Electroplating apparatus and electroplating device

Abstract

The application provides an electroplating device and an electroplating equipment, relates to the technical field of electroplating, and solves the technical problem of abnormal electroplating caused by abnormal anode liquid temperature and concentration in an electroplating cavity. The electroplating device comprises: a plurality of electroplating cavities, each of which is divided into an anode space and a cathode space; at least one group of circulating tanks, all circulating spaces of each group of circulating tanks are configured to communicate with the anode spaces of all electroplating cavities with the same anode liquid composition; all circulating spaces in each group of circulating tanks and all anode spaces corresponding to the communication form a circulating channel that is mutually communicated, and the circulating channel is configured to circulate the same anode liquid in the anode space of the corresponding electroplating cavity during the electroplating process to regulate the concentration and temperature of the anode liquid, so that the concentration of the target component of the anode liquid can be maintained at a set concentration, the temperature of the anode liquid can be maintained at a set temperature, and the abnormal electroplating caused by the change of the concentration of the target component and the deviation of the temperature of the anode liquid is avoided.

Description

Technical Field

[0001] This application relates to the field of electroplating technology, specifically to an electroplating apparatus and electroplating equipment. Background Technology

[0002] In advanced process metal interconnects or wafer packaging, electroplating equipment is required to perform electroplating processes on wafers. The process chamber of electroplating equipment generally includes an electroplating chamber and a fixture located at the top of the chamber. The fixture can open and close; when open, the wafer can be placed horizontally into the fixture, and then the fixture closes to fix the wafer horizontally. Once fixed, the wafer's electroplating side faces down and can move up and down, tilt, and rotate with the fixture. The electroplating chamber typically contains an electroplating solution, which includes an anolyte and a catholyte. An ion exchange membrane, typically a cation exchange membrane, is placed between the anolyte and catholyte, with the catholyte above the ion exchange membrane and the anolyte below it. A soluble metal anode, or an insoluble inert metal or oxide-coated anode, is typically placed in the anolyte.

[0003] During electroplating, the jig carries the wafer downwards, immersing the front side of the wafer into the catholy solution of the electroplating chamber. With the cathode and anode connected to an external power source, the electroplating process can begin. During long-term electroplating, the metal anode in the anolyte is electrolyzed into metal cations. The resistance heating of the solution during electrolysis causes the anolyte temperature to rise, leading to abnormal temperatures throughout the electroplating chamber, affecting the electroplating effect and causing abnormal deposition. During prolonged electroplating, as metal ions in the catholyte are consumed, changes in osmotic pressure across the ion exchange membrane cause metal ions from the anolyte to permeate through the ion exchange membrane into the catholyte, achieving a dynamic equilibrium between the two solutions. However, in this process, a high concentration of metal cations in the anolyte can cause metal ions to appear in the form of oxides or hydroxides, increasing resistance and causing a sharp rise in voltage. This can lead to abnormalities in the electroplating process, affecting the electroplating rate and uniformity, and even causing electroplating defects. Summary of the Invention

[0004] To address the aforementioned technical problems, this application is proposed. Embodiments of this application provide an electroplating apparatus and an electroplating device.

[0005] In a first aspect, one embodiment of this application provides an electroplating apparatus, comprising: a plurality of electroplating chambers, each electroplating chamber being divided into an anode space located at the lower part and a cathode space located above the anode space, wherein the anode space in each electroplating chamber contains an anolyte with the same or different composition; at least one set of circulation tanks, each set of circulation tanks containing at least one circulation tank, each circulation tank having a circulation space, the circulation spaces in all circulation tanks within a set of circulation tanks being interconnected, and all circulation spaces in each set of circulation tanks being configured to connect to the anode spaces of all electroplating chambers having the same anolyte composition; wherein all circulation spaces in each set of circulation tanks and the corresponding connected anode spaces form interconnected circulation pathways, the circulation pathways being configured to circulate the same anolyte in the anode space of the corresponding electroplating chamber during the electroplating process to regulate the concentration and temperature of the anolyte.

[0006] In some embodiments, there are multiple sets of circulation tanks, and the anolyte composition in the anode space of the electroplating chamber connected to each of the multiple sets of circulation tanks is different.

[0007] In some embodiments, the electroplating apparatus further includes: at least one concentration analysis component disposed on a circulation tank and configured to detect the current concentration of at least one target component of the anolyte in the circulation space, such that a control device connected in communication generates a concentration adjustment signal based on the current concentration of at least one target component and a set concentration of at least one target component; and at least one concentration adjustment component disposed on the circulation tank or the electroplating chamber and configured to receive the concentration adjustment signal sent by the control device connected in communication, and add an adjustment solution to the circulation space or the anolyte space based on the concentration adjustment signal to adjust the current concentration of at least one target component to the set concentration of at least one target component.

[0008] In some embodiments, the electroplating apparatus further includes at least one temperature control component disposed within the circulation space and configured to detect and adjust the current temperature of the anolyte within the circulation space.

