Film-cooled active infrared cloaking device

Abstract

The application relates to a film cold type active infrared stealth device, which comprises a surface layer in contact with the environment, a substrate layer for bearing the layer structure, a high-thermal-conductivity film layer arranged between the surface layer and the substrate layer, the in-plane thermal conductivity of the high-thermal-conductivity film layer being not less than 500 Wm ‑ ¹·K ‑ ¹; at least one thermoelectric refrigeration sheet arranged on the side of the high-thermal-conductivity film layer close to the substrate layer, the cold end of the thermoelectric refrigeration sheet being attached to the high-thermal-conductivity film layer; and a power supply and control module electrically connected with the thermoelectric refrigeration sheet and used for providing adjustable input current to the thermoelectric refrigeration sheet. The cold quantity of the thermoelectric refrigeration sheet is rapidly diffused in the plane through the high-thermal-conductivity film layer, thereby breaking through the limitation of the size of a single refrigeration sheet on the stealth area; meanwhile, the input current and the thermal conductivity of the film layer are matched, so that the increase of energy consumption caused by simply increasing the current is avoided, and the unification of large-area stealth and low power consumption is realized.

Description

Technical Field

[0001] This invention relates to the field of infrared stealth technology, and in particular to a membrane-cooled active infrared stealth device. Background Technology

[0002] Infrared detection technology, due to its independence from visible light and all-weather operation, is widely used in target detection, identification, and tracking. The heat generated by a target during operation causes its surface temperature to exceed the surrounding background, thus creating a distinct infrared signature. Therefore, developing effective infrared stealth technology is crucial to reducing the probability of a target being detected by infrared detection systems.

[0003] Existing infrared stealth technologies mainly fall into two categories: passive infrared stealth and active infrared stealth. Passive infrared stealth typically weakens infrared radiation intensity by reducing the infrared emissivity of materials, adding heat-insulating layers, or employing multi-layered structures. However, this type of method has poor adaptability to environmental changes and struggles to cope with situations such as continuous internal heating of the target or rapid changes in external ambient temperature, thus its stealth effectiveness has significant limitations. Active infrared stealth technology, by introducing external energy to regulate the surface temperature of the target, can overcome the shortcomings of passive stealth methods to some extent. Among these, thermoelectric cooling technology utilizes the Peltier effect to achieve the interconversion of electrical and thermal energy, providing a new technical approach for active infrared stealth.

[0004] However, existing thermoelectric infrared stealth solutions mostly focus on reducing the cold-end temperature of the thermoelectric cooler, limiting its cooling capacity to a localized area and making it difficult to achieve uniform and effective infrared stealth over a large area. Furthermore, simply relying on increasing the cooling current to obtain a lower cold-end temperature often leads to increased energy consumption and decreased system stability, failing to meet the needs of practical engineering applications. In addition, existing technologies lack systematic structural design and engineering implementation solutions for efficiently dispersing the cooling capacity generated by the thermoelectric cooler over a larger area and for achieving a reasonable match between the input parameters of the thermoelectric cooler and its cooling capacity under different operating conditions. Summary of the Invention

[0005] To address the technical challenge of simultaneously achieving large-area uniform infrared stealth and low power consumption in existing technologies, this invention provides a film-cooled active infrared stealth device. The technical solution is as follows:

[0006] A film-cooled active infrared stealth device is provided, comprising: a surface layer in contact with the environment; a base layer for supporting the various structural layers; and a high thermal conductivity film layer disposed between the surface layer and the base layer, having an in-plane thermal conductivity of not less than 500 W·m. - ¹·K -¹; at least one thermoelectric cooler is disposed on the side of the high thermal conductivity film layer near the substrate layer, the cold end of the thermoelectric cooler being attached to the high thermal conductivity film layer; and a power supply and control module is electrically connected to the thermoelectric cooler for providing an adjustable input current to the thermoelectric cooler; wherein the magnitude of the input current is coordinated with the in-plane thermal conductivity of the high thermal conductivity film layer, so that the cooling energy generated by each thermoelectric cooler can diffuse through the high thermal conductivity film layer to a preset stealth area, thereby ensuring that the surface temperature within this area is not higher than the ambient background temperature.

