Solid state transformer wafer electrophoresis tooling fixture

Abstract

The present application belongs to the technical field of electrophoresis tool clamps, and particularly relates to a solid-state transformer wafer electrophoresis tool clamp, which comprises an insulating mounting cylinder, the upper surface of the insulating mounting cylinder is provided with a fixed through hole, and the hole wall of the fixed through hole is fixedly connected with a conductive rod. In the solid-state transformer wafer electrophoresis operation process, the present application adopts a gas pressure linkage flexible clamping structure to replace the traditional rigid chuck hard connection, effectively avoids the edge collapse, fragmentation and scratches of the solid-state transformer wafer in the clamping and electrophoresis process, guarantees the stability of the electrophoresis current density through the multi-point uniform conduction design, solves the problems of uneven electrophoresis weight gain and poor passivation layer consistency, greatly reduces the frequency of the solid-state transformer wafer alone taking and placing and transferring by cooperating with the overall transfer mode, reduces the risk of bump damage from the source, and ensures the clamping safety and reliability relying on the gas pressure closed-loop automatic control, and significantly improves the qualified rate, batch consistency and production efficiency of the solid-state transformer wafer electrophoresis processing.

Description

Technical Field

[0001] This invention belongs to the field of electrophoresis tooling and fixture technology, and in particular relates to a solid-state transformer wafer electrophoresis tooling and fixture. Background Technology

[0002] Solid-state transformer wafers are the core power devices of solid-state transformers. Essentially, they are high-voltage, high-power circular silicon wafers. The insulation and protection effect of their internal PN junction structure directly determines the withstand voltage rating, switching losses, and long-term operational reliability of the solid-state transformer. Therefore, GPP (Glass Propagation) passivation treatment is essential. GPP passivation processes are mainly divided into three types: the surgical method, the photoresist glass method, and the electrophoresis method. The electrophoresis method involves making glass powder conductive, which then migrates directionally to the PN junction trenches of the solid-state transformer wafer under the influence of an electric field. After high-temperature sintering, a glass passivation film protecting the PN junction is formed. Due to its high deposition precision and good batch consistency, it has become the core passivation method for the large-scale production of solid-state transformer wafers. During electrophoresis, precise positioning and stable clamping of the solid-state transformer wafer are required using tooling fixtures to ensure good electrode contact and stable electrode spacing, thereby ensuring uniform current density, avoiding instability caused by electrophoretic weight gain, and guaranteeing passivation quality.

[0003] Currently available solid-state transformer wafer electrophoresis fixtures still have many defects and cannot meet production needs. Solid-state transformer wafers are made of monocrystalline silicon, which has low structural strength and is extremely brittle. Most existing fixtures use rigid metal chucks to connect the solid-state transformer wafers directly, without any flexible buffer structure. During the electrophoresis process, the solid-state transformer wafers are easily squeezed by the continuous scouring of the electrophoresis liquid, which can cause edge chipping, surface scratches, and even internal cracks, directly leading to wafer damage. This not only affects the pass rate of solid-state transformer wafer electrophoresis but also the reliability of the fixtures. In addition, most existing fixtures are single-wafer independent limiting structures. After electrophoresis, the solid-state transformer wafers need to be manually removed from the fixtures and transported to the inspection station. After passing the inspection, they are then transported to the heating and curing station for sintering. This frequent handling process easily causes the solid-state transformer wafers to be bumped and damaged, further reducing the pass rate of solid-state transformer wafer electrophoresis and significantly increasing the operation process, resulting in low electrophoresis efficiency.

[0004] To address these issues, we propose a solid-state transformer wafer electrophoresis fixture. Summary of the Invention

[0005] The purpose of this invention is to address the above-mentioned problems by providing a solid-state transformer wafer electrophoresis fixture.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a solid-state transformer wafer electrophoresis fixture, comprising an insulating mounting cylinder, wherein a fixed through hole is formed on the upper surface of the insulating mounting cylinder, and a conductive rod is fixedly connected to the wall of the fixed through hole, and a conductive connecting ring is fixedly connected to the top end of the conductive rod; four stepped through holes are uniformly formed on the wall of the insulating mounting cylinder, and an insulating sleeve is inserted into the wall of the four stepped through holes; a limit mechanism is fixedly sleeved on the outer wall of the insulating sleeve.

