Cooling device for portable high-temperature high-pressure equipment

Abstract

The application discloses a portable cooling device for high-temperature and high-pressure equipment, which comprises an outer shell, a water storage bucket for storing fresh water, a water pumping assembly arranged in the outer shell and connected with the water storage bucket, a water inlet cooling mechanism arranged in the outer shell and connected with the water pumping assembly at one end and connected with a water inlet port of the high-temperature and high-pressure equipment at the other end, and a water return cooling mechanism arranged in the outer shell and connected with the water storage bucket at one end and connected with a water outlet port of the high-temperature and high-pressure equipment at the other end. The application can effectively solve the problems of water resource waste, limited water source for offshore operation, equipment corrosion, large volume of the cooling device, poor portability and low adaptability.

Description

Technical Field

[0001] This invention belongs to the field of cooling device technology, and specifically relates to a portable cooling device for high-temperature and high-pressure equipment. Background Technology

[0002] After the high-temperature and high-pressure equipment test is completed, the working fluid inside the autoclave and the autoclave itself are at high temperatures (up to 200°C or higher). In order to quickly conduct multiple experiments, remove test samples, clean the autoclave, and perform other equipment maintenance operations, the temperature of the autoclave and its interior must be safely and quickly reduced to near room temperature or an operable temperature.

[0003] Currently, most high-temperature and high-pressure equipment uses external cooling water pipes for cooling in cold zones, relying on external water pressure to establish circulation. However, this method wastes freshwater resources, especially during offshore operations where freshwater is scarce and cannot meet the equipment's cooling needs. If seawater is used, it can cause electrochemical and chloride ion corrosion to the metal parts of the equipment. Furthermore, the limited space on offshore platforms, coupled with the large size of the cooling devices, severely restricts their installation and portability, necessitating improvements. Summary of the Invention

[0004] In order to solve all or some of the above problems, the purpose of this invention is to provide a portable cooling device for high temperature and high pressure equipment, which effectively solves problems such as water waste, limited water source for offshore operations, large size of cooling devices, poor portability, and low adaptability.

[0005] This invention provides a portable cooling device for high-temperature and high-pressure equipment, comprising: outer shell; Water storage tank, used to store fresh water; A water pump assembly is disposed within the housing and is used to connect to the water storage tank; A water inlet cooling mechanism is disposed within the housing, with one end of the water inlet cooling mechanism connected to the water pump assembly and the other end used to connect to the water inlet port of the high-temperature and high-pressure equipment; A water return cooling mechanism is disposed within the outer casing, with one end of the mechanism connected to the water storage tank and the other end connected to the drain port of the high-temperature and high-pressure equipment.

[0006] Optionally, the water inlet cooling mechanism includes: A first radiator is disposed within the outer casing. The first radiator is provided with a first heat dissipation channel and a second heat dissipation channel, and the water pump assembly is connected to the water inlet port of the first heat dissipation channel. The water inlet pipe has one end connected to the drain port of the first heat dissipation channel and the other end connected to the water inlet port of the high-temperature and high-pressure equipment.

[0007] Optionally, the water return cooling mechanism includes: A second heat sink is disposed within the outer casing; The first return water pipe has one end connected to the drain port of the high-temperature and high-pressure equipment, and the other end connected to the inlet port of the second radiator. The second return water pipe is connected at one end to the drain port of the second radiator and at the other end to the water storage tank.

[0008] Optionally, the second return water pipe includes: The first branch pipe is connected at one end to the drain port of the second radiator and at the other end to the water inlet port of the second heat dissipation channel; The second branch pipe has one end connected to the drain port of the second heat dissipation channel and the other end connected to the water storage tank.

[0009] Optionally, a filter is connected to the first branch pipe.

[0010] Optionally, the water return cooling mechanism further includes: A cooling fan is disposed inside the housing and faces the second heat sink so that the cooling fan can perform air cooling to cool the second heat sink.

[0011] Optionally, the pump assembly includes: The pump pipe has one end connected to the water storage tank and the other end connected to the water inlet port of the first heat dissipation channel; A circulating pump is connected to the pump water pipe.

[0012] Optionally, the cooling device further includes: A temperature control mechanism is installed inside the outer casing. The temperature control mechanism is electrically connected to the water pump assembly, the inlet cooling mechanism, and the return cooling mechanism, respectively. The temperature control mechanism is used to monitor the inlet and outlet water temperatures of the high-temperature and high-pressure equipment in real time, and to control the power of the water pump assembly, the inlet cooling mechanism, and the return cooling mechanism according to the inlet and outlet water temperatures, so as to achieve real-time regulation of cooling intensity.

