Electroplating equipment, split anode and cathode power supply system of electroplating equipment and electroplating system

Abstract

The application relates to the technical field of electroplating, and discloses an electroplating device, a positive and negative pole power supply system of the electroplating device and an electroplating system. The electroplating device comprises an electroplating tank, a first rectifying part and a plurality of hangers. Each hanger is provided with a second rectifying part and a cathode plate, the second rectifying part and the cathode plate are electrically connected, the cathode plate is located in the electroplating tank, and the second rectifying part and the first rectifying part are connected through a first conductive part. A plurality of anode plates are arranged at intervals, adjacent two anode plates are insulated from each other, and the anode plates are located in the electroplating tank. Each hanger is provided with a second conductive part, the second conductive part is electrically connected with the second rectifying part, the second conductive part is arranged corresponding to the anode plates and is used for realizing electrical conduction between the second conductive part and the anode plates, and the second conductive part simultaneously overlaps the plurality of anode plates, so that the anode plates and the cathode plates have electroplating areas with substantially equal areas. The application can avoid current deviation, reduce the current difference between the anode plates and the cathode plates, and thus ensure the uniformity of electroplating.

Description

Technical Field

[0001] This invention relates to the field of electroplating technology, specifically to an electroplating device, a separate cathode and anode power supply system for the electroplating device, and an electroplating system. Background Technology

[0002] Electroplating equipment mainly relies on the cathode and anode to form a conductive circuit with the electrolyte to complete the electroplating operation. The industry generally adopts a centralized power supply method, with the workpiece to be processed as the cathode, and the current is uniformly supplied to each cathode and anode by the rectifier. The workpiece is carried by the hanger and moves in the electroplating tank to complete the continuous electroplating process.

[0003] In existing electroplating equipment, the anodic electric field is unevenly distributed on the cathode surface, resulting in an uneven current distribution on the cathode surface. Furthermore, when the distance between two adjacent racks in existing electroplating equipment increases, the current is easily shifted to the adjacent racks, resulting in an excessively thick edge and a thin center of the plating layer formed on the cathode, leading to poor uniformity of the electroplated layer. Summary of the Invention

[0004] This invention provides an electroplating device, a separate cathode and anode power supply system for the electroplating device, and an electroplating system, to solve the problems of uneven distribution of the anode electric field on the cathode surface and poor electroplating uniformity caused by easy current deviation.

[0005] In a first aspect, the present invention provides an electroplating apparatus, comprising: An electroplating tank, the interior of which is used to contain an electrolyte; The first rectifier section is used for electrical connection with an external power supply; Multiple fixtures are spaced apart along the length of the electroplating tank and can move along the length of the electroplating tank. Each fixture is provided with a second rectifier and a cathode plate. The second rectifier and the cathode plate are electrically connected. The cathode plate is located inside the electroplating tank. The second rectifier and the first rectifier are electrically connected through a first conductive element. Multiple anode plates are provided, spaced apart along the length of the electroplating tank, with adjacent anode plates insulated from each other, and at least a portion of each anode plate located within the electroplating tank. Each of the fixtures is provided with a second conductive element, which is electrically connected to the second rectifier. The second conductive element is provided corresponding to the anode plate and is used to realize the electrical conduction between the anode plate and the cathode plate. Furthermore, the second conductive element simultaneously overlaps multiple anode plates along the length of the electroplating tank, so that the anode plate and the cathode plate in the working state have electroplating areas of substantially equal area.

[0006] Beneficial effects: The first rectifier is connected to an external power source and supplied with a unified power supply. The current is conducted to the second rectifier on the hanger through the first conductive element. The second rectifier conducts the current to the second conductive element. As the hanger moves along the length of the electroplating tank, the second conductive element overlaps with the anode plate and conducts the current to the anode plate. At this time, both the anode plate and the cathode plate are located in the electrolyte of the electroplating tank. The current on the anode plate is conducted to the cathode plate through the electrolyte. The current on the cathode plate flows back to the second rectifier. The anode plate and the cathode plate form an electroplating circuit under the action of the electrolyte, thereby producing an electroplated coating on the surface of the cathode plate.

[0007] Furthermore, by using multiple racks spaced apart, each rack is equipped with a cathode plate, and multiple independent cathode plates are arranged along the length of the electroplating tank, thus dividing the cathode. In addition, multiple anode plates are spaced apart along the length of the electroplating tank, dividing the anode. Adjacent anode plates are insulated from each other, which can prevent current from flowing between adjacent anode plates and avoid current deviation. Moreover, each rack is equipped with an independent second rectifier and cathode plate, realizing independent power supply for the cathode zone, solving the problem of uneven current distribution and current competition caused by multiple racks sharing the power supply.

[0008] As the mounting fixture moves the cathode plate, the second conductive element moves synchronously and always overlaps a certain number of anode plates. This ensures that each section of the cathode plate forms an independent power supply area with the anode plate overlapped by the second conductive element on the fixture. This guarantees that current can flow between the cathode and anode plates as the fixture moves, reducing the area difference between the interacting anode and cathode plates, and consequently reducing the current difference between them. This improves the uniformity of electroplating and meets the electroplating production needs under different working conditions. Furthermore, because the second conductive element overlaps multiple anode plates simultaneously along the length of the electroplating tank, regardless of the fixture spacing, the anode and cathode plates in operation form electroplating areas of approximately equal area, ensuring the uniformity of the electric field distribution and thus guaranteeing the stability of the cathode plate electroplating uniformity.

