Electrode mounting device and ion implantation apparatus

Abstract

The application belongs to the technical field of ion implanters, and discloses an electrode mounting device and an ion implantation equipment. The electrode mounting device comprises a mounting bracket assembly and a plurality of clamping assemblies. The mounting bracket assembly is configured to be detachably connected to a chamber structure. The mounting bracket assembly comprises a mounting base and a plurality of sets of positioning mechanisms arranged on the mounting base. The plurality of sets of positioning mechanisms form a plurality of mounting positions. The plurality of mounting positions and the plurality of clamping assemblies are in one-to-one correspondence. The clamping assemblies are detachably connected to the positioning mechanisms and are correspondingly constrained in the mounting positions. The clamping assemblies have mounting cavities for positioning electrode plates. The plurality of clamping assemblies are used for clamping a plurality of electrode plates, so that the plurality of electrode plates are arranged in parallel and a predetermined distance is maintained between the plurality of electrode plates. The clamping assemblies are configured to be electrically connected to an external high-voltage power supply. The electrode mounting device can improve the cleaning and maintenance efficiency of the ion implantation equipment and improve the processing quality of the ion implantation equipment.

Description

Technical Field

[0001] This invention relates to the field of ion implanter technology, and more particularly to electrode mounting devices and ion implantation equipment. Background Technology

[0002] Ion implantation equipment is a crucial piece of equipment in wafer manufacturing, primarily used to implant ions into designated areas of the wafer to achieve predetermined requirements. The housing of the ion implantation equipment contains an ion source chamber, which houses four electrode plates: an accelerating electrode plate, an extracting electrode plate, a suppressing electrode plate, and a grounding electrode plate. These four electrode plates are parallel to each other and form an electromagnetic field to constrain the ion implantation trajectory.

[0003] Under high voltage, as the electrode plates are used over time, microparticles inevitably become introduced or generated within the ion source chamber. When these microparticles accumulate to a certain level, they adhere to the wafer surface during the process, resulting in wafer products that do not meet the process parameters. Therefore, regular cleaning and maintenance of the ion source chamber is necessary. Ion implantation equipment requires the disassembly and reassembly of four electrode plates during cleaning and maintenance. Existing technology provides a disassembly and reassembly structure with positioning holes at the top and bottom of the electrode plates. Two positioning pins support and hold the disassembled electrode plates in place. The two positioning pins are inserted into the upper and lower positioning holes respectively to ensure the four electrode plates are parallel. However, in addition to maintaining parallelism, the electrode plates also need to maintain proper spacing between adjacent plates. The electrode plates must be continuously moved along the positioning pins to adjust to the confirmed position, making alignment difficult. Furthermore, each electrode plate needs to be disassembled and reassembled individually, which is time-consuming and affects the cleaning and maintenance efficiency of the ion implantation equipment. Summary of the Invention

[0004] One object of the present invention is to provide an electrode mounting device that can solve the problems of the difficulty in adjusting and aligning the electrode plate in the existing electrode plate disassembly and assembly structure, and the long time required for disassembly and installation of the electrode plate.

[0005] To achieve this objective, the present invention employs the following technical solution:

[0006] An electrode mounting device is provided for positioning and mounting multiple electrode plates. The electrode mounting device includes a mounting bracket assembly and multiple clamping assemblies. The mounting bracket assembly is configured to be detachably connected to a chamber structure. The mounting bracket assembly includes a mounting base and multiple sets of positioning mechanisms disposed on the mounting base. The multiple sets of positioning mechanisms form multiple mounting positions. The multiple mounting positions correspond one-to-one with the multiple clamping assemblies. The clamping assemblies are detachably connected to the positioning mechanisms and constrained one-to-one with the mounting positions. The clamping assemblies have mounting cavities for positioning the electrode plates. The multiple clamping assemblies are respectively used to clamp the multiple electrode plates so that the multiple electrode plates are arranged parallel to each other and maintain a preset distance between the multiple electrode plates. The clamping assemblies are configured to be electrically connected to an external high-voltage power supply.

[0007] In one embodiment, the clamping assembly includes a first mounting base and a second mounting base spaced apart along the height direction of the electrode plate. The first mounting base has a first mounting groove, and the second mounting base has a second mounting groove. The openings of the first mounting groove and the second mounting groove are opposite to each other to form the mounting cavity. Both ends of the electrode plate are respectively embedded in the first mounting groove and the second mounting groove.

