A high-power synthetic final power amplifier module and assembly method

Abstract

The application relates to a large-power synthesis final-stage power amplifier module and an assembling method in the field of radio frequency microwave systems. The method comprises the following steps: S1, locking and connecting an amplification PCB board and a copper block; S2, welding the pin of the power amplifier tube to the amplification PCB board; S3, arranging radio frequency connectors at the front and back ends of the amplification PCB board, and covering a cover plate; S4, connecting the final-stage power amplifier module to a test link; S5, acquiring the gain, power and phase indexes of the final-stage power amplifier module through the test link, and screening multiple final-stage power amplifier modules; and S6, removing the cover plate and the radio frequency connectors, and assembling the screened multiple final-stage power amplifier modules into the same large-power microwave solid-state source. The application independently completes the gain, power and phase tests and screening before assembling, avoids the low synthesis efficiency caused by individual differences and welding discreteness, improves the multi-path synthesis efficiency and stability, realizes one-time success in assembling, and shortens the debugging period.

Description

Technical Field

[0001] This invention relates to the field of radio frequency microwave systems, and more specifically, to a high-power combining final stage power amplifier module and its assembly method. Background Technology

[0002] High-power microwave solid-state sources are indispensable core power components in radio frequency microwave systems. With the technological development of solid-state semiconductor devices, high-power microwave solid-state sources have gradually replaced vacuum tubes such as magnetrons, traveling wave tubes, and backward wave tubes, and have been widely applied in industrial heating, medical equipment, and home appliances. These solid-state sources typically generate a low-power excitation signal from a signal source, which is then amplified step by step by a multi-stage amplifier circuit before being output. However, the output power of a single final-stage power amplifier tube is generally limited to the kilowatt level. High-power microwave solid-state sources with output power of kilowatts or more must use multiple final-stage power amplifier tubes for amplification and power combining to meet the high-power output requirements.

[0003] Power combining technology has strict requirements for power and phase consistency of the input signals of each branch. That is, the signals participating in the combining need to be close in power and phase. However, due to the inherent individual differences in semiconductor manufacturing process, the power gain and phase response of the final stage power amplifier tubes are discrete. At the same time, there are also inconsistencies in the soldering process between the final stage amplifier PCB and the pins of the power amplifier tubes. These factors cause the actual power and phase of the signals of each branch to deviate from the ideal value. The current production method usually directly installs multiple final stage power amplifier tubes into the same high-power microwave solid-state source system. Before assembly, there is a lack of independent testing, screening and adjustment of individual final stage power amplifier modules. After direct assembly, it is very easy to cause problems such as reduced combining efficiency and deterioration of system stability due to inconsistency in power gain and phase. Moreover, it is difficult to achieve effective compensation through whole-system debugging.

[0004] Therefore, in the process of multi-tube synthesis assembly of high-power microwave solid-state sources, the existing technology has the problem of difficulty in controlling the individual differences of the final stage power amplifier tubes and the discreteness of the welding process. This problem directly leads to low power synthesis efficiency and poor system stability. In addition, there is a lack of effective means to pre-test, screen and phase adjust the final stage module before the whole machine is assembled, resulting in technical defects such as low assembly success rate, long debugging cycle and poor module versatility. Summary of the Invention

[0005] To address the shortcomings of the prior art, this invention provides a high-power combining final-stage power amplifier module and its assembly method. The method involves locking an amplification PCB board to a grooved copper block, sintering the bottom of the power amplifier tube within the groove, and soldering the tube pins to pads on the amplification PCB board. Radio frequency connectors are located at the front and rear ends of the amplification PCB board, and a cover plate is placed over the amplification PCB board and the copper block. This integrates the final-stage power amplifier tube and related components into an independent, detachable final-stage power amplifier module. This module connects to a test link via the front and rear radio frequency connectors, independently performing gain, power, and phase testing and screening before being installed with a high-power microwave solid-state source. This solves the problem of uncontrollable individual differences and soldering dispersion caused by direct installation of the final-stage power amplifier tube in the prior art, avoids the decrease in combining efficiency and stability caused by inconsistent power gain and phase after installation, improves the success rate of multi-tube combining assembly, and shortens the debugging cycle.

