A three-probe testing device and testing system

Abstract

The present application relates to the technical field of circuit board detection, and discloses a three-probe testing device and a testing system, which comprise a mounting turntable, a first probe structure and a second probe structure, the first probe structure comprises a translation assembly and a first signal probe, the translation assembly is mounted on the mounting turntable, the first signal probe is arranged on the translation assembly, and the translation assembly is adapted to drive the first signal probe to move in a first direction; the second probe structure is arranged on the mounting turntable and corresponds to the first probe structure, the second probe structure comprises a second signal probe and a grounding needle, and the second signal probe and the grounding needle are arranged at intervals along the first direction. By arranging the translation assembly, the first signal probe, the second signal probe and the grounding needle, automatic switching of differential testing and single-end testing can be realized, different testing assemblies or probe heads do not need to be replaced like in a traditional double-probe scheme, and testing preparation and switching time are greatly reduced.

Description

Technical Field

[0001] This invention relates to the field of circuit board testing technology, specifically to a three-probe testing device and testing system. Background Technology

[0002] In today's era of rapid development in electronic information technology, various electronic devices rely heavily on PCB circuit boards. Modern electronic devices demand high integration, high power handling, complex signal processing, and unique physical layouts. With the rapid development of industries such as industry, energy, medicine, and communications, the quality requirements for PCBs are increasing. Therefore, the PCB manufacturing process necessitates the inspection of semi-finished products. Semi-finished PCBs refer to circuit boards that have completed copper plating and etching but have not yet undergone lamination.

[0003] The three-probe PROBE module has significant advantages over the existing two-probe PROBE module. It can simultaneously measure differential and single-ended measurements, and can switch between single-ended and differential measurements at will. The original two-probe PROBE module can only measure single-ended and differential measurements individually, and cannot achieve arbitrary switching between single-ended and differential testing. Summary of the Invention

[0004] In view of this, the present invention provides a three-probe testing device and testing system to solve the problem that the original two-probe PROBE component can only measure single-ended and differential signals, and cannot achieve arbitrary switching between single-ended and differential testing.

[0005] In a first aspect, the present invention provides a three-probe testing device, comprising: Install the turntable; A first probe structure, comprising a translation component and a first signal probe, wherein the translation component is mounted on the mounting turntable, and the first signal probe is disposed on the translation component, and the translation component is adapted to drive the first signal probe to move in a first direction; A second probe structure is disposed on the mounting turntable corresponding to the first probe structure. The second probe structure includes a second signal probe and a grounding pin, and the second signal probe and the grounding pin are arranged at intervals along a first direction. The translation component drives the first signal probe and the second signal probe to be aligned so as to perform differential impedance testing in a coordinated manner. Alternatively, the translation component can drive the first signal probe and the grounding pin to be aligned for coordinated single-ended impedance testing.

[0006] Beneficial effects: By setting up the aforementioned translation component, first signal probe, second signal probe, and grounding pin, automatic switching between differential and single-ended testing can be achieved, eliminating the need to change different test components or probe heads as required by traditional dual-probe solutions. This significantly reduces test preparation and switching time, making it suitable for batch testing scenarios of complex PCB boards containing multiple test items.

[0007] In one alternative implementation, the translation component includes: A driving component is fixed on the mounting turntable, and a guide is provided on the side of the driving component along a first direction; Mounting base, the mounting base is mounted on the guide member, and the mounting base is connected to the output end of the drive member; The mounting bracket is fixed on the mounting base and is used to mount the second signal probe.

[0008] In one alternative embodiment, a connecting bracket is further included, the connecting bracket being disposed on the mounting turntable; The first signal probe is mounted on the mounting bracket via a first mounting component; The second signal probe is mounted on the connecting bracket via a second mounting component; The grounding pin is positioned on the other side of the connecting bracket away from the second signal probe via a third mounting component.

[0009] In one alternative implementation, the first mounting component includes: A first support block, which is fixed on the mounting bracket; The first guide rail is disposed on the side of the mounting bracket near the first support block, corresponding to the first support block, and the first guide rail extends in the vertical direction. The first adjusting rod is vertically inserted through the first support block; The first probe mounting base is threadedly connected to the bottom end of the first adjusting rod, and the first probe mounting base is slidably mounted on the first guide rail. The first probe mounting base is used to mount the first signal probe. A first spring is sleeved on a first adjusting rod between the first support block and the first probe mounting base.

