Insulation configuration method and device for same-tower multi-circuit overhead transmission line and electronic equipment

Abstract

The application provides an insulation configuration method and device for a same-tower multi-circuit overhead transmission line and an electronic device, and relates to the technical field of overhead transmission line insulation design. The method comprises the following steps: obtaining multi-dimensional parameters of each circuit in the same-tower multi-circuit overhead transmission line, wherein the multi-dimensional parameters comprise the voltage grade, phase sequence arrangement, tower head position and contamination level of each circuit; based on the multi-dimensional parameters, evaluating the basic withstand requirement of each circuit for insulators; according to the tower head position of each circuit, differentiating and correcting the basic withstand requirement; and according to the corrected withstand requirement, determining a differentiated insulation configuration scheme for each circuit, wherein the differentiated insulation configuration scheme comprises at least one of the number of insulators, the type of insulators and the creepage distance, so that the number of insulators, the type of insulators and the creepage distance are configured on demand, the risk of lightning stroke and same trip is effectively reduced, and the stability and safety of long-term operation of the line are improved.

Description

Technical Field

[0001] This application relates to the field of insulation design technology for overhead transmission lines, and in particular to an insulation configuration method, device and electronic equipment for multi-circuit overhead transmission lines on the same tower. Background Technology

[0002] With the rapid development of power systems and the increasing scarcity of land resources, multi-circuit overhead transmission lines on the same tower have been widely used in power transmission networks due to their ability to effectively save corridor space, reduce land occupation, and lower construction costs. In multi-circuit transmission lines on the same tower, insulation configuration is a crucial factor in ensuring the safe and stable operation of the line, directly affecting its lightning withstand level, anti-pollution flashover capability, and overall power supply reliability. However, the circuits on a multi-circuit line differ in their spatial location at the tower head (top, middle, bottom), voltage levels, phase sequence arrangements, and the pollution levels and altitudes of the areas they traverse may also vary. These factors collectively lead to different lightning strike risks, electromagnetic coupling effects, and pollution impacts faced by different circuits. How to configure insulation to address the differentiated conditions of each circuit has become a pressing technical problem for the industry.

[0003] In related technologies, the insulation configuration of multi-circuit overhead transmission lines on the same tower generally adopts a "one-size-fits-all" design approach, meaning that each circuit is equipped with the same number, type, and creepage distance of insulators. In practice, designers typically determine the number of insulator discs and creepage distance based on relevant design specifications, using the line's highest voltage level and the most severe pollution level as unified design conditions, and then uniformly select and apply this to all circuits. However, while this design approach is primarily based on simplifying the design process and reducing design complexity, it also leads to a higher risk of simultaneous tripping of multiple circuits due to lightning strikes, reducing the long-term stability and safety of the line. Summary of the Invention

[0004] This application provides an insulation configuration method, device, and electronic equipment for multi-circuit overhead transmission lines on the same tower, in order to improve the problem in related technologies where the risk of simultaneous tripping of multiple lines due to lightning strikes is high, reducing the stability and safety of the line in long-term operation.

[0005] In a first aspect, this application provides an insulation configuration method for multi-circuit overhead transmission lines on the same tower, including:

[0006] Obtain multi-dimensional parameters for each circuit in a multi-circuit overhead transmission line on the same tower. These parameters include the voltage level, phase sequence, tower head location, and pollution level of the area in which each circuit is located.

[0007] Based on multidimensional parameters, the basic withstand requirements of each circuit for insulators are evaluated.

[0008] The foundation withstand requirements are modified differently based on the tower head location of each circuit;

[0009] Based on the revised withstand requirements, a differentiated insulation configuration scheme is determined for each circuit. The differentiated insulation configuration scheme includes at least one of the following: number of insulator discs, insulator type, and creepage distance.

[0010] In one possible embodiment, the tower head position includes the top, middle, and bottom layers of the tower; based on the tower head position of each circuit, the foundation withstand requirements are differentiated and modified, including: for circuits located at the top layer, increasing the number of insulator discs corresponding to the foundation withstand requirements by a first preset number; for circuits located at the bottom layer, reducing the number of insulator discs corresponding to the foundation withstand requirements by a second preset number, while meeting the minimum insulation requirements; and for circuits located at the middle layer, configuring the number of insulator discs according to the foundation withstand requirements.

[0011] In one possible embodiment, before making differentiated corrections to the basic tolerance requirements based on the tower head location of each loop, the method further includes: obtaining the altitude of the area traversed by each loop; and making high-altitude corrections to the basic tolerance requirements of each loop based on the altitude of the area traversed by each loop.

[0012] In one possible embodiment, after making differentiated corrections to the foundation withstand requirements based on the tower head position of each circuit, the method further includes: determining whether the electromagnetic coupling effect strength between adjacent circuits is greater than or equal to a preset strength threshold based on the phase sequence arrangement of each circuit; and for circuits with adjacent phase sequences and electromagnetic coupling effect strength greater than or equal to the strength threshold, adding a third preset number of insulator discs based on the current number of insulator discs.

[0013] In one possible embodiment, the basic withstand requirements of each circuit for insulators are evaluated based on multi-dimensional parameters, including: determining the withstand requirements of power frequency voltage, switching overvoltage, and lightning overvoltage for each circuit according to the voltage level of each circuit; assessing the electromagnetic coupling influence level between adjacent circuits according to the phase sequence arrangement of each circuit; assessing the lightning strike risk level of each circuit according to the tower head position of each circuit; determining the minimum creepage distance of each circuit according to the pollution level of each circuit and in accordance with preset specifications using the creepage distance ratio method; determining the number of basic insulator discs based on the minimum creepage distance and the preset creepage distance of a single insulator disc; and using the withstand requirements, electromagnetic coupling influence level, lightning strike risk level, minimum creepage distance, and number of basic discs as the basic withstand requirements.

[0014] In one possible embodiment, after determining the differentiated insulation configuration scheme for each circuit based on the modified withstand requirements, the method further includes: substituting the number of insulator discs in the differentiated insulation configuration scheme for each circuit into the lightning overvoltage withstand verification formula and the switching overvoltage withstand verification formula for withstand verification; if there is a target circuit that fails the withstand verification, the number of insulator discs in the target circuit is increased until the target circuit passes the withstand verification.

[0015] Secondly, this application provides an insulation configuration device for a multi-circuit overhead transmission line on the same tower, comprising:

[0016] The acquisition module is used to acquire multi-dimensional parameters of each circuit in a multi-circuit overhead transmission line on the same tower. The multi-dimensional parameters include the voltage level, phase sequence arrangement, tower head position, and pollution level of the area where each circuit is located.

[0017] The evaluation module is used to evaluate the basic withstand requirements of each circuit for insulators based on multi-dimensional parameters;

[0018] The differential correction module is used to make differential corrections to the foundation withstand requirements based on the tower head position of each loop.

[0019] The insulation configuration module is used to determine a differentiated insulation configuration scheme for each circuit based on the modified withstand requirements. The differentiated insulation configuration scheme includes at least one of the following: number of insulator discs, insulator type, and creepage distance.

[0020] Thirdly, this application provides an electronic device, including: a processor, and a memory communicatively connected to the processor;

[0021] Memory is used to store instructions executed by the computer;

[0022] A processor for executing computer-executable instructions stored in memory to implement any of the methods of the first aspect.

[0023] Fourthly, this application provides a computer-readable storage medium storing computer-executable instructions, which, when executed, are used to implement the method of any one of the first aspects.

[0024] Fifthly, this application provides a computer program product, including a computer program that, when executed, implements the method of any one of the first aspects.

[0025] The insulation configuration method, apparatus, and electronic equipment for multi-circuit overhead transmission lines on the same tower provided in this application include: acquiring multi-dimensional parameters of each circuit in the multi-circuit overhead transmission line on the same tower, the multi-dimensional parameters including the voltage level, phase sequence arrangement, tower head position, and pollution level of the area where each circuit is located; evaluating the basic withstand requirements of each circuit for insulators based on the multi-dimensional parameters; making differentiated corrections to the basic withstand requirements according to the tower head position of each circuit; and determining a differentiated insulation configuration scheme for each circuit based on the corrected withstand requirements, the differentiated insulation configuration scheme including at least one of the number of insulator discs, insulator type, and creepage distance.

[0026] In this process, multi-dimensional parameters such as voltage level, phase sequence, tower head position, and pollution level of each circuit are acquired, and the basic withstand requirements of each circuit are evaluated based on these parameters. Then, the basic withstand requirements are differentiated according to the tower head position of each circuit, and a differentiated insulation configuration scheme is determined for each circuit based on the corrected withstand requirements. This allows the configuration of the number of insulator discs, insulator type, and creepage distance to better meet the actual insulation requirements of each circuit. Compared with the "one-size-fits-all" configuration method in related technologies, this method fully considers the differences in lightning strike risk of different circuits at the tower head spatial position, and realizes the on-demand configuration of the number of insulator discs, insulator type, and creepage distance, thereby effectively reducing the risk of simultaneous lightning tripping and improving the long-term stability and safety of the line. It has good engineering practicality. Attached Figure Description

[0027] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0028] Figure 1 A schematic diagram illustrating an application scenario of the insulation configuration method for multi-circuit overhead transmission lines on the same tower, provided as an exemplary embodiment of this application;

[0029] Figure 2 A schematic flowchart illustrating an insulation configuration method for a multi-circuit overhead transmission line on the same tower, provided as an exemplary embodiment of this application;

[0030] Figure 3 Another schematic flowchart illustrating the insulation configuration method for a multi-circuit overhead transmission line on the same tower, provided as an exemplary embodiment of this application;

[0031] Figure 4 A schematic diagram of an insulation configuration device for a multi-circuit overhead transmission line on the same tower, provided as an exemplary embodiment of this application;

[0032] Figure 5 A schematic diagram of the structure of an electronic device provided as an exemplary embodiment of this application.

[0033] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0034] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application.

[0035] The terms “first,” “second,” etc., used in this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, products, or apparatus.

[0036] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties. Furthermore, the collection, use and processing of the relevant data must comply with relevant laws, regulations and standards, and corresponding operation entry points are provided for users to choose to authorize or refuse.