[0006] The technical solution of this invention is as follows: In a first aspect, a high-power assembly method, the method comprising: S1, lock the enlarged PCB board to the copper block with grooves; S2, sinter the bottom of the power amplifier tube into the groove, and solder the pins of the power amplifier tube to the pads of the amplifier PCB board; S3, radio frequency connectors are provided at both ends of the amplification PCB board, and a cover plate is placed on top of the amplification PCB board and the copper block; S4, connect the final stage power amplifier module to the test link. The test link includes a vector network analyzer PORT1, a pre-drive amplifier, a drive amplifier, the final stage power amplifier module, an attenuator, and a vector network analyzer PORT2. The vector network analyzer PORT1 is connected to the input terminals of the pre-drive amplifier and the drive amplifier. The output terminals of the pre-drive amplifier and the drive amplifier are connected to the input terminal of the final stage power amplifier module. The output terminal of the final stage power amplifier module is connected to the input terminal of the attenuator. The output terminal of the attenuator is connected to PORT2. S5, obtain the gain, power, and phase parameters of the final stage power amplifier module through the test link, and filter multiple final stage power amplifier modules based on the gain, power, and phase parameters; S6, remove the cover plate and the RF connector, and install the selected multiple final stage power amplifier modules into the same high-power microwave solid-state source.

[0007] In this invention, the locking connection in S1 can also include screw locking, positioning pin insertion, and thermally conductive adhesive bonding; the bottom sintering in S2 includes tin-lead solder sintering / silver paste sintering / gold-tin eutectic sintering soldering; the pin electrical connection in S2 includes: soldering / ultrasonic welding / conductive adhesive bonding. Specifically, the metal flange at the bottom of the power amplifier tube is embedded in the copper block groove, and the gold-tin solder sheet is placed between the bottom surface of the flange and the bottom surface of the groove, and heated to the eutectic temperature to form a sintered layer.

[0008] As a preferred method, in S1, the copper block is connected to the enlarged PCB board by screw locking.

[0009] As a preferred method, in S3, an extension wire is provided at the front end of the amplification PCB board and in front of the power amplifier tube.

[0010] As a preferred method, in S3, adjusting the transmission path length of the extended wire is used to achieve phase offset compensation between modules.

[0011] Secondly, a high-power combining final stage power amplifier module, based on the aforementioned high-power combining assembly method, the module comprising: Enlarged PCB board; A copper block, which is locked to the enlarged PCB board, and the copper block is provided with a groove; A power amplifier tube, the bottom of which is sintered in the groove, and the pins of which are soldered to the pads of the amplifier PCB board; Radio frequency connectors are located at the front and rear ends of the amplification PCB board; A cover plate is placed over the enlarged PCB board and the copper block.

[0012] As a preferred embodiment, the copper block and the enlarged PCB board are provided with corresponding screw holes and screws.

[0013] As a preferred embodiment, the bottom of the power amplifier tube is sintered into the groove by soldering, and the pins of the power amplifier tube are soldered to the pads of the amplifier PCB board by soldering.

[0014] More specifically, the groove is formed on the side surface of the copper block facing the amplification PCB board, the outline shape of the groove matches the bottom outline of the power amplifier tube, and the depth of the groove is adapted to the bottom thickness of the power amplifier tube; the bottom surface of the groove is a flat surface, and there is a gap between the side wall of the groove and the bottom side wall of the power amplifier tube; the bottom of the power amplifier tube is the bottom surface of a metallized flange, the bottom of the power amplifier tube is embedded in the groove, and the lower surface of the flange bottom surface is in contact with the bottom surface of the groove; the tube pins of the power amplifier tube extend parallel from the side of the power amplifier tube, and the tube pins are in contact with the pads on the upper surface of the amplification PCB board.

[0015] As a preferred embodiment, the RF connector includes an input RF connector and an output RF connector, with the input RF connector located at the front end of the amplification PCB board and the output RF connector located at the rear end of the amplification PCB board.

