A semiconductor chip test information management method, device and medium

Abstract

The application discloses a kind of management method, equipment and medium of semiconductor chip test information, it is related to test information management technical field, including, to semiconductor chip test object association table and test version event chain are closed locking verification, obtain test information closed locking table, closed locking abnormality in test information closed locking table is backfilled to corresponding wafer ring fan page block index and test version event chain, form closed locking drive difference record, after receiving test information management request, same record is found in semiconductor chip test object association table, and change record is found in closed locking drive difference record, test information management request, same record and change record are encapsulated, form test information management result package;The application improves the management efficiency and accuracy of semiconductor chip test information by constructing closed locking drive difference record.

Description

Technical Field

[0001] This invention relates to the field of test information management technology, and in particular to a method, device and medium for managing semiconductor chip test information. Background Technology

[0002] As semiconductor manufacturing processes continue to evolve towards higher integration, higher precision, and higher reliability, wafer-level testing, finished chip testing, and multi-batch reliability verification are playing an increasingly important role in the semiconductor chip production process. In actual testing, testing equipment typically generates a large number of test files based on test batches, wafer identifiers, test version numbers, semiconductor chip coordinates, and test results. These test files contain multi-level test data objects and test records from different sources. By standardizing the management of semiconductor chip test information, the scattered test file content can be transformed into data records that are clearly structured, hierarchically defined, and easy to retrieve and trace. Especially with the ever-expanding scale of wafer test data, establishing a unified management method for test data objects, semiconductor chip coordinates, and test version numbers has become an important direction for the development of semiconductor chip test information management technology.

[0003] Nevertheless, existing semiconductor chip test information management methods still have room for improvement. First, they do not use the center of the semiconductor chip wafer as an anchor point to calculate radial distance and angular position, making it difficult to divide the semiconductor chip coordinates into rings and sectors and form a wafer ring-sector-page block index. This affects the rapid location and anomaly cluster analysis at the wafer region level. Second, there is a lack of a unified connection and traceability mechanism for data changes of the same wafer and the same chip coordinates under different test versions, making it difficult to track differences in test results between versions. This affects the efficiency of anomaly location and the accuracy of version tracing under test information management requests. Summary of the Invention

[0004] In view of the aforementioned existing problems, the present invention is proposed.

[0005] Therefore, this invention provides a method for managing semiconductor chip test information to solve the problem of difficulty in tracking differences in test results between versions.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0007] In a first aspect, the present invention provides a method for managing semiconductor chip test information, comprising,

[0008] Collect the test file entry records of semiconductor chips, segment them, obtain the test file segment table, parse the test data objects in the test file segment table, and form a test object specification record table.

[0009] According to the parent-child hierarchical relationship coding test object specification record table, obtain the test object path table;

[0010] Using the center of the semiconductor chip wafer as the anchor point, calculate the ring zone and sector to which the semiconductor chip coordinates belong, obtain the wafer ring sector page block index, and bind it with the test object path table to obtain the semiconductor chip test object association table;

[0011] Connect the semiconductor chip test object association table by version to obtain the test version event chain;

[0012] Perform lockout verification on the semiconductor chip test object association table and test version event chain to obtain the test information lockout table;

[0013] The locking exceptions in the test information locking table are fed back to the corresponding wafer ring fan page block index and test version event chain to form a locking-driven differential record.

[0014] Upon receiving a test information management request, the system searches for identical records in the semiconductor chip test object association table and for changed records in the latch-up drive differential records. The test information management request, identical records, and changed records are then encapsulated to form a test information management result package.

[0015] In a preferred embodiment of the semiconductor chip test information management method of the present invention, the step of forming a test object specification record table specifically includes:

[0016] The test file entry record includes the test file text, test batch identifier, wafer identifier, and test version number;

[0017] The test file is segmented according to the start and end positions and parent-child hierarchical relationship of the test data objects in the test file body. Each segment of the test file body is recorded with the test batch identifier, wafer identifier and test version number to obtain the test file segmentation table.

[0018] Identify test data objects within the test file segmentation table, and extract the corresponding object hierarchy, object identifier, parent object identifier, object order, and source segment position of the test data objects;

[0019] Arrange the object hierarchy, object identifier, parent object identifier, object order, source segment position, test batch identifier, wafer identifier, and test version number in a unified record format to form a test object specification record table.

[0020] In a preferred embodiment of the semiconductor chip test information management method of the present invention, the step of obtaining the test object path table specifically includes:

[0021] Read the object hierarchy, object identifier, parent object identifier, object order, source segment position, test batch identifier, wafer identifier, and test version number from the test object specification record table;

[0022] The test data object with an empty parent object is used as the first-level test data object. The test batch identifier, wafer identifier, test version number, object level, object identifier, object order and source segment position are concatenated and encoded to obtain the test object path code of the first-level test data object. The test object path code of the first-level test data object is written into the test object specification record table.

[0023] Read test data objects whose parent object identifier is not empty from top to bottom according to the object hierarchy. Find the test object path code corresponding to the parent object identifier from the test object specification record table that has written the test object path code. Then, concatenate the test object path code corresponding to the parent object identifier, the object hierarchy, the object identifier, the object order and the source segment position order and encode it to obtain the test object path code of the test data object whose parent object identifier is not empty.

[0024] Write the test object path code of the test data object whose parent object identifier is not empty into the test object specification record table, and obtain the test object path table.

[0025] In a preferred embodiment of the semiconductor chip test information management method of the present invention, the step of obtaining the semiconductor chip test object association table specifically includes:

[0026] Read the test batch identifier, wafer identifier, test version number, test data object, test object path code and source segment position from the test object path table, and extract the corresponding semiconductor chip coordinates from the test file body according to the source segment position. Calculate the semiconductor chip wafer center according to the horizontal and vertical boundaries of all semiconductor chip coordinates under the same test batch identifier, the same wafer identifier and the same test version number.

