A general optical module error code full-temperature test system

Abstract

The application relates to a universal optical module error code full-temperature test system, and belongs to the technical field of optical module testing. The universal optical module error code full-temperature test system comprises a box unit and at least two independent test units installed in the box unit, and each test unit is adapted to different specifications of optical modules. Each test unit is provided with a temperature control assembly composed of a semiconductor refrigerating sheet and a water cooling head, a rigid pressing mechanism driven by an air cylinder, a limiting stopper and a temperature sensing unit embedded in a lower die, and the semiconductor refrigerating sheet and the test fixture die body are in rigid surface contact without a flexible medium layer. The water cooling head of each test unit is provided with an independent water inlet and a water outlet, thereby forming an independent circulating cooling loop. The test system is also provided with an interface in communication connection with an external error code test device. The application can realize parallel full-temperature error code testing of multiple specifications of optical modules without changing the fixture, and has the advantages of fast temperature control response, high pressing precision and independently adjustable heat dissipation.

Description

Technical Field

[0001] This invention relates to the field of optical module testing technology, specifically a universal optical module bit error rate full-temperature testing system. Background Technology

[0002] With the rapid development of cloud computing, artificial intelligence (AI) big data, and 5G communication technologies, the demand for data transmission rates and bandwidth in data centers is growing exponentially. As a core component of optical communication systems, optical modules play a crucial role in photoelectric signal conversion, and their performance stability directly determines the reliability of the entire communication network. During the manufacturing process of optical modules, especially for high-speed modules, rigorous high and low temperature cycling tests (full-temperature testing) and bit error rate (BER) tests must be conducted before shipment to screen out defective products that degrade in performance under extreme temperature environments.

[0003] Traditional equipment often employs a single temperature zone design, requiring frequent shutdowns to change fixtures when facing the production needs of multi-specification optical modules. Furthermore, due to the surge in heat generation from high-power modules, traditional thermal pads are prone to performance instability under extreme temperature cycling, making it difficult to meet the efficiency and accuracy requirements of mass production. Existing fixtures generally use a "cylinder + elastic buffer" pressing method, which can prevent module damage, but the buffer element is prone to deformation under high and low temperature cycling, causing probe contact impedance drift and severely affecting the accuracy of bit error rate testing. A uniform water-cooling circuit cannot adapt to the differentiated heat dissipation requirements of modules with different speeds, resulting in poor test data repeatability and hindering the improvement of high-speed optical module mass production yield. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a universal optical module bit error rate full-temperature testing system. It has advantages such as multi-specification parallel testing capability, high-precision temperature control and contact reliability, and differentiated heat dissipation management adapted to modules with different speeds. It solves the problems of low testing efficiency, poor accuracy and poor data repeatability caused by the thermal pad layer causing sluggish temperature control response and the inability of a unified water cooling circuit to adapt to the differentiated heat dissipation requirements of modules.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a general-purpose optical module bit error rate full-temperature testing system, comprising a housing unit, wherein the housing unit constitutes the outer shell and mounting carrier of the testing system;

[0006] and at least two test units installed within the enclosure unit, wherein the test units are independent of each other and are adapted to optical modules of different specifications;

[0007] Each of the test units includes: a fixture upper cover, a fixture lower cover, and a test fixture upper mold and a test fixture lower mold located between the two. The test fixture upper mold and the test fixture lower mold are arranged opposite to each other and together form a test cavity for accommodating the optical module.

[0008] A temperature control component is disposed between the upper cover of the fixture and the upper mold of the test fixture, and between the lower cover of the fixture and the lower mold of the test fixture, for bidirectional active temperature control of the test chamber;

[0009] A drive mechanism is fixed to the upper cover of the fixture and drives the upper mold of the test fixture to perform mold closing or opening movements relative to the lower mold of the test fixture.

[0010] A limiting mechanism is fixed to the lower cover of the fixture and is used to limit the downward stroke of the upper mold of the test fixture;

[0011] And a temperature sensing unit, which is disposed on the lower mold of the test fixture, for real-time detection of the temperature of the test chamber;

[0012] The testing system is also equipped with an interface for communication with external bit error rate testing equipment, which is used to perform bit error rate detection on the optical module under test in the high and low temperature environment provided by the testing cavity.

[0013] Furthermore, in at least two of the test units:

[0014] The first test unit is compatible with optical modules with speed ranges from 200G to 400G.