[0016] As a preferred embodiment, the system also includes an extension cable located at the front end of the amplifier PCB board, in front of the power amplifier tube.

[0017] More specifically, the extension wire is used to change the physical or electrical length of the radio frequency signal transmission path to introduce a controllable phase offset; the extension wire includes a sliding joint or telescopic structure for adjusting the mechanical length, or includes a variable loading element for adjusting the electrical length; during the testing phase, the phase index of the final stage power amplifier module is brought closer to a preset target value by adjusting the extension wire, and the multiple final stage power amplifier modules after phase compensation are used to reduce the difficulty of pairing and screening and improve the power combining efficiency after being installed in the same high-power microwave solid-state source.

[0018] As a preferred embodiment, the RF connector is detachably connected to the amplification PCB board; the cover plate is detachably connected to the copper block.

[0019] More specifically, the RF connector includes an input RF connector and an output RF connector. The input RF connector is an SMA type connector, and the output RF connector is an N type connector. Both the input RF connector and the output RF connector are screwed to the front and rear ends of the amplification PCB board via a threaded structure. During testing, the RF connector is used to connect with external test cables. After screening, the RF connector is used to unscrew and remove. The cover plate is secured to the upper surface edge of the copper block by multiple screws. The cover plate is used to cover and protect the power amplifier tube and solder joint area during the testing phase. After removing the cover plate, the final stage power amplifier module is used to embed the synthesis cavity of a high-power microwave solid-state source.

[0020] According to the above-described solution, the beneficial effects of this invention are as follows: This invention connects an amplification PCB board to a grooved copper block, sintersects the bottom of the power amplifier tube within the groove, and solders the tube pins to the pads on the amplification PCB board. RF connectors are placed at both ends of the amplification PCB board and covered with a cover plate to form an independent final-stage power amplifier module. This module is connected to a test link consisting of a vector network analyzer PORT1, a pre-drive amplifier, a drive amplifier, the final-stage power amplifier module, an attenuator, and a vector network analyzer PORT2 to independently perform gain, power, and phase performance tests. Based on the test performance, multiple final-stage power amplifier modules are screened, and modules with similar power, phase, and gain are grouped into the same configuration. For pairing, an extension wire is set at the front end of the amplification PCB board and before the power amplifier tube to change the transmission path length and introduce a controllable phase offset for fine-tuning phase indicators and reducing pairing difficulty. After screening, the cover plate and RF connector are removed and the paired modules are installed into the same high-power microwave solid-state source. This assembly method is used to pre-test and screen the final stage module before the whole machine is assembled, so as to reduce the risk of low synthesis efficiency and poor stability caused by individual differences of the final stage power amplifier tube and the discreteness of the welding process. It is used to improve the efficiency of multi-channel power synthesis and system stability, and to achieve successful assembly of the final stage module on the first try and shorten the whole machine debugging cycle. The high-power combining final stage power amplifier module of the present invention includes an amplification PCB board, a copper block with grooves that is locked to the amplification PCB board, a power amplifier tube with its bottom sintered in the grooves and its pins soldered to the pads of the amplification PCB board, radio frequency connectors located at the front and rear ends of the amplification PCB board and connected by a threaded structure, a cover plate covering the amplification PCB board and the copper block and fastened by screws, and an extension wire located at the front end of the amplification PCB board and before the power amplifier tube. This module is used to independently complete gain, power and phase index tests by connecting to a test link through the front and rear radio frequency connectors, to introduce a controllable phase offset through the extension wire to fine-tune the phase index, and to remove the radio frequency connectors and cover plate after screening and embed the combining cavity of a high-power microwave solid-state source. This independent and detachable modular structure is used to support the pre-testing and screening process before assembly to ensure that the power, phase and gain indexes of multiple final stage power amplifier modules installed in the whole machine are close to consistent and to improve the combining efficiency. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0022] Figure 2 This is a magnified three-dimensional structural diagram of a portion of the PCB board according to the present invention.

[0023] Figure 3 This is an enlarged side view of the PCB board structure of the present invention.