[0027] Calculate the radial distance and angular position of each semiconductor chip coordinate relative to the center of the semiconductor chip wafer, arrange the semiconductor chip coordinates according to the radial distance, and divide the arranged semiconductor chip coordinates into equal numbers according to the preset number of rings, calculate the ring to which the semiconductor chip coordinate belongs, and calculate the sector to which the semiconductor chip coordinate belongs according to the angular position.

[0028] The test batch identifier, wafer identifier, test version number, ring band and sector are concatenated in sequence and then subjected to SHA-256 hash operation to form the wafer ring sector block index.

[0029] Bind the test object path code, test data object, and semiconductor chip coordinates in the test object path table to the corresponding wafer ring fan page block index to obtain the semiconductor chip test object association table.

[0030] As a preferred embodiment of the semiconductor chip test information management method of the present invention, the step of obtaining the test version event chain specifically includes:

[0031] Read the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test object path code, wafer ring fan block index and test version number from the semiconductor chip test object association table. Merge the records in the semiconductor chip test object association table according to the same test batch identifier, same wafer identifier, same semiconductor chip coordinates and same test data object, and arrange the merged records in order of test version number from first to last.

[0032] Take the first test version number corresponding to the sorted record as the starting record, establish a concatenation relationship between each subsequent test version number corresponding record and the previous test version number corresponding record, and write the previous test version number, the current test version number, the test object path code and the wafer ring fan page block index into the same concatenation relationship;

[0033] Once all test version numbers under the same test batch identifier, same wafer identifier, same semiconductor chip coordinates, and same test data object have been concatenated, obtain the test version event chain.

[0034] In a preferred embodiment of the semiconductor chip test information management method of the present invention, the step of obtaining the test information lockout table specifically includes:

[0035] Read the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test object path code, wafer ring fan block index and test version number from the semiconductor chip test object association table, and read the previous test version number, current test version number, test object path code and wafer ring fan block index from the test version event chain for the same test batch identifier, same wafer identifier, same semiconductor chip coordinates and same test data object;

[0036] Using the same test batch identifier, same wafer identifier, same semiconductor chip coordinates, same test data object, and same test version number as the locking verification range, check whether there is a unique record in the semiconductor chip test object association table;

[0037] Recalculate the ring and sector to which the semiconductor chip coordinates belong according to the generation rules of the wafer ring and sector index, and regenerate the wafer ring and sector index. Check whether the regenerated wafer ring and sector index is consistent with the wafer ring and sector index in the semiconductor chip test object association table.

[0038] Check whether there is a continuous connection between the previous test version number and the current test version number in the test version event chain, and check whether the test object path code and wafer ring fan block index in the test version event chain are consistent with the test object path code and wafer ring fan block index in the semiconductor chip test object association table.

[0039] Record any content that fails the verification as a lockout exception, and save the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, wafer ring sector page block index, and lockout exception to obtain the test information lockout table.

[0040] In a preferred embodiment of the semiconductor chip test information management method of the present invention, the step of forming a latch-up drive differential record specifically includes:

[0041] Read records including lockout exceptions from the test information lockout table, and extract the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, and wafer ring sector block index.

[0042] Based on the test batch identifier, wafer identifier, semiconductor chip coordinates, test version number, and wafer ring sector block index, the latching exception is written to the corresponding wafer ring sector block index. Based on the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test object path code, and test version number, the latching exception is written to the corresponding concatenation relationship in the test version event chain.

[0043] Compare the wafer ring sector block index and test version event chain before and after the latch exception write, and record the changed test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, wafer ring sector block index, test version event chain and latch exception to form a latch-driven differential record.

[0044] In a preferred embodiment of the semiconductor chip test information management method of the present invention, the step of forming a test information management result package specifically includes:

[0045] Receive test information management requests and read the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object and test version number from them. Then, search for the same record in the semiconductor chip test object association table based on the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object and test version number.

[0046] When the same record is not empty, search for the change record with the lockout exception from the lockout driver differential record based on the test object path code and wafer ring fan block index in the same record.

[0047] When the same record is empty, search for the change record with the lockout exception from the lockout drive differential record based on the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object and test version number in the test information management request.

[0048] The test batch identifier, wafer identifier, semiconductor chip coordinates, test data object and test version number, identical records and changed records in the test information management request are encapsulated in a fixed field order to form a test information management result package.

[0049] In a second aspect, the present invention provides a computer device including a memory and a processor, wherein the memory stores a computer program, wherein when the computer program is executed by the processor, it implements any step of the semiconductor chip test information management method as described in the first aspect of the present invention.

[0050] Thirdly, the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein: when the computer program is executed by a processor, it implements any step of the semiconductor chip test information management method as described in the first aspect of the present invention.

[0051] The beneficial effects of this invention are as follows: by segmenting unstructured test files into standardized records, and by hashing and encoding based on parent-child hierarchical relationships to generate a globally unique test object path table, the entire lifecycle of test data objects can be traced. The radial distance and angular position of chip coordinates are calculated using the wafer center as an anchor point to identify the corresponding ring zone and sector, forming a wafer ring-sector-page block index. This enables rapid location and anomaly cluster analysis at the wafer region level. Records of the same wafer, the same coordinates, and the same test data object under different versions are chained together to form a test version event chain, enabling step-by-step tracing of cross-version differences. Combined with multi-dimensional locking verification and anomaly feedback differential mechanisms, normal data and anomaly differential information are returned simultaneously in a single request. This forms a management closed loop in three dimensions: hierarchical path identification, spatial region location, and version difference tracing, improving the management efficiency and accuracy of semiconductor chip test information. Attached Figure Description

[0052] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0053] Figure 1 A flowchart for a method of managing semiconductor chip test information.

[0054] Figure 2 A flowchart for generating a latch-driven differential record.

[0055] Figure 3 A flowchart for obtaining the wafer ring sector block index.

[0056] Figure 4 A flowchart for obtaining the association table of semiconductor chip test objects. Detailed Implementation

[0057] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0058] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0059] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0060] Reference Figures 1-4 As one embodiment of the present invention, this embodiment provides a method for managing semiconductor chip test information, including the following steps:

[0061] S1: Collect the test file entry record of the semiconductor chip, perform segmentation processing, obtain the test file segmentation table, parse the test data objects in the test file segmentation table, and form a test object specification record table.