[0015] The second test unit is compatible with optical modules with speeds ranging from 800G to 1.6T;

[0016] The dimensions of the test cavity of each test unit and the contour surfaces of the upper and lower test fixtures are set according to the packaging specifications of the adapted optical module.

[0017] Furthermore, the temperature control component includes: a first semiconductor cooling chip, sandwiched between the upper cover of the fixture and the upper mold of the test fixture;

[0018] A second semiconductor cooling chip is sandwiched between the lower cover of the fixture and the lower mold of the test fixture;

[0019] A first water cooling head and a second water cooling head are respectively attached to the first semiconductor refrigeration chip and the second semiconductor refrigeration chip to remove the heat generated by the semiconductor refrigeration chip during operation;

[0020] The first semiconductor refrigeration chip and the upper mold of the test fixture, and the second semiconductor refrigeration chip and the lower mold of the test fixture, are in rigid surface contact without a flexible dielectric layer.

[0021] Furthermore, each of the test units has an independent water inlet and outlet for its water cooling head, and the housing unit is equipped with a water pipe connector that communicates with each water cooling head to connect to an external chiller to form an independent circulating cooling loop.

[0022] Furthermore, the driving mechanism is a cylinder, which is fixed above the upper cover of the fixture by a cylinder mounting plate. The output end of the cylinder passes through the cylinder mounting plate and is rigidly fixedly connected to the upper mold of the test fixture, forming a rigid pressing drive without buffer elements.

[0023] Furthermore, the limiting mechanism includes a limiting block and a stop block fixed to the lower cover of the fixture. The upper surfaces of the limiting block and the stop block are higher than the upper surface of the lower mold of the test fixture, and are respectively vertically corresponding to the edge position of the upper mold of the test fixture.

[0024] Furthermore, the temperature sensing unit is embedded in the inner wall of the lower mold of the test fixture, with its sensing end facing the test cavity, for directly detecting the body temperature of the lower mold of the test fixture.

[0025] Furthermore, the housing unit includes a test bench housing;

[0026] The test platform cover plate is fixed to the top of the test platform housing;

[0027] The front panel of the test bench is fixed to the front side of the test bench housing;

[0028] As well as push-button switches, aviation plugs, pressure regulating valves and terminals installed on the test bench housing;

[0029] The aviation plug is used to connect each test unit to an external power source and control signals, and the pressure regulating valve is used to adjust the driving air pressure of the cylinder.

[0030] Furthermore, the full-temperature testing method of the general-purpose optical module bit error rate full-temperature testing system includes the following steps:

[0031] Step 1: Select one corresponding test unit from the at least two test units according to the specifications of the optical module under test;

[0032] Step 2: Place the optical module to be tested into the lower mold of the test fixture of the selected test unit, and start the drive mechanism to press down the upper mold of the test fixture to close the mold and clamp the optical module to be tested;

[0033] Step 3: Set the target test temperature, and use the temperature control component to perform bidirectional active temperature control on the test chamber so that the temperature of the test chamber reaches and stabilizes at the target test temperature;

[0034] Step 4: Establish a communication connection between the external bit error rate testing equipment and the optical module under test through the interface, perform bit error rate testing, and record the test data;

[0035] Step 5: After the test is completed, the drive mechanism drives the upper mold of the test fixture to open and remove the optical module under test.

[0036] Furthermore, the temperature control component dynamically adjusts the direction and magnitude of the driving current flowing through the semiconductor cooling chip based on the difference between the real-time temperature value fed back by the temperature sensing unit and the target test temperature, thereby achieving closed-loop control for heating or cooling.

[0037] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0038] 1. This general-purpose optical module full-temperature error test system integrates at least two independent test units within the same housing unit, and is equipped with a rigid surface contact temperature control component without a flexible dielectric layer, a rigid pressing drive mechanism without buffer elements, and an independent water cooling circuit, enabling parallel full-temperature error testing of optical modules of various specifications. The parallel layout of independent test units eliminates the need to change fixtures when testing different specifications of optical modules, which improves the testing continuity and equipment utilization of multi-specification production lines. The rigid surface contact between the semiconductor cooling chip and the test fixture mold avoids the additional thermal resistance introduced by the traditional flexible thermal conductive medium layer, shortens the heat transfer path, and, together with the temperature sensing unit embedded in the inner side wall of the lower mold of the test fixture, improves the response speed and temperature stability of the temperature control system. At the same time, the cylinder output end is rigidly fixed to the upper mold of the test fixture, and the pressing termination position is precisely limited by the mechanical height of the limit block, which avoids the impact of deformation of the elastic buffer due to temperature changes on the pressing accuracy. This helps to ensure the consistency of the contact impedance between the test probe and the gold finger of the optical module, thereby improving the repeatability and reliability of the bit error rate test data.