[0037] In related technologies, the "one-size-fits-all" insulation configuration approach treats multiple circuits on the same tower as a whole with similar operating conditions, using uniform parameters to meet general insulation requirements, thereby simplifying design calculations, material procurement, and construction. However, when the line is in a complex environment or there are significant differences in tower layout, the limitations of this uniform configuration approach gradually become apparent. Since different circuits on the same tower may be located at different tower heads, their exposure to lightning strikes, spatial electric field distribution, and the influence of adjacent circuits differ. If insulators of the same number, type, and creepage distance are still used, it can easily lead to insufficient insulation margins in some high-risk circuits, while some low-risk circuits have redundant configurations. Especially in areas with frequent lightning activity, the top-level circuits are more likely to withstand higher external overvoltage impacts. If their insulation configuration is not specifically enhanced, the risk of flashover or tripping increases, potentially inducing simultaneous tripping of multiple circuits. At the same time, different phase sequence arrangements change the electric field distribution and coupling state between adjacent circuits. Existing technologies generally do not incorporate this factor into circuit-level differential analysis, resulting in discrepancies between the insulation pressure experienced by local circuits in actual operation and design assumptions. Furthermore, the pollution levels of different circuits may vary depending on the area they pass through or the location they are in. If a single pollution standard is used uniformly, insufficient or excessive creepage distance matching often occurs, affecting operational reliability and increasing material and construction costs. Therefore, while related technologies can achieve basic insulation configurations for multiple circuits on the same tower, they struggle to accurately reflect the insulation requirements of each circuit in engineering scenarios with significant differences in circuits and complex environmental factors. This leads to a higher risk of simultaneous tripping of multiple circuits due to lightning strikes, reducing the long-term stability and safety of the lines.

[0038] In view of this, how to establish a configuration method that reflects the independent insulation requirements of different circuits in a multi-circuit overhead transmission line on the same tower has become an urgent technical problem to be solved. To solve the above problem, this application proposes an insulation configuration scheme for multi-circuit overhead transmission lines on the same tower, applicable to scenarios where multiple circuits on the same tower are designed and configured separately. In this technical approach, firstly, multi-dimensional parameters of each circuit are obtained, including the voltage level, phase sequence, tower head position, and pollution level of the area where each circuit is located, so that the design input of each circuit has a clear basis for differentiation; then, based on the multi-dimensional parameters, the basic withstand requirements of each circuit for insulators are evaluated, so that the insulation configuration is transformed from the traditional unified judgment of the whole tower to the analysis of each circuit separately; then, according to the tower head position of each circuit, the basic withstand requirements are differentiated and modified, so that circuits in different spatial locations reflect corresponding risk differences in insulation design; finally, based on the modified withstand requirements, a differentiated insulation configuration scheme for each circuit is determined. This solution improves the matching degree between insulation configuration and actual circuit operating conditions by separately acquiring, evaluating and modifying the parameters of each circuit in a multi-circuit line on the same tower. It also reduces the problems of insufficient insulation or redundant configuration caused by uniform design, thereby improving the stability and safety of line operation, reducing the risk of simultaneous tripping of multiple lines, and taking into account the practical needs of engineering implementation.

[0039] Figure 1 This is a schematic diagram illustrating an application scenario of the insulation configuration method for multi-circuit overhead transmission lines on the same tower, provided as an exemplary embodiment of this application. For example... Figure 1 As shown, this application scenario includes a client 11 and a server 12, wherein the number of clients 11 can be at least one. In practical applications, when the server 12 detects a request instruction submitted by the client 11 for insulation configuration of a multi-circuit overhead transmission line on the same tower, it executes the insulation configuration method for multi-circuit overhead transmission lines on the same tower provided in this application and outputs a differentiated insulation configuration scheme for each circuit.

[0040] It should be noted that server 12 can also be replaced by a server cluster or other computing devices with a certain computing power. Both the first and second clients can be mobile phones, computers, laptops, or personal digital assistants (PDAs).

[0041] The following is combined Figure 1 Application scenarios, refer to Figure 2 This application describes an insulation configuration method for multi-circuit overhead transmission lines on the same tower according to exemplary embodiments thereof. It should be noted that the above application scenarios are shown only to facilitate understanding of the spirit and principles of this application, and the embodiments of this application are not subject to change. Figure 1The limitations of the application scenarios shown are explained. It should be noted that the following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0042] Figure 2 This is a schematic flowchart illustrating an insulation configuration method for a multi-circuit overhead transmission line on the same tower, provided as an exemplary embodiment of this application. Figure 2 As shown, the insulation configuration method for this multi-circuit overhead transmission line on the same tower includes the following steps:

[0043] S201. Obtain multi-dimensional parameters of each circuit in a multi-circuit overhead transmission line on the same tower. The multi-dimensional parameters include the voltage level, phase sequence arrangement, tower head position, and pollution level of the area where each circuit is located.

[0044] In this step, multidimensional parameters are used to characterize the input information upon which insulation configuration design depends. Their function is to provide a data foundation for subsequent basic withstand capability assessment and differential correction. Specifically, voltage level characterizes the system nominal voltage of the circuit and is the basis for determining power frequency voltage withstand requirements, switching overvoltage withstand requirements, and lightning overvoltage withstand requirements; phase sequence arrangement characterizes the arrangement of conductors in each phase of the circuit, reflecting potential differences in electric field distribution and electromagnetic coupling between adjacent circuits; tower head position characterizes the spatial location of each circuit on the tower, typically categorized as top, middle, and bottom layers, providing a direct basis for subsequent position-related insulation corrections; and pollution level characterizes the degree of pollution in the area where the circuit is located, determining the design requirements for leakage paths on the insulator surface and the minimum creepage distance.

[0045] In the specific implementation process, the execution entity of this application embodiment can be the insulation configuration module in the transmission line design platform, or it can be an analysis program deployed in an engineering design terminal, server, or dedicated computing device. For multi-circuit overhead transmission lines on the same tower, a data structure indexed by tower number and circuit number is first established to register each circuit on the same tower. The voltage level can be obtained from engineering feasibility study data, preliminary design documents, construction drawing design documents, or dispatching and operation data. For engineering scenarios with mixed voltage levels on the same tower, the actual rated voltage of each circuit can be entered separately. For example, when a 220 kV circuit and a 110 kV circuit share a tower, different parameter items are formed. The phase sequence arrangement can be extracted from the tower head layout diagram, conductor hanging point diagram, and phase sequence identification data. Specifically, it can be recorded in the form of "ABC", "ACB", "BAC", etc., or the phase correspondence on the left and right crossarms and the upper and lower crossarms can be further recorded. This allows for subsequent analysis of the relative arrangement of adjacent loops; the tower head position can be identified based on the vertical distribution of loops within the tower windows, with the uppermost loop designated as the top layer, the loop in the middle space as the middle layer, and the loop at the lower position as the bottom layer; for loops with more than three layers, they can be grouped into the nearest top, middle, or bottom layer category based on their relative height, or a detailed position code can be established and mapped to a position correction coefficient in subsequent processing; the pollution level can be determined based on the pollution area distribution map of the area traversed by the line route, environmental monitoring data, historical pollution flashover records, on-site salt and ash density measurement results, or regional classification data provided by the operating unit, and can be expressed using levels such as light pollution, medium pollution, heavy pollution, and extremely heavy pollution.

[0046] In one possible embodiment, multidimensional parameters can be acquired either manually by designers through a human-computer interface or automatically extracted by the system from the line design database. During manual entry, the system provides field validation rules for each circuit. For example, the voltage level field is limited to a standard voltage sequence, the tower head position field is limited to a preset layer enumeration value, and the pollution level field is limited to the standard level corresponding to the specifications. For instance, based on relevant design specifications for overvoltage protection and insulation coordination of AC electrical installations, and combined with pollution distribution maps of various regions, the pollution level (light pollution area, medium pollution area, heavy pollution area, or pollution levels A, B, C, D, E) of the areas through which the line passes is determined, thereby reducing input ambiguity. During automatic extraction, the system can call the structural design module, the path environment module, and the operational data interface respectively to uniformly encode data from different sources, and then summarize and match them according to the circuit number. If the same parameter from different sources is inconsistent, such as differences in pollution level between design and operational data, the more recently updated data or a stricter level can be used as the current circuit parameter to ensure that subsequent configuration results do not fall below safety requirements.

[0047] Furthermore, after completing the multi-dimensional parameter acquisition, the system forms a parameter set based on the insulation configuration parameters of each circuit and performs integrity and logical consistency checks. For example, for the same circuit, if the tower head position is entered but the phase sequence is not, the system prompts for completion; if the geometric height of the top-level circuit in the tower head layout diagram is lower than that of the middle-level circuit, the system prompts for verification of the tower head position labeling; if the pollution level is significantly inconsistent with the area to which the line path belongs, manual review is triggered. This method ensures the accuracy and usability of the input data before the evaluation begins. Based on the above analysis, by acquiring the voltage level, phase sequence, tower head position, and pollution level for each circuit separately, rather than treating the entire tower line as a single object, a clear data distinction basis can be provided for the subsequent establishment of insulation requirement models by circuit. This allows the differences in insulation requirements of different circuits in a multi-circuit line on the same tower to be truly reflected, avoiding subsequent calculations based on fuzzy inputs that could lead to configuration results deviating from engineering reality.

[0048] S202. Based on multi-dimensional parameters, evaluate the basic withstand requirements of each circuit for insulators.

[0049] In this step, the basic withstand requirement characterizes the basic insulation capacity requirements that each circuit must meet before further differentiation adjustments. It serves as an intermediate result for subsequently determining the number of insulator discs, insulator type, and creepage distance. The basic withstand requirement is assessed by the combined effects of voltage level, phase sequence arrangement, tower head location, and pollution level. The voltage level determines the basic insulation level that the circuit must meet; the phase sequence arrangement reflects the coupling and electric field distribution effects between adjacent circuits; the tower head location reflects the spatial differences in external overvoltage exposure and air gap environment experienced by the circuit; and the pollution level determines the minimum conditions that the leakage path on the insulator surface must meet. Based on these parameters, the basic withstand requirement specifically includes power frequency withstand requirements, switching overvoltage withstand requirements, lightning overvoltage withstand requirements, and insulation configuration benchmarks corresponding to the pollution level.