[0007] A receiving protrusion is fixedly sleeved on the side of the insulating sleeve away from the insulating mounting cylinder. A conductive rubber expansion ring is fixedly connected to the inner surface of the receiving protrusion. A conductive mechanism for electrical connection between the conductive rubber expansion ring and the conductive rod is fixedly connected to the inner wall of the insulating sleeve.

[0008] Multiple wafer positioning mechanisms are fixedly connected to the top outer wall of the receiving protrusion ring;

[0009] An automatic control mechanism is fixedly connected to the inner wall of the insulating mounting cylinder;

[0010] The upper surface of the insulating mounting cylinder is fixedly connected to a fixing ring, and the upper surface of the fixing ring is provided with multiple fixing holes.

[0011] In the above-mentioned solid-state transformer wafer electrophoresis fixture, the conductive rod is fixedly sleeved with a first insulating plate and a second insulating plate, and the upper surface of the second insulating plate is provided with a plurality of vent holes.

[0012] In the aforementioned solid-state transformer wafer electrophoresis fixture, the limiting mechanism includes a limiting protrusion ring fixedly connected to the outer wall of the insulating sleeve. Two elastic clips are movably engaged with the outer wall of the limiting protrusion ring. An arc-shaped insulating partition is fixedly connected to the side of each elastic clip away from the limiting protrusion ring. The side wall of the arc-shaped insulating partition is fixedly connected to the outer wall of the insulating mounting cylinder.

[0013] In the aforementioned solid-state transformer wafer electrophoresis fixture, the conductive mechanism includes a conductive connecting rod fixedly connected to the inner wall of the insulating sleeve. One end of the conductive connecting rod is fixedly connected to the inner wall of the conductive rubber expansion ring, and the other end of the conductive connecting rod is fixedly connected to a conductive rubber block. The outer wall of the conductive rubber block is in close contact with the rod wall of the conductive rod.

[0014] In the aforementioned solid-state transformer wafer electrophoresis fixture, the wafer positioning mechanism includes a hollow cylinder fixedly connected to the outer wall of a receiving convex ring. A conductive extension rod is fixedly connected to the inner wall of the hollow cylinder. A conductive cylinder is movably sleeved on the rod wall of the conductive extension rod. A conductive rubber expansion sleeve is fixedly sleeved on the outer wall of the conductive cylinder. A rubber ring is fixedly sleeved on the outer wall of the conductive cylinder. The outer wall of the rubber ring is slidably and sealingly connected to the inner wall of the hollow cylinder. An arc-shaped tube is fixedly connected to the outer wall of the hollow cylinder. The outer end of the arc-shaped tube passes through the inner wall of the receiving convex ring and is located in the inner cavity of the conductive rubber expansion ring. An arc-shaped conductive sheet is fixedly connected to the side end of the conductive extension rod. The outer end of the arc-shaped conductive sheet passes through the inner wall of the receiving convex ring and is fixedly connected to the inner wall of the conductive rubber expansion ring.

[0015] In the above-mentioned solid-state transformer wafer electrophoresis fixture, a return spring is movably sleeved on the outer wall of the conductive cylinder, and the two ends of the return spring are fixedly connected to the outer wall of the rubber ring and the inner wall of the hollow cylinder, respectively.

[0016] In the above-mentioned solid-state transformer wafer electrophoresis fixture, a sealing ring is fixedly sleeved on the outer wall of the insulating sleeve, and the outer wall of the sealing ring is in sealing contact with the inner wall of the stepped through hole on the upper wall of the insulating mounting cylinder.

[0017] In the aforementioned solid-state transformer wafer electrophoresis fixture, the automatic control mechanism includes a PLC controller and a micro electric push rod fixedly connected to the inner wall of the insulating mounting cylinder. The micro electric push rod is located at the bottom end of the insulating mounting cylinder, and a rubber piston block is fixedly connected to the moving end of the micro electric push rod. The rubber sidewall of the rubber piston block is sealed and movably connected to the inner wall of the insulating mounting cylinder. A fixed through hole and a wire hole are opened on the upper surface of the first insulating plate, and a pressure sensor is fixedly connected to the wall of the fixed through hole.

