Vacuum sputter coating method

Abstract

The present application relates to a kind of vacuum sputtering coating method, belong to magnetron sputtering technical field, solve the magnetic field range adjustment and the clamping of target material respectively operation, operation is complicated, target material power supply is unstable, ion generation mechanism cannot be applicable to multiple specifications of target material, poor universality and the problem of one of the possible causes target material drop of clamping arm ring.The vacuum sputtering coating method of the present application includes: step A: device initialization;Step B: pumping;Step C: prepare high voltage power supply parameter;Step D: coating;Step E: shutdown.The coating method of the present application utilizes the outer drive tooth of the clamping arm ring of target material seat unit to drive the rotation of first transmission wheel, and then drives the rotation of second transmission wheel through driven shaft rod, and the rotation of swivel ring is driven by second transmission wheel, to realize the synchronous linkage adjustment of shielding assembly and target material seat unit, realize the synchronous matching adjustment of magnetic field range and target material specification, and the operation is simple.

Description

Technical Field

[0001] This invention relates to the field of magnetron sputtering technology, and more specifically to a vacuum sputtering coating method. Background Technology

[0002] In the existing magnetron sputtering equipment technology system, the configuration of the magnetic field distribution directly determines the shape and density distribution of the plasma region and the etching characteristics of the target surface.

[0003] However, existing coating devices have significant technical limitations in controlling the magnetic field range. Traditional devices typically use fixed permanent magnet arrays or constant-current electromagnetic coils for the magnetically controlled target. Once the equipment is assembled or the magnet arrangement is determined, the magnetic field strength and the spatial distribution of the magnetic field lines are locked. The radial range of the magnetic field is usually positively correlated with the target diameter; adjusting the magnetic field range and the target clamping separately is cumbersome and makes maintaining synchronization difficult. Summary of the Invention

[0004] To address the aforementioned shortcomings of existing technologies, this invention provides a vacuum sputtering coating method that solves several problems in existing technologies, including: the radial range of the magnetic field is usually positively correlated with the target diameter; the adjustment of the magnetic field range and the clamping of the target are performed separately, resulting in cumbersome operations and difficulty in maintaining synchronization; unstable power supply to the target; the ion generation mechanism is not applicable to various target specifications, resulting in poor versatility; and the clamping ring may rotate in the opposite direction, causing the target to fall off.

[0005] To achieve the above-mentioned objectives, the technical solution adopted by this invention is as follows: A vacuum sputtering coating method includes the following steps: Step A: Device initialization; Step B: Evacuate air; Step C: Prepare high-voltage power supply parameters Step D: Coating; Step E: Shut down the machine.

[0006] Further, step A includes: placing the target part to be coated on the target holder.

[0007] Furthermore, step A also includes: clamping the target material.

[0008] Further, step B includes: the controller turns on the mechanical pump and starts the second timer to accumulate the pumping time in the second period T2.

[0009] Furthermore, step B also includes: keeping the first timer running and the vacuum sensor continuously monitoring the vacuum level.

[0010] Furthermore, a step of transition trigger determination is included before step C.

[0011] Furthermore, the transition trigger determination includes: if the vacuum sensor detects that the vacuum degree V does not satisfy V < V_set + ΔV1, where ΔV1 is a set first threshold, then step B is executed.

[0012] Furthermore, the transition trigger determination also includes: if the vacuum sensor detects that the vacuum degree V satisfies V<V_set+ΔV1, where V_set is the vacuum degree set value, then step C is executed.

[0013] Furthermore, a step of delayed voltage regulation is included before step D.

[0014] Furthermore, a vacuum sputtering coating apparatus is used to coat the target part.