[0013] Optionally, the temperature control mechanism includes: The first temperature sensor is connected to the water inlet cooling mechanism and is used to monitor the water inlet temperature of the high-temperature and high-pressure equipment in real time. The second temperature sensor is connected to the return water cooling mechanism and is used to monitor the outlet water temperature of the high-temperature and high-pressure equipment in real time. The control module is mounted on the outer casing and is electrically connected to the first temperature sensor, the second temperature sensor, the water pump assembly, the water inlet cooling mechanism, and the water return cooling mechanism, respectively. The control module is used to receive temperature information from the first temperature sensor and the second temperature sensor, and to control the power of the water pump assembly, the water inlet cooling mechanism and the water return cooling mechanism.

[0014] As can be seen from the above technical solution, the portable cooling device for high-temperature and high-pressure equipment provided by the present invention has the following advantages: This cooling device employs a freshwater circulation cooling mode, forming a closed-loop water circulation system through a water storage tank, an inlet cooling mechanism, and a return cooling mechanism. The cooling water can be repeatedly recycled, completely solving the problem of freshwater waste inherent in traditional open cooling systems. It eliminates the need for external water sources, making it perfectly suited to the freshwater-scarce operating environment of offshore platforms. Simultaneously, this cooling device avoids the electrochemical and chloride ion corrosion problems associated with seawater cooling, effectively protecting the metal structure of high-temperature, high-pressure equipment and extending its service life. Furthermore, the cooling device boasts higher integration and a smaller size, effectively adapting to confined space operating scenarios such as offshore platforms and small laboratories, making it more convenient to move, install, and debug.

[0015] Other features and advantages of the present invention will be set forth in the following description. Attached Figure Description

[0016] The accompanying drawings are provided to further understand the technical solutions of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the technical solutions of the present invention, and do not constitute a limitation on the technical solutions of the present invention.

[0017] Figure 1 This is a schematic diagram of the overall structure of the cooling device in an embodiment of the present invention; Figure 2 This is a schematic diagram of the overall structure of the outer shell in an embodiment of the present invention; Figure 3 This is a schematic diagram of the internal structure of the outer shell in an embodiment of the present invention, showing the main view. Figure 4 This is a schematic diagram of the internal structure of the outer shell in an embodiment of the present invention, showing a side view.

[0018] Explanation of reference numerals in the attached figures: 1. Outer casing; 2. Water storage tank; 3. Pump assembly; 31. Pump pipe; 32. Circulation pump; 4. Inlet cooling mechanism; 41. First radiator; 42. Inlet pipe; 5. Return cooling mechanism; 51. Second radiator; 52. First return pipe; 53. Second return pipe; 531. First branch pipe; 532. Second branch pipe; 54. Filter; 55. Cooling fan; 6. Temperature control mechanism; 61. First temperature sensor; 62. Second temperature sensor; 63. Control module. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in the embodiments of the present invention can be arbitrarily combined with each other.

[0020] like Figure 1 , Figure 2 , Figure 3 , Figure 4 The illustration shows an embodiment of the present invention, which discloses a portable cooling device for high-temperature and high-pressure equipment. The device includes a housing 1, a water storage tank 2, a water pump assembly 3, a water inlet cooling mechanism 4, and a water return cooling mechanism 5. The water storage tank 2 is a foldable tank used to store fresh water. The water pump assembly 3, the water inlet cooling mechanism 4, and the water return cooling mechanism 5 are respectively disposed within the housing 1. The water pump assembly 3 is connected to the water storage tank 2. One end of the water inlet cooling mechanism 4 is connected to the water pump assembly 3, and the other end is connected to the water inlet port of the high-temperature and high-pressure equipment. One end of the water return cooling mechanism 5 is connected to the water storage tank 2, and the other end is connected to the drain port of the high-temperature and high-pressure equipment.

[0021] The cooling device in this embodiment forms a closed-loop water circulation system through a water storage tank 2, an inlet cooling mechanism 4, and a return cooling mechanism 5. The cooling water can be repeatedly recycled, completely solving the problem of freshwater waste in traditional open cooling modes. It does not rely on external water sources and is perfectly suited to the freshwater-scarce operating environment of offshore platforms. At the same time, this cooling device avoids the electrochemical corrosion and chloride ion corrosion problems caused by seawater cooling, effectively protecting the metal structure of high-temperature and high-pressure equipment and extending its service life.