[0018] Compared with existing technologies, the advantages of a solid-state transformer wafer electrophoresis fixture are:

[0019] 1. Through the design of an insulating sleeve, a receiving convex ring, a conductive rubber expansion ring, a wafer positioning mechanism, and a miniature electric push rod, when clamping and electrophoretic processing of solid-state transformer wafers, the miniature electric push rod drives the rubber piston block to move and pressurize. Airflow enters the conductive rubber expansion ring through the insulating sleeve, causing it to expand uniformly. At the same time, the airflow is delivered to the hollow cylinder through the arc-shaped tube, pushing the conductive cylinder to extend against the spring force of the return spring. The conductive rubber expansion sleeve flexibly presses against the edge of the wafer, forming a multi-point encircling flexible clamping structure in conjunction with the conductive rubber expansion ring. This structure works in synergy to replace the traditional rigid metal clamping method of hard connection between the wafer and the wafer, effectively buffering the impact force generated by the continuous scouring of the electrophoretic liquid. It solves the problems of edge chipping, surface scratches, internal breakage, and clamping displacement of solid-state transformer wafers caused by rigid clamping and liquid flow extrusion impact. It can stably limit the brittle single-crystal silicon solid-state transformer wafer, avoid wafer processing damage, significantly improve the safety and stability of solid-state transformer wafer clamping, and provide a reliable clamping foundation for electrophoresis operations.

[0020] 2. Through the technical features of the conductive rod, conductive connecting ring, conductive mechanism, wafer positioning mechanism, and conductive rubber expansion ring, when the electrophoresis circuit is turned on, the current is sequentially conducted through the conductive connecting ring, conductive rod, conductive rubber block, and conductive connecting rod to the conductive rubber expansion ring, realizing the main conductive path of the solid-state transformer wafer edge. At the same time, the current forms an auxiliary conductive path through the arc-shaped conductive sheet, conductive extension rod, conductive cylinder, and conductive rubber expansion sleeve. The dual paths work together to achieve uniform conductivity at multiple points on the wafer edge. The coordinated work of each conductive component effectively solves the core problems of poor electrode contact, unstable electrode spacing leading to current density fluctuations, and uneven electrophoresis weight gain in traditional fixtures. This makes the entire wafer form a cathode with uniform potential, ensuring that the glass powder in the electrophoresis solution is deposited uniformly and directionally in the PN junction trench, improving the thickness uniformity and quality stability of the glass passivation film, and ensuring the device performance and passivation processing quality of the solid-state transformer wafer.

[0021] 3. Through the setting of limiting protrusion rings, limiting mechanisms, automatic control mechanisms, and insulating mounting cylinders, when multi-wafer synchronous electrophoresis and process transfer operations are carried out, the arc-shaped insulating partition blocks the superposition of electric fields and edge distortion of adjacent solid-state transformer wafers, reducing mutual interference of electric fields. The air pressure sensor collects the internal air pressure data in real time and transmits it to the PLC controller to realize closed-loop control of the solid-state transformer wafer clamping force. After the limiting mechanism is released, the insulating sleeve can drive the solid-state transformer wafer to the inspection station as a whole, reducing the number of solid-state transformer wafer picking and placing steps. This combined structure works in concert to solve the problems of uneven electric fields in the same tank electrophoresis of multiple solid-state transformer wafers, uncontrollable clamping force that easily crushes wafers, frequent picking and placing and transferring leading to wafer collision damage, and low processing efficiency. It not only ensures the consistency of electrophoretic deposition of multiple solid-state transformer wafers, but also accurately controls the clamping pressure, reduces the process flow loss of solid-state transformer wafers, simplifies the operation process, and significantly improves the pass rate, batch consistency, and large-scale production efficiency of solid-state transformer wafer electrophoresis processing. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a solid-state transformer wafer electrophoresis fixture provided by the present invention;

[0023] Figure 2 This is a partial top view of the structure of a solid-state transformer wafer electrophoresis fixture provided by the present invention;

[0024] Figure 3 This is the present invention. Figure 2 A partially enlarged structural diagram;

[0025] Figure 4 This is a cross-sectional structural schematic diagram of the receiving convex ring portion in a solid-state transformer wafer electrophoresis fixture provided by the present invention;

[0026] Figure 5 This is the present invention. Figure 3 Enlarged structural diagram of section A;

[0027] Figure 6 This is a three-dimensional structural diagram of the conductive mechanism in a solid-state transformer wafer electrophoresis fixture provided by the present invention.

