An ultra-high thermal resistance chip packaging adhesive, a preparation method thereof and a chip packaging method

Abstract

The application belongs to the technical field of semiconductor chip packaging, and relates to a super-high thermal resistance chip packaging adhesive and a preparation method and a chip packaging method, which comprise hollow glass microbeads and an epoxy resin-based glue body, the volume ratio of the hollow glass microbeads and the epoxy resin-based glue body is 0.5:1-3:1, the glue body is one or more of an insulating epoxy resin-based glue body and a conductive epoxy resin-based glue body, and the particle size of the hollow glass microbeads is one or more of 5-250 mu m; the hollow glass microbeads are mixed with the epoxy resin-based glue body to form a mixed chip packaging adhesive, so that the chip packaging adhesive has super-high thermal resistance and good mechanical properties and process workability; and the chip packaging method can be widely applied to chip packaging of an integrated constant-temperature self-heating module and provides super-high thermal resistance for the chip, thereby guaranteeing the performance and reliability of the chip.

Description

Technical Field

[0001] This invention belongs to the technical field of semiconductor chip packaging, and relates to an ultra-high thermal resistance chip packaging adhesive and its preparation method, as well as a chip packaging method. Background Technology

[0002] With the rapid development of integrated circuits, chips with integrated on-chip thermostatic self-heating modules (such as ultra-precision voltage references and temperature sensors) are becoming increasingly important. The core function of these chips is to precisely maintain the heat generated by the heater within a set area to achieve stable and efficient heating, and to maintain the chip at a stable operating temperature. However, traditional packaging methods (using gold-tin, conductive adhesive, and insulating adhesive as bonding materials) generally pursue "low thermal resistance," that is, to conduct heat away from the chip as quickly as possible to reduce junction temperature and power consumption, ensuring device functionality and reliability. But for chips with integrated on-chip thermostatic self-heating modules, this design approach becomes a performance bottleneck. The heat generated by the on-chip heater is quickly conducted away by the package and PCB, leading to a sharp increase in power consumption to maintain the operating temperature, resulting in consistently high heating power consumption. Simultaneously, the chip generates a significant thermal gradient, making it difficult to guarantee temperature consistency, which in turn affects the device's response speed and accuracy, severely limiting the performance of this type of chip. Furthermore, the dissipated heat can also cause thermal crosstalk to neighboring components, reducing system-level application integration and reliability.

[0003] Therefore, driven by comprehensive requirements such as low power consumption, high uniformity, fast response and high performance, chips that integrate on-chip thermostatic self-heating modules adopt ultra-high thermal resistance adhesives to achieve high thermal resistance (thermal insulation) packaging technology, thereby effectively isolating the heating area from the external environment, so that most of the heating power is used to maintain the temperature of the set area rather than being dissipated to the surrounding environment, which has become an inevitable choice to ensure the performance of such chips. Summary of the Invention

[0004] To address the aforementioned technical problems, the present invention employs an ultra-high thermal resistance chip encapsulation adhesive, comprising: hollow glass microspheres and epoxy resin-based colloid.

[0005] The volume ratio of hollow glass microspheres to epoxy resin-based colloid is 0.5:1 to 3:1.

[0006] The epoxy resin-based colloid is one or more of the following: insulating epoxy resin-based colloid and conductive epoxy resin-based colloid.

[0007] The hollow glass microspheres have a particle size of one or more ranging from 5 μm to 250 μm.

[0008] On the other hand, the present invention employs a method for preparing the above-mentioned ultra-high thermal resistance chip packaging adhesive, comprising:

[0009] S1. Set the volume ratio of hollow glass microspheres and epoxy resin-based colloid, and measure the corresponding volume ratio of epoxy resin-based colloid and hollow glass microspheres using a graduated cylinder.

[0010] S2. Add the measured hollow glass microspheres to the measured epoxy resin-based colloid, mix and stir evenly, then add to a vacuum mixer and stir evenly to obtain an ultra-high thermal resistance chip encapsulation adhesive.

[0011] On the other hand, the present invention employs a chip packaging method based on the aforementioned ultra-high thermal resistance chip packaging adhesive, comprising:

[0012] S1. Obtain the chip and casing of the integrated on-chip constant temperature self-heating module;

[0013] S2. Using an ultra-high thermal resistance chip packaging adhesive, the chip of the integrated on-chip constant temperature self-heating module is bonded to the carrier of the tube shell, and then baked and cured.

[0014] S3. Use bonding wire to wire bond the device obtained in step S2, and then perform capping, marking and testing in sequence to obtain the chip package structure of the integrated on-chip constant temperature self-heating module.