[0039] 2. This universal optical module bit error rate full-temperature testing system features independent water inlets and outlets for each test unit's water-cooling head, along with corresponding independent water pipe connectors on the housing unit for connecting to an external chiller. This creates independent circulating cooling loops, allowing the coolant flow rate and temperature parameters of each test unit to be independently adjusted according to the power consumption level of the adapted optical module. This satisfies the rapid heat dissipation requirements of high-power modules while preventing condensation on the surface of low-power modules due to excessive cooling, thus improving the thermal uniformity and long-term operational stability of each test unit under full-temperature operating conditions. Attached Figure Description

[0040] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0041] Figure 2 This is a schematic diagram of the structure of the present invention without the cover plate on the test platform;

[0042] Figure 3 This is a schematic diagram of the interior of the structural box unit of the present invention;

[0043] Figure 4 This is an exploded view of the test unit of the present invention.

[0044] Figure 5 This is a schematic diagram of the exploded back side of the test unit of the present invention.

[0045] In the diagram: 1. Housing unit; 2. Test unit; 3. Fixture top cover; 4. Fixture bottom cover; 5. Test fixture upper mold; 6. Test fixture lower mold; 7. Temperature sensing unit; 8. First semiconductor refrigeration chip; 9. Second semiconductor refrigeration chip; 10. First water cooling head; 11. Second water cooling head; 12. Water pipe connector; 13. Cylinder; 14. Cylinder mounting plate; 15. Limit stop; 16. Stop; 17. Test bench housing; 18. Test bench top cover plate; 19. Test bench front panel; 20. Push-button switch; 21. Aviation connector; 22. Pressure regulating valve; 23. Terminal block. Detailed Implementation

[0046] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0047] Please see Figures 1 to 5 The general-purpose optical module full-temperature error test system in this embodiment includes a housing unit 1 and at least two test units 2 installed in the housing unit 1.

[0048] like Figures 1 to 3 As shown, the housing unit 1 constitutes the outer shell and mounting carrier of the entire testing system. The housing unit 1 specifically includes a test bench housing 17, a test bench top cover plate 18 fixed to the top of the test bench housing 17, a test bench front panel 19 fixed to the front side of the test bench housing 17, and a push-button switch 20, an aviation plug 21, a pressure regulating valve 22, and a terminal block 23 provided on the test bench housing 17.

[0049] The test bench housing 17 is a hollow box structure used to house and protect the test units 2 and related electrical components installed inside. The test bench top cover 18 is fixed to the top of the test bench housing 17 with screws, serving to seal the top opening, prevent dust, and protect internal components. The test bench front panel 19 is fixed to the front side of the test bench housing 17 with screws, used to install various operating and interface components. A push-button switch 20 is embedded in the test bench front panel 19, used to control the start and stop of the test system. An aviation connector 21 is embedded in the test bench front panel 19 or the side wall of the test bench housing 17, used to achieve electrical connection between each test unit 2 and external power supply and control signals. A pressure regulating valve 22 is installed on the test bench front panel 19, used to adjust the air pressure of the drive cylinder 13 to adapt to the different pressure requirements of different specifications of optical modules. A terminal block 23 is located on the test bench housing 17, used to achieve signal interconnection between the internal circuit and external test equipment.

[0050] Please see Figure 4 and Figure 5 Each test unit 2 includes a fixture upper cover 3, a fixture lower cover 4, a test fixture upper mold 5, and a test fixture lower mold 6. The test fixture upper mold 5 and the test fixture lower mold 6 are arranged opposite each other, forming a test cavity for accommodating the optical module.

[0051] The upper cover 3 and the lower cover 4 of the fixture are fixedly connected by circular support pillars to ensure the stability and assembly accuracy of the overall structure of the test unit 2. As a preferred embodiment, four circular support pillars are provided, respectively located at the four corners of the upper cover 3 and the lower cover 4 of the fixture.

[0052] A cylinder mounting plate 14 is fixedly connected to the top of the fixture upper cover 3 by screws, and a cylinder 13 is fixedly mounted on the cylinder mounting plate 14. The output end of the cylinder 13 passes through the cylinder mounting plate 14 and is rigidly fixedly connected to the upper mold 5 of the test fixture, forming a rigid pressing drive structure without buffer elements. That is, no elastic buffer elements such as springs or rubber pads are set between the output end of the cylinder 13 and the upper mold 5 of the test fixture; the two are directly and rigidly fixed by means of threaded connection or flange connection. The lower mold 6 of the test fixture is fixedly connected to the upper surface of the fixture lower cover 4.