[0050] In the specific implementation process, the system establishes an independent evaluation unit for each circuit. First, the nominal insulation level range of the circuit is determined based on the voltage level, and the power frequency withstand parameters, switching impulse withstand parameters, and lightning impulse withstand parameters corresponding to that voltage level are read from a preset insulation coordination rule library. For power frequency withstand requirements, target values ​​can be determined based on the system's highest operating voltage, the operating voltage distribution of the insulator strings, and the line's operating mode. For switching overvoltage withstand requirements, overvoltage levels under operating conditions such as closing, reclosing, and disconnecting unloaded lines can be considered. For lightning overvoltage withstand requirements, preliminary determinations can be made based on regional thunderstorm days, the line's lightning protection design basis, and the impulse withstand standards corresponding to the voltage level. Here, although the tower head position will be used for differentiated correction in subsequent steps, it is still introduced in the foundation withstand requirement assessment stage. Its purpose is to ensure that the foundation requirements themselves have an initial judgment capability corresponding to the spatial location, avoiding abstract estimations completely detached from the actual installation location.

[0051] In one possible embodiment, the pollution level assessment employs a standardized calculation method to determine the baseline parameters for the insulation configuration of each circuit. The system pre-stores the unit voltage configuration parameters corresponding to different pollution levels, combines them with the highest operating voltage of the circuit, and obtains the configuration baseline value for the insulator string of that circuit. Subsequently, by combining the characteristic parameters of the candidate insulator types, the basic configuration level required to meet the configuration baseline is determined. For example, when a circuit is in a medium pollution zone, the system retrieves the configuration parameters corresponding to the medium pollution level, calculates the lower limit of the configuration baseline based on the circuit's voltage level, and then converts it using the single-strand characteristics of the selected glass insulator, porcelain insulator, or composite insulator to form a basic configuration range. If multiple optional insulator types exist for the same circuit, the system can calculate their corresponding basic configuration levels separately and use combinations that meet the withstand requirements and whose material parameters are achievable as the subsequent candidate set.

[0052] The role of phase sequence arrangement in foundation withstand requirement assessment is to identify the risk of local electric field enhancement caused by the phase correspondence between adjacent circuits. For example, if upper and lower circuits are arranged in the same, opposite, or staggered positions in adjacent spaces, their potential difference distribution and coupling degree will differ. The system generates a relative relationship matrix between circuits based on the tower head geometry diagram and phase sequence arrangement data, calculates the proximity relationship between each phase conductor, and gives the coupling influence level between adjacent circuits accordingly. When the coupling influence is high, the switching overvoltage withstand margin or lightning overvoltage withstand margin in the foundation withstand requirement is set to a higher value. In this way, the foundation withstand requirement is not simply equivalent to the general requirement of a single-circuit line under standard conditions, but rather a circuit-level identification is performed in conjunction with the characteristics of multiple circuits sharing a tower.

[0053] To facilitate engineering implementation, this embodiment also employs a quantitative evaluation model to express the foundation withstand requirements. For example, the foundation withstand requirements are represented as a parameter set including "power frequency withstand target value, switching impulse target value, lightning impulse target value, configuration benchmark parameters, and candidate range for foundation configuration levels." The configuration benchmark parameters are determined according to specifications and in conjunction with the actual circuit conditions; the impulse withstand requirements are converted into corresponding insulator string lengths or insulator type constraints according to insulation coordination specifications.

[0054] Based on the above analysis, it can be seen that by conducting basic withstand requirement assessments for each circuit separately, each circuit can remain independent from input parameters to intermediate results. This allows voltage differences, phase sequence effects, location differences, and pollution differences that are ignored under the unified configuration mode to be included in the same evaluation chain. As a result, subsequent insulation configuration is based on the requirements that meet the actual operating conditions of the circuit. This helps to improve the problem of insufficient matching caused by the average treatment of insulation requirements of each circuit in a multi-circuit line on the same tower.

[0055] S203. Based on the tower head position of each circuit, make differentiated modifications to the foundation withstand requirements.

[0056] In this step, the differential correction characterizes the process of adjusting the foundation withstand requirements based on the spatial differences of different circuits within the same tower. Its function is to transform the different external risks faced by each circuit in a multi-circuit line on the same tower into actionable insulation configuration adjustments. The tower head position characterizes the spatial location of each circuit on the tower, directly affecting the circuit's exposure to lightning strikes, wind deflection, electric field distribution, and spatial relationship with the ground or other components. Since circuits located at higher spatial positions are generally more susceptible to external lightning strikes and have higher exposure risks, circuits located at lower spatial positions are relatively more shielded, and circuits in the middle positions have risks between the two, it is necessary to further introduce positional differential corrections on top of the foundation withstand requirements. This ensures that the final insulation design does not use a single standard to cover all circuits.

[0057] In the specific implementation process, the system first reads the basic withstand requirement parameter group for each circuit formed in S102 and establishes a mapping relationship between the tower head position and the correction rules. For circuits with high exposure risk, their insulation requirement level can be increased. Specifically, this can be manifested by increasing the preset correction amount at the basic configuration level, increasing the safety margin at the impact withstand target value, and favoring at least one type with higher pollution resistance and impact resistance when selecting insulator types. For circuits with medium exposure risk, the basic withstand requirement can remain unchanged or a small correction can be applied. For circuits with low exposure risk, under the premise of meeting the minimum insulation requirements and the lower limit of the specification, the preset correction amount at the basic configuration level can be reduced, or the number of basic panels can be maintained but the type level can be reduced, thereby avoiding unnecessary redundant configuration. The preset correction amount can be pre-set based on enterprise standards, typical design experience, regional lightning activity levels, or simulation verification results.

[0058] In one possible implementation, tower head position correction is accomplished using a combination of rule-based judgment and constraint verification. The system first assigns a position correction coefficient to each circuit according to its layer, with high-risk positions having a correction coefficient greater than or equal to 1, medium-risk positions approximately equal to 1, and low-risk positions less than or equal to 1. This correction coefficient is then applied to the number of foundation panels, target string length, or target creepage distance to obtain an initial correction result. If the initial correction result, after conversion, is lower than the minimum number of panels, minimum creepage distance, or minimum withstand level specified in the standard, the system automatically reverts the result to the lower limit of the standard. If the correction result results in insufficient mechanical load capacity of the insulator string or conflict with the tower structure clearance, the system further readjusts the correction value in conjunction with the structural verification module. In this way, differentiated correction not only reflects positional differences but also maintains the feasibility of the project.

[0059] Furthermore, the modification of the foundation withstand requirements based on the tower head location is not limited to increasing or decreasing the number of insulators. For circuits with high pollution levels and located in high-risk areas, the number of insulators can be adjusted to a high-performance insulator type while maintaining the same number of insulators, thereby increasing the creepage distance without significantly increasing the string length. For circuits in low-risk areas and with milder environments, conventional insulator types that meet the minimum requirements can be used to reduce material costs. For circuits with the same voltage level but different layers, the system can also adjust its insulator string combination method, such as changing the equalizing ring configuration, string type, or string length ratio, to make the insulator strings more matched under the external insulation pressure corresponding to the spatial differences.

[0060] Based on the above analysis, it is clear that tower head position correction is one of the key aspects of this solution to address technical issues. Its core lies in explicitly incorporating the spatial exposure differences of different circuits in multi-circuit shared-tower lines into the insulation configuration decision chain. By increasing the insulation margin for circuits in high-risk locations and appropriately compressing the configuration of circuits in low-risk locations while meeting safety requirements, the dual problems of insufficient insulation in top circuits and redundant configuration in bottom circuits in traditional unified designs can be simultaneously alleviated. This makes the allocation of insulation resources more aligned with the actual risk level of each circuit, thereby helping to reduce the probability of localized circuit flashovers and simultaneous tripping of multiple circuits, and improving the targeted nature of engineering material inputs.

[0061] S204. Based on the revised withstand requirements, determine a differentiated insulation configuration scheme for each circuit. The differentiated insulation configuration scheme includes at least one of the following: number of insulator discs, insulator type, and creepage distance.

[0062] In this step, the differentiated insulation configuration scheme is used to characterize the final insulation configuration result for each circuit. Its function is to transform the withstand requirements after basic assessment and location correction into configuration parameters that can be directly used for engineering design, procurement, and construction. The number of insulator discs characterizes the number of insulation units in the insulator string and is a direct parameter for meeting the string length and insulation level requirements. The insulator type characterizes the structure and material category of the insulator used, such as glass insulators, porcelain insulators, composite insulators, or large creepage distance anti-pollution insulators. The creepage distance characterizes the length of the leakage path along the insulator surface and is an important indicator for meeting the requirements for operation in polluted environments.

[0063] Regarding the differentiated selection of insulator types, the system makes a final differentiated selection of insulator types for each circuit based on the basic withstand requirements established in S202 (including the voltage level, pollution level, electromagnetic coupling influence level, and lightning strike risk level of each circuit) and the results of the differentiated correction of tower head position in S203. Specifically: for circuits with higher pollution levels, higher lightning strike risk levels, or higher electromagnetic coupling influence levels, the final selection tends to choose insulator types with stronger pollution resistance and higher impact resistance, such as composite insulators or large creepage distance anti-pollution porcelain insulators; for circuits with lower pollution levels, lower lightning strike risk levels, and lower electromagnetic coupling influence levels, the final selection can choose conventional insulator types that meet the basic requirements, such as ordinary porcelain insulators or glass insulators.

