Evaporation apparatus and evaporation method

Abstract

The application provides an evaporation equipment and an evaporation method. The evaporation equipment comprises, in sequence, a substrate loading device, a cleaning device, an alignment device and a film forming device. The alignment device and the film forming device are connected through a first vacuum pipeline. A first conveying device is arranged in the first vacuum pipeline. One side of the alignment device is provided with a loading cavity for placing a mask plate. A supporting part, a fitting part and a detection part are arranged in the alignment device. The supporting part is used for accommodating a to-be-fitted substrate. The detection part is used for collecting fitting information of the mask plate and the substrate in the alignment device and feeding back to the fitting part. Based on the adjustment of the fitting part, the mask plate is adjusted to a preset position of the substrate. The first conveying device conveys the combined substrate into the first vacuum pipeline and conveys it to the film forming device based on an instruction, so as to form a film in the film forming device. The alignment device is arranged outside and connected to the film forming device through the first vacuum pipeline, so as to improve the efficiency of the evaporation equipment and the material utilization rate.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a vapor deposition apparatus and a vapor deposition method thereof. Background Technology

[0002] OLED (Organic Light-Emitting Diode) is an active light-emitting device with a sandwich structure consisting of multiple organic layers and electrodes on both sides. OLED displays have been commercialized in fields such as smartphones, watches, and laptops.

[0003] In the fabrication process of OLED display panels, for example, the process of fabricating the light-emitting functional layer requires the use of evaporation equipment to deposit organic materials onto the substrate. This requires the cooperation of a mask, specifically an FMM (Fine Metal Mask) to form the desired pattern on the substrate. However, existing evaporation equipment suffers from low evaporation efficiency. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide a vapor deposition apparatus and a vapor deposition method, which can eliminate cycle time in the process of substrate transfer and mask alignment.

[0005] Based on the above objectives, this application adopts the following technical solution:

[0006] A vapor deposition apparatus includes a substrate loading device, a cleaning device, and a film forming device arranged in sequence. The substrate loading device is used to hold substrates to be cleaned.

[0007] An alignment device is provided between the cleaning device and the film forming device. The alignment device is connected to one end of the first vacuum pipe, and the side of the first vacuum pipe away from the alignment device is connected to the film forming device.

[0008] A first transmission device is installed inside the first vacuum pipe;

[0009] A loading cavity is provided on one side of the alignment device, and the loading cavity is used to place the mask plate.

[0010] The alignment device is provided with a support part, a bonding part and a detection part. The support part is used to support the substrate to be bonded and the mask plate after being cleaned by the cleaning device. The detection part is used to collect the bonding information between the mask plate and the substrate and feed it back to the bonding part. Based on the adjustment of the bonding part, the mask plate is adjusted to a preset position on the substrate.

[0011] The first transmission device is used to transfer the assembled mask and substrate to the first vacuum pipe and, based on instructions, to the film forming device for film formation.

[0012] In one embodiment, the vapor deposition equipment includes a first transfer pipe, one end of which is connected to the cleaning device, and the other end of the first transfer pipe opposite to the cleaning device is connected to the alignment device.

[0013] Preferably, it further includes a second transmission conduit, one end of which is connected to the alignment device, and the other end of the second transmission conduit opposite to the alignment device is connected to the loading cavity.

[0014] Preferably, a track is provided inside the first transmission pipe, and a transmission device for transferring the cleaned substrate is matched on the track;

[0015] Preferably, a transmission device for transmitting the mask plate is provided inside the second transmission pipe.

[0016] In one embodiment, the film-forming apparatus has a film-forming chamber, a fixing part is provided on the top side of the film-forming chamber, the fixing part is used to fix the assembly of the substrate and the mask plate, and a vapor deposition source is provided on the bottom side of the film-forming chamber, and the assembly is arranged opposite to the vapor deposition source.

[0017] Preferably, the vapor deposition source has a nozzle connected to a crucible, and a heater is fitted around the outside of the crucible;

[0018] Preferably, the heater is electrically connected to a power module outside the film-forming chamber;

[0019] Preferably, the heater is electrically connected to a connection end located at the bottom side of the film-forming chamber;

[0020] Preferably, the connecting end is located tangent to the rotation radius of the heater, so that the heater rotates to a preset position and is electrically connected to the connecting end.

