A cu alloy strip having both ultra-high strength and electrical conductivity and a method of manufacturing the same

Abstract

The application discloses a Cu alloy strip with super-high strength and conductivity, which comprises the following components in percentage by mass: Ni: 4.0-4.5%, Si: 0.8-1.2%, Mn: 0.12-0.15%, Mg: 0.15-0.20%, and the balance of copper and inevitable impurities. The Cu alloy strip is prepared through the following preparation process: pretreatment, online solid solution, primary finish rolling, primary aging, secondary finish rolling and secondary aging. By adding Mn and Mg elements into the Cu-Ni-Si base alloy, and by cooperating with the primary finish rolling, primary aging, secondary finish rolling and secondary aging treatment process, the copper alloy prepared has the characteristics of super-high strength and good conductivity, and meets the use requirements of the copper alloy as a BTB connector copper alloy raw material.

Description

Technical Field

[0001] This invention relates to the field of copper alloy technology, specifically to a Cu alloy strip with both ultra-high strength and electrical conductivity, and its manufacturing method. Background Technology

[0002] Cu-Ni-Si based high-strength, high-conductivity alloys are widely used in electrical connectors, lead frames, electronic packaging, and other fields. Board-to-board (BTB) connectors are core components of electronic devices. As BTB connectors continue to develop towards higher density, more pins, narrower pitch, ultra-low height, and higher reliability, stringent requirements are placed on the strength, conductivity, and other properties of copper alloys used in BTB connectors. For example, their strength needs to reach 1000 MPa, and their conductivity needs to be no less than 32% IACS. Existing Cu-Ni-Si based alloys cannot meet these requirements.

[0003] Studies show that increasing the content of alloying elements and adding Mn and Mg alloys for microalloying on the basis of existing Cu-Ni-Si based alloys can further improve strength, but it will increase the difficulty of achieving complete solid solution and lead to a decrease in conductivity.

[0004] Patent document CN115627379A discloses a copper alloy rod with the following mass percentage composition: Ni: 4.0 ~ 6.8%, Si: 0.86 ~ 1.5%, Mn: 0.12 ~ 0.60%, B: 0.001 ~ 0.06%, with the balance being Cu and unavoidable impurities. Adding Mn and B to Cu-Ni-Si based alloys results in copper alloys with tensile strengths exceeding 1120 MPa and electrical conductivity exceeding 20% ​​IACS, but this does not meet the requirement of a conductivity of at least 32% IACS.

[0005] Patent document CN115386766A discloses a Cu-Ni-Si-Cr-Mg pentagonal copper alloy. The alloy's mass percentage composition is: Ni 2.8-3.2%, Si 0.6-0.8%, Cr 0.05-0.6%, Mg 0.04-0.1%, with Cu as the base material. The document also discloses a process involving vacuum induction casting → homogenization treatment → hot forging → double milling → hot rolling → solution treatment → cold rough rolling → primary aging → cold finish rolling → secondary aging. While the copper alloy obtained by adding Cr and Mg to the Cu-Ni-Si based alloy achieves a tensile strength exceeding 830 MPa and a conductivity exceeding 40% IACS, its strength does not reach 1000 MPa.

[0006] While the existing technologies described above have incorporated additional chemical components into Cu-Ni-Si based copper alloys, their performance still cannot simultaneously achieve both ultra-high strength and good conductivity, failing to meet the requirements for copper alloy raw materials in BTB connectors. Therefore, it is necessary to design a combination of multi-component, high-solute, ultra-high-strength Cu alloy and a deformation heat treatment process tailored to its composition, based on experimental research, to achieve a combination of ultra-high strength and good conductivity. Summary of the Invention

[0007] To address the aforementioned problems, this invention provides a Cu alloy strip possessing both ultra-high strength and excellent electrical conductivity, along with its manufacturing method. The Cu alloy strip provided by this invention exhibits both ultra-high strength and good electrical conductivity, making it suitable for the fabrication of BTB connectors.