[0062] S1.1: It should be noted that after completing the semiconductor chip test, the semiconductor chip testing equipment outputs a semiconductor chip test file and writes it to a preset test file receiving directory. It reads the file list in the preset test file receiving directory at preset scan intervals (e.g., 5 seconds), identifies newly added semiconductor chip test files, and reads the newly added semiconductor chip test files in byte stream order after two consecutive reads of the file length remains consistent. Starting from the beginning byte position of the newly added semiconductor chip test file, it reads sequentially, identifying the test batch identifier, wafer identifier, and test version number, and records the end position of the test version number. From the end position of the test version number, it continues to read the newly added semiconductor chip test files in byte stream order, identifying the first occurrence of the relevant byte. The first test data object is identified by a structured record unit that independently corresponds to at least one of the following: test batch identifier, wafer identifier, semiconductor chip coordinates, and test version number. The starting position of the first test data object is used as the starting position of the main text area. The content from the starting byte position of the newly added semiconductor chip test file to the starting position of the main text area is used as the header area, and the content from the starting position of the main text area to the ending position of the newly added semiconductor chip test file is used as the main text area, thereby determining the boundary position between the header area and the main text area. The content within the main text area is extracted as the test file main text. The test batch identifier, wafer identifier, and test version number are read from the header area. The test file main text, test batch identifier, wafer identifier, and test version number are associated and recorded to form the test file entry record of the semiconductor chip.

[0063] S1.2: It should be noted that the test file text, test batch identifier, wafer identifier, and test version number are read from the test file entry record. The structured record unit in the test file text that can independently correspond to at least one of the following: test batch identifier, wafer identifier, semiconductor chip coordinates, and test version number, is determined as the test data object. For example, if the test file text contains "Wafer Identifier W01," under "Wafer Identifier W01" there is "Semiconductor Chip Coordinates X10Y08," and under "Semiconductor Chip Coordinates X10Y08" there is the corresponding "Test Result Content," then "Wafer Identifier W01," "Semiconductor Chip Coordinates X10Y08," and "Test Result Content" can each be used as a test data object.

[0064] Read the test file body in byte order and record the start and end positions of each test data object in the test file body. Select test data objects one by one from the beginning position as the current test data object. Other test data objects whose start position is earlier than the start position of the current test data object and whose end position is later than the end position of the current test data object are selected as candidate parent test data objects. When there is only one candidate parent test data object, it is selected as the parent test data object of the current test data object. When there are multiple candidate parent test data objects, the candidate parent test data object with the largest start position and the smallest end position is selected as the parent test data object of the current test data object. Record the containment relationship between the current test data object and the parent test data object as a parent-child hierarchy relationship. Extract a segment of the test file body corresponding to each test data object from the beginning position and write each segment of the test file body, start position, end position, parent-child hierarchy relationship, test batch identifier, wafer identifier, and test version number into the same record to obtain the test file segment table.

[0065] S1.3: It should be noted that, based on the parent-child hierarchy recorded in the test file segmentation table, the hierarchy depth of the test data object in the parent-child hierarchy is calculated. For example, the parent object identifier of "Wafer Identifier W01" is empty, and the object level is the first level; the parent object identifier of "Semiconductor Chip Coordinates X10Y08" corresponds to "Wafer Identifier W01", and the object level is the second level; the parent object identifier of "Test Result Content" corresponds to "Semiconductor Chip Coordinates X10Y08", and the object level is the third level. The hierarchy depth is recorded as the object hierarchy; a segment of test file text corresponding to the test data object in the test file segmentation table is read. When the test data object itself contains a wafer identifier, the value of the wafer identifier is recorded as the object identifier; when the test data object itself contains semiconductor chip coordinates, the value of the semiconductor chip coordinates is recorded as the object identifier; when the test data object itself is test result content, the test result content from the start position to the end position is recorded as the object identifier; the parent test data object corresponding to the test data object is read according to the parent-child hierarchy relationship, and the object identifier of the parent test data object is recorded as the parent object identifier; the test data objects are arranged from front to back according to the start position of the test data objects under the same parent object identifier, and the arrangement number is recorded as the object order; the start position and end position corresponding to the test data object in the test file segmentation table are recorded as the source segment position, thereby extracting the object hierarchy, object identifier, parent object identifier, object order, and source segment position corresponding to the test data object.

[0066] Arrange the object hierarchy, object identifier, parent object identifier, object order, source segment position, test batch identifier, wafer identifier, and test version number in a unified record format to form a test object specification record table.

[0067] S2: Obtain the test object path table by encoding the test object specification record table according to the parent-child hierarchical relationship.

[0068] S2.1: It should be noted that the following steps are performed: Read the object level, object identifier, parent object identifier, object order, source segment position, test batch identifier, wafer identifier, and test version number from the test object specification record table; designate the test data object with an empty parent object identifier as the first-level test data object; read the test batch identifier, wafer identifier, test version number, object level, object identifier, object order, and source segment position from the record containing the first-level test data object in the test object specification record table; convert the test batch identifier, wafer identifier, test version number, object level, object identifier, object order, and source segment position into a unified character encoding format, and add a preset field separator between adjacent fields to form a standardized encoding string corresponding to the first-level test data object; perform a SHA-256 hash operation on the standardized encoding string to obtain the SHA-256 hash operation result corresponding to the first-level test data object; convert the SHA-256 hash operation result into a fixed-length hexadecimal string, and use the fixed-length hexadecimal string as the test object path code of the first-level test data object; write the test object path code of the first-level test data object into the test object specification record table.

