Thermal management device and manufacturing method thereof

Abstract

The heat management device provided in the application comprises a flow channel part and a connecting part, the flow channel part has a flow channel therein, the connecting part has a first sub-communication hole, the first sub-communication hole penetrates through the connecting part, the first sub-communication hole is in communication with the flow channel, and the flow channel part is made of a metal material; the heat management device comprises a solder part, the solder part is an integral part with the flow channel part, the melting point of the connecting part is greater than the melting point of the solder part, and the solder part is directly in contact with and sealed with the connecting part. The application also provides a manufacturing method of the heat management device.

Description

Technical Field

[0001] This application relates to the field of thermal management, and more specifically, to a thermal management device. Background Technology

[0002] Thermal management devices are devices that manage the heat of components, such as those used in residential air conditioners, commercial air conditioners, multi-split air conditioners, or automobiles.

[0003] In related technologies, the thermal management device includes a flow channel section made of aluminum alloy. This flow channel section needs to be connected to a stainless steel refrigerant pipe. The welding of the stainless steel refrigerant pipe to the aluminum alloy flow channel section is mostly done by brazing. Solder is placed between the refrigerant pipe and the flow channel section, and then reflow soldering is performed. Part of the solder contacts the stainless steel refrigerant pipe, and the other part contacts the aluminum alloy flow channel section. The sealing effect between the solder and the flow channel section using this method needs improvement. Summary of the Invention

[0004] This application provides a thermal management device that can improve the sealing effect.

[0005] The thermal management device provided in this application includes a flow channel and a connecting part. The flow channel has a flow channel inside, and the connecting part has a first sub-connecting hole. The first sub-connecting hole penetrates the connecting part and communicates with the flow channel. The flow channel is made of metal.

[0006] The thermal management device includes a solder section, which is integral with the flow channel section. The melting point of the connecting part is greater than that of the solder section, and the solder section and the connecting part are in direct contact and sealed.

[0007] The thermal management device provided in this application includes a solder section, a connecting section, and a flow channel section. The solder section and the connecting section are in direct contact and sealed, and the solder section and the flow channel section are integrated to improve the sealing effect between the solder section and the flow channel section.

[0008] This application also provides a method for manufacturing a thermal management device, comprising the following steps:

[0009] A core, a mold, and a connecting part are provided, and the core, the mold, and the connecting part are combined to form a cavity;

[0010] A molten metal is provided, wherein the melting point of the connecting part is greater than the melting point of the molten metal. The molten metal is poured into the cavity. After the molten metal solidifies, a flow channel casting is obtained. The flow channel casting is in direct contact with the connecting part for sealing.

[0011] The manufacturing method of the thermal management device provided in this application involves combining the core, the mold, and the connecting part to form a cavity, pouring molten metal into the cavity to form a flow channel casting, and having the flow channel casting directly contact and seal with the connecting part to improve the sealing effect. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of a thermal management device according to this application;

[0013] Figure 2 for Figure 1 A three-dimensional sectional view of the first valve seat in the middle;

[0014] Figure 3 for Figure 2 A three-dimensional schematic diagram of the central flow channel section;

[0015] Figure 4 for Figure 1 A three-dimensional cross-sectional view of the flow channel section and the solder section in the middle;

[0016] Figure 5 for Figure 4 An enlarged view of circle A in the center;

[0017] Figure 6 for Figure 1 A three-dimensional schematic diagram of the other side of the central channel section;

[0018] Figure 7 for Figure 1 A three-dimensional schematic diagram of the first and second outer shells;

[0019] Figure 8 This is a schematic diagram of another embodiment of the thermal management device of this application;

[0020] Figure 9 This is a schematic diagram of another embodiment of the thermal management device of this application;

[0021] Figure 10 for Figure 9 A three-dimensional sectional view;

[0022] Figure 11 for Figure 9 Cross-sectional view of the central flow channel section;

[0023] Figure 12 This is a schematic diagram of a thermal management system in the first state according to the present application;

[0024] Figure 13 This is a schematic diagram of a thermal management system of the present application in the second state. Detailed Implementation

[0025] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0026] In related technologies, thermal management devices include a flow channel section made of aluminum alloy. This flow channel section needs to be connected to stainless steel or copper refrigerant pipes. Welding the stainless steel or copper refrigerant pipes to the aluminum alloy flow channel section mostly uses brazing. Solder is placed between the refrigerant pipe and the flow channel section, and reflow soldering is performed. Part of the solder contacts the stainless steel refrigerant pipe, and the other part contacts the aluminum alloy flow channel section, resulting in two contact surfaces between the solder, the flow channel section, and the refrigerant pipe. The sealing performance needs improvement, and the cost is relatively high. In the air conditioning field, the refrigerant pressure is relatively high, and the requirements for sealing performance are also high.

[0027] Therefore, this application provides a thermal management device, referring to Figure 1 as well as Figure 2 Thermal management device

[0028] The device includes a flow channel 1 and a connecting part 2. The flow channel 1 has a flow channel 11 inside, and the connecting part 2 has a first sub-connecting hole 211. The first sub-connecting hole 211 penetrates the connecting part 2 and communicates with the flow channel 11. The flow channel 1 is made of metal. The thermal management device includes a solder part 3. The solder part 3 and the flow channel 1 are integral parts. The melting point of the connecting part 2 is greater than the melting point of the solder part 3. The solder part 3 and the connecting part 2 are in direct contact and sealed.

