A leveling device for PCB production

Abstract

The application discloses a leveling device for PCB production and relates to the technical field of PCB processing. The leveling device comprises a machine box, an electric telescopic rod, electroplating equipment, a sliding rail, a sliding block and an electroplating tank. The electric telescopic rod is arranged on the top of the inner wall of the machine box. The electroplating equipment is fixedly installed on the output end of the electric telescopic rod and is used for plating a uniform metal film on the copper surface. The sliding rail is fixedly installed on the bottom of the inner wall of the machine box. The sliding block is slidingly installed on the inner wall of the sliding rail. The electroplating tank is fixedly installed on the top of the sliding block and contains electroplating liquid in the tank. A rotating roller is fixedly installed on the surface of the electroplating equipment. A trapezoidal plate is fixedly installed on the surface of the electroplating tank. The rotating roller is used for pushing the trapezoidal plate to move towards the inside of the machine box, so that the electroplating tank moves away from the electroplating equipment, and thus, the operator can conveniently take out the PCB.

Description

Technical Field

[0001] This invention relates to the field of PCB board processing technology, specifically to a leveling device for PCB board production. Background Technology

[0002] PCB boards typically require electroplating of the copper surface, primarily to improve the surface quality of the copper, enhance conductivity, and ensure the long-term stability of the PCB board.

[0003] Patent publication number CN221306205U relates to a copper surface processing device for integrated circuit board processing. The device includes a placement stage, an electric push rod fixedly connected inside the stage, a push block fixedly connected to the output end of the electric push rod, a limit block fixedly connected inside the stage, a lower surface of the push block slidably connected to the outside of the limit block, a rotating rod rotatably connected to the outside of the push block, a connecting rod rotatably connected to one side of the rotating rod, and a limit rod fixedly connected inside the stage. The lower surface of the connecting rod slidably connected to the outside of the limit rod. This patent utilizes the movement of the push block to drive the rotating rod to rotate, causing the connecting rod to move, which in turn drives the clamping plate to move. This achieves the effect of fixing circuit boards of different sizes, solving the problem that traditional copper surface processing devices cannot fix circuit boards of different sizes, and improving the efficiency of circuit board processing.

[0004] In the aforementioned patent, the movement of the push block causes the rotating rod to rotate, which in turn moves the connecting rod and the clamping plate, thereby achieving the effect of fixing circuit boards of different sizes. This solves the problem that traditional copper surface processing devices cannot fix PCB boards of different sizes and improves the efficiency of PCB board processing. However, placing the PCB board directly under the copper surface processing device and having the device move downwards directly may cause hand injuries, posing a safety hazard. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a leveling device for PCB board production, which solves the problems mentioned in the background section.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a leveling device for PCB board production, comprising: a chassis; an electric telescopic rod disposed on the top of the inner wall of the chassis; an electroplating device fixedly installed at the output end of the electric telescopic rod, the electroplating device being used to plate a uniform metal film onto a copper surface; a slide rail fixedly installed at the bottom of the inner wall of the chassis; a slider slidably installed on the inner wall of the slide rail; an electroplating tank fixedly installed on the top of the slider, the electroplating tank containing an electroplating solution; and the surface of the electroplating device. A rotating roller is fixedly installed, and a trapezoidal plate is fixedly installed on the surface of the electroplating tank. The rotating roller is used to push the trapezoidal plate to move into the machine housing. A pulley frame is fixedly installed on the inner wall of the machine housing. A sliding plate slides through the surface of the electroplating tank. A push plate is fixedly installed on the side of the sliding plate away from the pulley frame, and a trapezoidal block is fixedly installed on the side of the sliding plate close to the pulley frame. When the trapezoidal block moves into the machine housing, it will contact the pulley frame. The pulley frame will push the trapezoidal block to move closer to the electroplating tank. The movement of the trapezoidal block closer to the electroplating tank will drive the sliding plate and the push plate to move closer to the center of the electroplating tank.

[0007] According to the above technical solution, a first spring is provided between the slider and the slide rail, and the slider is reset by the elastic force of the first spring itself. A second spring is provided between the electroplating tank and the sliding plate, and the sliding plate is reset by the elastic force of the second spring itself.