[0015] Beneficial effects:

[0016] 1. This invention uses a mixture of hollow glass microspheres and epoxy resin-based colloid to form a mixed chip encapsulation adhesive, which gives the chip encapsulation adhesive ultra-high thermal resistance and good mechanical properties and processability.

[0017] 2. The chip packaging method used in this invention can be widely applied to the chip packaging of integrated on-chip constant temperature self-heating modules, and provides ultra-high thermal resistance for such chips to ensure their performance and reliability. Attached Figure Description

[0018] Figure 1 A schematic diagram of the chip packaging structure of the integrated on-chip thermostatic self-heating module provided in an embodiment of the present invention;

[0019] Figure 2 A flowchart illustrating a method for preparing an ultra-high thermal resistance chip packaging adhesive, provided in an embodiment of the present invention;

[0020] Figure 3 This is a flowchart illustrating a chip packaging method based on an ultra-high thermal resistance chip packaging adhesive, provided as an embodiment of the present invention. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] like Figure 1 As shown, in one aspect, the embodiments of the present invention employ an ultra-high thermal resistance chip encapsulation adhesive, comprising: hollow glass microspheres and epoxy resin-based colloid, wherein the chip encapsulation adhesive is a mixed adhesive composed of hollow glass microspheres and epoxy resin-based colloid.

[0023] The volume ratio of hollow glass microspheres to epoxy resin-based colloid is 0.5:1 to 3:1.

[0024] By adopting the above technical solution, hollow glass microspheres are introduced into the epoxy resin-based colloid, ensuring that the hollow glass microspheres are uniformly dispersed in the epoxy resin-based colloid as much as possible. This can effectively reduce the thermal conductivity of the epoxy resin-based colloid and increase its thermal resistance. At the same time, the resulting mixed adhesive has good mechanical properties and ultra-high thermal resistance, which helps to ensure the performance and reliability of the chip.

[0025] The epoxy resin-based colloid is one or more of the following: insulating epoxy resin-based colloid and conductive epoxy resin-based colloid.

[0026] The hollow glass microspheres have a particle size of one or more ranging from 5 μm to 250 μm.

[0027] like Figure 2 As shown, on the other hand, this invention employs a method for preparing the above-mentioned ultra-high thermal resistance chip packaging adhesive, comprising:

[0028] S1. Set the volume ratio of hollow glass microspheres and epoxy resin-based colloid, and measure the corresponding volume ratio of epoxy resin-based colloid and hollow glass microspheres using a graduated cylinder.

[0029] S2. Add the measured hollow glass microspheres to the measured epoxy resin-based colloid, mix and stir evenly, then add to a vacuum mixer and stir evenly to obtain an ultra-high thermal resistance chip encapsulation adhesive.

[0030] like Figure 3 As shown, on the other hand, this invention employs a chip packaging method based on the aforementioned ultra-high thermal resistance chip packaging adhesive, comprising:

[0031] S1. Obtain the chip and casing of the integrated on-chip constant temperature self-heating module;

[0032] S2. Using an ultra-high thermal resistance chip packaging adhesive, the chip of the integrated on-chip constant temperature self-heating module is bonded to the carrier of the tube shell, and then baked and cured.

[0033] S3. Use bonding wire to wire bond the device obtained in step S2, and then perform capping, marking and testing in sequence to obtain the chip package structure of the integrated on-chip constant temperature self-heating module.

[0034] To verify the effects of the volume ratio of hollow glass microspheres, epoxy resin-based colloid, hollow glass microspheres and epoxy resin-based colloid, and the particle size of hollow glass microspheres on the thermal resistance of the junction to the tube shell, the following test group and control group were set up:

[0035] Test group 1:

[0036] A chip encapsulation adhesive with ultra-high thermal resistance is formed by using 50 mL of WON207-T epoxy resin-based colloid and 50 mL of hollow glass microspheres with a particle size of 50 μm. The volume ratio of hollow glass microspheres with a particle size of 50 μm to epoxy resin-based colloid is 1:1.

[0037] Test group 2:

[0038] A chip encapsulation adhesive with ultra-high thermal resistance is formed by using 50 mL of WON207-T epoxy resin-based colloid and 50 mL of hollow glass microspheres with a particle size of 70 μm. The volume ratio of hollow glass microspheres with a particle size of 70 μm to epoxy resin-based colloid is 1:1.

[0039] Test group 3:

[0040] A chip encapsulation adhesive with ultra-high thermal resistance is formed by using 50 mL of WON207-T epoxy resin-based colloid and 100 mL of hollow glass microspheres with a particle size of 70 μm. The volume ratio of hollow glass microspheres with a particle size of 70 μm to epoxy resin-based colloid is 2:1.