[0029] By making the solder section 3 and the flow channel section 1 into one piece, the contact between the solder section 3 and the flow channel section 1 is reduced, which reduces the welding surface and improves the sealing performance compared to brazing.

[0030] Specifically, the connecting part 2 has an embedded wall 25, which is in direct contact with the contact wall 31. The area of ​​the embedded wall 25 located in the mounting hole 32 is defined as the first area, and the area of ​​the embedded wall 25 in contact with the contact wall 31 is defined as the second area. The ratio of the second area to the first area is greater than or equal to 0.9 and less than or equal to 1.

[0031] Furthermore, both the solder section 3 and the flow channel section 1 are made of aluminum alloy, while the connecting part 2 is made of stainless steel. The melting point of stainless steel is higher than that of aluminum alloy. Traditional thermal management devices use copper or stainless steel tubing externally. Welding copper tubing to the aluminum alloy flow channel section 1 may lead to electrochemical corrosion between copper and aluminum. Welding stainless steel tubing to the aluminum alloy flow channel section 1 is difficult, typically requiring brazing, which is costly and has limited sealing performance. This solution uses the stainless steel connecting part 2 to directly contact and connect the aluminum alloy solder section 3. The solder section 3 and the flow channel section 1 are a single unit. The external stainless steel or copper tubing is welded to the aluminum alloy flow channel section 1 via the stainless steel connecting part 2, making welding more convenient and improving adaptability.

[0032] In some implementations, refer to Figure 2 as well as Figure 3 The solder part 3 has a mounting hole 32 and a contact wall 31 located in the mounting hole 32. The connecting part 2 is at least partially located in the mounting hole 32. Placing the connecting part 2 into the mounting hole 32 can increase the contact area between the solder part 3 and the connecting part 2, further improve the sealing performance, and also improve the structural strength of the connecting part 2 installed in the solder part 3.

[0033] Specifically, refer to Figure 2 as well as Figure 3 The thermal management device includes a first valve 4, and a connecting portion 2 is at least partially located between the flow channel portion 1 and the first valve 4. The first valve 4 is connected to the connecting portion 2. The first valve 4 is a shut-off valve, and the first valve 4 is welded to the connecting portion 2. In related technologies, the valve body of the shut-off valve is made of copper. By welding the valve body of the copper shut-off valve to the stainless steel connecting portion 2, it is easier to weld and less prone to electrochemical corrosion. Directly welding the valve body of the copper shut-off valve to the aluminum alloy flow channel portion 1 is prone to electrochemical corrosion.

[0034] Specifically, the first valve component 4 includes a first valve body 41, which is made of copper and is welded to the connecting part 2. Furthermore, the solder part 3 and the flow channel part 1 are both made of aluminum alloy, while the connecting part 2 is made of stainless steel. This reduces electrochemical corrosion and makes welding easier. Furthermore, the first valve component 4 includes a threaded part, which is threadedly connected to the first valve body 41. By rotating the threaded part, the flow channel 11 within the first valve body 41 can be blocked.

[0035] In some implementations, refer to Figure 3 as well as Figure 4The flow channel 11 includes a first sub-flow channel 111, a second sub-flow channel 112, and a third sub-flow channel 113. The solder section 3 includes a first sub-solder section 341, a second sub-solder section 342, and a third sub-solder section 343. The mounting hole 32 includes a first sub-mounting hole 321, a second sub-mounting hole 322, and a third sub-mounting hole 323. The contact wall 31 includes a first sub-wall 311, a second sub-wall 312, and a third sub-wall 313. The first sub-solder section 341 has... A first sub-mounting hole 321 is provided; a second sub-soldering section 342 has a second sub-mounting hole 322; a third sub-soldering section 343 has a third sub-mounting hole 323; a first sub-soldering section 341 has a first sub-wall 311 located at the first sub-mounting hole 321; a second sub-soldering section 342 has a second sub-wall 312 located at the second sub-mounting hole 322; and a third sub-soldering section 343 has a third sub-wall 313. 13 is located in the third sub-mounting hole 323. The connecting part 2 includes a first sub-connecting part 21, a second sub-connecting part 22, and a third sub-connecting part 23. The first sub-connecting part 21 has a first sub-connecting hole 211, the second sub-connecting part 22 has a second sub-connecting hole 221, and the third sub-connecting part 23 has a third sub-connecting hole 231. The first sub-connecting part 21 is at least partially located in the first sub-mounting hole 321, and the first sub-wall 311 is in direct contact with the first sub-connecting part 21. The second sub-connecting part 22 is at least partially located in the second sub-mounting hole 322, and the second sub-wall 312 is in direct contact with the second sub-connecting part 22. The third sub-connecting part 23 is at least partially located in the third sub-mounting hole 323, and the third sub-wall 313 is in direct contact with the third sub-connecting part 23. The first sub-connecting hole 211 communicates with the first sub-flow channel 111, the second sub-connecting hole 221 communicates with the second sub-flow channel 112, and the third sub-connecting hole 231 communicates with the third sub-flow channel 113.

[0036] Specifically, refer to Figure 3 as well as Figure 4 The first sub-solder section 341 and the second sub-solder section 342 are located on both sides of the flow channel section 1, and the first sub-solder section 341, the second sub-solder section 342, and the flow channel section 1 are all located on the same side of the third sub-solder section 343. The first sub-solder section 341, the second sub-solder section 342, the third sub-solder section 343, and the flow channel section 1 are an integral structure. Furthermore, the first sub-solder section 341, the second sub-solder section 342, the third sub-solder section 343, and the flow channel section 1 are all made of aluminum alloy.

