion exchange and accelerates stress relaxation.

[0040] Furthermore, the molar percentage of Na₂O is approximately 11%~12%, 11%~13%, 12%~14%, 13%~14%, or 12%~13%, etc. Even further, the molar percentage of Na₂O is approximately 11%, 11.5%, 12%, 12.5%, 13%, 13.5%, or 14%, etc.

[0041] Al2O3 can enhance the stability of the network structure of radiation-resistant glass, improve its mechanical strength and chemical stability, and suppress the formation of color centers during irradiation. Its content is approximately 8.5% to 14%. Excessive Al2O3 content will increase the risk of crystallization in radiation-resistant glass and affect its optical uniformity; while insufficient Al2O3 content will not play an effective role in strengthening and assisting in radiation resistance.

[0042] When the molar percentage of Al2O3 is less than 8.5%, the network structure reinforcement effect of the radiation-resistant glass is insufficient, the silicon-oxygen skeleton is relatively loose, the mechanical strength and chemical stability decrease, making it difficult to effectively resist the damage of high-energy rays. The probability of color centers forming during irradiation increases, and the light transmittance of the radiation-resistant glass decreases more rapidly. Simultaneously, due to the lack of sufficient Al... 3+ When the glass enters a network structure, its resistance to acid and alkali corrosion decreases, and the uniformity of ion exchange during chemical strengthening may also be affected. Although the melting temperature is relatively low and the risk of crystallization is small, the overall radiation resistance and mechanical properties cannot meet the requirements for conventional use, making it only suitable for low-end applications where radiation stability is not a strict requirement.

[0043] When the molar percentage of Al2O3 exceeds 14%, the proportion of [AlO4] tetrahedra in the glass network is too high, leading to excessively dense local networks. During melting, aluminum-oxygen polyhedra are prone to agglomeration, significantly increasing the tendency for crystallization, resulting in poor optical uniformity and the appearance of streaks or inclusions. Simultaneously, excessive Al2O3 significantly increases the high-temperature viscosity of radiation-resistant glass, raising the melting temperature, reducing forming fluidity, and increasing the defect rate during thin-film fabrication. Furthermore, excessive Al2O3 content also reduces the thermal expansion coefficient matching of radiation-resistant glass, worsening its compatibility with subsequent sealing or coating processes.

[0044] Furthermore, the molar percentage of Al2O3 can be approximately 8.5% to 12%. Within this sub-range, Al2O3 can synergistically construct a dense and stable network framework with SiO2, effectively suppressing the formation of color centers, while avoiding excessive crystallization risk and melting difficulties. At the same time, it maintains good optical uniformity and chemical strengthening response capabilities. This range is the preferred range that balances radiation resistance, mechanical strength, and process window, and is especially suitable for radiation protection devices that require thicker or higher mechanical loads.

[0045] The molar percentage of Al2O3 can also be approximately 9%~13%, 10%~14%, 10%~11.5%, 9%~10%, or 8.5%~13%, etc. Furthermore, the molar percentage of Al2O3 can be approximately 8.5%, 9%, 9.5%, 10%, 10.5%, 11%, 11.5%, 12%, 12.5%, 13%, 13.5%, or 14%, etc.

[0046] B2O3, as a network intermediate, accounts for approximately 2% to 6%. It can regulate the viscosity and coefficient of thermal expansion of radiation-resistant glass, improve its forming and optical properties, and synergistically enhance its radiation resistance and reduce radiation discoloration. However, excessive B2O3 content can lead to a decrease in the mechanical strength of radiation-resistant glass, while insufficient content will prevent it from exerting its regulatory effect.

[0047] When the molar percentage of B2O3 is less than 2%, its effect on regulating the viscosity and coefficient of thermal expansion of radiation-resistant glass is weak. At high temperatures, the viscosity of the molten glass is too low and highly sensitive to temperature changes, resulting in poor dimensional stability during molding. Thinner products are prone to uneven thickness and warping. Simultaneously, the lack of synergistic radiation-resistant effects between B2O3 and SiO2 / Al2O3 leads to a significant increase in color centers after irradiation, a rapid decrease in light transmittance, and a significant deficiency in radiation-resistant discoloration resistance. Furthermore, excessively low B2O3 content also degrades the chemical stability of radiation-resistant glass and weakens its resistance to acid corrosion. Overall, this content range fails to leverage the optimizing effect of B2O3 and is unsuitable for scenarios with conventional requirements for radiation resistance and molding quality.

