Temperature control method of image pickup apparatus, image pickup apparatus, electronic apparatus, computer program product, and computer-readable storage medium

Abstract

The application provides a temperature control method of a camera device, the camera device, an electronic device, a computer program product and a computer readable storage medium; the method comprises the following steps: acquiring a first temperature collected by a first temperature collector arranged outside a camera main control unit, and acquiring a second temperature collected by a second temperature collector arranged inside the camera main control unit; determining a mapping relationship between the first temperature and the second temperature and mapping temperatures corresponding to a plurality of target temperature control regions based on a current running condition of the camera device; determining the mapping temperatures corresponding to the plurality of target temperature control regions based on the mapping relationship, the first temperature and the second temperature; and adjusting the working states of a plurality of heating elements according to the mapping temperatures by using a temperature control unit. According to the application, the temperatures of the plurality of target temperature control regions can be accurately mapped based on the running condition, and then the stable running of the camera device in various temperature environments can be ensured by controlling the working states of the plurality of heating elements.

Description

Technical Field

[0001] This application relates to camera equipment technology, and more particularly to a temperature control method for camera equipment, camera equipment, electronic equipment, computer program products, and computer-readable storage media. Background Technology

[0002] As the application scenarios for camera equipment continue to expand, some camera devices need to be deployed in extremely low-temperature environments (such as -40℃). However, the normal operating temperature limit of core components such as the main control unit and image sensor inside the camera equipment is usually only around -30℃. In practical applications, if the camera equipment is exposed to extremely cold environments that exceed the current design tolerance limit for a long time, the aforementioned core components are prone to performance degradation, unstable operation, or even failure to power on and start normally.

[0003] In related technologies, to maintain equipment operation in low-temperature environments, multiple heating components are typically independently arranged in each target temperature control zone of the main body to be heated. During temperature control, a temperature acquisition device needs to be configured for each temperature control zone to obtain the current temperature of the corresponding zone, and then the operating status of the heating components in each zone can be adjusted accordingly. Summary of the Invention

[0004] This application provides a temperature control method for a camera device, a camera device, an electronic device, a computer program product, and a computer-readable storage medium. It can accurately map the temperature of multiple target temperature control areas based on the operating conditions without having to configure a temperature acquisition device for each temperature control area separately, thereby achieving accurate linkage control of multiple heating elements to ensure the stable operation of the camera device in low-temperature environments.

[0005] The technical solution of this application embodiment is implemented as follows: This application provides a temperature control method for a camera device, the camera device including a temperature control unit, a camera main control unit, and multiple heating elements respectively disposed in multiple target temperature control areas, the method including: The system acquires a first temperature from a first temperature acquisition device and a second temperature from a second temperature acquisition device, wherein the first temperature acquisition device is located outside the camera main control unit and the second temperature acquisition device is located inside the camera main control unit. The current operating condition of the camera device is obtained, and based on the current operating condition, the temperature mapping relationship corresponding to the current operating condition is determined. The temperature mapping relationship includes the mapping relationship between the first temperature and the mapping temperature corresponding to the plurality of target temperature control areas, and the mapping relationship between the second temperature and the mapping temperature corresponding to the plurality of target temperature control areas. Based on the temperature mapping relationship, the first temperature, and the second temperature, the corresponding mapped temperatures of the plurality of target temperature control zones are determined. Using the temperature control unit, the working state of the multiple heating elements is adjusted according to the mapped temperature corresponding to the multiple target temperature control zones.

[0006] This application embodiment provides a camera device, the camera device comprising: The system comprises a first temperature acquisition unit, a second temperature acquisition unit, a temperature control unit, a camera main control unit, and multiple heating elements. The first temperature acquisition device is disposed outside the camera main control unit and is used to acquire the first temperature; The second temperature acquisition device is installed inside the camera main control unit and is used to acquire a second temperature. The plurality of heating elements are respectively arranged in multiple target temperature zones; The temperature control unit is configured to adjust the working state of the plurality of heating elements based on the temperature mapping relationship between the first temperature, the second temperature and the current operating condition of the camera device. The temperature mapping relationship includes the mapping relationship between the first temperature and the mapping temperature corresponding to the plurality of target temperature control areas, and the mapping relationship between the second temperature and the mapping temperature corresponding to the plurality of target temperature control areas.

[0007] This application provides an electronic device, the electronic device comprising: Memory is used to store executable instructions or computer programs. The processor, when executing computer-executable instructions or computer programs stored in the memory, implements the temperature control method for the camera device provided in the embodiments of this application.

[0008] This application provides a computer-readable storage medium storing a computer program or computer-executable instructions, which, when executed by a processor, implements the temperature control method for the camera device provided in this application.

[0009] This application provides a computer program product, including a computer program or computer executable instructions. When the computer program or computer executable instructions are executed by a processor, they implement the temperature control method for the camera device provided in this application.

[0010] The embodiments of this application have the following beneficial effects: By acquiring a first temperature from a first temperature acquisition device located outside the camera main control unit and a second temperature from a second temperature acquisition device located inside the camera main control unit, and by obtaining the current operating condition of the camera equipment, a logical association is established between the first temperature, the second temperature, and the mapped temperatures corresponding to multiple target temperature control areas based on the temperature mapping relationship matched with the current operating condition. Then, the temperature control unit adjusts the working state of multiple heating elements according to the determined mapped temperatures. Through this scheme, combining the dual temperature references acquired from inside and outside the camera main control unit, and the current specific operating condition of the camera equipment, accurate mapping and perception of the temperatures of multiple target temperature control areas are achieved. Based on the determined mapped temperatures, precise linkage control of multiple heating elements arranged in multiple target temperature control areas is achieved, improving the accuracy and rationality of the camera equipment's temperature control and ensuring the stable operation of the camera equipment under various temperature environments. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the temperature control system architecture of the camera device provided in the embodiments of this application; Figure 2 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application; Figure 3 This is a schematic diagram of the camera device provided in the embodiments of this application; Figure 4 This is a first flowchart illustrating the temperature control method for a camera device provided in an embodiment of this application; Figure 5 This is a second flowchart illustrating the temperature control method for a camera device provided in an embodiment of this application; Figure 6 This is a schematic diagram of the structure of the camera device provided in the embodiments of this application; Figure 7 This is a schematic diagram of the third process of the temperature control method for the camera device provided in the embodiments of this application; Figure 8 This is a schematic diagram showing the location distribution of the heating element in the lens area according to an embodiment of this application; Figure 9 This is a schematic diagram showing the location distribution of the heating element in the image sensor and camera main control unit area provided in an embodiment of this application; Figure 10 This is a schematic diagram of the temperature sampling circuit structure of the protection switch provided in the embodiment of this application; Figure 11 This is a schematic diagram of the hysteresis comparator circuit structure of the protection switch provided in the embodiments of this application; Figure 12 This is a schematic diagram of the action waveform of the protection switch provided in the embodiment of this application in a real test scenario.

[0012] Explanation of reference numerals in the attached figures: 1. Camera equipment; 10. Lens heating wire; 20. Main control heating wire; 30. Image sensor heating wire.

[0013] It should be noted that the terms "first" and "second" mentioned above are only used to distinguish between different options and do not represent the degree of superiority or inferiority of the options or their priority in the implementation process. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be regarded as limitations on this application. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0015] In the following description, references are made to “some embodiments,” which describe a subset of all possible embodiments. However, it is understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0016] In the following description, the terms "first, second, third" are used merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first, second, third" may be interchanged in a specific order or sequence where permitted, so that the embodiments of this application described herein can be implemented in an order other than that illustrated or described herein.

[0017] In the embodiments of this application, the terms "module" or "unit" refer to a computer program or part of a computer program that has a predetermined function and works with other related parts to achieve a predetermined goal, and can be implemented wholly or partially using software, hardware (such as processing circuitry or memory), or a combination thereof. Similarly, a processor (or multiple processors or memory) can be used to implement one or more modules or units. Furthermore, each module or unit can be part of an overall module or unit that includes the functionality of that module or unit.

[0018] Unless otherwise defined, all technical and scientific terms used in the embodiments of this application have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the embodiments of this application is for the purpose of describing the embodiments of this application only and is not intended to limit this application.

[0019] In the implementation of this application, the collection and processing of relevant data should strictly comply with the requirements of relevant laws and regulations, obtain the informed consent or separate consent of the personal information subject, and carry out subsequent data use and processing within the scope of laws and regulations and the authorization of the personal information subject.

[0020] Before providing a further detailed description of the embodiments of this application, the nouns and terms involved in the embodiments of this application will be explained, and the nouns and terms involved in the embodiments of this application shall be interpreted as follows.

[0021] 1) The temperature control unit is a control component in a camera device responsible for executing temperature detection and heating control logic. The temperature control unit acquires externally or internally collected temperature data and, in conjunction with the control logic, outputs control commands to adjust the operating status of multiple heating elements, thereby achieving temperature regulation of the camera device in various environments.

[0022] 2) The camera main control unit refers to the main processing unit in the camera equipment configured to perform data processing, instruction scheduling, or coordinated operation control of various functional modules.

[0023] 3) Operating conditions refer to the set of parameters of the power supply status, output power or operating load of each electronic component or functional module inside the camera equipment during operation.

[0024] 4) Mapped temperature refers to the current equivalent temperature of a target temperature-controlled area that is not directly equipped with a temperature acquisition sensor. This temperature is calculated based on a measured single-point reference temperature (such as a first temperature or a second temperature) and a pre-calibrated temperature mapping relationship under specific operating conditions. The mapped temperature serves as a direct quantitative basis for determining whether heating of the target temperature-controlled area is necessary.

[0025] 5) The target temperature control area refers to the physical spatial distribution area in which electronic components or optical devices are installed inside the camera equipment cavity, and whose working environment temperature needs to be raised through the intervention of electrothermal conversion components.

[0026] 6) A protection switch refers to a hardware-level over-temperature protection circuit (e.g., a redundant protection loop constructed from a thermistor and a hysteresis comparator) outside the software control logic of the temperature control unit. The protection switch is used to forcibly limit or cut off the power supply to the heating element when the actual temperature on the heat transfer path inside the camera device exceeds a preset safety limit, in order to prevent the risk of continuous overheating caused by abnormal or damaged control logic.

[0027] With the expansion of applications for camera equipment, extremely low temperatures (such as -40℃) can easily cause instability or power failure in the core components inside the equipment. To maintain the operation of the equipment in low-temperature environments, related technologies typically include two approaches. The first approach involves placing a low-power heating element on a single surface of the camera lens for localized defrosting and defogging. The second approach involves independently placing heating components in multiple target temperature control areas of the device to be heated. During temperature control, a separate temperature acquisition device must be configured for each temperature control area to obtain the current temperature of the corresponding area.

[0028] However, both of the above-mentioned approaches have their limitations. The first approach, which only heats external optical components without providing coordinated thermal compensation for core components such as the camera control unit and image sensor, cannot maintain the overall thermodynamic balance within the camera device in extremely cold environments. This can easily lead to operational failure or physical damage to internal core components due to temperatures falling below their normal operating limits. The second approach requires independent external parameter acquisition circuits for temperature detection in each temperature-controlled area, inevitably complicating the internal hardware topology of the camera device. This increases the overall hardware wiring difficulty and manufacturing cost, making it difficult to adapt to small-cavity camera devices with limited internal space. In actual operation, the heat generated by the internal components dynamically changes and interacts with the cavity temperature at different operating stages. Related technologies ignore these dynamic heat distribution changes, making it difficult to accurately match temperature estimation with the actual scene, easily causing lag or deviation in temperature control.