[0037] In some implementations, refer to Figure 3 as well as Figure 4 The flow channel 1 has a receiving groove 12. The thermal management device includes a second valve 43 connected to the flow channel 1. The second valve 43 includes a valve core 431, which is at least partially located in the receiving groove 12. (Refer to...) Figure 2 as well as Figure 6The valve core 431 has a first valve port 4311, a second valve port 4312, and a third valve port 4313. The first valve port 4311 can communicate with the first sub-flow channel 111, the second valve port 4312 can communicate with the second sub-flow channel 112, and the third valve port 4313 can communicate with the third sub-flow channel 113. By driving the valve core 431 to rotate, the first sub-flow channel 111, the second sub-flow channel 112, and the third sub-flow channel 113 can be interconnected.

[0038] Specifically, refer to Figure 3 as well as Figure 4 The second valve 43 has a first height direction Z1, and the direction perpendicular to the first height direction Z1 is defined as the first direction X, and the direction perpendicular to both the first height direction Z1 and the first direction X is defined as the second direction Y.

[0039] Reference Figure 3 as well as Figure 4 Along the second direction Y, the first sub-solder portion 341 and the second sub-solder portion 342 are located on both sides of the flow channel portion 1; the first sub-flow channel 111, the first sub-mounting hole 321, and the first sub-connecting hole 211 all extend along the second direction Y; the first sub-solder portion 341 and the flow channel portion 1 are distributed along the second direction Y; furthermore, the first sub-flow channel 111, the first sub-mounting hole 321, and the first sub-connecting hole 211 are all coaxially arranged, and the diameter of the first sub-mounting hole 321 is larger than the diameter of the first sub-flow channel 111. Further, the flow channel portion 1 has a first stepped surface 14, which is located between the first sub-mounting hole 321 and the first sub-flow channel 111. The first stepped surface 14 faces the first sub-connecting portion 21. The first stepped surface 14 can limit the first sub-connecting portion 21, and the first stepped surface 14 directly contacts the first sub-connecting portion 21, improving the positional accuracy of the first sub-connecting portion 21 within the first sub-mounting hole 321.

[0040] Reference Figure 3 as well as Figure 4 The second sub-channel 112, the second sub-mounting hole 322, and the second sub-connecting hole 221 all extend along the second direction Y; the second sub-solder portion 342 and the channel portion 1 are distributed along the second direction Y; furthermore, the second sub-channel 112, the second sub-mounting hole 322, and the second sub-connecting hole 221 are all coaxially arranged, and the diameter of the second sub-mounting hole 322 is larger than the diameter of the second sub-channel 112. Further, the channel portion 1 has a second stepped surface, which is located between the second sub-mounting hole 322 and the second sub-channel 112. The second stepped surface faces the second sub-connecting portion 22. The second stepped surface can limit the positioning of the second sub-connecting portion 22, and the second stepped surface directly contacts the second sub-connecting portion 22, improving the positional accuracy of the second sub-connecting portion 22 within the second sub-mounting hole 322.

[0041] Reference Figure 3 as well as Figure 4 The third sub-channel 113, the third sub-mounting hole 323, and the third sub-connecting hole 231 all extend along the first direction X; the third sub-solder portion 343 and the channel portion 1 are distributed along the first direction X; furthermore, the third sub-channel 113, the third sub-mounting hole 323, and the third sub-connecting hole 231 are all coaxially arranged, and the diameter of the third sub-mounting hole 323 is larger than the diameter of the third sub-channel 113. Further, the channel portion 1 has a third stepped surface, which is located between the third sub-mounting hole 323 and the third sub-channel 113. The third stepped surface faces the third sub-connecting portion 23. The third stepped surface can limit the positioning of the third sub-connecting portion 23, and the third stepped surface directly contacts the third sub-connecting portion 23, improving the positional accuracy of the third sub-connecting portion 23 within the third sub-mounting hole 323.

[0042] Specifically, refer to Figure 2 as well as Figure 3 The second valve component 43 includes a second valve body 432, a valve core 431 rotatably connected to the second valve body 432, and the second valve body 432 connected to the flow channel portion 1. Further, the second valve component 43 is a multi-way valve, specifically a three-way valve, a four-way valve, a five-way valve, or a six-way valve, or even a valve with more than six ports.

[0043] In some implementations, refer to Figure 2 as well as Figure 6 The flow channel 11 includes a fourth sub-flow channel 114, the mounting hole 32 includes a fourth sub-mounting hole 324, the connecting part 2 includes a fourth sub-connecting part 24, the fourth sub-connecting part 24 has a fourth sub-connecting hole 241, the solder part 3 includes a fourth sub-solder part 344, the contact wall 31 includes a fourth sub-wall 314, the fourth sub-solder part 344 has a fourth sub-mounting hole 324, the fourth sub-wall 314 is located in the fourth sub-mounting hole 324, and the fourth sub-wall 314 is in direct contact with the fourth sub-connecting part 24. (Refer to...) Figure 2 as well as Figure 6 The valve core 431 has a fourth valve port 4314, the fourth sub-connection portion 24 is at least partially located in the fourth sub-mounting hole 324, the fourth connecting hole communicates with the fourth sub-flow channel 114, and the fourth valve port 4314 is able to communicate with the fourth sub-flow channel 114.