[0048] When the molar percentage of B2O3 exceeds 6%, the excess B2O3 increases the proportion of [BO3] triangles in the glass network, disrupting the dense silica-oxygen framework constructed by SiO2 and Al2O3. This leads to a significant decrease in mechanical strength (such as flexural strength and hardness), reduced toughness, and increased brittleness in the radiation-resistant glass. Simultaneously, excessive viscosity reduction may cause uncontrolled flow during molding, and the chemical stability and weather resistance of the radiation-resistant glass deteriorate. During long-term use, borate precipitation, white spots, or phase separation are likely to occur on the surface. Regarding radiation resistance, excessive B2O3 actually weakens the ability to suppress color centers and may even introduce new radiation-sensitive centers.

[0049] Furthermore, the molar percentage of B2O3 can be approximately 2% to 5%. This range is the core optimization range for B2O3, which can form a highly efficient synergy with components such as SiO2, Al2O3, and Na2O, precisely adjusting the melt viscosity and coefficient of thermal expansion of the radiation-resistant glass, while enhancing radiation resistance and optical uniformity, achieving the optimal balance between forming performance and overall performance.

[0050] The molar percentage of B2O3 can also be approximately 2%~4%, 3%~4%, 4%~5%, or 2%~3%, etc.

[0051] For example, the molar percentage of B2O3 is approximately 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, 5.5%, or 6%, etc.

[0052] CeO2 is the core radiation-resistant component of the radiation-resistant glass in this application, accounting for 4.5% to 7%. It can effectively absorb high-energy rays, inhibit the formation and development of color centers during irradiation, significantly reduce the radiation discoloration rate of the radiation-resistant glass, and ensure the high optical transmittance of the radiation-resistant glass under irradiation environment. Too high a content will cause the radiation-resistant glass to yellow and affect its optical performance; too low a content will not achieve the ideal radiation resistance effect.

[0053] When the molar percentage of CeO2 is less than 4.5%, CeO2's absorption capacity for high-energy rays is insufficient, failing to effectively suppress the formation and development of color centers during irradiation. After irradiation, the light transmittance of the radiation-resistant glass decreases significantly, the discoloration rate increases, and it is difficult to guarantee high optical transmittance over a long period. Simultaneously, Ce... 4+ With Ce 3+ The charge transfer absorption between the particles is weak, resulting in poor stability of radiation-resistant glass under radiation. It is prone to browning or darkening, which severely shortens its service life. Although radiation-resistant glass may have high initial visible light transmittance and no obvious yellowing, it sacrifices its core radiation protection function and cannot meet the needs of applications with strict radiation protection requirements, such as medical, aerospace, and nuclear industries.

[0054] When the molar percentage of CeO2 exceeds 7%, excess CeO2 will cause a strong yellow or yellowish-brown discoloration in radiation-resistant glass during the melting process (even without irradiation), significantly affecting optical performance, especially a sharp decrease in transmittance in the short wavelength range. Simultaneously, excessive CeO2 content also increases the density and crystallization tendency of radiation-resistant glass, potentially introducing unmelted cerium oxide particles and reducing optical uniformity. Furthermore, high CeO2 content raises the melting temperature of radiation-resistant glass, increasing processing difficulty and significantly increasing costs.

[0055] Furthermore, the molar percentage of CeO2 can be 4.5% to 6.5%. Within this sub-range, CeO2 can efficiently absorb high-energy rays, strongly suppress color center formation, and significantly reduce radiation-induced discoloration, while avoiding the initial yellowing and decreased optical uniformity problems caused by excessively high content (greater than 7%). Compared to the wider range of 4.5% to 7%, 4.5% to 6.5% is more conducive to balancing radiation resistance performance with the background transmittance of radiation-resistant glass, especially suitable for scenarios with high requirements for visible light transmittance (especially in the blue-violet band) and color neutrality (such as optical windows and medical imaging equipment). At the same time, CeO2 has better solubility in radiation-resistant glass within this content range, is less likely to precipitate cerium-containing crystalline phases, has a wider melting process window, and a higher product yield, making it the preferred range that balances radiation resistance, optical quality, and manufacturing cost.

[0056] Furthermore, the molar percentage of CeO2 can be 4.5% to 5.5%. This range is a further refinement of the 4.5% to 6.5% subrange. Within this range, CeO2 can effectively absorb high-energy rays, significantly suppress color center formation, and reduce the radiation-induced color change rate to an extremely low level. Simultaneously, since the CeO2 content does not exceed 5.5%, the initial yellowing phenomenon after melting the radiation-resistant glass is essentially eliminated, and the transmittance in the visible light band (especially the 400–450 nm blue light region) is close to that of radiation-resistant glass without added CeO2, achieving optimal optical neutrality. In addition, at this content, CeO2 is completely dissolved in the glass network, eliminating the risk of crystallization, resulting in a moderate melting temperature, good process stability, and relatively low raw material costs. Therefore, 4.5% to 5.5% is particularly suitable for high-end optical windows, space exploration equipment, and medical imaging systems where extreme requirements for light transmittance, color purity, and long-term radiation stability are present.