[0015] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects: (1) In order to solve the problem that the radial range of the magnetic field is usually positively correlated with the diameter of the target material, and that the magnetic field range and the clamping of the target material are adjusted separately, the operation is cumbersome and it is difficult to maintain synchronization. The coating method of the present invention uses the outer drive teeth of the clamping arm ring of the target material seat unit to drive the first transmission wheel to rotate, and then drives the second transmission wheel to rotate through the driven shaft. The second transmission wheel drives the rotating ring to rotate, thereby realizing the synchronous linkage adjustment of the shielding component and the target material seat unit, realizing the synchronous matching adjustment of the magnetic field range and the target material specifications, which is simple to operate and improves the operation convenience and process stability of the coating device of the present invention. (2) In order to solve the problem that the coverage of the magnetic field cannot be adjusted according to the real-time process requirements and the controllability of the production process is poor, the adjacent magnetic blocking sheets of the magnetic control unit of the coating device of the present invention can overlap, and multiple magnetic blocking sheets form a shielding ring. The center of the shielding ring is a central hole. The shielding ring is used to cut off the magnetic lines of force, and the central hole is used to expose the target area so that the magnetic field only acts on the area. The rotating ring rotates and drives each magnetic blocking sheet to rotate around its own first hinge pin through the meshing transmission of the first inner drive tooth and the end tooth. This changes the radial position of the free end of the magnetic blocking sheet and the cross-sectional area of ​​the central hole, thereby enabling the adjustment of the coverage of the magnetic field and realizing the control of the magnetic field action area, thereby improving the process controllability of magnetron sputtering. (3) In order to solve the problem that the ion generation mechanism cannot be applied to a variety of target materials and has poor versatility, the clamping arm ring of the coating device of the present invention can rotate simultaneously to drive each clamping arm to rotate around its own second hinge pin, thereby changing the radial position of the free end of the clamping arm, and thus adjusting the clamping coverage of the target material. It can be applied to a variety of target materials and has strong versatility. (4) In order to solve the problem that the clamping arm ring may rotate in the opposite direction, causing the target material to fall off, the stop part of the anti-reverse rod of the present invention always abuts against the tooth surface of the anti-reverse gear. When the clamping arm ring rotates in the forward direction, the stop part of the anti-reverse rod can slide on the tooth surface of the anti-reverse gear; when the clamping arm ring rotates in the reverse direction, the stop part can be engaged in the tooth groove of the anti-reverse gear, thereby locking the driven shaft and preventing the clamping arm ring from rotating in the reverse direction.

[0016] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages may become apparent from the specification or be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained from the content specifically pointed out in the text and drawings. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the coating process; Figure 2 This is a schematic diagram of the overall structure of the coating device; Figure 3 This is a schematic diagram of the longitudinal section of the ion generation mechanism; Figure 4 This is a schematic diagram of the overall structure of the magnetic control unit, the target holder unit, and the coordination unit. Figure 5 This is an exploded structural diagram of the magnetic control unit, the target holder unit, and the cooperating unit; Figure 6 This is a schematic diagram of the longitudinal section structure of the energy unit; Figure 7 This is a top view of the collaborative unit.

[0018] Figure label: 1-Casing; 2-Launch mount; 3-Support unit; 31-Support column; 32-Span beam; 4-Magnetic control unit; 41-Cylindrical magnet; 42-Ring magnet; 43-Rotating platform; 44-Main connector; 45-Rotating ring; 46-Magnetic resisting sheet; 5-Energy unit; 51-Power supply base; 52-Connecting rod; 6-Target holder unit; 61-Clamping stage; 62-Connector; 63-Clamping arm ring; 64-Clamping arm; 65-Second hinge pin; 7-Coordination unit; 71-First transmission wheel; 72-Second transmission wheel; 73-Driven shaft; 74-Reverse gear; 75-Reverse rod; 76-Reverse rod shaft; 8-Main unit. Detailed Implementation

[0019] The specific embodiments of the present invention are described below to enable those skilled in the art to understand the present invention. However, it should be understood that the present invention is not limited to the scope of the specific embodiments. For those skilled in the art, various changes are obvious as long as they are within the spirit and scope of the present invention as defined and determined by the appended claims. All inventions utilizing the concept of the present invention are protected.

[0020] Example 1: A specific embodiment of the present invention provides a vacuum sputtering coating method (hereinafter referred to as the coating method), comprising the following steps: Step 1: Device initialization; Place the target part to be coated on the target holder; The target material is held by the target material holder unit 6, and the specifications of the target material are transmitted to the magnetic control unit 4 by the coordination unit 7. The magnetic control unit 4 is used to adjust the magnetic field range synchronously. Start the controller's first timer to collect and display the cavity vacuum data in real time during the first cycle T1. The mechanical pump and solenoid valve are both in the closed state. Step 2: Evacuate air; In response to a manual start command, the controller activates the mechanical pump and starts the second timer to accumulate the pumping time in the second cycle T2; the first timer continues to run, and the vacuum sensor continuously monitors the vacuum level.