[0053] Regarding the temperature control structure, each test unit 2 is equipped with an independent temperature control component. Specifically:

[0054] Below the upper cover 3 of the fixture, a first water-cooling head 10 and a first thermoelectric cooler 8 are arranged sequentially. The upper surface of the first water-cooling head 10 is fixedly connected to the lower surface of the upper cover 3 of the fixture; the upper surface of the first thermoelectric cooler 8 is in close contact with the lower surface of the first water-cooling head 10; and the lower surface of the first thermoelectric cooler 8 is rigidly in close contact with the upper surface of the upper mold 5 of the test fixture. The three are stacked sequentially from top to bottom to form a complete heat conduction chain.

[0055] A second water-cooling head 11 and a second thermoelectric cooler 9 are sequentially arranged above the lower cover 4 of the fixture. The lower surface of the second water-cooling head 11 is fixedly connected to the upper surface of the lower cover 4 of the fixture; the lower surface of the second thermoelectric cooler 9 is in contact with the upper surface of the second water-cooling head 11; and the upper surface of the second thermoelectric cooler 9 is rigidly in contact with the lower surface of the lower mold 6 of the test fixture. The three are stacked sequentially from bottom to top.

[0056] No flexible thermal conductive medium layer is provided between the above-mentioned bonding surfaces. That is, the first semiconductor cooling chip 8 and the upper mold 5 of the test fixture, and the second semiconductor cooling chip 9 and the lower mold 6 of the test fixture are all rigid surface contacts without flexible dielectric layers, so as to realize the rigid direct conduction of heat or cold and reduce heat loss in the intermediate links.

[0057] The first thermoelectric cooler 8 and the second thermoelectric cooler 9 are independently connected to an external temperature control system, and can independently switch between cooling and heating modes as needed, thereby achieving bidirectional active temperature control of the test chamber. The thermoelectric cooler is a solid-state thermoelectric element based on the Peltier effect. By changing the direction of the driving current flowing through it, the orientation of its hot and cold surfaces at the top and bottom can be switched, thus realizing the switching between cooling and heating modes.

[0058] Both the first water-cooling head 10 and the second water-cooling head 11 have internal circulating water channels and sidewalls connected to water pipe connectors 12 for connecting to an external chiller to remove the heat generated by the thermoelectric cooler during operation, ensuring its continuous and stable operation. Specifically, when the thermoelectric cooler operates in cooling mode, its hot end generates a large amount of heat, and circulating cooling water removes this heat through the internal circulating water channels of the water-cooling head; when the thermoelectric cooler operates in heating mode, the circulating cooling water also plays a role in stabilizing the temperature and preventing overheating.

[0059] For limit protection, limit blocks 15 and 16 are fixedly connected to the lower cover 4 of the fixture. The upper surfaces of limit blocks 15 and 16 are higher than the upper surface of the lower mold 6 of the test fixture, and correspond vertically to the edge positions of the upper mold 5 of the test fixture, respectively. When the cylinder 13 drives the upper mold 5 of the test fixture to move downward, the limit blocks 15 and 16 prevent the upper mold 5 of the test fixture from continuing to press down at the preset position, precisely limiting its downward pressing termination position, thereby avoiding damage to the optical module or the test fixture itself due to overpressure.

[0060] There are two blocks 16, which are respectively set on the left and right sides of the lower mold 6 of the test fixture. The height difference between the upper surface of the limit block 15 and the upper surface of the lower mold 6 of the test fixture is equal to the preset height of the test cavity in the mold closing state. This height is preset according to the thickness specification of the adapted optical module.

[0061] For temperature detection, a temperature sensing unit 7 is embedded in the inner wall of the lower mold 6 of the test fixture. The sensing end of the temperature sensing unit 7 is positioned facing the test cavity to directly detect the body temperature of the lower mold 6 of the test fixture. The signal output terminal of the temperature sensing unit 7 is electrically connected to the signal input terminal of an external temperature controller, feeding back real-time temperature data to the external temperature control system.

[0062] Preferably, the temperature sensing unit 7 employs a thermocouple or thermistor temperature sensor, with its sensing end flush with or slightly protruding from the inner wall surface of the lower mold 6 of the test fixture, to more accurately reflect the temperature field within the test cavity. Since the lower mold 6 of the test fixture is made of a high thermal conductivity metal material, and its upper surface is tightly fitted to the lower surface of the optical module after mold closing, the body temperature of the lower mold 6 can accurately reflect the ambient temperature of the optical module under thermal equilibrium conditions.