[0024] Figure 4 for Figure 3 A magnified view of the local structure.

[0025] Figure 5 A schematic diagram of the front structure of the extension wire.

[0026] Figure 6 For corresponding Figure 2 A side sectional view.

[0027] 1. Cover plate; 2. Amplification PCB board; 3. Copper block; 4. Final stage power amplifier tube; 5. Input RF connector; 6. Output RF connector; 7. Pin; 8. Groove; 9. Extension cable. Detailed Implementation

[0028] To better understand the purpose, technical solution, and technical effects of this invention, the invention will be further explained and described below in conjunction with the accompanying drawings and embodiments. It should be noted that similar reference numerals and letters in the following drawings indicate similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. It is also stated that the embodiments described below are only for explaining this invention and are not intended to limit this invention.

[0029] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is referred to as "connected to" another component, it can be directly connected to the other component or there may be an intermediate component.

[0030] The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product is usually placed when in use, or the orientation or positional relationship in which a person skilled in the art would normally understand it, or the orientation or positional relationship in which the product is usually placed when in use. It is only for the purpose of facilitating the description of this application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Example

[0031] like Figures 1-6 As shown, this embodiment describes a high-power combining final stage power amplifier module and its assembly method.

[0032] Specifically, a high-power assembly method includes the following steps: Connection between copper block 3 and amplification PCB 2 and structure of groove 8: The amplification PCB 2 is locked and connected to the copper block 3 with groove 8, so that the pad area of ​​the amplification PCB 2 corresponds to the opening position of the groove 8 of the copper block 3; the side of the copper block 3 away from the groove 8 is kept flat to fit the heat dissipation surface of the whole machine; the copper block 3 and the amplification PCB 2 are provided with corresponding screw holes and screws and are locked and connected by screws; the groove 8 is opened on the side surface of the copper block 3 facing the amplification PCB 2, the outline shape of the groove 8 matches the bottom outline of the final stage power amplifier tube 4, the depth of the groove 8 is adapted to the bottom thickness of the final stage power amplifier tube 4, the bottom surface of the groove 8 is a flat surface, and there is a gap between the side wall of the groove 8 and the bottom side wall of the final stage power amplifier tube 4. Furthermore, the side surface of the copper block 3 facing away from the groove 8 is milled to form a flat heat dissipation surface. This heat dissipation surface is used to fit the heat sink or air cooling channel of the high-power microwave solid-state source. The side surface of the copper block 3 facing the groove 8, except for the area of ​​the groove 8, is attached to the lower surface of the amplification PCB board 2. The screw passes through the edge through hole of the amplification PCB board 2 and is screwed into the threaded hole on the edge of the upper surface of the copper block 3. After locking, the pad area of ​​the amplification PCB board 2 is suspended above the groove 8 and aligned with the opening of the groove 8. The gap width between the side wall of the groove 8 and the bottom side wall of the final stage power amplifier tube 4 is uniform. This gap is used to accommodate solder and form a solder filling layer during sintering. After sintering, the solder layer provides lateral restraint and auxiliary heat conduction path.

[0033] Installation and sintering of the final stage power amplifier tube 4: The bottom of the final stage power amplifier tube 4 is embedded into the groove 8 of the copper block 3. The bottom of the final stage power amplifier tube 4 is the bottom surface of the metallized flange, and the lower surface of the flange bottom surface is in contact with the bottom surface of the groove 8. Through the sintering process, the metallized flange at the bottom of the final stage power amplifier tube 4 and the bottom surface of the groove 8 form a heat-conducting and fixing layer. The tube pins 7 of the final stage power amplifier tube 4 are led out parallel from the side of the final stage power amplifier tube 4, and the tube pins 7 are attached to the pads on the upper surface of the amplification PCB board 2 to complete the soldering. This makes the final stage power amplifier tube 4, the amplification PCB board 2 and the copper block 3 form an integrated heat-conducting and electrical-conducting structure.

