Vapor deposition apparatus

Abstract

Embodiments of the present application provide a kind of evaporation device, comprising: evaporation source assembly, substrate support and evaporation chamber, evaporation source assembly and substrate support are located in evaporation chamber, substrate support is located in the side of evaporation source assembly along the first direction, evaporation source assembly includes: shell, angle adjustment mechanism and drive mechanism, the accommodating chamber is in the shell, angle adjustment mechanism is connected to the side of shell along the first direction towards substrate support, angle adjustment mechanism includes ball head assembly and nozzle, nozzle is connected to the side of ball head assembly away from shell, channel is arranged in ball head assembly, channel is communicated between nozzle and accommodating chamber, channel is configured to be located in the evaporation material of accommodating chamber can pass through channel and enter nozzle, ball head assembly can be rotatably arranged;Drive mechanism is connected with ball head assembly, and drive mechanism is used to drive ball head assembly to rotate, to adjust the orientation of nozzle, to improve the evaporation angle range of evaporation device.

Description

Technical Field

[0001] This application relates to the field of vapor deposition equipment technology, and more particularly to a vapor deposition apparatus. Background Technology

[0002] Evaporation deposition is a widely used process for thin film preparation. It involves heating a material in a vacuum environment to an evaporation or sublimation state, causing it to deposit onto a substrate surface to form a thin film. This technology has important applications in optics, electronics, semiconductors, decorative materials, and display panel manufacturing. With increasing industrial demands, the requirements for film uniformity, material utilization, and equipment stability in evaporation deposition processes are becoming increasingly stringent.

[0003] During tilted evaporation deposition, the evaporation material is prone to overflowing from the crucible, leading to material waste and equipment contamination, thus limiting the evaporation angle range of the evaporation source. Therefore, there is an urgent need to improve the limited evaporation angle range of the evaporation deposition apparatus. Summary of the Invention

[0004] This application provides a vapor deposition apparatus designed to improve the vapor deposition angle range of the vapor deposition apparatus.

[0005] An embodiment of the first aspect of this application provides a vapor deposition apparatus, including: a vapor deposition source assembly, a substrate support, and a vapor deposition chamber. The vapor deposition source assembly and the substrate support are located within the vapor deposition chamber. The substrate support is used to support a substrate and is located on one side of the vapor deposition source assembly along a first direction. The vapor deposition source assembly includes: a housing, an angle adjustment mechanism, and a drive mechanism. The housing has a receiving chamber for receiving vapor deposition material. The angle adjustment mechanism is connected to the side of the housing facing the substrate support along the first direction. The angle adjustment mechanism includes a ball head assembly and a nozzle. The nozzle is connected to the side of the ball head assembly away from the housing. The ball head assembly has a channel that connects the nozzle and the receiving chamber. The channel is configured such that vapor deposition material located in the receiving chamber can enter the nozzle through the channel. The ball head assembly is rotatably configured. The drive mechanism is connected to the ball head assembly and is used to drive the ball head assembly to rotate to adjust the orientation of the nozzle.

[0006] According to an embodiment of this application, the housing includes a top wall and a bottom wall, the top wall is connected to the inner wall of the vapor deposition chamber, the bottom wall and the top wall are disposed opposite to each other along a first direction, and the ball head assembly is rotatably mounted on the bottom wall.

[0007] According to embodiments of this application, the vapor deposition apparatus further includes a fixing part, and the top wall is connected to the inner wall of the vapor deposition chamber through the fixing part.

[0008] According to an embodiment of this application, the bottom wall includes a first layer and a second layer spaced apart along a first direction. The second layer is located on the side of the first layer facing the substrate support. The first layer has a first opening, and the second layer has a second opening. The first opening and the second opening are arranged opposite to each other along the first direction, and there is a gap between the first layer and the second layer. The ball head assembly includes a first portion and a second portion. The second portion is located on the side of the first portion facing the receiving chamber. The channel communicates with the receiving chamber through the second opening. The second portion is rotatably embedded in the gap, and the first portion is exposed through the second opening. The nozzle is disposed on the first portion.

[0009] According to embodiments of this application, the channel is located in the first section and the second section.

[0010] According to an embodiment of this application, the diameter of the second opening is smaller than the diameter of the second portion.

[0011] According to an embodiment of this application, at least a portion of the drive mechanism is disposed in the space between the partitions, the drive mechanism is connected to the second part, and the drive mechanism is used to drive the second part to rotate.

[0012] According to an embodiment of this application, the driving mechanism includes a drive motor, the drive motor is provided with an output shaft, the output shaft is connected to a second part, and the drive motor is used to drive the output shaft to rotate so as to drive the second part to rotate.

[0013] According to an embodiment of this application, the drive mechanism includes a drive motor, a first gear, and a second gear. The drive motor is disposed in the receiving chamber and has an output shaft. The first gear is mounted on the output shaft, and the second gear is located in the spacer and connected to the second segment. At least one of the first gear and the second gear penetrates the first layer. The first gear and the second gear mesh, and the drive motor drives the second gear to rotate through the first gear, thereby driving the ball head assembly to rotate.

[0014] According to an embodiment of this application, the vapor deposition apparatus further includes a mounting assembly connected to the housing, the mounting assembly having an mounting space, and a ball head assembly rotatably mounted in the mounting space; the mounting assembly has a third opening along a first direction toward the vapor deposition chamber, a portion of the ball head assembly protruding from the third opening, and a nozzle connected to the portion of the ball head assembly protruding from the third opening.