[0009] In some embodiments, the temperature control component includes: a temperature detection component disposed inside the circulation space, configured to detect the current temperature of the anolyte in the circulation space, enabling a control device connected in communication to generate a temperature adjustment signal based on the current temperature and a set temperature; and a temperature adjustment component disposed above the anolyte in the circulation space, configured to receive the temperature adjustment signal sent by the control device connected in communication, and to heat and / or cool the anolyte in the circulation space according to the temperature adjustment signal, so as to regulate the anolyte circulation in the anolyte space of the electroplating chamber to the set temperature during the electroplating process.

[0010] In some embodiments, the electroplating apparatus further includes at least one bubble removal component, which is wholly or partially immersed in the anolyte within the circulation space and is configured to remove bubbles from the anolyte within the circulation space.

[0011] In some embodiments, each electroplating chamber further has an inlet and an outlet communicating with the anode space, and all circulation spaces in each group of circulation tanks are connected to the corresponding communicating anode space through the inlet and outlet; wherein, the electroplating apparatus further includes: at least one ion exchange membrane disposed in the electroplating chamber to divide the electroplating chamber into an anode space and a cathode space, the ion exchange membrane being configured to selectively transport specific ions; at least one inlet control valve disposed on a first communicating pipe between the inlet and the circulation space; at least one outlet control valve disposed on a second communicating pipe between the outlet and the circulation space; and at least one level detection component disposed in the electroplating chamber, configured to detect the current level of the catholyte in the cathode space, and determine whether the ion exchange membrane is damaged based on the current level and a set level.

[0012] In some embodiments, the outlet is located near the lower part of the anode space, and the inlet is located near the upper part of the anode space.

[0013] In some embodiments, the electroplating apparatus further includes: at least one electroplating tank, which is connected to the cathode space of one or two electroplating chambers via a cathode connecting pipe, the electroplating tank being configured to circulate and control the temperature, concentration, and flow rate of the cathodic liquid in the cathode space of the connected electroplating chambers.

[0014] Secondly, one embodiment of this application provides an electroplating apparatus, including: a plurality of clamps configured to carry a wafer; an electroplating apparatus according to any of the first aspects above, wherein the clamps are capable of carrying the wafer and immersing it in the cathodic liquid of the cathode space of the electroplating chamber of the electroplating apparatus, and the electroplating apparatus is configured to perform an electroplating process on the wafer.

[0015] The electroplating apparatus and equipment proposed in this application, because the circulation path can regulate the concentration and temperature of the same anolyte in the anode space of the corresponding electroplating chamber during the electroplating process, can maintain the concentration of the target component (especially metal cations) of the anolyte at a set concentration and the temperature of the anolyte at a set temperature, avoiding electroplating abnormalities caused by changes in the concentration of the target component and deviations in the anolyte temperature, thus improving electroplating efficiency and uniformity. Furthermore, a set of circulation tanks includes multiple circulation tanks. When there are many electroplating chambers, the circulation space of each circulation tank can be connected to the anode space of a small number of electroplating chambers through pipes. This reduces the need for only a few connecting holes in the tank wall for connecting to the pipes, improving the aesthetics of the circulation tank, reducing the layout and processing difficulty of the connecting holes, and giving the tank wall higher structural strength. Attached Figure Description

[0016] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0017] Figure 1 The diagram shown is a structural schematic of a first electroplating apparatus provided in an exemplary embodiment of this application.

[0018] Figure 2 The diagram shown is a structural schematic of a second electroplating apparatus provided in an exemplary embodiment of this application.

[0019] Figure 3 The diagram shown is a structural schematic of the connection between the circulation tank and the electroplating chamber provided in an exemplary embodiment of this application.

[0020] Figure 4 The diagram shown is a structural schematic of a third electroplating apparatus provided in an exemplary embodiment of this application.

[0021] Figure 5 The diagram shown is a structural schematic of a fourth electroplating apparatus provided in an exemplary embodiment of this application.

[0022] Figure 6 The diagram shown is a structural schematic of a fifth electroplating apparatus provided in an exemplary embodiment of this application.

[0023] Figure 7 The diagram shown is a structural schematic of an electroplating apparatus provided in an exemplary embodiment of this application.

[0024] Figure label: 100. Electroplating apparatus; 110. Electroplating chamber; 111. Anode space; 112. Cathode space; 113. Anode; 114. Outlet; 115. Inlet; 120. Circulation tank; 121. Circulation space; 130. Ion exchange membrane; 140. Circulation tank connecting pipe; 150. Circulation pump; 160. First connecting pipe; 170. Second connecting pipe; 180. Concentration analysis component; 190. Temperature control component; 200. Bubble removal component; 210. Inlet control valve; 220. Outlet control valve; 230. Liquid level detection component; 240. Support assembly; 300. Electroplating tank; 400. Electroplating equipment; 500. Fixture. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] Figure 1 The diagram shown is a structural schematic of a first electroplating apparatus provided in an exemplary embodiment of this application. Figure 2 The diagram shown is a structural schematic of a second electroplating apparatus provided in an exemplary embodiment of this application. Figure 3 The diagram shown is a structural schematic of the connection between the circulation tank and the electroplating chamber provided in an exemplary embodiment of this application. For clarity of the structural representation, [the diagram is omitted]. Figure 1 and Figure 2 The second connecting pipe has been omitted.

