Chip testing device, chip testing system and chip testing method

Abstract

The application provides a chip testing device, a chip testing system and a chip testing method. An intermediate partition plate is arranged above a base assembly to form a lower isolation cavity together with the base assembly. The cavity is isolated from an external variable temperature environment and maintains a stable normal temperature state. A test cover is arranged above the intermediate partition plate to form an upper test cavity together with the intermediate partition plate, which is used for accommodating a magnetosensitive chip to be tested. The test cover can be connected with an external variable temperature device to form a controlled local high and low temperature environment in the upper test cavity. A detection end of a magnetic field measuring component penetrates horizontally from a sidewall of the base assembly and extends into the lower isolation cavity. A detection point of the magnetic field measuring component is fixedly arranged directly below a chip mounting position in the upper test cavity and is used for directly measuring the magnetic field strength of the chip mounting position. Based on this, the temperature stress environment, the magnetic field generation environment and the magnetic field measurement environment are decoupled, so that each component operates in an optimal working condition, and the precision and reliability of the test are greatly improved.

Description

Technical Field

[0001] This application relates to the field of chip testing, and in particular to a chip testing apparatus, a chip testing system, and a chip testing method. Background Technology

[0002] In the development of magnetic sensing chips, it is necessary to accurately test their magnetic field sensing performance under temperature changes, including sensitivity, temperature drift, linearity, etc.

[0003] Traditional methods typically place the magnetic sensing chip under test and the magnetic field generating device together in a temperature drift chamber. The chip undergoes temperature shocks in the chamber, while a test magnetic field is generated by a coil inside the chamber, and a gaussmeter probe is used to monitor the magnetic field.

[0004] However, this integrated solution has flaws, resulting in low testing accuracy and poor reliability. Summary of the Invention

[0005] This application provides chip testing apparatus, chip testing system, and chip testing method to improve testing accuracy and reliability.

[0006] In a first aspect, embodiments of this application provide a chip testing apparatus, wherein at least some components are placed in a uniform magnetic field region generated by a magnetic field generating device, including:

[0007] Base assembly;

[0008] An intermediate partition is disposed above the base assembly, and together with the base assembly, forms a lower isolation cavity;

[0009] A test enclosure is disposed above the intermediate partition, and together with the intermediate partition, forms an upper test cavity for accommodating the magnetic sensing chip under test; the test enclosure is configured to be connected to an external temperature control device to create a controlled local temperature environment within the upper test cavity;

[0010] The magnetic field measuring component has its probe end passing through the sidewall of the base assembly and extending into the lower isolation cavity, and its probe point is configured to correspond vertically to the chip mounting position in the upper test cavity, for measuring the magnetic field at the chip mounting position.

[0011] Optionally, the intermediate partition is a printed circuit board;

[0012] The printed circuit board is a multilayer board with a wiring layer inside; the upper surface of the printed circuit board has an interface that seals with the test cover, and the wires of the wiring layer are electrically connected to the magnetic sensing chip placed in the upper test cavity through the interface.

[0013] Optionally, the base assembly includes a support block, and the printed circuit board is disposed above the support block; the support block has a horizontally extending measurement channel, and the probe end of the magnetic field measuring component extends into the lower isolation cavity through the measurement channel.

[0014] Optionally, the magnetic field measuring component is a gaussmeter probe.

[0015] Optionally, a probe fixing mechanism is also included to fix the gaussmeter probe in a state where its detection point corresponds to the chip mounting position in the upper test cavity in the vertical direction.

[0016] Secondly, this application provides a chip testing system, comprising:

[0017] The chip testing apparatus described in the first aspect;

[0018] A magnetic field generating device, wherein at least some components of the chip testing device are placed within a uniform magnetic field region generated by the magnetic field generating device;

[0019] The temperature-changing device is connected to the test chamber via a fluid pipeline and is used to deliver a temperature-controlled medium into the upper test chamber to create a localized temperature-changing environment within the upper test chamber.

[0020] Optionally, the base assembly, the intermediate partition, the magnetic field measuring component, and the chip are placed in the magnetic field uniform region.

[0021] Optionally, the magnetic field generating device includes a support assembly;

[0022] The base assembly is placed on the support assembly.

[0023] Optionally, the magnetic field generating device includes a three-dimensional Helmholtz coil;

[0024] And / or, the temperature-changing device is a heat flow meter;

[0025] And / or, the fluid conduit includes a non-magnetic conduit.

[0026] Optionally, the distance between the main body of the temperature-changing device and the magnetic field generating device is greater than a preset distance.

[0027] Thirdly, this application provides a chip testing method for use in the chip testing system described in the second aspect, the method comprising:

[0028] The magnetic field generating device is controlled to generate a target magnetic field, so that at least some components of the chip testing device are located within the uniform region of the generated magnetic field.

[0029] The temperature control device is controlled to operate, and a temperature control medium is delivered to the upper test chamber of the test hood through the fluid pipeline to form a local temperature environment in the upper test chamber;

[0030] The magnetic field measuring component is controlled to measure the actual magnetic field data in the lower isolation cavity in situ, which corresponds to the chip mounting position in the upper test cavity in the vertical direction.