[0015] According to an embodiment of this application, the diameter of the ball head assembly is larger than the diameter of the third opening.

[0016] According to an embodiment of this application, the housing includes a top wall and a bottom wall, the top wall being connected to the inner wall of the vapor deposition chamber, the bottom wall being disposed opposite to the top wall along a first direction, and the mounting assembly being embedded in the bottom wall.

[0017] According to an embodiment of this application, the housing is provided with a fourth opening, the mounting assembly is disposed in the receiving chamber, and the third opening and the nozzle are located in the fourth opening.

[0018] According to an embodiment of this application, the housing is provided with a fourth opening, the mounting assembly is disposed in the vapor deposition chamber and covers the fourth opening, and the mounting space is connected to the receiving chamber through the fourth opening.

[0019] According to an embodiment of this application, the driving mechanism includes a drive motor disposed in the installation space. The drive motor is provided with an output shaft, which is connected to a ball joint assembly. The drive motor is used to drive the output shaft to rotate so as to drive the ball joint assembly to rotate.

[0020] In the embodiments of this application, an angle adjustment mechanism is connected to the housing on the side facing the substrate support along a first direction. The angle adjustment mechanism includes a ball head assembly and a nozzle. The nozzle is connected to the side of the ball head assembly away from the housing. The vapor deposition material is deposited onto the substrate after passing through the nozzle. The nozzle being connected to the side of the ball head assembly away from the housing reduces interference from the housing on the vapor deposition material ejected from the nozzle. A channel is provided inside the ball head assembly. One end of the channel is connected to the nozzle, and the other end is connected to the receiving chamber. The vapor deposition material in the receiving chamber can enter the nozzle through the channel and be deposited into the receiving chamber through the nozzle. The nozzle is connected to the ball head assembly, and a drive mechanism is connected to the ball head assembly. The drive mechanism is used to drive the ball head assembly to rotate, thereby adjusting the orientation of the nozzle to adjust the vapor deposition angle. The introduction of the drive mechanism makes the adjustment of the vapor deposition angle more convenient and precise, simplifies the process control process, and improves production efficiency. The vapor deposition device is not only suitable for planar vapor deposition with the nozzle facing the vertical direction, but also for inclined vapor deposition with the nozzle tilted relative to the vertical direction, thus expanding the application range of the vapor deposition device. Attached Figure Description

[0021] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar features.

[0022] Figure 1 This is a schematic diagram of the structure of a vapor deposition apparatus provided in an embodiment of this application;

[0023] Figure 2 This is a schematic diagram of the structure of a vapor deposition source provided in an embodiment of this application;

[0024] Figure 3 This is a schematic diagram of another vapor deposition source provided in an embodiment of this application;

[0025] Figure 4 This is a schematic diagram of another vapor deposition source provided in the embodiments of this application;

[0026] Figure 5 This is a schematic diagram of another vapor deposition source provided in the embodiments of this application;

[0027] Figure 6 This is a schematic diagram of another vapor deposition source provided in the embodiments of this application.

[0028] Explanation of reference numerals in the attached drawings: 10, vapor deposition source assembly; 11, crucible; 12, evaporation opening; 20, fixing part; 30, vapor deposition chamber; 40, substrate; 50, substrate support; 100, shell; 101, receiving chamber; 110, top wall; 120, bottom wall; 121, first layer; 122, second layer; 123, first opening; 124, second opening; 125, spacer; 126, fourth opening; 200, ball head assembly; 201, first section; 202, second section; 210, channel; 220, nozzle; 300, drive mechanism; 310, drive motor; 311, output shaft; 320, first gear; 330, second gear; 345, third gear; 400, mounting assembly; 401, third opening; 410, mounting space; 411, rotating groove; X, first direction. Detailed Implementation

[0029] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0030] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0031] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the embodiments of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0032] Vapor deposition is a widely used process for thin film preparation, particularly important in the manufacturing of optics, electronics, semiconductors, and display panels. During vapor deposition, materials are heated to the point of evaporation or sublimation in a vacuum environment, subsequently deposited onto a substrate to form a thin film. To achieve uniform thin film deposition, vapor deposition equipment typically requires precise control of the position and angle of the evaporation source, as well as the distribution of the vaporized material.

[0033] In vapor deposition apparatuses of related technologies, the nozzles of the vapor deposition source assembly are typically at a fixed angle, making it difficult to flexibly adjust the direction and angle of the vapor deposition material spray during the vapor deposition process. In the vapor deposition apparatus, the crucible, as the core component of the evaporation source, is used to hold the vapor deposition material. When the vapor deposition source assembly is tilted for vapor deposition, the crucible usually needs to tilt synchronously with the assembly. However, this tilting operation can cause the vapor deposition material inside the crucible to overflow, especially when the material's fluidity increases after melting. Overflow not only wastes vapor deposition material but can also contaminate the vapor deposition chamber, affecting the quality of the film and the stability of the equipment, thus limiting the vapor deposition angle range of the apparatus.

[0034] Based on this, this application proposes a vapor deposition apparatus in which the nozzle 220 of the vapor deposition source assembly 10 is movably configured. When the vapor deposition apparatus performs tilted vapor deposition, the orientation of the nozzle 220 is adjusted to achieve tilted vapor deposition.