[0069] S2.2: It should be noted that test data objects with non-empty parent object identifiers are filtered from the test object specification record table; test data objects with non-empty parent object identifiers are arranged in ascending order of object hierarchy and object order; for each arranged test data object with non-empty parent object identifier, the parent object identifier and source segment position are read, and in the test object specification record table where test object path codes have been written, records with the same object identifier as the parent object identifier, the same test batch identifier, the same wafer identifier, the same test version number, and the source segment position corresponding to the parent-child inclusion relationship are searched according to the parent-child hierarchy relationship; when a corresponding record is found, the test object path code corresponding to the parent object identifier is obtained; when no corresponding record is found, the next test data object with non-empty parent object identifier is read in ascending order of object hierarchy and object order, and the search is performed again for test data objects for which the test object path code corresponding to the parent object identifier has not been obtained in the next round of reading; when test data objects with non-empty parent object identifiers under the same test batch identifier, the same wafer identifier, and the same test version number... If, after all readings are completed, the test object path code corresponding to the parent object identifier is still not obtained, no test object path code is generated for the current test data object. The object hierarchy, object identifier, parent object identifier, object order, and source segment position of the current test data object in the test object specification record table are retained. When the test object path code corresponding to the parent object identifier is obtained, the object hierarchy, object identifier, object order, and source segment position of the test data object whose parent object identifier is not empty are read. The test object path code, object hierarchy, object identifier, object order, and source segment position corresponding to the parent object identifier are arranged according to a fixed field order, converted to a unified character encoding format, and a preset field separator is added between adjacent fields to form a standardized encoding string. A SHA-256 hash operation is performed on the standardized encoding string, and the SHA-256 hash operation result is converted to a fixed-length hexadecimal string to obtain the test object path code of the test data object whose parent object identifier is not empty. The test object path code of the test data object whose parent object identifier is not empty is written into the test object specification record table to obtain the test object path table.

[0070] S3: Using the center of the semiconductor chip wafer as the anchor point, calculate the ring zone and sector to which the semiconductor chip coordinates belong, obtain the wafer ring sector page block index, and bind it with the test object path table to obtain the semiconductor chip test object association table.

[0071] S3.1: It should be noted that the test batch identifier, wafer identifier, test version number, test data object, test object path code, and source segment position are read from the test object path table, and the corresponding semiconductor chip coordinates are extracted from the test file text according to the source segment position; all semiconductor chip coordinates are aggregated according to the test batch identifier, wafer identifier, and test version number, and the minimum horizontal coordinate, maximum horizontal coordinate, minimum vertical coordinate, and maximum vertical coordinate of all semiconductor chip coordinates under the same test batch identifier, the same wafer identifier, and the same test version number are read respectively. The midpoint between the minimum horizontal coordinate and the maximum horizontal coordinate is taken as the horizontal coordinate of the semiconductor chip wafer center, and the midpoint between the minimum vertical coordinate and the maximum vertical coordinate is taken as the vertical coordinate of the semiconductor chip wafer center. The semiconductor chip wafer center under the same test batch identifier, the same wafer identifier, and the same test version number is obtained by combining the horizontal coordinate and the vertical coordinate of the semiconductor chip wafer center.

[0072] S3.2: It should be noted that the horizontal and vertical coordinates in the semiconductor chip coordinate system are read, and the center horizontal and vertical coordinates in the semiconductor chip wafer center are read; the difference between the horizontal coordinate and the center horizontal coordinate is calculated to obtain the horizontal offset, and the difference between the vertical coordinate and the center vertical coordinate is calculated to obtain the vertical offset; the square root of the sum of the squares of the horizontal and vertical offsets is calculated to obtain the radial distance; the arctangent angle value is calculated based on the vertical and horizontal offsets, and the arctangent angle value is converted to the range of 0 degrees to 360 degrees to obtain the angular position.

[0073] S3.3: It should be noted that the radial distance and angular position corresponding to the coordinates of all semiconductor chips under the same test batch identifier, the same wafer identifier, and the same test version number are read, and all semiconductor chip coordinates are arranged in ascending order of radial distance; when multiple semiconductor chip coordinates correspond to the same radial distance, the semiconductor chip coordinates with the same radial distance are arranged in ascending order of angular position to obtain the radial arrangement result of semiconductor chip coordinates; the total number of semiconductor chip coordinates in the radial arrangement result is counted, and the preset number of rings (e.g., 5) is read. The total number of semiconductor chip coordinates is divided by the preset number of rings to obtain the quotient and remainder; the semiconductor chip coordinates are divided from front to back according to the radial arrangement result, and the first few rings are assigned semiconductor chip coordinates with the quotient plus one, and the remaining rings are assigned semiconductor chip coordinates with the quotient; when the preset number of rings is greater than the total number of semiconductor chip coordinates, the first few semiconductor chip coordinates are divided into the remaining rings. Each of the total number of chip coordinates is assigned a semiconductor chip coordinate to one of the rings. Rings without assigned semiconductor chip coordinates do not participate in the calculation of the ring to which the current semiconductor chip coordinate belongs, thus maintaining a balance in the number of semiconductor chip coordinates corresponding to each participating ring. The ring to which the semiconductor chip coordinate belongs is calculated according to its position in the radial arrangement of the semiconductor chip coordinates. The zero-degree to 360-degree range is divided into multiple angular position ranges according to a preset number of sectors. For example, when the preset number of sectors is eight, each 45-degree range corresponds to one sector. When the angular position falls within the range of zero to 45 degrees, the sector to which the semiconductor chip coordinate belongs is calculated as the first sector; when the angular position falls within the range of 45 to 90 degrees, the sector to which the semiconductor chip coordinate belongs is calculated as the second sector, and so on. The rings obtained from the balanced division of the number of semiconductor chip coordinates and the sectors corresponding to the angular positions are combined as the ring and sector to which the semiconductor chip coordinate belongs.

[0074] S3.4: It should be noted that the test batch identifier, wafer identifier, test version number, ring band, and sector corresponding to the same semiconductor chip coordinates are read; the test batch identifier, wafer identifier, test version number, ring band, and sector are converted into a unified character encoding format, and a preset field separator is added between adjacent fields to form a normalized index string corresponding to the wafer ring sector block index; SHA-256 hash operation is performed on the normalized index string, the SHA-256 hash operation result is converted into a fixed-length hexadecimal string, and the fixed-length hexadecimal string is used as the wafer ring sector block index; the test object path code, test data object, and semiconductor chip coordinates in the test object path table are bound to the corresponding wafer ring sector block index and recorded to obtain the semiconductor chip test object association table.