[0008] According to the above technical solution, the chassis is equipped with a protective device and a purification device for protecting operators. The protective device includes a fixed block, a sliding rod, a connecting plate, a sliding plate, a connecting rod, and a trapezoidal frame. The trapezoidal frame moves into the chassis as the electroplating tank moves. When the trapezoidal frame moves into the chassis, it disengages from the fixed block. The No. 3 spring between the sliding rod and the electroplating tank causes the connecting plate to move downward. The fixed block is fixedly installed at the bottom of the inner wall of the chassis. The sliding rod slides through the bottom of the electroplating tank. The connecting plate is fixedly installed at the top of the sliding rod. The sliding plate slides on the inner wall of the connecting plate. The connecting rod is fixedly installed at the bottom of the sliding rod. The trapezoidal frame is fixedly installed at the bottom of the connecting rod.

[0009] According to the above technical solution, a pulley seat is fixedly installed on the surface of the electroplating tank, a trapezoidal long plate is slidably installed on the inner wall of the chassis, a purification device is provided on the inner wall of the chassis, a connecting frame is fixedly installed on the top of the trapezoidal long plate, a sealing plate is fixedly installed on the top of the connecting frame, the sealing plate is in contact with the surface of the air intake of the purification device, and the downward movement of the trapezoidal long plate will drive the connecting frame and the sealing plate to move downward, and the downward movement of the sealing plate will disengage from the seal on the purification device.

[0010] According to the above technical solution, a No. 3 spring is provided between the slide rod and the electroplating tank, and the slide rod is reset by the elastic force of the No. 3 spring itself. A No. 4 spring is provided between the chassis and the trapezoidal long plate, and the trapezoidal long plate is reset by the elastic force of the No. 4 spring itself.

[0011] According to the above technical solution, the purification device includes an L-shaped frame, a U-shaped frame, a sealing baffle, and a triangular block. The L-shaped frame moves downward by the downward movement of the trapezoidal plate, which in turn moves the U-shaped frame downward. The downward movement of the U-shaped frame pushes the triangular block away from the U-shaped frame. The L-shaped frame is fixedly installed on the surface of the trapezoidal plate, and the U-shaped frame is fixedly installed on the surface of the L-shaped frame. The sealing baffle is slidably installed on the bottom of the inner wall of the casing. A groove is provided on the bottom of the inner wall of the casing, and the triangular block is fixedly installed on the top of the sealing baffle.

[0012] According to the above technical solution, the inner wall of the L-shaped frame is rotatably mounted with rollers, the inner wall of the chassis is rotatably mounted with a rotating frame, and the inner wall of the chassis is rotatably mounted with a rotating door. When the rotating frame rotates downward, it will disengage from the support of the rotating door, causing the rotating door to rotate downward.

[0013] According to the above technical solution, a No. 5 spring is provided between the sealing baffle and the chassis, and the sealing baffle is reset by the elastic force of the No. 5 spring itself. A No. 1 torsion spring is provided between the chassis and the rotating frame, and the rotating frame is reset by the elastic force of the No. 1 torsion spring itself.

[0014] This invention provides a leveling device for PCB board production. It has the following advantages: (1) The invention moves the electroplating tank to the bottom of the electroplating equipment. When the processing is completed, the rotating roller loses the pressure on the trapezoidal plate. The elastic force of the No. 1 spring will drive the slider and the electroplating tank to reset, so that the electroplating tank moves away from the electroplating equipment. This makes it easier for the operator to take out the PCB board. At the same time, it prevents the electroplating equipment from pressing on the hand when it descends, thus improving the protection effect. Meanwhile, the push plate pushes the PCB board to the center to prevent the PCB board from shifting, which would cause surface defects during processing and affect the processing effect.