[0044] Specifically, refer to Figure 4 as well as Figure 6 Along the first direction X, the third sub-solder section 343 and the fourth sub-solder section 344 are located on different sides of the flow channel section 1. The fourth sub-solder section 344 and the flow channel section 1 are integral parts, and both the fourth sub-solder section 344 and the flow channel section 1 are made of aluminum alloy.

[0045] In some implementations, refer to Figure 4 as well as Figure 6The second valve member 43 has a first height direction Z1. The extension directions of the first sub-connecting hole 211, the second sub-connecting hole 221, and the third sub-connecting hole 231 are all perpendicular to the first height direction Z1 of the second valve member 43, and the extension direction of the fourth sub-connecting hole 241 is parallel to the first height direction Z1 of the second valve member 43. Along the first height direction Z1 of the second valve member 43, the fourth sub-connecting portion 24 is at least partially located on the same side of the first sub-connecting portion 21, the second sub-connecting portion 22, and the third sub-connecting portion 23. Specifically, the fourth sub-mounting hole 324 extends along the first height direction Z1, and the fourth sub-flow channel 114 has a curved flow channel 11. The fourth sub-flow channel 114 is used to connect the fourth sub-mounting hole 324 and the fourth valve port 4314. By driving the valve core 431 to rotate, the first sub-flow channel 111, the second sub-flow channel 112, the third sub-flow channel 113, and the fourth sub-flow channel 114 are interconnected.

[0046] In some implementations, refer to Figure 2 as well as Figure 7 The flow channel section 1 includes a first valve seat 16, a second valve seat 13, and a first filter 5. The first valve seat 16 is integrally formed with the first sub-solder section 341, the second sub-solder section 342, the third sub-solder section 343, and the fourth sub-solder section 344. The first filter 5 includes a first housing 51 and a first filter element 52. The first housing 51 is connected to the fourth sub-solder section 344 and the second valve seat 13. The first housing 51, the fourth sub-solder section 344, and the second valve seat 13 are integrally formed. The second valve seat 13 has a flow channel 11. The first filter 5 has a first receiving cavity 53, and the flow channel 11 communicates with the first receiving cavity 53. The first filter element 52 is at least partially located in the first receiving cavity 53. The first valve body 41 is connected to the second valve seat 13. An electronic expansion valve is connected to the second valve seat 13. The first valve seat 16 has a receiving groove 12, and has a first sub-flow channel 111, a second sub-flow channel 112, a third sub-flow channel 113, and a fourth sub-flow channel 114. The first valve seat 16 is in direct contact with the first sub-connecting part 21, the second sub-connecting part 22, the third sub-connecting part 23, and the fourth sub-connecting part 24. The first valve seat 16 is connected to the second valve element 43, specifically, the first valve seat 16 is connected to the second valve body 432.

[0047] Specifically, refer to Figure 2 as well as Figure 7The flow channel 11 includes a channel 115, which communicates with the first receiving cavity 53. The first receiving cavity 53 extends along the second direction Y. The thermal management device includes a first outer pipe 7, which is made of stainless steel. The first outer pipe 7 is embedded in the first outer shell 51 and is in direct contact with the first outer shell 51. Along the second direction Y, the first receiving cavity 53 is at least partially located where the first outer pipe 7 communicates with the channel 115. The channel 115 is blocked from the first sub-flow channel 111, the second sub-flow channel 112, the third sub-flow channel 113, and the fourth sub-flow channel 114.

[0048] Furthermore, refer to Figure 2 as well as Figure 7 The thermal management device includes a fourth valve 72, which is a shut-off valve. The fourth valve 72 is welded to the first external pipe 7. The connection structure between the first housing 51, the fourth valve 72 and the first external pipe 7 is the same as the connection structure between the flow channel 1, the connecting part 2 and the first valve 4, and will not be described in detail here.

[0049] In some implementations, refer to Figure 2 as well as Figure 7 The flow channel 1 includes a second filter 8, which includes a second housing 81 and a second filter element 82. The second housing 81 and the second valve seat 13 are integral. The second filter 8 has a second receiving cavity 83. The flow channel 11 communicates with the second receiving cavity 83. The second filter element 82 is at least partially located in the second receiving cavity 83. The second valve body 432 is connected to the second valve seat 13, and the second valve body 432 and the second valve seat 13 are integral.

[0050] Specifically, refer to Figure 2 as well as Figure 7 The thermal management device includes a second outer pipe 71, which is made of stainless steel. The second outer pipe 71 is embedded in the second outer shell 81 and is in direct contact with the second outer shell 81. The connection structure between the second outer shell 81 and the first outer pipe 71 is the same as the connection structure between the flow channel 1 and the connecting part 2, and will not be described in detail here. Furthermore, along the first height direction Z1, the channel 115 is located on one side of the second outer shell 81, and along the first height direction Z1, the second receiving cavity 83 is located between the channel 115 and the second outer pipe 71.

[0051] Specifically, refer to Figure 2 as well as Figure 7 The distribution direction of the second valve 43 and the fourth sub-flow channel 114 is defined as the first direction X. The second valve 43 has a first height direction Z1. The first direction X is perpendicular to the first height direction Z1 of the second valve 43. The second valve 43, the fourth sub-flow channel 114 and the first housing 51 are distributed along the first direction X. Along the first direction X, the fourth sub-flow channel 114 is at least partially located between the second valve 43 and the first housing 51.

