Electroplating rack with floating ball and electroplating method

Abstract

The present application relates to electroplating technical field, especially a kind of electroplating frame with float ball, including electroplating frame body, multiple material hanging rods are provided on electroplating frame body, material hanging electrode is provided on material hanging rod corresponding workpiece, material hanging electrode is used to hang workpiece and contact workpiece and is electroplated, material hanging rod is rotatably connected with electroplating frame body, float ball is also provided on electroplating frame body, linkage is provided between float ball and material hanging rod, linkage can drive material hanging rod to rotate when float ball moves along the vertical direction of electroplating frame body.When electroplating frame body is immersed in electroplating solution, float ball will be moved upward by buoyancy, then linkage will drive material hanging rod to rotate, so that the workpiece hung on material hanging electrode is rotated, the opening of workpiece is adjusted, so that electroplating solution can fully enter workpiece, prevent bubble from affecting electroplating effect, when electroplating frame body is taken out from electroplating solution, float ball will drive linkage to rotate and pour out electroplating solution, avoid the situation that electroplating solution is left in workpiece.

Description

Technical Field

[0001] This invention relates to the field of electroplating technology, and in particular to an electroplating rack with a float. Background Technology

[0002] Electroplating is the process of depositing a thin layer of another metal or alloy onto the surface of certain metals using the principle of electrolysis. It utilizes electrolysis to attach a metal film to the surface of metal or other material parts, thereby preventing metal oxidation, improving wear resistance, conductivity, reflectivity, corrosion resistance, and enhancing aesthetics. Many coins also have an electroplated outer layer.

[0003] During electroplating, workpieces are usually installed in batches on an electroplating rack and then immersed in the electroplating solution to complete the electroplating process. Some of the workpieces to be electroplated are container-shaped, and they are usually placed with the opening facing downwards to secure them. When the workpiece opening is facing downwards, the electroplating solution may not be able to fill the workpiece completely. Therefore, air bubbles are easily generated in the electroplating solution during electroplating, and these air bubbles will affect the quality of the electroplating. Summary of the Invention

[0004] To address the problem that air bubbles easily form when the workpiece is inverted and immersed in the electroplating solution during the electroplating of some container-shaped workpieces in the prior art, thus affecting the electroplating quality, this application provides an electroplating rack with a float ball, the specific solution of which is as follows.

[0005] An electroplating rack with a float includes an electroplating rack body, on which multiple hanging rods are provided. Each hanging rod has a hanging electrode corresponding to a workpiece, and the hanging electrode has a slot for placing the workpiece and contacting it for electroplating. The hanging rods are rotatably connected to the electroplating rack body. A float is also provided on the electroplating rack body, and a linkage is provided between the float and the hanging rods. When the float moves along the vertical direction of the electroplating rack body, the linkage can drive the hanging rods to rotate.

[0006] By adopting the above technical solution, a float and a linkage are set up. When the electroplating rack is immersed in the electroplating solution, the float will be buoyed and move upward. Then the linkage will drive the hanging rod to rotate, thereby rotating the workpiece hanging on the hanging electrode and adjusting the opening of the workpiece so that the electroplating solution can fully enter the workpiece, preventing air bubbles from affecting the electroplating effect. When the electroplating rack is removed from the electroplating solution, the float will drive the linkage to rotate and pour out the electroplating solution, avoiding the situation where the electroplating solution remains inside the workpiece.

[0007] Optionally, the linkage includes a float and a connecting rod, with the connecting rod and the hanging rod corresponding one-to-one. One end of the connecting rod is fixedly connected to the hanging rod, and the other end of the connecting rod is hinged to the float. The float can drive the float to move along the vertical direction of the electroplating frame.

[0008] By adopting the above technical solution, a floating frame is set up and a connecting rod is set up for each hanging rod. The connecting rod can drive the corresponding hanging rod to rotate, thereby realizing the synchronous rotation of each connecting rod. This can drive the connecting rod to simultaneously flip the workpiece up and down.

[0009] Optionally, the buoy is located at the bottom of the float.

[0010] By adopting the above technical solution, the float is set at the bottom of the float frame. When the float comes into contact with the electroplating solution, it can float up and push the float frame, thereby flipping the workpiece upwards so that the workpiece can be completely immersed in the electroplating solution.