[0008] In one embodiment, both the first mounting groove and the second mounting groove are U-shaped grooves. The clamping height of the clamping assembly is formed between the bottom of the first mounting groove and the bottom of the second mounting groove. The limiting distance of the clamping assembly is formed between the first snap-fit ​​sidewall of the first card holder and the second snap-fit ​​sidewall of the second card holder. The dimension of the electrode plate along the height direction is greater than the limiting distance and less than the clamping height.

[0009] In one embodiment, the clamping assembly further includes an elastic positioning member disposed in one of the first mounting groove and the second mounting groove. The elastic positioning member is used to apply an elastic force to one end of the electrode plate so that the other end of the electrode plate abuts against the bottom of the other of the first mounting groove and the second mounting groove.

[0010] In one embodiment, the depth of the first mounting groove is greater than the depth of the second mounting groove, the elastic positioning member is disposed in the first mounting groove, the elastic positioning member has a compressed state and an extended state, and in the extended state the elastic positioning member pushes against the electrode plate so that the electrode plate abuts against the bottom of the second mounting groove;

[0011] The electrode plate can move toward the first card holder and compress the elastic positioning member so that the elastic positioning member forms the compressed state. When the elastic positioning member forms the compressed state, the other end of the electrode plate away from the first card holder is located outside the opening of the second mounting groove.

[0012] In one embodiment, a limiting structure is provided in the second mounting groove along the thickness direction of the electrode plate, the limiting structure being used to abut and constrain the electrode plate to move along the thickness direction.

[0013] In one embodiment, the positioning mechanism includes a plurality of positioning adjustment seats, which are movably disposed on the mounting base. The plurality of positioning adjustment seats form a plurality of mounting positions. The plurality of positioning adjustment seats and a plurality of clamping components correspond one-to-one. The clamping components are detachably connected to the positioning adjustment seats. The positioning adjustment seats are capable of reciprocating along a direction perpendicular to the electrode plates to adjust the preset spacing between the plurality of electrode plates.

[0014] In one embodiment, the mounting base is provided with a positioning side plate, which is parallel to the electrode plate, and the multiple spacings between the electrode plates and the positioning side plate are all different; the positioning mechanism further includes a telescopic adjustment rod, which extends in a direction perpendicular to the electrode plate, one end of the telescopic adjustment rod is connected to the positioning adjustment seat, and the other end is connected to the positioning side plate, and the length of the telescopic adjustment rod relative to the positioning side plate is variable to adjust the distance between the positioning adjustment seat and the positioning side plate.

[0015] In one embodiment, the mounting base is provided with a guide rail extending along the length of the telescopic adjusting rod, the positioning adjusting seat is slidably connected to the guide rail, and a plurality of the positioning adjusting seats are spaced apart on the guide rail; and / or,

[0016] The positioning adjustment seat includes a first clamping frame and a second clamping frame that are spaced apart and parallel to each other along the direction perpendicular to the electrode plate. A clamping groove is formed between the first clamping frame and the second clamping frame. The clamping assembly can be inserted into the first clamping frame and the second clamping frame through the opening of the clamping groove.

[0017] Another objective of this invention is to provide an ion implantation device with an electrode mounting device that solves the problems of difficult adjustment and alignment of the electrode plate in existing electrode plate disassembly and assembly structures, and the time-consuming disassembly and installation of the electrode plate, thereby improving the cleaning and maintenance efficiency of the ion implantation device.

[0018] To achieve this objective, the present invention employs the following technical solution in another aspect:

[0019] An ion implantation apparatus is provided, including the electrode mounting device as described above, the ion implantation apparatus further including a chamber structure, the mounting bracket assembly being detachably connected to the chamber structure.

[0020] The beneficial effects of this invention are:

[0021] The electrode mounting device provided by this invention includes a mounting bracket assembly and multiple clamping assemblies. The mounting bracket assembly is configured to be detachably connected to the chamber structure of an ion implantation device. The mounting bracket assembly includes a mounting base and multiple sets of positioning mechanisms disposed on the mounting base, forming multiple mounting positions. Each mounting position corresponds to one of the multiple clamping assemblies. The clamping assemblies are detachably connected to the positioning mechanisms and constrained to the mounting positions accordingly. Each clamping assembly has a mounting cavity for positioning electrode plates. The multiple clamping assemblies are used to clamp multiple electrode plates, ensuring that the electrode plates are arranged parallel to each other and maintain a preset distance between them. The clamping assemblies are configured to be electrically connected to an external high-voltage power supply. The electrode mounting device provided by this invention forms multiple mounting positions on the mounting base through the mounting bracket assembly and the multiple sets of positioning mechanisms disposed on the mounting base. When the clamping assemblies for clamping the electrode plates are constrained to the mounting positions, the positions of the electrode plates are fully confirmed. At this time, the multiple electrode plates are arranged parallel to each other and maintain a preset distance between them. The clamping assembly can be detached and installed from the positioning mechanism to clamp the electrode plates. The electrode plates are positioned on the clamping assembly through the mounting cavity, making adjustment and alignment easy. Moreover, the electrode mounting device forms a modular structure of multiple electrode plates through the mounting bracket assembly. This allows for the overall disassembly and installation of multiple electrode plates during the cleaning and maintenance of the ion implantation equipment, eliminating the need to disassemble and install multiple electrode plates one by one, thereby improving the cleaning and maintenance efficiency of the ion implantation equipment.