[0035] like Figure 1As shown in the embodiment of this application, a vapor deposition apparatus includes: a vapor deposition source assembly 10, a substrate support 50, and a vapor deposition chamber 30. The vapor deposition source assembly 10 and the substrate support 50 are located within the vapor deposition chamber 30. The substrate support 50 is used to support a substrate 40 and is located on one side of the vapor deposition source assembly 10 along the first direction X. The vapor deposition source assembly 10 includes: a housing 100, an angle adjustment mechanism, and a drive mechanism 300. The housing 100 has a receiving chamber 101 for receiving vapor deposition material. The angle adjustment mechanism is connected to the housing 100 along the first direction X toward the substrate support. On the 50 side, the angle adjustment mechanism includes a ball head assembly 200 and a nozzle 220. The nozzle 220 is connected to the side of the ball head assembly 200 away from the housing 100. A channel 210 is provided inside the ball head assembly 200, which connects the nozzle 220 and the receiving chamber 101. The channel 210 is configured so that the vapor deposition material located in the receiving chamber 101 can enter the nozzle 220 through the channel 210. The ball head assembly 200 is rotatably configured. A drive mechanism 300 is connected to the ball head assembly 200 and is used to drive the ball head assembly 200 to rotate in order to adjust the orientation of the nozzle 220.

[0036] In this embodiment, both the vapor deposition source assembly 10 and the substrate support 50 are located within the vapor deposition chamber 30. The vapor deposition chamber 30 effectively isolates the external environment from interference with the vapor deposition process, reduces the risk of contamination, and improves product quality. The substrate support 50 is used to support the substrate 40. The substrate support 50 is located on one side of the vapor deposition source assembly 10 along the first direction X. The vapor deposition material in the vapor deposition source assembly 10 is deposited onto the substrate 40 through the nozzle 220. The vapor deposition source assembly 10 includes a housing 100, an angle adjustment mechanism, and a drive mechanism 300. The housing 100 has a receiving chamber 101 for accommodating vapor deposition material. The angle adjustment mechanism is connected to the housing 100 on the side facing the substrate support 50 along the first direction X. The angle adjustment mechanism includes a ball head assembly 200 and a nozzle 220. The nozzle 220 is connected to the side of the ball head assembly 200 away from the housing 100. The vapor deposition material is deposited onto the substrate 40 after passing through the nozzle 220. The nozzle 220 being connected to the side of the ball head assembly 200 away from the housing 100 reduces interference from the housing 100 on the vapor deposition material ejected from the nozzle 220. The ball head assembly 200 has a channel 210. One end of the channel 210 is connected to the nozzle 220, and the other end of the channel 210 is connected to the receiving chamber 101. The vapor deposition material in the receiving chamber 101 can enter the nozzle 220 through the channel 210 and be deposited into the receiving chamber 30 through the nozzle 220. The nozzle 220 is connected to the ball head assembly 200, and the drive mechanism 300 is connected to the ball head assembly 200. The drive mechanism 300 is used to drive the ball head assembly 200 to rotate, thereby adjusting the orientation of the nozzle 220 to adjust the vapor deposition angle. The introduction of the drive mechanism 300 makes the adjustment of the vapor deposition angle more convenient and precise, simplifies the process control process, and improves production efficiency. The vapor deposition device is not only suitable for planar vapor deposition with the nozzle 220 facing the vertical direction, but also for inclined vapor deposition with the nozzle 220 tilted relative to the vertical direction, thus expanding the vapor deposition angle range of the vapor deposition device.

[0037] The vapor deposition source assembly 10 and the substrate support 50 are located in the same vapor deposition chamber 30. Vapor deposition material is placed in the crucible 11 within the vapor deposition source assembly 10, and the material is evenly distributed in the heating area of ​​the crucible 11. The substrate 40 to be coated is fixed on the substrate support 50 in the vapor deposition chamber 30. The position and angle of the substrate support 50 are adjusted so that its distance and angle from the nozzle 220 meet the process requirements. The vapor deposition chamber 30 is then closed, and the vacuum pump is started to reduce the gas pressure inside the vapor deposition chamber 30 to the required vacuum level, thereby reducing the interference of gas molecules on the vapor deposition process. In this embodiment, the vapor deposition chamber 30 provides a vacuum environment. The nozzle 220 is connected to the ball head assembly 200, and the drive mechanism 300 is connected to the ball head assembly 200. The drive mechanism 300 drives the ball head assembly 200 to rotate, thereby adjusting the orientation of the nozzle 220 to adjust the vapor deposition angle and achieve tilted vapor deposition.

[0038] Optionally, the first direction X is the vertical direction.

[0039] Optionally, the ball joint assembly 200 can rotate about a single fixed axis, and can also be rotatably configured about an axis perpendicular to the first direction X. When the first direction X is vertical, the ball joint assembly 200 can be rotatably configured about an axis parallel to the horizontal direction. Alternatively, the ball joint assembly 200 can rotate freely in multiple directions.

[0040] In some alternative embodiments, the ball head assembly 200 is structured as a sphere or part of a sphere to enable multi-angle rotation.

[0041] Optionally, the ball head assembly 200 is made of a high-strength material capable of withstanding the high temperature and high load environment during the vapor deposition process. The material of the ball head assembly 200 may include at least one of stainless steel (such as 304 or 316L stainless steel), titanium alloy, nickel-based alloy, ceramic material (such as alumina or silicon nitride), or aluminum alloy.