[0075] S4: Connect the semiconductor chip test object association table by version to obtain the test version event chain.

[0076] S4.1: It should be noted that the test batch identifier, wafer identifier, test version number, test data object, test object path code, semiconductor chip coordinates, and wafer ring sector page index are read from each record in the semiconductor chip test object association table. Records with the same test batch identifier, wafer identifier, semiconductor chip coordinates, and test data object are grouped into the same version record group, using these criteria. The test version number must include at least one continuous number segment consisting of 0 to 9, separated by non-numeric characters, which serve only as separators. Within each version record group, each continuous number segment is extracted sequentially from left to right in the test version number. Leading zeros on the left side of each continuous number segment are removed, and the empty continuous number segment after removing leading zeros is recorded as the value 0. The remaining continuous number segments are converted to decimal integers and arranged into a version comparison value sequence according to the extraction order. When comparing two test version numbers, the comparison starts from the first item in the comparison sequence and proceeds item by item. The test version number corresponding to the smaller value of the first unequal comparison value is listed first. If all compared items are equal but the number of items in the two comparison sequences is different, zeros are added to the end of the comparison sequence with fewer items before continuing the comparison. If the two comparison sequences are still identical after adding zeros, the English letters in the two test version numbers are converted to uppercase, and the comparison is performed from front to back according to the byte sequence after UTF-8 character encoding. The test version number corresponding to the smaller value of the first different byte is listed first. If one UTF-8 character encoded byte sequence is a prefix of the other and the lengths of the two UTF-8 character encoded byte sequences are different, the test version number corresponding to the shorter UTF-8 character encoded byte sequence is listed first. If the lengths and corresponding byte values ​​of the two UTF-8 character encoded byte sequences are the same, the test version numbers are arranged according to the original record order in the semiconductor chip test object association table. Arrange the records within the version record group in ascending order according to the comparison results, so that the records corresponding to different test version numbers under the same test batch identifier, the same wafer identifier, the same semiconductor chip coordinates, and the same test data object form an ordered version sequence.

[0077] Read all records under the same test batch identifier, same wafer identifier, same semiconductor chip coordinates, and same test data object according to the test version number in ascending order. Mark the record in the first position as the starting record and retain the test version number, test object path code, and wafer ring sector page index in the starting record. Starting from the record in the second position, read the record corresponding to the current test version number one by one, and read the record corresponding to the previous test version number in the previous position of the record corresponding to the current test version number. Use the test version number in the record corresponding to the previous test version number as the previous test version number, and use the test version number in the record corresponding to the current test version number as the current test version number. Write the test object path code and wafer ring sector page index in the record corresponding to the current test version number, along with the previous test version number and the current test version number, into the same concatenation relationship. Repeat the concatenation relationship according to the test version number in ascending order until all subsequent test version number records under the same test batch identifier, same wafer identifier, same semiconductor chip coordinates, and same test data object are concatenated.

[0078] Once all test version numbers under the same test batch identifier, wafer identifier, semiconductor chip coordinates, and test data object have been concatenated, the starting record and concatenation relationships corresponding to the same test batch identifier, wafer identifier, semiconductor chip coordinates, and test data object are read. The starting record, previous test version number, current test version number, test object path code, and wafer ring fan page block index are arranged into continuous event records according to the test version number from first to last. These continuous event records are then saved corresponding to the same test batch identifier, wafer identifier, semiconductor chip coordinates, and test data object, allowing changes to the same test batch identifier, wafer identifier, semiconductor chip coordinates, and test data object under different test version numbers to be traced step-by-step from the previous test version number to the current test version number, thereby obtaining the test version event chain.

[0079] S5: Perform lockout verification on the semiconductor chip test object association table and test version event chain to obtain the test information lockout table.

[0080] It should be noted that the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test object path code, wafer ring fan block index, and test version number are read from the semiconductor chip test object association table. The previous test version number, current test version number, test object path code, and wafer ring fan block index under the same test batch identifier, same wafer identifier, same semiconductor chip coordinates, and same test data object are read from the test version event chain.

[0081] The test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, and test version number are read from the semiconductor chip test object association table and the test version event chain, respectively. The read fields are combined and deduplicated to form the latch verification range. For each latch verification range, records with the same test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, and test version number are filtered from the semiconductor chip test object association table, and the number of filtered records is counted. If the number of records is one, the unique record verification is considered successful. If the number of records is zero, no actual record is automatically generated or modified in the semiconductor chip test object association table. The test object path code and wafer ring fan page block index are read from the starting record or corresponding concatenation relationship in the test version event chain. The test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, wafer ring fan page block index, and latch exceptions with the value "unique record missing" are saved as latch records, and the unique record verification is considered unsuccessful. When the number of records is greater than one, no record is automatically selected, overwritten, or deleted. All filtered records are retained. The test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, wafer ring sector page block index, and any latching exceptions with a value of "unique record conflict" are saved as latching records for each record. The unique record verification is deemed to have failed. Records with "unique record conflicts" are not included in subsequent searches for identical records during the period when unique record verification fails. When unique record verification fails, for the current latching verification range, wafer ring sector page block index verification, continuous concatenation relationship verification, and association consistency verification based on unique records in the semiconductor chip test object association table are no longer performed.When the unique record verification passes, the semiconductor chip wafer center is recalculated based on the coordinates of all semiconductor chips under the same test batch identifier, wafer identifier, and test version number. The radial distance and angular position corresponding to the semiconductor chip coordinates are also recalculated based on the wafer center. The corresponding ring and sector are recalculated according to the calculation rules for rings and sectors. The test batch identifier, wafer identifier, test version number, recalculated ring, and recalculated sector are converted to a unified character encoding format, and a preset field separator is added between adjacent fields to form a recalculated normalized index string. A SHA-256 hash operation is performed on the recalculated normalized index string, and the SHA-256 hash result is converted to a fixed-length hexadecimal string to obtain the recalculated wafer ring-sector-page block index. If the recalculated wafer ring-sector-page block index matches the wafer ring-sector-page block index in the semiconductor chip test object association table, the wafer ring-sector-page block index verification is considered successful. If the recalculated wafer ring-sector-page block index does not match the wafer ring-sector-page block index in the semiconductor chip test object association table, the verification is considered successful. When the wafer fan-page block index verification fails, it is determined that the wafer fan-page block index verification fails and is recorded as a latching exception; the concatenation relationship between the previous test version number and the current test version number in the test version event chain is read. If the concatenation relationship exists, the continuous concatenation relationship verification is determined to pass; if the concatenation relationship does not exist, the continuous concatenation relationship verification fails and is recorded as a latching exception; the test object path code and wafer fan-page block index in the test version event chain are respectively compared with the test object path code in the semiconductor chip test object association table. The test object path code and the wafer fan-page block index are compared. If both are consistent, the consistency check is considered successful. If either the path code or the fan-page block index is inconsistent, the consistency check is considered unsuccessful and recorded as a locking anomaly. The test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, wafer fan-page block index, and locking anomaly are recorded and saved in a fixed field order to obtain locking records. All locking records together form the test information locking table.