[0052] In some implementations, refer to Figure 8 The solder section 3 has a flow channel hole 33 and a contact wall 31. The contact wall 31 is located inside the connecting section 2. The flow channel hole 33 is connected to the first sub-connecting hole 211 and the flow channel 11. The solder section 3 is at least partially located in the first sub-connecting hole 211.

[0053] This application also provides another thermal management device, see reference. Figure 9 as well as Figure 10 The thermal management device includes a flow channel 1 and a connecting part 2. The flow channel 1 has a flow channel 11, and the connecting part 2 has a first sub-connecting hole 211 that penetrates the connecting part 2 and communicates with the flow channel 11. The thermal management device also includes a solder part 3, which is integral with the flow channel 1. The melting point of the connecting part 2 is greater than that of the solder part 3. The solder part 3 has a contact wall 31 that is in direct contact with the connecting part 2.

[0054] By making the solder section 3 and the flow channel section 1 into one piece, the contact between the solder section 3 and the flow channel section 1 is reduced, which reduces the welding surface and improves the sealing performance compared to brazing.

[0055] Specifically, the connecting part 2 has an embedded wall 25, which is in direct contact with the contact wall 31. The area of ​​the embedded wall 25 located in the mounting hole 32 is defined as the first area, and the area of ​​the embedded wall 25 in contact with the contact wall 31 is defined as the second area. The ratio of the second area to the first area is greater than or equal to 0.9 and less than or equal to 1.

[0056] In some implementations, refer to Figure 9 as well as Figure 10 The solder part 3 has a mounting hole 32, the contact wall 31 is located in the mounting hole 32, and the connecting part 2 is at least partially located in the mounting hole 32. Placing the connecting part 2 into the mounting hole 32 can increase the contact area between the solder part 3 and the connecting part 2, further improve the sealing performance, and also improve the structural strength of the connecting part 2 installed in the solder part 3.

[0057] Furthermore, both the solder section 3 and the flow channel section 1 are made of aluminum alloy, while the connecting part 2 is made of stainless steel. The melting point of stainless steel is higher than that of aluminum alloy. Traditional thermal management devices use copper or stainless steel tubing externally. Welding copper tubing to the aluminum alloy flow channel section 1 may lead to electrochemical corrosion between copper and aluminum. Welding stainless steel tubing to the aluminum alloy flow channel section 1 is difficult, typically requiring brazing, which is costly and has limited sealing performance. This solution uses the stainless steel connecting part 2 to directly contact and connect the aluminum alloy solder section 3. The solder section 3 and the flow channel section 1 are a single unit. The external stainless steel or copper tubing is welded to the aluminum alloy flow channel section 1 via the stainless steel connecting part 2, making welding more convenient and improving adaptability.

[0058] Reference Figure 9 as well as Figure 10 The thermal management device includes a third valve 6, which is at least partially located in the flow channel 11. A portion of the flow channel 1 is located on one side of the connecting portion 2, and a coil portion 61 is at least partially located on the other side of the connecting portion 2. The third valve 6 is at least partially located in the first sub-connecting hole 211, and the connecting portion 2 is connected to the third valve 6.

[0059] Specifically, the third valve 6 is a throttle valve, specifically an expansion valve. The third valve 6 has a second height direction Z2, and the first height direction Z1 is parallel to the second height direction Z2.

[0060] Specifically, the third valve component 6 includes a coil portion 61 and a valve core assembly 63. The valve core assembly 63 is partially located within the coil portion 61. The material of the valve core assembly 63 is the same as that of the connecting portion 2. The valve core assembly 63 is located within the first sub-connecting hole 211, and the valve core assembly 63 is welded to the connecting portion 2. The third valve component 6 is a throttle valve. Furthermore, the outer shell of the valve core assembly 63 and the connecting portion 2 are both made of stainless steel, while the flow channel 1 is made of aluminum alloy. In related technologies, it is difficult to weld the stainless steel outer shell of the valve core assembly 63 to the aluminum alloy flow channel 1. Now, by using the stainless steel connecting portion 2 to the stainless steel outer shell of the valve core assembly 63, and embedding the stainless steel connecting portion 2 into the aluminum alloy flow channel 1, the connection between the stainless steel throttle valve and the aluminum alloy flow channel 1 is achieved, making welding easier.

[0061] In some implementations, refer to Figure 10 as well as Figure 11 The mounting hole 32 includes a mounting groove 325 and a receiving hole 326. The mounting groove 325 is recessed from the surface of the solder part 3 to the interior of the solder part 3. Along the extending direction of the mounting groove 325, the receiving hole 326 is located between the mounting groove 325 and the flow channel 11. The receiving hole 326 penetrates the wall corresponding to the flow channel 11 and the wall corresponding to the mounting groove 325. The connecting part 2 is at least partially located in the mounting groove 325, and the contact wall 31 is at least partially located in the mounting groove 325.

[0062] In some implementations, refer to Figure 10 as well as Figure 11 The third valve component 6 is located in the mounting groove 325 and the receiving hole 326. A plane perpendicular to the extension direction of the receiving hole 326 is defined as the projection plane. The projection of the groove wall corresponding to the receiving hole 326 onto the projection plane is at least partially located within the projection of the groove wall corresponding to the mounting groove 325 onto the projection plane. Specifically, the mounting groove 325 and the receiving hole 326 are coaxially arranged.