[0009] In one alternative embodiment, an insulating plate is provided between two adjacent anode plates along the length of the electroplating tank.

[0010] Beneficial effects: The insulating plate between adjacent anode plates enhances the insulation effect between them, blocks the current conduction between different anode plates, ensures that each independent power supply area does not interfere with each other, ensures the stability and reliability of current transmission in each independent power supply area, further blocks current from flowing between adjacent anode plates, avoids current deviation, and improves the uniformity of electroplating.

[0011] In one optional embodiment, the second conductive element includes a plurality of conductive copper brushes, which are spaced apart along the length of the electroplating tank and connected in series.

[0012] Beneficial effects: The second conductive component consists of multiple sets of conductive copper brushes arranged at intervals along the length of the electroplating tank. By setting multiple conductive copper brushes, multi-point contact conductivity is formed on the anode plate, which improves the stability and conductivity of current conduction, avoids power outages and poor contact during the movement of the rack, ensures the continuity of power supply, and further improves the continuity and stability of electroplating.

[0013] In one alternative embodiment, along the length of the electroplating tank, the width W of the conductive copper brush is greater than the gap L between two adjacent anode plates.

[0014] Beneficial effects: By limiting the width W of the conductive copper brush to be greater than the gap L between adjacent anode plates, the conductive copper brush can always maintain effective overlap and conduction with the anode plate when passing through the gap between the anode plates. This avoids power outages caused by the failure of the overlap between the conductive copper brush and the anode plate during the movement of the fixture, ensuring continuous electroplating operations and improving the operational stability and continuity of the electroplating equipment.

[0015] In one optional embodiment, the gap between two adjacent fixtures is adjustable. Along the length of the electroplating tank, when the width of the cathode plate is less than the total width of the multiple anode plates overlapping the second conductive element, the gap between two adjacent fixtures is reduced; when the width of the cathode plate is greater than the total width of the multiple anode plates overlapping the second conductive element, the gap between two adjacent fixtures is increased.

[0016] Beneficial effects: When the width of the cathode plate is less than the total width of the multiple anode plates overlapping the second conductive element, the gap between two adjacent fixtures is reduced to avoid electric field interference in adjacent areas; when the width of the cathode plate is greater than the total width of the multiple anode plates overlapping the second conductive element, the gap between two adjacent fixtures is increased, and the edge effect is used to thicken the edge of the cathode plate to offset the effect of the thin edge of the cathode plate. By adjusting the gap between two adjacent fixtures along the length direction of the electroplating tank, the uniformity effect caused by uneven thickness during the electroplating process on the cathode plate surface is offset.

[0017] In one optional embodiment, the second rectifier has a first positive output port and a second positive output port that are independent of each other. The plurality of anode plates are arranged in two groups, and the two groups of anode plates are respectively located on opposite sides of the cathode plate. The two groups of anode plates are electrically connected to the first positive output port and the second positive output port respectively through the second conductive element.

[0018] Beneficial effects: The second rectifier section is equipped with a first positive output port and a second positive output port, which are respectively connected to two sets of anode plates on opposite sides of the cathode plate. This allows the electric field generated by the anode plates on both sides of the cathode plate to act on the two surfaces of the cathode plate independently, thereby enabling independent control of the electroplating process on the two opposite surfaces of the cathode plate. This achieves differentiated processing of the plating layers on the two opposite surfaces of the cathode plate, while ensuring that both opposite surfaces of the cathode plate are covered by the effective electric field of the anode plates, thus improving the overall quality and consistency of double-sided electroplating of the cathode plate.

[0019] In one optional embodiment, clamping portions are formed on opposite sides of the hanger, and the second rectifier has a first negative output port and a second negative output port that are independent of each other. One end of the clamping portion on both sides of the hanger is connected to the first negative output port and the second negative output port, respectively, and the other end clamps the two opposite surfaces of the cathode plate, forming an electrical connection between the two surfaces of the cathode plate and the first negative output port and the second negative output port.

[0020] Beneficial effects: The fixture fixes the cathode plate through the clamping parts on both sides, and realizes electrical conduction between the first negative output port and the second negative output port of the cathode plate and the second rectifier through the clamping parts. The clamping parts not only complete the mechanical fixation of the cathode plate, but also realize stable conductivity between the first negative output port and the second negative output port of the cathode plate and the second rectifier. The structure has a high degree of integration. At the same time, it ensures that the two opposite surfaces of the cathode plate are subjected to uniform force and conduction, and it is not easy to have problems such as poor local conductivity or workpiece displacement, thereby improving the stability of the cathode plate and the conductivity reliability of the electroplating equipment.

[0021] In one optional embodiment, the first conductive element is located inside the electroplating tank. The first conductive element includes a positive electrode copper busbar and a negative electrode copper busbar. The positive electrode copper busbar is electrically connected to the positive electrode of the first rectifier, and the negative electrode copper busbar is electrically connected to the negative electrode of the first rectifier. Power-collecting elements are also provided on both sides of the hanger. The power-collecting elements on both sides of the hanger move synchronously with the hanger and respectively connect with the positive electrode copper busbar and the negative electrode copper busbar.

[0022] Beneficial effects: By electrically connecting the positive and negative terminals of the first rectifier section to the positive and negative power-collecting copper busbars respectively, and by having the power-collecting components on both sides of the hanger move synchronously with the hanger and connect to the positive and negative power-collecting copper busbars respectively, the power-collecting components on both sides of the hanger can continuously draw power from the first rectifier section and conduct it to the second rectifier section, thus providing a stable and continuous power supply to the second rectifier section. The structure is well-organized, the power-collecting method is simple and reliable, and it can ensure that the electroplating equipment forms a stable and continuous power supply path.