[0021] Step 3: Transition trigger determination; If the vacuum sensor detects that the vacuum degree V satisfies V<V_set+ΔV1, where V_set is the vacuum degree set value and ΔV1 is the set first threshold, then proceed to step 4. If the vacuum sensor detects that the vacuum level V does not satisfy V < V_set + ΔV1, proceed to step 2. Step 4: Prepare the high-voltage power supply parameters; Set the delay flag; The controller reads the preset power parameters of the high-voltage power supply; Stop the first timer; Start the controller's third timer; Step 5: Delay voltage regulation; In response to the delay flag, a second timer is used to count the delays. When the accumulated delay reaches the preset duration T_delay: Clear the delay flag; Turn on the high-voltage power supply to trigger ignition; Start the fourth timer to begin coating timing; Step 6: Coating; The following adjustment process is executed cyclically with the set period T3 of the third timer: Read the current flow parameters of the flow meter; Read the real-time vacuum level from the vacuum sensor; The flow rate set by the flow meter is adjusted according to the vacuum deviation using hysteresis control: When V < V_set + ΔV2, the flow rate of the flow meter increases by one step. When V > V_set + ΔV3 and the current flow rate is greater than the lower threshold, the flow rate of the flow meter decreases by one step; ΔV2 is the set second threshold, and ΔV3 is the set third threshold. Read and output the operating parameters of the high-voltage power supply; Step 7: Shutdown When the cumulative coating time of the fourth timer reaches the preset total time T_run, the following steps are executed sequentially: Turn off the high-voltage power supply; Turn off the mechanical pump; The flow meter reading is reset to zero. Reset all flags and timers; Restart the first timer and return to standby mode.

[0022] Compared with the prior art, the coating method of this embodiment uses the cooperative unit 7 to transmit the specifications of the target material to the magnetic control unit 4, and uses the magnetic control unit 4 to synchronously adjust the magnetic field range, thereby achieving the matching adjustment of the magnetic field range with the target material specifications and improving the ease of operation of the coating method of this embodiment.

[0023] Example 2: To address the problem of poor process control due to the inability to adjust the magnetic field coverage according to process requirements, another specific embodiment of the present invention, such as... Figure 2 As shown, a vacuum sputtering coating apparatus (hereinafter referred to as the coating apparatus) for implementing the coating method of Embodiment 1 includes a housing 1 and an ion generating mechanism disposed on the housing 1. The ion generating mechanism is used to perform vacuum sputtering coating on a target part inside the housing 1.

[0024] Specifically, such as Figure 3 As shown, the ion generation mechanism includes an emitter 2, a support unit 3, and a magnetization control unit 4. The emitter 2 is connected to the machine unit 8 through the support unit 3. The magnetization control unit 4 is mounted on the emitter 2 and is used to provide the magnetic field environment required for magnetron sputtering.

[0025] Preferred, such as Figure 3 and Figure 4As shown, a magnetic control groove is provided on the end face of the launcher 2 to accommodate the magnetic control unit 4. The magnetic control unit 4 includes a cylindrical magnet 41 and a ring magnet 42, which are concentrically arranged to form a uniform magnetic field distribution. The N pole of the cylindrical magnet 41 faces upward, and the S pole of the ring magnet 42 faces upward. Compared with the conventional single-magnet magnetic control unit 4, the combined magnetic field layout formed by the cylindrical magnet 41 and the ring magnet 42 in this embodiment can form a stable confinement magnetic field, improve the plasma confinement effect and sputtering uniformity, and result in more stable film quality. The magnetic field strength of the magnetic control unit 4 is 15-25 mT, preferably 20 mT. The outer diameter of the ring magnet 42 is 9 cm, and the diameter of the cylindrical magnet 41 is 4 cm. The height of both the cylindrical magnet 41 and the ring magnet 42 is 5 cm.

[0026] To solve the problem of the inability to adjust the coverage range of the magnetic field, such as Figure 4 As shown, the magnetic control unit 4 also includes a shielding component, which is disposed on the launcher 2 and is used to adjust the range of the radial action area of ​​the magnetic field.