[0028] In the diagram: 1 Insulating mounting cylinder, 2 Conductive rod, 3 Conductive connecting ring, 4 Insulating sleeve, 5 Limiting mechanism, 51 Limiting convex ring, 52 Elastic card, 53 Arc-shaped insulating partition, 6 Conductive mechanism, 61 Conductive connecting rod, 62 Conductive rubber block, 7 Wafer positioning mechanism, 71 Hollow cylinder, 72 Conductive extension rod, 73 Conductive cylinder, 74 Conductive rubber expansion sleeve, 75 Rubber ring, 76 Arc-shaped tube, 77 Arc-shaped conductive sheet, 8 Automatic control mechanism, 81 PLC controller, 82 Miniature electric push rod, 83 Rubber piston block, 84 Wire hole, 85 Pressure sensor, 9 Fixing ring, 10 Receiving convex ring, 11 Conductive rubber expansion ring, 12 Fixing round hole, 13 First insulating plate, 14 Second insulating plate, 15 Vent hole, 16 Return spring, 17 Sealing ring. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] like Figures 1-6 As shown, a solid-state transformer wafer electrophoresis fixture includes an insulating mounting cylinder 1. A fixed through hole is formed on the upper surface of the insulating mounting cylinder 1, and a conductive rod 2 is fixedly connected to the wall of the fixed through hole. A conductive connecting ring 3 is fixedly connected to the top of the conductive rod 2. Four stepped through holes are evenly formed on the wall of the insulating mounting cylinder 1, and an insulating sleeve 4 is inserted into the wall of each of the four stepped through holes. A limiting mechanism 5 is fixedly fitted onto the outer wall of the insulating sleeve 4. The limiting mechanism 5 includes a limiting protrusion ring 51 fixedly connected to the outer wall of the insulating sleeve 4. Two elastic cards 52 are movably engaged on the outer wall of the limiting protrusion ring 51. An arc-shaped insulating partition 53 is fixedly connected to the side of each elastic card 52 away from the limiting protrusion ring 51. The side wall of the arc-shaped insulating partition 53 is fixedly connected to the outer wall of the insulating mounting cylinder 1.

[0031] An insulating sleeve 4 is fixedly fitted with a receiving protrusion ring 10 on the side away from the insulating mounting cylinder 1. A conductive rubber expansion ring 11 is fixedly connected to the inner surface of the receiving protrusion ring 10. A conductive mechanism 6 for electrical connection between the conductive rubber expansion ring 11 and the conductive rod 2 is fixedly connected to the inner wall of the insulating sleeve 4. The conductive mechanism 6 includes a conductive connecting rod 61 fixedly connected to the inner wall of the insulating sleeve 4. One end of the conductive connecting rod 61 is fixedly connected to the inner wall of the conductive rubber expansion ring 11, and the other end of the conductive connecting rod 61 is fixedly connected to a conductive rubber block 62. The outer wall of the conductive rubber block 62 is in close contact with the rod wall of the conductive rod 2.

[0032] Multiple wafer positioning mechanisms 7 are fixedly connected to the top outer wall of the receiving protrusion ring 10. Each wafer positioning mechanism 7 includes a hollow cylinder 71 fixedly connected to the outer wall of the receiving protrusion ring 10. A conductive extension rod 72 is fixedly connected to the inner wall of the hollow cylinder 71. A conductive cylinder 73 is movably sleeved on the rod wall of the conductive extension rod 72. A conductive rubber expansion sleeve 74 is fixedly sleeved on the outer wall of the conductive cylinder 73. A rubber ring 75 is fixedly sleeved on the outer wall of the conductive cylinder 73. The outer wall of the rubber ring 75 is slidably and sealed to the inner wall of the hollow cylinder 71. An arc-shaped tube 76 is fixedly connected to the outer wall of the hollow cylinder 71. The outer end of the arc-shaped tube 76 passes through the inner wall of the receiving protrusion ring 10 and is located in the inner cavity of the conductive rubber expansion ring 11. An arc-shaped conductive sheet 77 is fixedly connected to the side end of the conductive extension rod 72. The outer end of the arc-shaped conductive sheet 77 passes through the inner wall of the receiving protrusion ring 10 and is fixedly connected to the inner wall of the conductive rubber expansion ring 11.