[0034] RF connector and extension cable 9 installation: An input RF connector 5 is installed at the front end of the amplifier PCB board 2, and an output RF connector 6 is installed at the rear end of the amplifier PCB board 2. The input RF connector 5 is an SMA type connector, and the output RF connector 6 is an N type connector. Both the input RF connector 5 and the output RF connector 6 are screwed to the front and rear ends of the amplifier PCB board 2 by a threaded structure. An extension cable 9 is set at the front end of the amplifier PCB board 2 and before the final stage power amplifier tube 4. The extension cable 9 is used to change the physical or electrical length of the RF signal transmission path to introduce a controllable phase offset. The extension cable 9 includes a sliding joint or telescopic structure for adjusting the mechanical length, or includes a variable loading element for adjusting the electrical length. Furthermore, both the input RF connector 5 and the output RF connector 6 include a connector body and a connecting flange; the connecting flange is fixed to the front and rear edges of the amplification PCB board 2 by screws; the center conductor of the connector body passes through the metallized via on the amplification PCB board 2 and is soldered to the microstrip line inside the board; the outer conductor thread of the connector body is used to screw on the corresponding interface of the external test cable; after the test is completed, the connector body and the test cable can be separated by screwing on the external cable; then the RF connector can be removed from the amplification PCB board 2 by loosening the connecting flange screws. Furthermore, both the input RF connector 5 and the output RF connector 6 include a connector body and a connecting flange. The connecting flange is fixed to the front and rear edges of the amplification PCB board 2 by screws. The center conductor of the connector body passes through the metallized via on the amplification PCB board 2 and is soldered to the microstrip line inside the board. The outer conductor thread of the connector body is used to screw on the corresponding interface of the external test cable. After the test is completed, the connector body and the test cable can be separated by screwing on the external cable. Then, the RF connector can be removed from the amplification PCB board 2 by loosening the connecting flange screws.

[0035] Cover plate 1 and module: Cover plate 1 covers the combination of amplification PCB board 2 and copper block 3 to shield the final stage power amplifier tube 4 and solder joint area. Cover plate 1 is fastened to the upper surface edge of copper block 3 by multiple screws to form an independent and detachable final stage power amplifier module. This module is connected to the external test cable through front and rear RF connectors. During testing, the RF connectors are used to connect to the external test cable. Furthermore, the cover plate 1 is a metal shielding cover plate 1. The lower surface edge of the cover plate 1 is provided with a countersunk through hole corresponding to the threaded hole on the upper surface edge of the copper block 3. The screw passes through the countersunk through hole and is screwed into the threaded hole on the edge of the copper block 3. A gap is maintained between the lower surface of the cover plate 1 and the upper surface of the amplification PCB board 2. This gap is used to avoid the top of the final stage power amplifier tube 4 and the solder joint protrusion of the pin 7. The side wall of the cover plate 1 is flush with the side wall of the copper block 3. The cover plate 1 is used to shield the internal electromagnetically sensitive area and prevent external mechanical contact during the testing phase.

[0036] Test Link: Connect the final stage power amplifier module to the test link consisting of vector network analyzer PORT1, pre-drive, drive power amplifier, attenuator, and vector network analyzer PORT2; connect vector network analyzer PORT1 to the input terminals of the pre-drive and drive power amplifiers; connect the output terminals of the pre-drive and drive power amplifiers to the input terminals of the final stage power amplifier module; connect the output terminal of the final stage power amplifier module to the input terminal of the attenuator; connect the output terminal of the attenuator to vector network analyzer PORT2.

[0037] Testing and Screening: The test signal is pre-driven and amplified by the drive power amplifier before being sent to the input RF connector 5 of the final stage power amplifier module; after being amplified internally by the module, it is sent out through the output RF connector 6; after being attenuated by the attenuator, it is returned to the vector network analyzer PORT2; the gain, power, and phase parameters of the final stage power amplifier module are obtained through this test link; during the testing phase, the phase parameter of the final stage power amplifier module is adjusted by adjusting the extension cable 9 to approach the preset target value; multiple final stage power amplifier modules are screened based on the gain, power, and phase parameters; modules with similar gain, power, and phase parameters are grouped into the same pairing group.