[0057] The molar percentage of CeO2 can also be in other ranges, such as 5.5% to 7%. A CeO2 concentration of 5.5% to 7% is considered a relatively high addition level and is suitable for scenarios with extremely high irradiation doses and stringent requirements for color change rate, but where slight initial yellowing is permissible, such as high-energy physics experimental windows or nuclear waste disposal observation windows. A CeO2 concentration of 5% to 6.5% balances radiation resistance efficiency and melt transparency, representing a more common compromise range in industry, suitable for most medical irradiation equipment and aerospace optical components. A CeO2 concentration of 4.8% to 5.2% allows for narrow-window, precise control, and is used in precision optical systems with extremely high requirements for colorimetric stability and batch consistency.

[0058] The molar percentage of CeO2 can also be an endpoint value, for example: approximately 4.5% (lower limit): achieving the lowest raw material cost and background absorption while ensuring basic radiation resistance, suitable for low-dose radiation environments or disposable protective radiation-resistant glass; approximately 4.8%, 5%, or 5.2%: the balance point, with good radiation resistance and optical transmittance, the preferred reference point for conventional mass production design; approximately 5.5%: the maximum safe addition amount that can be tolerated without causing significant yellowing, with excellent overall performance; approximately 6% or 6.5%: suitable for medium to high radiation doses, with slight yellowing but strong resistance to color centers, often used for sealed observation windows under long-term radiation; approximately % (upper limit): the strongest radiation resistance, but may cause slight yellowing and increased cost, only used in special occasions with extremely high radiation doses and less stringent requirements for initial transmittance.

[0059] K2O, as a network modifier, can reduce the high-temperature viscosity of radiation-resistant glass, improve melt and molding fluidity, and adjust the coefficient of thermal expansion to facilitate sealing with metals or ceramics; it can also provide some K + Ion exchange used in chemical fortification processes (with Na) +(The exchange forms a surface compressive stress layer). Adding an appropriate amount can also inhibit crystallization, improve the hydrolysis resistance and surface smoothness of radiation-resistant glass. The molar percentage of K2O can be approximately 1% to 4.5%. Excessive content will damage the network structure, reducing chemical stability and radiation resistance; insufficient content will have little regulatory effect.

[0060] When the molar percentage of K2O is less than 1%, the K2O content is insufficient, resulting in a weak effect on regulating viscosity and coefficient of thermal expansion. This leads to a higher melting temperature for radiation-resistant glass, poor fluidity, and a tendency to produce streaks, bubbles, and uneven thickness during molding. Simultaneously, during chemical strengthening, K2O content is also insufficient. + The supply is insufficient, the ion exchange layer is shallow, the surface compressive stress is low, and the improvement of mechanical strength is limited. In addition, the effect of inhibiting crystallization and improving hydrolysis resistance is not obvious, the overall process window is narrow, and the yield is low.

[0061] When the molar percentage of K2O is greater than 4.5%, excessive K2O will excessively damage the silicon-oxygen network structure, resulting in a significant decrease in chemical stability, poor resistance to acid and alkali corrosion, and easy alkali precipitation or weathering on the surface during long-term use. At the same time, the coefficient of thermal expansion is too large, resulting in poor compatibility with sealing materials and easy thermal stress cracking. The radiation resistance is also deteriorated due to the increase of non-bridging oxygen, and the tendency to form color centers increases. The cost increases, and it may affect the strain point and softening point of radiation-resistant glass, reducing thermal stability.

[0062] Furthermore, the molar percentage of K2O can be 2% to 4.5%. This subrange ensures sufficient adjustment of melting properties, coefficient of thermal expansion, and chemical strengthening ability while avoiding the stability risks associated with excessive K2O, making it particularly suitable for radiation-resistant glass products that require good sealing and moderate strengthening effects.

[0063] The molar percentage of K2O can also be 2%~4%, 1%~4%, 2.5%~3.5%, 1.5%~2.5%, or 3%~4.5%, etc. Furthermore, the molar percentage of K2O can be approximately 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, or 4.5%, etc.

[0064] ZnO can improve the optical uniformity and chemical stability of radiation-resistant glass, and help enhance its mechanical strength. The molar percentage of ZnO can be approximately 0.1% to 1%. Within this range, it can improve the optical uniformity and chemical stability of radiation-resistant glass, and help enhance its mechanical strength; at the same time, it can reduce high-temperature viscosity, improve molding performance, adjust the coefficient of thermal expansion to optimize sealing compatibility, enhance anti-crystallization ability to broaden the process window, synergize with CeO2 to stabilize the redox balance, reduce color center formation, improve surface hydrolysis resistance, and extend service life in humid environments.