[0010] Beneficial Effects: Through the above-described configuration, the translation component employs a drive mechanism in conjunction with a linear guide rail, ensuring the straightness and accuracy of the first signal probe's horizontal movement. This makes the alignment of the two signal probes during differential testing, and the alignment of the signal probe with the grounding pin during single-ended testing, highly precise and reliable, mechanically guaranteeing the quality of the test signal. In the first mounting assembly, the bottom end of the first probe mounting base and the first adjusting rod are connected by a thread. By rotating the first adjusting rod, the vertical mounting position between the first adjusting rod and the first probe mounting base can be changed, adapting to the location of the PCB test points to be tested, thus improving adaptability. The first spring in the first mounting assembly provides adaptive contact force, preventing probe tip wear, bending, or damage caused by hard impacts or uneven pressure. It also protects the expensive PCB test board surface and extends the lifespan of critical consumables.

[0011] In an optional implementation, the first mounting component further includes: A first displacement sensor is fixed on the mounting bracket, and the sensing end of the first displacement sensor faces the vertical direction. The first displacement sensing element is disposed on the first probe mounting base, corresponding to the first displacement sensor.

[0012] Beneficial effects: By setting up the above-mentioned system to monitor the testing process in real time and using displacement thresholds to determine whether contact is successful, the system eliminates testing errors or misjudgments caused by poor contact and improves the reliability of batch test results.

[0013] In one alternative implementation, the second mounting component includes: The second support block is fixed on the connecting bracket; The second guide rail is disposed on the side of the connecting bracket near the second support block, corresponding to the second support block, and the second guide rail extends in the vertical direction; The second adjusting rod is vertically inserted through the second support block; The second probe mounting base is threadedly connected to the bottom end of the second adjusting rod, and the second probe mounting base is slidably mounted on the second guide rail. The second probe mounting base is used to mount the second signal probe. The second spring is sleeved on the second adjusting rod between the second support block and the second probe mounting base.

[0014] In one alternative implementation, the third mounting component includes: The third support block is fixed to the side of the connecting bracket away from the second support block; The third guide rail is disposed on the side of the connecting bracket near the third support block, corresponding to the third support block, and the third guide rail extends in the vertical direction; The third adjusting rod is vertically inserted through the third support block; The third probe mounting base is threadedly connected to the bottom end of the third adjusting rod, and the third probe mounting base is slidably mounted on the third guide rail. The third probe mounting base is used to mount the grounding pin. The third spring is sleeved on the third adjusting rod between the third support block and the third probe mounting base.

[0015] Beneficial effects: The above settings ensure that the second signal probe and grounding pin also have a buffer function during the test pressure process, ensuring that the second signal probe and grounding pin can contact the board surface in a flexible manner during the test pressure process, effectively preventing damage to the probe or PCB pads caused by rigid impact, and improving the safety of the equipment.

[0016] In one optional embodiment, the mounting turntable is provided with a guide groove extending through it in the vertical direction, and the guide groove extends in a second direction perpendicular to the first direction. The upper end of the connecting bracket is slidably disposed within the guide groove; The second probe structure also includes a driver, the telescopic end of which is connected to the connecting bracket.

[0017] In an optional implementation, the second probe structure further includes: The second displacement sensor is installed on the side of the mounting turntable away from the second signal probe, and the sensing end of the second displacement sensor faces the second direction. The second displacement sensor is fixed on the connecting bracket, corresponding to the second displacement sensor.

[0018] In an optional implementation, a magnetic attraction structure is also included for lifting a second signal probe or grounding pin that is in a non-operating state.

[0019] Beneficial effects: The linear drive and magnetic components actively lift the probes and their mounting components that are not working in the current test mode and transfer them to a safe, high position, avoiding the risk of equipment damage caused by interference or collision.