[0033] Both the conductive rubber expansion ring 11 and the conductive rubber expansion sleeve 74 are integrally molded from conductive elastic silicone rubber. This material uses methyl vinyl silicone rubber as the elastic matrix, uniformly doped with conductive carbon black and flake graphite to form a conductive filler network, and is vulcanized with reinforcing agents, vulcanizing agents and anti-aging additives. Relying on the high elastic deformation characteristics of the silicone rubber matrix, the conductive rubber expansion ring 11 and the conductive rubber expansion sleeve 74 expand uniformly under air pressure. After depressurization, they automatically reset due to their own elasticity, realizing flexible clamping of the solid-state transformer wafer. The conductive fillers inside the silicone rubber matrix overlap to form a continuous three-dimensional conductive path. During the expansion deformation process, the conductive network remains intact, and the conductivity is stable and reliable, working together to achieve multi-point uniform conductivity at the wafer edge.

[0034] A return spring 16 is movably sleeved on the outer wall of the conductive cylinder 73. The two ends of the return spring 16 are fixedly connected to the outer wall of the rubber ring 75 and the inner wall of the hollow cylinder 71, respectively. A sealing ring 17 is fixedly sleeved on the outer wall of the insulating sleeve 4. The outer wall of the sealing ring 17 is in sealing contact with the inner wall of the stepped through hole on the upper wall of the insulating mounting cylinder 1. A fixing ring 9 is fixedly connected to the upper surface of the insulating mounting cylinder 1, and multiple fixing round holes 12 are opened on the upper surface of the fixing ring 9.

[0035] An automatic control mechanism 8 is fixedly connected to the inner wall of the insulating mounting cylinder 1. The first insulating plate 13 and the second insulating plate 14 are fixedly sleeved on the rod wall of the conductive rod 2. Multiple ventilation holes 15 are opened on the upper surface of the second insulating plate 14.

[0036] The automatic control mechanism 8 includes a PLC controller 81 and a miniature electric push rod 82 fixedly connected to the inner wall of the insulating mounting cylinder 1. The miniature electric push rod 82 is located at the bottom end of the insulating mounting cylinder 1. A rubber piston block 83 is fixedly connected to the moving end of the miniature electric push rod 82. The rubber sidewall of the rubber piston block 83 is sealed and movably connected to the inner wall of the insulating mounting cylinder 1. A fixed through hole and a wire hole 84 are opened on the upper surface of the first insulating plate 13, and a pressure sensor 85 is fixedly connected to the wall of the fixed through hole.

[0037] The miniature electric actuator 82 is electrically connected to the output terminal of the PLC controller 81 via a wire, and the air pressure sensor 85 is electrically connected to the input terminal of the PLC controller 81 via a wire. The electrical components, electrical connections, conductive rubber expansion ring 11 and conductive rubber expansion sleeve 74 mentioned above are all existing technologies and will not be described in detail here.

[0038] The operating principle of this invention is described as follows: Before the solid-state transformer wafer electrophoretic passivation operation begins, the preliminary setup and preparation of the tooling fixtures are completed. The insulating mounting cylinder 1 is fixed to the lifting mechanism of the electrophoresis tank via the fixing ring 9 and fixing hole 12 at the top. Simultaneously, the conductive connecting ring 3 at the top of the conductive rod 2 is reliably connected to the negative electrode (cathode) of the DC electrophoresis power supply. The platinum-iridium alloy inert anode plate in the electrophoresis tank is correspondingly connected to the positive electrode (anode) of the DC electrophoresis power supply, forming a complete electrophoresis electric field circuit. According to the requirements of the present invention... The specifications and thickness of the solid-state transformer wafer are preset in the PLC controller 81, along with the corresponding safe clamping air pressure threshold, air pressure fluctuation safety range, and control logic. This completes all preparatory work before the operation, ensuring that the pressure exerted on the solid-state transformer wafer by the conductive rubber expansion sleeve 74 and conductive rubber expansion ring 11 after expansion is within a safe range. This not only stabilizes and limits the solid-state transformer wafer but also prevents damage to it. This setting ensures a stable electric field and reliable conductive path, providing a safe and stable foundation for the synchronous electrophoresis of multiple solid-state transformer wafers.