[0022] In one embodiment, such as Figure 1 , Figure 3 , Figure 4 As shown, the water inlet cooling mechanism 4 includes a first radiator 41 and a water inlet pipe 42. The first radiator 41 is fixedly connected inside the outer casing 1. The first radiator 41 is provided with a first heat dissipation channel and a second heat dissipation channel, and the water pump assembly 3 is connected to the water inlet port of the first heat dissipation channel. One end of the water inlet pipe 42 is connected to the drain port of the first heat dissipation channel, and the other end is used to connect to the water inlet port of the high-temperature and high-pressure equipment.

[0023] In one embodiment, such as Figure 1 , Figure 3 , Figure 4As shown, the water return cooling mechanism 5 includes a second radiator 51, a first return water pipe 52, and a second return water pipe 53. One end of the first return water pipe 52 is connected to the drain port of the high-temperature and high-pressure equipment, and the other end is connected to the water inlet port of the second radiator 51. The second return water pipe 53 includes a first branch pipe 531 and a second branch pipe 532. One end of the first branch pipe 531 is connected to the drain port of the second radiator 51, and the other end is connected to the water inlet port of the second heat dissipation channel. One end of the second branch pipe 532 is connected to the drain port of the second heat dissipation channel, and the other end is connected to the water storage tank 2.

[0024] In one embodiment, such as Figure 1 , Figure 3 , Figure 4 As shown, a filter 54 is connected to the first branch pipe 531 to filter the cooling water and reduce the risk of pipe blockage. A cooling fan 55 is installed inside the outer casing 1, and the cooling fan 55 faces the second radiator 51. The cooling fan 55 can actively provide forced air cooling to the second radiator 51, accelerate the heat dissipation efficiency of the high-temperature return water, and improve the circulating cooling effect.

[0025] In this embodiment, the first heat sink 41 and the second heat sink 51 integrate microchannel heat dissipation channels and high-density aluminum fins, respectively, increasing the heat dissipation area by more than 40% compared to traditional designs. The heat exchanger can rapidly diffuse localized high temperatures to the entire heat dissipation surface (the heat diffusion efficiency is 2-3 times that of traditional heat pipes), and the heat dissipation area is increased by high-density fins (fin spacing 1-1.5mm, 30% denser than traditional modules), thereby improving the heat dissipation effect. The cooling fan 55 adopts a centrifugal ultra-thin fan with 20% higher air pressure than traditional axial fans, which can force the airflow into the narrow gaps of the high-density fins, avoiding heat dissipation bottlenecks caused by insufficient airflow.

[0026] In this embodiment, filter 54 uses a 50μm stainless steel filter screen, which is removable and washable. It can accurately intercept key pollutants within the equipment, and its low flow resistance design ensures system energy efficiency, protects experimental instruments, and stabilizes normal equipment operation. Filter 54 uses a graphene-based filter membrane. Utilizing the atomic-level pore size of graphene, it can efficiently trap fine impurities such as heavy metal ions (e.g., lead, mercury) and microplastics (particle size <2μm). Its filtration efficiency is 3-5 times higher than traditional filter membranes, and it has low water flow resistance.

[0027] In one embodiment, such as Figure 1 , Figure 3 , Figure 4 As shown, the water pump assembly 3 includes a water pump pipe 31 and a circulation pump 32. One end of the water pump pipe 31 is connected to the water storage tank 2, and the other end is connected to the water inlet port of the first heat dissipation channel. The circulation pump 32 is connected to the water pump pipe 31.

[0028] In this embodiment, the circulating pump 32 is a miniature high-efficiency water pump with an aluminum alloy casing, making it small in size and lightweight. Simultaneously, the miniature high-efficiency water pump is driven by a brushless DC motor, which is more than 30% more energy-efficient than traditional brushed motors and can provide stable circulating power. Furthermore, the miniature high-efficiency water pump also has the advantage of low energy consumption, meeting national energy conservation and emission reduction requirements, and its leak-free design prevents media leakage and environmental pollution. Moreover, the miniature high-efficiency water pump has low noise and vibration; its miniaturized structure, combined with precision bearings and a silent motor, typically results in operating noise below 40 decibels, far lower than traditional small pumps (50-60 decibels), making it suitable for noise-sensitive applications such as laboratory testing equipment, containers, and vehicle-mounted laboratories.

[0029] In one embodiment, such as Figure 1 , Figure 3 , Figure 4 As shown, the cooling device also includes a temperature control mechanism 6 disposed inside the outer casing 1. The temperature control mechanism 6 is connected to the circulating pump 32, the first radiator 41, the second radiator 51 and the cooling fan 55 respectively. The temperature control mechanism 6 is used to monitor the inlet and outlet water temperatures of the high-temperature and high-pressure equipment in real time, and to control the output power of the circulating pump 32, the first radiator 41, the second radiator 51 and the cooling fan 55 according to the inlet and outlet water temperatures, so as to realize the real-time regulation of cooling intensity.