[0020] Secondly, the present invention also provides a three-probe testing system, including the three-probe testing device described above. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of the three-probe testing device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the first probe structure according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the second probe structure according to an embodiment of the present invention; Figure 4 This is a top view of the three-probe testing device according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the magnetic attraction structure according to an embodiment of the present invention; Explanation of reference numerals in the attached figures: 1. Install the turntable; 11. Install the guide chute; 2. First probe structure; 21. Translation assembly; 211. Driving component; 212. Mounting base; 213. Mounting bracket; 22. First signal probe; 23. First mounting assembly; 231. First support block; 232. First guide rail; 233. First adjusting rod; 234. First probe mounting base; 235. First spring; 24. First displacement sensor; 25. First displacement sensing element; 3. Second probe structure; 31. Second signal probe; 32. Grounding pin; 33. Second mounting assembly; 331. Second support block; 332. Second guide rail; 333. Second adjusting rod; 334. Second probe mounting base; 335. Second spring; 34. Third mounting assembly; 341. Third support block; 342. Third guide rail; 343. Third adjusting rod; 344. Third probe mounting base; 345. Third spring; 35. Driver; 36. Second displacement sensor; 37. Second displacement sensing element; 4. Connecting bracket; 5. Magnetic suction structure; 51. Linear drive component; 52. Magnetic suction bracket; 53. Magnetic suction component; 54. Third displacement sensor; 55. Third displacement sensing component. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] In today's era of rapid development in electronic information technology, various electronic devices rely heavily on PCB circuit boards. Modern electronic devices demand high integration, high power handling, complex signal processing, and unique physical layouts. With the rapid development of industries such as industry, energy, medicine, and communications, the quality requirements for PCBs are increasing. Therefore, the PCB manufacturing process necessitates the inspection of semi-finished products. Semi-finished PCBs refer to circuit boards that have completed copper plating and etching but have not yet undergone lamination.

[0025] The three-probe PROBE module has significant advantages over the existing two-probe PROBE module. It can simultaneously measure differential and single-ended measurements, and can switch between single-ended and differential measurements at will. The original two-probe PROBE module can only measure single-ended and differential measurements individually, and cannot achieve arbitrary switching between single-ended and differential testing.

[0026] To solve the above technical problems, the following will be combined with... Figures 1 to 4 The following describes embodiments of the present invention.

[0027] According to an embodiment of the present invention, a three-probe testing device is provided, including a mounting turntable 1, a first probe structure 2, and a second probe structure 3. Figure 1 The middle arrow A represents the first direction, and the arrow B represents the second direction. Both are horizontal and perpendicular to each other.

[0028] like Figures 1 to 3 As shown, the first probe structure 2 and the second probe structure 3 are both mounted on the mounting turntable 1 and can move together with the mounting turntable 1 to align with different test points on the PCB board under test.

[0029] The first probe structure 2 includes a translation component 21 and a first signal probe 22. The translation component 21 is fixedly mounted on the mounting turntable 1, and the first signal probe 22 is fixedly mounted on the moving end of the translation component 21. When the translation component 21 is working, it can directly drive the first signal probe 22 to move linearly along the first direction.

[0030] The second probe structure 3 is fixedly mounted on the mounting turntable 1, adjacent to the first probe structure 2. It includes a second signal probe 31 and a grounding pin 32, which are arranged side-by-side and spaced apart along a first direction; that is, the second signal probe 31 and the grounding pin 32 are arranged in parallel along the first direction. The second signal probe 31 is a fixed signal acquisition probe. The grounding pin 32 is a fixed grounding probe.

[0031] By controlling the translation component 21, the position of the first signal probe 22 in the first direction is changed, thereby realizing the rapid switching between the two modes of differential impedance testing and single-ended impedance testing. Its working principle is as follows: When differential signal testing is required, the control system drives the translation component 21, moving the first signal probe 22 along the first direction until it is aligned side-by-side with the fixed second signal probe 31 in the second direction perpendicular to the mounting turntable 1, and the distance between them meets the testing requirements for differential pairs. At this time, the first signal probe 22 and the second signal probe 31 form a pair of signal acquisition terminals, simultaneously contacting the two test points of the differential signal pair on the PCB board, and working together to complete the measurement of differential impedance.