[0039] Subsequently, the solid-state transformer wafers are clamped and positioned. The solid-state transformer wafers to be processed are placed one by one stably in the inner positioning area of ​​the corresponding receiving ring 10, ensuring that the outer edge of the solid-state transformer wafer precisely aligns with the conductive rubber expansion ring 11 inside the receiving ring 10. Then, the insulating sleeve 4 containing the solid-state transformer wafer is inserted into the stepped through holes evenly spaced on the wall of the insulating mounting cylinder 1. The sealing ring 17 on the outer wall of the insulating sleeve 4 ensures a tight seal at the insertion point. Simultaneously, the limiting mechanism 5 completes the connection between the insulating sleeve 4 and the insulating... The stable locking and fixing of the mounting cylinder 1 is achieved by the engagement of the limiting protrusion 51 on the outer wall of the insulating sleeve 4 with the elastic card 52, which completes the axial limiting of the insulating sleeve 4. At the same time, the arc-shaped insulating partition 53 between adjacent stations is precisely separated between the two sets of solid-state transformer wafers. This step realizes the rapid positioning of solid-state transformer wafers and the synchronous clamping of multiple stations. The arc-shaped insulating partition 53 can reduce the electric field interference between adjacent solid-state transformer wafers, solve the problem of uneven electric field and poor deposition consistency of multiple solid-state transformer wafers in the same tank electrophoresis, and improve the stability of batch products.

[0040] After completing the clamping and station separation of the solid-state transformer wafers at all stations, the lifting mechanism matched with the electrophoresis tank drives the insulating mounting cylinder 1 and multiple groups of clamped solid-state transformer wafers to synchronously and stably immerse into the electrophoresis liquid in the electrophoresis tank, so that all solid-state transformer wafers are completely immersed in the electrophoresis liquid and maintain a preset uniform distance from the anode plate; then the electrophoresis operation is started, the automatic control mechanism 8 is started through the PLC controller 81, and the micro electric push rod 82 is controlled to extend, driving the rubber piston block 83 at the moving end to move upward in a sealing manner along the inner wall of the insulating mounting cylinder 1, compressing the air in the inner cavity of the insulating mounting cylinder 1 to form a pressurized air flow. The pressurized air flow enters the inner cavity of the conductive rubber expansion ring 11 through the inner cavity of the insulating sleeve 4, so that the conductive rubber expansion ring 11 expands synchronously and uniformly. Meanwhile, the pressurized air flow in the inner cavity of the conductive rubber expansion ring 11 synchronously enters the hollow cylinder 71 of the corresponding wafer positioning mechanism 7 through the arc-shaped pipe 76, pushing the rubber ring 75 in the hollow cylinder 71 to slide in a sealing manner along the inner wall, and then driving the conductive cylinder 73 to extend outward against the elastic force of the return spring 16, so that the conductive rubber expansion sleeve 74 at the end of the conductive cylinder 73 flexibly presses against the edge side wall of the solid-state transformer wafer, forming a multi-point encircling flexible clamping in cooperation with the conductive rubber expansion ring 11. This pneumatic linkage structure replaces rigid hard contact and has the ability to buffer the scouring of electrophoresis liquid, solving the problems of edge chipping, fragmentation and scratching easily caused by rigid connection of solid-state transformer wafers, and ensuring stable and non-destructive clamping of solid-state transformer wafers.

[0041] When the clamping is in place, the electrophoresis circuit completes the full-path conduction synchronously. The current from the negative electrode of the DC electrophoresis power supply is stably conducted to the conductive rod 2 through the conductive connecting ring 3, and then stably conducted to the conductive rubber expansion ring 11 through the conductive rubber block 62 and the conductive connecting rod 61 which are in close contact with the rod wall of the conductive rod 2, so as to realize the main circuit conduction at the edge of the solid-state transformer wafer. At the same time, the current is synchronously conducted to the conductive cylinder 73 through the arc-shaped conductive sheet 77 fixedly connected to the inner wall of the conductive rubber expansion ring 11 and the conductive extension rod 72, and finally forms auxiliary conduction through the contact point between the conductive rubber expansion sleeve 74 and the solid-state transformer wafer. Cooperating with the main circuit, it realizes multi-point uniform conduction at the edge of the solid-state transformer wafer, so that the entire solid-state transformer wafer forms a cathode with uniform potential. Under the action of the DC electric field, the negatively charged glass powder particles subjected to conductive treatment in the electrophoresis liquid directionally migrate to the solid-state transformer wafer serving as the cathode, and are accurately and uniformly deposited in the PN junction trenches of the solid-state transformer wafer, completing the electrophoretic deposition operation. This multi-point flexible conductive structure solves the problems of poor contact, unstable electrode spacing and current density fluctuation, so that the glass powder deposition is uniform, the weight gain is stable, and the quality of the passivation layer and the reliability of the device are improved.