[0023] In one optional embodiment, a height adjustment section is provided inside the electroplating tank. The height adjustment section is located at the lower end of the cathode plate along the height direction of the electroplating tank. The height adjustment section is used to adjust the position of the cathode plate to ensure that the electric field of the anode plate covers the cathode plate.

[0024] Beneficial effects: By adjusting the vertical position of the cathode plate in the electroplating tank through the height adjustment unit, the cathode plate is ensured to be within the electric field coverage area of ​​the anode plate, thereby achieving complete electroplating of the cathode plate surface, avoiding unplated parts on the cathode plate surface, and further improving the uniformity of electroplating.

[0025] Secondly, the present invention also provides a separate cathode and anode power supply system for an electroplating equipment, comprising: The first rectifier section is used for electrical connection with an external power supply; Multiple second rectifiers, each of which is disposed on a corresponding hanger and moves with the hanger; Multiple mutually insulated segmented anodes, each segmented anode including an anode plate, the anode plate serving as the power supply terminal of the segmented anode; The second conductive element is disposed on each of the hangers, electrically connected to the second rectifier, and disposed corresponding to the segmented anode, for realizing the electrical conduction between the segmented anode and the corresponding cathode plate; wherein, each of the second rectifiers simultaneously supplies power to the corresponding cathode plate and the corresponding segmented anode, so that the cathode plate corresponding to each hanger corresponds one-to-one with the segmented anode and is powered independently.

[0026] Beneficial effects: The first rectifier unit is connected to an external power source for unified power supply. The current is then conducted through a first conductive element to a second rectifier unit mounted on the mounting fixture. The second rectifier unit then conducts the current to a second conductive element. The segmented anode includes an anode plate, which serves as the power supply terminal for the segmented anode. As the mounting fixture moves along the length of the electroplating tank, the second conductive element engages with the anode plate, conducting current to it. At this time, both the anode plate and the cathode plate are located in the electrolyte of the electroplating tank. The electrolyte conducts the current from the anode plate to the cathode plate, and the current from the cathode plate flows back to the second rectifier unit. Under the action of the electrolyte, the anode plate and cathode plate form an electroplating circuit, thereby producing an electroplated coating on the surface of the cathode plate.

[0027] In addition, each fixture is equipped with a second conductive element and a cathode plate, resulting in multiple independent cathode plates along the length of the electroplating tank. Furthermore, multiple anode plates are spaced apart along the length of the electroplating tank, dividing the anodes along the length of the tank. Adjacent anode plates are insulated from each other, preventing current from flowing between adjacent anode plates and avoiding current deviation. Moreover, each fixture is equipped with an independent second rectifier and cathode plate, enabling independent power supply to the cathode zones and reducing the risk of uneven current distribution and current contention caused by multiple fixtures sharing a power supply.

[0028] As the fixture moves the cathode plate, the second conductive element moves synchronously and always overlaps a certain number of anode plates. This ensures that each section of the cathode plate forms an independent power supply area with the anode plate overlapped by the second conductive element on the fixture. This guarantees that the cathode plate can conduct current with the anode plate while the fixture is moving the cathode plate, reducing the area difference between the interacting anode and cathode plates, and thus reducing the current difference between the anode and cathode plates. This improves the uniformity of electroplating and can meet the electroplating production needs under different working conditions.

[0029] Thirdly, the present invention also provides an electroplating system, including the electroplating equipment described above.

[0030] Beneficial effects: By setting up the above-mentioned electroplating equipment, the electroplating system can avoid the problems of current deviation and uneven electric field distribution. The whole system is reliable in operation and easy to maintain, taking into account both electroplating quality and production efficiency, and can meet the electroplating production needs of multiple varieties and large batches of plates. Attached Figure Description

[0031] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0032] Figure 1 This is a front view of an electroplating device according to an embodiment of the present invention; Figure 2 for Figure 1 A magnified view of part M in the diagram; Figure 3 for Figure 1 Top view of the mounting bracket; Figure 4 This is a top view of an electroplating apparatus according to an embodiment of the present invention; Figure 5This is a circuit logic diagram of an electroplating tank, a first rectifier section, and a second rectifier section of an electroplating device according to an embodiment of the present invention. Figure 6 for Figure 5 A magnified view of N in the diagram.

[0033] Explanation of reference numerals in the attached figures: 1. Electroplating tank; 2. First rectifier section; 201. First positive output port; 202. Second positive output port; 203. First negative output port; 204. Second negative output port; 3. Hanger; 4. Second rectifier section; 5. Cathode plate; 6. Anode plate; 7. Second conductive component; 701. Conductive copper brush; 8. Insulating plate; 9. Positive electrode power-taking copper busbar; 10. Negative electrode power-taking copper busbar; 11. Power-taking component; 12. Height adjustment section. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] A common technical bias exists in related technologies: the inability to simultaneously achieve one-to-one correspondence control between the anode and cathode. Some related technologies employ a common cathode overall power supply mode, which leads to uneven current distribution; others use separate cathode or anode segmentation schemes, but cannot eliminate current offset problems. This technical bias has long existed, with related technologies generally believing that the anode and cathode of electroplating equipment must use some form of shared or coupled power supply. Dividing the anode into independent small segments leads to discontinuous power supply and current interruptions, and the structure of dividing the anode into independent small segments is complex and too costly. Therefore, related technologies all use electronic switch time-sharing control or maintain the anode as a whole structure while only dividing the cathode. However, to overcome this technical bias, this invention provides an electroplating device, a separate anode and cathode power supply system for the electroplating device, and an electroplating system.