[0063] The testing system also features an interface for communication with external bit error rate testing equipment. This interface can be located on the back panel of the test bench enclosure 17. It is used to transmit the bit error rate signal of the optical module under test to an external bit error rate analyzer under the high and low temperature conditions provided by the test chamber, enabling synchronous correlation testing of temperature and bit error rate. This communication interface can be a high-speed SMA RF interface, a QSFP-DD interface, or other standard interfaces suitable for high-speed digital signal transmission.

[0064] There are two test units 2, designated as the first test unit and the second test unit. The first test unit is compatible with optical modules with speeds ranging from 200G to 400G, while the second test unit is compatible with optical modules with speeds ranging from 800G to 1.6T. The dimensions of the test cavity and the contour surfaces of the upper mold 5 and lower mold 6 of the test fixture for both test units 2 are set according to the packaging specifications of the adapted optical modules. Specifically, 200G-400G optical modules and 800G-1.6T optical modules differ in physical dimensions, gold finger positions, and pin definitions. Therefore, the contour surfaces and test cavity dimensions of the upper mold 5 and lower mold 6 of the test fixture for both test units are contoured according to the packaging specifications of their respective adapted modules to ensure a tight fit between the surface of the optical module and the test fixture mold after molding, forming good thermal contact.

[0065] The two test units 2 work independently of each other, each with its own independent temperature control components, drive mechanism, limit mechanism and temperature sensing unit 7. They can be activated individually or simultaneously to meet the parallel testing needs of optical modules of different specifications.

[0066] It should be noted that each test unit 2 has an independent water cooling head with an independent inlet and outlet. The housing unit 1 is equipped with a corresponding water pipe connector 12 that connects to each water cooling head, allowing connection to an external chiller to form an independent circulating cooling loop. Since there is a significant difference in power consumption between 200G-400G optical modules and 800G-1.6T optical modules, the independent water cooling loops allow the coolant flow rate and temperature parameters of each test unit 2 to be independently adjusted according to the power consumption level of the adapted optical module, thereby achieving differentiated heat dissipation management.

[0067] The working principle of the general-purpose optical module bit error rate full-temperature testing system is as follows:

[0068] Cooling Mode: The external temperature control system sets a target low temperature. The first and second semiconductor cooling chips 8 and 9 simultaneously activate the cooling mode to cool the upper mold 5 and lower mold 6 of the test fixture, respectively. The temperature sensing unit 7 collects real-time temperature data of the inner wall of the lower mold 6 and feeds it back to the external temperature control system. The temperature control system dynamically adjusts the direction and magnitude of the driving current flowing through the semiconductor cooling chips using a PID algorithm, ensuring the test cavity stably reaches the preset target low temperature. Once the temperature stabilizes, the cylinder 13 drives the upper mold 5 of the test fixture to press down and close, clamping the optical module, allowing low-temperature bit error rate testing to begin.

[0069] Heating Mode: The external temperature control system sets a target high temperature. The first and second semiconductor cooling chips 8 and 9 simultaneously switch to heating mode to heat the upper mold 5 and lower mold 6 of the test fixture. The temperature sensing unit 7 collects temperature data in real time and feeds it back to the temperature control system. Through PID closed-loop control, the test chamber is stabilized at the preset target high temperature, after which high-temperature bit error rate testing can be performed.

[0070] During the cooling or heating process described above, the first water cooling head 10 and the second water cooling head 11 continuously supply circulating cooling water to remove the heat generated at the hot end of the semiconductor cooling chip, thereby ensuring that the semiconductor cooling chip can work continuously and stably.

[0071] Example 1: Full-Temperature Bit Error Rate Test of 200G-400G Optical Modules

[0072] This embodiment uses a universal optical module bit error rate full-temperature testing system provided by the present invention to perform full-temperature bit error rate testing on optical modules with a data rate of 200G-400G. The specific implementation process is as follows:

[0073] Test conditions:

[0074] Temperature range: -20℃~85℃, temperature control accuracy ±0.5℃;

[0075] Power supply voltage: 220V AC;

[0076] External water cooling: chiller, water temperature set at 15-20℃;

[0077] Bit error testing equipment: External bit error analyzer (connected to this system via a communication interface).