[0082] S6: Backflush the latching exceptions in the test information latching table to the corresponding wafer ring fan page block index and test version event chain to form latching-driven differential records.

[0083] S6.1: It should be noted that the lockout record, including the lockout exception, is read from the test information lockout table, and the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, wafer ring sector block index, and lockout exception are extracted. When the lockout exception is not a "unique record missing" error, before writing the lockout exception, the record content corresponding to the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, and wafer ring sector block index in the semiconductor chip test object association table is read; when the lockout exception is a "unique record missing" error, since there is no corresponding record in the semiconductor chip test object association table, the record content before writing the lockout exception is recorded as empty. Based on the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, and test object path code, the corresponding starting record or concatenation relationship content is read from the test version event chain. When the test version number is the same as the test version number in the starting record, the test version number, test object path code, and wafer ring fan block index in the starting record are read, and the previous test version number is recorded as empty. When the test version number is the same as the current test version number in the concatenation relationship, the previous test version number, current test version number, test object path code, and wafer ring fan block index in the concatenation relationship are read.

[0084] S6.2: It should be noted that when the latching exception is not a "unique record missing" error, the corresponding record is searched in the semiconductor chip test object association table based on the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, and wafer ring fan page block index, and the latching exception is written to the corresponding record. When the latching exception is a "unique record missing" error, no non-existent corresponding record is searched in the semiconductor chip test object association table. Instead, the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, and latching exception are saved in correspondence with the wafer ring fan page block index read from the test version event chain, forming the latching exception content corresponding to the wafer ring fan page block index. The latching exception content corresponding to the wafer ring fan page block index is not used as an actual record in the semiconductor chip test object association table. When the test version number is the same as the test version number of the starting record in the test version event chain, the latch exception is written to the corresponding starting record; when the test version number is the same as the current test version number of the concatenated relationship in the test version event chain, the latch exception is written to the corresponding concatenated relationship, so that the latch exception is associated with both the wafer ring fan block index and the test version event chain.

[0085] S6.3: It should be noted that after a latch exception is written, if the latch exception is not "unique record missing", the records corresponding to the same test batch identifier, same wafer identifier, same semiconductor chip coordinates, same test data object, same test version number, same test object path code, and same wafer ring fan block index in the semiconductor chip test object association table are reread; if the latch exception is "unique record missing", the latch exception content saved corresponding to the wafer ring fan block index is used as the record content after the latch exception is written. The starting record or concatenation relationship content corresponding to the same test batch identifier, same wafer identifier, same semiconductor chip coordinates, same test data object, same test version number, and same test object path code in the test version event chain is reread. The records before and after writing the latching exception are arranged in the following order: test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, wafer ring fan block index, and the fixed field of the latching exception. The starting records or concatenation relationships before and after writing the latching exception are arranged in the following order: test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, previous test version number, current test version number, test object path code, wafer ring fan block index, and the fixed field of the latching exception. The previous test version number corresponding to the starting record is arranged as a null value. For field values ​​with the same name before and after writing, they are converted to UTF-8 character encoding format. The length of the byte sequence corresponding to the field value is compared first. If the byte sequence lengths are the same, they are compared byte by byte in byte order. If the byte sequence lengths are different or any corresponding byte value is different, the corresponding field is considered to have changed. If the byte sequence length and all corresponding byte values ​​are the same, the corresponding field is considered unchanged. If the corresponding field value did not exist before the latching exception was written, the corresponding field value is treated as a null value. The item-by-item comparison is a direct comparison of each field in the aforementioned fixed field order, without hash comparison of the entire record content, the starting record, or the concatenation relationship content. When at least one field in the record content, the starting record, or the concatenation relationship content changes, the changed test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, wafer ring fan page block index, test version event chain, and latching exception are recorded to form a latch-driven differential record.

[0086] S7: After receiving the test information management request, search for the same record in the semiconductor chip test object association table and the changed record in the latch drive differential record. Encapsulate the test information management request, the same record and the changed record to form a test information management result package.

[0087] S7.1: It should be noted that the system receives test information management requests from administrators and reads the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, and test version number specified in the request. Following the record order in the semiconductor chip test object association table, the system reads the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, and test version number one by one, and compares them with the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, and test version number in the test information management request. When the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, and test version number are consistent, and the test information lock table does not record any "unique record missing" or "unique record conflict" corresponding to the currently read record, the system determines the currently read record in the semiconductor chip test object association table as the same record, and reads the test object path code and wafer ring sector block index from this same record. If any of the fields in the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, and test version number are inconsistent, or if the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, and test version number are all consistent but the test information lockout table contains a "unique record missing" or "unique record conflict" corresponding to the currently read record, the currently read record in the semiconductor chip test object association table will not be determined as a matching record, and the next record in the semiconductor chip test object association table will continue to be read. When all records in the semiconductor chip test object association table have been read and no matching record has been formed, the matching record will be empty as the search result.