[0032] When single-ended signal testing is required, the translation component 21 moves the first signal probe 22 along a first direction until it is aligned vertically with the fixed grounding pin 32. At this time, the first signal probe 22 serves as the signal acquisition end, and the grounding pin 32 serves as the reference ground end; both work together. During testing, the first signal probe 22 contacts the signal test point on the PCB board, and the grounding pin 32 contacts the nearby grounding copper foil or a designated grounding point, thereby completing the single-ended impedance measurement.

[0033] By configuring the aforementioned translation component 21, first signal probe 22, second signal probe 31, and grounding pin 32, automatic switching between differential and single-ended testing can be achieved, eliminating the need to replace different test components or probe heads as required by traditional dual-probe solutions. This significantly reduces test preparation and switching time, making it suitable for batch testing scenarios of complex PCB boards containing multiple test items.

[0034] In one embodiment, such as Figure 2 and Figure 3 As shown, the three-probe testing device includes a connecting bracket 4. The connecting bracket 4 is mounted on the mounting turntable 1, and the second signal probe 31 is mounted at a predetermined position on the connecting bracket 4 via a second mounting assembly 33. The grounding pin 32 is mounted on the connecting bracket 4 via a third mounting assembly 34, and is parallel to and spaced apart from the second signal probe 31 in a first direction.

[0035] like Figure 2As shown, the translation component 21 includes: a drive unit 211, a mounting base 212, and a mounting bracket 213. The drive unit 211 can be a hydraulic cylinder, a pneumatic cylinder, or a linear motor, etc. The main body of the drive unit 211 is directly fixed to the mounting turntable 1, and the output end of the drive unit 211 can reciprocate along a first direction. A guide member, which can be a guide rail, is fixedly mounted on the side or bottom surface of the drive unit 211 along the first direction. The mounting base 212 has a sliding block or sliding platform, which is mounted on the guide member and can slide smoothly along the guide member in the first direction. The mounting base 212 is directly connected to the output end of the drive unit 211. The mounting bracket 213 is fixed to the mounting base 212. When the drive unit 211 is working, it can precisely drive the mounting base 212 and the mounting bracket 213 fixed thereto to move synchronously along the first direction.

[0036] like Figure 2 As shown, the first mounting component 23 specifically includes: a first support block 231, a first guide rail 232, a first adjusting rod 233, a first probe mounting base 234, and a first spring 235.

[0037] A first support block 231 is fixedly mounted on the side of the mounting bracket 213, and a first guide rail 232 is also mounted on this side, the first guide rail 232 being vertically arranged. A first adjusting rod 233 is a guide rod that passes vertically through the first support block 231, and its upper end may be equipped with an adjusting nut. A portion of the lower end of the first adjusting rod 233 is threaded. A first probe mounting seat 234 is used to clamp and fix the first signal probe 22, and its top end is threadedly connected to the bottom end of the first adjusting rod 233. A slider is provided on the side of the first probe mounting seat 234 near the first guide rail 232, which cooperates with the vertical first guide rail 232, allowing it to slide only in the vertical direction. A first spring 235 is sleeved on the first adjusting rod 233 located between the first support block 231 and the first probe mounting seat 234. The spring is in a pre-compressed state, providing a continuous downward elastic force to the first probe mounting seat 234 and the first signal probe 22, while allowing it to recoil to a certain extent in the vertical direction against the spring force.

[0038] When the test system needs to switch test modes, the drive unit 211 is activated, pushing the mounting base 212 to move along the guide through its output terminal. The mounting base 212 drives the mounting bracket 213 on it and the first signal probe 22 mounted on the bracket through the first mounting component 23 to move together in the first direction to a predetermined position, aligning with the second signal probe 31 or the grounding pin 32.

[0039] During testing, the mounting turntable 1 causes the entire assembly to press down, bringing the probe into contact with the PCB test point. Once the first signal probe 22 contacts the test point surface, it continues to press down, allowing the first probe mounting base 234 to slide upwards along the vertical first guide rail 232, further compressing the first spring 235. The elastic force provided by the first spring 235 maintains a constant and appropriate contact pressure between the first signal probe 22 and the test point, preventing excessive pressure from damaging the probe or the board surface, and also preventing insufficient pressure from causing poor contact.