[0029] Based on this, embodiments of this application provide a temperature control method for a camera device, a camera device, an electronic device, a computer-readable storage medium, and a computer program product. By introducing a dynamic mapping mechanism between the dual reference temperatures inside and outside the main control unit and the current operating conditions of the device, it solves the problems in related technologies such as complex hardware structures caused by independent parameter acquisition in multiple regions, and low matching degree between temperature estimation and actual heat distribution due to lack of operating condition adaptability. Thus, without the need to configure temperature acquisition devices separately for each temperature control area, it achieves precise linkage temperature control of multiple heating elements in the camera device, effectively improving the accuracy and reliability of equipment temperature control in extremely cold environments.

[0030] The following describes exemplary applications of the electronic devices provided in the embodiments of this application. These devices can be implemented as various types of terminals such as laptops, tablets, desktop computers, set-top boxes, smartphones, smart speakers, smartwatches, smart TVs, and in-vehicle terminals, or as servers. The following will describe exemplary applications when the device is implemented as a server.

[0031] See Figure 1 , Figure 1 This is a schematic diagram of the architecture of the temperature control system 100 of the camera device provided in the embodiment of this application. The terminal 400 is connected to the server 200 through the network 300. The network 300 can be a wide area network or a local area network, or a combination of the two.

[0032] In some embodiments, the temperature control method for the camera device provided in this application can be implemented independently by the terminal 400. The terminal 400 acquires a first temperature collected by a first temperature acquisition element and a second temperature collected by a second temperature acquisition element, wherein the first temperature acquisition element is disposed outside the camera main control unit, and the second temperature acquisition element is disposed inside the camera main control unit; the terminal 400 acquires the current operating condition of the camera device and, based on the current operating condition, determines the temperature mapping relationship corresponding to the current operating condition, wherein the temperature mapping relationship includes the mapping relationship between the first temperature and the mapping temperatures corresponding to multiple target temperature control areas, and the mapping relationship between the second temperature and the mapping temperatures corresponding to multiple target temperature control areas; the terminal 400 determines the mapping temperatures corresponding to multiple target temperature control areas based on the temperature mapping relationships, the first temperature, and the second temperature; the terminal 400 uses the temperature control unit to adjust the working state of multiple heating elements according to the mapping temperatures corresponding to the multiple target temperature control areas.

[0033] In some embodiments, the temperature control method for the camera device provided in this application can be implemented independently by the server 200. The server 200 acquires a first temperature collected by a first temperature acquisition device and a second temperature collected by a second temperature acquisition device, wherein the first temperature acquisition device is located outside the camera main control unit, and the second temperature acquisition device is located inside the camera main control unit; the server 200 acquires the current operating condition of the camera device and, based on the current operating condition, determines the temperature mapping relationship corresponding to the current operating condition, wherein the temperature mapping relationship includes the mapping relationship between the first temperature and the mapping temperatures corresponding to multiple target temperature control areas, and the mapping relationship between the second temperature and the mapping temperatures corresponding to multiple target temperature control areas; the server 200 determines the mapping temperatures corresponding to multiple target temperature control areas based on the temperature mapping relationships, the first temperature, and the second temperature; the server 200 uses the temperature control unit to adjust the working state of multiple heating elements according to the mapping temperatures corresponding to the multiple target temperature control areas.

[0034] In some embodiments, the temperature control method for the camera device provided in this application can be jointly implemented by a server 200 and a terminal 400. The terminal 400 acquires a first temperature from a first temperature acquisition device, acquires a second temperature from a second temperature acquisition device, and acquires the current operating condition of the camera device. It then sends the first temperature, the second temperature, and the current operating condition to the server 200. The first temperature acquisition device is located outside the camera main control unit, and the second temperature acquisition device is located inside the camera main control unit. Based on the current operating condition, the server 200 determines the temperature mapping relationship corresponding to the current operating condition. This temperature mapping relationship includes mappings between the first temperature and the mapping temperatures corresponding to multiple target temperature control areas, and mappings between the second temperature and the mapping temperatures corresponding to multiple target temperature control areas. Based on the temperature mapping relationship, the first temperature, and the second temperature, the server 200 determines the mapping temperatures corresponding to the multiple target temperature control areas and sends these mapping temperatures to the terminal 400. The terminal 400 uses a temperature control unit to adjust the operating states of multiple heating elements according to the mapping temperatures corresponding to the multiple target temperature control areas.

[0035] In some embodiments, server 200 may be a standalone physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content delivery networks (CDNs), and big data and artificial intelligence platforms. Terminals and servers can be connected directly or indirectly via wired or wireless communication, which is not limited in this embodiment.

[0036] See Figure 2 , Figure 2 This is a schematic diagram of the structure of the electronic device 500 provided in the embodiments of this application. Figure 2 The illustrated electronic device 500 includes at least one processor 510, a memory 550, at least one network interface 520, and a user interface 530. The various components of the electronic device 500 are coupled together via a bus system 540. It is understood that the bus system 540 is used to implement communication between these components. In addition to a data bus, the bus system 540 also includes a power bus, a control bus, and a status signal bus. However, for clarity, in… Figure 2 The general labeled all buses as Bus System 540.

[0037] The processor 510 can be an integrated circuit chip with signal processing capabilities, such as a general-purpose processor, a digital signal processor (DSP), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor, etc.

[0038] User interface 530 includes one or more output devices 531 that enable the presentation of media content, including one or more speakers and / or one or more visual displays. User interface 530 also includes one or more input devices 532, including user interface components that facilitate user input, such as a keyboard, mouse, microphone, touch screen display, camera, other input buttons and controls.

[0039] The memory 550 may be removable, non-removable, or a combination thereof. Exemplary hardware devices include solid-state storage, hard disk drives, optical disk drives, etc. The memory 550 may optionally include one or more storage devices physically located away from the processor 510.

[0040] The memory 550 may include volatile memory or non-volatile memory, or both. The non-volatile memory may be read-only memory (ROM), and the volatile memory may be random access memory (RAM). The memory 550 described in this application embodiment is intended to include any suitable type of memory.

[0041] In some embodiments, memory 550 is capable of storing data to support various operations, examples of which include programs, modules, and data structures or subsets or supersets thereof, as illustrated below.

[0042] Operating system 551 includes system programs for handling various basic system services and performing hardware-related tasks, such as the framework layer, core library layer, driver layer, etc., for implementing various basic business functions and handling hardware-based tasks; The network communication module 552 is used to reach other electronic devices via one or more (wired or wireless) network interfaces 520, exemplary network interfaces 520 including: Bluetooth, WiFi, and Universal Serial Bus (USB), etc. Presentation module 553 is used to enable the presentation of information (e.g., user interface for operating peripheral devices and displaying content and information) via one or more output devices 531 (e.g., display screen, speaker, etc.) associated with user interface 530. The input processing module 554 is used to detect and translate one or more user inputs or interactions from one or more input devices 532.

[0043] In some embodiments, the temperature control device 555 of the camera equipment provided in this application can be implemented in software. Figure 2 A control device 555 stored in memory 550 is shown. This device can be software in the form of programs and plug-ins, and includes the following software modules: a temperature acquisition module 5551, a temperature mapping module 5552, a heating control module 5553, and an offset calculation module 5554. These modules are logically connected and can therefore be arbitrarily combined or further separated according to the functions they implement. The functions of each module will be described below.

[0044] The following describes the temperature control method for a camera device provided in the embodiments of this application. As mentioned above, the electronic device implementing the temperature control method for the camera device in the embodiments of this application can be a terminal, a server, or a combination of both. Therefore, the executing entity of each step will not be described again below.

[0045] To facilitate understanding of the hardware structure of the camera device provided in the embodiments of this application, as well as the connection relationships between the heating elements, temperature acquisition elements, and control unit, the following is introduced: Figure 3 Please provide an explanation. Figure 3 This is a schematic diagram of the camera device provided in the embodiments of this application, such as... Figure 3 As shown, the camera device includes a power supply, a temperature control unit, a camera main control unit, a first temperature acquisition device, a temperature control switch, multiple heating elements, and other functional modules. The temperature control unit can be a microcontroller unit (MCU), and the camera main control unit can be a central processing unit (CPU). The multiple heating elements include a lens heating wire located in the lens area, an image sensor heating wire located in the image sensor area, and a main control heating wire located in the camera main control unit area. The lens heating wire is used to heat the lens protective cover and / or the lens area, the image sensor heating wire is used to heat the image sensor area, and the main control heating wire is used to heat the main control CPU area.

[0046] like Figure 3As shown, the power supply provides power to the MCU, the main control CPU, and the related circuits of each heating element. The main control CPU is connected to power control 1, power control 2, and power control 3 to adjust the output power of the lens heating wire, image sensor heating wire, and main control heating wire. The MCU controls the on / off state of the lens heating wire, image sensor heating wire, and main control heating wire through the corresponding enable signal (EN). The MCU also communicates with the main control CPU through a Universal Asynchronous Receiver / Transmitter Interface (UART) to receive junction temperature information collected by the second temperature acquisition device inside the main control CPU, or to send control information to the main control CPU. The MCU is also connected to the power supply control path of the main control CPU to control the power-on and power-off of the main control CPU. The first temperature acquisition device can be a negative temperature coefficient (NTC) thermistor located near the main control CPU. The MCU collects the board-level temperature near the main control CPU through the NTC thermistor. The temperature control switch is located on the heating power supply or heating enable control path. Under normal circumstances, it does not interfere with the MCU's control of multiple heating elements. When the on-board temperature exceeds the preset temperature, the temperature control switch can forcibly shut down the lens heating wire, image sensor heating wire, and main control heating wire. The main control CPU is also connected to other modules, which may include image acquisition modules, supplementary lighting modules, audio modules, communication modules, or other business function modules in the camera equipment. The main control CPU is responsible for the operation control of these other modules.

[0047] See Figure 4 , Figure 4 This is a first flowchart illustrating the temperature control method for a camera device provided in this application embodiment, which will be combined with... Figure 4 The steps shown are explained below. Figure 4 The main component of the process is electronic equipment.

[0048] In step 101, a first temperature is acquired by a first temperature acquisition device, and a second temperature is acquired by a second temperature acquisition device. The first temperature acquisition device is located outside the camera main control unit, and the second temperature acquisition device is located inside the camera main control unit.

[0049] Here, the camera main control unit refers to the main processing chip in the camera equipment that is responsible for handling core business logic and the operation of other modules of the camera.

[0050] Here, the first temperature acquisition device refers to a sensor device located outside the external packaging structure of the camera main control unit, configured to measure the ambient temperature of the surrounding medium or circuit board environment where the main control unit is located; the second temperature acquisition device refers to a sensor device integrated inside the semiconductor packaging structure of the camera main control unit, configured to measure the physical junction temperature of the core semiconductor device.

[0051] It should be noted that since the first temperature acquisition device is located outside the camera main control unit, such as on a circuit board near the main control chip, the first temperature it acquires usually represents the board-level ambient temperature around the camera main control unit; while the second temperature acquisition device is located inside the camera main control unit, so the second temperature it acquires usually represents the actual operating temperature of the core circuit module inside the camera main control unit when running the core algorithm or processing data, i.e., the junction temperature.