[0007] The beneficial effects of the technical solution provided by the embodiments of the present invention include at least the following: by setting the in-plane thermal conductivity to be not less than 500 W·m - ¹·K - ¹ A high thermal conductivity film layer is used, and the cold end of the thermoelectric cooler is attached to this high thermal conductivity film layer. This allows the cooling energy generated by the thermoelectric cooler to spread rapidly and uniformly over a larger area in the in-plane direction, breaking through the limitation of the stealth area on the size of a single thermoelectric cooler. At the same time, by coordinating the magnitude of the input current with the in-plane thermal conductivity of the high thermal conductivity film layer, the cooling energy generated by each thermoelectric cooler can be matched with the thermal conductivity of the high thermal conductivity film layer. This avoids the problem of increased energy consumption and decreased system stability caused by simply increasing the cooling current to pursue a lower cold end temperature. This device achieves large-area effective infrared stealth while significantly reducing system power consumption. It also has a compact structure and good engineering feasibility. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 This is a schematic diagram of the structure of a membrane-cooled active infrared stealth device provided in an embodiment of the present invention.

[0010] Explanation of reference numerals in the attached diagram: 1. Base layer; 2. High thermal conductivity film layer; 3. Surface layer; 4. Thermoelectric cooling element; 5. Fin. Detailed Implementation

[0011] The technical solution of the present invention will now be described with reference to the accompanying drawings.

[0012] In embodiments of the present invention, words such as "exemplarily," "for example," etc., are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" in the present invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the word "exemplary" is intended to present the concept in a concrete manner. Furthermore, in embodiments of the present invention, the meaning expressed by "and / or" can be both, or either one.

[0013] In the embodiments of this invention, the terms "image" and "picture" may sometimes be used interchangeably. It should be noted that, without emphasizing the distinction between them, they convey the same meaning. Similarly, the terms "of," "corresponding (relevant)," and "corresponding" may sometimes be used interchangeably. It should be noted that, without emphasizing the distinction between them, they convey the same meaning.

[0014] In this embodiment of the invention, sometimes a subscript such as W1 may be written in a non-subscript form such as W1. When the difference is not emphasized, the meaning they express is the same.

[0015] To make the technical problems, technical solutions and advantages of the present invention clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0016] Please see Figure 1 This invention provides a film-cooled active infrared stealth device, which includes a surface layer 3, a base layer 1, a high thermal conductivity film layer 2, at least one thermoelectric cooler 4, and a power supply and control module (not shown in the figure). The surface layer 3 is in contact with the environment, and the base layer 1 supports the various structural layers. The high thermal conductivity film layer 2 is disposed between the surface layer 3 and the base layer 1, and its in-plane thermal conductivity is not less than 500 W·m. - ¹·K - ¹; The thermoelectric cooler 4 is disposed on the side of the high thermal conductivity film layer 2 near the substrate layer 1, and the cold end of the thermoelectric cooler 4 is attached to the high thermal conductivity film layer 2; The power supply and control module is electrically connected to the thermoelectric cooler 4 and is used to provide an adjustable input current to the thermoelectric cooler 4; The magnitude of the input current is coordinated with the in-plane thermal conductivity of the high thermal conductivity film layer 2, so that the cooling energy generated by each thermoelectric cooler 4 can diffuse through the high thermal conductivity film layer 2 to the preset stealth area, so that the surface layer 3 temperature in this area is not higher than the ambient background temperature.