[0015] (2) In this invention, the upward movement of the connecting plate will cause the PCB board to be removed from the electroplating solution, making it easier to remove the PCB board and preventing the electroplating solution from contacting the hands and causing skin burns. At the same time, long-term contact with these liquids may be absorbed through the skin and cause poisoning. Meanwhile, the downward movement of the trapezoidal long plate will cause the connecting frame and the sealing plate to move downward. The downward movement of the sealing plate will cause it to break the seal on the purification equipment, allowing the purification equipment to absorb the harmful gases generated inside the machine during processing, preventing the human body from absorbing harmful gases for a long time, which poses a safety hazard.

[0016] (3) In this invention, the movement of the triangular block away from the U-shaped frame will cause the sealing baffle to move away from the U-shaped frame. The movement of the sealing baffle away from the U-shaped frame will seal the groove. When the processing is completed, the U-shaped frame will reset and release the pressure on the triangular block. The elastic force of the No. 5 spring will drive the sealing baffle to reset. The reset of the sealing baffle will open the groove, allowing air to enter the machine from the bottom of the machine, improving air circulation and reducing the impact of odor on the operator.

[0017] (4) In this invention, when the L-shaped frame moves downward, it will drive the roller to move downward. When the roller moves downward, it will disengage from the support of the rotating frame. The elastic force of the No. 1 torsion spring itself will drive the rotating frame to rotate downward. When the rotating frame rotates downward, it will disengage from the support of the rotating door, causing the rotating door to rotate downward. By rotating the rotating door downward, the machine box is sealed to prevent the leakage of odors generated during processing, which would affect the normal work of the staff. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall cross-sectional structure of the present invention; Figure 3 This is a schematic diagram of the electroplating tank and trapezoidal plate structure of the present invention; Figure 4 This is a schematic diagram of the electroplating tank and pulley seat structure of the present invention; Figure 5 This is a schematic diagram of the pulley frame and trapezoidal block structure of the present invention; Figure 6 This is a schematic diagram of the trapezoidal long plate and connecting frame structure of the present invention; Figure 7 This is a schematic diagram of the U-shaped frame and triangular block structure of the present invention.

[0019] In the diagram: 1. Chassis; 2. Electric telescopic rod; 3. Electroplating equipment; 4. Slide rail; 5. Slider; 6. Electroplating tank; 7. Rotating roller; 8. Trapezoidal plate; 9. Pulley frame; 10. Sliding plate; 11. Push plate; 12. Trapezoidal block; 131. Fixed block; 132. Slide rod; 133. Connecting plate; 134. Slide plate; 135. Connecting rod; 136. Trapezoidal frame; 137. Pulley seat; 138. Trapezoidal long plate; 139. Purification equipment; 1310. Connecting frame; 1311. Sealing plate; 141. L-shaped frame; 142. U-shaped frame; 143. Sealing baffle; 144. Triangular block; 145. Roller; 146. Rotating frame; 147. Revolving door. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Please see Figure 1 - Figure 7 One embodiment of the present invention is: a leveling device for PCB board production, comprising: a chassis 1; an electric telescopic rod 2, the electric telescopic rod 2 being disposed on the top of the inner wall of the chassis 1; an electroplating device 3, the electroplating device 3 being fixedly installed at the output end of the electric telescopic rod 2, the electroplating device 3 being used to plate a uniform metal film on a copper surface; a slide rail 4, the slide rail 4 being fixedly installed at the bottom of the inner wall of the chassis 1; a slider 5, the slider 5 being slidably installed on the inner wall of the slide rail 4; and an electroplating tank 6, the electroplating tank 6 being fixedly installed on the top of the slider 5, the electroplating tank 6 containing an electroplating solution; the electroplating equipment... A rotating roller 7 is fixedly installed on the surface of the equipment 3, and a trapezoidal plate 8 is fixedly installed on the surface of the electroplating tank 6. The rotating roller 7 is used to push the trapezoidal plate 8 into the machine housing 1. A pulley frame 9 is fixedly installed on the inner wall of the machine housing 1. A sliding plate 10 slides through the surface of the electroplating tank 6. A push plate 11 is fixedly installed on the side of the sliding plate 10 away from the pulley frame 9, and a trapezoidal block 12 is fixedly installed on the side of the sliding plate 10 close to the pulley frame 9. The push plate 11 pushes the PCB board towards the center to prevent the PCB board from being misaligned, which could lead to surface defects during processing and affect the processing effect.