[0036] The following is combined Figures 1 to 6 The following describes embodiments of the present invention.

[0037] According to an embodiment of the present invention, an electroplating apparatus is provided, comprising an electroplating tank 1, a first rectifier 2, a plurality of hangers 3, and a plurality of anode plates 6. The interior of the electroplating tank 1 is used to contain an electrolyte. The first rectifier 2 is used to be electrically connected to an external power source. The plurality of hangers 3 are spaced apart along the length direction of the electroplating tank 1 and are movable along the length direction of the electroplating tank 1. Each hanger 3 is provided with a second rectifier 4 and a cathode plate 5. The second rectifier 4 and the cathode plate 5 are electrically connected. The cathode plate 5 is located inside the electroplating tank 1. The second rectifier 4 and the first rectifier 2 are connected by a first conductive element. Electrical connection; multiple anode plates 6 are spaced apart along the length of the electroplating tank 1, with adjacent anode plates 6 insulated from each other, and at least a portion of the anode plates 6 located within the electroplating tank 1; wherein, each hanger 3 is provided with a second conductive element 7, the second conductive element 7 is electrically connected to the second rectifier 4, the second conductive element 7 is provided corresponding to the anode plate 6 and is used to realize the electrical conduction between the anode plate 6 and the cathode plate 5, and the second conductive element 7 simultaneously overlaps multiple anode plates 6 along the length of the electroplating tank 1, so that the anode plate 6 and the cathode plate 5 in the working state have electroplating areas of substantially equal area.

[0038] In this embodiment, the first rectifier 2 is connected to an external power source for unified power supply. The current is then conducted to the second rectifier 4 mounted on the hanger 3 via the first conductive element. The second rectifier 4 then conducts the current to the second conductive element 7. As the hanger 3 moves along the length of the electroplating tank 1, the second conductive element 7 overlaps with the anode plate 6, conducting the current to the anode plate 6. At this time, both the anode plate 6 and the cathode plate 5 are located in the electrolyte of the electroplating tank 1. The current on the anode plate 6 is conducted to the cathode plate 5 through the electrolyte, and the current on the cathode plate 5 flows back to the second rectifier 4. Under the action of the electrolyte, the anode plate 6 and the cathode plate 5 form an electroplating circuit, thereby producing an electroplated coating on the surface of the cathode plate 5.

[0039] Furthermore, multiple fixtures 3 are spaced apart, each fixture 3 is equipped with a cathode plate 5, and multiple independent cathode plates 5 are arranged along the length of the electroplating tank 1, thereby dividing the cathode; and multiple anode plates 6 are spaced apart along the length of the electroplating tank 1, dividing the anode along the length of the electroplating tank 1, and adjacent anode plates 6 are insulated from each other, which can block the current from flowing between adjacent anode plates 6 and avoid current deviation; and each fixture 3 is equipped with an independent second rectifier 4 and a cathode plate 5, so that the cathode is independently powered in a zone, reducing the risk of uneven current distribution and current competition caused by multiple fixtures 3 sharing the power supply.

[0040] Simultaneously, as the fixture moves the cathode plate 5, the second conductive element 7 also moves synchronously and always overlaps a certain number of anode plates 6, so that each section of the cathode plate 5 forms an independent power supply area with the anode plate 6 overlapped by the second conductive element 7 on the fixture 3. This ensures that the cathode plate 5 can conduct current with the anode plate 6 while the fixture 3 is moving the cathode plate 5, reducing the area difference between the interacting anode plate 6 and the cathode plate 5, and thus reducing the current difference between the anode plate 6 and the cathode plate 5, thereby improving the uniformity of electroplating and meeting the electroplating production needs under different working conditions.

[0041] Furthermore, "basically equal" means that the overlap of the second conductive element 7 along its length ensures that the relative effective working areas of the anode plate 6 and the cathode plate 5 remain consistent within the engineering error range during operation. Since there are multiple anode plates 6, and adjacent anode plates 6 are insulated from each other, only the sections of anode plates 6 overlapping with the second conductive element 7 are always in operation during the movement of the hanger 3, preventing the simultaneous coverage of a large section of anode. If a large section of anode were used, the anode area would be much larger than the cathode area, leading to uneven distribution of electric field lines and problems such as excessively thick coatings and fluctuations in uniformity.

[0042] By simultaneously overlapping multiple anode plates 6 along the length of the electroplating tank 1 with the second conductive element 7, the anode plates 6 and cathode plates 5 in the working state form electroplating areas with basically equal areas, regardless of how the spacing of the hangers 3 changes. This ensures the uniformity of the electric field distribution and thus guarantees the stability of the electroplating uniformity of the cathode plate.

[0043] In one embodiment, an insulating plate 8 is provided between two adjacent anode plates 6 along the length of the electroplating tank 1.

[0044] In this embodiment, an insulating plate 8 is provided between adjacent anode plates 6, which enhances the insulation effect between adjacent anode plates 6, blocks the current conduction between different anode plates 6, ensures that each independent power supply area does not interfere with each other, ensures the stability and reliability of current transmission in each independent power supply area, further blocks current from flowing between adjacent anode plates 6, avoids current deviation, and improves the uniformity of electroplating.