[0027] Specifically, such as Figure 5 As shown, the shielding assembly includes a rotating platform 43, main connectors 44, a rotating ring 45, and magnetic blocking plates 46. The rotating platform 43 is connected to the bottom end of the launcher 2 via the main connectors 44. Multiple main connectors 44 are evenly distributed around the circumference of the rotating platform 43 and are used to limit the rotation of the ring 45, keeping the ring 45 concentric with the rotating platform 43, so that the ring 45 can only rotate around the axis of the rotating platform 43. The magnetic blocking plates 46 are used to shield magnetic lines of force. Multiple magnetic blocking plates 46 are provided, and the multiple magnetic blocking plates 46 are evenly distributed around the circumference of the rotating ring 45. Adjacent magnetic blocking plates 46 can overlap, and the multiple magnetic blocking plates 46 form a shielding ring. The center of the shielding ring is a central hole. The shielding ring is used to cut off magnetic lines of force, and the central hole is used to expose the target area, so that the magnetic field only acts on that area. One end of the magnetic blocking plate 46 is rotatably connected to the rotating platform 43 via a first hinge pin. This end is the rotating end, and the other end is the free end. The outer circumferential surface of the rotating end is arc-shaped and concentric with the first hinge pin. Multiple end teeth are provided on the outer circumferential surface of the rotating end, and a first inner drive tooth that mates with the end teeth is provided on the inner circumferential surface of the rotating ring 45. When the rotating ring 45 rotates, the meshing of the first inner drive tooth with the end teeth drives each magnetic resistive sheet 46 to rotate around its respective first hinge pin, thereby changing the radial position of the free end of the magnetic resistive sheet 46 and the cross-sectional area of ​​the central hole. This allows for adjustment of the magnetic field coverage area, enabling control of the magnetic field's effective region and improving the process controllability of magnetron sputtering.

[0028] Preferably, such as Figure 3As shown, the support unit 3 includes a support column 31 and a crossbeam 32. The support column 31 is mounted on the main unit 8, and the crossbeam 32 is hinged to the end of the support column 31. The top of the launcher 2 is connected to the crossbeam 32. Through the hinged connection between the support column 31 and the crossbeam 32, the launcher 2 can be flexibly switched between horizontal and vertical orientations, facilitating the installation and removal of the target material.

[0029] Furthermore, to address the issue of unstable power supply to the target material, the ion generation mechanism also includes an energy unit 5, which is mounted on the launcher 2. For example... Figure 6 As shown, the energy unit 5 includes a power supply base 51, a connecting rod 52, and a connecting rod spring (not shown in the figure). The power supply base 51 is fixedly mounted on the launch base 2. The connecting rod 52 is slidably mounted in the power supply slot of the power supply base 51. One end of the connecting rod spring is connected to the power supply slot, and the other end of the connecting rod spring abuts against the connecting rod 52. The connecting rod spring provides elastic thrust to the connecting rod 52, ensuring that the connecting rod 52 remains connected to the power supply base 51 at all times. The power supply base 51 can be connected to a power cord, and the end of the connecting rod 52 is used to connect to a target or conductive component. The fact that the connecting rod 52 remains connected to the power supply base 51 at all times improves the stability and reliability of the power supply connection.

[0030] Furthermore, in order to address the problem that ion generation mechanisms cannot be applied to various target materials and have poor versatility, such as... Figure 4 As shown, the ion generation mechanism also includes a target holder unit 6, which is disposed on the emitter 2 and is used to fix the target.

[0031] Specifically, such as Figure 5 As shown, the target holder unit 6 includes a clamping platform 61, connecting members 62, clamping arm rings 63, and clamping arms 64. The clamping platform 61 is connected to the bottom end of the rotating platform 43 via the connecting members 62. Multiple connecting members 62 are evenly distributed around the circumference of the clamping platform 61 and are used to limit the clamping arm rings 63, keeping them concentric with the clamping platform 61 and allowing them to rotate only around the axis of the clamping platform 61. The clamping arms 64 are used to clamp the target material. Multiple clamping arms 64 are provided and are evenly arranged around the circumference of the clamping platform 61.