[0031] Optionally, the method further includes:

[0032] Acquire the electrical output signal of the magnetic sensing chip under test under the combined action of the target magnetic field and the local temperature environment;

[0033] Based on the actual magnetic field data, the electrical output signal is subjected to performance analysis, temperature drift compensation, or sensitivity calibration.

[0034] Fourthly, embodiments of this application provide an electronic device, including: a memory and a processor;

[0035] The memory stores computer-executed instructions;

[0036] The processor executes computer execution instructions stored in the memory, causing the processor to perform the first aspect and / or various possible implementations of the first aspect as described above.

[0037] Fifthly, embodiments of this application provide a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the fourth aspect and / or various possible implementations of the fourth aspect.

[0038] Sixthly, embodiments of this application provide a computer program product, including a computer program that, when executed by a processor, implements the fourth aspect and / or various possible implementations of the fourth aspect.

[0039] The chip testing apparatus, chip testing system, and chip testing method provided in this application include a base assembly, an intermediate partition, a test enclosure, and a magnetic field measuring component. The intermediate partition is disposed above the base assembly, forming a lower isolation cavity together with the base assembly. This cavity is isolated from the external variable temperature environment, maintaining a stable room temperature. The test enclosure is disposed above the intermediate partition, forming an upper test cavity together with the intermediate partition, used to accommodate the magnetically sensitive chip under test. The test enclosure can be connected to an external variable temperature device, thereby creating a controlled local high and low temperature environment within the upper test cavity. The probe end of the magnetic field measuring component horizontally penetrates from the side wall of the base assembly and extends into the lower isolation cavity. Its probe point is fixedly disposed directly below the chip mounting position in the upper test cavity, used to directly measure the magnetic field strength at the chip location. By employing a collaborative design that integrates thermal isolation between the upper and lower chambers with vertical spatial synchronization between the measurement and sensing points, the temperature stress environment, magnetic field generation environment, and magnetic field measurement environment are decoupled. This allows each component to operate under optimal conditions, significantly improving the reliability and lifespan of the entire testing system. Furthermore, by providing a high-precision, real magnetic field reference that is spatiotemporally synchronized with the chip's sensing point, it enhances the accuracy and reliability of key performance tests such as sensitivity calibration and temperature drift characteristic analysis of the magnetic sensing chip. Attached Figure Description

[0040] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0041] Figure 1 This is a schematic diagram of the structure of a temperature drift chamber;

[0042] Figure 2 Schematic diagram of the chip testing device provided in this application Figure 1 ;

[0043] Figure 3 Schematic diagram of the chip testing device provided in this application Figure 2 ;

[0044] Figure 4 Schematic diagram of the chip testing system provided in this application Figure 1 ;

[0045] Figure 5 Schematic diagram of the chip testing system provided in this application Figure 2 ;

[0046] Figure 6 This is a schematic diagram of the Helmholtz coil provided in this application;

[0047] Figure 7 This is a schematic diagram of the chip testing system provided in this application;

[0048] Figure 8A schematic diagram of the structure of the electronic device provided in this application.

[0049] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0050] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0051] In the development of magnetic sensing chips (such as magnetic sensors and magnetic memories), it is necessary to accurately test their magnetic field sensing performance under temperature changes, including sensitivity, temperature drift, and linearity. Traditional testing methods often employ indirect measurement: a high-precision constant current source drives a pre-calibrated Helmholtz coil, and the theoretical magnetic field strength (e.g., [missing information]) in the central region is deduced from the current value. This method uses this as a benchmark to test the chip. However, this method has inherent systematic errors:

[0052] 1. Deviation between theoretical and actual values:

[0053] Due to factors such as the inherent accuracy limitations of the constant current source, the drift of coil resistance with temperature, fluctuations in the geomagnetic field, and interference from surrounding ferromagnetic materials, the actual magnetic field generated by the coil (e.g., ...) is limited. There is a non-negligible deviation between the actual value and the theoretical calculation value (for example, the reference error can reach 0.244%).

[0054] 2. Insufficient time stability: Even under constant temperature and current settings, the actual magnetic field will fluctuate slightly over time due to power supply noise, thermal disturbances, etc., resulting in poor instantaneous reproducibility of the test benchmark.

[0055] To simulate ambient temperature, traditional methods place the magnetic sensing chip under test and the magnetic field generating device (such as a three-dimensional Helmholtz coil) together in a temperature drift chamber (high and low temperature test chamber). Figure 1 As shown, the chip undergoes temperature shocks within the temperature drift chamber, while a test magnetic field is generated by a coil inside the chamber, and monitored using a gaussmeter probe. Alternatively, the chip temperature can be altered using liquid nitrogen or hot nitrogen. Once the test temperature is reached, heating and cooling are stopped. At this point, a Hall effect probe is inserted into the chamber for testing. After the test is complete, the Hall effect probe is removed.

[0056] However, traditional solutions suffer from the following drawbacks, resulting in low testing accuracy, poor reliability, short equipment lifespan, and high maintenance costs:

[0057] 1. Performance degradation and interference issues of magnetic field generating equipment

[0058] Performance degradation: The drastic temperature cycling and humidity changes within the temperature drift chamber directly affect the magnetic field generating equipment. The insulation material of the coil winding ages rapidly, and the frame and support structure undergo plastic deformation or cracking due to repeated thermal expansion and contraction. This leads to changes in the coil's geometric parameters, irreversible attenuation of the magnetic field strength, and drift of the uniform magnetic field region, fundamentally undermining the long-term benchmark stability of the test.