[0045] In one embodiment, the second conductive element 7 includes a plurality of conductive copper brushes 701, which are spaced apart along the length of the electroplating tank 1 and connected in series.

[0046] In this embodiment, the second conductive element 7 is composed of multiple sets of conductive copper brushes 701 arranged at intervals along the length of the electroplating tank 1. By setting multiple conductive copper brushes 701, multi-point contact conductivity is formed on the anode plate 6, which improves the stability and conductivity of current conduction, avoids power outages and poor contact during the movement of the hanger 3, ensures the continuity of power supply, and further improves the continuity and stability of electroplating.

[0047] In one embodiment, along the length of the electroplating tank 1, the width W of the conductive copper brush 701 is greater than the gap L between two adjacent anode plates 6. The value of L includes, but is not limited to, 5 mm.

[0048] In this embodiment, the width W of the conductive copper brush 701 is limited to be greater than the gap L between adjacent anode plates 6. When the conductive copper brush 701 passes through the gap between the anode plates 6, it can always maintain effective overlap and conduction between the conductive copper brush 701 and the anode plate 6, avoiding power outage caused by the failure of overlap between the conductive copper brush 701 and the anode plate 6 during the movement of the fixture 3, ensuring continuous electroplating operation, and improving the operational stability and continuity of the electroplating equipment.

[0049] It should be noted that during the movement, the conductive copper brush 701 will not experience a power outage when passing through the gap L between two adjacent anode plates 6. The reasons are as follows: Since the width W of the conductive copper brush 701 is greater than the gap L between two adjacent anode plates 6, firstly, assuming the width of the gap L is 5mm, and the conductive copper brush 701 is in surface contact rather than point contact, the contact area is much larger than 5mm, so when the conductive copper brush 701 passes through the gap L, a portion of it will always overlap with the adjacent anode plate 6; secondly, the five conductive copper brushes 701 are connected in series as a group, and as long as one brush overlaps with the anode plate 6, the entire group of brushes will remain energized and there will be no power outage.

[0050] In one embodiment, the gap between two adjacent hangers 3 can be adjusted. Along the length of the electroplating tank 1, when the width of the cathode plate 5 is less than the total width of the multiple anode plates 6 that overlap with the second conductive element 7, the gap between two adjacent hangers 3 is reduced; when the width of the cathode plate 5 is greater than the total width of the multiple anode plates 6 that overlap with the second conductive element 7, the gap between two adjacent hangers 3 is increased.

[0051] In this embodiment, when the width of the cathode plate 5 is less than the total width of the multiple anode plates 6 that overlap with the second conductive element 7, the gap between two adjacent hangers 3 is reduced to avoid electric field interference in adjacent areas; when the width of the cathode plate 5 is greater than the total width of the multiple anode plates 6 that overlap with the second conductive element 7, the gap between two adjacent hangers 3 is increased, and the edge effect is used to thicken the edge of the cathode plate 5 to offset the effect of the thin edge of the cathode plate 5. By adjusting the gap between two adjacent hangers 3 along the length direction of the electroplating tank 1, the uniformity effect caused by uneven thickness during the electroplating process of the cathode plate 5 is offset.

[0052] In one embodiment, the second rectifier 4 has an independent first positive output port 201 and a second positive output port 202. Multiple anode plates 6 are arranged in two groups, with the two groups of anode plates 6 located on opposite sides of the cathode plate 5. The two groups of anode plates 6 are electrically connected to the first positive output port 201 and the second positive output port 202 via second conductive elements 7. The first positive output port 201 and the second positive output port 202 are each independently set with an output current, resulting in different plating thicknesses on opposite sides of the cathode plate 5. Specifically, the two groups of anode plates 6 are electrically connected to the first positive output port 201 and the second positive output port 202 of the second rectifier 4 via second conductive elements 7. The two groups of anode plates 6 are located on opposite sides of the cathode plate 5, and the electric fields of the two groups of anode plates 6 cover the opposite two surfaces of the cathode plate 5.

[0053] In this embodiment, the second rectifier 4 is provided with a first positive output port 201 and a second positive output port 202, which can be independently set to output current and are respectively connected to two sets of anode plates 6 on opposite sides of the cathode plate 5. This allows the electric field generated by the anode plates 6 on both sides of the cathode plate 5 to act on the two surfaces of the cathode plate 5, thereby independently controlling the electroplating process on the two opposite surfaces of the cathode plate 5. This enables differentiated processing of the plating layers on the two opposite surfaces of the cathode plate 5, allowing different plating thicknesses to be obtained on the opposite sides of the cathode plate 5. At the same time, it ensures that both opposite surfaces of the cathode plate 5 are covered by the effective electric field of the anode plates 6, improving the overall quality and consistency of the double-sided electroplating of the cathode plate 5.

[0054] In one embodiment, the hanger 3 extends to form clamping portions on opposite sides, and the second rectifier 4 has a first negative output port 203 and a second negative output port 204 that are independent of each other. One end of the clamping portion on both sides of the hanger 3 is connected to the first negative output port 203 and the second negative output port 204 respectively, and the other end clamps the two opposite surfaces of the cathode plate 5, forming an electrical connection between the two surfaces of the cathode plate 5 and the first negative output port 203 and the second negative output port 204.