[0065] When the molar percentage of ZnO is less than 0.1%: the addition of ZnO is too low to effectively exert the regulatory role of the network intermediate, resulting in negligible improvement in optical uniformity, and making it difficult to fully eliminate microbubbles and streaks in the glass melt; the auxiliary improvement in chemical stability and mechanical strength is almost negligible, and the effects on adjusting the coefficient of thermal expansion, enhancing anti-crystallization ability, and synergistic radiation resistance are not significant. Although it does not introduce the risk of crystallization or increase in density, it also fails to provide the process and performance gains that ZnO offers, making it only suitable for extremely simple formulation scenarios where there are no additional requirements for uniformity, stability, and mechanical properties.

[0066] When the molar percentage of ZnO exceeds 1%, excessive ZnO disrupts the stability of the glass network, leading to a significant increase in crystallization tendency. This is especially true during cooling, where zinc silicate or zinc aluminate microcrystals are easily formed, severely reducing optical uniformity and light transmittance. Simultaneously, the density of the radiation-resistant glass increases significantly, and the coefficient of thermal expansion may change unexpectedly, affecting subsequent sealing compatibility. Furthermore, high ZnO content reduces the acid resistance of the radiation-resistant glass and may cause excessively rapid hardening, making molding difficult. Thinner products are prone to internal stress or cracking. Mechanical strength no longer increases with increasing ZnO content; instead, it decreases due to crystallization and phase separation.

[0067] Furthermore, the molar percentage of ZnO can also be 0.2%~0.4%, 0.1%~0.5%, 0.5%~0.7%, 0.2%~0.8%, or 0.3%~0.5%, etc. Even further, the molar percentage of ZnO can be approximately 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, or 1%, etc.

[0068] As a clarifying agent, Sb₂O₃ can remove bubbles generated during the melting process of radiation-resistant glass, improving its transparency and optical uniformity. However, excessive Sb₂O₃ content can lead to defects in the radiation-resistant glass, while insufficient content results in poor clarification. The molar percentage of Sb₂O₃ can be approximately 0.1% to 0.2%, which is the core optimization range for Sb₂O₃. This range achieves excellent clarification while precisely controlling the risk of defects in the radiation-resistant glass, balancing its optical properties, melting properties, and structural stability.

[0069] When the molar percentage of Sb₂O₃ is less than 0.1%, insufficient clarifying agent leads to difficulty in effectively removing bubbles generated during the melting process. This results in numerous microbubbles remaining inside and on the surface of the radiation-resistant glass, causing decreased transparency and poor optical uniformity. Furthermore, these bubbles may expand further during subsequent forming or heat treatment, creating visible defects and severely impacting the optical quality and yield of the radiation-resistant glass. Although it does not introduce secondary defects caused by excessive clarifying agent, it fails to meet the basic requirements for high transparency in conventional applications.

[0070] When the molar percentage of Sb₂O₃ exceeds 0.2%, excessive Sb₂O₃ will decompose or volatilize excessively at high temperatures. On the one hand, this may generate secondary bubbles (i.e., re-generated bubbles), which will worsen the clarification effect. On the other hand, residual antimony ions or unreacted antimony compounds are prone to forming stones, streaks, or localized coloring (such as yellow or brown spots), significantly reducing optical uniformity and appearance quality. Simultaneously, high Sb₂O₃ content can also affect the stability of the network structure of radiation-resistant glass, potentially reducing its chemical strengthening ability and radiation resistance.

[0071] Furthermore, the molar percentage of Sb₂O₃ can also be 0.15%~0.18%, 0.12%~0.15%, 0.15%~0.17%, 0.12%~0.14%, or 0.13%~0.15%, etc. Even further, the molar percentage of Sb₂O₃ can be approximately 0.1%, 0.11%, 0.12%, 0.13%, 0.14%, 0.15%, 0.16%, 0.17%, 0.18%, 0.19%, or 0.2%, etc.

[0072] Fluorine (F), as an anion, introduced in the form of alkali metal or alkaline earth metal fluorides, can reduce the dispersion of radiation-resistant glass, effectively reducing reflectivity and increasing transmittance, thus improving cell conversion efficiency. Furthermore, introducing a certain amount of fluorine into radiation-resistant glass further loosens the glass network structure and expands the internal channels, which is more conducive to ion exchange and improves its effectiveness and efficiency. Excessive fluorine, however, leads to an overly loose structure in the radiation-resistant glass, reducing its strength and increasing its crystallization tendency, which is detrimental to production. Fluorine can be introduced in the form of sodium fluoride (NaF), with a molar percentage of approximately 0-2%.