[0052] Obtaining the first temperature from the first temperature acquisition device and the second temperature from the second temperature acquisition device can provide accurate benchmark support for subsequent temperature mapping and heating linkage from two dimensions: the influence of heat conduction in the external environment and the self-heating of the internal chip.

[0053] In some embodiments, the camera control unit may be a central processing unit.

[0054] In some embodiments, the first temperature acquisition device may be a negative temperature coefficient (NTC) thermistor disposed on a circuit board at a predetermined distance from the edge of the camera control unit (CPU).

[0055] For example, the first temperature sensor can be positioned on a circuit board 2 to 5 millimeters from the edge of the camera control unit. By setting a precise preset distance, it is possible to ensure that the first temperature sensor can sensitively sense the ambient temperature of the board around the camera control unit, while avoiding direct interference from localized thermal pulses caused by instantaneous load changes in the camera control unit due to excessive proximity.

[0056] It should be noted that NTC thermistors have the physical characteristic that their resistance decreases as temperature increases. In actual temperature measurement, the NTC thermistor and a fixed resistor can be combined to form a voltage divider circuit, and the temperature control unit can collect the voltage value from the voltage divider circuit. Since there is a corresponding relationship between the voltage value and the resistance of the NTC thermistor, the resistance value of the NTC thermistor can be deduced from the voltage value first, and then the initial temperature can be determined based on the correspondence between the resistance value of the NTC thermistor and the temperature. In this way, the temperature control unit can independently acquire the temperature near the camera main control unit even when the camera main control unit is not powered on.

[0057] In some embodiments, the second temperature acquisition device is configured as a sensor device for detecting the temperature of a semiconductor junction, such as, but not limited to, a PN junction (Positive-Negative Junction) or an on-chip temperature sensor device inside the CPU.

[0058] In some embodiments, the first temperature collected by the first temperature acquisition device can be obtained by the following method: connecting the camera device to a power source, using a temperature control unit to control multiple heating elements respectively set in multiple target temperature control areas to be in the on state, and obtaining the first temperature through the first temperature acquisition device.

[0059] It should be noted that since the camera main control unit is not powered on at this time, the second temperature acquisition device cannot output the second temperature. Therefore, the first temperature can be used as the temperature basis for judging whether the camera main control unit has reached the safe start-up condition.

[0060] In some embodiments, when the camera control unit is not powered on, if the temperature of the camera control unit is determined to be lower than a preset startup temperature based on a first temperature, the temperature control unit controls the heating elements disposed in the camera control unit area and the image sensor area to be turned on to preheat the camera control unit and the image sensor area. If the temperature of the camera control unit is determined to be higher than or equal to the preset startup temperature based on the first temperature, the temperature control unit controls the camera control unit to be powered on, and after the camera control unit is powered on, the heating elements disposed in the camera control unit area and the image sensor area are controlled to be turned off. For example, the preset startup temperature can be -20°C.

[0061] Figure 5 This is a second flowchart illustrating the temperature control method for a camera device provided in an embodiment of this application, as shown below. Figure 5 As shown, in some embodiments, the step 101 of "acquiring the second temperature collected by the second temperature acquisition device" can be achieved through the following steps 1011 to 1012, which will be explained in detail below.

[0062] In step 1011, if the continuous on time of multiple heating elements exceeds a preset time threshold and the first temperature does not reach the preset start-up temperature when the camera main control unit is not powered on, the camera main control unit is powered on by the temperature control unit, and the second temperature collected by the second temperature acquisition element is obtained through the camera main control unit.

[0063] Here, "not powered on" means that the main power supply circuit of the camera control unit is disconnected, causing the camera control unit to be in a power-off state where it stops operating.

[0064] Here, the preset startup temperature refers to the minimum device tolerance temperature required for the camera main control unit to be safely powered on and work normally.

[0065] Here, the temperature control unit refers to the control component in the camera equipment that is responsible for executing temperature detection and heating control logic and has the ability to control the power supply of the camera main control unit.

[0066] In step 1012, when the camera main control unit is powered on, the second temperature collected by the second temperature acquisition device is obtained through the camera main control unit.

[0067] Here, "power-on state" refers to the working mode in which the power supply circuit of the camera equipment is closed and the camera main control unit has received the rated operating voltage and has the ability to execute commands.

[0068] It should be noted that obtaining the second temperature from the second temperature acquisition device through the camera main control unit means that, since the second temperature acquisition device (such as a PN junction) is integrated into the internal structure of the camera main control unit, the measurement and output of its temperature data strongly depends on the camera main control unit being powered on. Therefore, if the first temperature acquisition device is suspected of having an abnormal temperature measurement, the camera main control unit needs to be powered on first using the temperature control unit before the camera main control unit can read the second temperature using its own internal detection mechanism.

[0069] The embodiments of this application solve the technical problem in related technologies where a camera device is trapped in endless, ineffective heating and unable to obtain the true temperature due to the failure of a single external temperature acquisition device or abnormal external heating. By introducing a joint verification mechanism between the heating start-up time and the first temperature during the power-off phase of the camera main control unit, when specific abnormal conditions are met (i.e., continuous heating timeout and the first temperature still not reaching the standard), the abnormal scenario of a faulty first temperature acquisition device or heating failure can be accurately identified. At this time, the single dependence on the external temperature measurement reference is automatically cut off, and the camera main control unit is forced to power on, thereby smoothly switching to obtaining the true second temperature using its internally integrated second temperature acquisition device. This temperature measurement redundancy switching control mechanism not only constructs a mutually redundant system of external and internal temperature measurement based on conventional temperature mapping logic, but also avoids temperature control failure caused by temperature measurement distortion in extremely cold environments, further improving the reliability and fault tolerance of the overall temperature control scheme.

[0070] In an abnormal configuration experiment, the heating element in the camera main control unit area is not connected, and the camera device is powered on at an ambient temperature of -40℃. At this time, the temperature control unit first controls the heating element to heat according to the low-temperature start-up logic; after the heating duration reaches 4 minutes, if the temperature in the camera main control unit area is still determined to be below -20℃ based on the first temperature, the temperature control unit determines that there is a risk of abnormal temperature measurement by the first temperature acquisition device or abnormal heating element in the camera main control unit area, and controls the camera main control unit to power on, subsequently switching to temperature measurement control based on the second temperature.

[0071] For example, in this abnormal construction experiment, the default mapping relationship of "the first temperature equals the second temperature minus 15°C" can be used for subsequent temperature control.

[0072] In some embodiments, the temperature control unit and the camera main control unit can communicate through a Universal Asynchronous Receiver / Transmitter (UART) interface. The temperature control unit can control the power-on of the camera main control unit in the following way: the temperature control unit sends a level conversion signal to the power management circuit corresponding to the camera main control unit to control the power supply circuit of the camera main control unit to be turned on or off, thereby realizing the power-on / off control of the camera main control unit.

[0073] In some embodiments, the preset time threshold can be determined based on the expected heating power of the heating element in extremely cold environments, the heating rate, and the normal preheating time required for the camera control unit to reach a safe start-up state. For example, the preset time threshold can be set to 4 minutes.

[0074] In some embodiments, the preset startup temperature can be determined based on the internal hardware physical characteristics of the camera control unit, semiconductor process limitations, and the minimum allowable temperature range for normal operation. For example, the preset startup temperature can be set to -20°C.

[0075] In step 102, the current operating condition of the camera device is obtained, and based on the current operating condition, the temperature mapping relationship corresponding to the current operating condition is determined. The temperature mapping relationship includes the mapping relationship between the first temperature and the mapping temperature corresponding to the multiple target temperature control areas, and the mapping relationship between the second temperature and the mapping temperature corresponding to the multiple target temperature control areas.

[0076] Here, the current operating condition of the camera equipment refers to the set of specific working states of the various electronic functional modules inside the camera equipment at the current moment. The operating condition determines the heat distribution and thermodynamic equilibrium state inside the camera equipment.

[0077] It should be noted that, due to the typically sealed and compact cavity structure of camera equipment, the temperature difference between different physical locations within the cavity exhibits quasi-constant characteristics under specific workloads after the cavity's thermal equilibrium stabilizes. However, as the complexity of the tasks performed by the camera equipment varies (e.g., whether a high-load supplementary light or a complex recognition algorithm is activated), the power consumption of the core circuitry within the camera's main control unit dynamically changes. This dynamic change in heat generation directly affects the integrated secondary temperature, causing a shift in the temperature difference between the primary and secondary temperatures. Therefore, by acquiring the current operating conditions in real time, it is possible to accurately perceive changes in the thermodynamic state within the camera's main control unit, and then match the temperature mapping relationship that best matches the current heat distribution characteristics from multiple preset mapping models. This mechanism ensures the accuracy of the underlying temperature reference mapping, thereby ensuring that the true temperatures of multiple other target temperature control zones can be accurately derived using only a single or dual-point reference temperature, achieving adaptive operating condition compensation.

[0078] For a better understanding of the structure of camera equipment, see [link / reference]. Figure 6 , Figure 6 This is a schematic diagram of the structure of the camera device provided in the embodiments of this application. Figure 6 As shown, in some embodiments, the camera device 1 can be a bullet camera, which has a small and sealed cavity. Because the cavity space of the camera device 1 is small and the air exchange between the cavity and the external environment is minimal, the temperature difference between different physical locations inside the camera device 1 can gradually stabilize after the operating states of each functional module and the working states of each heating element have stabilized.

[0079] Based on the thermal balance characteristics of the small enclosed cavity, the embodiments of this application can calculate the temperature of multiple target temperature control areas, such as the lens area, image sensor area, and camera main control unit area of ​​the camera device 1, by measuring the temperature of one or a few locations and combining them with a pre-calibrated temperature mapping relationship.

[0080] In some embodiments, the operating conditions may include at least one or more of the following operating state dimensions: the operating state of the heating device, the operating state of the audio peripheral, the luminous intensity of the supplementary lighting peripheral, and the business processing load of the camera main control unit.

[0081] For example, the operating status of the heating device may include the on or off status of each heating element; the operating status of the audio peripheral may include the operating status of the microphone, as well as the volume of the speaker or the type of audio source being played; the luminous intensity of the supplementary lighting peripheral may include the intensity percentage of the white light supplementary light or the intensity percentage of the infrared supplementary light; the business processing load of the camera main control unit may include the on status of the video preview and the type of intelligent algorithm currently running.

[0082] It should be noted that the heat generated by the camera's main control unit varies depending on its workload. For example, when the camera's main control unit is running intelligent algorithms of varying complexity, video preview, or recording tasks, the power consumption of the core circuitry inside the main control unit will change, resulting in a significant change in the second temperature sampled by the second temperature acquisition device. Since the second temperature acquisition device is located inside the camera's main control unit, it is more sensitive to changes in the unit's own heat generation; while the first temperature acquisition device is located outside the main control unit, such as on a circuit board near the main control unit, and is relatively less affected by instantaneous load changes. Therefore, the temperature difference between the first and second temperatures may differ under different operating conditions, requiring the determination of corresponding temperature mapping relationships for each operating condition.