[0022] A first spring is installed between slider 5 and slide rail 4. The slider 5 is reset by the elastic force of the first spring. A second spring is installed between electroplating tank 6 and sliding plate 10. The sliding plate 10 is reset by the elastic force of the second spring.

[0023] In this embodiment, during operation: the electric telescopic rod 2 moves downward, causing the electroplating equipment 3 to move downward. As the electroplating equipment 3 moves downward, an electric current is used to plate a uniform metal film onto the copper surface inside the electroplating tank 6. The downward movement of the electroplating equipment 3 also causes the rotating roller 7 to move downward. This movement pushes the trapezoidal plate 8 into the housing 1, which in turn moves the electroplating tank 6 into the housing 1. Once the electroplating tank 6 reaches the bottom of the electroplating equipment 3, after processing, when the rotating roller 7 loses its pressure on the trapezoidal plate 8, the elastic force of the first spring causes the slider 5 and the electroplating tank 6 to reset, moving the electroplating tank 6 away from the electroplating equipment 3, allowing the operator to... To facilitate the removal of the PCB board and prevent injury to hands when the electroplating equipment 3 descends, thus improving protection, the movement of the electroplating tank 6 into the chassis 1 causes the sliding plate 10 to move into the chassis 1. The sliding plate 10 then moves the trapezoidal block 12 into the chassis 1. The trapezoidal block 12 then contacts the pulley frame 9, which pushes the trapezoidal block 12 towards the electroplating tank 6. This movement of the trapezoidal block 12 towards the electroplating tank 6 causes the sliding plate 10 and the push plate 11 to move towards the center of the electroplating tank 6. The push plate 11 pushes the PCB board towards the center, preventing the PCB board from shifting and causing surface defects during processing, which would affect the processing effect.

[0024] Please see Figure 1 - Figure 7 Based on the above embodiments, in another embodiment of the present invention, the chassis 1 is provided with a protective device and a purification device for protecting the operator. The protective device includes a fixing block 131, a sliding rod 132, a connecting plate 133, a sliding plate 134, a connecting rod 135, and a trapezoidal frame 136. The fixing block 131 is fixedly installed on the bottom of the inner wall of the chassis 1. The sliding rod 132 slides through the bottom of the electroplating tank 6. The connecting plate 133 is fixedly installed on the top of the sliding rod 132. The sliding plate 134 slides on the inner wall of the connecting plate 133. The connecting rod 135 is fixedly installed on the bottom of the sliding rod 132. The trapezoidal frame 136 is fixedly installed on the bottom of the connecting rod 135. The upward movement of the connecting plate 133 will cause the PCB board to detach from the electroplating solution, making it easier to remove the PCB board and preventing the electroplating solution from contacting the hands and causing skin burns. At the same time, long-term contact with these liquids may be absorbed through the skin, leading to poisoning.

[0025] A pulley seat 137 is fixedly installed on the surface of the electroplating tank 6. A trapezoidal long plate 138 is slidably installed on the inner wall of the chassis 1. A purification device 139 is installed on the inner wall of the chassis 1. A connecting frame 1310 is fixedly installed on the top of the trapezoidal long plate 138. A sealing plate 1311 is fixedly installed on the top of the connecting frame 1310. The sealing plate 1311 is in contact with the surface of the air intake of the purification device 139, so that the purification device 139 absorbs the harmful gases generated inside the chassis 1 during processing, preventing the human body from absorbing harmful gases for a long time, which could pose a safety hazard.

[0026] A No. 3 spring is installed between the slide rod 132 and the electroplating tank 6. The slide rod 132 is reset by the elastic force of the No. 3 spring. A No. 4 spring is installed between the chassis 1 and the trapezoidal plate 138. The trapezoidal plate 138 is reset by the elastic force of the No. 4 spring.