[0064] In the implementation process, the system reads the corrected withstand capability requirements for each circuit and filters candidate configurations that meet the conditions from the insulator product library. The product library can pre-store the rated mechanical failure load, single-piece structural height, single-piece creepage distance, power frequency wet withstand capability level, lightning impulse withstand capability level, applicable pollution level, and cost parameters for each insulator type. The system first eliminates types that do not meet the pollution requirements based on the corrected minimum creepage distance, and then verifies whether the candidate insulator strings meet the power frequency, switching overvoltage, and lightning overvoltage requirements based on the corrected number of pieces and withstand capability target value. If there are multiple candidate schemes that meet the conditions for a certain circuit, further selection can be made according to design rules, such as selecting the one with the lower total cost under the premise of meeting safety constraints, or prioritizing the type with stronger anti-pollution performance in heavily polluted coastal or industrially polluted areas. Finally, the system outputs the configuration results for each circuit, including the circuit number, voltage level, tower head position, target number of pieces, target type, total creepage distance, and verification conclusion.

[0065] In one possible embodiment, when determining differentiated insulation configuration schemes, a processing path of "number of insulators first, then type" can be adopted. Specifically, the lower limit of the target number of insulators is first determined based on the modified withstand requirements, and then, under the premise of meeting this lower limit, an insulator type with suitable creepage distance and impulse withstand capability per insulator is selected, so that the total creepage distance and total insulation level simultaneously meet the requirements. In this path, the differentiated selection of insulator type is determined comprehensively based on the pollution level, lightning risk level, and electromagnetic coupling influence level of each circuit. Alternatively, a processing path of "type first, then number of insulators" can be adopted, that is, the type category is first determined based on the pollution level and environmental characteristics, and then the target number of insulators is calculated based on the single-insulator parameters. In this path, the differentiated selection of insulator type is completed before the number of insulators is calculated, and the selection result directly affects the calculation basis of the basic number of insulators. For non-sheet structures such as composite insulators, the "number of insulators" can also be converted into an equivalent insulation length parameter, and the corresponding number of supports, structural length, or shed combination parameters can be output accordingly. This implementation method makes it applicable not only to traditional disc suspension insulator strings, but also to other engineering-featured insulating components.

[0066] By selecting insulators with different types, different circuits can choose different types and performance of insulators according to their actual operating conditions (voltage level, pollution level, tower head position, phase sequence arrangement, etc.). This makes the insulation configuration more accurately match the risk level and operating requirements of each circuit, reducing the cost waste caused by using high-performance insulators in low-requirement circuits due to uniform selection, or the safety hazards caused by using low-performance insulators in high-requirement circuits.

[0067] To ensure the configuration scheme can be directly implemented, this embodiment can also perform loop-level and tower-level reviews after the scheme is generated. Loop-level review checks whether the insulator strings of each loop meet the corrected withstand requirements and the corresponding pollution and structural constraints. Tower-level review checks whether the configuration differences between loops on the same tower are consistent with their voltage level, phase sequence arrangement, tower head position, and pollution level, reducing anomalies such as high-risk loops being under-configured and low-risk loops being over-configured. If the review fails, the system can backtrack to S203 to readjust the correction values, or backtrack to S202 to recalibrate the basic withstand requirement assessment parameters, thus forming a closed-loop design process. Based on the above analysis, by converting the modified withstand requirements into at least one specific configuration parameter among the number of insulator discs, insulator type, and creepage distance for each circuit, the embodiments of this application realize a complete technical link from input parameter acquisition, basic requirement modeling, location difference correction to final engineering configuration output. This transforms the insulation configuration of multi-circuit lines on the same tower from "uniform configuration for the whole tower" to "differentiated configuration for each circuit". This improves the matching degree between insulation configuration and actual operating conditions while meeting insulation safety requirements, thereby alleviating the problems of insufficient insulation or redundant configuration in some circuits.

[0068] The insulation configuration method for multi-circuit overhead transmission lines on the same tower provided in this application obtains multi-dimensional parameters such as voltage level, phase sequence arrangement, tower head position, and pollution level of each circuit. Based on these multi-dimensional parameters, the basic withstand requirements of each circuit are evaluated. Then, the basic withstand requirements are differentiated according to the tower head position of each circuit, and a differentiated insulation configuration scheme is determined for each circuit based on the corrected withstand requirements. This allows the configuration of the number of insulator discs, insulator type, and creepage distance to better meet the actual insulation requirements of each circuit. Compared with the "one-size-fits-all" configuration method in related technologies, this method fully considers the differences in lightning strike risk of different circuits at the tower head spatial position, and realizes the on-demand configuration of the number of insulator discs, insulator type, and creepage distance. This effectively reduces the risk of simultaneous lightning trips, thereby improving the long-term stability and safety of the line and has good engineering practicality.

[0069] In some embodiments, the tower head position includes the top, middle, and bottom layers of the tower; based on the tower head position of each circuit, the foundation withstand requirements are differentiated and modified, including: for circuits located at the top layer, increasing the number of insulator discs corresponding to the foundation withstand requirements by a first preset number; for circuits located at the bottom layer, reducing the number of insulator discs corresponding to the foundation withstand requirements by a second preset number, while meeting the minimum insulation requirements; and for circuits located at the middle layer, configuring the number of insulator discs according to the foundation withstand requirements.

[0070] The tower head position is used to characterize the spatial arrangement hierarchy of each circuit on the same tower. The top, middle and bottom layers of the tower correspond to different electric field exposure conditions, lightning strike probability and coupling effects with adjacent circuits, respectively. The number of insulator discs corresponding to the foundation withstand requirements is a benchmark number of discs calculated from the circuit voltage level, phase sequence arrangement and pollution level, which is used as the starting point for subsequent differential corrections. The first preset number of discs is used to compensate for the lightning strike risk and external overvoltage risk borne by the top circuit due to its higher position, and its value range is, for example, 1 to 2 discs. The second preset number of discs is used to reduce the configuration redundancy of the bottom circuit after meeting the lower insulation limit, and its value range is, for example, 1 disc. The minimum insulation requirement is used to limit the safety boundary of the bottom circuit after reduction, ensuring that the insulation configuration after reduction is still not lower than the minimum insulation requirement determined by the voltage level and pollution level.

[0071] In practical implementation, after obtaining the basic withstand requirements of each circuit, the system matches each circuit with the installation position of the tower head and identifies its layer according to the pre-stored tower position determination rules. For circuits identified as the top layer, the system adds a first preset number of insulator discs to the number of insulator discs corresponding to the basic withstand requirements to improve its lightning resistance level, reduce the risk of flashover, and form an enhanced disc configuration to improve withstand margin. For circuits identified as the bottom layer, the system first checks whether the number of discs after subtracting the second preset number still meets the minimum insulation requirements. If it does, the reduced number of discs is used to reduce material and installation costs. For circuits identified as the middle layer, the number of insulator discs corresponding to the basic withstand requirements is directly used without additional correction. The number of insulator discs can be the equivalent number of glass insulator discs, porcelain insulator discs, or composite insulation strings. The specific model can be selected according to the engineering voltage level and pollution conditions. In practical applications, other models can also be selected for this component, which is not limited in this embodiment.

[0072] In one possible implementation, the specific values ​​of the first and second preset insulator numbers are determined based on the line's voltage level, lightning activity intensity, and engineering experience. For top-level circuits in areas with frequent lightning activity, the first preset number of insulators is a larger value (e.g., 2); for top-level circuits in areas with weak lightning activity, the first preset number of insulators can be a smaller value (e.g., 1). The second preset number of insulators for bottom-level circuits is usually 1, but the reduced number of insulator discs must not be lower than the minimum number of discs required by the specifications.

[0073] This differentiated correction method enables the top-level circuit to obtain a higher insulation margin, reduces the redundant configuration of the bottom-level circuit within safety constraints, and keeps the configuration level of the middle-level circuit consistent with the basic withstand requirements, thereby realizing the layered verification and layered configuration of multi-circuit lines on the same tower according to spatial location.

[0074] By adopting the above method, the number of insulation panels can be adjusted according to the actual power receiving environment of the circuits at different tower head positions. This allows the top-level circuit to have 1-2 more panels than the calculated number to improve its lightning resistance level, while the bottom-level circuit can have 1 fewer panel to save costs while meeting the minimum insulation requirements. The middle-level circuits can be configured according to the basic calculated number of panels. This improves the problems of insufficient insulation in the upper-level circuits and excessive configuration in the lower-level circuits caused by uniform configuration. In turn, it improves the line's flashover resistance, reduces the risk of multiple circuits tripping at the same time, and enhances the engineering adaptability of the insulation design.

[0075] Furthermore, in some embodiments, before making differentiated corrections to the basic tolerance requirements based on the tower head position of each loop, the method further includes: obtaining the altitude of the area traversed by each loop; and making high-altitude corrections to the basic tolerance requirements of each loop based on the altitude of the area traversed by each loop.

[0076] Altitude is used to characterize the height of the area where each circuit corridor is located relative to the reference sea level, and it can serve as an input parameter reflecting changes in air density and insulation capacity. Altitude correction is used to compensate for the decrease in air insulation strength caused by increased altitude, ensuring that the basic withstand requirements match the actual environment. Basic withstand requirements characterize the basic withstand level that each circuit must meet before insulation configuration is completed; this can be reflected in initial requirements for the number of insulator discs, creepage distance, or insulator type.

[0077] In practical implementation, the altitude of the areas traversed by each circuit can be obtained based on line design data, topographic mapping data, Geographic Information System (GIS) data, or field survey data, and then bound to the corresponding circuit to form a set of altitude parameters for each circuit. Since different circuits of a multi-circuit overhead transmission line on the same tower may pass through different altitude areas (for example, when the line crosses a mountain range, different circuits face different altitude conditions due to differences in their routes), this embodiment obtains and corrects the altitude of each circuit separately, rather than uniformly using the highest or average altitude of the entire line. Subsequently, based on the pre-established altitude correction relationship, the basic withstand requirements of each circuit are calculated or incrementally compensated separately. Specifically, high altitude correction is performed according to the provisions on high altitude correction in the overhead transmission line design specifications: when the altitude of the area traversed by the circuit exceeds 1000m, the number of insulator discs increases by 1% for every 100m increase; when the altitude of the area traversed by the circuit does not exceed 1000m, no high altitude correction is required. During the correction process, the number of insulator discs in the basic withstand requirements is converted according to the above ratio and rounded up; the creepage distance requirement in the basic withstand requirements is adjusted accordingly according to the same ratio. This correction result is then input into the differential correction step based on the tower head position as the basic parameters for further determining the insulation configuration of each circuit.