[0027] like Figures 1-3As shown, this application embodiment provides an electroplating apparatus 100, which includes a plurality of electroplating chambers 110 and at least one set of circulation tanks 120. Each electroplating chamber 110 is divided into an anode space 111 located at the bottom and a cathode space 112 located above the anode space 111. The anode space 111 in each electroplating chamber 110 contains anolyte with the same or different compositions. Each set of circulation tanks 120 includes at least one circulation tank 120, and each circulation tank 120 is provided with a circulation space 121. The circulation spaces 121 in all circulation tanks 120 in a set of circulation tanks 120 are interconnected. All circulation spaces 121 in each set of circulation tanks 120 are configured to connect with the anode spaces 111 of all electroplating chambers 110 with the same anolyte composition. In each group of circulation tanks 120, all circulation spaces 121 and corresponding connected anode spaces 111 form interconnected circulation paths. The circulation paths are configured to circulate the same anolyte in the anode spaces 111 of the corresponding electroplating chambers 110 during the electroplating process to regulate the concentration and temperature of the anolyte.

[0028] Specifically, the electroplating chamber 110 is the location for the electroplating process. The interior of the electroplating chamber 110 can be divided, for example, by an ion exchange membrane 130 into an upper cathode space 112 and a lower anode space 111. The ion exchange membrane 130 allows specific ions to pass through (e.g., copper ions, hydrogen ions, etc.), but prevents additives in the cathode space 112 from migrating to the anode space 111. An anode 113 is also provided in the anode space 111. During the process, the wafer-carrying fixture 500 immerses the side of the wafer to be electroplated into the catholy solution in the cathode space 112.

[0029] Specifically, such as Figure 1 As shown, a set of circulation tanks 120 may contain only one circulation tank 120, or it may contain multiple circulation tanks 120 that are connected to the circulation space 121 through circulation tank connecting pipes 140, such as... Figure 2 As shown, the circulation spaces 121 of the four circulation tanks 120 are connected by four circulation tank connecting pipes 140. Different circulation tanks 120 can be arranged on the same or different planes. The anolyte in the anode space 111 of each electroplating chamber 110 can be directly connected to the circulation space 121 of the same circulation tank 120 through two pipes (i.e., the first connecting pipe 160 and the second connecting pipe 170 described below) (e.g., ...). Figure 3(As shown), or, the anolyte in the anode space 111 of each electroplating chamber 110 can be directly connected to the circulation space 121 of a circulation tank 120 through one pipe, and directly connected to the circulation space 121 of another circulation tank 120 through another pipe. The circulation spaces 121 of these two circulation tanks 120 are directly or indirectly connected, so that the anolyte can form a circulation flow from the circulation space 121 to the anode space 111, and then from the anode space 111 to the circulation space 121.

[0030] Specifically, the electroplating apparatus 100 further includes a circulation pump 150, which is connected via a pipe to the circulation space 121 of the circulation tank 120 and the anode space 111 of the electroplating chamber 110. The circulation pump 150 can drive the anolyte in the circulation space 121 to flow to the anode space 111 of the electroplating chamber 110. Exemplarily, the first connecting pipe 160 includes a first pipe section and a second pipe section, with the circulation pump 150 connected between the first and second pipe sections. The first pipe section connects the circulation pump 150 and the circulation space 121, and the second pipe section connects the circulation pump 150 and the anode space 111.

[0031] In the above embodiments, since the circulation path can regulate the concentration and temperature of the same anolyte in the anode space 111 of the corresponding electroplating chamber 110 during the electroplating process, the concentration of the target component (especially metal cations) of the anolyte can be maintained at a set concentration, and the temperature of the anolyte can be maintained at a set temperature. This avoids electroplating abnormalities caused by changes in the concentration of the target component and deviations in the anolyte temperature, thereby improving electroplating efficiency and uniformity. Furthermore, a set of circulation tanks 120 includes multiple circulation tanks 120. When there are a large number of electroplating chambers 110, the circulation space 121 of each circulation tank 120 can be connected to the anode space 111 of a small number of electroplating chambers 110 through pipes. This allows the tank wall of the circulation tank 120 to have only a few connecting holes for connecting to the pipes, improving the aesthetics of the circulation tank 120, reducing the layout and processing difficulty of the connecting holes of the circulation tank 120, and giving the tank wall of the circulation tank 120 higher structural strength.

[0032] The target components include various target ions, compounds, and other different components. It can be understood that they can be any component in the electroplating solution.

[0033] Figure 4 The diagram shown is a structural schematic of a third electroplating apparatus provided in an exemplary embodiment of this application. The diagram is for clarity of the structure. Figure 4 The second connecting pipe 170 is omitted.

[0034] In some embodiments, such as Figure 4As shown, there are multiple sets of circulation tanks 120, and the anolyte composition in the anode space 111 of the electroplating chamber 110 is different for each of the multiple sets of circulation tanks 120 and all the circulation spaces 121 are respectively connected to the anode space 111 of the electroplating chamber 110.

[0035] Specifically, when the electroplating process needs to handle different plating types (such as copper, nickel, gold, etc.) or different process formulations, an independent circulation path can be configured for each anolyte component. That is, all electroplating chambers 110 with the same anolyte composition are grouped together and connected to a corresponding set of circulation tanks 120; while another set of electroplating chambers 110 with different anolyte compositions are connected to another independent set of circulation tanks 120.