[0063] In some implementations, refer to Figure 10 as well as Figure 11The mounting hole 32 includes an embedding groove 327, which is recessed from the groove wall corresponding to the mounting groove 325 into the flow channel portion 1. A portion of the connecting portion 2 is located within the embedding groove 327. Specifically, the embedding groove 327 is coaxially arranged with the mounting groove 325. Further, the contact wall 31 includes a first wall 315 and a second wall 316. The first wall 315 is located in the mounting groove 325, and the second wall 316 is located in the embedding groove 327. Both the first wall 315 and the second wall 316 are in direct contact with the connecting portion 2.

[0064] In some implementations, refer to Figure 10 as well as Figure 11 The second wall 316 includes an outer wall 3161, a bottom wall 3162, and an inner wall 3163. Along the radial direction of the mounting groove 325, the bottom wall 3162 is located between the outer wall 3161 and the inner wall 3163. The outer wall 3161, the bottom wall 3162, and the inner wall 3163 are all in direct contact with the connecting part 2.

[0065] This application also provides a method for manufacturing a thermal management device, comprising the following steps:

[0066] Provides a core, a mold, and a connecting part 2, and combines the core, mold, and connecting part to form a cavity;

[0067] A molten metal is provided, wherein the melting point of the connecting part 2 is greater than that of the molten metal. The molten metal is poured into the mold cavity. After the molten metal solidifies, a casting of the flow channel part 1 is obtained. The casting of the flow channel part 1 is in direct contact with the connecting part 2 for sealing.

[0068] By means of the above method, the connecting part 2 is at least partially exposed to the cavity, and molten metal is poured in. The molten metal comes into direct contact with the connecting part 2. After the molten metal solidifies, a casting of the runner part 1 with the connecting part 2 is obtained. By means of the above manufacturing method, the process steps of brazing connection in related technologies can be reduced. The connecting part 2 is welded to the runner part 1 during the manufacturing process of forming the runner part 1 with the runner 11, which greatly reduces the cost and reduces the number of weld points, resulting in better sealing.

[0069] Specifically, the connecting part 2 is made of stainless steel, and the molten metal is made of aluminum alloy. Furthermore, positioning the connecting part 2 at least partially within the cavity includes the following steps:

[0070] The connecting part 2 is sleeved on the core, and the connecting part 2 is at least partially in direct contact with the core. The connecting part 2 is used to form the wall corresponding to the cavity.

[0071] Alternatively, the connecting part 2 can be embedded into the mold, with at least part of the connecting part 2 in direct contact with the mold, and the connecting part 2 is used to form the wall corresponding to the cavity.

[0072] In some embodiments, after the step of pouring molten metal into a mold cavity and allowing the molten metal to solidify, the following steps are included:

[0073] The core is removed from the casting with the connecting part 2 by one or more methods, such as vibration, injection of high-pressure fluid, or heating.

[0074] The flow channel 1 casting is heat-treated and machined to obtain flow channel 1.

[0075] This application also provides a thermal management system, referring to... Figure 12 as well as Figure 13 The thermal management system includes a first flow path 9, a second flow path 91, a third flow path 92, a fourth flow path 93, and a second valve 43. The second valve 43 has a first valve port 4311, a second valve port 4312, a third valve port 4313, and a fourth valve port 4314. The first valve port 4311 is connected to the first flow path 9, the second valve port 4312 is connected to the second flow path 91, and the third valve port 4313 is connected to the third flow path 92. The thermal management system includes a compressor 9. 4. First valve 4, third valve 6, fourth valve 72, first filter 5, second filter 8, outdoor heat exchanger 95, compressor 94 outlet connected to third flow path 92, compressor 94 inlet connected to fourth flow path 93; first flow path 9 connected to first valve 4, first valve 4 is a shut-off valve; second flow path 91 is equipped with outdoor heat exchanger 95, first filter 5, third valve 6, second filter 8 and fourth valve 72, third valve 6 is a throttle valve and fourth valve 72 is a shut-off valve.

[0076] Specifically, the first flow path 9 has a first sub-flow channel 111, the second flow path 91 has a second sub-flow channel 112 and a channel 115, the third flow path 92 has a third sub-flow channel 113, and the fourth flow path 93 has a fourth sub-flow channel 114.

[0077] Reference Figure 12 The thermal management system has a first mode, in which the second valve port 4312 is connected to the third valve port 4313, and the first valve port 4311 is connected to the fourth valve port 4314 to achieve room cooling.

[0078] Reference Figure 13 The thermal management system has a second mode, in which the second valve port 4312 is connected to the fourth valve port 4314, and the first valve port 4311 is connected to the third valve port 4313, thereby achieving room heating. The two modes of the thermal management system are switched by rotating the second valve component 43.

[0079] The above examples illustrate the principles and implementation methods of the present invention. These embodiments are merely illustrative and intended to aid in understanding the method and core concepts of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A thermal management device, characterized in that, It includes a flow channel (1) and a connecting part (2). The flow channel (1) has a flow channel (11) inside, and the connecting part (2) has a first sub-connecting hole (211) through the connecting part (2). The first sub-connecting hole (211) communicates with the flow channel (11). The flow channel (1) is a metal flow channel (1). The thermal management device includes a solder section (3), which is integral with the flow channel section (1). The melting point of the connecting part (2) is greater than that of the solder section (3), and the solder section (3) and the connecting part (2) are in direct contact and sealed.