[0038] After screening, unscrew and remove the RF connector and remove cover plate 1; after removing cover plate 1, the final stage power amplifier module is used to embed into the synthesis cavity of the high-power microwave solid-state source; embed the paired multiple final stage power amplifier modules into the synthesis cavity of the same high-power microwave solid-state source and perform power synthesis.

[0039] Preferably, the attenuator in the test link is used to attenuate the high-power signal output by the final stage power amplifier module to the safe reception range of the vector network analyzer PORT2. The pre-drive and drive power amplifiers are used to amplify the low-power excitation signal output by the vector network analyzer PORT1 to the input drive level required by the final stage power amplifier module. During screening, the gain and phase are extracted based on the transmission parameters measured by the vector network analyzer, and the power index is extracted based on the power. After screening, the RF connectors and cover plates 1 of each final stage power amplifier module in the pairing group are removed, while the copper block 3 and the amplification PCB board 2 are kept locked. The flat heat dissipation surface of the copper block 3 of each module is attached to the common heat dissipation substrate of the high-power microwave solid-state source synthesis cavity. The output of the amplification PCB board 2 of each module is combined by the synthesizer.

[0040] This embodiment pre-constructs an independent and detachable final-stage power amplifier module, allowing the final-stage power amplifier tube 4 to undergo independent performance testing and screening before being installed in the complete unit. This avoids the decrease in synthesis efficiency after installation caused by individual differences in the final-stage power amplifier tube 4 and the discreteness of the soldering process. Through the closed-loop design of the test link, the gain, power, and phase indicators of the module are quantitatively evaluated before installation, improving the consistency of each signal during multi-channel power synthesis. The detachable design of the cover plate 1 and the RF connector provides the module with a complete protective structure during the testing phase, and it can be quickly removed and embedded into the synthesis cavity of the complete unit during the installation phase, balancing testing convenience and installation integration. By extending the wire 9 to change the transmission path length and introducing controllable phase offset, the phase indicators of the final-stage power amplifier module can approach the preset target value during the testing phase, reducing the difficulty of pairing and screening and improving the power synthesis efficiency. Through the pre-screening and pairing method, the number of repeated disassembly and assembly during installation and debugging is reduced, shortening the overall assembly cycle and improving the assembly success rate.

[0041] In another embodiment, the method is implemented using a high-power combining final stage power amplifier module, the module comprising: Enlarged PCB board 2; Copper block 3, which is locked to the enlarged PCB board 2, and the copper block 3 is provided with a groove 8; The bottom of the final stage power amplifier tube 4 is sintered in the groove 8, and the pin 7 of the final stage power amplifier tube 4 is soldered to the pad of the amplification PCB board 2. Radio frequency connectors are located at the front and rear ends of the amplification PCB board 2; Cover plate 1 covers the enlarged PCB board 2 and the copper block 3.

[0042] As a preferred embodiment of the final stage power amplifier module, it also includes an extension wire 9, which is located at the front end of the amplification PCB board 2 and before the final stage power amplifier tube 4. The extension wire 9 is used to change the physical or electrical length of the radio frequency signal transmission path to introduce a controllable phase shift. The extension wire 9 includes a sliding joint or telescopic structure for adjusting the mechanical length, or includes a variable loading element for adjusting the electrical length.

[0043] like Figure 1 As shown, cover plate 1 covers the assembly of amplified PCB board 2 and copper block 3; input RF connector 5 and output RF connector 6 are respectively located at the front and rear ends of the module; the module connects to external test cables through RF connectors to independently complete the performance tests.

[0044] like Figure 2 As shown, the final stage power amplifier tube 4 is embedded in the groove 8 of the copper block 3; the tube pin 7 is soldered to the amplification PCB board 2; the bare module is used to embed into the synthesis cavity.

[0045] like Figure 3 and Figure 4 As shown, the bottom of the final stage power amplifier tube 4 is embedded in the groove 8. The bottom surface of the flange and the bottom surface of the groove 8 are filled with solder to form a sintered heat-conducting layer. The corresponding shaded area in the figure indicates the solder filling position. The gap between the side wall of the groove 8 and the bottom side wall of the final stage power amplifier tube 4 is filled with solder to form a lateral auxiliary fixation. The pin 7 and the pad are electrically connected by soldering.