[0059] Poor connection reliability: The power supply and signal lines of the Helmholtz coil must pass through the wall of the temperature drift box. These through-wall interfaces destroy the sealing and tightness of the temperature change zone, increase heat leakage, and the connecting wires themselves are also prone to aging and embrittlement under alternating hot and cold conditions, which increases the risk of poor contact or open circuit.

[0060] Magnetic field environment contamination: If the inner liner, support or other internal components of the temperature drift chamber contain ferromagnetic materials such as iron, cobalt, and nickel, it will seriously interfere with or even distort the original magnetic field generated by the coil, destroy the spatial uniformity and directional accuracy of the magnetic field, and introduce errors that are difficult to calibrate.

[0061] 2. Accuracy issues of magnetic field measuring components (such as gaussmeter probes)

[0062] Probe is vulnerable: Exposing a precision gaussmeter probe to extreme high and low temperature cycling environments for extended periods can cause significant thermal stress on its internal semiconductor sensors, solder joints, and packaging materials, leading to performance drift, failure, or physical damage, which affects measurement repeatability and lifespan.

[0063] Lead wire challenge: The probe signal wire also needs to be led out of the temperature drift box, facing the same sealing damage and cable aging problems as the coil lead wire.

[0064] 3. The inherent error chain of indirect measurement methods cannot be eliminated.

[0065] Temperature drift effect: The coil resistance changes with temperature. Even if the output current of the constant current source is constant, the magnetic field it generates will change due to the change in resistance. In order to cope with load changes, the internal operating state of the constant current source will be adjusted, and this adjustment itself may introduce instability.

[0066] Source accuracy limit: Any constant current source, even under ideal normal temperature conditions, has physical limits to its output repeatability and accuracy (not 100%). This inherent error will be directly transmitted to the magnetic field calculation value.

[0067] 4. It is difficult to guarantee the consistency of test conditions and the resistance to interference.

[0068] Temperature transient interference: In the intermittent measurement method where the probe is inserted and then withdrawn, the entry and exit of the probe will disturb the air flow field and temperature field of the test area, causing the chip temperature to fluctuate before and after the measurement, thus disrupting the consistency of the test temperature conditions.

[0069] Environmental density disruption: Frequent probe entry and exit severely disrupted the stability and uniformity of the internal temperature environment of the temperature drift chamber.

[0070] In summary, the traditional approach places temperature stress, magnetic field generation, and magnetic field measurement in the same harsh environment, resulting in an irreconcilable contradiction between equipment reliability, measurement accuracy, and consistency of testing conditions.

[0071] To address this, this application proposes a chip testing device that completely isolates the high-temperature / low-temperature testing chamber from the precision measurement isolation chamber via an intermediate partition. Through a collaborative design that integrates thermal isolation between the upper and lower chambers with vertical spatial synchronization of the measurement and sensing points, the temperature stress environment, magnetic field generation environment, and magnetic field measurement environment are successfully decoupled, allowing each component to operate under optimal conditions. This not only significantly improves the reliability and lifespan of the entire testing system but also provides a high-precision, real magnetic field reference that is spatiotemporally synchronized with the chip's sensing point, enhancing the accuracy and reliability of key performance tests such as sensitivity calibration and temperature drift characteristic analysis of the magnetic sensing chip.

[0072] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0073] Figure 2 Flowchart of the chip testing apparatus provided in this application Figure 1 ,like Figure 2 As shown, at least some components of the chip testing apparatus are placed in a uniform magnetic field region generated by a magnetic field generating device. The chip testing apparatus includes:

[0074] Base assembly 101;

[0075] The intermediate partition 102 is disposed above the base assembly 101 and together with the base assembly 101 forms the lower isolation cavity;

[0076] The test enclosure 103 is disposed above the intermediate partition 102, and together with the intermediate partition 102, forms an upper test cavity for accommodating the magnetic sensing chip 105 to be tested; the test enclosure 103 is configured to be connected to an external temperature-changing device to form a controlled local temperature-changing environment in the upper test cavity.

[0077] The magnetic field measuring component 104 has its probe end passing through the side wall of the base assembly 101 and extending into the lower isolation cavity, and its probe point is configured to correspond vertically to the chip mounting position in the upper test cavity, for measuring the magnetic field at the chip mounting position.

[0078] In this embodiment, the base assembly 101 serves as the supporting foundation for the entire device. A middle partition 102 is disposed above the base assembly 101, forming a lower isolation chamber together with the base assembly 101. This chamber is isolated from the external temperature-changing environment, maintaining a stable ambient temperature. A test enclosure 103 is disposed above the middle partition 102, forming an upper test chamber together with the middle partition 102, used to house the magnetic sensing chip 105 under test. The test enclosure 103 can be connected to an external temperature-changing device, thereby creating a controlled local high and low temperature environment within the upper test chamber. The probe end of the magnetic field measuring component 104 horizontally penetrates from the side wall of the base assembly 101 and extends into the lower isolation chamber. Its probe point is fixed directly below the chip mounting position in the upper test chamber, used to directly measure the magnetic field strength at the chip's location.