[0008] A Cu alloy strip with both ultra-high strength and electrical conductivity comprises the following components by mass percentage: Ni: 4.0 ~ 4.5%, Si: 0.8 ~ 1.2%, Mn: 0.12 ~ 0.15%, Mg: 0.15 ~ 0.20%, with the balance being copper and unavoidable impurities; The manufacturing method of the Cu alloy strip with both ultra-high strength and electrical conductivity includes the following process flow: pretreatment → online solution treatment → single-stage finishing rolling → single-stage aging → double-stage finishing rolling → double-stage aging The deformation amount during a single precision rolling process is 10-15%. The single-stage aging process is as follows: the aging temperature is 500~550℃, the holding time is 90~150min, and the cooling method is air cooling; The deformation amount of the secondary finishing rolling is 70% to 80%; The secondary aging process is as follows: the aging temperature is 400 ~ 450℃, the holding time is 25 ~ 35 min, and the cooling method is air cooling.

[0009] In alloys, Mg can purify the melt and reduce the adverse effects of impurity elements. During aging, it can effectively inhibit the excessive growth of precipitates. At the same time, Mg atoms have a pinning effect on dislocations, thereby improving strength.

[0010] Mn element forms Mn at the grain boundaries of the alloy. x The Si phase enhances grain boundary bonding, increases the yield strength and hardness of the alloy, and refines the grains, achieving a good balance between strength and conductivity.

[0011] Preferably, when Mn: 0.12~0.13% and Mg: 0.15~0.16%, the strength and conductivity of the Cu alloy strip manufactured under the above process flow achieve the best match.

[0012] The combined process flow of one-stage fine rolling, one-stage aging, two-stage fine rolling, and two-stage aging described in this invention, wherein the one-stage fine rolling and one-stage aging processes can promote the precipitation of precipitates and improve the strength of the alloy; the two-stage fine rolling can increase the dislocation density and achieve strain strengthening; and the two-stage aging further precipitates the precipitates. Based on the formulation of this invention, the alloy strength and electrical conductivity are synergistically improved.

[0013] Preferably, the pretreatment includes alloy melting and casting, billet preparation, rough rolling, hot rolling, and cold rolling processes, wherein the pretreated copper alloy strip is rolled to a thickness of 2 mm or less and has a cold deformation of more than 80%, so that an alloy strip with small and uniform grain size can be obtained after online solution treatment.

[0014] Preferably, the online solution treatment step involves a solution temperature of 1000~1020℃, a treatment time of 25~30s, and water quenching, thereby preventing grain growth while achieving sufficient solution treatment.

[0015] Preferably, the single aging process is as follows: the aging temperature is 480-520 ℃, the holding time is 90-150 min, and the cooling method is air cooling, so as to promote the precipitation of the strengthening phase.

[0016] Preferably, the secondary aging process is as follows: the aging temperature is 400-420 ℃, the holding time is 25-35 min, and the cooling method is air cooling, so as to promote the secondary precipitation of the strengthening phase and retain some deformation strengthening effect.

[0017] This invention also provides the application of the aforementioned Cu alloy strip, which combines ultra-high strength and electrical conductivity, in the manufacture of BTB connectors. The Cu alloy strip of this invention possesses ultra-high strength and good conductivity, meeting the performance requirements of BTB connectors and showing broad application prospects in the BTB connector manufacturing field.

[0018] Compared with the prior art, the present invention has the following beneficial effects: (1) This invention employs specific alloy components and combines them with specific heat treatment processes to synergistically improve the strength and conductivity of copper alloys. By adding Mn and Mg elements to Cu-Ni-Si based alloys, and simultaneously using a process of one-time fine rolling, one-time aging, two-time fine rolling, and two-time aging, a copper alloy is prepared that possesses both ultra-high strength and good conductivity.

[0019] (2) The Cu alloy strip provided by the present invention has a tensile strength ≥1010 MPa and an electrical conductivity ≥34.9% IACS. It has the synergistic characteristics of ultra-high strength and good electrical conductivity, which can meet the requirements of copper alloy raw materials for BTB connectors. Attached Figure Description

[0020] Figure 1 The grain structure of the Cu alloy strip prepared in Example 1 is shown.

[0021] Figure 2 The image shows the morphology of the precipitated phases in the Cu alloy strip prepared in Example 1. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below. Obviously, the described embodiments are some embodiments of this invention, but not all embodiments.

[0023] The preparation process of the Cu alloy strip with ultra-high strength and electrical conductivity in this embodiment of the invention is as follows: alloy casting → billet preparation → rough rolling → hot rolling → cold rolling → online solution treatment → first finishing rolling → first aging → second finishing rolling → second aging.