2. The thermal management device as claimed in claim 1, characterized in that, The solder part (3) has a mounting hole (32), and the connecting part (2) is at least partially located in the mounting hole (32); Both the solder part (3) and the flow channel part (1) are made of aluminum alloy, and the connecting part (2) is made of stainless steel.

3. The thermal management device as described in claim 1, characterized in that, The solder part (3) has a flow channel hole (33), the solder part (3) is at least partially located in the connecting part (2), the flow channel hole (33) is connected to the first sub-connecting hole (211) and the flow channel (11), and the solder part (3) is at least partially located in the first sub-connecting hole (211).

4. The thermal management device as described in claim 2, characterized in that, The thermal management device includes a first valve (4), and the connecting part (2) is at least partially located between the flow channel (1) and the first valve (4), and the first valve (4) is connected to the connecting part (2); The first valve (4) includes a first valve body (41), which is made of copper and is welded to the connecting part (2).

5. The thermal management device as described in claim 2, characterized in that, The flow channel (11) includes a first sub-flow channel (111), a second sub-flow channel (112), and a third sub-flow channel (113); the solder section (3) includes a first sub-solder section (341), a second sub-solder section (342), and a third sub-solder section (343); and the mounting hole (32) includes a first sub-mounting hole (321), a second sub-mounting hole (322), and a third sub-mounting hole (323). The solder section (3) has a contact wall (31), which is at least partially the wall of the mounting hole (32). The contact wall (31) is in direct contact with the connecting part (2) for sealing. The contact wall (31) includes a first sub-wall (311), a second sub-wall (312), and a third sub-wall (313). The first sub-solder section (341) has a first sub-mounting hole (321), the second sub-solder section (342) has a second sub-mounting hole (322), and the third sub-solder section (343) has the first sub-mounting hole (321). The three sub-mounting holes (323) are provided. The first sub-solder part (341) has a first sub-wall (311) located in the first sub-mounting hole (321). The second sub-solder part (342) has a second sub-wall (312) located in the second sub-mounting hole (322). The third sub-solder part (343) has the third sub-wall (313) located in the third sub-mounting hole (323). The connecting part (2) includes a first sub-connector. The device comprises a first sub-connecting part (21), a second sub-connecting part (22), and a third sub-connecting part (23). The first sub-connecting part (21) has a first sub-connecting hole (211), the second sub-connecting part (22) has a second sub-connecting hole (221), and the third sub-connecting part (23) has a third sub-connecting hole (231). The first sub-connecting part (21) is at least partially located in the first sub-mounting hole (321), and the first sub-wall (311) is in direct contact with the first sub-connecting part (21). The second sub-connecting part (22) is at least partially located in the first sub-mounting hole (321). The second sub-mounting hole (322) is in direct contact with the second sub-connecting part (22). The third sub-connecting part (23) is at least partially located in the third sub-mounting hole (323). The third sub-wall (313) is in direct contact with the third sub-connecting part (23). The first sub-connecting hole (211) is connected to the first sub-flow channel (111). The second sub-connecting hole (221) is connected to the second sub-flow channel (112). The third sub-connecting hole (231) is connected to the third sub-flow channel (113). The flow channel (1) has a receiving groove (12), and the thermal management device includes a second valve (43) connected to the flow channel (1). The second valve (43) includes a valve core (431) at least partially located in the receiving groove (12). The valve core (431) has a first valve port (4311), a second valve port (4312), and a third valve port (4313). The first valve port (4311) can communicate with the first sub-flow channel (111), the second valve port (4312) can communicate with the second sub-flow channel (112), and the third valve port (4313) can communicate with the third sub-flow channel (113).

6. The thermal management device as described in claim 5, characterized in that, The solder section (3) has a contact wall (31), which is at least partially the wall of the mounting hole (32). The contact wall (31) is in direct contact with the connecting part (2) for sealing. The flow channel (11) includes a fourth sub-flow channel (114). The mounting hole (32) includes a fourth sub-mounting hole (324). The connecting part (2) includes a fourth sub-connecting part (24), which has a fourth sub-connecting hole (241). The solder section (3) includes a fourth sub-solder section (344). The contact wall (31) includes a fourth sub-wall (344). 314), the fourth sub-solder part (344) has the fourth sub-mounting hole (324), the fourth sub-wall (314) is located in the fourth sub-mounting hole (324), the fourth sub-wall (314) is in direct contact with the fourth sub-connecting part (24), the valve core (431) has the fourth valve port (4314), the fourth sub-connecting part (24) is at least partially located in the fourth sub-mounting hole (324), the fourth connecting hole is connected to the fourth sub-flow channel (114), and the fourth valve port (4314) is capable of communicating with the fourth sub-flow channel (114); The second valve (43) includes a second valve body (432), the valve core (431) is rotatably connected to the second valve body (432), and the second valve body (432) is connected to the flow channel (1).

7. The thermal management device as claimed in claim 6, characterized in that, The second valve (43) has a first height direction (Z1), the extension direction of the first sub-connecting hole (211), the extension direction of the second sub-connecting hole (221) and the extension direction of the third sub-connecting hole (231) are all perpendicular to the first height direction (Z1) of the second valve (43), and the extension direction of the fourth sub-connecting hole (241) is parallel to the first height direction (Z1) of the second valve (43); along the first height direction (Z1) of the second valve (43), the fourth sub-connecting portion (24) is at least partially located on the same side of the first sub-connecting portion (21), the second sub-connecting portion (22) and the third sub-connecting portion (23).