[0079] The chip testing device provided in this application, during operation, places at least some components at the center of the uniform magnetic field region generated by the external magnetic field generator. Through the physical separation of the intermediate partition 102, complete isolation is achieved between the upper testing chamber (locally variable temperature environment) and the lower isolation chamber (stable room temperature environment). The magnetic field generator is entirely within a mild external room temperature environment, avoiding the direct impact of the drastic temperature cycles within the temperature-changing chamber on the coil windings, insulation materials, and support structure. Therefore, the magnetic field generator no longer experiences thermal expansion and contraction deformation and material aging, and its magnetic field strength, uniformity, and directional stability are maintained over a long period, fundamentally ensuring the reliability and reproducibility of the test reference.

[0080] Furthermore, the detection point of the magnetic field measuring component 104 is configured to correspond vertically to the chip mounting position in the upper test cavity. That is, the measuring point of the magnetic field measuring component 104 and the sensing point of the magnetic sensing chip 105 are located on the same vertical axis and are both located in the core region of the uniform magnetic field area. Therefore, the magnetic field sensed by the chip and the magnetic field measured by the magnetic field measuring component 104 are the real magnetic fields at the same time and in the same spatial location, achieving absolute synchronization between the measurement reference and the test object.

[0081] Building upon this foundation, this solution abandons the indirect method of calculating the magnetic field through current. Instead, it eliminates systematic errors introduced by factors such as constant current source error, coil resistance temperature drift, and geomagnetic fluctuations by performing in-situ, real-time, and direct measurements of the magnetic field surrounding the chip. This provides a high-precision benchmark for chip performance calculations. Furthermore, the magnetic field generating equipment and high-precision measuring instruments are protected from temperature shocks by a room-temperature environment, extending equipment lifespan, reducing maintenance costs, and ensuring long-term stable magnetic field performance. The chip's temperature-dependent environment is confined within a miniaturized test enclosure, resulting in a stable temperature field and rapid response.

[0082] Specifically, this device replaces the traditional current-based inverse estimation method with in-situ direct measurement. The detection point of the magnetic field measuring component 104 is precisely configured to correspond vertically to the chip mounting position in the upper test cavity, and both are located at the core of the same uniform magnetic field region generated by the external magnetic field generator. This ensures that the magnetic field measured by the probe is the actual magnetic field induced by the chip, completely bypassing the systematic errors introduced by all indirect calculation steps such as constant current source accuracy limitations, coil resistance temperature drift, and geomagnetic fluctuations, achieving precise measurement reference from the source.

[0083] In high and low temperature environments, the magnetic field measurement component 104 (such as a gaussmeter) reads the magnetic field magnitude in real time, providing an accurate and reliable magnetic field reference for the magnetosensitive chip 105, rather than inferring the magnetic field magnitude through calibration current. This overcomes calculation errors caused by inaccurate magnetic field magnitude and ensures the reliability and accuracy of data such as the temperature coefficient and precision of the magnetosensitive chip 105. This solution effectively avoids magnetic field measurement deviations caused by factors such as constant current source repetition errors, geomagnetic fluctuations, and environmental changes by directly reading the magnetic field magnitude.

[0084] Meanwhile, the probe does not need to enter or leave the temperature-changing area, completely avoiding disturbances to the chip temperature field and the density of the test environment caused by probe movement, ensuring a high degree of consistency and repeatability of temperature and magnetic field conditions during each test.

[0085] In summary, this application successfully decouples the temperature stress environment, magnetic field generation environment, and magnetic field measurement environment through a collaborative design that integrates thermal isolation between the upper and lower chambers with vertical spatial synchronization of the measurement and sensing points, ensuring that each component operates under optimal conditions. This not only significantly improves the reliability and lifespan of the entire testing system but also provides accuracy and reliability for key performance tests such as sensitivity calibration and temperature drift characteristic analysis of the magnetic sensing chip 105 by offering a high-precision real magnetic field reference that is spatiotemporally synchronized with the chip's sensing point.

[0086] For example, the test enclosure 103 has an opening through which it is connected to a temperature-controlled device.

[0087] Optionally, the intermediate partition 102 is a multilayer printed circuit board with a wiring layer inside. The upper surface of the printed circuit board has an interface that seals with the test housing 103, and the wiring layer is electrically connected to the magnetic sensing chip 105 placed in the upper test chamber through this interface.

[0088] Employing a multi-layer printed circuit board structure, the signal and power lines required by the chip are led out through internal wiring layers. This achieves a reliable electrical connection with the magnetosensitive chip 105 without requiring openings or exposed wiring in the test enclosure 103, thus ensuring the complete airtightness of the temperature-changing environment in the upper test chamber. This design maintains high reliability of the electrical connection while ensuring the stability and controllability of the local temperature field. The internal wiring effectively avoids sealing risks introduced by wires passing through the cavity, reliably guaranteeing the airtightness of the local temperature-changing environment and the effectiveness of the test.

[0089] For example, the printed circuit board may adopt a four-layer board structure, in which the middle two layers serve as wiring layers.