[0078] In one possible implementation, if the same circuit traverses multiple regions at different altitudes, the insulation configuration is adjusted according to the highest altitude of the regions traversed by the circuit to ensure that the insulation configuration meets the most stringent environmental conditions along the entire line. If there are altitude differences between different circuits, the insulation configuration is adjusted independently to match the actual altitude conditions of each circuit.

[0079] In this embodiment, by introducing altitude correction, the basic withstand requirements of each circuit can be adapted to different altitude environments in advance. This reduces the risk of lower withstand levels due to reduced air insulation capacity at high altitudes, thus ensuring that subsequent differentiated corrections based on tower head location are more aligned with actual operating conditions. Simultaneously, by applying altitude correction to each circuit separately, the problem of excessive redundancy in insulation configuration for low-altitude circuits caused by uniformly applying the highest altitude of the entire line is mitigated. This approach helps improve the accuracy and consistency of insulation configuration, reduces the risk of flashover on high-altitude lines, and minimizes redundant design caused by uniform configuration.

[0080] Based on the above embodiments, in some embodiments, after making differentiated corrections to the foundation withstand requirements according to the tower head position of each circuit, the method further includes: determining whether the electromagnetic coupling effect strength between adjacent circuits is greater than or equal to a preset strength threshold according to the phase sequence arrangement of each circuit; for circuits with adjacent phase sequences and electromagnetic coupling effect strength greater than or equal to the strength threshold, adding a third preset number of insulator discs based on the current number of insulator discs.

[0081] Among them, the phase sequence arrangement is used to characterize the relative arrangement of each circuit in the same tower structure (such as the arrangement of phases A, B, and C at the tower head, including horizontal, vertical, or mixed arrangement); the electromagnetic coupling effect strength is used to characterize the strength of the coupling effect between adjacent circuits due to phase relationship and spatial proximity; the strength threshold is used to limit whether additional corrections to the insulation configuration are needed; the third preset number of plates is used to compensate for the insulation pressure caused by the coupling effect of adjacent circuits, and its value range is usually 1 plate. The above parameters can be jointly determined by the line design database, tower head arrangement parameters, and circuit phase relationship, and can be calibrated in conjunction with existing operating experience.

[0082] In practical implementation, adjacent circuit identification results can be established based on the phase sequence combination relationship of each circuit. Combined with circuit spacing, conductor arrangement, and phase correspondence, the electromagnetic coupling effect strength between adjacent circuits can be estimated. For circuits with adjacent phase sequences and strong electromagnetic coupling effect (i.e., reaching or exceeding a preset strength threshold), this indicates that the adjacency relationship has a significant impact on the electric field distribution and withstand capability of the insulator string. In this case, a third preset number of insulator discs (e.g., adding one disc) is added to the current number of discs for the corresponding circuit to improve insulation margin and avoid insulation breakdown. For non-adjacent phase sequence circuits, or adjacent circuits where the electromagnetic coupling effect strength does not reach the strength threshold, the current number of insulator discs is used, without the need to add additional discs. This third preset number of discs can be set according to different voltage levels, tower structures, and line environments; it can be a fixed configuration or modified according to engineering parameters. In practical applications, the increased string length corresponding to the increase in the number of insulator discs can be achieved using standard steel-cap porcelain insulators, glass insulators, or composite insulator strings; this application embodiment does not limit this.

[0083] In one possible implementation, the system generates a relative relationship matrix between circuits based on the tower head geometry diagram and phase sequence data, calculates the proximity relationship between each phase conductor, and quantifies the coupling influence level between adjacent circuits accordingly. When the coupling influence level reaches a preset level, it is determined that the electromagnetic coupling effect strength is greater than or equal to the strength threshold, thereby triggering insulation enhancement measures.

[0084] This allows the electromagnetic coupling effects between adjacent circuits to be identified and translated into corresponding insulation enhancement measures, thereby making the insulation configuration more suitable for the actual operating environment. For adjacent circuits with high coupling strength, increasing the number of third preset insulators can improve the electric field distribution of series insulators, reduce the risk of partial discharge and flashover, and improve the operational coordination of multi-circuit lines on the same tower.

[0085] The embodiments of this application can reduce the insulation deficiency problem caused by ignoring phase sequence coupling factors when making corrections based solely on the tower head position. At the same time, it reduces the over-configuration of low-coupling circuits, allowing the differential corrections of the top, middle, and bottom layers and the corrections of phase sequence coupling effects to be superimposed, so that the insulation design takes into account both safety and applicability, and improves the reliability of multi-circuit overhead transmission lines on the same tower under complex operating conditions.

[0086] In some embodiments, the basic withstand requirements of each circuit for insulators are evaluated based on multi-dimensional parameters, including: determining the withstand requirements of power frequency voltage, switching overvoltage, and lightning overvoltage for each circuit according to the voltage level of each circuit; assessing the electromagnetic coupling influence level between adjacent circuits according to the phase sequence arrangement of each circuit; assessing the lightning strike risk level of each circuit according to the tower head position of each circuit; determining the minimum creepage distance of each circuit according to the pollution level of each circuit and in accordance with preset specifications using the creepage distance ratio method; determining the basic number of insulator discs based on the minimum creepage distance and the preset creepage distance of a single insulator disc; and using the withstand requirements, electromagnetic coupling influence level, lightning strike risk level, minimum creepage distance, and number of basic discs as the basic withstand requirements.

[0087] Among them, power frequency voltage is used to characterize the power frequency conditions during normal operation of the line, switching overvoltage is used to characterize the instantaneous overvoltage caused by switch operation, and lightning overvoltage is used to characterize the instantaneous high voltage under lightning strike conditions. The three together constitute the voltage withstand constraint in the circuit foundation withstand requirements. Lightning strike risk level is used to quantify the differences in the probability of lightning strikes faced by different spatial locations. Pollution level is used to characterize the degree of pollution accumulation and leakage risk of the environment in which the line is located. The preset specification requirements are used to correspond to the insulation coordination standards under different pollution levels (such as the different creepage distance requirements corresponding to light pollution area, medium pollution area, heavy pollution area, or pollution levels A, B, C, D, and E). The creepage distance method is used to convert the creepage distance requirement corresponding to unit voltage into the minimum creepage distance of the insulator. The preset creepage distance of a single insulator is used to characterize the effective creepage length of a single insulator along the surface. The number of basic insulators is the initial number of series insulators obtained based on the correspondence between the minimum creepage distance and the creepage distance of a single insulator.

[0088] In practical implementation, for each circuit's voltage level, it is first mapped to the corresponding insulation withstand level. Then, the withstand requirements for power frequency voltage, switching overvoltage, and lightning overvoltage are determined based on the line's operating mode. Power frequency withstand is used to meet long-term operating conditions, switching overvoltage withstand is used to meet transient conditions such as closing, opening, and fault switching, and lightning overvoltage withstand is used to meet external impulse conditions. Specifically, for 110kV and 220kV circuits, their insulation configuration must consider both lightning backflashover and lightning strike protection; for 500kV and above circuits, the insulation configuration should primarily focus on lightning strike protection. When determining withstand requirements, it is necessary to ensure that the withstand voltage of the insulator string is greater than the maximum overvoltage that the line may experience, including lightning overvoltage and switching overvoltage.

[0089] For phase sequence arrangement, the system generates a relative relationship matrix between circuits based on the tower head geometry diagram and phase sequence data, calculates the proximity relationship between each phase conductor, and quantifies the coupling influence level between adjacent circuits accordingly. When upper and lower layer circuits form same-phase, opposite-phase, or staggered opposite positions in adjacent spatial locations, their potential difference distribution and coupling degree differ, and the coupling influence level increases accordingly. For tower head location, the system identifies the spatial position of the circuits based on their vertical distribution on the tower: circuits located at the top layer have the highest lightning strike risk level, circuits located in the middle layer have the second highest, and circuits located at the bottom layer have the lowest. The above electromagnetic coupling influence level and lightning strike risk level will be used as components of the basic withstand requirements for subsequent differentiated correction steps.

[0090] Subsequently, based on the pollution level of the area where each circuit is located, the unit creepage distance limit (i.e., uniform creepage ratio) corresponding to that pollution level is retrieved and multiplied by the corresponding voltage level borne by the insulator (the highest operating voltage of the system) to obtain the minimum creepage distance. This calculation process is performed in accordance with the relevant provisions on creepage ratio in the design specifications for overhead transmission lines. For different pollution levels, the corresponding creepage ratio value is used for calculation. The selected insulators can be glass insulators, porcelain insulators, or composite insulators. Their single-piece creepage distance can be determined from product samples or type parameters, usually corresponding to specific shed structure and shed spacing parameters. The minimum creepage distance is further divided by the single-piece creepage distance and rounded up to obtain the number of basic insulators that meet the basic insulation requirements, thus forming the initial configuration benchmark before subsequent differential corrections for each circuit. This number of basic insulators can serve as the starting point for insulation string design and as a comparison benchmark when adding or removing insulators based on tower head positions.

[0091] After completing the above assessments, the system will use the tolerance requirements, electromagnetic coupling impact level, lightning strike risk level, minimum creepage distance, and number of basic plates as the basic tolerance requirements for the circuit, forming a parameter set with multiple dimensions for use in subsequent differentiated correction steps.

[0092] In one possible implementation, if there are multiple optional insulator types for the same circuit (such as glass insulators, porcelain insulators, and composite insulators), the system calculates the number of base pieces corresponding to each type and uses the combinations that meet the tolerance requirements and whose material parameters are achievable as the subsequent candidate set for selection by the differentiation correction step.

[0093] For power frequency voltage withstand requirements, the target value is determined based on the system's highest operating voltage, the working voltage distribution of the insulator string, and the line's operating mode. For switching overvoltage withstand requirements, the overvoltage level under operating conditions such as closing, reclosing, and disconnecting unloaded lines is considered. For lightning overvoltage withstand requirements, the initial determination is made based on the region's thunderstorm days, the line's lightning protection design basis, and the impulse withstand standards corresponding to the voltage level.