[0030] In one embodiment, such as Figure 1 , Figure 3 , Figure 4 As shown, the temperature control mechanism 6 includes a first temperature sensor 61, a second temperature sensor 62, and a control module 63. The first temperature sensor 61 is connected to the water inlet cooling mechanism 4 and is used to monitor the water inlet temperature of the high-temperature and high-pressure equipment in real time. The second temperature sensor 62 is connected to the water return cooling mechanism 5 and is used to monitor the water outlet temperature of the high-temperature and high-pressure equipment in real time.

[0031] In one embodiment, such as Figure 1 , Figure 3 , Figure 4 As shown, the control module 63 is mounted on the housing 1 and is electrically connected to the first temperature sensor 61, the second temperature sensor 62, the water pump assembly 3, the water inlet cooling mechanism 4, and the water return cooling mechanism 5, respectively.

[0032] In this embodiment, the first temperature sensor 61 and the second temperature sensor 62 are PT1000 platinum resistance thermometers and NTC thermistors, respectively, to ensure an error of <0.05℃ and greater accuracy. Simultaneously, the microprocessor of the control module 63 receives temperature information from the first temperature sensor 61 and the second temperature sensor 62 in real time using PID and AI adaptive algorithms. Based on the inlet and outlet water temperatures, it dynamically controls the output power of the circulating pump 32, the first radiator 41, the second radiator 51, and the cooling fan 55, avoiding overshoot (temperature exceeding the target value) or hysteresis (slow temperature response) and reducing unnecessary energy consumption.

[0033] The portable high-temperature and high-pressure equipment cooling device in this embodiment is used as follows: Connect the pump pipe 31 and the second branch pipe 532 to the water storage tank 2, respectively. Connect the inlet port of the high-temperature and high-pressure equipment to the inlet pipe 42 and the drain port to the first return pipe 52. Then, remotely control the circulation pump 32, the first radiator 41, the second radiator 51, and the cooling fan 55 via the control module 63. At this time, the cooling water in the water storage tank 2 enters the first heat dissipation channel through the pump pipe 31, and then enters the high-temperature and high-pressure equipment through the inlet pipe 42, where it exchanges heat with the equipment. Subsequently, the cooling water in the high-temperature and high-pressure equipment enters the second radiator 51 through the first return pipe 52. At this time, the cooling fan 55 pushes air through the heat dissipation fins of the second heat exchanger to cool the water. Next, the cooling water enters the second heat dissipation channel through the first branch pipe 531 to cool it again. Finally, the cooling water flows back to the water storage tank 2. This process is repeated to achieve circulating cooling and thus realize the recycling of cooling water.

[0034] As described above, this cooling device forms a closed-loop water circulation system through the water storage tank 2, the inlet cooling mechanism 4, and the return cooling mechanism 5. The cooling water can be repeatedly recycled, completely solving the problem of freshwater waste in traditional open cooling modes. It does not rely on external water sources and is perfectly suited to the freshwater-scarce operating environment of offshore platforms. At the same time, it avoids the electrochemical corrosion and chloride ion corrosion problems caused by seawater cooling, effectively protecting the metal structure of high-temperature and high-pressure equipment and extending the service life of the equipment.

[0035] Meanwhile, the cooling device integrates all core components such as water storage tank 2, water pump assembly 3, dual radiators, cooling fan 55, and temperature control mechanism 6 into the outer shell 1. The overall structure is compact and small in size, which greatly reduces the space occupied by the equipment. It solves the problem of traditional cooling devices being bulky and inconvenient to install and carry. It is suitable for limited space operation scenarios such as offshore platforms and small laboratories, and is convenient to move, install, and debug.

[0036] Furthermore, the cooling device employs a dual radiator combined with a bidirectional flow channel heat exchange structure. The inlet water is pre-cooled by the first radiator 41, and the return water is forced to cool down by the second radiator 51 before flowing through the second heat dissipation channel of the first radiator 41 to exchange heat with the low-temperature inlet water, forming a bidirectional heat dissipation system. This significantly improves the efficiency of heat exchange, and can quickly reduce the temperature of high-temperature and high-pressure equipment to an operable temperature, shortening the experimental interval and improving operational efficiency.

[0037] In addition, the cooling device collects the inlet and outlet water temperatures of the equipment in real time through dual temperature sensors, and works with the control module 63 to dynamically adjust the water supply power of the circulation pump 32 and the heat dissipation power of the cooling fan 55 to achieve adaptive adjustment of cooling intensity. It can accurately match the cooling efficiency according to the real-time temperature of the equipment, avoid over-cooling or under-cooling, and ensure that the cooling process is safe, stable and controllable.