[0042] Throughout the electrophoresis process, the arc-shaped insulating partition 53, through the physical isolation of the insulating material, weakens the superposition of electric fields and edge distortion between solid-state transformer wafers at adjacent workstations, reduces the mutual interference of electrophoretic electric fields between adjacent solid-state transformer wafers, and ensures that each solid-state transformer wafer is in a relatively independent and uniform electric field environment. Simultaneously, the air pressure sensor 85 on the first insulating plate 13 collects real-time air pressure data from the inner cavity of the insulating mounting cylinder 1 and transmits the collected real-time air pressure data to the PLC controller 81 via a communication cable. The PLC controller 81 compares the real-time air pressure value with the preset safety clamping air pressure threshold in real time to achieve closed-loop air pressure control: when the real-time air pressure is lower than the preset threshold, the PLC controller 81 controls the miniature electric push rod 8... 2. Continue to extend, increasing the air pressure inside the insulating mounting cylinder 1 to ensure sufficient clamping force and prevent the solid-state transformer wafer from shifting or becoming poorly contacted due to electrophoretic fluid erosion. When the real-time air pressure exceeds the preset threshold, the PLC controller 81 controls the miniature electric push rod 82 to retract, driving the rubber piston block 83 to move downward to release the internal pressure, preventing excessive clamping force from crushing the brittle monocrystalline silicon solid-state transformer wafer. If abnormal air pressure fluctuations are detected that exceed the preset safety range, the PLC controller 81 controls the moving end of the miniature electric push rod 82 to quickly retract and release pressure, reducing the risk of damage to the solid-state transformer wafer. This closed-loop self-control achieves precise and adjustable clamping force, solving the problems of uncontrollable clamping force and easy crushing of solid-state transformer wafers, and improving the safety and adaptability of the tooling operation.

[0043] After the electrophoretic deposition is completed, the circuit connection of the electrophoretic power supply is first disconnected. Then, the electrophoretic liquid is lifted out of the insulating mounting cylinder 1 by the lifting mechanism. After the residual electrophoretic liquid on the surface is drained, the locking limit between the elastic card 52 and the limiting protrusion 51 in the limiting mechanism 5 is released. The insulating sleeve 4 and the insulating mounting cylinder 1 can then be quickly separated. At this time, the solid-state transformer wafer is still stably limited on the receiving protrusion 10. The insulating sleeve 4 and the receiving protrusion 10 can be transferred to the testing station to complete the passivation quality testing. This reduces the need for separate handling and transfer of the solid-state transformer wafer, avoiding the risk of bumps, chipping, and scratches caused by frequent disassembly and transfer. This overall transfer mode solves the problem of repeated disassembly and assembly of the traditional single station, which is prone to bumps and damage to the solid-state transformer wafer. It reduces process flow losses and improves processing efficiency. After the test is qualified, the micro electric push rod 82 is controlled to fully retract and release pressure, so that the conductive rubber expansion ring 11 and the conductive rubber expansion sleeve 74 are fully contracted. The reset spring 16 drives the conductive cylinder 73 to retract and reset.

[0044] After the solid-state transformer wafer passes inspection, the solid-state transformer wafer, which is limited on the receiving convex ring 10, is transferred to the heating and curing station to complete the subsequent high-temperature sintering and curing operation, so that the glass powder deposited in the trench of the solid-state transformer wafer melts and solidifies to form a glass passivation film that protects the PN junction.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A solid-state transformer wafer electrophoresis fixture, comprising an insulating mounting cylinder (1), characterized in that, The upper surface of the insulating mounting cylinder (1) is provided with a fixed through hole, and a conductive rod (2) is fixedly connected to the hole wall of the fixed through hole. A conductive connecting ring (3) is fixedly connected to the top of the conductive rod (2). The cylinder wall of the insulating mounting cylinder (1) is provided with four stepped through holes evenly. An insulating sleeve (4) is inserted into the hole wall of the four stepped through holes. A limit mechanism (5) is fixedly sleeved on the outer wall of the insulating sleeve (4). The insulating sleeve (4) is fixedly sleeved with a receiving protrusion ring (10) on the side away from the insulating mounting cylinder (1). A conductive rubber expansion ring (11) is fixedly connected to the inner surface of the receiving protrusion ring (10). A conductive mechanism (6) for electrically connecting the conductive rubber expansion ring (11) and the conductive rod (2) is fixedly connected to the inner wall of the insulating sleeve (4). Multiple wafer positioning mechanisms (7) are fixedly connected to the top outer wall of the receiving protrusion ring (10). The inner wall of the insulating mounting cylinder (1) is fixedly connected to a self-control mechanism (8); The upper surface of the insulating mounting cylinder (1) is fixedly connected to a fixing ring (9), and the upper surface of the fixing ring (9) is provided with multiple fixing holes (12).