[0022] The ion implantation equipment provided by the present invention includes the above-mentioned electrode mounting device. The modular disassembly and assembly method of the electrode mounting device can improve the cleaning and maintenance efficiency of the ion implantation equipment and enhance the processing quality of the ion implantation equipment. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the electrode mounting device provided in an embodiment of the present invention;

[0024] Figure 2 This is a top view of the electrode mounting device provided in an embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure where the clamping assembly and the electrode plate are separated according to an embodiment of the present invention;

[0026] Figure 4This is a schematic diagram of the clamping assembly for clamping the electrode plate provided in an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the structure provided in the embodiment of the present invention, which shows how the electrode plate compresses the elastic positioning element.

[0028] In the picture:

[0029] 1. Mounting bracket assembly; 11. Mounting base; 111. Positioning side plate; 112. Guide slide rail; 12. Positioning mechanism; 121. Positioning adjustment seat; 1211. First clamping frame; 1212. Second clamping frame; 122. Telescopic adjustment rod;

[0030] 2. Clamping assembly; 21. First mounting base; 211. First mounting groove; 212. First snap-fit ​​sidewall; 22. Second mounting base; 221. Second mounting groove; 222. Second snap-fit ​​sidewall; 223. Limiting structure; 23. Elastic positioning element; 24. Electrode connection;

[0031] 100. Electrode plate. Detailed Implementation

[0032] Before explaining any implementation of this application in detail, it should be understood that this application is not limited to its application to the structural details and component arrangements set forth in the following description or shown in the above drawings.

[0033] In this application, the terms "comprising," "including," "having," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0034] In this application, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "and / or" relationship.

[0035] In this application, the terms "connection," "combination," "coupling," and "installation" can refer to direct connection, combination, coupling, or installation, or indirect connection, combination, coupling, or installation. For example, a direct connection refers to two parts or components being connected together without the need for an intermediary, while an indirect connection refers to two parts or components each being connected to at least one intermediary, with the connection achieved through the intermediary. Furthermore, "connection" and "coupling" are not limited to physical or mechanical connections or couplings, but can also include electrical connections or couplings.

[0036] In this application, those skilled in the art will understand that relative terms (e.g., “about,” “approximately,” “basically,” etc.) used in conjunction with quantities or conditions are to include the values ​​and have the meaning indicated by the context. For example, such relative terms include at least the degree of error associated with the measurement of a particular value, tolerances associated with the particular value due to manufacturing, assembly, use, etc. Such terms should also be considered as disclosing a range defined by the absolute values ​​of the two endpoints. Relative terms may refer to a certain percentage (e.g., 1%, 5%, 10% or more) of the indicated value. Numerical values ​​not using relative terms should also be disclosed as specific values ​​with tolerances. Furthermore, “basically” when expressing relative angular relationships (e.g., substantially parallel, substantially perpendicular) may refer to a certain degree (e.g., 1 degree, 5 degrees, 10 degrees or more) added to or subtracted from the indicated angle.

[0037] In this application, those skilled in the art will understand that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.

[0038] In this application, the directional terms "upper," "lower," "left," "right," "front," and "rear" are used to describe the orientation and positional relationships shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when an element is mentioned as being connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected through an intermediate element. It should also be understood that directional terms such as upper side, lower side, left side, right side, front side, and rear side not only represent positive orientation but can also be understood as lateral orientation. For example, "below" can include directly below, lower left, lower right, lower front, and lower rear.