[0027] In this embodiment, during operation: the electroplating tank 6 moves into the chassis 1, causing the trapezoidal frame 136 to move into the chassis 1. As the trapezoidal frame 136 moves into the chassis 1, it disengages from the fixing block 131. The third spring between the sliding rod 132 and the electroplating tank 6 then moves the connecting plate 133 downwards. This downward movement of the connecting plate 133 immerses the PCB board above it in the electroplating solution. After processing, the electroplating tank 6 resets, and the fixing block 131 pushes the trapezoidal frame 136, connecting rod 135, sliding rod 132, and connecting plate 133 upwards. This upward movement of the connecting plate 133 removes the PCB board from the electroplating solution, making PCB board removal easier and preventing the electroplating solution from leaking out. Contact with hands can cause skin burns, and prolonged contact with these liquids may lead to poisoning through skin absorption. Furthermore, the movement of the electroplating tank 6 into the housing 1 will cause the pulley seat 137 to move into the housing 1. This movement of the pulley seat 137 will cause it to lose its support on the trapezoidal plate 138. The elastic force of the fourth spring will cause the trapezoidal plate 138 to move downwards. This downward movement of the trapezoidal plate 138 will cause the connecting frame 1310 and the sealing plate 1311 to move downwards. This downward movement of the sealing plate 1311 will cause it to lose its seal on the purification equipment 139, preventing the purification equipment 139 from absorbing harmful gases generated during processing inside the housing 1. This poses a safety hazard as it prevents long-term absorption of harmful gases by the human body.

[0028] The purification device includes an L-shaped frame 141, a U-shaped frame 142, a sealing baffle 143, and a triangular block 144. The L-shaped frame 141 is fixedly installed on the surface of the trapezoidal long plate 138, the U-shaped frame 142 is fixedly installed on the surface of the L-shaped frame 141, the sealing baffle 143 is slidably installed on the bottom of the inner wall of the housing 1, and a groove is provided at the bottom of the inner wall of the housing 1. The triangular block 144 is fixedly installed on the top of the sealing baffle 143. When the sealing baffle 143 is reset, the groove will open, allowing air to enter the housing 1 from the bottom, improving air circulation and reducing the impact of odors on operators.

[0029] The inner wall of the L-shaped frame 141 is rotatably equipped with rollers 145, the inner wall of the machine housing 1 is rotatably equipped with a rotating frame 146, and the inner wall of the machine housing 1 is rotatably equipped with a rotating door 147. The rotating door 147 rotates downward to seal the machine housing 1, preventing the leakage of odors generated during processing and affecting the normal work of the staff.

[0030] A No. 5 spring is installed between the sealing baffle 143 and the chassis 1. The sealing baffle 143 is reset by the elastic force of the No. 5 spring. A No. 1 torsion spring is installed between the chassis 1 and the rotating frame 146. The rotating frame 146 is reset by the elastic force of the No. 1 torsion spring.

[0031] The downward movement of the trapezoidal plate 138 causes the L-shaped frame 141 to move downwards. This downward movement of the L-shaped frame 141, in turn, causes the U-shaped frame 142 to move downwards. The downward movement of the U-shaped frame 142 pushes the triangular block 144 away from the U-shaped frame 142. This movement of the triangular block 144 away from the U-shaped frame 142 causes the sealing baffle 143 to move away from the U-shaped frame 142, sealing the groove. After processing, the U-shaped frame 142 resets, releasing its pressure on the triangular block 144. The elastic force of the No. 5 spring then resets the sealing baffle 143. When the sealing baffle 143 resets, the groove opens, allowing air to enter the machine housing 1 from the bottom, improving air circulation and reducing the impact of odors on operators. At the same time, when the L-shaped frame 141 moves downward, it drives the roller 145 downward. The downward movement of the roller 145 disengages from the support of the rotating frame 146, and the elastic force of the first torsion spring causes the rotating frame 146 to rotate downward. The downward rotation of the rotating frame 146 disengages from the support of the rotating door 147, causing the rotating door 147 to rotate downward. The downward rotation of the rotating door 147 seals the machine housing 1, preventing the leakage of odors generated during processing and affecting the normal work of the staff.