[0021] In one embodiment, the vapor deposition equipment further includes a vapor deposition support, which is disposed at the bottom side of the film formation chamber, and at least two vapor deposition sources are placed on the vapor deposition support;

[0022] Preferably, two vapor deposition sources are placed on the vapor deposition bracket;

[0023] Preferably, the vapor deposition bracket has a connecting part in the middle, and the connecting part is rotatably connected to a rotating shaft, which is fixed to the bottom side of the film formation chamber;

[0024] Preferably, the rotating shaft passes through the bottom of the film-forming chamber, and the protruding part is connected to the driving device, and rotates by a preset angle based on the driving of the driving device;

[0025] Preferably, the preset angle is between 30° and 180°.

[0026] In one embodiment, the vapor deposition support is either in a fixed, linear configuration or a rotating, turntable configuration.

[0027] In one embodiment, the vapor deposition equipment further includes a storage chamber, which is disposed on one side of the film forming device via a gate valve;

[0028] Preferably, the storage chamber is connected to one end of the second vacuum pipe, and the other end of the second vacuum pipe is connected to the feed port of the film forming device through a gate valve.

[0029] In one embodiment, the storage chamber stores multiple vapor deposition sources;

[0030] Preferably, the vapor deposition sources are made of the same material;

[0031] Preferably, the materials of the vapor deposition sources are different.

[0032] In one embodiment, the second vacuum conduit connects to a vacuum pump and a pressure sensor;

[0033] Preferably, a robotic arm for transferring the vapor deposition source is installed inside the second vacuum pipe.

[0034] In one embodiment, a material rack is provided inside the first vacuum pipe, the material rack being used to temporarily store the assembly of the substrate and the mask plate to be film-formed, or the assembly after film formation.

[0035] Based on the same inventive concept, this application proposes a vapor deposition method for use in the aforementioned vapor deposition equipment. The vapor deposition method includes the following steps:

[0036] Provide a substrate;

[0037] Clean the substrate;

[0038] The mask plate is bonded to the cleaned substrate in the alignment device. The bonding information between the mask plate and the substrate is collected by the detection component and fed back to the bonding component. Based on the adjustment of the bonding component, the mask plate is adjusted to a preset position on the substrate, and the aligned mask plate and substrate assembly is transferred to the preset position.

[0039] The aligned mask and substrate assembly is transferred into the film-forming chamber.

[0040] A film is formed on the substrate in the film-forming chamber. This method advances the assembly and alignment process of the substrate and the mask, saving waiting time in the film-forming chamber, improving film-forming efficiency, and reducing the loss of vapor deposition material. Simultaneously with film formation on the substrate in the film-forming apparatus, the method also includes bonding the mask to the cleaned substrate in an alignment device, detecting the bonding position of the mask using a detection component, and adjusting the bonding component to position the mask at a preset position on the substrate.

[0041] Compared with the prior art, the vapor deposition equipment provided in this application effectively eliminates the time required to pause vapor deposition during the alignment and bonding of the substrate and the mask. Because the vapor deposition is uninterrupted, the loss of organic materials is reduced, thereby improving the efficiency of the vapor deposition process and the material utilization rate. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of the structure of a vapor deposition apparatus according to an embodiment of this application;

[0044] Figure 2 This is a cross-sectional schematic diagram of a film-forming apparatus according to another embodiment of this application;

[0045] Figure 3 This is a top view schematic diagram of a vapor deposition source according to another embodiment of this application;

[0046] Figure 3a for Figure 3 A schematic diagram showing the connection between the vapor deposition source and the connecting end;

[0047] Figure 4 This is a top view schematic diagram of a vapor deposition source according to another embodiment of this application;

[0048] Figure 5 This is a schematic diagram of the alignment device structure according to an embodiment of this application;

[0049] Figure 6 This is a schematic diagram of the loading cavity according to an embodiment of this application;

[0050] Figure 7 This is a schematic flowchart of a vapor deposition method using a vapor deposition apparatus according to an embodiment of this application.