[0094] By adopting the above method, the insulation requirements of the circuit are no longer determined solely by a uniform voltage level. Instead, voltage withstand requirements, phase sequence coupling effects, tower head lightning strike risk, and pollution environment constraints are all incorporated into the basic assessment. This allows the insulation configuration to reflect the comprehensive withstand capability of each circuit under normal operation, operational shock, and pollution conditions. Furthermore, by differentiating the protection priorities of circuits at different voltage levels (e.g., 110kV / 220kV considers both backflashover and side-flashover protection, while 500kV focuses primarily on side-flashover protection), the assessment of basic withstand requirements becomes more accurate. Introducing the basic assessment based on phase sequence arrangement and tower head position allows subsequent differentiated modifications to be made more closely aligned with the actual operating conditions of the circuit. Additionally, by matching the minimum creepage distance with the creepage distance of a single piece, the number of feasible basic pieces can be directly obtained, reducing deviations caused by experience-based selection and providing a clear basis for subsequent differentiated modifications based on tower head position. This improves the accuracy, adaptability, and feasibility of the insulation configuration.

[0095] In some embodiments, after determining the differentiated insulation configuration scheme for each circuit based on the modified withstand requirements, the method further includes: substituting the number of insulator discs in the differentiated insulation configuration scheme for each circuit into the lightning overvoltage withstand verification formula and the switching overvoltage withstand verification formula for withstand verification; if there is a target circuit that fails the withstand verification, the number of insulator discs in the target circuit is increased until the target circuit passes the withstand verification.

[0096] The differentiated insulation configuration scheme characterizes the configuration results of each circuit after completing the basic requirements assessment and differentiated correction. Its content may include at least one of the following: number of insulator discs, insulator type, and creepage distance. The number of insulator discs characterizes the number of series-connected insulator units in the insulation string and is a core parameter for withstand voltage verification and subsequent compensation adjustments. The lightning overvoltage withstand voltage verification formula verifies the circuit's withstand capability under lightning impulse conditions, and the switching overvoltage withstand voltage verification formula verifies the circuit's withstand capability under overvoltage conditions such as switch operation. Together, they constitute a complete verification basis for the insulation configuration scheme, ensuring that the withstand voltage of the insulator string is greater than the maximum possible overvoltage of the line. The target circuit indicates the circuit that failed the withstand voltage requirements during the verification process; this circuit will be used as a supplementary adjustment target.

[0097] In this embodiment, once the differentiated insulation configuration scheme for each circuit has been determined, the number of insulator discs corresponding to each circuit can be used as an input parameter, substituted into the lightning overvoltage withstand verification formula and the switching overvoltage withstand verification formula, respectively, to calculate the verification result of the circuit under the corresponding overvoltage. The verification formula can be established based on the line voltage level, insulator string structure, insulation coordination coefficient, and environmental correction coefficient, and is automatically solved by the line design software or calculation module. When the calculation result of a certain circuit shows that the withstand voltage of the insulator string is less than the maximum overvoltage of the line, the withstand verification of that circuit is determined to be unsuccessful, and it is identified as the target circuit. Subsequently, the number of insulator discs is increased for the target circuit. The number of discs added can be adjusted sequentially according to a preset increment (e.g., adding 1 disc each time), and after each adjustment, the two types of withstand verification formulas are re-substituted for verification until the target circuit meets the requirement that the withstand voltage is greater than or equal to the maximum overvoltage of the line under both lightning overvoltage and switching overvoltage conditions. This iterative verification process ensures that the final configuration scheme can simultaneously meet the dual requirements of lightning overvoltage and switching overvoltage. In practical applications, the number of insulator discs can be selected from common tempered glass insulators, porcelain insulators, or composite insulator strings. This application does not limit this.

[0098] In one possible implementation, if the same target circuit fails to meet both lightning overvoltage withstand capability and switching overvoltage withstand capability requirements simultaneously, then increasing the number of insulator discs requires meeting both types of requirements concurrently, rather than just one. The system can determine the final number of discs according to the more stringent standard.

[0099] By conducting secondary withstand verification on differentiated insulation configuration schemes, the insulation configuration of each circuit can not only meet the differentiated design results but also the final lightning and switching overvoltage withstand requirements, thereby reducing the flashover risk caused by undersized initial configurations. For target circuits that fail the verification, a circuit-by-circuit reinforcement method is used for correction, which avoids the material waste caused by uniformly adding insulation to the entire tower and improves the matching degree between the configuration results and actual operational risks. At the same time, it reduces the risk of simultaneous tripping of multiple circuits due to simultaneous lightning flashovers on multiple lines, thereby improving the operational reliability and engineering applicability of multi-circuit overhead transmission lines on the same tower.

[0100] For example, Figure 3 Another schematic flowchart illustrating the insulation configuration method for a multi-circuit overhead transmission line on the same tower, provided as an exemplary embodiment of this application. (See attached diagram.) Figure 3 As shown, the insulation configuration method for this multi-circuit overhead transmission line on the same tower includes:

[0101] S301. Obtain multi-dimensional parameters of each circuit in a multi-circuit overhead transmission line on the same tower. The multi-dimensional parameters include the voltage level, phase sequence arrangement, tower head position, and pollution level of the area where each circuit is located.

[0102] For example, taking the insulation configuration design of a 500kV overhead transmission line with two circuits on the same tower in a high-altitude area as an example, when configuring the insulation of a multi-circuit overhead transmission line on the same tower, the relevant parameters of the insulation configuration of each circuit are first collected. For a certain double-circuit line on the same tower, the voltage level of circuit A and circuit B is 500kV; in the phase sequence arrangement, phase A of circuit A is adjacent to phase B of circuit B; circuit A is located at the top of the tower, and circuit B is located at the bottom of the tower; the area where circuit A is located is a heavily polluted area, and the area where circuit B is located is a moderately polluted area; the altitude of the area through which circuit A passes is 2200 meters, and the altitude of the area through which circuit B passes is 2100 meters.

[0103] S302. Based on multi-dimensional parameters, evaluate the basic withstand requirements of each circuit for insulators.

[0104] 1) Based on the voltage level of each circuit, determine the withstand requirements for power frequency voltage, switching overvoltage, and lightning overvoltage for each circuit. For example, based on the withstand voltage requirements of a 500kV line, determine the power frequency withstand requirements, switching overvoltage withstand requirements, and lightning overvoltage withstand requirements for circuits A and B respectively. The power frequency withstand voltage for the 500kV line is determined based on the highest operating voltage of the system; lightning overvoltage verification can be performed based on a maximum lightning overvoltage of approximately 750kV (i.e., 1.5 times the rated voltage); switching overvoltage verification can be performed based on a maximum switching overvoltage of approximately 650kV (i.e., 1.3 times the rated voltage). 2) Based on the phase sequence arrangement of each circuit, assess the electromagnetic coupling influence level between adjacent circuits. For example, if circuits A and B have adjacent phase sequences, and phase A of circuit A and phase B of circuit B are spatially close, their electromagnetic coupling effect is strong, and the electromagnetic coupling influence level is assessed as high. 3) Based on the tower head location of each circuit, assess the lightning strike risk level of each circuit. For example, circuit A is located at the top of the tower, and its lightning strike risk level is assessed as high; circuit B is located at the bottom of the tower, and is blocked by the circuit above it, so its lightning strike risk level is assessed as low. 4) Based on the pollution level of each circuit, determine the minimum creepage distance of each circuit according to the preset specifications using the creepage distance ratio method. For example, in heavily polluted areas, the creepage distance ratio can be calculated as not less than 25mm per kV, and in medium-polluted areas, it can be calculated as 20mm per kV; for a 500kV line, the minimum creepage distance for circuit A (heavily polluted area) is 500×25=12500mm; the minimum creepage distance for circuit B (medium-polluted area) is 500×20=10000mm. 5) Determine the number of base insulators based on the minimum creepage distance and the preset creepage distance of a single insulator piece. For example, the preset creepage distance of a single insulator piece is 150mm. The basic number of insulator discs for circuit A is approximately 83.33 (12500 ÷ 150 ≈ 84), rounded up. The basic number of insulator discs for circuit B is approximately 66.67 (10000 ÷ 150 ≈ 67), rounded up. 6) The withstand requirements, electromagnetic coupling influence level, lightning strike risk level, minimum creepage distance, and basic number of discs are used as the basic withstand requirements. Based on the above assessment results, a preliminary selection preference for the insulator type of each circuit is determined. For example, based on the insulation requirement assessment results of each circuit (including voltage level, pollution level, lightning strike risk level, electromagnetic coupling influence level, etc.), a preliminary selection preference for the insulator type of circuits A and B is determined. Circuit A is located on the top floor, in a heavily polluted area, and at a high altitude. Both its lightning strike risk level and electromagnetic coupling influence level are high. Therefore, the initial selection tends to choose composite insulators with stronger pollution resistance and impact resistance, or large creepage distance anti-pollution porcelain insulators. Circuit B is located on the bottom floor, in a medium-pollution area, and at a medium altitude. Its lightning strike risk level is low, and its electromagnetic coupling influence level is high, but this can be compensated for by adjusting the number of insulators. Therefore, the initial selection tends to choose ceramic insulators or glass insulators that meet the basic requirements in order to reduce material costs.This initial selection preference will serve as an important basis for subsequent differentiation adjustments and the determination of the final configuration scheme.

[0105] S303. Analyze the altitude of the areas traversed by each loop, and make high-altitude corrections to the basic tolerance requirements of each loop according to the altitude conditions.

[0106] For example, according to the high-altitude correction provisions in the design specifications for overhead transmission lines, for areas with an altitude exceeding 1000m, the number of insulator discs increases by 1% for every 100m increase in altitude. Circuit A has an altitude of 2200m, and the portion exceeding 1000m is 1200m, requiring an increase of 12%, thus correcting the number of base discs from 84 to 94 (84 × 1.12 ≈ 94.08, rounded up). Circuit B has an altitude of 2100m, and the portion exceeding 1000m is 1100m, requiring an increase of 11%, thus correcting the number of base discs from 67 to 74 (67 × 1.11 ≈ 74.37, rounded up).