[0073] When the molar percentage of NaF is greater than 2%, the excessive fluoride ions excessively damage the silicon-oxygen network structure, resulting in an overly loose structure of the radiation-resistant glass, a significant decrease in mechanical strength (flexural strength, hardness), and an increase in brittleness. At the same time, the tendency for crystallization increases significantly, and fluoride crystallization or phase separation is easily generated during the melting process, affecting optical uniformity and surface quality. In addition, the chemical stability of the radiation-resistant glass deteriorates, its deliquescence resistance decreases, and fluorine volatilization is severe during the melting process, polluting the environment and causing compositional fluctuations.

[0074] Preferably, the molar percentage of NaF can be approximately 0.5% to 1%. Within this range, the introduction of fluoride ions is moderate, which can moderately loosen the glass network and slightly expand the ion exchange channels, thereby improving the ion exchange efficiency and depth to a certain extent, while avoiding excessive damage to the network framework. This results in minimal loss of the mechanical strength (such as bending strength and hardness) of the radiation-resistant glass, with almost no impact on its original mechanical properties. In terms of optical performance, 0.5% to 1% NaF can effectively reduce the dispersion and reflectivity of the radiation-resistant glass, and improve the transmittance in the visible and near-infrared bands, thus contributing to the improvement of battery conversion efficiency. Compared with an addition of 1% to 2%, its intrinsic absorption and volatilization problems are less severe, the melting process is more stable, and the background transparency of the radiation-resistant glass is higher. This range is particularly suitable for scenarios where the retention of mechanical strength is extremely high (such as thin photovoltaic glass or radiation windows that need to withstand certain loads), while still desiring ion exchange-assisted gain and optical anti-reflection effects. It is the preferred range for achieving a fine balance between performance enhancement and structural stability.

[0075] The molar percentage of NaF can also be approximately 1%~1.5%, 1.5%~2%, 0.7%~1%, 0.9%~1.7%, 1.2%~1.5%, or 0.4%~1.2%, etc. Furthermore, the molar percentage of NaF can also be approximately 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1.0%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%, 1.9%, or 2.0%, etc.

[0076] The radiation-resistant glass of this application has a density of 2.51 g / cm³ to 2.56 g / cm³. Radiation-resistant glass within this density range combines lightweight design with structural stability, making it suitable for applications such as aerospace equipment where component weight is a concern. Simultaneously, it ensures sufficient mechanical strength to prevent breakage after thinning.

[0077] The refractive index Nd of the radiation-resistant glass in this application is 1.51~1.53. This refractive index range meets the requirements for use in optical components such as optical windows and protective lenses, ensuring the optical imaging quality and light transmission effect of the radiation-resistant glass, and making it compatible with various optical systems.

[0078] Within a temperature range of 20℃ to 150℃, the coefficient of thermal expansion α of the radiation-resistant glass of this application is not greater than 9.0 × 10⁻⁶. -6 / ℃. A lower coefficient of thermal expansion can improve the thermal stability of radiation-resistant glass, prevent thermal stress cracking in conditions with large temperature changes (such as aerospace environments), and extend the service life of radiation-resistant glass.

[0079] The radiation-resistant glass of this application has an irradiation chromatic aberration rate of ≤0.8%. The extremely low irradiation chromatic aberration rate ensures that the optical transmittance of the radiation-resistant glass will not decrease significantly under long-term radiation conditions, and it will always maintain good light transmission performance to meet the needs of optical windows and protective lenses.

[0080] The flexural strength of the radiation-resistant glass in this application is 130MPa~178MPa. This flexural strength can meet the mechanical requirements of radiation-resistant glass during processing, installation and use, and prevent the radiation-resistant glass from breaking due to external forces, making it particularly suitable for the application of thin radiation-resistant glass.

[0081] When the thickness of the radiation-resistant glass is 0.3mm to 0.35mm (e.g., 0.32mm), the transmittance of the radiation-resistant glass is <1% in the 330nm band, ≥89% in the 400nm band, ≥90% in the 450nm band, and an average transmittance ≥92% in the 500nm to 2000nm band. This transmittance index ensures that the radiation-resistant glass has good ultraviolet shielding performance and visible and near-infrared transmittance performance. It can block harmful ultraviolet rays while ensuring a clear optical field of view, making it suitable for use in medical irradiation, aerospace optics, and other scenarios.