[0078] Implementation steps:

[0079] Step 1: Connect the power supply of the test system and the external chiller, turn on the main switch of the test system, and the system completes the power-on self-test; adjust the driving air pressure of cylinder 13 to the preset value through the pressure regulating valve 22; switch the first test unit to the working state of 200G-400G and initialize the external temperature control system.

[0080] Step 2: Place the 200G-400G optical module to be tested into the lower mold 6 of the test fixture of the first test unit, and perform coarse positioning by means of the limiting block 15 and the stop block 16; start the cylinder 13, and the output end of the cylinder 13 drives the upper mold 5 of the test fixture to move downward until it abuts against the upper surface of the limiting block 15 and the stop block 16. The upper mold 5 of the test fixture and the lower mold 6 of the test fixture close together, clamping and fixing the optical module, ensuring that the upper surface of the optical module is in close contact with the lower surface of the upper mold 5 of the test fixture, and the lower surface of the optical module is in close contact with the upper surface of the lower mold 6 of the test fixture.

[0081] Step 3: Set the target test temperatures sequentially on the external temperature control system interface (low temperature -20℃, normal temperature 25℃, high temperature 85℃). Based on the difference between the real-time temperature value fed back by the temperature sensing unit 7 and the target temperature value, the temperature control system dynamically adjusts the direction and magnitude of the driving current of the first thermoelectric cooler 8 and the second thermoelectric cooler 9 using a PID algorithm to perform bidirectional active temperature control of the test cavity. The first thermoelectric cooler 8 and the second thermoelectric cooler 9 simultaneously heat up or cool down the upper mold 5 and the lower mold 6 of the test fixture, respectively, so that the test cavity quickly reaches and stabilizes at each target temperature. After the temperature points stabilize, the external chiller continuously supplies circulating cooling water at 15-20℃ to the first water-cooling head 10 and the second water-cooling head 11 to remove heat from the hot end of the thermoelectric cooler, ensuring that it maintains stable cooling or heating capabilities during long-term testing.

[0082] Step 4: After stabilizing at each target temperature (-20℃, 25℃, 85℃), establish a communication connection between the external bit error rate analyzer and the optical module under test through the communication interface set in the test system, and start the bit error rate test. Continuously run the test and record key performance parameters such as bit error rate, optical power, and receiver sensitivity at each temperature point.

[0083] Step 5: After the error rate test is completed at all temperature points, the external temperature control system stops outputting, cylinder 13 automatically depressurizes and drives the upper mold 5 of the test fixture to open upwards, removing the optical module under test. The test system automatically saves the temperature change curves and error rate test data for each temperature point and generates a test report.

[0084] Step 6: Turn off the power to the test system and the external chiller to complete the entire test process.

[0085] In this embodiment, the test temperature points (-20℃, 25℃, 85℃) can be adjusted according to the actual optical module's specifications, and are not limited to the above three temperature points; the heat preservation time and test duration at each temperature point can be adaptively set according to the heat dissipation characteristics of the module under test and the test specifications.

[0086] Example 2: Full-Temperature Bit Error Rate Test of 800G-1.6T Optical Module

[0087] This embodiment uses a universal optical module bit error rate full-temperature testing system provided by the present invention to perform full-temperature bit error rate testing on optical modules of the 800G-1.6T rate class. The specific implementation process is as follows:

[0088] Test conditions:

[0089] Temperature range: -30℃ to 85℃, temperature control accuracy ±0.5℃;

[0090] Power supply voltage: 220V AC;

[0091] External water cooling: chiller, water temperature set at 5-10℃ (because the 800G-1.6T optical module has higher power consumption, it requires coolant at a lower temperature to ensure heat dissipation efficiency).

[0092] Bit error testing equipment: External bit error analyzer (connected to this system via a communication interface).

[0093] Implementation steps:

[0094] Step 1: Connect the power supply of the test system and the external chiller, turn on the main switch of the test system, and the system completes the power-on self-test; adjust the driving air pressure of cylinder 13 to the preset value through the pressure regulating valve 22; switch the second test unit (adapted to 800G-1.6T) to the working state, and initialize the external temperature control system.

[0095] Step 2: Place the 800G-1.6T optical module to be tested into the lower mold 6 of the test fixture in the second test unit, and accurately position it using the limiting blocks 15 and 16; activate cylinder 13, and the output end of cylinder 13 drives the upper mold 5 of the test fixture to move downwards until it abuts against the upper surfaces of the limiting blocks 15 and 16. The upper mold 5 and the lower mold 6 of the test fixture then close, clamping and fixing the optical module. Since the package size of the 800G-1.6T optical module is different from that of the 200G-400G, the contoured surfaces of the upper mold 5 and the lower mold 6 of the test fixture in the second test unit are set according to the package specifications of the 800G-1.6T to ensure a tight fit between the mating surfaces.