[0083] To facilitate understanding of the calibration methods for temperature mapping relationships under different operating conditions, the following examples, using Table 1, illustrate the relationships between the first temperature, the second temperature, and the mapped temperatures corresponding to multiple target temperature control zones. Table 1 provides examples of temperature mapping relationships under different power-on and heating states. As shown in Table 1, it illustrates the mapping relationships between ambient temperature, NTC temperature, main control temperature, sensor temperature, lens temperature, and general junction temperature under different power-on states and different heating element operating states.

[0084] It should be noted that T in Table 1 can represent the real-time acquired temperature used as a mapping reference, such as the NTC temperature. The temperature symbol in Table 1 is ℃. Taking the operating state of "MCU and CPU powered on, heating wires all off" as an example, when the NTC temperature is T, the ambient temperature can be determined as T-25, the main control temperature as T+8, the sensor temperature as T-15, the lens temperature as T-17, and the general junction temperature as T+15. That is to say, in this operating state, even if independent temperature acquisition devices are not set up in the ambient area, sensor area, or lens area, the mapped temperature of the corresponding target temperature control area can be calculated based on the NTC temperature and the pre-calibrated temperature mapping relationship. Taking the operating state of "MCU and CPU powered on, heating wires fully on" as an example, when the NTC temperature is T, we can determine that the ambient temperature is T-70, the main control temperature is T+11, the sensor temperature is T-20, the lens temperature is T-48, and the general junction temperature is T+15. It can be seen that whether the heating element is on or off will change the temperature offset between different regions. Therefore, it is necessary to calibrate the corresponding temperature mapping relationship for different operating states.

[0085]

[0086] Table 1 It should be noted that the general junction temperature in Table 1 refers to the equivalent temperature value calculated based on the preset default temperature mapping relationship. Specifically, the general junction temperature in Table 1 is T+15, which represents the junction temperature value derived by default using the fixed calculation logic that the second temperature (junction temperature measurement) equals the first temperature (NTC temperature measurement) plus 15℃ before detailed calibration is performed for different service load conditions of the camera main control unit.

[0087] Figure 7 This is a schematic diagram of the third process of the temperature control method for the camera device provided in the embodiments of this application, as shown below. Figure 7 As shown, in some embodiments, the step 102 of "determining the temperature mapping relationship corresponding to the current operating condition based on the current operating condition" can be achieved through the following steps 1021 to 1023, which are explained in detail below.

[0088] In step 1021, multiple historical operating conditions of the camera device and the temperature mapping relationship corresponding to the multiple historical operating conditions are obtained.

[0089] Here, historical operating conditions refer to specific combinations of functional module working states that have occurred and been successfully recorded during the past operation of the camera equipment; among them, the combination of working states can be a combination of parameters consisting of the specific state values ​​of each functional module, a combination of intervals consisting of the parameter value ranges of each functional module, or a composite combination consisting of a mixture of specific state values ​​and parameter value ranges.

[0090] It should be noted that the temperature mapping relationship corresponding to multiple historical operating conditions refers to the stable temperature difference relationship between the first temperature and the second temperature, or between the first temperature / second temperature and each target temperature control zone, which is pre-calibrated and saved for each of the above combinations of operating states that have occurred.

[0091] In step 1022, if there is a target historical operating condition that matches the current operating condition among multiple historical operating conditions, the temperature mapping relationship corresponding to the target historical operating condition is determined as the temperature mapping relationship corresponding to the current operating condition.

[0092] It should be noted that the existence of a target historical operating condition that matches the current operating condition among multiple historical operating conditions refers to the existence of parameter combinations, interval combinations, or composite combinations that match the current combination of the activation states of each functional module of the camera equipment. Specifically, the parameters of each functional module in the current operating condition can be completely consistent with the specific state values ​​in the parameter combination, or fall within the historical state combination interval corresponding to the interval combination, or meet the mixed matching conditions of specific state values ​​and parameter value intervals in the composite combination. In such cases, the current operating condition is considered a known or existing operating condition. By directly retrieving and reusing the temperature mapping relationship corresponding to the known operating condition, rapid matching of the mapping relationship can be achieved, significantly improving the temperature calculation response speed while effectively saving computational overhead.

[0093] For example, if the current camera device only turns on the speaker at 50% volume and runs a specific algorithm, and if the historical database records a matching parameter combination (i.e., the same combination of speakers turning on at 50% volume and running a specific algorithm), or records a matching interval combination (e.g., the speaker volume is in the historical state interval of 45% to 55% and running a specific algorithm), then the temperature difference value corresponding to the target historical operating condition is directly extracted as the current mapping benchmark.

[0094] It should be noted that, theoretically, for the luminous intensity of supplementary lighting peripherals, each unit change in supplementary lighting intensity can be divided into different operating conditions; however, in practical applications, the range can also be divided according to the degree of influence of the change in supplementary lighting intensity on the second temperature.

[0095] For example, in a certain camera device, if the measured supplementary light intensity changes by about 7% and the second temperature fluctuates by about 1°C, the white light supplementary light intensity or infrared supplementary light intensity can be divided into multiple intensity ranges such as 0% to 7%, 7% to 14%, and 14% to 21%. Supplementary light states falling into the same intensity range are regarded as matching operating conditions, thereby reducing the number of operating conditions while ensuring mapping accuracy.

[0096] In step 1023, if there is no target historical operating condition that matches the current operating condition among multiple historical operating conditions, for the current operating condition, the first temperature and the second temperature are acquired multiple times at preset time intervals, and the difference between the first temperature and the second temperature acquired multiple times is calculated respectively; if the difference between the maximum and minimum values ​​in the difference of a consecutive preset number of times is less than or equal to a preset stable threshold, the temperature mapping relationship corresponding to the current operating condition is determined based on the difference.

[0097] It should be noted that when multiple historical operating conditions do not match the current operating condition, it means that the current combination of the activation states of the various functional modules of the camera device fails to match any parameter combination, interval combination, or composite combination in the historical records.

[0098] Specifically, the parameters of each functional module in the current operating condition are neither completely consistent with the specific state values ​​in any known parameter combination, nor fall within the historical state combination interval corresponding to any known interval combination, nor do they meet the mixed matching conditions of any known composite combination. This indicates that the camera equipment is currently in a completely new combination of operating states, belonging to a new operating condition that has not been pre-calibrated. At this time, it is necessary to dynamically detect and self-calibrate the temperature performance under this new operating condition in real time. For example, the first temperature and the second temperature are recorded multiple times every 1 minute (preset time interval) and the difference between the two is calculated. When the difference is the same for 5 consecutive times (preset number of times) or the fluctuation is very small (the difference between the maximum and minimum values ​​is less than or equal to the preset stability threshold), it indicates that the internal heat distribution under this new operating condition has reached a stable state. At this time, based on the recorded difference, the exclusive temperature mapping relationship between the first temperature and the second temperature under this new operating condition and each target temperature control area can be established. If the number of times the difference between the first and second temperatures recorded under the current operating condition is less than the preset number, the current state will not be defined as a new operating condition, but only as a temporary state of the camera equipment. This avoids the temperature mapping relationship being incorrectly recorded due to short-term transient tasks or occasional load changes. By recording the mapping relationship between the first and second temperatures under the new operating condition, even if the temperature measured by the first temperature acquisition device is abnormal, the start-stop control of the heating element can still be accurately executed using the second temperature acquired by the second temperature acquisition device.

[0099] It should be noted that the maximum and minimum values ​​among the differences of a preset number of consecutive sampling periods are used for calculation, rather than simply comparing the differences between the first and last two. This is because the difference between the maximum and minimum values ​​can truly and completely reflect the maximum fluctuation range of the temperature difference within the multiple consecutive sampling periods, thereby effectively avoiding misjudgments caused by transient thermal disturbances or sudden calculation jitters at a certain sampling moment in the middle, and ensuring that the confirmed difference corresponds to the truly converged and stable state of the internal thermal field.

[0100] In practice, if multiple historical operating conditions do not match the current operating condition, and the temperature mapping relationship corresponding to the current operating condition has not yet been determined based on the difference of a preset number of consecutive tests, then the preset default mapping relationship is temporarily set as the temperature mapping relationship corresponding to the current operating condition. After the temperature mapping relationship corresponding to the current operating condition is subsequently determined based on the difference of a preset number of consecutive tests, the default mapping relationship is updated using the temperature mapping relationship determined based on the difference. This default mapping relationship refers to the fixed calculation logic used earlier to derive the general junction temperature value.

[0101] For example, the default mapping relationship can be: the second temperature equals the first temperature plus 15℃; that is, when the first temperature acquisition device is an NTC thermistor and the second temperature acquisition device is the PN junction inside the camera main control unit, "junction temperature measurement = NTC temperature measurement + 15℃" can be temporarily determined as the temperature mapping relationship corresponding to the current operating condition.

[0102] The embodiments of this application solve the technical problems in related technologies where the temperature calculation logic of camera equipment is often pre-fixed, unable to adapt to the diverse combinations of internal functional module states, resulting in decreased temperature mapping accuracy when facing unknown new workloads, and response lag caused by frequent recalibration. By introducing an adaptive mechanism that combines historical operating condition reuse with dynamic self-calibration for new operating conditions, when matching items exist in multiple historical operating conditions, the existing temperature mapping relationship is directly reused, eliminating the need for repetitive calculation and verification processes, and effectively improving the speed of obtaining mapping relationships under known operating conditions and the agility of equipment temperature control; while when facing unknown new operating conditions, by repeatedly collecting dual reference temperatures at preset time intervals, and using the fluctuation range of the dual reference temperature difference (i.e., the difference between the maximum and minimum values) of multiple consecutive dual reference temperatures to strictly determine whether the internal heat distribution has reached a balanced state, and then using this as a reference, dynamically generating a unique temperature mapping relationship between the dual reference temperatures and multiple target temperature control areas under the current new operating condition. Compared to the basic static mapping scheme, this adaptive evolution mechanism gives the camera device the ability to autonomously adapt to and accumulate local thermodynamic properties under complex and variable workloads, ensuring that the device can maintain high precision and reliability of temperature control logic when facing any unknown combination of edge functions.

[0103] To facilitate understanding of the classification of operating conditions and the corresponding method for saving the mapping relationship between historical operating conditions and temperatures, examples are provided below using Table 2. Table 2 shows examples of the mapping relationship between NTC temperature measurement and junction temperature measurement under different prototype operating conditions. As shown in Table 2, it illustrates how the prototype's operating conditions are classified according to the status of the heating element, microphone, speaker, supplementary lighting, recording, preview, and intelligent algorithm at a certain moment, and how the mapping relationship between NTC temperature measurement and junction temperature measurement under that condition is recorded.

[0104]

[0105] Table 2 It should be noted that the states of each functional module in Table 2 together constitute an operating condition. For example, in condition 1, the prototype is in a state where the heating wire is off, the microphone is on, the speaker is playing sound source 2 at 50% volume, the white light supplement intensity is 50%, the infrared supplement intensity is 0%, recording is on, preview is on, and algorithm 1 is running. In this case, if the NTC temperature measurement is T, then the junction temperature measurement is T+13. This difference can be used as a mapping relationship between the NTC temperature measurement and the junction temperature measurement in condition 1. As another example, in condition 2, the prototype is in a state where the main control heating wire and the image sensor heating wire are on, the microphone is off, the speaker is playing sound source 1 at 50% volume, the white light supplement intensity is 0%, the infrared supplement intensity is 60%, recording is off, preview is off, and algorithm 5 is running. In this case, if the NTC temperature measurement is T, then the junction temperature measurement is T+11. This difference can be used as a mapping relationship between the NTC temperature measurement and the junction temperature measurement in condition 2.