2. The solid-state transformer wafer electrophoresis fixture according to claim 1, characterized in that, The conductive rod (2) has a first insulating plate (13) and a second insulating plate (14) fixedly sleeved on its wall. The upper surface of the second insulating plate (14) has multiple vent holes (15).

3. The solid-state transformer wafer electrophoresis fixture according to claim 1, characterized in that, The limiting mechanism (5) includes a limiting protrusion ring (51) fixedly connected to the outer wall of the insulating sleeve (4). The outer wall of the limiting protrusion ring (51) is movably engaged with two elastic cards (52). An arc-shaped insulating partition (53) is fixedly connected to the side of the elastic card (52) away from the limiting protrusion ring (51). The side wall of the arc-shaped insulating partition (53) is fixedly connected to the outer wall of the insulating mounting cylinder (1).

4. A solid-state transformer wafer electrophoresis fixture according to claim 1, characterized in that, The conductive mechanism (6) includes a conductive connecting rod (61) fixedly connected to the inner wall of the insulating sleeve (4). One end of the conductive connecting rod (61) is fixedly connected to the inner wall of the conductive rubber expansion ring (11), and the other end of the conductive connecting rod (61) is fixedly connected to a conductive rubber block (62). The outer wall of the conductive rubber block (62) is in close contact with the rod wall of the conductive rod (2).

5. A solid-state transformer wafer electrophoresis fixture according to claim 1, characterized in that, The wafer positioning mechanism (7) includes a hollow cylinder (71) fixedly connected to the outer wall of a receiving protrusion ring (10). A conductive extension rod (72) is fixedly connected to the inner wall of the hollow cylinder (71). A conductive cylinder (73) is movably sleeved on the rod wall of the conductive extension rod (72). A conductive rubber expansion sleeve (74) is fixedly sleeved on the outer wall of the conductive cylinder (73). A rubber ring (75) is fixedly sleeved on the outer wall of the conductive cylinder (73). The outer wall of the rubber ring (75) is connected to the hollow cylinder (71). The inner wall of the hollow cylinder (71) is sealed and slidably connected. The outer wall of the hollow cylinder (71) is fixedly connected to an arc-shaped tube (76). The outer end of the arc-shaped tube (76) passes through the inner wall of the receiving convex ring (10) and is located in the inner cavity of the conductive rubber expansion ring (11). The side end of the conductive extension rod (72) is fixedly connected to an arc-shaped conductive sheet (77). The outer end of the arc-shaped conductive sheet (77) passes through the inner wall of the receiving convex ring (10) and is fixedly connected to the inner wall of the conductive rubber expansion ring (11).

6. A solid-state transformer wafer electrophoresis fixture according to claim 5, characterized in that, A return spring (16) is movably sleeved on the outer wall of the conductive cylinder (73), and the two ends of the return spring (16) are fixedly connected to the outer wall of the rubber ring (75) and the inner wall of the hollow cylinder (71), respectively.

7. A solid-state transformer wafer electrophoresis fixture according to claim 1, characterized in that, The outer wall of the insulating sleeve (4) is fixedly fitted with a sealing ring (17), and the outer wall of the sealing ring (17) is in sealing contact with the inner wall of the stepped through hole on the upper wall of the insulating mounting cylinder (1).

8. A solid-state transformer wafer electrophoresis fixture according to claim 2, characterized in that, The automatic control mechanism (8) includes a PLC controller (81) and a miniature electric push rod (82) fixedly connected to the inner wall of the insulating mounting cylinder (1). The miniature electric push rod (82) is located at the bottom end of the insulating mounting cylinder (1). A rubber piston block (83) is fixedly connected to the moving end of the miniature electric push rod (82). The rubber sidewall of the rubber piston block (83) is sealed and movably connected to the inner wall of the insulating mounting cylinder (1). A fixed through hole and a wire hole (84) are opened on the upper surface of the first insulating plate (13), and a pressure sensor (85) is fixedly connected to the hole wall of the fixed through hole.

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