[0032] Preferably, the target holder unit 6 further includes a second hinge pin 65, which is fixedly mounted on the clamping platform 61. One end of the clamping arm 64 is rotatably connected to the second hinge pin 65; this end is the rotating end, and the other end is the free end. The outer circumferential surface of the rotating end of the clamping arm 64 is arc-shaped and concentric with the second hinge pin 65. Multiple clamping arm teeth are provided on the outer circumferential surface of the rotating end of the clamping arm 64, and a second inner drive tooth that mates with the clamping arm teeth is provided on the inner circumferential surface of the clamping arm ring 63. Rotation of the clamping arm ring 63 simultaneously drives each clamping arm 64 to rotate around its respective second hinge pin 65, thereby changing the radial position of the free end of the clamping arm 64. This allows for adjustment of the clamping coverage area of ​​the target material, making it suitable for various target specifications and highly versatile.

[0033] Preferably, the free end of the clamping arm 64 is provided with a clamping groove, which is used to accommodate the edge of the target material and improve the clamping stability of the target material.

[0034] The magnetic field range is typically positively correlated with the target diameter. Furthermore, to address the problem of cumbersome operation and difficulty in maintaining synchronization when adjusting the shielding assembly and target holder unit 6 separately, such as... Figure 6 As shown, the ion generation mechanism in this embodiment also includes a coordination unit 7, which is used to realize the linkage adjustment between the shielding component and the target holder unit 6, simplifying the operation.

[0035] Specifically, such as Figure 4 and Figure 5 As shown, the coordinating unit 7 includes a first transmission wheel 71, a second transmission wheel 72, and a driven shaft 73. The two ends of the driven shaft 73 are fixedly connected to the first transmission wheel 71 and the second transmission wheel 72, respectively, and the driven shaft 73 passes through the rotating platform 43, allowing it to rotate around its axis on the rotating platform 43. The outer circumferential surface of the clamping arm ring 63 is provided with external drive teeth that cooperate with the first transmission wheel 71, and the outer circumferential surface of the rotating ring 45 is provided with external drive teeth that cooperate with the second transmission wheel 72. When the clamping arm ring 63 rotates, it drives the first transmission wheel 71 to rotate via the external drive teeth, which in turn drives the second transmission wheel 72 to rotate via the driven shaft 73. The second transmission wheel 72 then drives the rotating ring 45 to rotate, thereby achieving synchronous linkage adjustment between the shielding component and the target material holder unit 6. Through the aforementioned gear transmission, synchronous linkage between the shielding component and the target material holder unit 6 is achieved, enabling the matching adjustment of the magnetic field range with the target material specifications, thus improving the ease of operation and process stability of the coating apparatus in this embodiment.

[0036] Furthermore, regarding the issue that the clamping arm ring 63 might rotate in the opposite direction, causing the target material to fall off, preferably, as follows: Figure 4 As shown, the coordinating unit 7 also includes an anti-rotation component, which is used to limit the reverse rotation of the clamping arm ring 63, prevent the clamping arm 64 from radially separating due to reverse rotation, and prevent the target material from falling off due to clamping failure.

[0037] Specifically, such as Figure 7 As shown, the anti-rotation assembly includes a backstop gear 74, a backstop rod 75, and a backstop rod shaft 76. The backstop gear 74 is fixedly connected to the driven shaft 73. The backstop rod shaft 76 is mounted on the rotating platform 43. The middle part of the backstop rod 75 is rotatably connected to the backstop rod shaft 76. One end of the backstop rod 75 has a stop portion that mates with the tooth surface of the backstop gear 74, and the other end of the backstop rod 75 is a free end. The stop portion always abuts against the tooth surface of the backstop gear 74. When the clamping arm ring 63 rotates in the forward direction, the stop portion of the backstop rod 75 can slide on the tooth surface of the backstop gear 74; when the clamping arm ring 63 rotates in the reverse direction, the stop portion can engage with the tooth groove of the backstop gear 74, thereby locking the driven shaft 73 and preventing the clamping arm ring 63 from rotating in the reverse direction.

[0038] Preferably, the anti-rotation assembly further includes an anti-rotation spring (not shown in the figure), which is sleeved on the anti-reverse rod shaft 76 and is used to apply elastic force to the anti-reverse rod 75 so that the stop part remains in contact with the anti-reverse gear 74.

[0039] Preferably, such as Figure 2 As shown, the coating apparatus of this embodiment also includes a base unit 8, which includes a target, a mechanical pump, a vacuum sensor, a flow meter, a solenoid valve, and a controller. The target is disposed inside the enclosure 1, and the mechanical pump, solenoid valve, flow meter, and vacuum sensor are all electrically connected to the controller.