[0106] Therefore, the combined states of different functional modules mainly change the heat generation of the camera main control unit itself. Specifically, changes in heat generation are sensitively captured by the second temperature acquisition device (junction temperature measurement) inside the camera main control unit, while having little impact on the external first temperature acquisition device (NTC temperature measurement). Due to this difference in internal and external thermal response, the temperature difference between the NTC temperature measurement and the junction temperature measurement is different. Therefore, when determining the temperature mapping relationship corresponding to the current operating condition, it can be first determined whether the current state of each functional module matches the historical operating conditions shown in Table 2; if they match, the corresponding temperature mapping relationship is directly called; if they do not match, the new operating condition is sampled and its stability is judged multiple times according to the aforementioned steps 1023, and a new temperature mapping relationship is generated after the stability condition is met.

[0107] In some embodiments, the preset stability threshold can be determined based on the hardware measurement accuracy of the first temperature acquisition device and the second temperature acquisition device, the heat dissipation and cooling rate of the internal cavity of the camera device, and the tolerance of the camera device to temperature mapping control errors.

[0108] For example, the preset stability threshold can be set to 0°C (i.e., requiring the difference to be exactly the same multiple times) or a very small tolerance value (such as 0.5°C).

[0109] It should be noted that the higher the preset stability threshold is set, the more lenient the judgment conditions of the camera device for the internal thermodynamic equilibrium state, thus enabling the mapping relationship calibration of the new working condition to be completed more quickly, but the accuracy of the calculated mapping temperature may be reduced accordingly; conversely, the lower the preset stability threshold is set, the more stringent the judgment conditions for the thermal equilibrium state, the higher the accuracy of the generated mapping relationship, but a longer convergence time is required.

[0110] In some embodiments, the temperature mapping relationship corresponding to the current operating condition can be determined based on the difference by the following method: calculating the average value of the difference for a preset number of consecutive times (or directly extracting the same difference that meets the preset stable threshold condition), and using this value as the stable reference temperature difference between the first temperature and the second temperature under the current operating condition. Then, combining the pre-obtained stable reference temperature difference with the heat conduction offset law between each target temperature control area, the temperature mapping relationship between the first temperature, the second temperature and the multiple target temperature control areas can be constructed.

[0111] For example, suppose the camera enters a new and unrecorded operating condition, with a preset time interval of 1 minute, a preset number of times of recording, and a preset stability threshold of 1°C. After entering the current operating condition, the camera synchronously acquires the first and second temperatures every minute and calculates the difference between the second and first temperatures. Assume the differences calculated in the first 5 times (i.e., from minute 1 to minute 5) are 13°C, 15°C, 16°C, 16°C, and 16°C respectively. At this point, the difference between the maximum value (16°C) and the minimum value (13°C) is 3°C, which is greater than the preset stability threshold (1°C), indicating that the internal cavity temperature is still dynamically conducting and has not yet reached thermal equilibrium.

[0112] Continue rolling sampling. Assume that the five consecutive differences measured from the 3rd to the 7th minute are 15.5℃, 16.5℃, 16℃, 16℃, and 16℃ respectively. At this time, the difference between the maximum and minimum values ​​of these five consecutive differences is 1℃, which satisfies the condition of being less than or equal to the preset stable threshold.

[0113] At this point, the camera determines that the internal heat distribution has reached a steady state and calculates the average of the five consecutive differences, which is 16°C. This average of 16°C is then determined as the current stable reference temperature difference (i.e., the second temperature equals the first temperature plus 16°C). Further, a pre-calibrated heat conduction offset pattern corresponding to this stable reference temperature difference (16°C) is retrieved. This pattern is assumed to be: the thermal equilibrium temperature of the first target temperature control area (e.g., the lens area) is 5°C higher than the first temperature, and the thermal equilibrium temperature of the second target temperature control area (e.g., the sensor area) is 8°C higher than the first temperature. Based on the above stable reference temperature difference and heat conduction offset law, the temperature mapping relationship corresponding to the current operating condition is finally determined as follows: For the first temperature, the mapped temperature of the first target temperature control area is equal to the first temperature plus 5℃, and the mapped temperature of the second target temperature control area is equal to the first temperature plus 8℃; For the second temperature, combined with the aforementioned reference temperature difference for algebraic conversion, the mapped temperature of the first target temperature control area is equal to the second temperature minus 11℃ (i.e., minus 16℃ plus 5℃), and the mapped temperature of the second target temperature control area is equal to the second temperature minus 8℃ (i.e., minus 16℃ plus 8℃).

[0114] In some embodiments, the multiple target temperature control areas may include the lens area, image sensor area, and camera main control unit area of ​​the camera device, and multiple heating elements are respectively disposed in the lens area, image sensor area, and camera main control unit area of ​​the camera device.

[0115] By specifically heating the lens area, the problems of frost and condensation on the lens surface in extremely cold environments can be effectively solved, ensuring light path transparency and obtaining clear detection images. By maintaining the temperature of the image sensor area, the photosensitive components can be ensured to operate in a stable thermodynamic environment, avoiding increased image noise or electrical parameter drift caused by extremely low temperatures, thereby ensuring image quality. By thermally compensating the camera main control unit area, the core processing chip can be ensured to remain above the preset minimum operating temperature threshold under low power consumption conditions, effectively preventing abnormal operation or failure to power on the camera equipment due to ambient temperature exceeding the tolerance limit of semiconductor devices, thus achieving comprehensive protection of the core functional modules of the camera equipment.

[0116] In some embodiments, the heating element can be a heating wire. Using a heating wire as a heating component allows it to fit the irregularly shaped structural surface inside the small cavity using its flexible physical properties, and it also has the advantages of high electrothermal conversion efficiency and uniform heat distribution.

[0117] In some embodiments, the heating wire disposed in the lens area may have a power of 1.5W; the heating wire disposed in the camera main control unit area may have a power of 6W; and the heating wire disposed in the image sensor area may have a power of 6W.

[0118] In practice, for a clearer understanding of the specific arrangement of multiple heating elements inside the camera device, please refer to [link / reference needed]. Figure 8 and Figure 9 , Figure 8 This is a schematic diagram showing the location distribution of the heating element in the lens area according to an embodiment of this application. Figure 9 This is a schematic diagram showing the location distribution of the heating element in the image sensor and camera main control unit area provided in an embodiment of this application. Combined with... Figure 8 and Figure 9 As shown, the heating wire (i.e., lens heating wire 10) located in the lens area can be attached to the lens protective cover; the heating wire (i.e., main control heating wire 20) located in the camera main control unit area can be attached to the main control heat sink; and the heating wire (i.e., image sensor heating wire 30) located in the image sensor area can be attached to the sensor heat sink.

[0119] Here, a lens cover refers to a transparent cover assembly that is installed on the housing of a camera device and located at the front of the lens to provide physical protection for the lens.

[0120] In some embodiments, the lens cover may also be a light-transmitting protective element, which is a transparent structural element disposed at the front end of the lens (e.g., but not limited to, a protective sheet made of glass, acrylic or polycarbonate).

[0121] By directly attaching the heating wire to the lens protective cover, the main control heat sink, and the sensor heat sink, the heat conduction path can be shortened, ensuring that heat can be quickly and directly compensated to each target temperature control area, thereby maintaining the thermodynamic balance of each area in extremely cold environments.

[0122] In step 103, the mapped temperatures corresponding to multiple target temperature control zones are determined based on the temperature mapping relationship, the first temperature, and the second temperature.

[0123] Here, mapped temperature refers to the actual equivalent temperature of multiple target temperature control zones at the current moment, calculated by using temperature mapping relationships to convert the temperature measurement node data (i.e., the first temperature or the second temperature) used as the calculation benchmark.

[0124] It should be noted that since the temperature mapping relationship has objectively revealed the thermodynamic transfer law and fixed temperature difference between the first temperature, the second temperature and each target temperature control zone under specific operating conditions, the real-time collected first temperature or second temperature can be substituted into the matching temperature mapping relationship to overcome the limitations of physical space and accurately map and calculate the current temperature of each area that is not directly equipped with a temperature sensor, thereby providing a quantitative control basis for subsequent adjustment of the heating element.

[0125] It should be noted that this embodiment does not require measuring the resistance of the heating element itself to infer its temperature, nor does it require establishing a complex mathematical model based on the heating element's resistance. For heating wires used in some camera devices, their resistance changes little with temperature, making it difficult to accurately reflect the temperature of the target temperature control area through resistance changes. Therefore, this embodiment utilizes the characteristic that the temperature difference between different locations within the small, enclosed cavity of the camera device tends to be stable. By using a first temperature, a second temperature, and a pre-calibrated temperature mapping relationship, the temperature of multiple target temperature control areas can be calculated, thus meeting the temperature control requirements of consumer electronics camera devices in low-temperature environments with relatively low implementation complexity.

[0126] In some embodiments, step 103 can be implemented in the following way: at preset time intervals, calculate the difference between the second temperature and the first temperature to obtain the first temperature difference; when the first temperature difference is greater than zero and less than a preset temperature difference threshold, use the temperature mapping relationship corresponding to the current operating condition to map the first temperature to the mapped temperature corresponding to multiple target temperature control zones; when the first temperature difference is less than or equal to zero, or when the first temperature difference is greater than or equal to the preset temperature difference threshold, use the temperature mapping relationship corresponding to the current operating condition to map the second temperature to the mapped temperature corresponding to multiple target temperature control zones.

[0127] Here, the preset temperature difference threshold refers to the dynamic temperature deviation boundary limit used to determine whether the first temperature acquisition device is working properly or whether there is an abnormal overlap in the local thermal environment around it.

[0128] It should be noted that during normal operation of the camera equipment, due to the heat generated by the camera's main control unit, the second temperature set inside the main control unit is usually higher than the first temperature set outside the main control unit under normal operating conditions. Therefore, the difference between the second temperature and the first temperature (i.e., the first temperature difference) should be greater than zero and stable within a preset envelope range. When the calculated first temperature difference is greater than zero and less than the preset temperature difference threshold, it indicates that the external first temperature acquisition device is working normally and is not interfered with by abnormal heat sources. In this case, the first temperature, which is more sensitive to changes in the external environment, is used preferentially for multi-path mapping calculation. However, when the first temperature difference is less than or equal to zero (i.e., an abnormal temperature inversion occurs), or when the first temperature difference is greater than or equal to the preset temperature difference threshold, it indicates that the external first temperature acquisition device may have experienced hardware failure, physical detachment, or direct interference from local heat conduction anomalies (such as uncontrolled continuous heating by external heating components), resulting in severe distortion of the acquired first temperature. At this point, the dependence on the first temperature is cut off, and the calculation is performed using the second temperature, which is less affected by external local thermal interference and is located inside the camera main control unit, as the new mapping benchmark.