[0051] Marker explanation:

[0052] 1. Guide rail; 11. Substrate loading device; 12. Substrate; 13. Mask plate; 21. Cleaning device; 31. Film forming device; 32. Evaporation source; 33. Evaporation support; 34. Rotating shaft; 37. Storage chamber; 41. First transfer pipe; 51. Alignment device; 52. Support part; 53. Detection component; 61. First vacuum pipe; 71. Second transfer pipe; 81. Loading cavity. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0054] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0055] In the process of preparing the light-emitting functional layer of an OLED display panel, an evaporation equipment is needed to deposit organic materials onto a substrate through a mask and form a preset pattern on the substrate. As disclosed in Chinese invention patent CN105874096A, an evaporation device and evaporation method are disclosed. It solves the problem of being able to perform evaporation on multiple substrates in one chamber. During the evaporation process of one substrate, other substrates are transferred or aligned. However, it does not truly solve the problem of eliminating cycle time during substrate transfer and mask alignment.

[0056] To this end, the applicant has conducted a detailed study on the vapor deposition process of the light-emitting functional layer. In the existing vapor deposition process, the cleaned substrate is transferred to the vapor deposition chamber via a transfer device, placed in the substrate holding part and fixed. Then, a mask is attached to the substrate and, after alignment confirmation, vapor deposition is performed. (This vapor deposition process utilizes a high-vacuum environment in the vapor deposition chamber, where organic or metallic materials in the evaporation source are heated. Heating methods typically include resistance heating, electron beam heating, and laser heating. For example, resistance heating generates heat by passing an electric current through a resistance wire, raising the temperature of the material in the evaporation boat; electron beam heating uses a high-energy electron beam to bombard the material, converting the kinetic energy of electrons into thermal energy. When the material reaches a certain temperature, it changes from a solid to a gaseous state, forming atoms or molecules of the vapor deposition material. A mask is placed between the evaporation source and the substrate, and the mask has openings corresponding to the pixel pattern. Only vapor deposition material atoms or molecules that pass through the openings of the mask can reach the substrate surface and be deposited; atoms or molecules in other directions are blocked by the mask. In this way, a thin film pattern consistent with the opening pattern of the mask is formed on the substrate, achieving precise pixel patterning.)

[0057] The inventors discovered that existing vapor deposition equipment requires transferring the substrate to the corresponding vapor deposition chamber, installing a mask, and aligning the mask (if multiple cameras are used to photograph the alignment marks on the substrate or mask during this process, the cameras that cannot detect the marks are adjusted and checked, and this process is repeated until the marks can be detected). This generates a cycle time due to the substrate transfer and mask alignment process, which is not conducive to improving the work efficiency per unit time.

[0058] Therefore, the purpose of this application is to provide a vapor deposition apparatus and a vapor deposition method thereof to solve the above-mentioned problems.

[0059] The vapor deposition equipment includes a substrate loading device, a cleaning device, and a film forming device arranged in sequence. An alignment device is provided between the cleaning device and the film forming device and is connected by a first vacuum pipe. A first transfer device is provided inside the first vacuum pipe. A loading cavity is provided on one side of the alignment device for placing a mask. The alignment device is provided with a support, a bonding component, and a detection component. The support is used to hold the substrate to be bonded after being cleaned by the cleaning device. The detection component is used to collect the bonding information between the mask and the substrate in the alignment device and feed it back to the bonding component. Based on the adjustment of the bonding component, the mask is adjusted to a preset position on the substrate (i.e., successful alignment). The first transfer device transfers the bonded mask and substrate combination to the first vacuum pipe and transmits the command to the film forming device for film forming inside the film forming device. When the vapor deposition equipment is running, the pressure environment in the first vacuum pipe is similar to that in the film formation chamber of the film forming device. This means that there is almost no need to wait for the assembled mask and substrate to be transferred to the film formation chamber before vapor deposition can be performed, which improves the efficiency of the vapor deposition equipment and the material utilization rate (avoiding the loss of vapor deposition material during waiting).

[0060] The proposed vapor deposition equipment and method will now be described in conjunction with the accompanying drawings.

[0061] Please refer to Figure 1 The diagram shown is a structural schematic of a vapor deposition apparatus provided in an embodiment of this application.

[0062] The vapor deposition equipment includes a substrate loading device 11, a cleaning device 21, an alignment device 51, and a film forming device 31 arranged in sequence. The alignment device 51 and the film forming device 31 are connected by a first vacuum pipe 61, that is, the first vacuum pipe 61 connects the alignment device 51 and the film forming device 31. The first transfer pipe 41 connects the cleaning device 21 and the alignment device 51.