[0090] It should be noted that the intermediate partition 102 is not limited to a printed circuit board structure, and can also be made of other materials with good thermal insulation, structural stability and processability, such as ceramic substrates or composite insulating boards. As long as reliable physical separation and thermal isolation between the upper test chamber and the lower isolation chamber can be achieved, and the necessary gas path, wiring or measurement channel arrangement is allowed, it is a feasible implementation.

[0091] Optionally, the base assembly 101 includes a support block, with a printed circuit board disposed above the support block. The support block has a horizontally extending measurement channel, through which the probe end of the magnetic field measuring component 104 passes and extends into the lower isolation cavity.

[0092] The support block serves as the basic structure supporting the printed circuit board, and a horizontally penetrating measurement channel is machined inside. The size of this channel matches the outer diameter of the probe end of the magnetic field measurement component 104, ensuring that the probe can be smoothly inserted and accurately positioned, while minimizing gaps to maintain the environmental stability of the lower isolation cavity.

[0093] The horizontal channel provides a clear installation path and fixed position for the probe, ensuring that its detection point can be precisely aligned directly below the chip mounting position in the upper test chamber, achieving spatial alignment in the vertical direction. Furthermore, the probe enters horizontally from the side, without disrupting the longitudinal seal between the upper test chamber and the lower isolation chamber, effectively maintaining the environmental independence of each chamber.

[0094] It should be noted that the base assembly 101 is not limited to an integrated structure of the support block and the measurement channel; it can also be constructed using methods such as separate assembly, modular support, or multi-layer stacking. The probe end of the magnetic field measurement component 104 is not limited to entering through a horizontal channel; for example, it can be introduced through a guide structure at other angles on the bottom or side of the base assembly 101, as long as the probe point is aligned vertically with the chip mounting position and the environment of the lower isolation cavity remains stable.

[0095] For example, a PCB support block is set as a mounting base within the uniform magnetic field area generated by the magnetic field generating device. A multilayer printed circuit board is fixed above the support block, and the circuit board has a square groove that matches the shape of the test cover 103. The test cover 103 is quickly snapped on and installed through a pre-set slot structure on the circuit board, forming a reliable sealed fit.

[0096] The connection between the test enclosure 103 and the intermediate partition 102 is not limited to snap-fit ​​sealing; it can also employ various detachable or fixed connection structures such as flange sealing, threaded locking, or magnetic adsorption. Furthermore, the connection interface between the test enclosure 103 and external temperature control equipment can be designed as a quick connector, threaded interface, or standardized fluid / electrical interface, depending on specific temperature control requirements, to improve system adaptability and scalability.

[0097] Optionally, the magnetic field measuring component 104 includes a gaussmeter probe. This probe can directly read the magnetic field strength at the location of the chip, and the measurement process is completely synchronized with the chip's sensing, reflecting the instantaneous changes in the magnetic field in real time.

[0098] It should be noted that the magnetic field measuring component 104 is not limited to a gaussmeter probe, but can also use other types of magnetic sensors such as Hall sensors and magnetoresistive sensors to achieve in-situ measurement of the magnetic field.

[0099] For example, the probe's detection end can be fixed to a specially provided mounting base on the base assembly 101 or the intermediate partition 102, or it can be integrated inside the intermediate partition 102. The installation position must ensure that the measurement point is perpendicularly aligned with the chip's sensing point, and that the environmental isolation between the upper and lower chambers is not compromised.

[0100] Optional, such as Figure 3 As shown, the chip testing device also includes a probe fixing mechanism 105, which is used to fix the gaussmeter probe at a position that corresponds vertically to the chip mounting device in the upper test cavity.

[0101] This fixing mechanism can eliminate the slight displacement of the probe caused by mechanical vibration, temperature deformation or external interference, and ensure that the detection point and the chip sensing point always maintain a strict vertical spatial correspondence. This ensures that the geometric conditions required for in-situ measurement do not degrade during long-term testing, and guarantees the authenticity and accuracy of the measurement benchmark from a physical perspective.

[0102] For three-dimensional magnetic field testing, it is essential to ensure that each sensitive direction of the probe is strictly parallel to the magnetic field along the corresponding axis of the magnetic field generating device. The fixing mechanism, while locking the probe position, also constrains its spatial orientation, preventing deflection of the sensitive axis, avoiding cosine errors introduced by directional deviations, and ensuring the integrity of the vector magnetic field measurement.

[0103] For example, the probe fixing mechanism 105 includes a clamping assembly, a locking structure, and a positioning reference, typically integrated into the base assembly 101 or a support block. During the device assembly and debugging phase, the gaussmeter probe is first inserted into the measurement channel on the side of the base. Precision adjustments are made to ensure that its detection point is precisely aligned below the chip mounting position in the upper test cavity, and that the probe's sensitive direction is parallel to the target magnetic field direction. After adjustment, the probe is securely locked using locking screws, clips, or clamps to prevent displacement or deflection during subsequent testing.

[0104] For example, the gaussmeter probe is inserted horizontally from the side of the support block, extending to the center of the support block, directly below the printed circuit board. During assembly and debugging, the X, Y, and Z axes of the gaussmeter probe must be aligned parallel to the corresponding axial magnetic field directions generated by the magnetic field generator to ensure that the probe can perform positive measurements of magnetic fields in all directions. After adjustment, the gaussmeter probe is locked in place by the probe fixing mechanism 105 to maintain its spatial position and orientation stability during testing.