[0129] The embodiments of this application solve the technical problem in related technologies where a single external temperature measurement node malfunctions or is interfered with by local thermal anomalies, causing the device to incorrectly control the temperature based on distorted temperature data, resulting in overheating or insufficient heating of the target area. By continuously calculating the temperature difference between the inside and outside of the camera's main control unit at preset time intervals and performing extreme value range verification with a preset temperature difference threshold, a dynamic self-cross-validation mechanism is constructed between the internal second temperature acquisition device and the external first temperature acquisition device. Based on this, relying on the multi-range diversion judgment logic of the first temperature difference, when the external temperature measurement is confirmed to be normal, the external first temperature is used as the benchmark. However, when abnormal distortion of the external temperature measurement data is accurately identified, the system can smoothly switch to using the protected internal second temperature for mapping. Compared with the conventional single-point mapping logic, this dual-temperature mutual verification and automatic benchmark switching mechanism significantly enhances the camera device's ability to perceive and respond to anomalies in the temperature acquisition components, ensuring the continuity and reliability of temperature mapping results under extreme abnormal operating conditions.

[0130] For example, taking a negative temperature coefficient thermistor as the first temperature acquisition device (acquiring NTC temperature measurement) and a PN junction inside the camera main control unit as the second temperature acquisition device (acquiring junction temperature measurement), the preset time period is set to 5 minutes, and the preset temperature difference threshold is 30℃. Every 5 minutes, the difference between the junction temperature measurement and the NTC temperature measurement (i.e., the first temperature difference) is calculated, and different mapping controls are executed according to the range in which the difference falls: if the currently calculated difference is 15℃, it meets the condition of being greater than 0℃ and less than the preset temperature difference threshold of 30℃. This phenomenon indicates that the external negative temperature coefficient thermistor is working normally. At this time, the temperature mapping relationship corresponding to the current operating condition is used to map the NTC temperature measurement to the mapped temperature corresponding to multiple target temperature control areas. If the currently calculated difference is -2℃ or 0℃, which meets the condition of being less than or equal to 0℃, this phenomenon indicates that the external negative temperature coefficient thermistor is likely being directly baked by an abnormal heat source (such as a malfunctioning heating wire), resulting in severe data distortion. At this time, the dependence on NTC temperature measurement is cut off, and the junction temperature measurement is mapped to the mapped temperature corresponding to multiple target temperature control areas using the temperature mapping relationship corresponding to the current operating condition. If the currently calculated difference is 35℃, which meets the condition of being greater than or equal to the preset temperature difference threshold of 30℃, this phenomenon indicates that the external negative temperature coefficient thermistor may have suffered hardware damage, physical disconnection of the circuit, or extreme local cold shock, resulting in abnormally low temperature measurement data. At this time, the junction temperature measurement is mapped to the mapped temperature corresponding to multiple target temperature control areas using the temperature mapping relationship corresponding to the current operating condition.

[0131] In some embodiments, when using the first temperature for temperature measurement and control, if any one of the multiple heating elements remains in the on state, then according to a preset verification cycle, based on the mapping relationship between the first temperature and the second temperature, it is verified whether any heating element still meets the on-state conditions; if the verification result indicates that any heating element still meets the on-state conditions, then the first temperature is used for temperature measurement and control; if the verification result indicates that any heating element does not meet the on-state conditions, then it is determined that there is a risk of temperature measurement abnormality in the first temperature acquisition device, and the system switches to using the second temperature for temperature measurement and control.

[0132] For example, the preset verification cycle can be 1 minute. The first temperature acquisition device can be an NTC thermistor, and the second temperature acquisition device can be the PN junction inside the camera control unit. The mapping relationship between the first temperature and the second temperature can be: junction temperature = NTC temperature + 15°C. When a certain heating wire is continuously on, every 1 minute, the mapping relationship is used to verify whether the current heating wire should continue to be on. If it should continue to be on, the NTC temperature measurement continues; if it should not continue to be on, the NTC temperature measurement is considered abnormal, and the junction temperature measurement is used subsequently.

[0133] It should be noted that when using only the default mapping relationship without fine-tuning for different operating conditions, the use of the second temperature instead of the first temperature for temperature control may cause a certain deviation in the actual ambient temperature corresponding to the start and stop of the heating element. For example, the preset logic may expect the heating element to shut down when the actual ambient temperature is approximately -10℃, but when using the default mapping relationship and switching to the second temperature for control, the heating element may shut down when the actual ambient temperature is between approximately -5℃ and 0℃. Since the heating control threshold of camera equipment usually has a safety margin, the above deviation will not affect the normal operation of the camera equipment, but it also illustrates the necessity of accurately calibrating the mapping relationship between the first and second temperatures for different operating conditions.

[0134] In some embodiments, the preset time period can be determined comprehensively based on the conduction convergence rate of the internal thermal balance of the small cavity camera device, the step frequency of the service load, and the computing power load of the microcontroller unit.

[0135] In some embodiments, the preset time period can be 5 minutes.

[0136] In some embodiments, the preset temperature difference threshold can be determined based on the inherent hardware measurement tolerances of the first and second temperature acquisition devices, the maximum range of the thermal field gradient envelope inside the camera device under various extreme computing load conditions, and the heat resistance safety threshold tolerance of the core semiconductor device.

[0137] In step 104, the working state of multiple heating elements is adjusted by using a temperature control unit according to the mapped temperature corresponding to multiple target temperature control zones.

[0138] In the embodiments of this application, a first temperature is acquired by a first temperature acquisition device located outside the camera main control unit, and a second temperature is acquired by a second temperature acquisition device located inside the camera main control unit. The current operating condition of the camera device is also acquired. Based on the temperature mapping relationship matching the current operating condition, a logical association is established between the first temperature, the second temperature, and the mapped temperatures corresponding to multiple target temperature control areas. Then, the temperature control unit adjusts the working state of multiple heating elements according to the determined mapped temperatures. Through the above scheme, combined with the dual temperature references acquired from inside and outside the camera main control unit, and the current specific operating condition of the camera device, accurate mapping and perception of the temperature of multiple target temperature control areas are achieved. Based on the determined mapped temperatures, precise linkage control of multiple heating elements arranged in multiple target temperature control areas is achieved, improving the accuracy and rationality of the camera device's temperature control and ensuring the stable operation of the camera device in various temperature environments.

[0139] To verify the camera's startup performance in low-temperature environments, in some experimental scenarios, the camera was started at an ambient temperature of -40°C, where the temperature of the main camera control unit area was approximately -40°C. After the camera was connected to power, the temperature control unit first controlled the heating element located in the main camera control unit area to heat the main camera control unit; after heating for approximately 2 minutes, the temperature of the main camera control unit area rose to approximately -20°C, at which point the temperature control unit powered on the main camera control unit.

[0140] Therefore, in extremely cold environments, the embodiments of this application can preheat the camera main control unit first, and then control it to be powered on after reaching the safe start-up temperature, thereby reducing the risk of direct start-up at low temperatures.

[0141] In other experimental scenarios, when the ambient temperature is above -20℃, the temperature of the camera main control unit area is also higher than or equal to the preset start-up temperature, and the temperature control unit can directly control the camera main control unit to power on.

[0142] The above experimental results show that the embodiments of this application can achieve preheating start-up in extremely cold environments such as -40℃, and can avoid unnecessary preheating wait in environments that meet the start-up temperature, thereby improving start-up efficiency.

[0143] In some embodiments, step 104 can be implemented as follows: for each of the multiple target temperature control regions, obtain the preset heating start threshold and preset heating stop threshold corresponding to the target temperature control region; when the mapped temperature corresponding to the target temperature control region is less than or equal to the preset heating start threshold, use the temperature control unit to control the heating element set in the target temperature control region to be in the on state, or increase the output power of the heating element; when the mapped temperature corresponding to the target temperature control region is greater than or equal to the preset heating stop threshold, use the temperature control unit to control the heating element set in the target temperature control region to be in the off state, or decrease the output power of the heating element.

[0144] Here, the preset heating start threshold refers to the minimum safe temperature limit required to allow components within the corresponding temperature control area to operate normally or to prevent physical degradation such as frost and condensation.

[0145] Here, the preset heating stop threshold refers to the highest safe temperature limit set for the components in the corresponding area to reach a suitable working thermal balance or to avoid local heat accumulation and overload caused by continuous heating.

[0146] It should be noted that due to the objective differences in the physical materials, temperature resistance limits, and business requirements of the electronic or optical components deployed in multiple target temperature control areas (such as the aforementioned lens area and image sensor area), the preset heating start threshold and preset heating stop threshold for each target temperature control area are usually independently and differentiated. For example, the preset heating start threshold for the lens area, which is for rapid defrosting and defogging, may be set relatively high; while the preset heating start threshold for the image sensor area, which is only to ensure that the photosensitive components do not suffer physical damage, low-temperature degradation, or severe temperature drift under extreme cold, may be set relatively low. By comparing the independently calculated mapped temperature of each temperature control area with its specific threshold, the previous temperature mapping results can be accurately translated into differentiated control execution for each target temperature control area.

[0147] The embodiments of this application solve the technical problem in related technologies where a uniform global heating strategy easily leads to overheating of some temperature-sensitive device areas and insufficient heating of some optical areas requiring high-temperature defrosting. By independently comparing and controlling the calculated mapped temperatures of each target temperature control area with preset heating start and stop thresholds configured independently for each area, decoupling and fine-tuning of multiple heating elements deployed in different physical locations is achieved. This differentiated temperature control logic not only closely matches the actual tolerance characteristics of different components inside the camera equipment, avoiding wasted power consumption caused by ineffective heating, but also further strengthens the operational stability of the camera equipment in extremely cold environments and the reliability of all-weather detection.

[0148] For example, taking the linkage control of the main control heating wire and the image sensor heating wire as an example, multiple target temperature control areas include a camera main control unit area and an image sensor area, and multiple heating elements include a main control heating wire disposed in the camera main control unit area and an image sensor heating wire disposed in the image sensor area. When the main control heating wire is in the off state, if the ambient temperature determined based on the temperature mapping relationship is lower than -15℃, or the first temperature is lower than 10℃, or the second temperature is lower than 20℃, then the temperature control unit controls the main control heating wire and the image sensor heating wire to be in the on state; when the main control heating wire is in the on state, if the ambient temperature determined based on the temperature mapping relationship is higher than -10℃, or the first temperature is higher than 60℃, or the second temperature is higher than 70℃, then the temperature control unit controls the main control heating wire and the image sensor heating wire to be in the off state.

[0149] It should be noted that after the main control heating wire is turned on, under the same ambient temperature, the heat generated by the main control heating wire will cause the first temperature collected by the first temperature acquisition unit and the second temperature collected by the second temperature acquisition unit to rise.

[0150] For example, when the main control heating wire is turned on, it will introduce a temperature rise of approximately 45°C to the NTC temperature and junction temperature under the same ambient temperature. Therefore, when the main control heating wire is in the off state and the on state, different first temperature thresholds and second temperature thresholds can be used to determine whether to turn the main control heating wire and the image sensor heating wire on or off, thereby avoiding misjudgment of the ambient temperature or the temperature of the target temperature control area due to the temperature rise introduced by the heating element itself.

[0151] Taking the control of the lens heating wire as an example, multiple target temperature control areas include the lens area, and multiple heating elements include the lens heating wire disposed in the lens area. When the main control heating wire is in the on state, if the ambient temperature determined based on the temperature mapping relationship is higher than 20°C, or the first temperature is higher than 90°C, or the second temperature is higher than 100°C, then the temperature control unit controls the lens heating wire to be in the off state; if the ambient temperature determined based on the temperature mapping relationship is lower than 15°C, or the first temperature is lower than 85°C, or the second temperature is lower than 95°C, then the temperature control unit controls the lens heating wire to be in the on state.