[0063] That is, one end of the first transmission pipe 41 is connected to the cleaning device 21 (e.g., through a sealing ring), and the other end of the first transmission pipe 41 is connected to one end of the alignment device 51 (e.g., through a sealing ring).

[0064] The first vacuum conduit 61 is equipped with a guide rail 1, on which a retainer or material holder is fitted to support the assembly of the substrate and the mask plate, thus transferring the substrate 12 via the guide rail 1. Preferably, a first transfer device (such as a robot arm) can be used for transfer. In some embodiments, the guide rail 1 can be omitted, and the transfer can be performed by the first transfer device (such as a robot arm).

[0065] One end of the first vacuum conduit 61 is connected to the alignment device 51 (e.g., via a gate valve), and the other end of the first vacuum conduit 61 is connected / communicated with one end of the film-forming device 31 (e.g., via a gate valve). In this embodiment, the first transfer conduit 41 and the first vacuum conduit 61 also have the function of temporarily storing substrates. For example, the first transfer conduit 41 temporarily stores cleaned substrates (one or more); the first vacuum conduit 61 temporarily stores the assembly of the aligned substrate and the mask (one or more pieces). For the substrate, the time t1 required for cleaning when it is in the cleaning device 21 is different from the time t2 required for alignment when it is in the alignment device 51 and the time t3 required for vapor deposition when it is in the film-forming device 31. By controlling the rhythm of substrate movement through this design, the operating efficiency of the vapor deposition equipment is improved, and the utilization rate of the vapor deposition material is increased.

[0066] A second transfer conduit 71 is provided on one side of the alignment device 51, and a loading cavity 81 is provided on the side of the second transfer conduit 71 away from the alignment device 51. The loading cavity 81 is used to place the mask plate 13 (e.g., in a stacked manner). Preferably, a transfer device (e.g., a robotic arm) is provided inside the second transfer conduit 71, which is used to transfer the mask plate 13 in the loading cavity 81 to a preset position on the alignment device 51 (e.g., to perform fixed-point placement using preset coordinates).

[0067] The alignment device has a chamber containing a support, a bonding component, and a detection component. The support is used to hold the substrate and mask to be bonded, which have been cleaned by the cleaning device. The detection component collects the bonding information between the mask and the substrate and feeds it back to the bonding component. Based on the adjustment of the bonding component, the mask is aligned to a preset position on the substrate (i.e., successful alignment). (For example, the detection component uses a high-resolution CCD camera to detect alignment marks on the mask and substrate. If a deviation is detected, the bonding component adjusts the X / Y / θ (rotation) position of the mask or substrate using a nanometer-scale stepper motor or piezo actuator to achieve alignment. Sometimes, the alignment marks are identified in conjunction with the pattern to confirm the alignment and improve the accuracy of the alignment.) During bonding, the substrate and mask are bonded and placed (i.e., assembled) according to preset coordinates. In practice, there may be differences between the preset placement and the actual placement position (adjusted by bonding components). The X / Y / θ (rotation) positions of the mask or substrate are adjusted by nanoscale stepper motors or piezo actuators to achieve alignment.

[0068] Preferably, the substrate to be bonded is positioned upwards in the alignment device 51, and the mask side is upwards after assembly. It can be flipped before being transferred to the film-forming device 31 within the first vacuum conduit 61, or the mask side can be downwards after assembly, depending on the application and not limited here. In one embodiment, a material rack and a robotic arm can be provided within the first vacuum conduit 61, on which the substrate and mask assembly can be stacked. The robotic arm transfers the assembly to or from the film-forming chamber to the material rack. The first to third vacuum lines are respectively connected to a vacuum pump and a pressure sensor, thus maintaining a vacuum environment in the chamber during the transfer process (e.g., maintaining a Class 1000 or higher cleanliness level environment).

[0069] In one embodiment, a material rack may be provided inside the first transfer pipe 41 for placing the cleaned substrate.

[0070] like Figure 2 The figure shown is a cross-sectional schematic diagram of a film-forming apparatus according to an embodiment.