[0107] S304. Based on the position of each circuit at the tower head on the tower, the foundation withstand requirements are modified accordingly.

[0108] For example, for circuit A (high lightning risk level) located at the top level, the number of insulator discs is increased by a first preset number (2 discs) based on the altitude-corrected number to improve its lightning resistance and reduce the risk of flashover. The number of discs in circuit A increases from 94 to 96. Simultaneously, based on the preliminary selection criteria of S307, composite insulators or large-creep-distance anti-pollution porcelain insulators should be prioritized in subsequent selections for circuit A. For circuit B (low lightning risk level) located at the bottom level, while meeting minimum insulation requirements, the number of insulator discs is reduced by a second preset number (1 disc) based on the altitude-corrected number to save costs. The number of discs in circuit B decreases from 74 to 73. Simultaneously, based on the preliminary selection criteria of S307, ordinary ceramic insulators or glass insulators can be used in subsequent selections for circuit B. For circuits located in the middle level, the configuration follows the altitude-corrected number of insulator discs without further correction.

[0109] S305. Based on the phase sequence arrangement of each circuit, determine whether the electromagnetic coupling effect strength between adjacent circuits is greater than or equal to the preset strength threshold.

[0110] If so, execute S306;

[0111] If not, proceed with S307.

[0112] For example, if circuit A and circuit B are phase-sequential and have a strong electromagnetic coupling effect (the electromagnetic coupling effect level is high), it can be determined that the intensity of their electromagnetic coupling effect reaches the preset intensity threshold, so S306 is executed.

[0113] S306. For circuits with adjacent phase sequence and electromagnetic coupling effect strength greater than or equal to the strength threshold, increase the preset number of insulator discs based on the current number of insulator discs.

[0114] For example, the preset number of chips can be 1. With this correction, the number of chips in circuit A increases from 96 to 97; the number of chips in circuit B increases from 73 to 74.

[0115] S307. For non-adjacent phase sequence circuits, or adjacent circuits where the electromagnetic coupling effect strength does not reach the strength threshold, the current number of insulator discs shall be used for configuration, and no additional discs are required.

[0116] S308. Determine a differentiated insulation configuration scheme for each circuit. The differentiated insulation configuration scheme includes at least one of the following: number of insulator discs, insulator type, and creepage distance.

[0117] For example, after high altitude correction, tower head position correction and electromagnetic coupling correction, combined with the preliminary insulator type selection tendency determined in S302, the insulator type is selected differently for circuit A and circuit B respectively, and the differentiated insulation configuration scheme for each circuit is determined.

[0118] Specifically, for circuit A (top layer, heavily polluted area, altitude 2200m, high lightning risk level, high electromagnetic coupling impact level), 97 composite insulators were ultimately selected. Composite insulators have advantages such as strong pollution resistance, high impact resistance, and light weight, which can meet the insulation requirements of the top layer circuit under high altitude, heavily polluted area, and high lightning risk conditions. With a creepage distance of 150mm per composite insulator, the total creepage distance is 14550mm. For circuit B (bottom layer, medium pollution area, altitude 2100m, low lightning risk level), 74 ceramic insulators were ultimately selected. Ceramic insulators have good electromechanical properties and mature manufacturing processes, which can meet the basic insulation requirements of the bottom layer circuit under medium pollution area and medium altitude conditions, and the cost is relatively low. With a creepage distance of 150mm per ceramic insulator, the total creepage distance is 11100mm.

[0119] This differentiated insulation configuration scheme includes the number of insulator discs, insulator type, and creepage distance. Circuit A, corresponding to the top layer, heavily polluted area, high altitude, and strong coupling conditions, uses high-performance composite insulators; Circuit B, corresponding to the bottom layer, medium-polluted area, medium altitude, and weak coupling conditions, uses conventional ceramic insulators. Through this differentiated selection of insulator types, the insulation configuration more accurately matches the actual operating conditions and risk levels of each circuit.

[0120] S309. Substitute the number of insulator discs in each circuit configuration scheme into the lightning overvoltage withstand verification formula and the switching overvoltage withstand verification formula respectively to perform withstand verification.

[0121] For example, for circuit A, the configuration of 97 composite insulators is substituted into the verification formula to verify whether its lightning overvoltage withstand capability meets the requirement of a maximum lightning overvoltage of approximately 750kV for a 500kV line, and whether its switching overvoltage withstand capability meets the requirement of approximately 650kV; for circuit B, the configuration of 74 ceramic insulators is substituted into the corresponding formula to verify lightning overvoltage and switching overvoltage withstand capabilities.

[0122] S310. If there is a target circuit that fails the withstand test, the number of insulator discs for the target circuit shall be increased, and the lightning overvoltage withstand test formula and the switching overvoltage withstand test formula shall be resubmitted and the test shall be repeated until the target circuit passes the corresponding withstand test.

[0123] In this example, both circuits A and B passed the corresponding withstand test after verification, thus forming a differentiated insulation configuration implementation method suitable for this high-altitude double-circuit 500kV overhead transmission line on the same tower.

[0124] In summary, this application has at least the following advantages:

[0125] I. By acquiring the voltage level, phase sequence, tower head location, and pollution level of each circuit, the basic withstand requirements of each circuit are assessed, and differentiated adjustments are made based on the tower head location of each circuit to ultimately determine a differentiated insulation configuration scheme for each circuit. Compared to the "one-size-fits-all" configuration approach in related technologies that uses the highest line voltage level and the most severe pollution level as uniform design conditions, this application fully considers the differences in lightning strike risk at the tower head location of different circuits, the differences in electromagnetic coupling effects caused by phase sequence arrangement, and the differences in pollution levels of the areas actually traversed by each circuit. This effectively reduces the problems of high lightning flashover probability in top-level circuits and high risk of simultaneous tripping of multiple circuits due to uniform configuration.

[0126] Second, by introducing differentiated corrections based on tower head location, the number of insulator discs for circuits located at the top of the tower is increased beyond the basic number to improve their lightning resistance and reduce the risk of flashover. For circuits located at the bottom of the tower, the number of discs is reduced while meeting minimum insulation requirements, which helps save materials and installation costs. Circuits located in the middle layer are configured according to the basic number of discs. Simultaneously, a phase sequence influence correction is introduced: for circuits with adjacent phase sequences and strong electromagnetic coupling, the number of discs is increased beyond the current number to help reduce insulation breakdown. Through this layered, multi-factor coupled differentiated configuration method, the allocation of insulation resources better reflects the actual risk level of each circuit.

[0127] Third, by independently adjusting the basic withstand requirements of each circuit through high-altitude correction, the excessive redundancy in insulation configuration of low-altitude circuits caused by uniformly adopting the highest altitude of the entire line is reduced. Overvoltage withstand verification is performed circuit-by-circuit to verify differentiated configuration schemes, ensuring that the withstand voltage of the insulator string is greater than the maximum overvoltage of the line. If this is not met, the number of insulator discs is automatically increased until the requirements are met. This method, while ensuring that the insulation performance of each circuit meets the withstand requirements for lightning overvoltage, switching overvoltage, and power frequency voltage, allows for on-demand configuration of the number of insulator discs, type, and creepage distance. This effectively reduces the risk of simultaneous tripping due to lightning strikes, improves the long-term stability and safety of the line, and reduces excessive or insufficient insulation configuration, demonstrating good engineering economy and practicality.

[0128] The following are embodiments of the apparatus described in this application, which can be used to execute the embodiments of the method described in this application. For details not disclosed in the apparatus embodiments of this application, please refer to the embodiments of the method described in this application.

[0129] Figure 4 This is a schematic diagram of an insulation configuration device for a multi-circuit overhead transmission line on the same tower, provided as an exemplary embodiment of this application. Figure 4 As shown, the insulation configuration device 40 for the multi-circuit overhead transmission line on the same tower includes an acquisition module 41, an evaluation module 42, a differentiation correction module 43, and an insulation configuration module 44, wherein:

[0130] The acquisition module 41 is used to acquire multi-dimensional parameters of each circuit in a multi-circuit overhead transmission line on the same tower. The multi-dimensional parameters include the voltage level, phase sequence arrangement, tower head position and pollution level of the area where each circuit is located.

[0131] Evaluation module 42 is used to evaluate the basic withstand requirements of each circuit for insulators based on multi-dimensional parameters;

[0132] The differential correction module 43 is used to make differential corrections to the foundation withstand requirements based on the tower head position of each loop.

[0133] The insulation configuration module 44 is used to determine a differentiated insulation configuration scheme for each circuit based on the modified withstand requirements. The differentiated insulation configuration scheme includes at least one of the following: number of insulator discs, insulator type, and creepage distance.

[0134] In one possible implementation, the tower head position includes the top, middle and bottom layers of the tower; the differentiation correction module 43 can be specifically used to: for the circuit located at the top layer, increase the number of insulator discs based on the number of insulator discs corresponding to the basic withstand requirements; for the circuit located at the bottom layer, reduce the number of insulator discs based on the number of insulator discs corresponding to the basic withstand requirements, provided that the minimum insulation requirements are met; for the circuit located at the middle layer, configure according to the number of insulator discs corresponding to the basic withstand requirements.

[0135] In one possible embodiment, the differentiation correction module 43 can also be used to: obtain the altitude of the area traversed by each loop; and perform high-altitude correction on the basic tolerance requirements of each loop according to the altitude of the area traversed by each loop.

[0136] In one possible embodiment, the differentiation correction module 43 can also be used to: determine whether the electromagnetic coupling effect strength between adjacent circuits is greater than or equal to a preset strength threshold according to the phase sequence arrangement of each circuit; and for circuits with adjacent phase sequences and electromagnetic coupling effect strength greater than or equal to the strength threshold, add a third preset number of insulator discs based on the current number of insulator discs.

[0137] In one possible embodiment, the evaluation module 42 may be specifically used to: determine the withstand requirements of power frequency voltage, switching overvoltage, and lightning overvoltage for each circuit based on the voltage level of each circuit; evaluate the electromagnetic coupling influence level between adjacent circuits based on the phase sequence arrangement of each circuit; evaluate the lightning strike risk level of each circuit based on the tower head position of each circuit; determine the minimum creepage distance of each circuit using the creepage distance ratio method according to the pollution level of each circuit and in accordance with preset specifications; determine the number of basic insulator discs based on the minimum creepage distance and the preset creepage distance of a single insulator disc; and use the withstand requirements, electromagnetic coupling influence level, lightning strike risk level, minimum creepage distance, and number of basic discs as basic withstand requirements.