[0040] Furthermore, when uneven surfaces are present, each probe is allowed to independently adapt to minute Z-axis height differences, ensuring that all probes can make reliable contact.

[0041] With the above settings, the translation component 21 adopts a structure of drive component 211 and linear guide rail, which ensures the straightness and accuracy of the horizontal movement of the first signal probe 22. This makes the alignment of the two signal probes during differential testing and the alignment of the signal probe and grounding pin 32 during single-end testing very accurate and reliable, thus mechanically guaranteeing the quality of the test signal.

[0042] In the first mounting assembly 23, the bottom end of the first probe mounting base 234 and the first adjusting rod 233 are connected by threads. By rotating the first adjusting rod 233, the vertical mounting position between the first adjusting rod 233 and the first probe mounting base 234 can be changed, which can be changed according to the position of the PCB test point to be tested, thus improving adaptability.

[0043] The first spring 235 provided in the first mounting component 23 can provide adaptive contact force to avoid probe tip wear, bending or damage caused by hard impact or uneven pressure, while also protecting the expensive PCB test board surface and extending the service life of critical consumables.

[0044] In one embodiment, such as Figure 2 As shown, the first mounting assembly 23 further includes a first displacement sensor 24 and a first displacement sensing element 25. The first displacement sensor 24 can be a laser displacement sensor. It is fixed on the mounting bracket 213, and the measuring axis of its sensing end is set to face vertically, specifically, vertically downwards, parallel to the movement direction of the first probe mounting base 234. The first displacement sensing element 25 is disposed on the first probe mounting base 234, and the first displacement sensing elements 25 are spaced below the first displacement sensor 24. The first displacement sensing elements 25 can move vertically with the first probe mounting base 234.

[0045] When the mounting turntable 1 drives the testing device downwards, causing the first signal probe 22 to contact the PCB test point, the contact force overcomes the elastic force of the first spring 235, pushing the first probe mounting base 234 upwards along the first guide rail 232. This causes the first displacement sensor 25, fixed thereon, to move upwards synchronously, resulting in a change in the relative distance between it and the first displacement sensor 24, fixed on the mounting bracket 213. The first displacement sensor 24 detects the change in the gap between itself and the first displacement sensor 25 in real time, and the displacement signal reflects the vertical position and retraction amount of the first probe mounting base 234.

[0046] By setting up the above system to monitor the testing process in real time and using displacement thresholds to determine whether contact is successful, test errors or misjudgments caused by poor contact are eliminated, thus improving the reliability of batch test results.

[0047] In one embodiment, such as Figure 1 and Figure 3 As shown, the second mounting assembly 33 includes: a second support block 331, a second guide rail 332, a second adjusting rod 333, a second probe mounting base 334, and a second spring 335. The second support block 331 is fixedly mounted on a predetermined side of the connecting bracket 4. The second guide rail 332 is disposed on the connecting bracket 4 corresponding to the second support block 331 and is vertically arranged. The second adjusting rod 333 is a guide rod that vertically passes through the second support block 331, and its upper end may be equipped with a locking and adjusting nut. The second probe mounting base 334 is used to clamp and fix the second signal probe 31. The upper end of the second probe mounting base 334 is threadedly connected to the bottom end of the second adjusting rod 333. A slider that mates with the vertical second guide rail 332 is provided on one side of the second probe mounting base 334. The second spring 335 is sleeved on the second adjusting rod 333 between the second support block 331 and the second probe mounting base 334. The second spring 335 is in a pre-compressed state, providing a downward elastic force to the second probe mounting base 334 and allowing it to float elastically in the vertical direction.