[0036] For example, such as Figure 4 As shown, there are four sets of circulation tanks 120. Each set of circulation tanks 120 contains one circulation tank 120. The circulation space 121 of each set of circulation tanks 120 is connected to the anode space 111 of the two electroplating chambers 110.

[0037] For example, suppose the electroplating apparatus 100 includes eight electroplating chambers 110, wherein the first four electroplating chambers 110 are used for copper plating and the latter four electroplating chambers 110 are used for nickel plating. The anode spaces 111 of the first four electroplating chambers 110 can be connected to the circulation space 121 of the first set of circulation tanks 120, and the anode spaces 111 of the latter four electroplating chambers 110 can be connected to the circulation space 121 of the second set of circulation tanks 120. The anolyte circulating in the first set of circulation tanks 120 is a copper-containing anolyte, and the anolyte circulating in the second set of circulation tanks 120 is a nickel-containing anolyte.

[0038] In the above embodiments, by setting up multiple sets of circulation tanks 120 and connecting the multiple sets of circulation tanks 120 to the electroplating chamber 110 of the anode space 111 which carries anolytes of different compositions, the electroplating apparatus 100 can simultaneously perform electroplating tasks of multiple coatings or multiple process formulas, and the multiple circulation paths can independently perform the tasks of adjusting the concentration and temperature of the anolyte, avoiding cross-contamination between different anolytes, and significantly improving the process compatibility and production flexibility of the electroplating apparatus 100.

[0039] In some embodiments, such as Figure 1 , Figure 2 and Figure 4As shown, the electroplating apparatus 100 further includes at least one concentration analysis component 180 and at least one concentration adjustment component. The concentration analysis component 180 can be manually controlled or connected to a control device and automatically controlled by the control device. The control device is mainly used to control the operation of the electroplating equipment, primarily through software and electrical signals to control various components such as clamps and robotic arms, thereby automating the operation of the electroplating equipment. The concentration analysis component 180 is disposed on the circulation tank 120 and configured to detect the current concentration of at least one target component of the anolyte in the circulation space 121, enabling the communication-connected control device (which may be a controller, etc.) to generate a concentration adjustment signal based on the current concentration and a set concentration of at least one target component. The concentration adjustment component is disposed on the circulation tank 120 or the electroplating chamber 110 and configured to receive the concentration adjustment signal sent by the communication-connected control device, and add an adjustment solution to the circulation space 121 or the anolyte space 111 according to the concentration adjustment signal to adjust the current concentration of at least one target component to the set concentration of at least one target component.

[0040] Specifically, the concentration analysis component 180 includes a concentration analyzer. The concentration analysis component 180 can be installed in the circulation tank 120 via a pipeline to receive and detect the anolyte in the circulation space 121, thereby determining the current concentration of at least one target component in the anolyte. If there is only one concentration analysis component 180, it can be installed in any circulation tank 120 and detect the concentration of the target component in the circulation space 121 of that circulation tank 120. If there are multiple concentration analysis components 180, each concentration analysis component 180 can be installed in a corresponding circulation tank 120 and detect the concentration of the target component in the circulation space 121 of the corresponding circulation tank 120.

[0041] Specifically, the target components are typically ions that have a critical impact on the quality of the electroplating process, such as copper ions, hydrogen ions, and chloride ions in copper electroplating. The control equipment stores the set concentrations of various target components. The concentration adjustment component stores a specific solution that can dilute or increase the concentration of the target component. If there is only one concentration adjustment component, it can be installed on a circulation tank 120 or an electroplating chamber 110, communicating with a circulation space 121 or an anode space 111; if there are multiple concentration adjustment components, they can be installed on one or more circulation tanks 120 and / or one or more electroplating chambers 110, communicating with one or more circulation spaces 121 and / or one or more anode spaces 111.

[0042] For example, when the control device detects that the copper ion concentration in the anolyte of the circulation space 121 is lower than the set concentration, the control device generates a concentration adjustment signal for copper ion replenishment. After receiving the concentration adjustment signal, the concentration adjustment component quantitatively injects a solution containing a high concentration of copper ions into the circulation space 121, thereby increasing the copper ion concentration in the entire circulation path to the set concentration.

[0043] For example, for N electroplating chambers 110 whose anode space 111 is connected to the circulation space 121 of a certain group of circulation tanks 120, before the electroplating process begins, the anolyte concentration in the anode space 111 of the N electroplating chambers 110 is the same, set as the initial concentration M. After the electroplating process continues for a period of time, the anolyte concentration in the anode space 111 of each electroplating chamber 110 changes. Assuming that the anolyte concentration in the anode space 111 of the N electroplating chambers 110 all changes, and the changed concentrations are M1, M2, M3...Mn respectively, then the anolyte in the anode space 111 of these N electroplating chambers 110 will be collected into the circulation space 121 of the circulation tank 120 through the circulation path. After the concentration analysis component 510 detects the current concentration R of the target component in the mixed anolyte within the circulation space 121, the control device generates a concentration adjustment signal based on the concentration difference between R and the set concentration Mt. Upon receiving the concentration adjustment signal, the concentration adjustment component adds a specific solution (such as a solution containing a high concentration of the target component, or a solution capable of diluting the target component) to the circulation space 121, ensuring that the concentration of the target component in the anolyte within the circulation space 121 remains at Mt. As the anolyte circulates in the circulation path, the anolyte in the anode spaces 111 of the N electroplating chambers 110 continuously exchanges and mixes with the anolyte in the circulation space 121 of the circulation tank 120, ultimately ensuring that the concentration of the target component in the anolyte of the N electroplating chambers 110 is restored and maintained at Mt.