[0096] Step 3: Set the target test temperatures sequentially on the external temperature control system interface (low temperature -30℃, normal temperature 25℃, high temperature 85℃). The temperature control system dynamically adjusts the driving current of the first semiconductor cooling chip 8 and the second semiconductor cooling chip 9 through a PID algorithm to perform bidirectional active temperature control of the test cavity, enabling the test cavity to quickly reach and stabilize at each target temperature. After the temperature points stabilize, the external chiller continuously supplies circulating cooling water at 5-10℃ to the first water-cooling head 10 and the second water-cooling head 11. Compared with Example 1, Example 2 uses a lower cooling water temperature to match the higher power consumption and heat generation of the 800G-1.6T optical module, ensuring that the semiconductor cooling chip can maintain sufficient cooling capacity and temperature control accuracy in continuous high-power cooling mode.

[0097] Step 4: After stabilizing at each target temperature (-30℃, 25℃, 85℃), establish a communication connection between the external bit error rate analyzer and the optical module under test through the communication interface set in the test system, and start the bit error rate test. Continuously run the test and record key performance parameters such as bit error rate, optical power, and receiver sensitivity at each temperature point.

[0098] Step 5: After the error rate test is completed at all temperature points, the external temperature control system stops outputting, cylinder 13 automatically depressurizes and drives the upper mold 5 of the test fixture to open upwards, removing the optical module under test. The test system automatically saves the temperature change curves and error rate test data for each temperature point and generates a test report.

[0099] Step 6: Turn off the power to the test system and the external chiller to complete the entire test process.

[0100] In this embodiment, the low-temperature test temperature (-30℃) of the 800G-1.6T optical module is lower than the -20℃ in the 200G-400G embodiment. This is because higher-speed optical modules often require reliability verification over a wider temperature range. The specific values ​​of each temperature point can be flexibly adjusted according to actual test specifications, and all of these are within the protection scope of this invention.

[0101] The working principle of the above embodiments is as follows:

[0102] (1) At least two test units 2 work independently of each other. When testing optical modules of different specifications, the external temperature control system only outputs control to the temperature control component of the test unit 2 that is currently in operation, while the other test units 2 remain in standby mode. When it is necessary to switch test specifications, no fixture parts need to be replaced. The optical module only needs to be placed in the test unit 2 of the corresponding specification and the test unit needs to be started, so as to realize the rapid switching test of multiple specifications of optical modules.

[0103] (2) During the independent operation of each test unit 2, the temperature sensing unit 7 of each test unit 2 only feeds back the real-time temperature data of its own test unit 2 to the corresponding control channel of the external temperature control system. Each channel independently executes PID closed-loop calculation without interfering with each other, thereby ensuring that each test unit 2 can run at different target temperatures at the same time, and realizes true parallel full-temperature testing.

[0104] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0105] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A universal optical module bit error rate full-temperature testing system, characterized in that, include: The housing unit (1) constitutes the outer shell and mounting carrier of the test system; And at least two test units (2) installed in the enclosure unit (1), wherein the test units (2) are independent of each other and are adapted to optical modules of different specifications; Each of the test units (2) includes: a fixture upper cover (3), a fixture lower cover (4), and a test fixture upper mold (5) and a test fixture lower mold (6) located between the two. The test fixture upper mold (5) and the test fixture lower mold (6) are arranged opposite to each other and together form a test cavity for accommodating the optical module. A temperature control component is disposed between the upper cover (3) of the fixture and the upper mold (5) of the test fixture, and between the lower cover (4) of the fixture and the lower mold (6) of the test fixture, for bidirectional active temperature control of the test chamber; The driving mechanism is fixed to the upper cover (3) of the fixture and drives the upper mold (5) of the test fixture to perform mold closing or mold opening relative to the lower mold (6) of the test fixture. A limiting mechanism is fixed to the lower cover (4) of the fixture and is used to limit the downward stroke of the upper mold (5) of the test fixture; And a temperature sensing unit (7), which is disposed on the lower mold (6) of the test fixture and is used to detect the temperature of the test cavity in real time; The testing system is also equipped with an interface for communication with external bit error rate testing equipment, which is used to perform bit error rate detection on the optical module under test in the high and low temperature environment provided by the testing cavity.