[0024] The technical solution and effects of the present invention will be illustrated below with specific embodiments.

[0025] The specific compositions of the Cu alloy strips with both ultra-high strength and electrical conductivity in Examples 1-10 and Comparative Examples 1-8 are shown in Table 1.

[0026] Table 1. Composition (wt%) of Cu alloy strips with both ultra-high strength and electrical conductivity in various embodiments and comparative examples of the present invention. Example 1 The preparation steps of the Cu alloy strip with both ultra-high strength and electrical conductivity in this embodiment are as follows: 1) Preprocessing The alloy is processed through melting and casting, billet making, rough rolling, hot rolling, and cold rolling to produce a strip with a thickness of 2 mm. The cold rolling deformation is 80%.

[0027] 2) Online solid solution The temperature was 1000 ℃, the holding time was 30 s, and the water was quenched.

[0028] 3) One-time precision rolling The deformation amount is controlled at 10%.

[0029] 4) One-time validity period The temperature was 500 ℃, the holding time was 120 min, and the air was used for cooling.

[0030] 5) Secondary finishing rolling The deformation amount is controlled at 80%.

[0031] 6) Secondary time limit The temperature was 400 ℃, the holding time was 25 min, and the air was used for cooling.

[0032] The metallographic structure of the obtained Cu alloy strip, which possesses both ultra-high strength and electrical conductivity, is as follows: Figure 1 As shown, the grain structure is relatively small, indicating that the online short-time high-temperature solid solution process achieved sufficient solid solution during preparation; the morphology of the precipitated phases in the above Cu alloy strip is shown. Figure 2 As shown, a high-density nano-precipitated phase is formed, which can play a strong precipitation enhancement effect.

[0033] Example 2 The preparation steps of the Cu alloy strip with both ultra-high strength and electrical conductivity in this embodiment are as follows: 1) Preprocessing The alloy is processed through melting and casting, billet making, rough rolling, hot rolling, and cold rolling to produce a strip with a thickness of 2 mm. The cold rolling deformation is 80%.

[0034] 2) Online solid solution The temperature was 1000 ℃, the holding time was 30 s, and the water was quenched.

[0035] 3) One-time precision rolling The deformation was controlled at 12%.

[0036] 4) One-time validity period The temperature was 490 ℃, the holding time was 100 min, and the air was used for cooling.

[0037] 5) Secondary finishing rolling The deformation amount is controlled at 80%.

[0038] 6) Secondary time limit The temperature was 400 ℃, the holding time was 25 min, and the air was used for cooling.

[0039] Example 3 The preparation steps of the Cu alloy strip with both ultra-high strength and electrical conductivity in this embodiment are as follows: 1) Preprocessing The alloy is processed through melting and casting, billet making, rough rolling, hot rolling, and cold rolling to produce a strip with a thickness of 1.8 mm. The cold rolling deformation is 85%.

[0040] 2) Online solid solution The temperature was 1020 ℃, the holding time was 25 s, and the water was quenched.

[0041] 3) One-time precision rolling The deformation was controlled at 12%.

[0042] 4) One-time validity period The temperature was 500 ℃, the holding time was 120 min, and the air was used for cooling.

[0043] 5) Secondary finishing rolling The deformation was controlled at 78%.

[0044] 6) Secondary time limit The temperature was 400 ℃, the holding time was 32 min, and the air was used for cooling.

[0045] Example 4 The preparation steps of the Cu alloy strip with both ultra-high strength and electrical conductivity in this embodiment are as follows: 1) Preprocessing The alloy is processed through melting and casting, billet making, rough rolling, hot rolling, and cold rolling to produce a strip with a thickness of 1.8 mm. The cold rolling deformation is 85%.

[0046] 2) Online solid solution The temperature was 1020 ℃, the holding time was 25 s, and the water was quenched.

[0047] 3) One-time precision rolling The deformation was controlled at 12%.

[0048] 4) One-time validity period The temperature was 520 ℃, the holding time was 90 min, and the air was used for cooling.

[0049] 5) Secondary finishing rolling The deformation was controlled at 78%.

[0050] 6) Secondary time limit The temperature was 420℃, the holding time was 30 minutes, and the air was used for cooling.