[0044] For example, if the number of concentration analysis components 180 is less than the number of groups of circulation tanks 120, a concentration analysis component 180 with the function of analyzing the concentration of multiple target components can be selected for concentration detection. Furthermore, the concentration analysis component 180 can be set to multiple modes. When analyzing the target component concentration of the anolyte in the circulation space 121 of multiple groups of circulation tanks 120, the detection mode can be switched sequentially to analyze the target component concentration of the anolyte in the circulation space 121 of each group of circulation tanks 120. For example, when detecting the target component concentration of the anolyte in the circulation space 121 of multiple groups of circulation tanks 120, the concentration analysis component 180 can be installed first in the first group of circulation tanks. On the circulation tank 120 in the first group of circulation tanks 120, the concentration analysis component 180 is switched to the first mode to detect the concentration of the target component of the anolyte in the circulation space 121 of the circulation tank 120 in the first group of circulation tanks 120. Then, the concentration analysis component 180 is removed from the circulation tank 120 in the first group of circulation tanks 120 and installed on the circulation tank 120 in the second group of circulation tanks 120. The concentration analysis component 180 is then switched to the second mode to detect the concentration of the target component of the anolyte in the circulation space 121 of the circulation tank 120 in the second group of circulation tanks 120. This process is repeated to reduce the cost of the concentration analysis component 180.

[0045] In the above embodiments, by forming interconnected circulation paths between all circulation spaces 121 in each group of circulation tanks 120 and all corresponding connected anode spaces 111, and by setting up a concentration analysis component 180 and a concentration adjustment component to adjust the concentration of the target component in the circulation path, the concentration of anolyte in the anode spaces 111 of multiple electroplating chambers 110 can be dynamically maintained to the set concentration during the electroplating process, avoiding concentration drift caused by long-term electroplating processes, thereby ensuring the quality of the electroplating process.

[0046] In some embodiments, such as Figures 1-4 As shown, the electroplating apparatus 100 further includes at least one temperature control component 190, which is disposed inside the circulation space 121 and configured to detect and adjust the current temperature of the anolyte within the circulation space 121.

[0047] Specifically, temperature is a key parameter affecting the quality of the electroplating process. By integrating the temperature control component 190 into the circulation space 121 of the circulation tank 120, the temperature of all anolyte flowing through the circulation space 121 can be centrally adjusted. The anolyte in the circulation space 121, after temperature adjustment, will flow to the anode space 111, thereby maintaining the temperature of the anolyte in the anode space 111 at the set temperature. For a group of circulation tanks 120, if there is only one corresponding temperature control component 190, the temperature control component 190 can be set in the circulation space 121 of any circulation tank 120 in the group of circulation tanks 120; if there are multiple temperature control components 190, the multiple temperature control components 190 can be respectively set in the circulation spaces 121 of multiple circulation tanks 120 in the group of circulation tanks 120.

[0048] In the above embodiments, temperature control is performed in the circulation space 121 of the circulation tank 120, which can adjust the temperature of the anolyte in the entire circulation path, thereby enabling the anolyte in the anolyte in the anolyte space 111 to maintain the set temperature and improve the quality of the electroplating process.

[0049] In some embodiments, the temperature control component 190 includes a temperature detection component and a temperature regulation component. The temperature detection component is disposed inside the circulation space 121 and configured to detect the current temperature of the anolyte within the circulation space 121, enabling a control device with a communication connection to generate a temperature regulation signal based on the current temperature and a set temperature. The temperature detection component can be communicationally connected to the control device, which transmits temperature detection commands to the temperature detection component. These commands may include the frequency of temperature detection, etc. The temperature detection component can continuously detect the temperature of the anolyte according to the temperature detection commands and transmit the data to the control device. The control device determines the difference between the detected temperature and the set temperature, thereby determining whether to regulate the temperature of the anolyte. If regulation is required, a temperature regulation signal is generated. The temperature regulation component is disposed above the anolyte within the circulation space 121 and configured to receive the temperature regulation signal sent by the control device with a communication connection, and to heat and / or cool the anolyte within the circulation space 121 according to the temperature regulation signal, thereby regulating the anolyte circulation in the anode space 111 of the electroplating chamber 110 to the set temperature during the electroplating process.

[0050] Specifically, the control device can calculate the temperature difference between the current temperature detected by the temperature detection component and the set temperature, and then generate a corresponding temperature adjustment signal based on the temperature difference.