[0011] Optionally, the buoy is rotatably connected to the float.

[0012] By adopting the above technical solution, the rotation setting of the float allows the float to be pushed by the reaction force when it is immersed in the electroplating solution, thereby releasing a certain reaction force and avoiding the situation where the buoyancy is too large and affects the immersion of the float in the electroplating solution.

[0013] Optionally, the electroplating frame is provided with a limiting rod on the upper side of the float, and the float can interfere with the limiting rod when it moves.

[0014] By adopting the above technical solution, the limiting rod can restrict the movement of the floating frame by abutting against it, avoiding the situation where the floating frame drives the hanging rod to rotate too much and thus fails to achieve the original effect, thereby further improving the stability during use.

[0015] Optionally, the electroplating frame, floating frame, hanging rod, and linkage are all wrapped with an insulating layer, while the hanging electrode is exposed.

[0016] By adopting the above technical solution, the purpose of wrapping with an insulating layer is to reduce the repeated electroplating process by avoiding contact between the electroplating and the metal material, thereby reducing the increase in electroplating costs.

[0017] Optionally, the hanging rod is also provided with multiple anode plates and anode wires, with the anode plates respectively disposed at both ends of the anode wires, and the anode wires connecting two corresponding anode plates.

[0018] By adopting the above technical solution and adding an additional anode, the thickness of the electroplating on the inside and outside of the workpiece can be made consistent, thereby further improving the quality of electroplating.

[0019] Optionally, the electroplating frame is also provided with an indicator, and a linkage is also provided between the indicator and the float. The indicator is rotatably connected to the electroplating frame, and when the float moves upward, the indicator also moves upward.

[0020] By adopting the above technical solution and setting up indicators, the movement of the float can be effectively indicated, thereby judging the status of the hanging rod driven by the float. This allows for the indication of the rotation of the hanging rod during electroplating, determining whether the hanging rod has rotated to the correct position, and further improving the electroplating quality.

[0021] Optionally, the indicator includes an indicator rod and an indicator block. The indicator block is detachably connected to the indicator rod, the indicator rod is covered with an insulating layer, and the indicator block is exposed and can be electroplated and colored.

[0022] By adopting the above technical solution, if the indicator block is immersed in the electroplating solution for electroplating, the indicator block will be colored. When the position of the indicator block is not noticed during production, the electroplating of the indicator block after immersion in the electroplating solution can promptly remind the workers to check the batch of workpieces, avoiding the situation where the quality of the workpiece is affected by bubbles and other reasons and cannot be detected in time.

[0023] An electroplating method, comprising the electroplating rack of claim 9, employing the following method: A. Place the workpiece into the hanging electrode of the hanging rod; B. Submerge the entire electroplating rack in the electroplating solution until the electroplating solution completely submerges the electroplating rack. C. Observe the indicator; electroplating can begin when the indicator extends beyond the surface of the electroplating solution. D. After electroplating, remove the entire electroplating rack. If the indicator changes color, it indicates a problem with the tilt. Inspect the workpiece and replace the indicator.

[0024] By adopting the above technical solution, the float can drive the hanging rod to rotate, and the indicator can indicate the rotation status of the workpiece to determine whether electroplating can be carried out. After the electroplating is completed, the condition of the electroplated part can be used to determine whether there is any problem with the rotation not being in place during the electroplating process, thereby further improving the electroplating quality.

[0025] In summary, this application has at least the following beneficial effects: This application solves the problem in the prior art that when electroplating some container-shaped workpieces, air bubbles easily appear when the workpiece is immersed upside down in the electroplating solution, which affects the electroplating quality. This application sets up a float ball, which can drive all the hanging rods to rotate together, thereby realizing the rotation of the workpiece on the hanging rods. This allows the workpiece to rotate so that the opening faces downward, allowing the electroplating solution to fill the interior of the workpiece, reducing the occurrence of air bubbles and improving the quality of electroplating. Attached Figure Description

[0026] Figure 1 This is a perspective view of this embodiment.