[0071] The film-forming apparatus has a film-forming chamber 31a, and a fixing part 31b is provided on the top side of the film-forming chamber 31a for fixing the assembly 100 of the substrate and the mask plate. A vapor deposition source 32 is provided on the bottom side of the film-forming chamber 31a, and the assembly 100 of the substrate and the mask plate is positioned opposite to the vapor deposition source 32 (main vapor deposition source). The vapor deposition source 32 has a nozzle 32a connected to a crucible, on which a heater 32b is provided. The heater 32b is electrically connected to an external power module (not shown). The heater 32b is uniformly wound around the outer wall of the crucible and wrapped with insulating material and a protective layer, ensuring heating efficiency.

[0072] The film-forming chamber 31a has an extraction port 311a and an inlet port 311b on its wall 311. The extraction port 311a is connected to a vacuum pumping device (not shown) via a pipe, and the inlet port 311b is connected to a gas supply device (not shown) via a pipe. Gas (such as nitrogen) is introduced into the film-forming chamber 31a through the gas supply device, and the gas in the film-forming chamber is extracted by the vacuum pumping device. During operation, the film-forming device utilizes the cooperation of the vacuum pumping device and the gas supply device to maintain the film-forming chamber in a vacuum atmosphere or an atmosphere of inactive gas such as nitrogen. It should be noted that in this specification, "vacuum" can be understood as the state of a film-forming chamber filled with gas at a pressure lower than atmospheric pressure.

[0073] In one embodiment, the cleaning device 21 includes a cleaning chamber, which is equipped with a cleaner for cleaning the substrate 12. The cleaner can be a water gun or a spray gun. Its purpose is to clean the substrate 12. After cleaning, the substrate 12 needs to be dried before it can enter the next process.

[0074] Figure 2 The schematic diagram of the film-forming apparatus shows only one evaporation source 32. Figure 2 Variations of the method shown, such as Figure 3 As shown, the film-forming apparatus 31 has two evaporation sources 32 inside, one as the main evaporation source and the other as a backup evaporation source. The two evaporation sources 32 are mounted on an evaporation support 33a, which is connected to a rotating shaft 34. Part of the rotating shaft 34 passes through the bottom side of the film-forming chamber, and the protruding part is connected to a drive device (not shown, such as a motor). The rotating shaft 34 is rotated (in the W direction) by a preset angle (e.g., 180°) based on the drive device, thereby switching the evaporation source 32. Preferably, the connection end on the bottom side of the film-forming chamber is electrically connected to a heater, so that after the evaporation source 32 rotates to a predetermined position, its heater can be electrically connected to this connection end. Preferably, this connection end (electrode) is located in the rotation direction, thus achieving electrical connection after the heater rotates without interfering with the rotation.

[0075] The connection includes a first connection for electrical connection to the main evaporation source and a second connection for electrical connection to a standby evaporation source. Both the first and second connections are electrically connected to a power module or a matching power module, and are independently powered by it. When the evaporation source 32 is in the standby position, it is preheated using a heater, thus saving heating time when switching to the main evaporation position and improving evaporation efficiency. Figure 3a The diagram illustrates a first connecting end 31c (including two electrodes) electrically connected to a vapor deposition source 32 (as the main vapor deposition source), and a second connecting end 31d (including two electrodes) electrically connected to the vapor deposition source 32 (as a backup vapor deposition source). Preferably, a cover plate 31c1 is provided on the first connecting end 31c side, and a cover plate 31d1 is provided on the second connecting end 31d side, with cover plates 31c1 / 31d1 provided to protect the connecting ends. Preferably, the connecting end is tangent to the heater's rotation radius, allowing the heater to rotate to a preset position and become electrically connected to the connecting end.

[0076] The bottom side of the film-forming chamber is provided with a vapor deposition bracket 33 for placing the vapor deposition source 32. The vapor deposition bracket 33 is configured as a fixed type in a straight line or a rotating type on a turntable. Preferably, the vapor deposition bracket 33 is a rotating type. The rotating type of vapor deposition bracket 33 is more convenient to use and can save space. The rotating type of vapor deposition bracket 33 is also more convenient to operate when changing the vapor deposition source 32.