[0046] like Figure 5 As shown, the extension cable 9 is located at the front end of the amplifier PCB board 2 and before the final stage power amplifier tube 4; the extension cable 9 includes multiple zigzag or stepped transmission segments, and adjacent segments are staggered and overlapped to form a retractable structure; the physical length of the transmission path is adjusted by changing the overlap length.

[0047] In another embodiment, the extension wire 9 includes a microstrip line structure loaded with a variable capacitor or a variable inductor, which changes the electrical length of the transmission path by adjusting the electrical parameters of the loaded element.

[0048] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0049] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A high-power assembly method, characterized in that, The method includes: S1, lock the enlarged PCB board to the copper block with grooves; S2, sinter the bottom of the power amplifier tube into the groove, and solder the pins of the power amplifier tube to the pads of the amplifier PCB board; S3, radio frequency connectors are provided at both ends of the amplification PCB board, and a cover plate is placed on top of the amplification PCB board and the copper block; S4, connect the final stage power amplifier module to the test link. The test link includes a vector network analyzer PORT1, a pre-drive amplifier, a drive amplifier, the final stage power amplifier module, an attenuator, and a vector network analyzer PORT2. The vector network analyzer PORT1 is connected to the input terminals of the pre-drive amplifier and the drive amplifier. The output terminals of the pre-drive amplifier and the drive amplifier are connected to the input terminal of the final stage power amplifier module. The output terminal of the final stage power amplifier module is connected to the input terminal of the attenuator. The output terminal of the attenuator is connected to PORT2. S5, obtain the gain, power, and phase parameters of the final stage power amplifier module through the test link, and filter multiple final stage power amplifier modules based on the gain, power, and phase parameters; S6, remove the cover plate and the RF connector, and install the selected multiple final stage power amplifier modules into the same high-power microwave solid-state source.

2. The high-power synthesis and assembly method according to claim 1, characterized in that, In S1, the copper block is connected to the enlarged PCB board by screws.

3. The high-power synthesis and assembly method according to claim 1, characterized in that, In S3, an extension wire is provided at the front end of the amplification PCB board and in front of the power amplifier tube.

4. The high-power synthesis assembly method according to claim 3, characterized in that, In S3, adjusting the transmission path length of the extended wire is used to achieve phase offset compensation between modules.

5. A high-power combining final stage power amplifier module, characterized in that, The high-power synthesis assembly method as described in claim 3 or 4, wherein the module comprises: Enlarged PCB board; A copper block, which is locked to the enlarged PCB board, and the copper block is provided with a groove; A power amplifier tube, the bottom of which is sintered in the groove, and the pins of which are soldered to the pads of the amplifier PCB board; Radio frequency connectors are located at the front and rear ends of the amplification PCB board; A cover plate is placed over the enlarged PCB board and the copper block.

6. A high-power combining final stage power amplifier module according to claim 5, characterized in that, The copper block and the enlarged PCB board are provided with corresponding screw holes and screws.

7. A high-power combining final stage power amplifier module according to claim 5, characterized in that, The bottom of the power amplifier tube is sintered into the groove by soldering, and the pins of the power amplifier tube are soldered to the pads of the amplifier PCB board by soldering.

8. A high-power combining final stage power amplifier module according to claim 5, characterized in that, The radio frequency connector includes an input radio frequency connector and an output radio frequency connector. The input radio frequency connector is located at the front end of the amplification PCB board, and the output radio frequency connector is located at the rear end of the amplification PCB board.

9. A high-power combining final stage power amplifier module according to claim 5, characterized in that, It also includes an extension cable, which is located at the front end of the amplifier PCB board and is positioned before the power amplifier tube.

10. A high-power combining final stage power amplifier module according to claim 5, characterized in that, The RF connector is detachably connected to the amplification PCB board, and the cover plate is detachably connected to the copper block.

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