[0017] The core innovation of this invention lies in treating the generation and diffusion of cold energy as two collaboratively designed aspects, rather than as independent parameters. In traditional thermoelectric stealth solutions, the cooling capacity of the thermoelectric cooler 4 is limited to its own size. To achieve large-area stealth, it is often necessary to densely arrange a large number of coolers or simply increase the input current to pursue a lower cold-end temperature, resulting in a significant increase in system complexity and power consumption. This invention completely changes this design approach by introducing an in-plane thermal conductivity of not less than 500 W·m. - ¹·K - The high thermal conductivity film layer 2 ¹ rapidly and uniformly diffuses the cooling energy generated by the cold end of the thermoelectric cooling chip 4 to a larger area in the in-plane direction, thereby greatly increasing the effective stealth area of ​​a single cooling chip.

[0018] More importantly, this invention coordinates the input current with the thermal conductivity of the high thermal conductivity film layer 2. The input current determines the amount of cooling generated by the cooling chip, while the thermal conductivity of the high thermal conductivity film layer 2 determines the speed and range of cooling diffusion. The two work together to ensure that the cooling generated by each cooling chip can diffuse precisely through the high thermal conductivity film layer 2 to a predetermined stealth area, while maintaining the surface temperature within that area below the ambient background temperature. This "diffusion-driven generation" design avoids the energy waste caused by simply pursuing low cold-end temperatures, achieving a balance between large-area stealth and low power consumption, while also simplifying the system structure and improving response speed.

[0019] Optionally, surface layer 3, as the outermost layer of the device directly facing the environment, directly affects the stealth performance of the device through its functional design and material selection. In this embodiment of the invention, surface layer 3 may include an infrared thin film layer and / or a radar-absorbing thin layer and / or a camouflage layer. The infrared thin film layer is used to regulate the infrared radiation characteristics of the device, further weakening the infrared radiation intensity of the device itself by reducing the infrared emissivity of surface layer 3, thus creating a synergistic effect with the active cooling of the thermoelectric cooler 4. The radar-absorbing thin layer is used to absorb radar waves, enabling the device to possess radar stealth capabilities and achieving multi-band stealth compatibility. The camouflage layer is used for optical stealth. This modular surface layer 3 design allows the device to be flexibly configured according to actual application scenarios, taking into account the needs of infrared stealth, radar stealth, and optical stealth, thereby improving the applicability of the device.

[0020] Optionally, the base layer 1 is used to support the high thermal conductivity film layer 2, the thermoelectric cooling element 4, and the surface layer 3, among other structural layers. In this embodiment of the invention, the base layer 1 is made of a flexible material, giving the entire device foldable, deployable, or rollable characteristics. This design allows the device to be folded or rolled up when not in use, facilitating carrying and transportation; when in use, it can be quickly deployed to cover the target surface, adapting to various complex terrains and equipment shapes, significantly improving the portability and deployment flexibility of the device.

[0021] Optionally, the high thermal conductivity film layer 2 is composed of multiple sub-regions, each sub-region corresponding to at least one thermoelectric cooling element 4, and at least two sub-regions corresponding to thermoelectric cooling elements 4 have different input currents. In practical applications, stealth targets vary in size, placing higher demands on the flexibility of large-area stealth. Therefore, in this embodiment of the invention, the high thermal conductivity film layer 2 can be composed of multiple sub-regions, each sub-region corresponding to at least one thermoelectric cooling element 4, thus forming a modular stealth unit. More importantly, at least two sub-regions corresponding to thermoelectric cooling elements 4 can have different input currents, enabling independent control of each zone. This design allows the device to provide differentiated cooling capabilities to different sub-regions based on the varying heating conditions of different areas on the target surface, avoiding localized overcooling or insufficient cooling caused by a "one-size-fits-all" approach. This achieves an optimal match between stealth performance and energy consumption, further enhancing the device's applicability in complex environments.