[0051] Specifically, the temperature control component may include a heating element and / or a cooling element. The heating element may be, for example, a heating wire or a heating tube (the heating tube can be circulated with a heating medium), and the cooling element may be, for example, a cooling tube (the cooling tube can be circulated with a cooling medium). If the current temperature is higher than the set temperature, the temperature control device generates a temperature control signal to activate the cooling element; if the current temperature is lower than the set temperature, the temperature control device generates a temperature control signal to activate the heating element.

[0052] In the above embodiments, by setting temperature detection components and temperature regulation components, the current temperature of the anolyte in the circulation space 121 can be accurately detected and adjusted, so that the temperature of the anolyte in the circulation path is maintained at the set temperature, thereby improving the quality of the electroplating process.

[0053] In some embodiments, such as Figures 1-4 As shown, the electroplating apparatus 100 further includes at least one bubble removal component 200. The bubble removal component 200 is wholly or partially immersed in the anolyte within the circulation space 121 and is configured to remove bubbles from the anolyte within the circulation space 121.

[0054] Specifically, for a set of circulation tanks 120, if there is only one corresponding bubble removal component 200, the bubble removal component 200 can be set in the circulation space 121 of any circulation tank 120 in the set of circulation tanks 120; if there are multiple bubble removal components 200, the multiple bubble removal components 200 can be respectively set in the circulation space 121 of multiple circulation tanks 120 in the set of circulation tanks 120.

[0055] Specifically, tiny air bubbles may be introduced into the anolyte during the flow of the circulating path. If air bubbles are present in the anolyte within the anode space 111, it will seriously affect the quality of the electroplating process.

[0056] In the above embodiments, a bubble removal component 200 is provided in the circulation space 121, which can remove bubbles in the anolyte as it flows through the circulation space 121, thereby removing bubbles from the anolyte in the entire circulation space 121, significantly reducing the number of bubbles in the anolyte ...

[0057] In some embodiments, such as Figure 3As shown, each electroplating chamber 110 also has an inlet 115 and an outlet 114 communicating with the anode space 111. All circulation spaces 121 in each group of circulation tanks 120 are connected to the corresponding anode space 111 through the inlet 115 and the outlet 114. The electroplating apparatus 100 further includes at least one ion exchange membrane 130, at least one inlet control valve 210, at least one outlet control valve 220, and at least one level detection component 230. The ion exchange membrane 130 is disposed within the electroplating chamber 110 to divide the electroplating chamber 110 into an anode space 111 and a cathode space 112. The ion exchange membrane 130 is configured to selectively transport specific ions. The inlet control valve 210 is disposed on a first connecting pipe 160 between the inlet 115 and the circulation space 121. The outlet control valve 220 is disposed on a second connecting pipe 170 between the outlet 114 and the circulation space 121. The liquid level detection component 230 is disposed in the electroplating chamber 110 and is configured to detect the current liquid level of the catholyte in the cathode space 112, and determine whether the ion exchange membrane 130 is damaged based on the current liquid level and the set liquid level.

[0058] Specifically, the inlet 115 is the interface connecting the anode space 111 of the electroplating chamber 110 to the first connecting pipe 160. The outlet 114 is the interface connecting the anode space 111 of the electroplating chamber 110 to the second connecting pipe 170. The ion exchange membrane 130 is an ion-selective permeable membrane, mainly used to prevent additives in the catholyte in the cathode space 112 from entering the anolyte in the anode space 111. Therefore, the integrity of the ion exchange membrane 130 is crucial to preventing cross-contamination between the catholyte and the anolyte.

[0059] Specifically, the inlet control valve 210 and the outlet control valve 220 can be solenoid valves, pneumatic valves, diaphragm valves, ball valves, etc. When the inlet control valve 210 and the outlet control valve 220 are closed, the anolyte will no longer enter the anode space 111 from the inlet port 115 or leave the anode space 111 from the outlet port 114. The level detection assembly 230 can include an ultrasonic level gauge, a capacitive level sensor, or a float switch, etc., for monitoring the level of the catholyte in the cathode space 112.

[0060] When the inlet control valve 210 and outlet control valve 220 are closed, if the ion exchange membrane 130 is damaged, the catholyte will seep into the anode space 111 through the damaged area and mix with the anolyte, causing the catholyte level in the cathode space 112 to drop. Therefore, for any electroplating chamber 110, the following method can be used to determine whether the ion exchange membrane 130 is damaged. First, close the inlet control valve 210 and outlet control valve 220 corresponding to the electroplating chamber 110. Second, the level detection component 230 detects the current level of the catholyte in the cathode space 112. If the difference between the set level and the current level is greater than a preset value, the ion exchange membrane 130 is determined to be damaged; if the difference is less than or equal to the preset value, the ion exchange membrane 130 is determined not to be damaged.

[0061] In the above embodiments, by setting up an inlet control valve 210, an outlet control valve 220, and a liquid level detection component 230, it is possible to easily and accurately detect whether the ion exchange membrane 130 is damaged without disassembling the electroplating chamber 110 and the ion exchange membrane 130.

[0062] In some embodiments, the outlet 114 is located near the lower part of the anode space 111, and the inlet 115 is located near the upper part of the anode space 111.