[0077] As Figure 2 Variations of the method shown, such as Figure 4As shown, the film-forming apparatus 31 is equipped with multiple evaporation sources 32, which are mounted on a rotary evaporation support 33. The evaporation support 33 is connected to a rotating shaft 34, which rotates by a preset angle (the preset angle is 360 / n, where n is the number of evaporation sources; the preset angle can be 30°, 45°, 60°, 72°, 90°, 120°, 180°, etc.). Each evaporation source 32 is electrically connected to the bottom side connection end of the film-forming chamber (see structural reference). Figure 3a The rotary vapor deposition bracket 33 is more convenient to use and saves space. The rotary vapor deposition bracket 33 is also more convenient to operate when changing the vapor deposition source 32, and it is easy to switch the vapor deposition source.

[0078] Reference Figure 5 The diagram shown illustrates the structure of the alignment device 51 according to an embodiment of this application. The alignment device 51 includes a support portion 52 that houses the substrate 12 and the mask 13. A detection component 53 is also included within the alignment device 51. This detection component 53 is used to confirm the alignment of the substrate 12 and the mask 13 after assembly, ensuring that the mask 13 is placed in a preset position and guaranteeing the quality of subsequent film deposition on the substrate. Accurate alignment of the mask 13 is considered prior art and will not be detailed here. The alignment device can operate in an atmospheric environment when the substrate 12 and the mask 13 are assembled / bonded.

[0079] Please continue to refer to Figure 1 As shown, in one embodiment, a guide rail 1 is provided on the substrate loading device 11 side, and a first transmission unit 91 is matched thereto. The first transmission unit 91 can be a robotic arm to transfer the substrate to be cleaned to the cleaning device 21. The guide rail 1 can be segmented, such as a portion of the guide rail 1 being located on the upstream side of the substrate loading device 11 (viewed along the substrate movement direction, the section along the substrate movement direction is downstream, and vice versa) and matched with rollers to transfer the substrate.

[0080] In one embodiment, a second transmission unit 92, which can be a robotic arm, is provided on the side of the cleaning device 21. A third transmission unit 93, which can also be a robotic arm, is disposed inside the second transmission pipe 71 and is used to transfer the mask plate.

[0081] Please continue to refer to Figure 1As shown, in one embodiment, a storage chamber 37 for storing the vapor deposition source 32 is provided on one side of the film forming apparatus 31 (the film forming apparatus 31 is equipped with a feed inlet through which the vapor deposition source 32 is transferred). The storage chamber 37 is connected to the film forming apparatus 31 via a gate valve or a second vacuum line, allowing for rapid switching of the vapor deposition source. This vacuum line connects to a vacuum pump and a pressure sensor. The storage chamber 37 can store vapor deposition materials of the same type or different types, depending on the application. When switching is required, the vacuum pump is activated, extracting air and gas from the chamber to equalize the pressure in the vacuum line with that in the film forming apparatus. The pumping rate and operating power are adjusted in real time to ensure the stability and reliability of the vacuum environment.

[0082] In one embodiment, the first transfer unit 91 transfers the substrate from the substrate loading device 11 to the cleaning device 21, where the substrate 12 is cleaned. The cleaned substrate 12 is then transferred to the drying process via the guide rail 1 and matching rollers. The dried substrate 12 is then transferred to the alignment device 51. During substrate cleaning, a robotic arm (i.e., the third transfer unit 93) removes the mask 13 from the loading cavity 81 and temporarily stores it in the second transfer pipe 71. After the substrate is placed on the alignment device support, the mask 13 is placed on the substrate, and alignment confirmation is performed. This process can be performed in an atmospheric environment or a vacuum environment. The alignment device 51 is equipped with a vacuum pump to ensure that the environment of the alignment device 51 is equivalent to the vacuum environment inside the first vacuum pipe 61 after the substrate and mask are aligned.

[0083] Please refer to Figure 6 As shown, in one embodiment, the stacked mask plates 13 are placed in the loading cavity 81, such as the side wall of the loading cavity 81 being provided with grooves (not shown), and the mask plates 13 are placed in the corresponding grooves.