[0027] Explanation of reference numerals in the attached figures: 1. Electroplating frame; 12. Limiting rod; 13. Insulation layer; 14. Indicator rod; 15. Indicator block; 2. Material hanging rod; 21. Material hanging electrode; 211. Slot; 22. Anode plate; 23. Anode wire; 3. Buoy; 31. Float; 32. Linkage rod. Detailed Implementation

[0028] The present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] An electroplating rack with a float, such as Figure 1 As shown, the system includes an electroplating frame 1 with multiple hanging rods 2. Each hanging rod 2 has a corresponding hanging electrode 21. The hanging electrode 21 has a slot 211 for placing and contacting the workpiece for electroplating. The hanging rods 2 are rotatably connected to the electroplating frame 1. A float 3 is also provided on the electroplating frame 1, and a linkage is connected between the float 3 and the hanging rods 2. When the float 3 moves vertically along the electroplating frame 1, the linkage drives the hanging rods 2 to rotate. In practice, when the workpiece is hung, the float 3 needs to be fixed to prevent the float 3 from moving up and down and rotating the workpiece, causing it to fall off. During electroplating, the entire electroplating frame 1 is immersed in the electroplating solution. The float 3 will be buoyed and move vertically upwards, driving the workpiece to rotate via the linkage 32. The rotation angle needs to change the workpiece's opening from downward to upward, allowing the electroplating solution to fully enter the workpiece and improve the electroplating effect.

[0030] like Figure 1 As shown, the linkage includes a float 3 and a connecting rod 32. The connecting rod 32 is correspondingly arranged with the hanging rod 2. One end of the connecting rod 32 is fixedly connected to the hanging rod 2, and the other end of the connecting rod 32 is hinged to the float 3. The float 3 can drive the float 3 to move along the vertical direction of the electroplating frame 1. In specific implementation, the up and down movement of the float 3 will drive the connecting rod 32 to rotate as a whole. The rotation of the connecting rod 32 will drive the corresponding hanging rod 2 to rotate, thereby realizing the rotation of the workpiece. A single float 3 can drive the entire float 3 to rotate, thereby driving all the hanging rods 2 to rotate, thus realizing the rotation of the workpiece.

[0031] like Figure 1 As shown, the float 3 is located at the bottom of the float frame 3, and the float 3 is rotatably connected to the float frame 3. In specific implementation, the float 3 located at the bottom of the float frame 3 can drive the float frame 3 to float when it comes into contact with the electroplating solution. It rotates before the workpiece is immersed in the electroplating solution, thereby turning the opening of the workpiece over so that the workpiece can achieve complete contact with the electroplating solution when it is immersed in the electroplating solution.

[0032] like Figure 1As shown, the electroplating frame 1 has a limiting rod 12 on the upper side of the float 3, which can interfere with the float 3 when it moves. In practice, if the workpiece rotates too much, it will affect the contact with the electroplating solution. Therefore, the limiting rod 12 can effectively block the float 3, so that the float 3 stops moving when it reaches the required turning angle, thus improving the electroplating effect.

[0033] like Figure 1 As shown, the electroplating frame 1, the floating frame 3, the hanging rod 2, and the linkage are all covered with an insulating layer 13, while the hanging electrode 21 is exposed. In specific implementations, the insulating layer 13 can be made of materials such as rubber, which can prevent the electroplating frame 1 from coming into excessive contact with the electroplating solution and being electroplated as a whole, thus avoiding resource waste.

[0034] like Figure 1 As shown, the hanging rod 2 is also equipped with multiple anode plates 22 and anode wires 23. The anode plates 22 are respectively located at both ends of the anode wires 23, and the anode wires 23 connect two corresponding anode plates 22. In practical implementation, this design can make the electroplating thickness the same on both the inner and outer sides of the workpiece, further improving product quality.

[0035] like Figure 1 As shown, an indicator is also provided on the electroplating frame 1, and a linkage is also provided between the indicator and the float 3. The indicator is rotatably connected to the electroplating frame 1, and when the float 3 moves upward, the indicator also moves upward. In specific implementation, the indicator can move with the float 3 to indicate the movement of the float 3, and thus indicate the rotation of the workpiece. Electroplating can begin after the workpiece rotates to the indicated position.