[0039] The ion implantation equipment contains an ion source chamber with four electrode plates: an accelerating electrode plate, an extracting electrode plate, a suppressing electrode plate, and a grounding electrode plate. These four electrode plates are parallel to each other and form an electromagnetic field to constrain the ion implantation trajectory. Under high voltage, as the electrode plates are used over time, microparticles inevitably become introduced or generated within the ion source chamber. When these microparticles accumulate to a certain level, they adhere to the wafer surface during the process, resulting in wafer products that do not meet the process parameters. Therefore, regular cleaning and maintenance of the ion source chamber is necessary. The cleaning and maintenance of the ion implantation equipment requires the disassembly and reassembly of the four electrode plates. Existing technology provides a disassembly and reassembly method that involves positioning holes at the top and bottom of the electrode plates. Two positioning pins are used to support and hold the disassembled electrode plates. The two positioning pins are inserted into the upper and lower positioning holes respectively to ensure the parallelism of the four electrode plates. In addition to maintaining parallelism, the electrode plates also need to maintain proper spacing between adjacent plates. The electrode plates must be continuously moved along the positioning pins to adjust to the confirmed position, making alignment difficult. Furthermore, the electrode plates need to be disassembled and reassembled one by one, which takes a long time and affects the cleaning and maintenance efficiency of the ion implantation equipment.

[0040] To address the aforementioned problems, embodiments of the present invention provide an electrode mounting device and an ion implantation equipment to improve the cleaning and maintenance efficiency of the ion implantation equipment.

[0041] like Figures 1 to 5 As shown, this embodiment first provides an electrode mounting device for positioning and mounting multiple electrode plates 100. The electrode mounting device includes a mounting bracket assembly 1 and multiple clamping assemblies 2. The mounting bracket assembly 1 is configured to be detachably connected to the chamber structure of an ion implantation device (not shown in the figure). The mounting bracket assembly 1 includes a mounting base 11 and multiple sets of positioning mechanisms 12 disposed on the mounting base 11, forming multiple mounting positions. The multiple mounting positions and multiple clamping assemblies 2 correspond one-to-one. The clamping assemblies 2 are detachably connected to the positioning mechanisms 12 and are constrained to the mounting positions one-to-one. The clamping assemblies 2 have mounting cavities for positioning the electrode plates 100. The multiple clamping assemblies 2 are respectively used to clamp the multiple electrode plates 100 so that the multiple electrode plates 100 are arranged parallel to each other and maintain a preset distance between the multiple electrode plates 100. The clamping assemblies 2 are configured to be electrically connected to an external high-voltage power supply.

[0042] The electrode mounting device provided in this embodiment of the invention forms multiple mounting positions on the mounting base 11 through the mounting base 11 of the mounting bracket assembly 1 and multiple sets of positioning mechanisms 12 disposed on the mounting base 11. When the clamping assembly 2 for clamping the electrode plate 100 is constrained to the mounting position, the position of the electrode plate 100 is completely confirmed. At this time, the multiple electrode plates 100 are arranged parallel to each other, and a preset distance is maintained between the multiple electrode plates 100. The clamping assembly 2 can be disassembled and assembled from the positioning mechanism 12 to clamp the electrode plate 100. The electrode plate 100 is positioned on the clamping assembly 2 through the mounting cavity, which is easy to adjust and align. Moreover, the electrode mounting device forms a modular structure of multiple electrode plates 100 through the mounting bracket assembly 1, which can realize the overall disassembly and installation of multiple electrode plates 100 during the cleaning and maintenance of the ion implantation equipment, without having to disassemble and assemble multiple electrode plates 100 one by one, thereby improving the cleaning and maintenance efficiency of the ion implantation equipment.

[0043] In this embodiment, the ion implantation device has four electrode plates 100, and the electrode mounting device is provided with four sets of positioning mechanisms 12. In other embodiments, the number of electrode plates 100 can be adjusted adaptively according to different processing technologies of the ion implantation device, and is not limited to the figures of this embodiment.

[0044] The clamping assembly 2 includes a first mounting base 21 and a second mounting base 22 spaced apart along the height direction of the electrode plate 100. The first mounting base 21 has a first mounting groove 211, and the second mounting base 22 has a second mounting groove 221. The openings of the first mounting groove 211 and the second mounting groove 221 are positioned opposite each other to form a mounting cavity. Both ends of the electrode plate 100 are respectively embedded in the first mounting groove 211 and the second mounting groove 221, thereby mounting the electrode plate 100 on the clamping assembly 2. The first mounting base 21 and the second mounting base 22 stably constrain the electrode plate 100 without obstructing the working area of ​​the electrode plate 100. Electrode connecting wires 24 are provided on both the first mounting base 21 and the second mounting base 22 to form an electrical connection with an external high-voltage power supply.