[0051] Example 5 The preparation steps of the Cu alloy strip with both ultra-high strength and electrical conductivity in this embodiment are as follows: 1) Preprocessing The alloy is processed through melting and casting, billet making, rough rolling, hot rolling, and cold rolling to produce a strip with a thickness of 2 mm. The cold rolling deformation is 80%.

[0052] 2) Online solid solution The temperature was 1020 ℃, the holding time was 35 s, and the water was quenched.

[0053] 3) One-time precision rolling The deformation amount is controlled at 10%.

[0054] 4) One-time validity period The temperature was 500 ℃, the holding time was 120 min, and the air was used for cooling.

[0055] 5) Secondary finishing rolling The deformation amount is controlled at 80%.

[0056] 6) Secondary time limit The temperature was 400 ℃, the holding time was 30 min, and the air was used for cooling.

[0057] Example 6 The preparation steps of the Cu alloy strip with both ultra-high strength and electrical conductivity in this embodiment are as follows: 1) Preprocessing The alloy is processed through melting and casting, billet making, rough rolling, hot rolling, and cold rolling to produce a strip with a thickness of 2 mm. The cold rolling deformation is 80%.

[0058] 2) Online solid solution The temperature was 1020 ℃, the holding time was 35 s, and the water was quenched.

[0059] 3) One-time precision rolling The deformation amount is controlled at 10%.

[0060] 4) One-time validity period The temperature was 510 ℃, the holding time was 100 min, and the air was used for cooling.

[0061] 5) Secondary finishing rolling The deformation amount is controlled at 80%.

[0062] 6) Secondary time limit The temperature was 390 ℃, the holding time was 35 min, and the air was used for cooling.

[0063] Example 7 The preparation steps of the Cu alloy strip with both ultra-high strength and electrical conductivity in this embodiment are as follows: 1) Preprocessing The alloy is processed through melting and casting, billet making, rough rolling, hot rolling, and cold rolling to produce a strip with a thickness of 1.2 mm. The cold rolling deformation is 85%.

[0064] 2) Online solid solution The temperature was 1000 ℃, the holding time was 25 s, and the water was quenched.

[0065] 3) One-time precision rolling The deformation amount is controlled at 10%.

[0066] 4) One-time validity period The temperature was 500 ℃, the holding time was 120 min, and the air was used for cooling.

[0067] 5) Secondary finishing rolling The deformation amount is controlled at 80%.

[0068] 6) Secondary time limit The temperature was 400 ℃, the holding time was 30 min, and the air was used for cooling.

[0069] Example 8 The preparation steps of the Cu alloy strip with both ultra-high strength and electrical conductivity in this embodiment are as follows: 1) Preprocessing The alloy is processed through melting and casting, billet making, rough rolling, hot rolling, and cold rolling to produce a strip with a thickness of 1.2 mm. The cold rolling deformation is 85%.

[0070] 2) Online solid solution The temperature was 1000 ℃, the holding time was 25 s, and the water was quenched.

[0071] 3) One-time precision rolling The deformation amount is controlled at 15%.

[0072] 4) One-time validity period The temperature was 500 ℃, the holding time was 130 min, and the air was used for cooling.

[0073] 5) Secondary finishing rolling The deformation amount is controlled at 75%.

[0074] 6) Secondary time limit The temperature was 400 ℃, the holding time was 32 min, and the air was used for cooling.

[0075] Example 9 The preparation steps of the Cu alloy strip with both ultra-high strength and electrical conductivity in this embodiment are as follows: 1) Preprocessing The alloy is processed through casting, billet preparation, rough rolling, hot rolling, and cold rolling to produce a strip with a thickness of 1.6 mm. The cold rolling deformation is 84%.

[0076] 2) Online solid solution The temperature was 1010 ℃, the holding time was 32 s, and the water was quenched.

[0077] 3) One-time precision rolling The deformation was controlled at 12%.

[0078] 4) One-time validity period The temperature was 500 ℃, the holding time was 120 min, and the air was used for cooling.

[0079] 5) Secondary finishing rolling The deformation was controlled at 78%.

[0080] 6) Secondary time limit The temperature was 400 ℃, the holding time was 28 min, and the air was used for cooling.