[0022] Optionally, the in-plane thermal conductivity of the high thermal conductivity film layer 2 is key to achieving efficient cold diffusion. In this embodiment of the invention, the high thermal conductivity film layer 2 is preferably made of graphene, pyrolytic graphite, or diamond. Graphite materials have excellent in-plane thermal conductivity, with in-plane thermal conductivity reaching hundreds to thousands of W·m. - ¹·K - ¹ It can quickly and evenly diffuse the cold energy generated by the cold end of the thermoelectric cooling chip 4 to a larger area, effectively improving the cooling coverage of a single cooling chip.

[0023] Optionally, the high thermal conductivity film layer 2 can also be a flexible vapor chamber. A flexible vapor chamber is a phase change heat dissipation device that can be bent, folded, or fitted to irregularly shaped surfaces. It uses flexible materials (such as polymers, copper foil / PI composite films) to replace the traditional rigid metal shell. Internally, it contains a microstructured capillary wick and a closed phase change working fluid, achieving efficient and uniform heat conduction through liquid-vapor phase change. Its principle is the same as that of a traditional vapor chamber, relying on the working fluid (such as water or ethanol) within the vacuum chamber to evaporate at the heat source end, diffuse to the cold zone for condensation, and then reflux through the liquid capillary structure. The thermal conductivity can reach several thousand W·m. - ¹·K - ¹.

[0024] Optionally, the input current of the thermoelectric cooler 4 is 1A to 3A. The input current of the thermoelectric cooler 4 determines the amount of cooling generated at its cold end. In this embodiment of the invention, the input current is preferably 1A to 3A. This current range is a low-current operating range determined after comprehensively considering the in-plane thermal conductivity of the high thermal conductivity film layer 2 and the preset stealth area. Unlike the prior art, which typically uses a larger current to pursue a lower cold end temperature, this invention achieves effective infrared stealth within a low current range of 1A to 3A through the synergistic matching of current and thermal conductivity. This significantly reduces system power consumption, extends power supply life, and avoids the problem of decreased cooling efficiency caused by the dramatic increase in Joule heat loss of the thermoelectric cooler 4 under high current.

[0025] It should be noted that in this embodiment, the hot end of the thermoelectric cooler 4 faces the flexible substrate layer 1. Since this invention employs a low-current (1A~3A) operating mode, the heat generated by the hot end of the thermoelectric cooler 4 is relatively small, and this small amount of heat can be dissipated through a simpler structure. Optionally, the stealth device in this invention also includes fins 5 or a phase change thermal storage unit. The heat generated by the hot end of the thermoelectric cooler 4 is discharged into the environment through the heat sink of the fins 5 or transferred to the phase change thermal storage unit. This design significantly simplifies the device structure and reduces its size and weight.

[0026] Optionally, to achieve large-area uniform cooling, multiple thermoelectric cooling elements 4 are arranged in a regular array on the high thermal conductivity film layer 2. Figure 1 The upper part of the diagram illustrates the array arrangement of thermoelectric cooling elements 4. In reality, the surface layer 3 and the high thermal conductivity film layer 2 will cover the thermoelectric cooling elements 4; this depiction is merely for clarity in showing the arrangement of the thermoelectric cooling elements 4. In this embodiment of the invention, the thermoelectric cooling elements 4 are rectangular, with adjacent spacing along their length less than or equal to five times their length, and adjacent spacing along their width less than or equal to five times their width. This spacing design ensures that the cooling capacity generated by adjacent cooling elements can be interconnected through the high thermal conductivity film layer 2 without leaving any "cooling blind spots," while avoiding increased costs and structural redundancy caused by overly dense arrangement of cooling elements, achieving an optimal balance between cooling effect and cost.

[0027] Optionally, the thermoelectric cooling element 4 is square with a side length of 20mm to 65mm. The thermoelectric cooling element 4 within this size range is easy to arrange in an array and modularly spliced, and at the same time, it matches the in-plane thermal conductivity of the high thermal conductivity film layer 2, enabling efficient cooling under low current conditions.