[0152] When the main heating wire is in the off state, if the ambient temperature determined based on the temperature mapping relationship is higher than 20℃, or the first temperature is higher than 45℃, or the second temperature is higher than 55℃, the lens heating wire is controlled to be in the off state by the temperature control unit; if the ambient temperature determined based on the temperature mapping relationship is lower than 15℃, or the first temperature is lower than 40℃, or the second temperature is lower than 50℃, the lens heating wire is controlled to be in the on state by the temperature control unit.

[0153] It should be noted that the lens heating wire is mainly used to heat the lens area to reduce the risk of frost, condensation, or fogging in the lens area under low-temperature conditions. Since the main control heating wire changes the heat distribution within the camera device cavity when turned on, and increases the NTC temperature and junction temperature at the same ambient temperature, the first and second temperature thresholds corresponding to the lens heating wire can differ when the main control heating wire is on and off. This allows the start / stop determination of the lens heating wire to match the current actual heat distribution state.

[0154] To verify the accuracy of the heating element start / stop logic and temperature mapping relationship in the embodiments of this application, the following explanation is provided in conjunction with Table 3. Table 3 shows examples of temperature measurement, mapping temperature, and heating element status of the camera device under different ambient temperatures. In the heating element status table, "1" indicates that the corresponding heating element is in the on state, and "0" indicates that the corresponding heating element is in the off state.

[0155]

[0156] Table 3 Table 3 shows that in low-temperature environments, the image sensor heating wire, main control heating wire, and lens heating wire are all in the on state. The main control heating wire and image sensor heating wire are turned on when the ambient temperature is approximately -15℃ and turned off when the ambient temperature is approximately -10℃. The lens heating wire is turned on when the ambient temperature is approximately 15℃ and turned off when the ambient temperature is approximately 20℃, which conforms to the preset heating control logic. Furthermore, the lens area temperature and sensor area temperature calculated using the first temperature and the calibrated temperature mapping relationship are basically consistent with the measured temperatures of the corresponding areas, with the error controlled within approximately 3℃. This indicates that the method of mapping the temperature of multiple target temperature control areas through single-point or dual-point temperature measurement has high accuracy.

[0157] Furthermore, Table 3 shows that the measured difference between the second and first temperatures is not always fixed at 15°C, but varies with operating conditions and the state of the heating element. Therefore, calibrating the mapping relationship between the first and second temperatures under different operating conditions can further improve the accuracy of subsequent temperature control using the second temperature instead of the first temperature. Moreover, when the heating element is on, the mapping difference between the first and second temperatures is affected by the actual output power of the heating element; when the output power decreases due to heating element aging, this mapping difference may change. Therefore, changes in the mapping difference can be used to detect the aging of the heating element and further adjust its power.

[0158] In some embodiments, the temperature control method for the camera device further includes: when at least one of the plurality of heating elements is in an on state, calculating the difference between a second temperature and a first temperature at preset time intervals to obtain a first temperature difference; obtaining a reference temperature difference corresponding to the current operating condition, and calculating the difference between the first temperature difference and the reference temperature difference to obtain a first difference offset; and when the first difference offset is greater than or equal to a preset aging threshold, adjusting the output power of the plurality of heating elements using a temperature control unit.

[0159] It should be noted that the first temperature difference offset objectively reflects the performance degradation and aging of the heating element's heating power after prolonged operation. When the heating element operates at full power, the heat it generates introduces a relatively fixed temperature rise difference between the core circuit and the external temperature sensing nodes, maintaining the second temperature at a reference temperature difference with the first temperature. As the heating element ages, its actual output power gradually decreases. Since the heat transfer medium around the second temperature sensing element is mainly a semiconductor solid with high thermal conductivity, while the heat transfer medium around the first temperature sensing element contains more cavity air with relatively poor thermal conductivity, when the overall heat generation of the heating assembly decreases, the decrease in the external first temperature will be significantly greater than that of the internal second temperature. This unequal cooling caused by the asymmetry in the thermal response of different media will cause an abnormally large increase in the first temperature difference, resulting in the first temperature difference offset obtained by subtracting the reference temperature difference from the first temperature difference reaching or exceeding the preset aging threshold. Under this condition, without active intervention, the disruption of the underlying thermal balance will lead to a severe misalignment of the temperature mapping relationship. Therefore, a feedforward compensation mechanism needs to be introduced, which uses the temperature control unit to directly increase the output power of at least one heating element that is aging, and compensates for the heat loss caused by aging through physical weighting, so as to promote the rapid reconstruction of the internal thermal field and its convergence back to a stable reference temperature difference range.

[0160] The embodiments of this application solve the technical problem in related technologies where the output power decreases due to the aging of heating devices after prolonged operation, leading to inaccurate temperature calculations and failure of low-temperature compensation. By continuously detecting the dynamic temperature difference between a first and second temperature while the heating element is on, and monitoring its deviation relative to a reference temperature difference, an aging self-diagnosis mechanism based on thermal mapping deviation is constructed. This control logic breaks through the conventional passive heating mode driven by fixed parameters. It can automatically identify the performance degradation of the heating component by utilizing abnormal deviations in the internal and external temperature differences, and intervene in advance to adjust the output power of the heating element for compensation when the first difference deviation reaches a preset aging threshold. This not only eliminates the cost of adding additional hardware electrical detection circuitry but also significantly extends the lifespan of the camera equipment for all-weather operation in extremely cold climates, further improving the long-term closed-loop reliability of the temperature mapping control architecture.

[0161] In some embodiments, the plurality of heating elements includes a main control heating wire disposed in the camera main control unit area and an image sensor heating wire disposed in the image sensor area. The method further includes: when the main control heating wire and the image sensor heating wire are in the on state, acquiring a first temperature and a second temperature at preset time intervals, calculating the difference between the second temperature and the first temperature to obtain a first temperature difference; acquiring a reference temperature difference corresponding to the current operating condition, and calculating the difference between the first temperature difference and the reference temperature difference to obtain a first difference offset; when the first difference offset is greater than or equal to a preset aging threshold, increasing the output power of the plurality of heating elements using a temperature control unit until the currently measured first temperature difference meets the reference temperature difference.

[0162] For example, the preset time period can be 1 minute, and the preset aging threshold can be 3℃. When the main control heating wire and the image sensor heating wire are in the on state, the first temperature difference between the junction temperature measurement and the negative temperature coefficient thermistor temperature measurement is calculated every 1 minute. When this first temperature difference becomes larger than the calibrated reference temperature difference, and the calculated first difference deviation reaches 3℃, it is determined that the heating wire has a serious aging phenomenon. At this time, the output power of the main control heating wire and the image sensor heating wire is increased until the temperature difference between them returns to the reference temperature difference.

[0163] In some embodiments, the camera device includes a protection switch, and the temperature control method of the camera device further includes: acquiring a third temperature collected by a third temperature acquisition device, wherein the third temperature acquisition device is disposed on a heat transfer path in which multiple heating elements transfer heat to multiple target temperature control areas; when the third temperature is greater than or equal to a preset operating temperature, the protection switch restricts the control of the temperature control unit on the multiple heating elements to make the multiple heating elements in an off state; when the third temperature is less than or equal to a preset recovery temperature, the protection switch releases the control of the temperature control unit to restore the control of the temperature control unit on the multiple heating elements; wherein the preset recovery temperature is lower than the preset operating temperature.

[0164] Here, a protection switch refers to a hardware protection circuit that is independent of the digital logic control of the temperature control unit and directly triggers the circuit to shut down or turn on in response to a physical temperature threshold.

[0165] Here, the third temperature acquisition device refers to a temperature sensing element that is independent of the first and second temperature acquisition devices used to perform temperature mapping logic.

[0166] Here, the preset operating temperature refers to the highest limit temperature threshold that indicates that heat has accumulated severely on the heat conduction path, and that continued heating will cause components in multiple target temperature control areas to face the risk of physical damage.

[0167] Here, the preset recovery temperature refers to the safe temperature limit that indicates the abnormal overheating state has been eliminated, the heat on the heat conduction path has dropped to a safe range, and reheating regulation is allowed.

[0168] It should be noted that the placement of the third temperature sensor on the heat transfer path from multiple heating elements to multiple target temperature control areas means that, in terms of physical spatial layout, the third temperature sensor is not directly placed at the center of the heat source or on the surface of the final heated device. Instead, it is deployed on structural components (such as thermally conductive silicone, metal thermally conductive brackets, or PCB copper paths) through which heat must be conducted from the heating elements to the target temperature control areas. This means that the third temperature reflects the intermediate temperature during the heat transfer process. Because its physical location is closer to the heating elements and on the heat flow path, its response speed to uncontrolled abnormal temperature rise of the heating elements is much faster than that of the target temperature control area, thus providing a more proactive overheat warning.

[0169] Furthermore, in the aforementioned embodiments, temperature control primarily relies on the temperature control unit executing software logic. In extreme cases such as software crashes, main controller failure, or simultaneous failure of mapped temperature measurement nodes, the camera equipment faces the risk of direct burnout due to uncontrolled heating. Therefore, a low-level physical defense mechanism that does not rely on complex software calculations is necessary. Simultaneously, setting a preset recovery temperature lower than the preset action temperature creates a safe hysteresis range in temperature control. Without this temperature difference, when the third temperature fluctuates slightly around the preset action temperature threshold, the protection switch will fall into a high-frequency opening and closing oscillation state. Such frequent relay engagement or MOSFET switching not only accelerates the aging and damage of switching components but also generates severe electromagnetic interference in the power supply circuit. Introducing a hysteresis range effectively avoids this problem, ensuring the stability of the hardware protection action.

[0170] In the embodiments of this application, the technical problems of relying solely on a single microprocessor to execute software temperature control logic in related technologies—lacking a hardware-level overheat protection mechanism when facing low-level hardware short circuits or main control program crashes, making it highly susceptible to thermal runaway and burnout of the equipment—and the single protection threshold easily leading to high-frequency oscillations of the switch, are addressed. By deploying an independent third temperature acquisition device along the heat transfer path and combining it with a protection switch possessing hysteresis characteristics, a final physical protection line independent of conventional temperature measurement mapping and software control is constructed. When the temperature of the heat transfer path is detected to reach its action limit, conventional control permissions are directly restricted and heating is forcibly disconnected; permissions are only released after the temperature drops to a lower recovery threshold. This mechanism not only protects the core components of the camera equipment from heat penetration damage under extreme software failures but also eliminates the risk of critical oscillation through asymmetrical action and recovery thresholds, improving the hardware-level safety redundancy and long-term service life of the temperature control architecture.

[0171] In some embodiments, the third temperature acquisition element may be disposed on a heat-conducting substrate at a predetermined distance from the first heat-conducting edge of the plurality of heating elements.

[0172] For example, for heating control of a specific image sensor area, a third temperature acquisition unit can be placed on the PCB copper heat dissipation layer, 2 to 3 millimeters away from the edge of the heating wire. By setting a precise preset distance, it avoids both direct interference from the instantaneous pulse heat of the heating wire causing false triggering due to excessively close distance and slow overheating response due to excessively large distance.