[0055] In this embodiment, the fixture 3 fixes the cathode plate 5 through the clamping parts on both sides, and realizes the electrical conduction between the first negative output port 203 and the second negative output port 204 of the cathode plate 5 and the second rectifier 4 through the clamping parts. The clamping parts not only complete the mechanical fixation of the cathode plate 5, but also realize the stable conduction between the first negative output port 203 and the second negative output port 204 of the cathode plate 5 and the second rectifier 4, resulting in high structural integration. At the same time, it ensures that the two opposite surfaces of the cathode plate 5 are subjected to uniform force and conduction, and it is not easy to have problems such as poor local conductivity or workpiece displacement, thereby improving the stability of the cathode plate 5 and the conductivity reliability of the electroplating equipment.

[0056] In one embodiment, the first conductive element is located inside the electroplating tank 1. The first conductive element includes a positive electrode copper busbar 9 and a negative electrode copper busbar 10. The positive electrode copper busbar 9 is electrically connected to the positive electrode of the first rectifier 2, and the negative electrode copper busbar 10 is electrically connected to the negative electrode of the first rectifier 2. Power-collecting elements 11 are also provided on both sides of the hanger 3. The power-collecting elements 11 on both sides of the hanger 3 move synchronously with the hanger 3 and respectively connect with the positive electrode copper busbar 9 and the negative electrode copper busbar 10.

[0057] In this embodiment, the positive and negative terminals of the first rectifier 2 are electrically connected to the positive and negative power-collecting copper busbars 9 and 10, respectively. The power-collecting components 11 on both sides of the hanger 3 move synchronously with the hanger 3 and connect with the positive and negative power-collecting copper busbars 9 and 10, respectively. This allows the power-collecting components 11 on both sides of the hanger 3 to continuously draw power from the first rectifier 2 and conduct it to the second rectifier 4, thus providing a stable power supply to the second rectifier 4. The structure is well-organized, the power collection method is simple and reliable, and it can ensure that the electroplating equipment forms a stable and continuous power supply path.

[0058] In one embodiment, a height adjustment part 12 is provided inside the electroplating tank 1. The height adjustment part 12 is located at the lower end of the cathode plate 5 along the height direction of the electroplating tank 1. The height adjustment part 12 is used to adjust the position of the cathode plate 5 to ensure that the electric field of the anode plate 6 covers the cathode plate 5.

[0059] In this embodiment, the vertical position of the cathode plate 5 in the electroplating tank 1 is adjusted by the height adjustment part 12 to ensure that the cathode plate 5 is within the electric field coverage of the anode plate 6, thereby achieving complete electroplating on the surface of the cathode plate 5, avoiding any unplated parts on the surface of the cathode plate 5, and further improving the uniformity of electroplating.

[0060] It is understandable that the working principle of this embodiment is as follows: The electroplating tank 1 is equipped with a positive electrode copper busbar 9, two sets of anode plates 6, and a negative electrode copper busbar 10. The second rectifier unit 4 carried on the mounting bracket 3 adopts a 36V dual-output rectifier, which is equivalent to two independent rectifiers, with two sets of outputs: a first positive output port VO1+ / a first negative output port VO1- and a second positive output port VO2+ / a second negative output port VO2-. The current path formation logic is as follows: (1) The first rectifier 2 is connected to an external power source and supplies power to the second rectifier 4 on the hanger 3 through the positive terminal copper busbar 9 and the negative terminal copper busbar 10; (2) The VO1+ and VO2+ of the second rectifier 4 are respectively connected to two sets of anode plates 6 arranged at intervals on both sides of the inside of the electroplating tank 1, so that the two sets of anode plates 6 are carried with positive current; (3) VO1- and VO2- of the second rectifier 4 are connected together to the cathode plate 5 held by the hanger 3; (4) The electroplating solution in the electroplating tank 1 serves as a conductive medium, connecting the anode plate 6 and the cathode plate 5 to form a complete electroplating circuit.

[0061] In one embodiment, along the length of the electroplating tank 1, which is 3 meters long, each anode plate 6 is a 220mm wide independent segment. Adjacent anode plates 6 are separated by a 5mm thick insulating board 8, preferably a PP board, to ensure no electrical connection between them. All anode plates 6 are installed within the same pre-sized anode box, with internal separation only; the overall size of the anode box does not need to be changed. Each anode plate 6 is individually wired to the corresponding positive output port of the second rectifier section 4. There are five conductive copper brushes 701, pre-connected in series as a group. During the movement of the mounting bracket 3, the copper brush will simultaneously overlap approximately three anode plates 6 (3×220mm≈660mm), forming an electroplating area roughly equal in size with the 500mm wide cathode plate 5. The cathode plate 5 is 500mm wide. During the movement of the mounting bracket 3, the copper brush will always overlap only about three 220mm sections of anode, with a total width of about 660mm, maintaining an area roughly equal to that of the 500mm wide cathode. Since the adjacent anode plates 6 are segmented, only a few anode plates 6 that overlap with the conductive copper brush 701 are working during the movement of the mounting bracket 3, and there will be no situation where the entire anode plate 6 is covered at the same time.

[0062] If a single large anode is used, the area of ​​the anode plate 6 will be much larger than the area of ​​the cathode plate 5, resulting in uneven distribution of electric field lines and problems such as excessively thick plating and fluctuations in uniformity. In this embodiment, the anode plates 6 are spaced apart so that the areas of the anode plate 6 and the cathode plate 5 are always equal, ensuring the uniformity of the electric field distribution and very stable electroplating uniformity.