[0105] The chip testing apparatus provided in the embodiments of this application has been described in detail above. The embodiments of this application also provide a chip testing system, such as... Figure 4 and Figure 5 As shown, the chip testing system provided in this application embodiment includes:

[0106] The aforementioned chip testing device 10, magnetic field generating device 20, and temperature changing device 30;

[0107] At least some components of the chip testing device 10 are placed in the uniform magnetic field area generated by the magnetic field generating device 20; the temperature changing device 30 is connected to the test chamber 103 in the chip testing device 10 through the fluid pipeline 40. The temperature changing device 30 is used to deliver a temperature control medium into the upper test chamber in the chip testing device 10 to form a local temperature changing environment in the upper test chamber.

[0108] In this embodiment, the magnetic field environment, temperature environment, and precision measurement are integrated into a single testing platform, enabling simultaneous and controllable testing of the chip's multi-physical field (magnetic field, temperature) performance. Each component is relatively independent, facilitating flexible selection or upgrades of equipment based on testing requirements (such as different magnetic field ranges and temperature profiles), resulting in strong system scalability and adaptability. The system incorporates the core advantages of upper and lower chamber isolation and vertical spatial synchronization in the testing device, ensuring accurate in-situ magnetic field measurements can still be performed in complex system environments.

[0109] For example, the magnetic field generating device 20 is a device capable of generating a three-dimensional controllable magnetic field, enabling a complete characterization of the chip's omnidirectional magnetic field sensing performance (such as triaxial sensitivity and orthogonality). By actively controlling the magnetic field direction, test errors caused by the chip's installation orientation deviation in the test device can be eliminated, improving the accuracy and reliability of the test.

[0110] Optionally, the base assembly 101, intermediate partition 102, and magnetic field measurement component 104, as well as the chip 105, in the chip testing device 10 are placed within the uniform magnetic field area generated by the magnetic field generating device 20, while the test enclosure 103 of the chip testing device 10 can be placed outside the uniform magnetic field area. This ensures the accuracy of key testing steps while avoiding the problems of expanding the uniform area and significantly increasing costs caused by placing the entire large-volume testing device within the uniform area.

[0111] It should be noted that, as an optional implementation, the entire chip testing device can also be placed entirely within the uniform magnetic field area, in which case the size of the magnetic field generating device 20 needs to be relatively large.

[0112] Optionally, the magnetic field generating device 20 includes a support assembly, with the base assembly 101 placed on the support assembly. The support assembly can also be understood as a support platform.

[0113] For example, the base assembly 101 of the chip testing device 10 is mounted on the support assembly in a fixed, detachable or adjustable manner and thereby positioned in the magnetic field uniform region; while the test cover 103 of the chip testing device 10 surrounds or covers the support assembly and the base assembly 101 and is located outside the magnetic field uniform region.

[0114] Optionally, the magnetic field generating device 20 includes a three-dimensional Helmholtz coil. A Helmholtz coil is a standard device capable of generating a highly uniform and stable magnetic field, providing a pure, controllable, and precisely calculable magnetic field source for testing, thus ensuring the quality of the test reference from the outset.

[0115] It should be noted that the three-dimensional Helmholtz coil is only one example; other devices capable of generating a magnetic field with sufficient uniformity within the target test area (i.e., the chip mounting location) and whose three-dimensional components (X, Y, Z directions) can be precisely controlled independently or jointly are also applicable. For example, three (or more) independently controlled straight solenoids, square coils, or specially configured coils can be arranged orthogonally (or at a specific angle) in space. By independently adjusting the magnitude and direction of the current in each coil, a controllable magnetic field of arbitrary direction and magnitude in space can be synthesized.

[0116] For example, such as Figure 6As shown, the Helmholtz coil includes a central support platform 201 on which the chip measurement device is mounted. This structural design fully utilizes the uniform magnetic field characteristics of a three-dimensional Helmholtz coil: under the combined action of coil pairs in three orthogonal directions, a highly uniform and directionally controllable magnetic field environment can be formed in its central region. Placing the chip measurement device on the support platform ensures that the chip under test is precisely located within this uniform region, thereby obtaining stable and known magnetic field vectors in the X, Y, and Z axes, providing the necessary magnetic field conditions for accurate measurement of the chip's magnetic properties. Simultaneously, the support platform is typically made of non-magnetic material to minimize interference with the magnetic field distribution and ensure the accuracy of the measurement results.

[0117] Optionally, the variable temperature device 30 includes a heat flow meter. The heat flow meter directly controls the temperature and flow rate of the fluid, enabling rapid heating and cooling of the small cavity within the test chamber. It offers good temperature stability and fast response, meeting stringent temperature cycling test requirements. Compared to traditional temperature chambers, the heat flow meter only controls the temperature of a small test chamber, significantly reducing system thermal inertia and allowing the temperature change curve to more accurately track the set program, thus improving the accuracy and efficiency of temperature testing.