[0088] S7.2: It should be noted that when the same record is not empty, the test object path code and wafer ring fan block index in the same record are used as differential search conditions. The test object path code, wafer ring fan block index and lockout exception are read one by one according to the record arrangement order of the latch-driven differential record. The test object path code and wafer ring fan block index in the latch-driven differential record are compared with the test object path code and wafer ring fan block index in the differential search conditions. When the test object path code is consistent, the wafer ring fan block index is consistent and the lockout exception is not empty, the currently read record in the latch-driven differential record is determined as a changed record. When any of the following situations exists: inconsistent test object path code, inconsistent wafer ring fan block index, or empty lockout exception, the currently read record in the latch-driven differential record is not determined as a changed record, and the next record in the latch-driven differential record is read.

[0089] When a record is empty, the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, and latch exception are read one by one according to the record arrangement order of the latch-driven differential record. The test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, and test version number in the latch-driven differential record are compared with the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, and test version number in the test information management request. When the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, and test version number are consistent, and the latch exception is not empty, the currently read record in the latch-driven differential record is identified as a changed record. When any field of the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, or test version number is inconsistent, or the latch exception is empty, the currently read record in the latch-driven differential record is not identified as a changed record, and the next record in the latch-driven differential record is read. When all records in the latching drive differential record have been read and no change record has been formed, the change record is left empty as the differential search result.

[0090] S7.3: It should be noted that the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, and test version number are read from the test information management request, and identical records and change records are read; when identical records are empty, identical records are written into the identical record field in a fixed field order; when change records are empty, change records are written into the change record field in a fixed field order; the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, identical records, and change records are arranged in a fixed field order, and the arranged test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, identical records, and change records are encapsulated into a test information management result package. When the lockout exception in the change record is "unique record missing" or "unique record conflict," the test information management result package is returned to the administrator who sent the test information management request. When the lockout exception is "unique record missing," the administrator locates the corresponding semiconductor chip test file based on the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, and test version number in the test information management result package, and supplements the missing record. When the lockout exception is "unique record conflict," the administrator locates the corresponding semiconductor chip test file based on the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, and test version number in the test information management result package, verifies the source of the conflicting record, retains the verified record, and removes or corrects the remaining duplicate records. The corrected semiconductor chip test file is rewritten to the preset test file receiving directory, and S1 to S5 are re-executed as the new semiconductor chip test file. When the number of records within the corresponding lockout verification range obtained by re-executing S5 is one, the unique record verification is deemed successful, and S6 is executed again. S7 is then executed using the same test information management request to form an updated test information management result package. When the number of records within the corresponding lockout verification range is still zero or greater than one, S6 is executed again, and S7 is then executed using the same test information management request to form an updated test information management result package including the corresponding lockout exception. The updated test information management result package is then returned to the administrator, and the above verification, correction, and re-verification process is repeated until the number of records within the corresponding lockout verification range is one.

[0091] This embodiment also provides a computer device applicable to a method for managing semiconductor chip test information, comprising: a memory and a processor; the memory is used to store computer-executable instructions, and the processor is used to execute the computer-executable instructions to implement the semiconductor chip test information management method proposed in the above embodiment.

[0092] The computer device can be a terminal, comprising a processor, memory, communication interface, display screen, and input devices connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, carrier networks, NFC (Near Field Communication), or other technologies. The display screen can be an LCD screen or an e-ink screen. The input devices can be a touch layer covering the display screen, buttons, a trackball, or a touchpad on the computer device's casing, or an external keyboard, touchpad, or mouse.

[0093] This embodiment also provides a storage medium storing a computer program, which, when executed by a processor, implements the semiconductor chip test information management method proposed in the above embodiments. The storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Erasable Programmable Read Only Memory (EPROM), Programmable Red-Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0094] In summary, this invention achieves full lifecycle traceability of test data objects by: reorganizing unstructured test files into standardized records through segmented processing; generating a globally unique test object path table based on parent-child hierarchical relationships using hash encoding; calculating the radial distance and angular position of chip coordinates using the wafer center as an anchor point to identify the corresponding ring and sector, forming a wafer ring-sector-page block index; enabling rapid location and anomaly cluster analysis at the wafer region level; chaining records of the same wafer, the same coordinates, and the same test data object across different versions into a test version event chain; achieving step-by-step tracing of cross-version differences; and combining multi-dimensional locking verification and anomaly backfeed differential mechanisms to simultaneously return normal data and anomaly differential information in a single request. This forms a management closed loop across three dimensions: hierarchical path identification, spatial region location, and version difference tracing, thereby improving the management efficiency and accuracy of semiconductor chip test information.

[0095] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A method for managing semiconductor chip test information, characterized in that: include, Collect the test file entry records of semiconductor chips, segment them, obtain the test file segment table, parse the test data objects in the test file segment table, and form a test object specification record table. According to the parent-child hierarchical relationship coding test object specification record table, obtain the test object path table; Using the center of the semiconductor chip wafer as the anchor point, calculate the ring zone and sector to which the semiconductor chip coordinates belong, obtain the wafer ring sector page block index, and bind it with the test object path table to obtain the semiconductor chip test object association table; Connect the semiconductor chip test object association table by version to obtain the test version event chain; Perform lockout verification on the semiconductor chip test object association table and test version event chain to obtain the test information lockout table; The locking exceptions in the test information locking table are fed back to the corresponding wafer ring fan page block index and test version event chain to form a locking-driven differential record. Upon receiving a test information management request, the system searches for identical records in the semiconductor chip test object association table and for changed records in the latch-up drive differential records. The test information management request, identical records, and changed records are then encapsulated to form a test information management result package.

2. The method for managing semiconductor chip test information as described in claim 1, characterized in that: The formation of the test object specification record table is specifically as follows: The test file entry record includes the test file text, test batch identifier, wafer identifier, and test version number; The test file is segmented according to the start and end positions and parent-child hierarchical relationship of the test data objects in the test file body. Each segment of the test file body is recorded with the test batch identifier, wafer identifier and test version number to obtain the test file segmentation table. Identify test data objects within the test file segmentation table, and extract the corresponding object hierarchy, object identifier, parent object identifier, object order, and source segment position of the test data objects; Arrange the object hierarchy, object identifier, parent object identifier, object order, source segment position, test batch identifier, wafer identifier, and test version number in a unified record format to form a test object specification record table.