[0048] The third mounting assembly 34 includes: a third support block 341, a third guide rail 342, a third adjusting rod 343, a third probe mounting base 344, and a third spring 345. The third support block 341 is fixedly mounted on the side of the connecting bracket 4 away from the second support block 331. The third guide rail 342 is fixed on the connecting bracket 4 corresponding to the third support block 341, and the third guide rail 342 is vertically arranged. The third adjusting rod 343 is a guide rod, which is vertically inserted through the third support block 341. The upper end of the third adjusting rod 343 is equipped with a locking and adjusting nut, and the lower end of the third adjusting rod 343 is threaded. The top end of the third probe mounting base 344 is threadedly connected to the bottom end of the third adjusting rod 343. The third probe mounting base 344 is used to install and fix the grounding pin 32. One side of the third probe mounting base 344 is provided with a slider that cooperates with the vertical third guide rail 342. The slider is slidably mounted on the third guide rail 342. The third spring 345 is sleeved on the third adjusting rod 343 between the third support block 341 and the third probe mounting base 344.

[0049] Before testing, the initial extension height of the second signal probe 31 or the grounding pin 32 can be finely adjusted individually by rotating the second adjustment rod 333 or the third adjustment rod 343 to accommodate PCBs of different thicknesses.

[0050] When the mounting turntable 1 drives the entire test head assembly to press down towards the PCB test point, the second probe mounting base 334 and the third probe mounting base 344 simultaneously approach the surface of the board under test. After the tip of the second signal probe 31 or the grounding pin 32 contacts the test point surface, if the test head continues to press down, the contact force will push the corresponding second probe mounting base 334 or third probe mounting base 344 to overcome the elastic force of the second spring 335 or the third spring 345, and slide upwards to retract. The second signal probe 31 and the grounding pin 32 can ensure reliable contact with the PCB board through different retraction amounts.

[0051] The above settings ensure that the second signal probe 31 and the grounding pin 32 also have a buffer function during the test pressure process, ensuring that the second signal probe 31 and the grounding pin 32 can contact the board surface in a flexible manner during the test pressure process, effectively preventing damage to the probe or PCB pads caused by rigid impact, and improving the safety of the equipment.

[0052] In one embodiment, such as Figure 4As shown, the mounting turntable 1 has one or more guide grooves 11 extending vertically. In this embodiment, there are two guide grooves 11, symmetrically arranged, extending along a second direction perpendicular to the first direction. The upper end of the connecting bracket 4 is slidably disposed within the guide groove 11. The second probe structure 3 also includes a driver 35. The driver 35 can be a linear drive device such as a linear motor, cylinder, or electric push rod, and is fixedly mounted on the mounting turntable 1. The telescopic end of the driver 35 is directly connected to the connecting bracket 4. By controlling the extension and retraction of the driver 35, the connecting bracket 4 can be precisely pushed or pulled along the guide groove 11 in the second direction.

[0053] like Figure 4 As shown, the second probe structure 3 includes a second displacement sensor 36 and a second displacement sensing element 37. The second displacement sensor 36 is mounted on the top of the mounting turntable 1 away from the second signal probe 31. The detection direction of its sensing end is set to face the second direction. The second displacement sensing element 37 is fixed to the connecting bracket 4 corresponding to the second displacement sensor 36 and can move together with the connecting bracket 4 in the second direction.

[0054] During the test preparation phase, the driver 35 is activated, and its telescopic end pushes or pulls the connecting bracket 4, causing the upper end of the connecting bracket 4 to slide along the guide groove 11 on the mounting turntable 1 in the second direction, thereby driving the second mounting component 33, the third mounting component 34, the second signal probe 31 and the grounding pin 32, and the related mounting components to make fine adjustments in the second direction as a whole.

[0055] During the movement of the connecting bracket 4, the position of the second displacement sensor 37 fixed on it changes relative to the second displacement sensor 36 fixed on the mounting turntable 1. The second displacement sensor 36 detects this change in real time and feeds back the position signal.

[0056] With the above configuration, the testing device has the ability to independently adjust the probe position in two horizontal directions, improving its adaptability to test points at different positions and spacings. The combination of the actuator 35 and the displacement sensor enables automated and precise control of the positioning of the second probe structure 3 in the second direction.

[0057] In one embodiment, the three-probe testing device further includes a magnetic attraction structure 5, such as... Figure 5 As shown, the magnetic attraction structure 5 includes: a linear drive component 51, a magnetic support 52, a magnetic component 53, a third displacement sensor 54, and a third displacement sensing component 55.