[0036] like Figure 1 As shown, the indicator includes an indicator rod 14 and an indicator block 15. The indicator block 15 is detachably connected to the indicator rod 14. The indicator rod 14 is covered with an insulating layer 13, while the indicator block 15 is exposed and can be electroplated. In practice, the indicator block 15 and the indicator rod 14 are detachably connected by a threaded connection. If a worker starts electroplating without noticing the condition of the indicator, the indicator block 15 will also be plated. At this time, the condition of the indicator block 15 can be used to remind the worker to check the batch of products, thereby further improving product quality.

[0037] This embodiment also provides an electroplating method, including the above-mentioned electroplating rack, using the following method: A. Place the workpiece into the hanging electrode 21 of the hanging rod 2; B. Submerge the entire electroplating frame 1 into the electroplating solution until the electroplating solution completely submerges the electroplating frame 1. C. Observe the indicator; electroplating can begin when the indicator extends beyond the surface of the electroplating solution. D. After electroplating, remove the entire electroplating rack 1. If the indicator changes color, it indicates a problem with the tilt. Inspect the workpiece and replace the indicator.

[0038] Working principle: The workpiece is rotated by a float 3 that floats in the electroplating solution. After the workpiece rotates, the opening faces downward, allowing the electroplating solution to enter the workpiece, thus avoiding the influence of air bubbles on the workpiece and improving the electroplating quality.

[0039] The above are preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made to the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An electroplating rack with a float, characterized in that: The device includes an electroplating frame (1), on which multiple hanging rods (2) are provided. Each hanging rod (2) has a hanging electrode (21) corresponding to a workpiece. Each hanging electrode (21) has a slot (211) for placing the workpiece and contacting it for electroplating. The hanging rods (2) are rotatably connected to the electroplating frame (1). The electroplating frame (1) is also provided with a float (3). A linkage is provided between the float (3) and the hanging rods (2). When the float (3) moves along the vertical direction of the electroplating frame (1), the linkage can drive the hanging rods (2) to rotate.

2. The electroplating rack with a float according to claim 1, characterized in that: The linkage includes a float (3) and a connecting rod (32). The connecting rod (32) is arranged in a one-to-one correspondence with the hanging rod (2). One end of the connecting rod (32) is fixedly connected to the hanging rod (2), and the other end of the connecting rod (32) is hinged to the float (3). The float (3) can drive the float (3) to move along the vertical direction of the electroplating frame (1).

3. The electroplating rack with a float according to claim 2, characterized in that: The buoy (3) is located at the bottom of the float (3).

4. The electroplating rack with a float ball according to claim 3, characterized in that: The buoy (3) is rotatably connected to the float (3).

5. The electroplating rack with a float ball according to claim 4, characterized in that: The electroplating frame (1) is provided with a limiting rod (12) on the upper side of the float (3), and the float (3) can interfere with the limiting rod (12) when it moves.

6. The electroplating rack with a float according to claim 5, characterized in that: The electroplating frame (1), the floating frame (3), the hanging rod (2), and the linkage are all wrapped with an insulating layer (13), while the hanging electrode (21) is exposed.

7. The electroplating rack with a float ball according to claim 1, characterized in that: The hanging rod (2) is also provided with a plurality of anode plates (22) and anode wires (23). The anode plates (22) are respectively disposed at both ends of the anode wires (23), and the anode wires (23) connect two corresponding anode plates (22).

8. The electroplating rack with a float according to claim 5, characterized in that: An indicator is also provided on the electroplating frame (1), and a linkage is also provided between the indicator and the float (3). The indicator is rotatably connected to the electroplating frame (1), and the indicator also moves upward when the float (3) moves upward.

9. The electroplating rack with a float ball according to claim 8, characterized in that: The indicator includes an indicator rod (14) and an indicator block (15). The indicator block (15) is detachably connected to the indicator rod (14). The indicator rod (14) is covered with an insulating layer (13). The indicator block (15) is exposed and can be electroplated.

10. An electroplating method, characterized in that, Including the electroplating rack as described in claim 9: The following method is employed: A. Place the workpiece into the hanging electrode (21) of the hanging rod (2); B. Submerge the electroplating frame (1) entirely in the electroplating solution until the electroplating solution completely submerges the electroplating frame (1); C. Observe the indicator; electroplating can begin when the indicator extends beyond the surface of the electroplating solution. D. After electroplating, remove the entire electroplating frame (1). If the indicator changes color, it indicates that there is a problem with the tilt. Inspect the workpiece and replace the indicator.

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