[0084] The vapor deposition equipment proposed in this application, by setting an alignment device between the cleaning device and the film deposition device, allows the substrate to be aligned and bonded within the alignment device during vapor deposition within the film deposition device (e.g., by positioning it at a preset coordinate). The aligned component is then temporarily stored in a vacuum pipeline and transferred to a preset position in the film deposition chamber of the film deposition device during film deposition (and then the vapor deposition process is performed). This eliminates the need to wait for alignment after vapor deposition, saving time spent pausing the vapor deposition process due to alignment. By externalizing the alignment device, the mask loading and alignment processes are moved forward, saving waiting time.

[0085] This application provides a vapor deposition method using the aforementioned vapor deposition equipment.

[0086] The vapor deposition method includes the following steps:

[0087] Provide a substrate,

[0088] The substrate is cleaned and then transferred to the alignment device. In this step, the substrate is transferred to the cleaning device, where it is cleaned (clearly identifying contaminants such as particles, grease, metal ions, and organic residues to enhance the adhesion of vapor-deposited materials (such as the OLED organic layer)). The cleaned substrate is then transferred to the drying location for drying. This cleaning process is existing technology and is not limited here; it is sufficient to achieve this function.

[0089] The mask is bonded to the cleaned substrate. A detection component collects the bonding information between the mask and substrate within the alignment device and feeds it back to the bonding component. Based on the adjustment of the bonding component, the mask is positioned at a preset position on the substrate, and the aligned assembly is then transferred to that preset position. In this step, the mask is bonded to the cleaned substrate within the alignment device, and a detection component monitors until the mask is placed at the preset position on the substrate. The bonded assembly is then transferred to a vacuum channel. For example, the detection component uses a high-resolution CCD camera to detect alignment marks on the mask and substrate. If a deviation is detected, a nanometer-scale stepper motor or piezo actuator is used to adjust the X / Y / θ (rotational) position of the mask or substrate to achieve alignment. Sometimes, alignment is confirmed by recognizing the alignment marks in conjunction with the pattern.

[0090] The aligned assembly is transferred to the film-forming chamber, where the material evaporated by the vapor deposition source is used to form a film (forming a preset pattern) on the substrate. In this step, the aligned assembly is transferred to the film-forming apparatus by a transfer device and fixed on the fixing part. The vapor deposition source is heated and evaporated by a heater, and the evaporated material forms a film on the substrate, completing the vapor deposition.

[0091] The vapor-deposited assembly is removed and placed in a preset position. In this step, the film-deposited assembly is removed (e.g., the film-deposited assembly is returned to the alignment device (because the environment inside the alignment device is similar to that inside the vapor deposition chamber, saving the pressure adjustment time for the next substrate vapor deposition in the vapor deposition chamber), the mask and the substrate are separated in the alignment device, the substrate is transferred to the next process, and the mask can be transferred to the recycling position, cleaned and reused).

[0092] In one embodiment, if the amount of the evaporation source reaches a set threshold during film formation, a drive device is triggered to rotate the backup evaporation source to the evaporation position, and the evaporation operation continues. This improves the evaporation efficiency.

[0093] In one embodiment, the method further includes switching the evaporation source in a standby position (e.g., using a robotic arm equipped with a transfer arm within a second vacuum pipe to transfer the evaporation source). This second vacuum pipe is connected to a vacuum pump and a pressure sensor, ensuring that the environment within the second vacuum pipe is similar to that of the evaporation chamber during switching. This provides a continuous and stable supply of evaporation material without disrupting the vacuum environment of the evaporation chamber, offering a reliable guarantee for the preparation of high-quality evaporation films. This makes the entire evaporation process more compact and efficient, particularly suitable for large-scale, continuous production operations. It also prevents impurities from the outside air from contaminating the evaporation material, thus ensuring the purity and performance consistency of the evaporation film, while avoiding equipment maintenance and downtime due to malfunctions or abnormalities during the feeding process.

[0094] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description.

[0095] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0096] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A vapor deposition apparatus, comprising a substrate loading device, a cleaning device, and a film forming device arranged in sequence, wherein the substrate loading device is used to hold a substrate to be cleaned, characterized in that, An alignment device is provided between the cleaning device and the film forming device. The alignment device is connected to one end of the first vacuum pipe, and the side of the first vacuum pipe away from the alignment device is connected to the film forming device. A first transmission device is installed inside the first vacuum pipe; A loading cavity is provided on one side of the alignment device, and the loading cavity is used to place the mask plate. The alignment device is provided with a support part, a bonding part and a detection part. The support part is used to support the substrate to be bonded and the mask plate after being cleaned by the cleaning device. The detection part is used to collect the bonding information between the mask plate and the substrate and feed it back to the bonding part. Based on the adjustment of the bonding part, the mask plate is adjusted to a preset position on the substrate. The first transmission device is used to transfer the assembled mask and substrate to the first vacuum pipe and, based on instructions, to the film forming device for film formation.