[0041] Test group 4:

[0042] A chip encapsulation adhesive with ultra-high thermal resistance is formed by using 50 mL of WON207-T epoxy resin-based colloid and 150 mL of hollow glass microspheres with a particle size of 70 μm. The volume ratio of hollow glass microspheres with a particle size of 70 μm to epoxy resin-based colloid is 3:1.

[0043] Test group 5:

[0044] A chip encapsulation adhesive with ultra-high thermal resistance is formed by using 50 mL of WON207-T epoxy resin-based colloid and 100 mL of hollow glass microspheres with a particle size of 90 μm. The volume ratio of hollow glass microspheres with a particle size of 90 μm to epoxy resin-based colloid is 2:1.

[0045] Test group 6:

[0046] A chip encapsulation adhesive with ultra-high thermal resistance is formed by using 50 mL of WON207-T epoxy resin-based colloid, 50 mL of hollow glass microspheres with a particle size of 70 μm, and 50 mL of hollow glass microspheres with a particle size of 50 μm. The volume ratio of hollow glass microspheres to epoxy resin-based colloid is 2:1.

[0047] Comparison Group 1:

[0048] Hollow glass microspheres are not used; only epoxy resin-based colloids are used as chip encapsulation adhesives.

[0049] After the ultra-high thermal resistance chip packaging adhesives prepared for test groups 1-6 and control group 1 were used for chip packaging, the junction-to-case thermal resistance of the chips was tested, and the test results are shown in Table 1.

[0050] Table 1. Test results of thermal resistance test

[0051]

[0052] Combining test group 1 and test group 2, and referring to Table 1, it can be seen that under the same mixing ratio, the larger the particle size of the hollow glass microspheres used, the greater the thermal resistance of the prepared chip encapsulation adhesive.

[0053] Based on test groups 2-4 and Table 1, it can be seen that, under the condition of using hollow glass microspheres of the same particle size, the larger the volume ratio of hollow glass microspheres to epoxy resin-based colloid, the greater the thermal resistance of the prepared chip encapsulation adhesive.

[0054] Combining test groups 4 and 6, and referring to Table 1, it can be seen that, under the same mixing ratio, the chip encapsulation adhesive prepared using mixed-size hollow glass microspheres has lower thermal resistance than that prepared using a single, larger-size hollow glass microsphere.

[0055] Combining test groups 1-6 and comparative example 1, and referring to Table 1, it can be seen that the thermal resistance of the chip packaging station adhesive formed by hollow glass microspheres and epoxy resin-based colloid is much better than that of pure epoxy resin-based colloid, which is more conducive to the chip packaging of integrated on-chip constant temperature self-heating modules.

[0056] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high thermal resistance chip packaging adhesive, characterized in that, include: Hollow glass microspheres and epoxy resin-based colloids.

2. The ultra-high thermal resistance chip packaging adhesive according to claim 1, characterized in that, The volume ratio of hollow glass microspheres to epoxy resin-based colloid is 0.5:1 to 3:

1.

3. The ultra-high thermal resistance chip packaging adhesive according to claim 1, characterized in that, The epoxy resin-based colloid is one or more of the following: insulating epoxy resin-based colloid and conductive epoxy resin-based colloid.

4. The ultra-high thermal resistance chip packaging adhesive according to claim 1, characterized in that, The hollow glass microspheres have a particle size of one or more ranging from 5 μm to 250 μm.

5. A method for preparing the ultra-high thermal resistance chip packaging adhesive according to any one of claims 1 to 4, characterized in that, include: S1. Set the volume ratio of hollow glass microspheres and epoxy resin-based colloid, and measure the corresponding volume ratio of epoxy resin-based colloid and hollow glass microspheres using a graduated cylinder. S2. Add the measured hollow glass microspheres to the measured epoxy resin-based colloid, mix and stir evenly, then add to a vacuum mixer and stir evenly to obtain an ultra-high thermal resistance chip encapsulation adhesive.

6. A chip packaging method based on the ultra-high thermal resistance chip packaging adhesive according to any one of claims 1 to 4, characterized in that, include: S1. Obtain the chip and casing of the integrated on-chip constant temperature self-heating module; S2. Using an ultra-high thermal resistance chip packaging adhesive, the chip of the integrated on-chip constant temperature self-heating module is bonded to the carrier of the tube shell, and then baked and cured. S3. Use bonding wire to wire bond the device obtained in step S2, and then perform capping, marking and testing in sequence to obtain the chip package structure of the integrated on-chip constant temperature self-heating module.

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