[0045] It should be noted that for the vertically arranged electrode plate 100, its height can be either horizontal or vertical. Figure 1 The vertical direction is taken as the height direction of electrode plate 100 as an example.

[0046] Both the first mounting groove 211 and the second mounting groove 221 are U-shaped grooves. The bottom of the first mounting groove 211 and the bottom of the second mounting groove 221 form the clamping height of the clamping assembly 2. The first engaging sidewall 212 of the first card holder 21 and the second engaging sidewall 222 of the second card holder 22 form a limiting distance of the clamping assembly 2. The dimension of the electrode plate 100 along the height direction is greater than the limiting distance and less than the clamping height. Figure 3 As shown in the figure, H1 is the clamping height of the clamping assembly 2, H2 is the limiting distance of the clamping assembly 2, and H3 is the dimension in the height direction of the electrode plate 100, where H2 < H3 < H1. This ensures that when the electrode plate 100 is located in the mounting cavity, the first snap-fit ​​sidewall 212 and the second snap-fit ​​sidewall 222 constrain the electrode plate 100, preventing it from falling off. Furthermore, the clamping assembly 2 has sufficient clamping height to facilitate the assembly and disassembly of the electrode plate 100. The electrode plate 100, tilted relative to the clamping assembly 2, can enter or exit the mounting cavity through the space between the first snap-fit ​​sidewall 212 and the second snap-fit ​​sidewall 222, achieving rapid assembly and disassembly of the electrode plate 100 with high efficiency.

[0047] Since the clamping height between the bottom of the first mounting groove 211 and the bottom of the second mounting groove 221 is greater than the dimension of the electrode plate 100 along the height direction, in order to reduce the shaking of the electrode plate 100 in the mounting cavity, the clamping assembly 2 also includes an elastic positioning member 23. The elastic positioning member 23 is disposed in one of the first mounting groove 211 and the second mounting groove 221. The elastic positioning member 23 is used to apply an elastic force to one end of the electrode plate 100 so that the other end of the electrode plate 100 abuts against the bottom of the other of the first mounting groove 211 and the second mounting groove 221. In this way, the electrode plate 100 is completely positioned between the elastic positioning member 23 and the bottom of the groove along the height direction and will not shake.

[0048] The depth of the first mounting groove 211 is greater than the depth of the second mounting groove 221, and the elastic positioning member 23 is disposed within the first mounting groove 211. The elastic positioning member 23 has a compressed state and an extended state. In the extended state, the elastic positioning member 23 pushes against the electrode plate 100, causing the electrode plate 100 to abut against the bottom of the second mounting groove 221. The electrode plate 100 is completely positioned along its height between the elastic positioning member 23 and the bottom of the second mounting groove 221, thus achieving the installation of the electrode plate 100. Figure 4 As shown. When it is necessary to remove the electrode plate 100, the electrode plate 100 can move toward the first card holder 21 and compress the elastic positioning member 23, so that the elastic positioning member 23 is in a compressed state, as shown. Figure 5 As shown; when the elastic positioning member 23 is compressed, the other end of the electrode plate 100 away from the first card seat 21 is located outside the opening of the second mounting groove 221, at which time the electrode plate 100 can be removed from the mounting cavity.

[0049] The elastic positioning element 23 is a compression spring. One end of the compression spring is connected to the bottom of the first mounting groove 211, and the other end of the compression spring is provided with a pressure plate. The pressure plate is used to contact the electrode plate 100, increasing the contact area between the electrode plate 100 and the elastic positioning element 23, improving the positional stability of the electrode plate 100, and preventing the compression spring from scratching the electrode plate 100. In order to reduce the additional force exerted on the elastic positioning element 23 by the self-weight of the installed electrode plate 100, the first retainer 21 is located above the electrode plate 100, and the second retainer 22 is located below the electrode plate 100.

[0050] It should be noted that during both the installation and removal of the electrode plate 100, the electrode plate 100 needs to be in an inclined state. Furthermore, to ensure that the mounting cavity can accommodate the inclined electrode plate 100 and that the inclined electrode plate 100 can be adjusted to a vertical state within the mounting cavity, the width of the first mounting groove 211 and the width of the second mounting groove 221 are both greater than the thickness of the electrode plate 100. Here, the width of the first mounting groove 211 and the width of the second mounting groove 221 are relative to the thickness direction of the electrode plate 100. When the electrode plate 100 needs to be installed on the clamping assembly 2, the electrode plate 100 is adjusted to an inclined state. The inclined electrode plate 100 and the second snap-fit ​​sidewall 222 form a clearance, allowing the electrode plate 100 to partially enter the mounting cavity in an inclined state. The electrode plate 100 moves toward the first latch 21 and compresses the elastic positioning member 23. During the movement, the electrode plate 100 is adjusted to a vertical state until the elastic positioning member 23 is compressed. At this time, the lower end of the electrode plate 100 is located outside the opening of the second mounting groove 221. Then, the electrode plate 100 is moved toward the second latch 22 to release the elastic positioning member 23 until the electrode plate 100 abuts the bottom of the second mounting groove 221. The electrode plate 100 is completely positioned in the height direction between the elastic positioning member 23 and the bottom of the second mounting groove 221.