[0032] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A leveling device for PCB board production, used for electroplating PCB boards, comprising: Chassis (1), characterized in that: Electric telescopic rod (2), the electric telescopic rod (2) is set on the top of the inner wall of the casing (1); Electroplating equipment (3), which is fixedly installed at the output end of the electric telescopic rod (2), is used to plate a uniform metal film on the copper surface; The slide rail (4) is fixedly installed on the bottom of the inner wall of the chassis (1); Slider (5), which is slidably mounted on the inner wall of slide rail (4); Electroplating tank (6), the electroplating tank (6) is fixedly installed on the top of the slider (5), and the electroplating tank (6) contains electroplating liquid; The electroplating equipment (3) is fixedly mounted with a rotating roller (7), and the electroplating tank (6) is fixedly mounted with a trapezoidal plate (8). The rotating roller (7) is used to push the trapezoidal plate (8) to move into the machine box (1). The inner wall of the machine box (1) is fixedly mounted with a pulley frame (9). The surface of the electroplating tank (6) is slidably penetrated by a sliding plate (10). A push plate (11) is fixedly mounted on the side of the sliding plate (10) away from the pulley frame (9). A trapezoidal block (12) is fixedly mounted on the side of the sliding plate (10) close to the pulley frame (9). The machine box (1) is equipped with a protective device and a purification device for protecting the operator.

2. The leveling device for PCB board production according to claim 1, characterized in that: A first spring is provided between the slider (5) and the slide rail (4), and a second spring is provided between the electroplating tank (6) and the sliding plate (10).

3. A leveling device for PCB board production according to claim 2, characterized in that: The protective device includes a fixing block (131), a sliding rod (132), a connecting plate (133), a sliding plate (134), a connecting rod (135), and a trapezoidal frame (136). The fixing block (131) is fixedly installed on the bottom of the inner wall of the chassis (1). The sliding rod (132) slides through the bottom of the electroplating tank (6). The connecting plate (133) is fixedly installed on the top of the sliding rod (132). The sliding plate (134) slides on the inner wall of the connecting plate (133). The connecting rod (135) is fixedly installed on the bottom of the sliding rod (132). The trapezoidal frame (136) is fixedly installed on the bottom of the connecting rod (135).

4. A leveling device for PCB board production according to claim 3, characterized in that: A pulley seat (137) is fixedly installed on the surface of the electroplating tank (6). A trapezoidal long plate (138) is slidably installed on the inner wall of the chassis (1). A purification device (139) is provided on the inner wall of the chassis (1). A connecting frame (1310) is fixedly installed on the top of the trapezoidal long plate (138). A sealing plate (1311) is fixedly installed on the top of the connecting frame (1310). The sealing plate (1311) is in contact with the surface of the air intake of the purification device (139).

5. A leveling device for PCB board production according to claim 4, characterized in that: A No. 3 spring is provided between the slide bar (132) and the electroplating tank (6), and a No. 4 spring is provided between the chassis (1) and the trapezoidal long plate (138).

6. A leveling device for PCB board production according to claim 5, characterized in that: The purification device includes an L-shaped frame (141), a U-shaped frame (142), a sealing baffle (143), and a triangular block (144). The L-shaped frame (141) is fixedly installed on the surface of a trapezoidal long plate (138), the U-shaped frame (142) is fixedly installed on the surface of the L-shaped frame (141), the sealing baffle (143) is slidably installed on the bottom of the inner wall of the housing (1), a groove is provided on the bottom of the inner wall of the housing (1), and the triangular block (144) is fixedly installed on the top of the sealing baffle (143).

7. A leveling device for PCB board production according to claim 6, characterized in that: The inner wall of the L-shaped frame (141) is rotatably equipped with rollers (145), the inner wall of the chassis (1) is rotatably equipped with a rotating frame (146), and the inner wall of the chassis (1) is rotatably equipped with a rotating door (147).

8. A leveling device for PCB board production according to claim 7, characterized in that: A No. 5 spring is provided between the sealing baffle (143) and the chassis (1), and a No. 1 torsion spring is provided between the chassis (1) and the rotating frame (146).

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