3. The method for managing semiconductor chip test information as described in claim 2, characterized in that: The specific steps for obtaining the test object path table are as follows: Read the object hierarchy, object identifier, parent object identifier, object order, source segment position, test batch identifier, wafer identifier, and test version number from the test object specification record table; The test data object with an empty parent object is used as the first-level test data object. The test batch identifier, wafer identifier, test version number, object level, object identifier, object order and source segment position are concatenated and encoded to obtain the test object path code of the first-level test data object. The test object path code of the first-level test data object is written into the test object specification record table. Read test data objects whose parent object identifier is not empty from top to bottom according to the object hierarchy. Find the test object path code corresponding to the parent object identifier from the test object specification record table that has written the test object path code. Then, concatenate the test object path code corresponding to the parent object identifier, the object hierarchy, the object identifier, the object order and the source segment position order and encode it to obtain the test object path code of the test data object whose parent object identifier is not empty. Write the test object path code of the test data object whose parent object identifier is not empty into the test object specification record table, and obtain the test object path table.

4. The method for managing semiconductor chip test information as described in claim 3, characterized in that: The process of obtaining the semiconductor chip test object association table is as follows: Read the test batch identifier, wafer identifier, test version number, test data object, test object path code and source segment position from the test object path table, and extract the corresponding semiconductor chip coordinates from the test file body according to the source segment position. Calculate the semiconductor chip wafer center according to the horizontal and vertical boundaries of all semiconductor chip coordinates under the same test batch identifier, the same wafer identifier and the same test version number. Calculate the radial distance and angular position of each semiconductor chip coordinate relative to the center of the semiconductor chip wafer, arrange the semiconductor chip coordinates according to the radial distance, and divide the arranged semiconductor chip coordinates into equal numbers according to the preset number of rings, calculate the ring to which the semiconductor chip coordinate belongs, and calculate the sector to which the semiconductor chip coordinate belongs according to the angular position. The test batch identifier, wafer identifier, test version number, ring band and sector are concatenated in sequence and then subjected to SHA-256 hash operation to form the wafer ring sector block index. Bind the test object path code, test data object, and semiconductor chip coordinates in the test object path table to the corresponding wafer ring fan page block index to obtain the semiconductor chip test object association table.

5. The method for managing semiconductor chip test information as described in claim 4, characterized in that: The event chain for obtaining the test version is as follows: Read the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test object path code, wafer ring fan block index and test version number from the semiconductor chip test object association table. Merge the records in the semiconductor chip test object association table according to the same test batch identifier, same wafer identifier, same semiconductor chip coordinates and same test data object, and arrange the merged records in order of test version number from first to last. Take the first test version number corresponding to the sorted record as the starting record, establish a concatenation relationship between each subsequent test version number corresponding record and the previous test version number corresponding record, and write the previous test version number, the current test version number, the test object path code and the wafer ring fan page block index into the same concatenation relationship; Once all test version numbers under the same test batch identifier, same wafer identifier, same semiconductor chip coordinates, and same test data object have been concatenated, obtain the test version event chain.

6. The method for managing semiconductor chip test information as described in claim 5, characterized in that: The lock table for obtaining test information is specifically as follows: Read the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test object path code, wafer ring fan block index and test version number from the semiconductor chip test object association table, and read the previous test version number, current test version number, test object path code and wafer ring fan block index from the test version event chain for the same test batch identifier, same wafer identifier, same semiconductor chip coordinates and same test data object; Using the same test batch identifier, same wafer identifier, same semiconductor chip coordinates, same test data object, and same test version number as the locking verification range, check whether there is a unique record in the semiconductor chip test object association table; Recalculate the ring and sector to which the semiconductor chip coordinates belong according to the generation rules of the wafer ring and sector index, and regenerate the wafer ring and sector index. Check whether the regenerated wafer ring and sector index is consistent with the wafer ring and sector index in the semiconductor chip test object association table. Check whether there is a continuous connection between the previous test version number and the current test version number in the test version event chain, and check whether the test object path code and wafer ring fan block index in the test version event chain are consistent with the test object path code and wafer ring fan block index in the semiconductor chip test object association table. Record any content that fails the verification as a lockout exception, and save the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, wafer ring sector page block index, and lockout exception to obtain the test information lockout table.

7. The method for managing semiconductor chip test information as described in claim 6, characterized in that: The formation of the locking drive differential record specifically involves: Read records including lockout exceptions from the test information lockout table, and extract the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, and wafer ring sector block index. Based on the test batch identifier, wafer identifier, semiconductor chip coordinates, test version number, and wafer ring sector block index, the latching exception is written to the corresponding wafer ring sector block index. Based on the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test object path code, and test version number, the latching exception is written to the corresponding concatenation relationship in the test version event chain. Compare the wafer ring sector block index and test version event chain before and after the latch exception write, and record the changed test batch identifier, wafer identifier, semiconductor chip coordinates, test data object, test version number, test object path code, wafer ring sector block index, test version event chain and latch exception to form a latch-driven differential record.

8. The method for managing semiconductor chip test information as described in claim 7, characterized in that: The formation of the test information management result package specifically includes: Receive test information management requests and read the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object and test version number from them. Then, search for the same record in the semiconductor chip test object association table based on the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object and test version number. When the same record is not empty, search for the change record with the lockout exception from the lockout driver differential record based on the test object path code and wafer ring fan block index in the same record. When the same record is empty, search for the change record with the lockout exception from the lockout drive differential record based on the test batch identifier, wafer identifier, semiconductor chip coordinates, test data object and test version number in the test information management request. The test batch identifier, wafer identifier, semiconductor chip coordinates, test data object and test version number, identical records and changed records in the test information management request are encapsulated in a fixed field order to form a test information management result package.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that: When the processor executes the computer program, it implements the steps of the semiconductor chip test information management method according to any one of claims 1 to 8.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by the processor, it implements the steps of the semiconductor chip test information management method according to any one of claims 1 to 8.

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