[0082] The glass transition temperature of the radiation-resistant glass in this application is 542℃~582℃, and the softening temperature is 603℃~675℃. These thermal performance indicators ensure that the radiation-resistant glass has good thermal stability during processing (such as molding, cutting, and chemical strengthening), preventing deformation and breakage due to excessive temperature, while also meeting the temperature requirements of subsequent chemical strengthening processes.

[0083] The radiation-resistant glass of this application achieves a synergistic improvement in radiation resistance, optical performance, and mechanical strength through the reasonable compounding of various components, and has many beneficial effects: (1) Excellent radiation resistance: The core component CeO2 works synergistically with other components to effectively absorb high-energy rays and suppress the generation of color centers during irradiation, so that the radiation discoloration rate of the radiation-resistant glass is ≤0.8%, and it can work stably in harsh irradiation environments such as aerospace and nuclear industry for a long time, avoiding discoloration and darkening of the radiation-resistant glass; (2) Excellent optical performance: By optimizing the component ratio, the radiation-resistant glass has high optical transmittance, especially in the visible light and near-infrared bands, and also has good ultraviolet shielding performance, which is suitable for the use of optical components such as optical windows and protective lenses; and the refractive index and optical uniformity are good, ensuring the quality of optical imaging; (3) High mechanical strength: The glass network structure is optimized by the synergistic combination of various components, so that the bending strength of the radiation-resistant glass reaches 130MPa~178MPa. a. After chemical strengthening, the bending strength can be increased to 450MPa~540MPa, which is suitable for thin-film preparation and avoids the breakage of thin radiation-resistant glass during processing and installation; (4) Good thermal and chemical stability: Radiation-resistant glass has a low coefficient of thermal expansion, suitable glass transition temperature and softening temperature, and can adapt to working conditions with large temperature changes. It also has excellent chemical stability, is not easily corroded, and extends service life; (5) Good process adaptability: Radiation-resistant glass has a reasonable composition ratio, moderate melting difficulty, good molding performance, and is suitable for chemical strengthening by potassium ion exchange process. The process is simple and controllable and suitable for large-scale industrial production; (6) Broad application prospects: Radiation-resistant glass components can be made for optical windows and protective lenses in aerospace, nuclear industry, medical irradiation and other fields. It can also be directly applied to related equipment to solve the pain points of existing radiation-resistant glass materials in harsh irradiation environments. It has good application value and market prospects.

[0084] This application also proposes a chemically strengthened radiation-resistant glass, which is made by chemically strengthening the above-mentioned radiation-resistant glass. The chemical strengthening adopts a potassium ion exchange process. The surface compressive stress (CS) of the strengthened chemically strengthened radiation-resistant glass is 650MPa~980MPa, the compressive stress at 50μm below the surface (CS50) is 40MPa~62MPa, the stress layer depth (DOL0) is 70μm~95μm, the surface center tensile stress (CT-CV) is 40MPa~56MPa, the average tensile stress (CT-AV) is 35MPa~48MPa, the tensile stress linear density (CTLD) is 18000MPa / mm~29000MPa / mm, and the bending strength is 450MPa~540MPa.

[0085] This application describes a radiation-resistant glass that is chemically strengthened using a potassium ion exchange process, utilizing the Na+ on the surface of the radiation-resistant glass. + With K in the salt bath+ To perform the exchange, since K + The ionic radius is greater than that of Na. + After the exchange, a compressive stress layer is formed on the surface of the radiation-resistant glass, which significantly improves the mechanical strength of the radiation-resistant glass. The above stress parameters and bending strength indicators mean that the chemically strengthened radiation-resistant glass not only retains excellent radiation resistance and optical properties, but also has extremely high mechanical strength, which can effectively prevent damage and cracking of the radiation-resistant glass during processing, installation and use, and adapt to more stringent operating conditions.

[0086] Chemically strengthened radiation-resistant glass is produced through a single chemical strengthening process. The KNO3 mass fraction in the strengthening salt bath is ≥99.5%, the strengthening temperature is 400℃~430℃, and the strengthening time is 200min~250min. These chemical strengthening process parameters have been optimized to achieve KNO3 concentrations of ≥99.5%. + with Na + The process involves sufficient exchange of heat and moisture to form a uniform and stable compressive stress layer. At the same time, it avoids defects such as yellowing and deformation of the radiation-resistant glass caused by excessively high temperatures or excessively long periods of time. This ensures that the optical and mechanical properties of the chemically strengthened radiation-resistant glass reach the best balance. The process is simple, controllable, and suitable for industrial production.