[0063] In this embodiment, the second rectifier 4 is provided with two independent first positive output ports 201 and second positive output ports 202, which are respectively connected to the two sets of anode plates 6 on both sides of the cathode plate 5. This allows the electric field generated by the anode plates 6 on both sides of the cathode plate 5 to act on the two surfaces of the cathode plate 5, thereby independently controlling the electroplating process of the two opposite surfaces of the cathode plate 5. This enables differentiated processing of the plating layers on the two opposite surfaces of the cathode plate 5, while ensuring that both opposite surfaces of the cathode plate 5 are covered by the effective electric field of the anode plates 6, thus improving the overall quality and consistency of the double-sided electroplating of the cathode plate 5.

[0064] It should be noted that the different copper thicknesses on both sides of the cathode plate 5 are controlled separately: Since the second rectifier section 4 uses a dual-output rectifier, the first positive output port 201 and the second positive output port 202 of the second rectifier section 4 supply power to the two sets of anode plates 6 respectively. The output current supplied to the two sets of anode plates 6 can be set separately (e.g., 50 amps for one set of anode plates 6 and 100 amps for the other set), thus achieving separate control of the different copper thicknesses on both sides of the same cathode plate 5. This design meets the requirements of differentiated electroplating on both sides and requires only one dual-output rectifier, eliminating the need for two independent rectifiers and reducing the equipment's footprint.

[0065] It should also be noted that this embodiment is not simply dividing multiple cathode plates 5 into multiple anode plates 6 with intervals, but rather produces a further synergistic effect: when the multiple cathode plates 5 are divided into intervals alone, the uniformity of the coating on the surface of the cathode plate 5 is 3-4μm, while after the multiple anode plates 6 are superimposed, the uniformity of the coating on the surface of the cathode plate 5 increases dramatically to ≤3μm. Therefore, in this embodiment, the division of multiple cathode plates 5 and the division of multiple anode plates 6 with intervals is not a simple superposition relationship, but rather produces a synergistic effect—dividing into multiple cathode plates 5 solves the problem of current competition between adjacent hangers 3, and dividing into multiple anode plates 6 solves the problem of current offset. The simultaneous implementation of both fundamentally eliminates the two major pain points affecting the uniformity of electroplating.

[0066] According to an embodiment of the present invention, in another aspect, a separate cathode and anode power supply system for an electroplating equipment is also provided, comprising: a first rectifier 2 for electrically connecting to an external power source; a plurality of second rectifiers 4, each second rectifier 4 being disposed on a corresponding fixture 3 and moving with the fixture 3; a plurality of mutually insulated segmented anodes, each segmented anode including an anode plate 6, the anode plate 6 serving as the power supply terminal of the segmented anode; and a second conductive element 7 disposed on each fixture 3, electrically connected to the second rectifier 4, and disposed corresponding to the segmented anode, for realizing electrical conduction between the segmented anode and the corresponding cathode plate 5; wherein each second rectifier 4 simultaneously supplies power to the corresponding cathode plate 5 and the corresponding segmented anode, so that the cathode plate 5 corresponding to each fixture 3 corresponds one-to-one with the segmented anode and is powered independently.

[0067] In this embodiment, the first rectifier 2 is connected to an external power source for unified power supply, and the current is then conducted to the second rectifier 4 mounted on the hanger 3 via the first conductive element. The second rectifier 4 then conducts the current to the second conductive element 7. The segmented anode includes an anode plate 6, which serves as the power supply terminal for the segmented anode. As the hanger 3 moves along the length of the electroplating tank 1, the second conductive element 7 overlaps with the anode plate 6, conducting the current to the anode plate 6. At this time, both the anode plate 6 and the cathode plate 5 are located in the electrolyte of the electroplating tank 1. The current on the anode plate 6 is conducted to the cathode plate 5 through the electrolyte, and the current on the cathode plate 5 flows back to the second rectifier 4. Under the action of the electrolyte, the anode plate 6 and the cathode plate 5 form an electroplating circuit, thereby generating an electroplated layer on the surface of the cathode plate 5.

[0068] In addition, each fixture 3 is equipped with a second conductive element 7 and a cathode plate 5, so that there are multiple independent cathode plates 5 along the length of the electroplating tank 1; and multiple anode plates 6 are spaced apart along the length of the electroplating tank 1, which divides the anodes along the length of the electroplating tank 1. Adjacent anode plates 6 are insulated from each other, which can block the current from flowing between adjacent anode plates 6 and avoid current deviation; and each fixture 3 is equipped with an independent second rectifier 4 and a cathode plate 5, so that the cathodes are independently powered, reducing the risk of uneven current distribution and current competition caused by multiple fixtures 3 sharing the same power supply.

[0069] As the fixture 3 moves the cathode plate 5, the second conductive element 7 also moves synchronously and always overlaps a certain number of anode plates 6. This ensures that each section of the cathode plate 5 forms an independent power supply area with the anode plate 6 overlapped by the second conductive element 7 on the fixture 3. This guarantees that the cathode plate 5 can conduct current with the anode plate 6 while the fixture 3 is moving the cathode plate 5, reducing the area difference between the interacting anode plate 6 and the cathode plate 5, and thus reducing the current difference between the anode plate 6 and the cathode plate 5. This improves the uniformity of electroplating and can meet the electroplating production needs under different working conditions.

[0070] According to an embodiment of the present invention, another aspect provides an electroplating system including the electroplating apparatus of the previous embodiment.