[0063] Specifically, the lower tank wall of the electroplating chamber 110 encloses to form an anode space 111, and the liquid outlet 114 is close to the lower part of the anode space 111, that is, the liquid outlet 114 is located at the lower part of the lower tank wall. At this time, the liquid outlet 114 is connected to the lower part of the anode space 111; the liquid inlet 115 is close to the upper part of the anode space 111, that is, the liquid inlet 115 is located at the upper part of the lower tank wall. At this time, the liquid inlet 115 is connected to the upper part of the anode space 111.

[0064] In the above embodiments, by placing the liquid outlet 114 near the lower part of the anode space 111, the liquid in the lower part of the anode space 111 can be discharged preferentially, and by placing the liquid inlet 115 near the upper part of the anode space 111, the anolyte can flow into the anode space 111 from the upper part, thereby forming a top-down flow trend, which is beneficial to the stability of the flow field in the anode space 111.

[0065] Figure 5 The diagram shown is a structural schematic of a fourth electroplating apparatus provided in an exemplary embodiment of this application.

[0066] In some embodiments, such as Figure 5As shown, the electroplating apparatus 100 further includes at least one electroplating tank 300. The electroplating tank 300 is connected to the cathode space 112 of one or two electroplating chambers 110 via a cathode connecting pipe. The electroplating tank 300 is configured to circulate and control the temperature, concentration, and flow rate of the cathodic solution in the cathode space 112 of the connected electroplating chambers 110.

[0067] Specifically, the cathodic liquid flows from the electroplating tank 300 to the cathode space 112 of the connected electroplating chamber 110, flows over the wafer surface, and then returns to the electroplating tank 300. This process is repeated, and the liquid circulates between the electroplating tank 300 and the cathode space 112.

[0068] For example, the electroplating tank 300 may be equipped with a cathode concentration control component, a cathode temperature control component, a cathode flow control component, etc., to circulate and control the concentration, temperature and flow rate of the cathode liquid respectively.

[0069] In the above embodiments, the electroplating apparatus 100 is equipped with an independent control mechanism (i.e., electroplating tank 300) for the cathode space 112 to regulate the temperature, concentration, and flow rate of the catholyte, thereby ensuring that the state of the catholyte meets the requirements of the electroplating process. Furthermore, by connecting the electroplating tank 300 to only one or two cathode spaces 112 of the electroplating chambers 110 via cathode connecting pipes, precise control of the catholyte flow rate can be guaranteed. This makes it easier to control the catholyte to flow uniformly and stably tangentially across the wafer surface to be electroplated, allowing metal ions to be uniformly electroplated onto the wafer surface.

[0070] Figure 6 The diagram shown is a structural schematic of a fifth electroplating apparatus provided in an exemplary embodiment of this application. Figure 5 A schematic diagram is shown showing that the electroplating chamber 110 can be placed on both sides of the support assembly 240. Figure 6 A schematic diagram is shown of a support assembly 240 on each side, which can accommodate eight electroplating chambers 110.

[0071] In some embodiments, such as Figure 5 and Figure 6 As shown, there are a total of 16 electroplating chambers 110, which are arranged on both sides of the support assembly 240. Eight electroplating chambers 110 are arranged on each side of the support assembly 240. These eight electroplating chambers 110 on each side can be arranged in two layers, with four electroplating chambers 110 placed in each layer. The eight electroplating chambers 110 on each side of the support assembly 240 can include two groups of electroplating chambers 110, with each group including four electroplating chambers 110. All anode spaces 111 of each group of electroplating chambers 110 are connected to the circulation space 121 of the corresponding circulation tank 120.

[0072] For example, such as Figure 6The bracket assembly 240 shown has eight electroplating chambers 110 on one side. The four electroplating chambers 110 on the left side constitute the first group of electroplating chambers 110, and the four electroplating chambers 110 on the right side constitute the second group of electroplating chambers 110. Similarly, Figure 6 Of the eight electroplating chambers 110 arranged on the other side of the support assembly 240 (not shown), the four electroplating chambers 110 on the left are the third group of electroplating chambers 110, and the four electroplating chambers 110 on the right are the fourth group of electroplating chambers 110.

[0073] In the above embodiments, this layout allows multiple electroplating chambers 110 to be centrally located, enabling each electroplating chamber 110 to be concentrated in one place, thus achieving a modular layout design. This facilitates the pipeline layout design between the chamber and a connected set of circulation tanks 120.

[0074] Figure 7 The diagram shown is a structural schematic of an electroplating apparatus provided in an exemplary embodiment of this application.

[0075] Based on the same concept, such as Figure 7 As shown, this application embodiment also provides an electroplating apparatus 400, which includes: a plurality of clamps 500 and the electroplating device 100 in the above embodiment. The clamps 500 are configured to carry wafers and are capable of carrying the wafers into the cathodic solution in the cathode space 112 of the electroplating chamber 110 of the electroplating device 100. The electroplating apparatus 400 is configured to perform an electroplating process on the wafers.

[0076] Specifically, the electroplating equipment 400 is used for a horizontal electroplating process, that is, the fixture 500 will immerse the wafer in the catholy solution in a horizontal state. The fixture 500 exposes the surface of the wafer to be electroplated and makes the surface of the wafer to be electroplated face downward, so that the surface of the wafer to be electroplated is in full contact with the catholy solution.