[0051] The disassembly process of the electrode plate 100 on the clamping assembly 2 is the reverse of the installation process described above, as follows: Move the electrode plate 100 toward the first card holder 21 and compress the elastic positioning member 23. When the elastic positioning member 23 is in a compressed state, the other end of the electrode plate 100 away from the first card holder 21 is located outside the opening of the second mounting groove 221. At this time, the electrode plate 100 can be adjusted to an inclined state so that the lower part of the electrode plate 100 is located outside the mounting cavity. Then, the electrode plate 100, which is in an inclined state, is moved in the direction of relaxing the elastic positioning member 23 until the upper part of the electrode plate 100 is disengaged from the first mounting groove 211 and all the electrode plates 100 are moved outside the mounting cavity.

[0052] The above-mentioned disassembly and assembly process of electrode plate 100 is relatively simple and the constraint positioning is reliable, which improves the ease of use and reliability of electrode installation device.

[0053] To prevent the electrode plate 100 from moving along its thickness direction within the mounting cavity, a limiting structure 223 is provided in the second mounting groove 221. Along the thickness direction of the electrode plate 100, the limiting structure 223 serves to abut and constrain the electrode plate 100's movement along the thickness direction. For example, the bottom of the second mounting groove 221 has two positioning protrusions extending towards the first mounting groove 211, and the distance between the two positioning protrusions is the same as the thickness of the electrode plate 100. When the two sides of the electrode plate 100 abut against the two positioning protrusions respectively, the electrode plate 100 is constrained along the thickness direction on the second mounting groove 221, preventing the distance between the electrode plates 100 from being affected by the shaking of the electrode plate 100.

[0054] Two support rods (not shown in the figure) are provided between the first clamping seat 21 and the second clamping seat 22. The two ends of the support rods are connected to the first clamping seat 21 and the second clamping seat 22 respectively, and the two support rods are respectively located on both sides of the electrode plate 100 in the width direction. Through the connection of the two support rods, the clamping assembly 2 forms a stable frame structure to ensure the positional accuracy of the electrode plate 100.

[0055] In some cases, the ion implantation equipment adjusts the processing parameters and uses different ion sources. In this case, it is necessary to adaptively adjust the preset spacing between multiple electrode plates 100. Therefore, the positioning mechanism 12 includes multiple positioning adjustment seats 121, which are movably disposed on the mounting base 11. The multiple positioning adjustment seats 121 form multiple mounting positions, and each of the multiple positioning adjustment seats 121 corresponds to a multiple clamping assembly 2. The clamping assembly 2 is detachably connected to the positioning adjustment seat 121. The positioning adjustment seat 121 can reciprocate in a direction perpendicular to the electrode plate 100, thereby driving the clamping assembly 2 to reciprocate in a direction perpendicular to the electrode plate 100, so as to adjust the preset spacing between the multiple electrode plates 100.

[0056] Specifically, the mounting base 11 is provided with a positioning side plate 111, which is parallel to the electrode plates 100. The positioning side plate 111 serves as the mounting reference, and the multiple spacings between the electrode plates 100 and the positioning side plate 111 are all unequal. It should be noted that the spacing between two adjacent electrode plates 100 can be equal or unequal; this embodiment does not impose specific limitations and can be adjusted according to the process parameters of the ion implantation equipment. The positioning mechanism 12 also includes a telescopic adjustment rod 122, the length of which extends perpendicular to the electrode plates 100. One end of the telescopic adjustment rod 122 is connected to the positioning adjustment seat 121, and the other end is connected to the positioning side plate 111. The length of the telescopic adjustment rod 122 relative to the positioning side plate 111 is variable, thereby adjusting the distance between the positioning adjustment seat 121 and the positioning side plate 111, and thus adjusting the distance between the electrode plates 100 and the positioning side plate 111, thereby achieving adjustment of the spacing between the four electrode plates 100.