[0118] It should be noted that any other equipment or technology combination capable of achieving precise temperature control of the local space inside the test chamber and compatible with the magnetic field testing environment is acceptable, as long as it is used in conjunction with the test device and magnetic field generating device 20 of this application to form a complete chip testing system. For example, a thermoelectric cooler can be directly integrated into the test chamber 103 or a base in close contact with it, and the test chamber can be directly heated or cooled by precisely controlling the magnitude and direction of the current.

[0119] Optionally, the distance between the main body of the temperature-changing device 30 and the magnetic field generating device 20 is greater than a preset distance. The main body of the temperature-changing device 30 (such as a compressor, pump body, or metal structure) usually contains ferromagnetic materials or generates stray magnetic fields. The main body of the temperature-changing device 30 is far away from the magnetic field generating device 20 to reduce the interference of the magnetic materials such as iron, cobalt, and nickel inside the main body of the temperature-changing device 30 with the magnetic field generated by the magnetic field generating device 20.

[0120] For example, the preset distance can be determined based on the magnetic field material properties of the temperature-changing device 30. The greater the magnetic field strength of the magnetic field material, the farther the preset distance can be, for example, it can be 1 meter or more.

[0121] Optionally, the fluid conduit 40 between the temperature-changing device 30 and the test chamber 103 is a non-magnetic conduit. Even if the main body of the temperature-changing device 30 is far away, if ordinary metal pipes are used for the connecting pipes, magnetic interference or disturbance may still be introduced. Non-magnetic conduits (such as specific plastic pipes or non-magnetic stainless steel pipes) completely cut off this interference path. In addition, non-magnetic conduits usually also have excellent thermal insulation properties, which helps to reduce heat exchange between the pipes and the environment, thereby better maintaining the stability and uniformity of the local temperature field inside the test chamber.

[0122] The chip testing system provided in the embodiments of this application has been described in detail above. The embodiments of this application also provide a chip testing method for use in the above-described chip testing system. The chip testing method provided in the embodiments of this application uses an electronic device as the execution subject, such as... Figure 7 As shown, the method includes:

[0123] S101. Control the magnetic field generating device to generate a target magnetic field so that at least some components of the chip testing device are located in the uniform region of the generated magnetic field.

[0124] For example, before or simultaneously with the control magnetic field generating device generating the target magnetic field, the spatial orientation of the probe end of the magnetic field measuring component in the lower isolation cavity can be adjusted so that its sensitive direction is consistent with the preset direction of the target magnetic field, and then the adjusted magnetic field measuring component is fixed by the probe fixing mechanism.

[0125] For example, a magnetic field generating device can be controlled to generate a target magnetic field independently or in combination along at least one of the X-axis, Y-axis, and Z-axis.

[0126] S102. Control the operation of the temperature-changing equipment and deliver the temperature-controlled medium to the upper test chamber of the test hood through the fluid pipeline to create a local temperature environment in the upper test chamber.

[0127] For example, the temperature control device is used to make the temperature inside the upper test chamber change according to a preset temperature curve, which includes at least one of a heating, cooling and constant temperature phase.

[0128] S103. Control the magnetic field measuring component to measure the actual magnetic field data in the vertical direction corresponding to the chip installation position in the upper test cavity in the lower isolation cavity.

[0129] Optionally, the electrical output signal of the magnetic sensing chip under test can also be acquired under the combined action of the target magnetic field and the local temperature environment; based on the actual magnetic field data, the performance of the electrical output signal can be analyzed, temperature drift compensation can be performed, or sensitivity calibration can be performed.

[0130] For example, an excitation electrical signal can be applied to the magnetosensitive chip through the wires in the wiring layer inside the printed circuit board, and the output electrical signal generated by the magnetosensitive chip in response to the target magnetic field, the local temperature environment and the excitation electrical signal can be collected simultaneously.

[0131] For example, performance analysis, temperature drift compensation, or sensitivity calibration of electrical output signals based on actual magnetic field data may include: establishing a correspondence between the output signal of the magnetosensitive chip and the precise magnetic field value measured by the magnetic field measurement component to perform sensitivity calibration; analyzing the characteristics of the output signal of the magnetosensitive chip changing with temperature under a constant magnetic field to determine its temperature drift coefficient; and analyzing the linearity or accuracy of the output signal of the magnetosensitive chip changing with the magnetic field at a constant temperature.

[0132] For example, during the test, the temperature-controlled device applies temperature control to the chip through a non-magnetic conduit. Once the chip reaches the specified temperature, a Helmholtz coil provides a set magnetic field to the magnetically sensing chip. The system simultaneously acquires the actual magnetic field strength using a gaussmeter and collects the chip's output signal through a high-precision data acquisition unit and a multimeter system. All data is recorded in a preset table in real time. After completing the test at the current temperature point, the system will automatically or manually adjust to the next temperature point and repeat the above measurement process, thereby achieving magnetic field-electrical signal characteristic testing under multiple temperature conditions.

[0133] Figure 8 A schematic diagram of the structure of the electronic device provided in this application. Figure 8 As shown, the electronic device 50 provided in this embodiment includes at least one processor 501 and a memory 502. Optionally, the electronic device 50 further includes a communication component 503. The processor 501, memory 502, and communication component 503 are connected via a bus.

[0134] In a specific implementation, at least one processor 501 executes computer execution instructions stored in memory 502, causing at least one processor 501 to perform the above-described method.