[0028] Optionally, the device also includes a temperature sensor for detecting the ambient background temperature and / or the temperature of surface layer 3. The power supply and control module adjusts the input current based on the temperature difference detected by the temperature sensor.

[0029] Optionally, the power supply and control module may include a battery (or an external power interface) and a control circuit. The control circuit adjusts the output current based on the temperature difference between the ambient temperature and the preset stealth area, so that the input current is synchronized with the in-plane thermal conductivity of the high thermal conductivity film layer 2. The control circuit can use PID control or lookup table control to achieve precise current regulation.

[0030] Three specific implementation methods are provided below for reference.

[0031] Example 1: In this example, the overall size of the device is 20cm × 20cm, using a 40mm × 40mm thermoelectric cooler 4. The cold end of the thermoelectric cooler 4 is in direct contact with a high thermal conductivity film layer 2, and the in-plane thermal conductivity of the high thermal conductivity film layer 2 is approximately 1000 W·m. - ¹·K - ¹. A low-infrared-emissivity metal film is coated on the outer side of the high thermal conductivity film layer 2 as a surface layer 3. A 2A input current is applied to the thermoelectric cooler 4 via the power supply and control module. The high thermal conductivity film layer 2 diffuses the cooling energy generated by the thermoelectric cooler 4 in the in-plane direction, making the surface temperature of an approximately 20cm × 20cm area match the ambient background temperature, thereby achieving active infrared stealth. At room temperature, the entire surface temperature is 285K.

[0032] Example 2: In this example, the entire device measures 20cm × 30cm and uses six 20mm × 20mm thermoelectric coolers 4 arranged in a regular array. The cold end of each thermoelectric cooler 4 is in direct contact with a layer of synthetic graphite film (i.e., a high thermal conductivity film layer 2), and the in-plane thermal conductivity of the graphite film is approximately 600 W·m. - ¹·K - ¹. A low-infrared-emissivity metal film is coated on the outer side of the high thermal conductivity film layer 2 as a surface layer 3. A 1A input current is applied to the thermoelectric cooler 4 via the power supply and control module. The graphite film diffuses the cooling energy generated by the thermoelectric cooler 4 in the in-plane direction, causing the surface temperature of an area of ​​approximately 20cm × 30cm to match the ambient background temperature, thereby achieving active infrared stealth. At room temperature, the surface temperature of the entire stealth blanket is 288K.

[0033] Example 3: In this example, the entire device measures 2m × 3m. Its high thermal conductivity film layer 2 is composed of multiple sub-regions. Each sub-region can be constructed using a 20cm × 20cm high thermal conductivity film layer 2 as described in Example 1. Each sub-region corresponds to a thermoelectric cooling element 4, and the entire device integrates 150 thermoelectric cooling elements 4. These are controlled uniformly or in zones via a power supply and control module. The sub-regions are connected by a flexible support base layer 1, giving the device the ability to be laid out and folded. By adjusting the input current, the overall surface temperature of the device is matched with the ambient background temperature. The current of a single thermoelectric cooling element 4 is between 1 and 2A. Thermoelectric cooling elements 4 often have a higher energy efficiency ratio when operating under low current conditions, making a single thermoelectric cooling element 4 more energy-efficient. To achieve the same infrared stealth area, this example requires a significantly larger number of thermoelectric cooling elements 4, but the overall system consumes less power, is more energy-efficient, and has a faster response time. When the external wind speed is 20m / s, the average surface temperature of the entire stealth blanket is 294.3K.

[0034] To further compare the advantages of the present invention, we compared the above-described embodiment 3 with common water-cooled stealth devices and air-cooled stealth devices, and the results are shown in Table 1.

[0035] Table 1: Performance parameters of Example 3 compared with other devices.