[0057] Because the distances between the multiple electrode plates 100 and the positioning side plate 111 are not equal, the lengths of the telescopic adjustment rods 122 corresponding to each electrode plate 100 are also different, such as Figure 2 As shown. To avoid interference during the adjustment process of the telescopic adjustment rod 122, multiple telescopic adjustment rods 122 are parallel to each other and mounted above the positioning adjustment seat 121.

[0058] The length adjustment method of the telescopic adjustment rod 122 can be set with reference to the existing technology, which is not the focus of this application and will not be described in detail here.

[0059] To ensure the smooth movement of the positioning adjustment seat 121 on the mounting base 11, the mounting base 11 is provided with a guide slide rail 112. The guide slide rail 112 extends along the length of the telescopic adjustment rod 122. The guide slide rail 112 and the telescopic adjustment rod 122 are respectively located on the upper and lower sides of the positioning adjustment seat 121.

[0060] The positioning adjustment seat 121 is slidably connected to the guide slide rail 112, and multiple positioning adjustment seats 121 are spaced apart on the guide slide rail 112. The sliding connection between the positioning adjustment seat 121 and the guide slide rail 112 reduces the moving resistance of the positioning adjustment seat 121 and ensures that the positioning adjustment seat 121 will not jam or tilt during movement.

[0061] To enable quick assembly and disassembly of the clamping assembly 2, the positioning adjustment seat 121 includes a first clamping frame 1211 and a second clamping frame 1212 spaced apart and parallel to each other along the direction perpendicular to the electrode plate 100. A clamping groove is formed between the first clamping frame 1211 and the second clamping frame 1212, with the opening of the clamping groove facing the side of the electrode mounting device. The clamping assembly 2 can be inserted between the first clamping frame 1211 and the second clamping frame 1212 through the opening of the clamping groove from the side of the electrode mounting device. In this way, the clamping assembly 2 can be assembled and disassembled without disassembling the positioning mechanism 12, which is more convenient. The positioning adjustment seat 121 is provided with a limit block on the opposite side of the opening. When the clamping assembly 2 abuts against the limit block, it indicates that it is installed in place.

[0062] The present invention further provides an ion implantation device, which includes the electrode mounting device as described in any of the above embodiments. The ion implantation device also includes a chamber structure, and the mounting bracket assembly 1 is detachably connected to the chamber structure. The electrode mounting device forms multiple mounting positions on the mounting base 11 through the mounting base 11 of the mounting bracket assembly 1 and multiple sets of positioning mechanisms 12 disposed on the mounting base 11. When the clamping assembly 2 for clamping the electrode plate 100 is constrained to the mounting position, the position of the electrode plate 100 is completely confirmed. At this time, the multiple electrode plates 100 are arranged parallel to each other, and a preset distance is maintained between the multiple electrode plates 100. The clamping assembly 2 can be detached from the positioning mechanism 12 to clamp the electrode plate 100. The electrode plate 100 is positioned on the clamping assembly 2 through the mounting cavity, which is easy to adjust and align. Moreover, the electrode mounting device forms a modular structure of multiple electrode plates 100 through the mounting bracket assembly 1, which can realize the overall disassembly and installation of multiple electrode plates 100 during the cleaning and maintenance of the ion implantation equipment, without having to disassemble and install multiple electrode plates 100 one by one, thereby improving the cleaning and maintenance efficiency of the ion implantation equipment and enhancing the processing quality of the ion implantation equipment.

[0063] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. An electrode mounting device for positioning and mounting multiple electrode plates (100), characterized in that, The electrode mounting device includes a mounting bracket assembly (1) and multiple clamping assemblies (2). The mounting bracket assembly (1) is configured to be detachably connected to the chamber structure. The mounting bracket assembly (1) includes a mounting base (11) and multiple sets of positioning mechanisms (12) disposed on the mounting base (11). The multiple sets of positioning mechanisms (12) form multiple mounting positions. The multiple mounting positions correspond one-to-one with the multiple clamping assemblies (2). The clamping assemblies (2) are detachably connected to the positioning mechanisms (12) and constrained one-to-one with the mounting positions. The clamping assemblies (2) have mounting cavities for positioning the electrode plates (100). The multiple clamping assemblies (2) are respectively used to clamp the multiple electrode plates (100) so that the multiple electrode plates (100) are arranged parallel to each other and a preset distance is maintained between the multiple electrode plates (100). The clamping assemblies (2) are configured to be electrically connected to an external high-voltage power supply.