[0135] The specific implementation process of processor 501 can be found in the above method embodiments, and its implementation principle and technical effect are similar. It will not be repeated here.

[0136] In the above embodiments, it should be understood that the processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), etc. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this invention can be directly implemented by a hardware processor, or implemented by a combination of hardware and software modules within the processor.

[0137] The memory may include random access memory (RAM) and may also include non-volatile memory (NVM), such as at least one disk storage device.

[0138] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of illustration, the buses shown in the accompanying drawings are not limited to a single bus or a single type of bus.

[0139] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method.

[0140] This application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the above-described method.

[0141] The aforementioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The readable storage medium can be any available medium accessible to a general-purpose or special-purpose computer.

[0142] An exemplary readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can reside in an Application Specific Integrated Circuit (ASIC). Alternatively, the processor and the readable storage medium can exist as discrete components in the device.

[0143] The division of units is merely a logical functional division; in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0144] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0145] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0146] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0147] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0148] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A chip testing device, characterized in that, At least some of its components are placed in a uniform magnetic field region generated by a magnetic field generating device, including: Base assembly (101); A middle partition (102) is disposed above the base assembly (101) and together with the base assembly (101) forms a lower isolation cavity; A test enclosure (103) is disposed above the intermediate partition (102) and together with the intermediate partition (102) forms an upper test cavity for accommodating the magnetic sensing chip (105) under test; the test enclosure (103) is configured to be connected to an external temperature control device to form a controlled local temperature environment in the upper test cavity; The magnetic field measuring component (104) has its probe end passing through the sidewall of the base assembly and extending into the lower isolation cavity, and its probe point is configured to correspond vertically to the chip mounting position in the upper test cavity, for measuring the magnetic field at the chip mounting position.

2. The chip testing apparatus according to claim 1, characterized in that, The intermediate partition (102) is a printed circuit board; The printed circuit board is a multilayer board with a wiring layer inside; the upper surface of the printed circuit board has an interface that seals with the test cover (103), and the wires of the wiring layer are electrically connected to the magnetic sensing chip (105) placed in the upper test cavity through the interface.

3. The chip testing apparatus according to claim 2, characterized in that, The base assembly (101) includes a support block, and the printed circuit board is disposed above the support block; the support block has a horizontally extending measurement channel, and the probe end of the magnetic field measuring component (104) extends into the lower isolation cavity through the measurement channel.

4. The chip testing apparatus according to any one of claims 1 to 3, characterized in that, The magnetic field measuring component (104) is a gaussmeter probe.

5. The chip testing apparatus according to claim 4, characterized in that, It also includes a probe fixing mechanism (106) for fixing the gaussmeter probe in a state where its detection point corresponds to the chip mounting position in the upper test cavity in the vertical direction.

6. A chip testing system, characterized in that, include: The chip testing apparatus (10) according to any one of claims 1 to 5; A magnetic field generating device (20) is provided, and at least some components of the chip testing device (10) are placed within a uniform magnetic field region generated by the magnetic field generating device (20). The temperature-changing device (30) is connected to the test chamber (103) through a fluid pipeline (40) and is used to deliver a temperature-controlled medium into the upper test chamber to form a local temperature-changing environment in the upper test chamber.

7. The chip testing system according to claim 6, characterized in that, The base assembly (101), the intermediate partition (102), the magnetic field measuring component (104), and the magnetic sensing chip (105) are placed in the magnetic field uniform region.

8. The chip testing system according to claim 7, characterized in that, The magnetic field generating device (20) includes a support assembly; The base assembly (101) is placed on the support assembly.

9. The chip testing system according to claim 6, characterized in that, The magnetic field generating device (20) includes a three-dimensional Helmholtz coil; And / or, the temperature-changing device (30) is a heat flow meter; And / or, the fluid conduit (40) includes a non-magnetic conduit.

10. The chip testing system according to any one of claims 6-9, characterized in that, The distance between the main body of the temperature-changing device (30) and the magnetic field generating device (20) is greater than a preset distance.

11. A chip testing method, characterized in that, The method for the chip testing system according to any one of claims 6 to 10 includes: The magnetic field generating device is controlled to generate a target magnetic field, so that at least some components of the chip testing device are located within the uniform region of the generated magnetic field. The temperature control device is controlled to operate, and a temperature control medium is delivered to the upper test chamber of the test hood through the fluid pipeline to form a local temperature environment in the upper test chamber; The magnetic field measuring component is controlled to measure the actual magnetic field data in the lower isolation cavity in situ, which corresponds to the chip mounting position in the upper test cavity in the vertical direction.

12. The method according to claim 11, characterized in that, The method further includes: Acquire the electrical output signal of the magnetic sensing chip under test under the combined action of the target magnetic field and the local temperature environment; Based on the actual magnetic field data, the electrical output signal is subjected to performance analysis, temperature drift compensation, or sensitivity calibration.

13. An electronic device, characterized in that, include: Memory, processor; The memory stores computer-executed instructions; The processor executes computer execution instructions stored in the memory, causing the processor to perform the method as described in claim 11 or 12.

14. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the method as described in claim 11 or 12.

15. A computer program product, characterized in that, Includes a computer program that, when executed by a processor, implements the method of claim 11 or 12.

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