[0042] Optionally, the inner wall of channel 210 is smooth to reduce the risk of material residue and blockage.

[0043] Optionally, the nozzle 220 may be made of a high-temperature resistant and corrosion-resistant material, including at least one of ceramic or alloy, to adapt to the high-temperature and chemically corrosive environment during the vapor deposition process.

[0044] Optional, such as Figure 1 As shown, the nozzle 220 is detachably connected to the ball head assembly 200 for easy replacement and maintenance.

[0045] Optionally, a sealing structure is provided between the nozzle 220 and the ball head assembly 200 to reduce leakage of vapor deposition material or entry of external contaminants.

[0046] Optionally, the drive mechanism 300 can precisely adjust the rotation angle of the ball head assembly 200 by mechanical or electronic means, thereby changing the orientation of the nozzle 220.

[0047] like Figure 1 As shown, in some optional embodiments, a crucible 11 is provided in the receiving chamber 101. The crucible 11 serves as the core component of the evaporation source and is used to load the vapor deposition material. The crucible 11 is provided with an evaporation opening 12.

[0048] In these alternative embodiments, the vapor deposition material is heated to evaporate or sublimate in the crucible 11, enters the receiving chamber 101 through the evaporation opening 12, and then passes through the channel 210 and nozzle 220 to be deposited on the substrate 40 to form a thin film. The nozzle 220 is connected to the ball head assembly 200, and the drive mechanism 300 is connected to the ball head assembly 200. The drive mechanism 300 is used to drive the ball head assembly 200 to rotate, thereby adjusting the orientation of the nozzle 220 to adjust the vapor deposition angle. When performing tilted vapor deposition, the housing 100 and the crucible 11 inside the housing 100 do not need to be tilted, thereby reducing the risk of vapor deposition material overflowing from the evaporation opening 12 in the crucible 11, increasing the vapor deposition angle range of the vapor deposition apparatus, and reducing material waste and equipment contamination.

[0049] Optionally, the crucible 11 is a container for loading vapor-deposited material. The cross-section of the crucible 11 along the X-direction perpendicular to the first direction can be circular, square, or other geometric shapes. The inner wall surface of the crucible 11 is smooth to reduce material residue and contamination.

[0050] Optional, such as Figure 1 As shown, the evaporation opening 12 is located on one side of the crucible 11 along the first direction X. The side opposite to the evaporation opening 12 along the first direction X or the side perpendicular to the first direction X is the heating area, which is in contact with the heating device (such as a resistance heater, electron beam or induction coil) to achieve efficient heating.

[0051] Optionally, the crucible 11 possesses high temperature resistance, corrosion resistance, good thermal conductivity, and sufficient mechanical strength to withstand thermal and mechanical stresses at high temperatures. The material of the crucible 11 may include at least one of tungsten, tantalum, quartz, ceramic, or graphite.

[0052] like Figure 1 As shown, in some optional embodiments, the housing 100 includes a top wall 110 and a bottom wall 120. The top wall 110 is connected to the inner wall of the vapor deposition chamber 30, and the bottom wall 120 is disposed opposite to the top wall 110 along a first direction X. The ball head assembly 200 is rotatably mounted on the bottom wall 120.

[0053] In these optional embodiments, the housing 100 is connected to the inner wall of the vapor deposition chamber 30 via a top wall 110. The top wall 110 is located on the side of the bottom wall 120 facing away from the substrate support 50 along the first direction X. The bottom wall 120 and the top wall 110 are arranged opposite each other along the first direction X. The ball head assembly 200 is rotatably mounted on the bottom wall 120, that is, the ball head assembly 200 is located on the side of the housing 100 facing the substrate support 50. The rotatable mounting of the ball head assembly 200 on the bottom wall 120 reduces the use of other fixing parts 20, making the structure simpler and the ball head assembly 200 and the housing 100 more compact. The stable support of the bottom wall 120 reduces the vibration of the ball head assembly 200 during rotation, further improving the vapor deposition accuracy.

[0054] Optionally, the housing 100 may be made of at least one of stainless steel (such as 304 or 316L stainless steel), titanium alloy, nickel-based alloy, ceramic material (such as alumina or silicon nitride), or aluminum alloy to give the housing 100 high temperature resistance, corrosion resistance, mechanical strength, and machinability. The housing 100's mechanical strength enhances its support for the ball joint assembly 200, reduces vibration during rotation of the ball joint assembly 200, and improves the vapor deposition accuracy.

[0055] like Figure 1 As shown, in some optional embodiments, the vapor deposition apparatus further includes a fixing part 20, and the top wall 110 is connected to the inner wall of the vapor deposition chamber 30 through the fixing part 20.

[0056] In these optional embodiments, before the evaporation process begins, the evaporation chamber 30 is closed, and the vacuum pump is started to reduce the gas pressure inside the evaporation chamber 30 to the required vacuum level, thereby reducing the interference of gas molecules on the evaporation process. The fixing part 20 is connected between the top wall 110 and the inner wall of the evaporation chamber 30, thereby reducing the direct transmission of vibrations from the vacuum pump and other components through the inner wall of the evaporation chamber 30 to the housing 100, thus improving the performance of the evaporation apparatus. The fixing part 20 is used to fix the position of the evaporation source assembly 10 within the evaporation chamber 30, that is, to fix the position of the nozzle 220 within the evaporation chamber 30, thereby improving the evaporation accuracy of the evaporation source assembly 10. The top wall 110 is detachably connected to the inner wall of the evaporation chamber 30 via the fixing part 20, thus facilitating the disassembly and maintenance of the evaporation source assembly 10.