[0081] Example 10 The preparation steps of the Cu alloy strip with both ultra-high strength and electrical conductivity in this embodiment are as follows: 1) Preprocessing The alloy is processed through casting, billet preparation, rough rolling, hot rolling, and cold rolling to produce a strip with a thickness of 1.6 mm. The cold rolling deformation is 84%.

[0082] 2) Online solid solution The temperature was 1010 ℃, the holding time was 32 s, and the water was quenched.

[0083] 3) One-time precision rolling The deformation amount is controlled at 15%.

[0084] 4) One-time validity period The temperature was 500 ℃, the holding time was 120 min, and the air was used for cooling.

[0085] 5) Secondary finishing rolling The deformation amount is controlled at 75%.

[0086] 6) Secondary time limit The temperature was 390 ℃, the holding time was 25 min, and the air was used for cooling.

[0087] Comparative Example 1 The Cu alloy strip of this embodiment, which combines ultra-high strength and electrical conductivity, contains the following elements by mass percentage: Ni 4.3%, Si 1.05%, Mn 0.12%, Mg 0.15%, with the balance being Cu and unavoidable impurities. In the preparation steps, after pretreatment, the alloy is rolled into a strip with a thickness of 2 mm and a cold deformation of 80%; it is then solution-treated in a pit furnace at 1000 °C for 1 h; aged at 500 °C for 120 min, and air-cooled.

[0088] Comparative Example 2 The Cu alloy strip of this embodiment, which combines ultra-high strength and electrical conductivity, contains the following elements by mass percentage: Ni 4.3%, Si 10%, Mn 0.12%, Mg 0.15%, with the balance being Cu and unavoidable impurities. In the preparation steps, after pretreatment, the alloy is rolled into a strip with a thickness of 2 mm and a cold rolling deformation of 80%; it is then solution-treated online at 1000℃ for 30 s, water-quenched, and finished with a 10% deformation, aging at 500℃ for 120 min, and air-cooled.

[0089] Comparative Example 3 The Cu alloy strip of this embodiment, which combines ultra-high strength and electrical conductivity, contains the following elements by mass percentage: Ni 4.3%, Si 10%, Mn 0.12%, with the balance being Cu and unavoidable impurities. In the preparation steps, after pretreatment, the alloy is rolled to a strip with a thickness of 2 mm, with a cold rolling deformation of 80%; online solution treatment at 1000 ℃ for 30 s, followed by water quenching; a first-stage finishing rolling deformation of 10%; a first-stage aging temperature of 500 ℃, holding time of 120 min, followed by air cooling; a second-stage finishing rolling deformation of 80%; a second-stage aging temperature of 400 ℃, holding time of 30 min, followed by air cooling.

[0090] Comparative Example 4 The Cu alloy strip of this embodiment, which combines ultra-high strength and electrical conductivity, contains the following elements by mass percentage: Ni 4.3%, Si 1.0%, Mg 0.15%, with the balance being Cu and unavoidable impurities. In the preparation steps, after pretreatment, the alloy is rolled to a strip with a thickness of 2 mm, with a cold rolling deformation of 80%; online solution treatment at 1000℃ for 30 s, followed by water quenching; a first-stage finishing rolling deformation of 10%; a first-stage aging temperature of 500℃, holding time of 120 min, followed by air cooling; a second-stage finishing rolling deformation of 80%; a second-stage aging temperature of 400℃, holding time of 30 min, followed by air cooling.

[0091] Comparative Example 5 The Cu alloy strip of this embodiment, which combines ultra-high strength and electrical conductivity, contains the following elements by mass percentage: Ni 4.2%, Si 0.9%, Mn 0.13%, Mg 0.16%, with the balance being Cu and unavoidable impurities. In the preparation steps, after pretreatment, the alloy is rolled into a strip with a thickness of 1.8 mm and a cold deformation of 85%; it is then solution-treated online at 1020 °C for 25 s; aged at 500 °C for 120 min, and air-cooled.

[0092] Comparative Example 6 The Cu alloy strip of this embodiment, which combines ultra-high strength and electrical conductivity, contains the following elements by mass percentage: Ni 1.3%, Si 1.1%, Mg 0.15%, with the balance being Cu and unavoidable impurities. In the preparation steps, after pretreatment, the alloy is rolled into a strip with a thickness of 2 mm and a cold deformation of 80%; it is then solution-treated online at 1020 °C for 35 s; a single-pass finishing rolling deformation of 10% is performed; the aging temperature is 500 °C, the holding time is 120 min, and air cooling is applied.