[0036]

[0037] As can be seen from the table, the membrane-cooled active infrared stealth device provided in Embodiment 3 of the present invention is significantly smaller in volume (0.0091 m³) and weight (3.3 kg) than the water-cooled device, and its response time (30 s) is much faster than both the water-cooled (900 s) and air-cooled (300 s) types. Simultaneously, its heat exchange power (2475.6 W) is significantly higher than that of the air-cooled (1625 W). This indicates that the present invention achieves rapid response and efficient heat exchange while maintaining a compact and lightweight structure, demonstrating significant comprehensive performance advantages. It is particularly suitable for portable and rapid deployment scenarios with strict requirements on size, weight, and response speed.

[0038] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. A and B can be singular or plural. Additionally, the character " / " in this article generally indicates an "or" relationship between the preceding and following related objects, but it can also represent an "and / or" relationship. Please refer to the context for a more accurate understanding.

[0039] In this invention, "at least one" means one or more, and "more than one" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be a single item or multiple items.

[0040] It should be understood that, in various embodiments of the present invention, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0041] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0042] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the devices, apparatuses, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0043] In the several embodiments provided by this invention, it should be understood that the disclosed devices, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another device, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0044] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0045] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0046] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0047] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A membrane-cooled active infrared stealth device, characterized in that, The device includes: The surface layer, which comes into contact with the environment; The base layer is used to support the structure of each layer. A high thermal conductivity film layer is disposed between the surface layer and the substrate layer, and its in-plane thermal conductivity is not less than 500 W·m. - ¹·K - ¹; At least one thermoelectric cooling element is disposed on the side of the high thermal conductivity film layer near the substrate layer, and the cold end of the thermoelectric cooling element is attached to the high thermal conductivity film layer; and A power supply and control module, electrically connected to the thermoelectric cooler, is used to provide an adjustable input current to the thermoelectric cooler; The magnitude of the input current is coordinated with the in-plane thermal conductivity of the high thermal conductivity film layer, so that the cooling energy generated by each thermoelectric cooling chip can diffuse through the high thermal conductivity film layer to the preset stealth area, thereby ensuring that the surface temperature within this area is not higher than the ambient background temperature.

2. The membrane-cooled active infrared stealth device according to claim 1, characterized in that, The surface layer includes: An infrared thin film layer is used to modulate the infrared radiation characteristics of the device; and / or Radar absorbing thin layer, used to absorb radar waves; and / or Camouflage layer, used for optical stealth.

3. The membrane-cooled active infrared stealth device according to claim 1, characterized in that, The base layer is a flexible base layer, which enables the device to be foldable, unfoldable, or rollable.

4. The membrane-cooled active infrared stealth device according to claim 1, characterized in that, The high thermal conductivity film layer is composed of multiple sub-regions spliced ​​together, and each sub-region is provided with at least one thermoelectric cooling chip, and the thermoelectric cooling chips corresponding to at least two sub-regions have different input currents.

5. The membrane-cooled active infrared stealth device according to claim 1, characterized in that, The high thermal conductivity film layer is made of graphene, pyrolytic graphite, or diamond, or is a flexible heat spreader.

6. The membrane-cooled active infrared stealth device according to claim 1, characterized in that, The input current of the thermoelectric cooling element is 1A~3A.

7. The membrane-cooled active infrared stealth device according to claim 6, characterized in that, The device also includes a finned or phase change thermal storage unit, wherein the heat generated by the hot end of the thermoelectric cooling chip is discharged into the environment through the finned heat sink or transferred to the phase change thermal storage unit.

8. The membrane-cooled active infrared stealth device according to claim 1, characterized in that, The thermoelectric cooling element is rectangular, and multiple thermoelectric cooling elements are arranged in a regular array. The adjacent spacing along the length direction of the thermoelectric cooling element is less than or equal to 5 times its length, and the adjacent spacing along the width direction is less than or equal to 5 times its width.

9. The membrane-cooled active infrared stealth device according to claim 8, characterized in that, The thermoelectric cooling element is square, with a side length of 20mm to 65mm.

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