[0057] like Figure 2 As shown, in some optional embodiments, the bottom wall 120 includes a first layer 121 and a second layer 122 spaced apart along a first direction X. The second layer 122 is located on the side of the first layer 121 facing the substrate support 50. The first layer 121 has a first opening 123, and the second layer 122 has a second opening 124. The first opening 123 and the second opening 124 are arranged opposite to each other along the first direction X, and there is a gap space 125 between the first layer 121 and the second layer 122. The ball head assembly 200 includes a first portion 201 and a second portion 202. The second portion 202 is located on the side of the first portion 201 facing the receiving chamber 101. The channel 210 communicates with the receiving chamber 101 through the second opening 124. The second portion 202 is rotatably embedded in the gap space 125. The first portion 201 is exposed through the second opening 124, and the nozzle 220 is disposed on the first portion 201.

[0058] In these optional embodiments, the bottom wall 120 includes a first layer 121 and a second layer 122 spaced apart along a first direction X. The bottom wall 120 adopts a double-layer structure, and a space 125 is formed between the first layer 121 and the second layer 122, thereby improving the heat insulation performance of the bottom wall 120 for the receiving chamber 101 and improving the thermal efficiency of the crucible 11 in heating the vapor deposition material. The second portion 202 is rotatably embedded in the space 125. The space 125 between the first layer 121 and the second layer 122 provides sufficient rotation space for the second portion 202 of the ball head assembly 200, allowing the ball head assembly 200 to flexibly adjust its angle. At the same time, the first layer 121 and the second layer 122 can fix the position of the second portion 202 of the ball head assembly 200, reducing the displacement or vibration of the ball head assembly 200 during rotation and improving the stability of the vapor deposition process. The first layer 121 has a first opening 123, and the second layer 122 has a second opening 124. The first opening 123 and the second opening 124 are arranged opposite each other along the first direction X. The second portion 202 is located on the side of the first portion 201 facing the receiving chamber 101. The channel 210 connects to the receiving chamber 101 through the second opening 124, and the vapor deposition material can enter the channel 210 through the second opening 124. The first portion 201 is exposed through the second opening 124, and the nozzle 220 is disposed in the first portion 201, that is, the nozzle 220 is exposed through the second opening 124 and extends into the vapor deposition chamber 30. The second portion 202 of the ball head assembly 200 is disposed in the spacer space 125, thereby reducing the size of the vapor deposition source assembly 10 along the first direction X, making the structure of the vapor deposition source assembly 10 more compact.

[0059] Optional, such as Figure 2 As shown, channel 210 is located in the first section 201 and the second section 202, and nozzle 220 is connected to the first section 201 to make channel 210 and nozzle 220 communicate.

[0060] like Figure 2 As shown, in some alternative embodiments, the diameter of the second opening 124 is smaller than the diameter of the second portion 202.

[0061] In these alternative embodiments, the diameter of the second opening 124 is smaller than the diameter of the second portion 202, so that the second opening 124 can restrict the position of the second portion 202 along the first direction X, reducing the risk of the ball head assembly 200 falling off the second opening 124. The ball head assembly 200 is fitted to the edge of the second opening 124, which can increase the sealing between the ball head assembly 200 and the second layer 122.

[0062] like Figure 2As shown, in some optional embodiments, at least a portion of the drive mechanism 300 is disposed in the space 125, the drive mechanism 300 is connected to the second portion 202, and the drive mechanism 300 is used to drive the second portion 202 to rotate.

[0063] In these alternative embodiments, the drive mechanism 300 is integrated within the spacer 125, making full use of the internal space of the bottom wall 120 and reducing the size of the vapor deposition source assembly 10 along the first direction X. The drive mechanism 300 is directly connected to the second portion 202, reducing the number of transmission components, lowering energy loss, and improving drive efficiency. Furthermore, since the vapor deposition chamber 30 is filled with vapor deposition material and has a relatively high temperature, the direct connection between the drive mechanism 300 and the second portion 202 enhances the reliability of the vapor deposition apparatus.

[0064] like Figure 2 As shown, in some optional embodiments, the drive mechanism 300 includes a drive motor 310, the drive motor 310 is provided with an output shaft 311, the output shaft 311 is connected to the second part 202, and the drive motor 310 is used to drive the output shaft 311 to rotate so as to drive the second part 202 to rotate.

[0065] In these optional embodiments, the drive motor 310 enables more precise angle control of the ball head assembly 200, meeting the requirements of the vapor deposition process for adjusting the spray direction of the nozzle 220. The drive motor 310 is directly connected to the second section 202 via its output shaft 311, reducing the use of intermediate transmission components, lowering vibrations during the drive process, and improving the stability of the device. Furthermore, since the vapor deposition chamber 30 is filled with vapor deposition material and operates at a high temperature, the direct connection between the output shaft 311 of the drive motor 310 and the second section 202 enhances the reliability of the vapor deposition apparatus. The connection between the output shaft 311 and the second section 202 restricts the axial displacement of the ball head assembly 200 during rotation, ensuring the accuracy and consistency of the vapor deposition process.