2. The universal optical module bit error rate full-temperature testing system according to claim 1, characterized in that: In at least two of the test units (2): The first test unit is compatible with optical modules with speed ranges from 200G to 400G. The second test unit is compatible with optical modules with speeds ranging from 800G to 1.6T; The test cavity size of each test unit (2) and the contour surfaces of the upper mold (5) and lower mold (6) of the test fixture are set according to the packaging specifications of the adapted optical module.

3. The universal optical module bit error rate full-temperature testing system according to claim 1, characterized in that, The temperature control component includes: The first semiconductor cooling chip (8) is sandwiched between the upper cover (3) of the fixture and the upper mold (5) of the test fixture; The second semiconductor cooling chip (9) is sandwiched between the lower cover of the fixture (4) and the lower mold of the test fixture (6); A first water cooling head (10) and a second water cooling head (11) are respectively attached to the first semiconductor refrigeration chip (8) and the second semiconductor refrigeration chip (9) to remove the heat generated by the semiconductor refrigeration chip during operation; The first semiconductor cooling chip (8) and the upper mold (5) of the test fixture, and the second semiconductor cooling chip (9) and the lower mold (6) of the test fixture, are in rigid surface contact without a flexible dielectric layer.

4. The universal optical module bit error rate full-temperature testing system according to claim 3, characterized in that, Each of the test units (2) has an independent water inlet and outlet for its water cooling head. The housing unit (1) is provided with a water pipe connector (12) that communicates with each water cooling head, which is used to connect to an external chiller to form an independent circulating cooling circuit.

5. The universal optical module bit error rate full-temperature testing system according to claim 1, characterized in that, The driving mechanism is a cylinder (13). The cylinder (13) is fixed above the upper cover (3) of the fixture by a cylinder mounting plate (14). The output end of the cylinder (13) passes through the cylinder mounting plate (14) and is rigidly fixedly connected to the upper mold (5) of the test fixture to form a rigid pressing drive without buffer elements.

6. The universal optical module bit error rate full-temperature testing system according to claim 1, characterized in that: The limiting mechanism includes a limiting block (15) and a stop block (16) fixed on the lower cover (4) of the fixture. The upper surfaces of the limiting block (15) and the stop block (16) are higher than the upper surface of the lower mold (6) of the test fixture, and are respectively vertically corresponding to the edge position of the upper mold (5) of the test fixture.

7. The universal optical module bit error rate full-temperature testing system according to claim 1, characterized in that: The temperature sensing unit (7) is embedded in the inner wall of the lower mold (6) of the test fixture, with its sensing end facing the test cavity, for directly detecting the body temperature of the lower mold (6) of the test fixture.

8. The universal optical module bit error rate full-temperature testing system according to claim 1, characterized in that, The housing unit (1) includes a test bench housing (17). The test platform cover plate (18) is fixed to the top of the test platform housing (17); The front panel (19) of the test bench is fixed to the front side of the test bench housing (17). And a push-button switch (20), an aviation plug (21), a pressure regulating valve (22) and a terminal block (23) are provided on the test bench housing (17); The aviation plug (21) is used to connect each test unit (2) to an external power supply and control signal, and the pressure regulating valve (22) is used to regulate the driving air pressure of the cylinder (13).

9. A full-temperature testing method for a universal optical module bit error rate full-temperature testing system according to any one of claims 1 to 8, characterized in that, Includes the following steps: Step 1: Select one test unit (2) from the at least two test units (2) according to the specifications of the optical module under test. Step 2: Place the optical module to be tested into the lower mold (6) of the test fixture of the selected test unit (2), and start the drive mechanism to make the upper mold (5) of the test fixture press down and close the mold, clamping the optical module to be tested; Step 3: Set the target test temperature, and use the temperature control component to perform bidirectional active temperature control on the test chamber so that the temperature of the test chamber reaches and stabilizes at the target test temperature; Step 4: Establish a communication connection between the external bit error rate testing equipment and the optical module under test through the interface, perform bit error rate testing, and record the test data; Step 5: After the test is completed, the driving mechanism drives the upper mold (5) of the test fixture to open and take out the optical module under test.

10. The full-temperature testing method according to claim 9, characterized in that, The temperature control component dynamically adjusts the direction and magnitude of the driving current flowing through the semiconductor cooling chip based on the difference between the real-time temperature value fed back by the temperature sensing unit (7) and the target test temperature, thereby achieving closed-loop control for heating or cooling.

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