[0071] By setting up the electroplating equipment described above, the electroplating system in this embodiment can avoid problems such as current deviation and uneven electric field distribution. The entire system is reliable in operation and easy to maintain, taking into account both electroplating quality and production efficiency, and can meet the electroplating production needs of multiple varieties and large batches of plates.

[0072] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. An electroplating device, characterized in that, include: Electroplating tank (1), the interior of which is used to contain electrolyte; The first rectifier (2) is used for electrical connection with an external power supply; Multiple fixtures (3) are spaced apart along the length of the electroplating tank (1) and can move along the length of the electroplating tank (1). Each fixture (3) is provided with a second rectifier (4) and a cathode plate (5). The second rectifier (4) and the cathode plate (5) are electrically connected. The cathode plate (5) is located in the electroplating tank (1). The second rectifier (4) and the first rectifier (2) are electrically connected through a first conductive element. Multiple anode plates (6) are arranged at intervals along the length of the electroplating tank (1), and adjacent anode plates (6) are insulated from each other. The anode plates (6) are located inside the electroplating tank (1). Each of the hangers (3) is provided with a second conductive element (7), which is electrically connected to the second rectifier (4). The second conductive element (7) is provided corresponding to the anode plate (6) and is used to realize the electrical conduction between the anode plate (6) and the cathode plate (5). The second conductive element (7) simultaneously overlaps multiple anode plates (6) along the length direction of the electroplating tank (1), so that the anode plate (6) and the cathode plate (5) in the working state have electroplating areas with basically equal areas.

2. The electroplating equipment according to claim 1, characterized in that, An insulating plate (8) is provided between two adjacent anode plates (6) along the length of the electroplating tank (1).

3. The electroplating equipment according to claim 1, characterized in that, The second conductive element (7) includes a plurality of conductive copper brushes (701), which are spaced apart along the length of the electroplating tank (1) and connected in series.

4. The electroplating equipment according to claim 3, characterized in that, Along the length of the electroplating tank (1), the width W of the conductive copper brush (701) is greater than the gap L between two adjacent anode plates (6).

5. The electroplating equipment according to claim 4, characterized in that, The gap between two adjacent fixtures (3) is adjustable. Along the length of the electroplating tank (1), when the width of the cathode plate (5) is less than the total width of the multiple anode plates (6) corresponding to the second conductive element (7), the gap between two adjacent fixtures (3) is reduced; when the width of the cathode plate (5) is greater than the total width of the multiple anode plates (6) corresponding to the second conductive element (7), the gap between two adjacent fixtures (3) is increased.

6. The electroplating equipment according to claim 1, characterized in that, The second rectifier (4) has a first positive output port (201) and a second positive output port (202) that are independent of each other. The multiple anode plates (6) are arranged in two groups. The two groups of anode plates (6) are located on opposite sides of the cathode plate (5). The two groups of anode plates (6) are electrically connected to the first positive output port (201) and the second positive output port (202) through the second conductive element (7). The first positive output port (201) and the second positive output port (202) are set with independent output currents, so that the cathode plate (5) can obtain different coating thicknesses on opposite sides.

7. The electroplating equipment according to claim 1, characterized in that, The hanger (3) extends to form clamping parts on opposite sides. The second rectifier (4) has a first negative output port (203) and a second negative output port (204) that are independent of each other. One end of the clamping part on both sides of the hanger (3) is connected to the first negative output port (203) and the second negative output port (204) respectively, and the other end clamps the two opposite surfaces of the cathode plate (5) and forms an electrical connection between the two surfaces of the cathode plate (5) and the first negative output port (203) and the second negative output port (204).

8. The electroplating equipment according to claim 1, characterized in that, The first conductive element is located inside the electroplating tank (1). The first conductive element includes a positive electrode copper busbar (9) and a negative electrode copper busbar (10). The positive electrode copper busbar (9) is electrically connected to the positive electrode of the first rectifier (2), and the negative electrode copper busbar (10) is electrically connected to the negative electrode of the first rectifier (2). Power-collecting elements (11) are also provided on both sides of the hanger (3). The power-collecting elements (11) on both sides of the hanger (3) move synchronously with the hanger (3) and overlap with the positive electrode copper busbar (9) and the negative electrode copper busbar (10) respectively.

9. The electroplating equipment according to claim 1, characterized in that, The electroplating tank (1) is provided with a height adjustment part (12), which is located at the lower end of the cathode plate (5) along the height direction of the electroplating tank (1). The height adjustment part (12) is used to adjust the position of the cathode plate (5) to ensure that the electric field of the anode plate (6) covers the cathode plate (5).

10. A separate cathode and anode power supply system for an electroplating equipment, characterized in that, include: The first rectifier (2) is used for electrical connection with an external power supply; Multiple second rectifiers (4), each second rectifier (4) is disposed on a corresponding hanger (3) and moves with the hanger (3); Multiple mutually insulated segmented anodes, each segmented anode including an anode plate (6), the anode plate (6) serving as the power supply terminal of the segmented anode; The second conductive element (7) is disposed on each of the hangers (3), electrically connected to the second rectifier (4), and disposed corresponding to the segmented anode, for realizing the electrical conduction between the segmented anode and the corresponding cathode plate (5); wherein, each of the second rectifiers (4) simultaneously supplies power to the corresponding cathode plate (5) and the corresponding segmented anode, so that the cathode plate (5) corresponding to each hanger (3) corresponds to the segmented anode one by one and supplies power to each other independently.

11. An electroplating system, characterized in that, include: The electroplating equipment as described in any one of claims 1 to 9, or including the power supply system as described in claim 10.

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