[0040] Compared to existing technologies, in this embodiment, the adjacent magnetic blocking sheets 46 of the magnetic control unit 4 of the coating apparatus can overlap, and multiple magnetic blocking sheets 46 form a shielding ring. The center of the shielding ring is a central hole. The shielding ring is used to cut off magnetic lines of force, and the central hole is used to expose the target area, so that the magnetic field only acts on that area. The rotating ring 45 rotates, and through the meshing transmission of the first inner drive tooth and the end tooth, it simultaneously drives each magnetic blocking sheet 46 to rotate around its respective first hinge pin, thereby changing the radial position of the free end of the magnetic blocking sheet 46 and the cross-sectional area of ​​the central hole, thereby adjusting the coverage range of the magnetic field and realizing the magnetic field action area. The controllability of the field improves the process controllability of magnetron sputtering; the power supply base 51 of the coating device in this embodiment can be connected to the power line, and the end of the connecting rod 52 is used to connect to the target or conductive parts. The connecting rod 52 is always connected to the power supply base 51, improving the stability and reliability of the power supply connection; the rotation of the clamping arm ring 63 of the coating device in this embodiment can simultaneously drive each clamping arm 64 to rotate around its respective second hinge pin 65, thereby changing the radial position of the free end of the clamping arm 64, and thus adjusting the clamping coverage of the target. It can be applied to various specifications of target materials and has strong versatility.

[0041] In this embodiment, the clamping arm ring 63 of the target holder unit 6 rotates, and the outer drive teeth of the clamping arm ring 63 drive the first transmission wheel 71 to rotate, which in turn drives the second transmission wheel 72 to rotate via the driven shaft 73. The second transmission wheel 72 drives the rotating ring 45 to rotate, thereby realizing the synchronous linkage adjustment between the shielding component and the target holder unit 6. Through the above-mentioned gear transmission, the synchronous linkage between the shielding component and the target holder unit 6 is realized, and the matching adjustment between the magnetic field range and the target specifications is achieved, improving the ease of operation and process stability of the coating device in this embodiment. The stop part of the anti-reverse rod 75 always abuts against the tooth surface of the anti-reverse gear 74. When the clamping arm ring 63 rotates in the forward direction, the stop part of the anti-reverse rod 75 can slide on the tooth surface of the anti-reverse gear 74; when the clamping arm ring 63 rotates in the reverse direction, the stop part can be engaged in the tooth groove of the anti-reverse gear 74, thereby locking the driven shaft 73 and preventing the clamping arm ring 63 from rotating in the reverse direction.

[0042] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A vacuum sputtering coating method, characterized in that, Includes the following steps: Step A: Device initialization; Step B: Evacuate air; Step C: Prepare the high-voltage power supply parameters; Step D: Coating; Step E: Shut down the machine.

2. The vacuum sputtering coating method according to claim 1, characterized in that, Step A includes: clamping the target material.

3. The vacuum sputtering coating method according to claim 2, characterized in that, Step A further includes: starting the controller's first timer, collecting and displaying the cavity vacuum data in real time at the first cycle T1, while the mechanical pump and solenoid valve are both in the closed state.

4. The vacuum sputtering coating method according to claim 3, characterized in that, Step B includes: the controller turns on the mechanical pump and starts the second timer to accumulate the pumping time in the second period T2.

5. The vacuum sputtering coating method according to claim 4, characterized in that, Step B further includes: keeping the first timer running and the vacuum sensor continuously monitoring the vacuum level.

6. The vacuum sputtering coating method according to claim 1, characterized in that, The step preceding step C is: transition trigger determination.

7. The vacuum sputtering coating method according to claim 6, characterized in that, The transition trigger determination includes: if the vacuum sensor detects that the vacuum degree V does not meet the condition V<V_set+ΔV1, where ΔV1 is the set first threshold, then step B is executed.

8. The vacuum sputtering coating method according to claim 7, characterized in that, The transition trigger determination further includes: if the vacuum sensor detects that the vacuum degree V satisfies V<V_set+ΔV1, where V_set is the vacuum degree set value, then step C is executed.

9. The vacuum sputtering coating method according to claim 1, characterized in that, The step prior to step D is a delay voltage regulation step.

10. The vacuum sputtering coating method according to claim 1, characterized in that, A vacuum sputtering coating apparatus is used to coat a target part.

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