[0038] It should be noted that, unless otherwise stated, the technical or scientific terms used in this invention should have the ordinary meaning as understood by one of ordinary skill in the art.

[0039] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly defined.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A portable cooling device for high-temperature and high-pressure equipment, characterized in that, include: Outer shell (1); Water storage tank (2), used to store fresh water; A water pump assembly (3) is disposed inside the outer casing (1) and is used to connect to the water storage tank (2); A water inlet cooling mechanism (4) is disposed inside the outer casing (1), and one end of the water inlet cooling mechanism (4) is connected to the water pump assembly (3), and the other end is used to connect to the water inlet port of the high temperature and high pressure equipment; A water return cooling mechanism (5) is installed inside the outer shell (1), and one end of the water return cooling mechanism (5) is used to connect to the water storage tank (2), and the other end is used to connect to the drain port of the high temperature and high pressure equipment.

2. The portable high-temperature and high-pressure equipment cooling device according to claim 1, characterized in that, The water inlet cooling mechanism (4) includes: The first radiator (41) is disposed inside the outer casing (1). The first radiator (41) is provided with a first heat dissipation channel and a second heat dissipation channel, and the water pump assembly (3) is connected to the water inlet port of the first heat dissipation channel. The water inlet pipe (42) is connected at one end to the drain port of the first heat dissipation channel and at the other end to the water inlet port of the high temperature and high pressure equipment.

3. The portable high-temperature and high-pressure equipment cooling device according to claim 2, characterized in that, The water return cooling mechanism (5) includes: The second radiator (51) is disposed inside the outer casing (1); The first return water pipe (52) is used to connect one end to the drain port of the high temperature and high pressure equipment, and the other end to the inlet port of the second radiator (51). The second return water pipe (53) is connected at one end to the drain port of the second radiator (51) and at the other end to the water storage tank (2).

4. The portable high-temperature and high-pressure equipment cooling device according to claim 3, characterized in that, The second return water pipe (53) includes: The first branch pipe (531) is connected at one end to the drain port of the second radiator (51) and at the other end to the water inlet port of the second heat dissipation channel. The second branch pipe (532) is connected at one end to the drain port of the second heat dissipation channel and at the other end to the water storage tank (2).

5. The portable high-temperature and high-pressure equipment cooling device according to claim 4, characterized in that, A filter (54) is connected to the first branch pipe (531).

6. The portable high-temperature and high-pressure equipment cooling device according to claim 4, characterized in that, The water return cooling mechanism (5) also includes: A cooling fan (55) is disposed inside the outer casing (1) and faces the second heat sink (51) so that the cooling fan (55) can cool the second heat sink (51) by air.

7. The portable high-temperature and high-pressure equipment cooling device according to claim 2, characterized in that, The pump assembly (3) includes: The pump pipe (31) is used to connect one end to the water storage tank (2) and the other end to the water inlet port of the first heat dissipation channel; A circulating pump (32) is connected to the pump water pipe (31).

8. The portable high-temperature and high-pressure equipment cooling device according to claim 1, characterized in that, The cooling device further includes: A temperature control mechanism (6) is installed inside the outer casing (1). The temperature control mechanism (6) is electrically connected to the water pump assembly (3), the water inlet cooling mechanism (4), and the water return cooling mechanism (5), respectively. The temperature control mechanism (6) is used to monitor the inlet and outlet water temperatures of the high-temperature and high-pressure equipment in real time, and to control the power of the water pump assembly (3), the water inlet cooling mechanism (4), and the water return cooling mechanism (5) according to the inlet and outlet water temperatures, so as to realize real-time regulation of cooling intensity.

9. The portable high-temperature and high-pressure equipment cooling device according to claim 8, characterized in that, The temperature control mechanism (6) includes: The first temperature sensor (61) is connected to the water inlet cooling mechanism (4) and is used to monitor the water inlet temperature of the high-temperature and high-pressure equipment in real time. The second temperature sensor (62) is connected to the return water cooling mechanism (5) and is used to monitor the outlet water temperature of the high temperature and high pressure equipment in real time. The control module (63) is disposed on the outer shell (1) and is electrically connected to the first temperature sensor (61), the second temperature sensor (62), the water pump assembly (3), the water inlet cooling mechanism (4) and the water return cooling mechanism (5), respectively. The control module (63) is used to receive temperature information from the first temperature sensor (61) and the second temperature sensor (62), and to control the power of the water pump assembly (3), the water inlet cooling mechanism (4) and the water return cooling mechanism (5).

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