[0066] like Figure 3 As shown, in some optional embodiments, the drive mechanism 300 includes a drive motor 310, a first gear 320, and a second gear 330. The drive motor 310 is disposed in the receiving chamber 101 and has an output shaft 311. The first gear 320 is mounted on the output shaft 311, and the second gear 330 is located in the spacer space 125 and connected to the second portion 202. At least one of the first gear 320 and the second gear 330 penetrates the first layer 121. The first gear 320 and the second gear 330 mesh, and the drive motor 310 drives the second gear 330 to rotate through the first gear 320, thereby driving the ball head assembly 200 to rotate.

[0067] In these optional embodiments, the first gear 320 is mounted on the output shaft 311, and the drive motor 310 drives the first gear 320 to rotate through the output shaft 311. The second gear 330 meshes with the first gear 320, and the second gear 330 is located in the gap space 125 and connected to the second segment 202. The first gear 320 can drive the second segment 202 to rotate through the second gear 330. The second gear 330 can be directly connected to the second segment 202, or the second gear 330 can be connected to the second segment 202 through a connecting component. Optionally, the axis of rotation of the second gear 330 is perpendicular to the first direction X. When the first direction X is vertical, the second gear 330 rotates about an axis parallel to the horizontal direction. Furthermore, by adjusting the transmission ratio of the first gear 320 and the second gear 330, the rotation speed and accuracy of the ball head assembly 200 can be flexibly controlled, improving the vapor deposition effect.

[0068] like Figure 4 As shown, in some alternative embodiments, the vapor deposition apparatus further includes a mounting assembly 400 connected to the housing 100. The mounting assembly 400 has a mounting space 410, in which a ball head assembly 200 is rotatably mounted. The mounting assembly 400 has a third opening 401 on the side facing the vapor deposition chamber 30 along the first direction X. A portion of the ball head assembly 200 is exposed through the third opening 401, and a nozzle 220 is connected to the portion of the ball head assembly 200 exposed through the third opening 401.

[0069] In these optional embodiments, the mounting space 410 of the mounting assembly 400 provides rotational space for the ball head assembly 200, ensuring that the ball head assembly 200 is not disturbed during rotation. The mounting assembly 400 is used to fix the position of the ball head assembly 200, reducing the offset or vibration of the ball head assembly 200 during rotation, thereby improving the accuracy of the vapor deposition angle control. The mounting assembly 400 is provided with a third opening 401 along the first direction X toward the vapor deposition chamber 30. The third opening 401 exposes part of the ball head assembly 200. The nozzle 220 is connected to the part of the ball head assembly 200 exposed by the third opening 401. The nozzle 220 faces the vapor deposition chamber 30, ensuring that the nozzle 220 can freely adjust its angle.

[0070] like Figure 4 As shown, in some optional embodiments, a rotating groove 411 is provided within the mounting space 410, and the surface of the rotating groove 411 is arc-shaped. The ball head assembly 200 is rotatably mounted in the rotating groove 411.

[0071] In these alternative embodiments, a rotating groove 411 is provided in the installation space 410. The rotating groove 411 is used to fix the position of the ball head assembly 200. The surface of the rotating groove 411 is arc-shaped to adapt to the spherical ball head assembly 200. The rotating groove 411 is used to fix the position of the ball head assembly 200, which can improve the stability of the ball head assembly 200 when rotating and reduce the problem of vibration when adjusting the angle of the nozzle 220.

[0072] Optional, such as Figure 4 As shown, the cross section of the rotating groove 411 perpendicular to the first direction X is circular, so that the shape of the rotating groove 411 is adapted to the ball head assembly 200.

[0073] Optional, such as Figure 4 As shown, the drive mechanism 300 includes a drive motor 310, which is disposed in the installation space 410. The drive motor 310 is provided with an output shaft 311, which extends into the rotation groove 411 to connect to the ball head assembly 200, thereby driving the ball head assembly 200 located in the rotation groove 411 to rotate.

[0074] like Figure 4 As shown, in some alternative embodiments, the diameter of the ball head assembly 200 is larger than the diameter of the third opening 401.

[0075] In these alternative embodiments, the diameter of the ball head assembly 200 is larger than the diameter of the third opening 401, so that the third opening 401 can restrict the position of the ball head assembly 200 along the first direction X, reducing the risk of the ball head assembly 200 falling off the third opening 401. The ball head assembly 200 is fitted to the edge of the third opening 401, which can increase the sealing between the ball head assembly 200 and the mounting assembly 400, reduce the entry of vapor deposition material into the mounting space 410, and improve the reliability of the vapor deposition apparatus.

[0076] like Figure 4 As shown, in some optional embodiments, the housing 100 includes a top wall 110 and a bottom wall 120. The top wall 110 is connected to the inner wall of the vapor deposition chamber 30, and the bottom wall 120 is disposed opposite to the top wall 110 along a first direction X. The mounting assembly 400 is embedded in the bottom wall 120.

[0077] In these optional embodiments, the bottom wall 120 of the housing 100 is located on the side of the housing 100 facing the substrate support 50. The mounting assembly 400 is embedded in the bottom wall 120, and the bottom wall 120 surrounds the mounting assembly 400 to fix its position, improving the stability of the mounting assembly 400 and ensuring the accurate positioning and stable operation of the ball head assembly 200 during rotation. The design of the mounting assembly 400 embedded in the bottom wall 120 makes full use of the internal space of the housing 100, making the structure of the vapor deposition source assembly 10 more compact and reducing the volume of the vapor deposition source assembly 10 and the vapor deposition apparatus. The mounting assembly 400 embedded in the bottom wall 120 makes the disassembly and replacement of the ball head assembly 200 and the nozzle 220 more convenient, which is conducive to improving production efficiency. By disassembling the mounting assembly 400, the ball head assembly 200 and the nozzle 220 can be inspected simultaneously, and the mounting assembly 400, the ball head assembly 200, and the nozzle 220 can be produced modularly.