[0087] This application also proposes a radiation-resistant glass element, which is made of the aforementioned radiation-resistant glass or chemically strengthened radiation-resistant glass. This radiation-resistant glass element is used for optical windows and protective lenses in aerospace, nuclear industry, or medical radiation environments. This radiation-resistant glass element inherits the excellent properties of radiation-resistant glass or chemically strengthened radiation-resistant glass, possessing good radiation resistance, high optical transmittance, and mechanical strength. It can operate stably for a long time in harsh environments such as aerospace, nuclear industry, and medical radiation, effectively solving the problems of discoloration and insufficient strength of existing radiation-resistant glass elements under radiation environments, thus improving the reliability and service life of related equipment.

[0088] This application also proposes a device comprising the aforementioned radiation-resistant glass, or the aforementioned chemically strengthened radiation-resistant glass, or the aforementioned radiation-resistant glass element, for use in aerospace equipment, nuclear testing equipment, or medical irradiation equipment. Applying the radiation-resistant glass, chemically strengthened radiation-resistant glass, or radiation-resistant glass element of this application to aerospace equipment, nuclear testing equipment, or medical irradiation equipment can improve the stability and reliability of the equipment under harsh radiation environments, extend the service life of the equipment, reduce equipment maintenance costs, and promote the upgrading and optimization of equipment in related fields.

[0089] Explanation of the testing equipment and methods involved in the above parameters: Coefficient of expansion: The linear expansion coefficient α of glass (20℃~150℃, 10) 7 / k) The test method is based on the national standard: Test Methods for Colorless Optical Glass Part 16: Coefficient of Linear Expansion, Transition Temperature and Sag Temperature; Standard No.: GB / T7962.16 2010.

[0090] Water resistance stability (DW, powder method) and acid resistance stability (DA, powder method) Radiation-resistant glass samples were prepared as powder and tested under aqueous or acidic solutions. The powder was then immersed at 100°C for 1 hour. Acid and water resistance were graded according to the percentage of weight loss, as shown in the table below. Table 1 Water Resistance Classification

[0091] Table 2 Acid Resistance Classification

[0092] Transmittance: The light transmittance was measured by a spectrophotometer after the sample was processed to a thickness of 0.32 mm and polished on both sides.

[0093] CT-CV, DOL0, CS50, CT-AV, CTLD, etc., were tested using a SLP-2000 glass surface stress meter. The measurement conditions were calculated with the sample's refractive index being 1.51 and the optical elastic constant being 30.8 [(nm / cm) / MPa].

[0094] Bending strength: The test was conducted using a microcomputer-controlled electronic universal testing machine with a sample size of 0.32 mm, in accordance with ASTM C 158-2002.

[0095] Density: Take cover glass without bubbles, stones, streaks or other defects, process it into a 10mm×20mm×5mm and polished cuboid glass block, test it according to the test principle and procedure in GB / T5432, and take the arithmetic mean of the measured sample density as the density of the cover glass.

[0096] Irradiation attenuation rate: The cover glass is subjected to electron irradiation under the following conditions: ① Type: Electron; ② Energy: 1 MeV; ③Instantaneous injection volume: 5×10 10 e / cm 2 ·s~2×10 12 e / cm 2 ·s; ④ Cumulative betting volume: 1×10 16 e / cm 2 The light is incident perpendicularly on the front surface of the cover plate.

[0097] Based on the previously tested spectral transmittance standard, the samples before and after irradiation were tested, and the irradiation attenuation rate T is calculated as follows:

[0098] In the formula: T: Irradiation attenuation rate, % T1: Transmittance before irradiation, % T2: Transmittance after irradiation, %.

[0099] Refractive index: ① Instruments and equipment: One Abbe refractometer, α-bromonal, sodium lamp; ② Take coverslip glass free of bubbles, stones, streaks, and other defects, process it into a 10mm×20mm×5mm rectangular glass block, and finely grind it. The largest face and the smallest top face should be polished. The number of samples should be no less than 3.

[0100] ③ Place α-bromonaphthalene on a large polished surface of the sample and attach it to the sample holder. Rotate the reading knob and align the crosshairs in the eyepiece with the line of intersection of light and dark areas on the sample. Read the refractive index value of the sample from the reading window. Measure the refractive index of all samples and calculate the arithmetic mean.

[0101] To further clarify and illustrate the technical solution of this application, the following non-limiting embodiments are provided. The components and measurement results of each embodiment are detailed in Tables 3 and 4.

[0102] Table 3 Examples 1 to 5

[0103] Table 4 Examples 6 to 9

[0104] It should be noted that the molar percentages of all components in this application are theoretical design values. In actual radiation-resistant glass preparation, the content of each component may fluctuate within ±0.5 percentage points (absolute value) of the design value, which is an acceptable error in the art. Therefore, any specific values ​​or ranges listed in the specification, unless explicitly stated, imply the aforementioned reasonable fluctuations. Furthermore, measured values ​​of each component within ±0.5 mol% of the theoretical value are considered to meet the formulation requirements of this application.