[0138] In one possible embodiment, the insulation configuration module 44 can be specifically used to: substitute the number of insulator discs in the differentiated insulation configuration schemes of each circuit into the lightning overvoltage withstand verification formula and the switching overvoltage withstand verification formula for withstand verification; if there is a target circuit that fails the withstand verification, increase the number of insulator discs of the target circuit until the target circuit passes the withstand verification.

[0139] The insulation configuration device for multi-circuit overhead transmission lines on the same tower provided in this application embodiment can execute the technical solution shown in the above-described insulation configuration method embodiment for multi-circuit overhead transmission lines on the same tower. Its implementation principle and beneficial effects are similar, and will not be repeated here.

[0140] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to this application.

[0141] It should be further noted that although the steps in the flowchart are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowchart may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0142] It should be noted that the above-described device embodiments are merely illustrative, and the device of this application can also be implemented in other ways; and it should be understood that the division of the various modules of the above device is only a logical functional division, and in actual implementation, they can be fully or partially integrated into a single physical entity, or they can be physically separated. Furthermore, these modules can all be implemented in software through processing element calls; they can all be implemented in hardware; or some modules can be implemented in software through processing element calls, and some modules can be implemented in hardware. For example, the differentiation correction module can be a separately established processing element, or it can be integrated into a chip of the above device. Alternatively, it can be stored as program code in the memory of the above device, and its function can be called and executed by a processing element of the above device. The implementation of other modules is similar. In addition, these modules can be fully or partially integrated together, or they can be implemented independently. The processing element here can be an integrated circuit with signal processing capabilities. In the implementation process, each step of the above method or each of the above modules can be completed by the integrated logic circuit in the hardware of the processor element or by software instructions.

[0143] For example, these modules can be one or more integrated circuits configured to implement the above methods, such as one or more Application Specific Integrated Circuits (ASICs), one or more Digital Signal Processors (DSPs), or one or more Field Programmable Gate Arrays (FPGAs). As another example, when a module is implemented using processing element scheduler code, the processing element can be a general-purpose processor, such as a Central Processing Unit (CPU) or other processor capable of calling program code. Furthermore, these modules can be integrated together as a System-On-a-Chip (SOC).

[0144] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. A computer program product includes one or more computer instructions. When the computer instructions are loaded and executed on a computer, all or part of the flow or function according to the embodiments of this application is generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means.

[0145] Computer-readable storage media can be any available medium that a computer can access, or a data storage device such as a server or data center that integrates one or more available media. Available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., Digital Video Discs, DVDs), or semiconductor media (e.g., solid-state disks (SSDs)).

[0146] Figure 5 A schematic diagram of the structure of an electronic device provided as an exemplary embodiment of this application. For example... Figure 5 As shown, the electronic device 50 in this embodiment includes:

[0147] At least one processor 51; and a memory 52 communicatively connected to the at least one processor;

[0148] The memory 52 stores instructions that can be executed by at least one processor 51 to cause the electronic device to perform the method as described in any of the above embodiments.

[0149] Alternatively, the memory 52 can be either standalone or integrated with the processor 51.

[0150] The memory 52 may include high-speed random access memory (RAM) and may also include non-volatile memory, such as at least one disk storage device.

[0151] The processor 51 may be a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of this application. Specifically, in implementing the insulation configuration method for multi-circuit overhead transmission lines on the same tower as described in the foregoing method embodiments, the electronic device may be, for example, an electronic device with processing capabilities such as a server.

[0152] Optionally, the electronic device may also include a communication interface 53. In specific implementations, if the communication interface 53, memory 52, and processor 51 are implemented independently, they can be interconnected via a bus to complete communication. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc., but this does not imply that there is only one bus or one type of bus.

[0153] Optionally, in a specific implementation, if the communication interface 53, memory 52 and processor 51 are integrated on a single chip, then the communication interface 53, memory 52 and processor 51 can communicate through an internal interface.

[0154] The implementation principle and technical effects of the electronic device provided in this embodiment can be found in the foregoing embodiments, and will not be repeated here.

[0155] This application also provides a computer program product, including a computer program, which, when executed, implements the method steps as described in the above method embodiments. The specific implementation and technical effects are similar and will not be repeated here.

[0156] This application also provides a computer-readable storage medium storing computer-executable instructions. When the computer-executable instructions are executed, they are used to implement the method steps as described in the above method embodiments. The specific implementation methods and technical effects are similar and will not be repeated here.

[0157] The aforementioned computer-readable storage media can be implemented from any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read Only Memory (EEPROM), Erasable Programmable Read Only Memory (EPROM), Programmable Read Only Memory (PROM), Read Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The readable storage medium can be any available medium accessible to a general-purpose or special-purpose computer.

[0158] An exemplary readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can reside in an application-specific integrated circuit (ASIC). Alternatively, the processor and the readable storage medium can exist as discrete components in the insulation configuration of a multi-circuit overhead transmission line on the same tower.

[0159] The division of units is merely a logical functional division; in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0160] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0161] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0162] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0163] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0164] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope.

Claims

1. An insulation configuration method for a multi-circuit overhead transmission line on the same tower, characterized in that, include: The multidimensional parameters of each circuit in a multi-circuit overhead transmission line on the same tower are obtained. The multidimensional parameters include the voltage level, phase sequence arrangement, tower head position, and pollution level of the area where each circuit is located. Based on the aforementioned multidimensional parameters, the basic withstand requirements of each circuit for the insulator are evaluated. The basic tolerance requirements are differentiated and modified according to the tower head position of each circuit. Based on the revised withstand requirements, a differentiated insulation configuration scheme is determined for each of the circuits, the differentiated insulation configuration scheme including at least one of the number of insulator discs, insulator type and creepage distance.

2. The insulation configuration method for multi-circuit overhead transmission lines on the same tower according to claim 1, characterized in that, The tower head positions include the top, middle, and bottom layers of the tower; the differentiated modification of the foundation withstand requirements based on the tower head positions of each circuit includes: For the circuit located at the top layer, the number of insulator discs is increased by a first preset number based on the number of discs corresponding to the basic withstand requirement; For the circuit located at the bottom layer, under the premise of meeting the minimum insulation requirements, the number of insulator discs is reduced by a second preset number based on the number of discs corresponding to the basic withstand requirements; For the circuit located in the middle layer, the number of insulator discs is configured according to the basic withstand requirements.

3. The insulation configuration method for multi-circuit overhead transmission lines on the same tower according to claim 2, characterized in that, Before making differentiated adjustments to the basic tolerance requirements based on the tower head position of each of the circuits, the method further includes: Obtain the altitude of the areas traversed by each of the aforementioned loops; Based on the altitude of the areas traversed by each loop, the basic tolerance requirements of each loop are adjusted for high altitude.

4. The insulation configuration method for multi-circuit overhead transmission lines on the same tower according to claim 3, characterized in that, After making differentiated adjustments to the basic tolerance requirements based on the tower head position of each of the circuits, the method further includes: Based on the phase sequence arrangement of each circuit, determine whether the electromagnetic coupling effect strength between adjacent circuits is greater than or equal to a preset strength threshold. For circuits with adjacent phase sequences and electromagnetic coupling effect strength greater than or equal to the strength threshold, a third preset number of insulator discs is added to the current number of insulator discs.

5. The insulation configuration method for multi-circuit overhead transmission lines on the same tower according to any one of claims 1 to 4, characterized in that, The assessment of the basic withstand requirements of each circuit for insulators based on the multidimensional parameters includes: Based on the voltage level of each circuit, determine the withstand requirements for power frequency voltage, switching overvoltage, and lightning overvoltage of each circuit; Based on the phase sequence arrangement of each circuit, assess the level of electromagnetic coupling impact between adjacent circuits; Assess the lightning strike risk level of each circuit based on the tower head location of each circuit; Based on the pollution level of each circuit, and in accordance with the preset specifications, the minimum creepage distance of each circuit is determined using the creepage distance ratio method. The number of base plates of the insulator is determined based on the minimum creepage distance and the preset creepage distance of a single insulator plate; The basic withstand requirements are defined as the withstand requirements, the electromagnetic coupling influence level, the lightning strike risk level, the minimum creepage distance, and the number of basic plates.

6. The insulation configuration method for multi-circuit overhead transmission lines on the same tower according to any one of claims 1 to 4, characterized in that, After determining the differentiated insulation configuration scheme for each circuit based on the modified withstand requirements, the method further includes: The number of insulator discs in the differentiated insulation configuration schemes of each circuit is substituted into the lightning overvoltage withstand verification formula and the switching overvoltage withstand verification formula for withstand verification. If a target circuit fails the tolerance test, the number of insulator discs in the target circuit is increased until the target circuit passes the tolerance test.

7. An insulation configuration device for a multi-circuit overhead transmission line on the same tower, characterized in that, include: The acquisition module is used to acquire multi-dimensional parameters of each circuit in a multi-circuit overhead transmission line on the same tower. The multi-dimensional parameters include the voltage level, phase sequence arrangement, tower head position, and pollution level of the area where each circuit is located. An evaluation module is used to evaluate the basic withstand requirements of each circuit to the insulator based on the multidimensional parameters. A differential correction module is used to make differential corrections to the basic tolerance requirements based on the tower head position of each of the circuits. An insulation configuration module is used to determine a differentiated insulation configuration scheme for each circuit based on the modified withstand requirements. The differentiated insulation configuration scheme includes at least one of the following: number of insulator discs, insulator type, and creepage distance.

8. An electronic device, characterized in that, include: A processor, and a memory communicatively connected to the processor; The memory is used to store computer-executed instructions; The processor is configured to execute the computer execution instructions to implement the method as described in any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed, are used to implement the method as described in any one of claims 1 to 6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed, it implements the method as described in any one of claims 1 to 6.

Images