[0093] Comparative Example 7 The Cu alloy strip of this embodiment, which combines ultra-high strength and electrical conductivity, contains the following elements by mass percentage: Ni 1.3%, Si 0.9%, Mg 0.15%, with the balance being Cu and unavoidable impurities. The preparation process involves rolling the alloy to a thickness of 1.2 mm after pretreatment; online solution treatment at 1000℃ for 25 s; water quenching; a first-stage finishing rolling deformation of 10%; a first-stage aging temperature of 500℃ for 120 min; and air cooling; a second-stage finishing rolling deformation of 80%; and a second-stage aging temperature of 400℃ for 30 min; followed by air cooling.

[0094] Comparative Example 8 The Cu alloy strip of this embodiment, which combines ultra-high strength and electrical conductivity, contains the following elements by mass percentage: Ni 2.5%, Si 0.9%, Mn 0.13%, Mg 0.15%, with the balance being Cu and unavoidable impurities. In the preparation steps, after pretreatment, the alloy is rolled into a strip with a thickness of 1.6 mm; solution is applied in a pit furnace at 1010 ℃ for 2 h, followed by water quenching; aging is carried out at 500 ℃ for 120 min, and then air-cooled.

[0095] The tensile strength and electrical conductivity of the Cu alloy strips obtained in each embodiment and comparative example were tested, and the results are shown in Table 2.

[0096] Table 2 Performance of various embodiments and comparative examples of the present invention Performance Analysis: Examples 1-10 exhibit tensile strengths exceeding 1010 MPa and electrical conductivity exceeding 34.9% IACS, demonstrating extremely high strength and excellent electrical conductivity.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A Cu alloy strip possessing both ultra-high strength and electrical conductivity, characterized in that, It includes the following components in mass percentage: Ni: 4.0 ~ 4.5%, Si: 0.8 ~ 1.2%, Mn: 0.12 ~ 0.15%, Mg: 0.15 ~ 0.20%, with the balance being copper and unavoidable impurities; The Cu alloy strip with both ultra-high strength and electrical conductivity is produced through the following process: pretreatment → online solution treatment → first precision rolling → first aging → second precision rolling → second aging. The deformation amount of the single precision rolling is 10-15%. The single aging process is as follows: the aging temperature is 500 ~ 550℃, the holding time is 90-150 min, and the cooling method is air cooling; The deformation amount of the secondary finishing rolling is 70-80%; The secondary aging process is as follows: the aging temperature is 400 ~ 450 ℃, the holding time is 25 ~ 35 min, and the cooling method is air cooling.

2. The Cu alloy strip with both ultra-high strength and electrical conductivity according to claim 1, characterized in that, The components include the following mass percentages: Mn: 0.12~0.13%, Mg: 0.15~0.16%.

3. The Cu alloy strip with both ultra-high strength and electrical conductivity according to claim 1 or 2, characterized in that, The Cu alloy strip has a tensile strength ≥1010 MPa and a conductivity ≥34.9% IACS.

4. The Cu alloy strip with both ultra-high strength and electrical conductivity according to claim 1, characterized in that, The pretreatment includes steps such as melting and casting, billet making, rough rolling, hot rolling, and cold rolling. The thickness after pretreatment is rolled to less than 2 mm, and the cold deformation is more than 80%.

5. The Cu alloy strip with both ultra-high strength and electrical conductivity according to claim 1, characterized in that, The online solution treatment temperature is 1000 ~ 1020℃, the time is 25 ~ 35s, and the solution is water quenched.

6. The Cu alloy strip with both ultra-high strength and electrical conductivity according to claim 1, characterized in that, The aforementioned single aging process is as follows: the aging temperature is 480 ~ 520 ℃, and the holding time is 90-150 min.

7. The Cu alloy strip with both ultra-high strength and electrical conductivity according to claim 1 or 6, characterized in that, The secondary aging process is as follows: the aging temperature is 400 ~ 420 ℃, and the holding time is 25 ~ 35 min.

8. The application of Cu alloy strip with ultra-high strength and electrical conductivity as described in any one of claims 1-7 in the manufacture of BTB connectors.

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