[0058] like Figure 5As shown, the linear drive 51 can be a hydraulic cylinder, etc., and is fixed on the outer surface of the connecting bracket 4 away from the first signal structure. The output end of the linear drive 51 is vertically upward and directly facing the mounting turntable 1. The magnetic bracket 52 is a U-shaped frame, which is fixed on the output end of the linear drive 51. The entire magnetic bracket 52 is arranged between the second probe structure 3 and the mounting turntable 1. The two ends of the U-shaped frame are respectively positioned above the second adjusting rod 333 and the third adjusting rod 343. The magnetic element 53 is an electromagnet, and two magnetic elements 53 are provided. The two magnetic elements 53 are respectively fixed at the two ends of the U-shaped frame and are respectively positioned above the second adjusting rod 333 and the third adjusting rod 343. The third displacement sensor 54 is installed on the magnetic bracket 52, and the third displacement sensor 55 is fixed at a preset position on the connecting bracket 4 corresponding to the third displacement sensor 54.

[0059] When the device performs differential signal testing, the first signal probe 22 is aligned with the second signal probe 31. At this time, the grounding pin 32 is not working. The linear drive 51 is activated. The linear drive 51 drives the two magnetic components 53 to move downwards by a fixed stroke through the magnetic bracket 52 until the two magnetic components 53 are close to the top of the third adjustment rod 343. The magnetic component 53 close to the top of the third adjustment rod 343 is energized, and the magnetic component 53 attracts the third adjustment rod 343. The linear drive 51 drives the magnetic component 53 to reset, thereby lifting the entire third mounting assembly 34 and the grounding pin 32 upwards. Similarly, when the device performs a single-ended signal test, the first signal probe 22 is aligned with the grounding pin 32. At this time, the second signal probe 31 is not working. The linear drive 51 is activated. The linear drive 51 drives the two magnetic suction pieces 53 to move downwards by a fixed stroke through the magnetic suction bracket 52 until the two magnetic suction pieces 53 are close to the top of the second adjusting rod 333. The magnetic suction piece 53 close to the top of the second adjusting rod 333 is energized, and the magnetic suction piece 53 attracts the second adjusting rod 333. The linear drive 51 drives the magnetic suction piece 53 to reset, thereby lifting the entire second mounting assembly 33 and the second signal probe 31 upwards.

[0060] During the process of the linear drive 51 driving the magnetic bracket 52 and the magnetic component 53 to reset, when the detection end of the third displacement sensor 54 is aligned with the third displacement sensor 55, the third displacement sensor 54 will feed back the position signal, and then control the linear drive 51 to stop working, thereby realizing precise control of the working stroke of the linear drive 51 in the vertical direction.

[0061] With the above settings, the linear drive unit 51 and the magnetic suction unit 53 actively lift the probe and its mounting components that are not working in the current test mode and transfer them to a safe high position to avoid the risk of equipment damage caused by interference or collision.

[0062] According to an embodiment of the present invention, in another aspect, a three-probe testing system is also provided, including the three-probe testing apparatus of claim 10, having all of its beneficial effects.

[0063] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A three-probe testing device, characterized in that, include: Install turntable (1); The first probe structure (2) includes a translation component (21) and a first signal probe (22). The translation component (21) is mounted on the mounting turntable (1), and the first signal probe (22) is disposed on the translation component (21). The translation component (21) is adapted to drive the first signal probe (22) to move in a first direction. The second probe structure (3) is disposed on the mounting turntable (1) corresponding to the first probe structure (2). The second probe structure (3) includes a second signal probe (31) and a grounding pin (32). The second signal probe (31) and the grounding pin (32) are arranged at intervals along a first direction. The translation component (21) drives the first signal probe (22) and the second signal probe (31) to be relative to each other for collaborative differential impedance testing; Alternatively, the translation component (21) can drive the first signal probe (22) and the grounding pin (32) to be aligned for coordinated single-ended impedance testing.

2. The three-probe testing device according to claim 1, characterized in that, The translation component (21) includes: A driving component (211) is fixed on the mounting turntable (1), and a guide is provided on the side of the driving component (211) along the first direction; Mounting base (212), which is mounted on the guide member and connected to the output end of the drive member (211); Mounting bracket (213) is fixed on mounting base (212) and is used to mount the second signal probe (31).