[0105] The above embodiments are only used to illustrate the present application and are not intended to limit it. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included within the protection scope of the present application.

Claims

1. A radiation-resistant glass, characterized in that, The components of the radiation-resistant glass are expressed as a mole percentage, including: SiO2: 60%~68%; Na2O: 11%~14%; Al2O3: 8.5%~14%; B2O3: 2%~6%; CeO2: 4.5%~7%; K2O: 1%~4.5%; ZnO: 0.1%~1%; and Sb2O3: 0.1%~0.2%.

2. The radiation-resistant glass according to claim 1, characterized in that, The molar percentages of each component are as follows: SiO2: 60%~68%; Na2O: 11%~14%; Al2O3: 8.5%~12%; B2O3: 2%~5%; CeO2: 4.5%~7%; K2O: 2%~4.5%; ZnO: 0.1%~1%; Sb2O3: 0.1%~0.2%.

3. The radiation-resistant glass according to claim 1, characterized in that, The molar percentage of CeO2 is 4.5% to 6.5%.

4. The radiation-resistant glass according to claim 3, characterized in that, The molar percentage of CeO2 is 4.5% to 5.5%.

5. The radiation-resistant glass according to claim 1, characterized in that, The radiation-resistant glass also includes: Fluorine is introduced in the form of NaF, with a NaF content of 0-2%.

6. The radiation-resistant glass according to claim 5, characterized in that, The NaF content is 0.5%~1%.

7. The radiation-resistant glass according to any one of claims 1 to 6, characterized in that, The density of the radiation-resistant glass is 2.51 g / cm³ to 2.56 g / cm³.

8. The radiation-resistant glass according to any one of claims 1 to 6, characterized in that, The refractive index Nd of the radiation-resistant glass is 1.51~1.

53.

9. The radiation-resistant glass according to any one of claims 1 to 6, characterized in that, Within a temperature range of 20℃ to 150℃, the coefficient of thermal expansion α of the radiation-resistant glass is not greater than 9.0 × 10⁻⁶. -6 / ℃.

10. The radiation-resistant glass according to any one of claims 1 to 6, characterized in that, The radiation-resistant glass has an irradiation discoloration rate of ≤0.8%.

11. The radiation-resistant glass according to any one of claims 1 to 6, characterized in that, The flexural strength of the radiation-resistant glass is 130 MPa to 178 MPa.

12. The radiation-resistant glass according to any one of claims 1 to 6, characterized in that, When the thickness of the radiation-resistant glass is 0.3mm to 0.35mm, the transmittance of the radiation-resistant glass is <1% in the 330nm band, ≥89% in the 400nm band, ≥90% in the 450nm band, and the average transmittance in the 500nm to 2000nm band is ≥92%.

13. The radiation-resistant glass according to any one of claims 1 to 6, characterized in that, The glass transition temperature of the radiation-resistant glass is 542℃~582℃, and the softening temperature is 603℃~675℃.

14. A chemically strengthened radiation-resistant glass, characterized in that, The radiation-resistant glass according to any one of claims 1 to 13 is chemically strengthened, wherein the chemical strengthening adopts a potassium ion exchange process, and the strengthened chemically strengthened radiation-resistant glass has a surface compressive stress of 650MPa to 980MPa, a compressive stress at 50μm below the surface of 40MPa to 62MPa, a stress layer depth of 70μm to 95μm, a central tensile stress of 40MPa to 56MPa, an average tensile stress of 35MPa to 48MPa, a tensile stress linear density of 18000MPa / mm to 29000MPa / mm, and a bending strength of 450MPa to 540MPa.

15. The chemically strengthened radiation-resistant glass according to claim 14, characterized in that, The chemically strengthened radiation-resistant glass is made through a single chemical strengthening process, wherein the mass fraction of KNO3 in the chemical strengthening salt bath is ≥99.5%, the strengthening temperature is 400℃~430℃, and the strengthening time is 200min~250min.

16. A radiation-resistant glass element, characterized in that, Made of radiation-resistant glass according to any one of claims 1 to 13, or made of chemically strengthened radiation-resistant glass according to claims 14 to 15, the radiation-resistant glass element is used as an optical window or protective lens in aerospace, nuclear industry or medical radiation environments.

17. A device, characterized in that, The device includes the radiation-resistant glass according to any one of claims 1 to 13, or the chemically strengthened radiation-resistant glass according to claims 14 to 15, or the radiation-resistant glass element according to claim 16, wherein the device is aerospace equipment, nuclear detection equipment, or medical irradiation equipment.

Images