2. The vapor deposition equipment as described in claim 1, characterized in that, It includes a first transmission pipe, one end of which is connected to the cleaning device, and the other end of the first transmission pipe opposite to the cleaning device is connected to the alignment device; Preferably, it further includes a second transmission conduit, one end of which is connected to the alignment device, and the other end of the second transmission conduit opposite to the alignment device is connected to the loading cavity. Preferably, a track is provided inside the first transmission pipe, and a transmission device for transferring the cleaned substrate is matched on the track; Preferably, a transmission device for transmitting the mask plate is provided inside the second transmission pipe.

3. The vapor deposition equipment as described in claim 1, characterized in that, The film forming apparatus has a film forming chamber, a fixing part is provided on the top side of the film forming chamber, the fixing part is used to fix the assembly of the substrate and the mask plate, and a vapor deposition source is provided on the bottom side of the film forming chamber, and the assembly is arranged opposite to the vapor deposition source. Preferably, the vapor deposition source has a nozzle, the nozzle is connected to a crucible, and a heater is fitted around the outside of the crucible; Preferably, the heater is electrically connected to a power module outside the film-forming chamber; Preferably, the heater is electrically connected to a connection end located at the bottom side of the film-forming chamber; Preferably, the connecting end is located tangent to the rotation radius of the heater, so that the heater rotates to a preset position and is electrically connected to the connecting end.

4. The vapor deposition equipment as described in claim 3, characterized in that, It also includes a vapor deposition support, which is disposed at the bottom side of the film formation chamber, and at least two vapor deposition sources are placed on the vapor deposition support; Preferably, two vapor deposition sources are placed on the vapor deposition bracket; Preferably, the vapor deposition bracket has a connecting part in the middle, and the connecting part is rotatably connected to a rotating shaft, which is fixed to the bottom side of the film formation chamber; Preferably, the rotating shaft passes through the bottom of the film-forming chamber, and the protruding part is connected to the driving device, and the vapor deposition bracket is rotated by a preset angle based on the driving device. Preferably, the preset angle is between 30° and 180°.

5. The vapor deposition equipment as described in claim 4, characterized in that, The vapor deposition support can be either a fixed, linear type or a rotating, turntable type.

6. The vapor deposition equipment as described in claim 1, characterized in that, It also includes a storage chamber, which is located on one side of the film-forming device via a gate valve; Preferably, the storage chamber is connected to one end of the second vacuum pipe, and the other end of the second vacuum pipe is connected to the feed port of the film forming device through a gate valve.

7. The vapor deposition equipment as described in claim 6, characterized in that, The storage chamber stores multiple vapor deposition sources; Preferably, the vapor deposition sources are made of the same material; Preferably, the materials of the vapor deposition sources are different.

8. The vapor deposition equipment as described in claim 6, characterized in that, The second vacuum pipe connects to the vacuum pump and the pressure sensor; Preferably, a robotic arm for transferring the vapor deposition source is installed inside the second vacuum pipe.

9. The vapor deposition equipment as described in claim 1, characterized in that, The first vacuum pipe is a vacuum environment; Preferably, a material rack is provided inside the first vacuum pipe, the material rack being used to temporarily store the combination of the substrate and the mask plate to be formed or the combination after film formation.

10. A vapor deposition method, used in the vapor deposition equipment as described in any one of claims 1-9, characterized in that, Includes the following steps: Provide a substrate; Clean the substrate; The mask plate is bonded to the cleaned substrate in the alignment device. The bonding information between the mask plate and the substrate is collected by the detection component and fed back to the bonding component. Based on the adjustment of the bonding component, the mask plate is adjusted to a preset position on the substrate, and the aligned mask plate and substrate assembly is transferred to the preset position. The aligned mask and substrate assembly is transferred into the film-forming chamber. A film is formed on the substrate in the film-forming chamber.

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