2. The electrode mounting device according to claim 1, characterized in that, The clamping assembly (2) includes a first mounting base (21) and a second mounting base (22) spaced apart along the height direction of the electrode plate (100). The first mounting base (21) has a first mounting groove (211), and the second mounting base (22) has a second mounting groove (221). The openings of the first mounting groove (211) and the second mounting groove (221) are arranged opposite to each other to form the mounting cavity. Both ends of the electrode plate (100) are respectively embedded in the first mounting groove (211) and the second mounting groove (221).

3. The electrode mounting device according to claim 2, characterized in that, Both the first mounting groove (211) and the second mounting groove (221) are U-shaped grooves. The clamping height of the clamping assembly (2) is formed between the bottom of the first mounting groove (211) and the bottom of the second mounting groove (221). The limiting distance of the clamping assembly (2) is formed between the first snap-fit ​​sidewall (212) of the first card holder (21) and the second snap-fit ​​sidewall (222) of the second card holder (22). The dimension of the electrode plate (100) along the height direction is greater than the limiting distance and less than the clamping height.

4. The electrode mounting device according to claim 3, characterized in that, The clamping assembly (2) further includes an elastic positioning member (23), which is disposed in one of the first mounting groove (211) and the second mounting groove (221). The elastic positioning member (23) is used to apply an elastic force to one end of the electrode plate (100) so that the other end of the electrode plate (100) abuts against the bottom of the other of the first mounting groove (211) and the second mounting groove (221).

5. The electrode mounting device according to claim 4, characterized in that, The depth of the first mounting groove (211) is greater than the depth of the second mounting groove (221). The elastic positioning member (23) is disposed in the first mounting groove (211). The elastic positioning member (23) has a compressed state and an extended state. In the extended state, the elastic positioning member (23) pushes against the electrode plate (100) so that the electrode plate (100) abuts against the bottom of the second mounting groove (221). The electrode plate (100) can move toward the first card holder (21) and compress the elastic positioning member (23) so that the elastic positioning member (23) forms the compressed state. When the elastic positioning member (23) forms the compressed state, the other end of the electrode plate (100) away from the first card holder (21) is located outside the opening of the second mounting groove (221).

6. The electrode mounting device according to claim 5, characterized in that, A limiting structure (223) is provided in the second mounting groove (221). Along the thickness direction of the electrode plate (100), the limiting structure (223) is used to abut and constrain the electrode plate (100) to move along the thickness direction.

7. The electrode mounting device according to claim 1, characterized in that, The positioning mechanism (12) includes a plurality of positioning adjustment seats (121), which are movably disposed on the mounting base (11). The plurality of positioning adjustment seats (121) form a plurality of mounting positions. The plurality of positioning adjustment seats (121) correspond one-to-one with a plurality of clamping components (2). The clamping components (2) are detachably connected to the positioning adjustment seats (121). The positioning adjustment seats (121) can reciprocate along a direction perpendicular to the electrode plate (100) to adjust the preset distance between the plurality of electrode plates (100).

8. The electrode mounting device according to claim 7, characterized in that, The mounting base (11) is provided with a positioning side plate (111), which is parallel to the electrode plate (100), and the multiple spacings between the multiple electrode plates (100) and the positioning side plate (111) are all different; the positioning mechanism (12) also includes a telescopic adjustment rod (122), which extends in a direction perpendicular to the electrode plate (100), one end of which is connected to the positioning adjustment seat (121), and the other end is connected to the positioning side plate (111). The length of the telescopic adjustment rod (122) relative to the positioning side plate (111) is variable to adjust the distance between the positioning adjustment seat (121) and the positioning side plate (111).

9. The electrode mounting device according to claim 8, characterized in that, The mounting base (11) is provided with a guide rail (112), which extends along the length of the telescopic adjusting rod (122). The positioning adjusting seat (121) is slidably connected to the guide rail (112), and multiple positioning adjusting seats (121) are spaced apart on the guide rail (112); and / or, The positioning adjustment seat (121) includes a first clamping frame (1211) and a second clamping frame (1212) that are spaced apart and parallel to each other along the direction perpendicular to the electrode plate (100). A clamping groove is formed between the first clamping frame (1211) and the second clamping frame (1212). The clamping assembly (2) can be inserted into the first clamping frame (1211) and the second clamping frame (1212) through the opening of the clamping groove.

10. An ion implantation apparatus, characterized in that, Including the electrode mounting device as described in any one of claims 1-9, the ion implantation device further includes a chamber structure, and the mounting bracket assembly (1) is detachably connected to the chamber structure.

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