8. The thermal management device as claimed in claim 6, characterized in that, The flow channel section (1) includes a first valve seat (16), a second valve seat (13), and a first filter (5). The first valve seat (16) is integrally formed with the first sub-solder section (341), the second sub-solder section (342), the third sub-solder section (343), and the fourth sub-solder section (344). The first filter (5) includes a first housing (51) and a first filter element (52). The first housing (51) is connected to the fourth sub-solder section (344). 51) Connected to the second valve seat (13), the first housing (51), the fourth sub-solder part (344) and the second valve seat (13) are an integral part, the second valve seat (13) has the flow channel (11), the first filter (5) has a first receiving cavity (53), the flow channel (11) communicates with the first receiving cavity (53), the first filter element (52) is at least partially located in the first receiving cavity (53), and the first valve body (41) is connected to the second valve seat (13); The distribution direction of the second valve (43) and the fourth sub-channel (114) is defined as the first direction (X). The second valve (43) has a first height direction (Z1). The first direction (X) is perpendicular to the first height direction (Z1) of the second valve (43). The second valve (43), the fourth sub-channel (114) and the first housing (51) are distributed along the first direction (X). Along the first direction (X), the fourth sub-channel (114) is at least partially located between the second valve (43) and the first housing (51).

9. The thermal management device according to any one of claims 1-8, characterized in that, The solder part (3) has a contact wall (31), which is at least part of the wall of the mounting hole (32). The contact wall (31) is in direct contact with the connecting part (2) for sealing. The connecting part (2) has an embedded wall (25), which is in direct contact with the contact wall (31). The area of ​​the embedded wall (25) located in the mounting hole (32) is defined as the first area. The area of ​​the embedded wall (25) in contact with the contact wall (31) is defined as the second area. The ratio of the second area to the first area is greater than or equal to 0.9 and less than or equal to 1.

10. The thermal management device as claimed in claim 2 or 3, characterized in that, The thermal management device includes a third valve (6), which is at least partially located in the flow channel (11). A portion of the flow channel (1) is located on one side of the connecting portion (2), and a portion of the third valve (6) is located on the other side of the connecting portion (2). The third valve (6) is at least partially located in the first sub-connecting hole (211), and the connecting portion (2) is connected to the third valve (6).

11. The thermal management device as claimed in claim 10, characterized in that, The third valve (6) includes a coil part (61) and a valve core assembly (63). The valve core assembly (63) is partially located inside the coil part (61). The material of the valve core assembly (63) is the same as that of the connecting part (2). The valve core assembly (63) is partially located in the first sub-connecting hole (211). The valve core assembly (63) is welded to the connecting part (2).

12. The thermal management device as claimed in claim 10, characterized in that, The mounting hole (32) includes a mounting groove (325) and a receiving hole (326). The mounting groove (325) extends from the surface of the solder part (3) to the interior of the solder part (3). Along the extending direction of the mounting groove (325), the receiving hole (326) is located between the mounting groove (325) and the flow channel (11). The receiving hole (326) penetrates the wall corresponding to the flow channel (11) and the wall corresponding to the mounting groove (325). The connecting part (2) is at least partially located in the mounting groove (325). The solder part (3) has a contact wall (31). The contact wall (31) is at least partially located in the mounting groove (325). The third valve (6) is partially located in the mounting groove (325) and the receiving hole (326). A plane perpendicular to the extension direction of the receiving hole (326) is defined as the projection plane. The projection of the groove wall corresponding to the receiving hole (326) on the projection plane is at least partially located within the projection of the groove wall corresponding to the mounting groove (325) on the projection plane.

13. The thermal management device as claimed in claim 12, characterized in that, The mounting hole (32) includes an embedding groove (327), which is recessed from the groove wall corresponding to the mounting groove (325) to the interior of the flow channel (1), and a portion of the connecting portion (2) is located in the embedding groove (327). The contact wall (31) includes a first wall (315) and a second wall (316). The first wall (315) is located in the mounting groove (325), and the second wall (316) is located in the embedding groove (327). Both the first wall (315) and the second wall (316) are in direct contact with the connecting part (2).

14. A method for manufacturing a thermal management device, characterized in that, Includes the following steps: Provide a core, a mold, and a connecting part (2), and combine the core, the mold, and the connecting part to form a cavity; A molten metal is provided, wherein the melting point of the connecting part (2) is greater than the melting point of the molten metal. The molten metal is poured into the cavity. After the molten metal solidifies, a casting of the flow channel part (1) is obtained. The casting of the flow channel part (1) is in direct contact with the connecting part (2) for sealing.

15. The method for manufacturing the thermal management device as described in claim 14, characterized in that: The connecting part (2) is made of stainless steel, and the molten metal is made of aluminum alloy; The process of assembling the core, the mold, and the connecting part to form a cavity includes the following steps: The connecting part (2) is sleeved on the core, and the connecting part (2) is at least partially in direct contact with the core. The connecting part (2) is used to form the wall corresponding to the cavity. Alternatively, the connecting part (2) can be embedded in the mold, and the connecting part (2) can be at least partially in direct contact with the mold, and the connecting part (2) can be used to form the wall corresponding to the cavity.

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