[0077] In some embodiments, the electroplating equipment 400 further includes a controller, and the control of the concentration adjustment component, temperature adjustment component, and bubble removal component 200 can all be achieved through the controller.

[0078] Specifically, the controller can receive the analysis results from the concentration analysis component 180, generate a concentration adjustment signal, and send it to the concentration adjustment component to control the concentration of the corresponding component; the controller can also receive the temperature detection results sent by the temperature detection component, generate a temperature adjustment signal, and send it to the temperature adjustment component.

[0079] Since the electroplating equipment 400 includes the electroplating apparatus 100, all the technical features and effects of the electroplating apparatus 100 are included in the electroplating equipment 400 and will not be described in detail here.

[0080] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0081] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0082] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0083] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0084] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. An electroplating apparatus, characterized in that, include: Multiple electroplating chambers, each of which is divided into an anode space at the bottom and a cathode space at the top, wherein the anode space in each electroplating chamber contains anolyte with the same or different composition; At least one set of circulation tanks, each set of circulation tanks includes at least one circulation tank, each circulation tank is provided with a circulation space, the circulation spaces in all the circulation tanks in a set of circulation tanks are interconnected, and all the circulation spaces in each set of circulation tanks are configured to connect with the anode spaces of all the electroplating chambers with the same anode liquid composition; In each group of the circulating tanks, all the circulating spaces and all the corresponding connected anode spaces form an interconnected circulating path. The circulating path is configured to circulate the same anolyte in the anode spaces of the corresponding electroplating chambers during the electroplating process to regulate the concentration and temperature of the anolyte.

2. The electroplating apparatus according to claim 1, characterized in that, The circulation tank consists of multiple sets, and the anolyte composition in the anode space of the electroplating chamber is different for each of the multiple sets of circulation tanks.

3. The electroplating apparatus according to claim 1, characterized in that, Also includes: At least one concentration analysis component is disposed on the circulation tank and configured to detect the current concentration of at least one target component of the anolyte in the circulation space, so that a control device connected in communication generates a concentration adjustment signal based on the current concentration of at least one target component and a set concentration of at least one target component. At least one concentration adjustment component is disposed on the circulation tank or the electroplating chamber and configured to receive the concentration adjustment signal sent by the control device connected in communication, and add an adjustment solution to the circulation space or the anode space according to the concentration adjustment signal to adjust the current concentration of at least one of the target components to a set concentration of at least one of the target components.

4. The electroplating apparatus according to claim 1 or 2, characterized in that, Also includes: At least one temperature control component is disposed within the circulation space and configured to detect and adjust the current temperature of the anolyte within the circulation space.

5. The electroplating apparatus according to claim 4, characterized in that, The temperature control component includes: A temperature detection component is disposed inside the circulation space and configured to detect the current temperature of the anolyte in the circulation space, so that the control device connected in communication generates a temperature adjustment signal based on the current temperature and the set temperature. A temperature regulating component, disposed above the anolyte in the circulation space, is configured to receive the temperature regulating signal sent by the control device connected in communication, and to heat and / or cool the anolyte in the circulation space according to the temperature regulating signal, so as to regulate the anolyte in the anolyte in the anolyte space of the electroplating chamber to the set temperature during the electroplating process.

6. The electroplating apparatus according to claim 1 or 2, characterized in that, Also includes: At least one bubble removal component, which is wholly or partially immersed in the anolyte within the circulation space, is configured to remove bubbles from the anolyte within the circulation space.

7. The electroplating apparatus according to claim 1 or 2, characterized in that, Each of the electroplating chambers also has an inlet and an outlet that communicate with the anode space, and all the circulation spaces in each group of circulation tanks are connected to the corresponding anode space through the inlet and the outlet; The electroplating apparatus further includes: At least one ion exchange membrane is disposed within the electroplating chamber to divide the electroplating chamber into the anode space and the cathode space, and the ion exchange membrane is configured to selectively transport specific ions; At least one liquid inlet control valve is disposed on a first connecting pipe between the liquid inlet and the circulation space; At least one liquid discharge control valve is disposed on a second connecting pipe between the liquid outlet and the circulation space; At least one liquid level detection component is disposed in the electroplating chamber and configured to detect the current liquid level of the catholyte in the cathode space, and determine whether the ion exchange membrane is damaged based on the current liquid level and a set liquid level.

8. The electroplating apparatus according to claim 7, characterized in that, The liquid outlet is located near the lower part of the anode space, and the liquid inlet is located near the upper part of the anode space.

9. The electroplating apparatus according to claim 1 or 2, characterized in that, Also includes: At least one electroplating tank is connected to the cathode space of one or two electroplating chambers via a cathode connecting pipe, the electroplating tank being configured to circulate and control the temperature, concentration, and flow rate of the catholyte in the cathode space of the connected electroplating chambers.

10. An electroplating device, characterized in that, include: Multiple fixtures configured to carry wafers; The electroplating apparatus according to any one of claims 1 to 9, wherein the fixture is capable of carrying the wafer and immersing it in the cathodic liquid of the cathode space of the electroplating chamber of the electroplating apparatus, and the electroplating apparatus is configured to perform an electroplating process on the wafer.

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