3. The three-probe testing device according to claim 2, characterized in that, It also includes a connecting bracket (4), which is disposed on the mounting turntable (1); The first signal probe (22) is mounted on the mounting bracket (213) via the first mounting component (23); The second signal probe (31) is mounted on the connecting bracket (4) via the second mounting assembly (33); The grounding pin (32) is mounted on the connecting bracket (4) via a third mounting component (34).

4. The three-probe testing device according to claim 3, characterized in that, The first installation component (23) includes: The first support block (231) is fixed on the mounting bracket (213); The first guide rail (232) is disposed on the side of the mounting bracket (213) close to the first support block (231) corresponding to the first support block (231), and the first guide rail (232) extends in the vertical direction; The first adjusting rod (233) is vertically inserted through the first support block (231); The first probe mounting base (234) is threadedly connected to the bottom end of the first adjusting rod (233), and the first probe mounting base (234) is slidably mounted on the first guide rail (232). The first probe mounting base (234) is used to mount the first signal probe (22). The first spring (235) is sleeved on the first adjusting rod (233) between the first support block (231) and the first probe mounting base (234).

5. The three-probe testing device according to claim 4, characterized in that, The first installation component (23) also includes: The first displacement sensor (24) is fixed on the mounting bracket (213), and the sensing end of the first displacement sensor (24) faces the vertical direction. The first displacement sensor (25) is disposed on the first probe mounting base (234) corresponding to the first displacement sensor (24).

6. The three-probe testing device according to claim 3, characterized in that, The second installation component (33) includes: The second support block (331) is fixed on the connecting bracket (4); The second guide rail (332) is disposed on the side of the connecting bracket (4) near the second support block (331) corresponding to the second support block (331), and the second guide rail (332) extends in the vertical direction; The second adjusting rod (333) is vertically inserted through the second support block (331); The second probe mounting base (334) is threadedly connected to the bottom end of the second adjusting rod (333), and the second probe mounting base (334) is slidably mounted on the second guide rail (332). The second probe mounting base (334) is used to mount the second signal probe (31). The second spring (335) is sleeved on the second adjusting rod (333) between the second support block (331) and the second probe mounting base (334).

7. The three-probe testing device according to claim 6, characterized in that, The third mounting component (34) includes: The third support block (341) is fixed to the side of the connecting bracket (4) away from the second support block (331); The third guide rail (342) is disposed on the side of the connecting bracket (4) near the third support block (341) corresponding to the third support block (341), and the third guide rail (342) extends in the vertical direction; The third adjusting rod (343) is vertically inserted through the third support block (341); The third probe mounting base (344) is threadedly connected to the bottom end of the third adjusting rod (343), and the third probe mounting base (344) is slidably mounted on the third guide rail (342). The third probe mounting base (344) is used to mount the grounding pin (32). The third spring (345) is sleeved on the third adjusting rod (343) between the third support block (341) and the third probe mounting base (344).

8. The three-probe testing device according to claim 7, characterized in that, The mounting turntable (1) is provided with a guide groove (11) in the vertical direction, and the guide groove (11) extends in a second direction perpendicular to the first direction; The upper end of the connecting bracket (4) is slidably disposed in the guide groove (11); The second probe structure (3) also includes a driver (35), the telescopic end of which is connected to the connecting bracket (4).

9. The three-probe testing device according to claim 8, characterized in that, The second probe structure (3) further includes: The second displacement sensor (36) is mounted on the side of the mounting turntable (1) away from the second signal probe (31), and the sensing end of the second displacement sensor (36) faces the second direction. The second displacement sensor (37) is fixed on the connecting bracket (4) corresponding to the second displacement sensor (36).

10. The three-probe testing device according to claim 9, characterized in that, It also includes a magnetic suction structure (5) for lifting the second signal probe (31) or grounding pin (31) when it is in a non-working state.

11. A three-probe testing system, characterized in that, The three-probe testing apparatus includes any one of claims 1-10.

Images