[0078] like Figure 5 As shown, in some alternative embodiments, the housing 100 is provided with a fourth opening 126, the mounting assembly 400 is disposed in the receiving chamber 101, and the third opening 401 and the nozzle 220 are located in the fourth opening 126.

[0079] In these optional embodiments, the mounting assembly 400 is disposed within the receiving chamber 101, which reduces the space occupied by the mounting assembly 400 in the vapor deposition chamber 30, thereby facilitating the arrangement of more substrates 40 in the vapor deposition chamber 30 and improving production efficiency. The housing 100 has a fourth opening 126 on the side facing the substrate support 50. The mounting assembly 400 covers at least part of the fourth opening 126. The third opening 401 and the nozzle 220 are located within the fourth opening 126, which exposes the third opening 401 and the nozzle 220, allowing the nozzle 220 to communicate with the vapor deposition chamber 30 through the fourth opening 126, ensuring normal vapor deposition.

[0080] like Figure 6 As shown, in some other alternative embodiments, the housing 100 is provided with a fourth opening 126, the mounting assembly 400 is disposed in the vapor deposition chamber 30 and covers the fourth opening 126, and the mounting space 410 is connected to the receiving chamber 101 through the fourth opening 126.

[0081] In these optional embodiments, the mounting assembly 400 is disposed within the vapor deposition chamber 30 to reduce the space occupied by the mounting assembly 400 in the receiving chamber 101, thereby facilitating the reduction of contamination of the mounting assembly 400 and the ball head assembly 200 in the mounting space 410 by the vapor deposition material, and improving the rotational stability of the ball head assembly 200. The mounting assembly 400 being disposed within the vapor deposition chamber 30 makes the disassembly and replacement of the ball head assembly 200 and the nozzle 220 more convenient, without requiring the opening of the housing 100 of the vapor deposition source assembly 10, which is beneficial for improving production efficiency. The mounting space 410 is connected to the receiving chamber 101 through a fourth opening 126, allowing the vapor deposition material to enter the channel 210 of the ball head assembly 200 located in the mounting space 410 through the fourth opening 126.

[0082] like Figures 4 to 6 As shown, in some optional embodiments, the drive mechanism 300 includes a drive motor 310, which is disposed in the mounting space 410. The drive motor 310 is provided with an output shaft 311, which is connected to the ball joint assembly 200. The drive motor 310 is used to drive the output shaft 311 to rotate so as to drive the ball joint assembly 200 to rotate.

[0083] In these optional embodiments, the drive motor 310 is used to drive the output shaft 311 to rotate, thereby rotating the ball joint assembly 200 and adjusting the rotation angle of the ball joint assembly 200 to meet the requirements of the vapor deposition process for the spray direction. The drive motor 310 is disposed within the installation space 410, making the structure more compact and reducing the intrusion of vapor deposition material into the drive electrode, thereby improving the stability of the drive electrode and extending the service life of the drive motor 310.

[0084] In some optional embodiments, the vapor deposition apparatus includes: a vapor deposition source assembly 10, a substrate support 50, and a vapor deposition chamber 30. The vapor deposition source assembly 10 and the substrate support 50 are located within the vapor deposition chamber 30. The substrate support 50 is used to support the substrate 40 and is located on one side of the vapor deposition source assembly 10 along a first direction X. The vapor deposition source assembly 10 includes: a housing 100, an angle adjustment mechanism, and a drive mechanism 300. The housing 100 includes a top wall 110 and a bottom wall 120 disposed opposite to each other along the first direction X. The bottom wall 120 is located on the side of the housing 100 facing the substrate support 50. The top wall 110 is fixed by a fixing part 20. The housing 100 has a receiving chamber 101 within it, connected to the inner wall of the vapor deposition chamber 30. The angle adjustment mechanism includes a ball head assembly 200 and a nozzle 220. The ball head assembly 200 is rotatably connected to the bottom wall 120, and the nozzle 220 is connected to the side of the ball head assembly 200 away from the top wall 110. A channel 210 is provided inside the ball head assembly 200, connecting the nozzle 220 and the receiving chamber 101. The channel 210 is configured so that vapor deposition material located in the receiving chamber 101 can enter the nozzle 220 through the channel 210. The ball head assembly 200 is rotatably arranged about an axis parallel to the horizontal direction. The drive mechanism 300 includes a drive motor 310, which has an output shaft 311 connected to the ball head assembly 200. The drive motor 310 drives the output shaft 311 to rotate, thereby driving the ball head assembly 200 to rotate. The bottom wall 120 includes a first layer 121 and a second layer 122 spaced apart along a first direction X. The second layer 122 is located on the side of the first layer 121 facing the substrate support 50. The first layer 121 has a first opening 123 and the second layer 122 has a second opening 124. The first opening 123 and the second opening 124 are arranged opposite to each other along the first direction X. There is a gap space 125 between the first layer 121 and the second layer 122. The ball head assembly 200 includes a first portion 201 and a second portion 202. The second portion 202 is located on the side of the first portion 201 facing the receiving chamber 101. The channel 210 communicates with the receiving chamber 101 through the second opening 124. The second portion 202 is rotatably embedded in the gap space 125. The first portion 201 is exposed through the second opening 124. The nozzle 220 is disposed on the first portion 201. Alternatively, the vapor deposition apparatus may further include a mounting assembly 400 connected to the bottom wall 120. The mounting assembly 400 has a mounting space 410, in which a ball head assembly 200 is rotatably mounted. The mounting assembly 400 has a third opening 401 on the side facing the vapor deposition chamber 30 along the first direction X. A portion of the ball head assembly 200 is exposed through the third opening 401, and the nozzle 220 is connected to the portion of the ball head assembly 200 exposed through the third opening 401.

[0085] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A vapor deposition apparatus, characterized in that, include: The evaporation source assembly, the substrate support, and the evaporation chamber are provided. The evaporation source assembly and the substrate support are located within the evaporation chamber. The substrate support is used to support the substrate and is located on one side of the evaporation source assembly along a first direction. The evaporation source assembly includes: A housing having a receiving chamber for accommodating vapor-deposited material; An angle adjustment mechanism is provided, which is connected to the housing on the side facing the substrate support along the first direction. The angle adjustment mechanism includes a ball head assembly and a nozzle. The nozzle is connected to the ball head assembly on the side away from the housing. A channel is provided in the ball head assembly, which communicates between the nozzle and the receiving chamber. The channel is configured such that the vapor-deposited material located in the receiving chamber can enter the nozzle through the channel. The ball head assembly is rotatably configured. A drive mechanism is connected to the ball head assembly and is used to drive the ball head assembly to rotate in order to adjust the orientation of the nozzle.

2. The vapor deposition apparatus according to claim 1, characterized in that, The housing includes a top wall and a bottom wall. The top wall is connected to the inner wall of the vapor deposition chamber. The bottom wall and the top wall are disposed opposite to each other along the first direction. The ball head assembly is rotatably mounted on the bottom wall. Preferably, the vapor deposition apparatus further includes a fixing part, and the top wall is connected to the inner wall of the vapor deposition chamber through the fixing part.

3. The vapor deposition apparatus according to claim 2, characterized in that, The bottom wall includes a first layer and a second layer spaced apart along a first direction. The second layer is located on the side of the first layer facing the substrate support. The first layer has a first opening, and the second layer has a second opening. The first opening and the second opening are arranged opposite to each other along the first direction, and there is a space between the first layer and the second layer. The ball head assembly includes a first portion and a second portion, the second portion being located on the side of the first portion facing the receiving chamber, the channel communicating with the receiving chamber through a second opening, the second portion being rotatably embedded in the space, the first portion being exposed through the second opening, and the nozzle being disposed on the first portion; Preferably, the channel is located in the first section and the second section; Preferably, the diameter of the second opening is smaller than the diameter of the second portion.

4. The vapor deposition apparatus according to claim 3, characterized in that, At least a portion of the drive mechanism is disposed in the interval space, the drive mechanism is connected to the second portion, and the drive mechanism is used to drive the second portion to rotate; Preferably, the driving mechanism includes a drive motor, the drive motor is provided with an output shaft, the output shaft is connected to the second part, and the drive motor is used to drive the output shaft to rotate so as to drive the second part to rotate.

5. The vapor deposition apparatus according to claim 3, characterized in that, The drive mechanism includes a drive motor, a first gear, and a second gear. The drive motor is disposed in the receiving chamber and has an output shaft. The first gear is mounted on the output shaft, and the second gear is located in the space and connected to the second portion. At least one of the first gear and the second gear penetrates the first layer. The first gear and the second gear mesh. The drive motor drives the second gear to rotate through the first gear, thereby driving the ball joint assembly to rotate.

6. The vapor deposition apparatus according to claim 1, characterized in that, The vapor deposition apparatus further includes a mounting assembly connected to the housing, the mounting assembly having an installation space, and the ball head assembly being rotatably mounted in the installation space; The mounting assembly has a third opening along the first direction toward the vapor deposition chamber, a portion of the ball head assembly is exposed through the third opening, and the nozzle is connected to the portion of the ball head assembly exposed through the third opening; Preferably, the diameter of the ball head assembly is larger than the diameter of the third opening.

7. The vapor deposition apparatus according to claim 6, characterized in that, The housing includes a top wall and a bottom wall. The top wall is connected to the inner wall of the vapor deposition chamber. The bottom wall and the top wall are disposed opposite to each other along the first direction. The mounting assembly is embedded in the bottom wall.

8. The vapor deposition apparatus according to claim 6, characterized in that, The housing is provided with a fourth opening, the mounting assembly is disposed in the receiving chamber, and the third opening and the nozzle are located in the fourth opening.

9. The vapor deposition apparatus according to claim 6, characterized in that, The housing is provided with a fourth opening, the mounting assembly is disposed in the vapor deposition chamber and covers the fourth opening, and the mounting space is connected to the receiving chamber through the fourth opening.

10. The vapor deposition apparatus according to any one of claims 6 to 9, characterized in that, The driving mechanism includes a drive motor disposed within the installation space. The drive motor has an output shaft connected to the ball joint assembly. The drive motor is used to drive the output shaft to rotate, thereby causing the ball joint assembly to rotate.

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