[0173] In some embodiments, the type of the third temperature acquisition device is the same as that of the first temperature acquisition device, for example, both are NTC thermistors. Using a consistent type of temperature acquisition device can effectively unify the bill of materials (BOM) and simplify the surface mount assembly process of the printed circuit board (PCB) while achieving an independent physical protection mechanism.

[0174] In practice, the protection switch restricts the temperature control unit's control over multiple heating elements to keep them in an off state. This can be achieved in the following ways: the protection switch responds to a hardware level signal that the third temperature is greater than or equal to the preset operating temperature by directly disconnecting the main power supply circuit of multiple heating elements (e.g., disconnecting the load switch connected in series on the power supply bus), or by forcibly pulling down / up the enable pin level of the temperature control unit output to the heating driver chip, thereby shielding the pulse width modulation (PWM) control signal output by the temperature control unit.

[0175] Correspondingly, the protection switch releases control of the temperature control unit to restore control of multiple heating elements. This can be achieved by the protection switch responding to a hardware level signal that the third temperature drops to less than or equal to the preset recovery temperature, either by reclosing the main power supply circuit or by releasing the level clamp on the enable pin of the heating driver chip, thereby allowing the heating driver chip to receive and execute the heating control signal output by the temperature control unit again.

[0176] To clearly illustrate the connection relationships between the protective switch and various circuit components, please refer to [link / reference]. Figure 10 and Figure 11 . Figure 10 This is a schematic diagram of the temperature sampling circuit structure of the protection switch provided in an embodiment of this application. Figure 11 This is a schematic diagram of the hysteresis comparator circuit structure of the protection switch provided in the embodiment of this application.

[0177] Combination Figure 10 and Figure 11As shown, the protective switch (i.e., by...) Figure 10 and Figure 11 The hardware temperature control switch (which together consists of a temperature sampling circuit and a hysteresis comparison circuit) includes a temperature sampling circuit and a hysteresis comparison circuit.

[0178] Specifically, such as Figure 10 As shown, the temperature sampling circuit includes a negative temperature coefficient thermistor TR2 as the third temperature acquisition element, as well as voltage divider resistors R4156 and R4155. One end of the thermistor TR2 is connected to the power supply terminal (3V3_MCU), and the other end is connected to ground after being connected in series with voltage divider resistors R4156 and R4155. The common node between voltage divider resistors R4156 and R4155 is led out and outputs a voltage signal (HEAT_VREF) reflecting the actual temperature.

[0179] like Figure 11 As shown, the hysteresis comparator circuit includes a comparator U54 (e.g., an LMV331TP chip) and its peripheral circuitry. The inverting input (N-terminal, pin 3) of comparator U54 receives the voltage signal (HEAT_VREF) output from the temperature sampling circuit via input resistor R303. The non-inverting input (P-terminal, pin 1) of comparator U54 is connected to the reference voltage node Vth; the reference voltage node Vth is formed by a voltage divider connected in series from the power supply terminal (3V3_MCU) via resistors R4150 and R4144, and grounded via pull-down resistor R4149. Furthermore, the output terminal (Vout, pin 4) of comparator U54 is connected to the power supply terminal (3V3_MCU) via pull-up resistor R4152 and grounded via filter capacitor C7288; simultaneously, the output terminal (Vout) is connected to the non-inverting input terminal (P-terminal) via feedback resistors R4154 and R4151, thus constructing a positive feedback loop to achieve the hysteresis characteristic. The output (Vout) of comparator U54 outputs a hardware pull-low control signal (HW_PULL_DOWN) via output resistor R4153.

[0180] Based on the above circuit structure, the thermistor TR2 and the peripheral circuit of comparator U54 cooperate to form an independent hardware temperature control switch. This hardware temperature control switch can be set at the edge of the circuit board and is configured to, in the event of a program execution abnormality, hardware failure, or the heating element being normally open and unable to be turned off, trigger the hysteresis comparator to flip its level based on the change in the HEAT_VREF voltage caused by the edge temperature (collected by TR2), and output a hardware pull-down control signal (HW_PULL_DOWN) to forcibly turn off multiple heating elements.

[0181] For example, Table 4 shows the operating temperature and recovery temperature of the hardware temperature control switch. As shown in Table 4, the preset operating ambient temperature for the hardware temperature control switch can be 35℃, and the corresponding on-board NTC operating temperature can be 45℃; the preset recovery ambient temperature for the hardware temperature control switch can be 6℃, and the corresponding on-board NTC recovery temperature can be 16℃.

[0182]

[0183] Table 4 As shown in Table 4, when the ambient temperature reaches 35℃ and the NTC temperature on the board reaches 45℃, the hardware temperature control switch takes effect to forcibly shut off the three heating wires; when the ambient temperature drops to 6℃ and the NTC temperature on the board drops to 16℃, the hardware temperature control switch stops working, and the temperature control unit resumes control of the heating wires. Because the recovery temperature is lower than the operating temperature, a hysteresis control range can be formed, avoiding frequent switching of the heating wires when the temperature fluctuates near the critical point.

[0184] To intuitively verify the actual control effect of the aforementioned protective switch, a test scenario was conducted, in which... Figure 12 Please provide an explanation. Figure 12 This is a schematic diagram of the action waveform of the protection switch provided in the embodiment of this application in a real test scenario.

[0185] like Figure 12 As shown, in this test, when the heating element malfunctioned and caused the temperature to rise continuously, Figure 12 The reference voltage that reflects the temperature change of the NTC on the board (i.e.) Figure 12 The HEAT_VREF value rises accordingly. When the NTC temperature on the board rises to approximately 48°C (at which point HEAT_VREF rises to approximately 582.5mV), the temperature control switch takes effect and is triggered, and its output control signal (i.e., Figure 12 The HW_PULL_DOWN signal is pulled low to force the heating wire to shut down with a faster response time. Subsequently, as the NTC temperature decreases, VREF also decreases. When the NTC temperature on the board drops to about 18°C ​​(at which point HEAT_VREF drops to about 365mV), the temperature control switch fails and the forced shutdown state is released. The HW_PULL_DOWN signal is restored and no longer interferes with the switching logic of the heating wire, thereby restoring the temperature control unit's control over the heating element.

[0186] It should be noted that due to the numerical tolerances of hardware components such as NTC thermistors, fixed resistors, and comparators used in the hardware temperature control switch, there may be some differences between the measured operating temperature and recovery temperature and the preset operating temperature and preset recovery temperature. If the difference is small, it is within the normal hardware tolerance range and will not affect the overheat protection effect of the hardware temperature control switch.

[0187] In some embodiments, before acquiring the second temperature from the second temperature acquisition element, the method further includes: when the camera main control unit is not powered on, if it is determined based on the first temperature that the temperature of the camera main control unit is lower than a preset start-up temperature, then using the temperature control unit, controlling the heating element disposed in the camera main control unit area and the heating element disposed in the image sensor area to be turned on, so as to preheat the camera main control unit and the image sensor area; if it is determined based on the first temperature that the temperature of the camera main control unit is higher than or equal to the preset start-up temperature, then using the temperature control unit, controlling the camera main control unit to be powered on, and after the camera main control unit is powered on, controlling the heating element disposed in the camera main control unit area and the heating element disposed in the image sensor area to be turned off. For example, the preset start-up temperature can be -20°C.

[0188] In the embodiments of this application, when the camera main control unit is not powered on, multiple heating elements are first controlled by the temperature control unit to preheat the camera main control unit and related target temperature control areas. The power-on condition is determined based on the first temperature collected by the first temperature acquisition element located outside the camera main control unit. This avoids the camera main control unit being directly powered on in extremely cold environments below its safe start-up temperature, thereby reducing the risk of chip malfunction, start-up failure, or device damage caused by low-temperature start-up. At the same time, the camera main control unit is powered on only after the preset start-up temperature is met, and the corresponding heating elements are turned off after power-on. This reduces unnecessary continuous heating power consumption while ensuring the reliability of low-temperature start-up, and improves the start-up stability and energy consumption control rationality of the camera equipment in extremely cold environments.

[0189] The following continues to describe the exemplary structure of the camera device provided in the embodiments of this application as a software module. In some embodiments, the camera device includes: a first temperature acquisition element, a second temperature acquisition element, a temperature control unit, a camera main control unit, and multiple heating elements; the first temperature acquisition element is disposed outside the camera main control unit and is used to acquire a first temperature; the second temperature acquisition element is disposed inside the camera main control unit and is used to acquire a second temperature; the multiple heating elements are respectively disposed in multiple target temperature regions; the temperature control unit is configured to adjust the working state of the multiple heating elements based on the temperature mapping relationship corresponding to the first temperature, the second temperature, and the current operating condition of the camera device, wherein the temperature mapping relationship includes the mapping relationship between the first temperature and the mapping temperature corresponding to the multiple target temperature control regions, and the mapping relationship between the second temperature and the mapping temperature corresponding to the multiple target temperature control regions.

[0190] In some embodiments, the temperature control unit is configured to, when the camera main control unit is not powered on, if the continuous on time of multiple heating elements exceeds a preset time threshold and the first temperature does not reach the preset start-up temperature, control the camera main control unit to power on, and when the camera main control unit is powered on, acquire the second temperature collected by the second temperature acquisition element.

[0191] In some embodiments, the first temperature acquisition unit and the second temperature acquisition unit are configured to acquire the first temperature and the second temperature multiple times at preset time intervals for the current operating condition when multiple historical operating conditions do not match the current operating condition.

[0192] In some embodiments, the camera device further includes: a third temperature acquisition element disposed on the heat transfer path of the plurality of heating elements transferring heat to the plurality of target temperature control areas, the third temperature acquisition element acquiring a third temperature; a protection switch configured to restrict the control of the temperature control unit on the plurality of heating elements when the third temperature is greater than or equal to a preset operating temperature, so that the plurality of heating elements are in an off state; and to release the control of the temperature control unit when the third temperature is less than or equal to a preset recovery temperature, so as to restore the control of the temperature control unit on the plurality of heating elements; wherein the preset recovery temperature is lower than the preset operating temperature.

[0193] This application embodiment provides a temperature control device 555 for a camera device. The camera device includes a temperature control unit, a camera main control unit, and multiple heating elements respectively disposed in multiple target temperature control areas. The device includes: The temperature acquisition module 5551 is used to acquire a first temperature acquired by a first temperature acquisition element and a second temperature acquired by a second temperature acquisition element, wherein the first temperature acquisition element is disposed outside the camera main control unit and the second temperature acquisition element is disposed inside the camera main control unit.

[0194] The temperature mapping module 5552 is used to acquire the current operating condition of the camera device and determine the temperature mapping relationship corresponding to the current operating condition based on the current operating condition. The temperature mapping relationship includes the mapping relationship between the first temperature and the mapping temperature corresponding to multiple target temperature control areas, and the mapping relationship between the second temperature and the mapping temperature corresponding to multiple target temperature control areas. Based on the temperature mapping relationship, the first temperature and the second temperature, the mapping temperature corresponding to multiple target temperature control areas is determined.

[0195] The heating control module 5553 is used to adjust the working status of multiple heating elements according to the mapped temperature corresponding to multiple target temperature control zones using the temperature control unit.

[0196] In some embodiments, the temperature acquisition module 5551 is further configured to, when the camera main control unit is not powered on, if the continuous on time of multiple heating elements exceeds a preset time threshold and the first temperature does not reach the preset start-up temperature, control the camera main control unit to power on and acquire the second temperature acquired by the second temperature acquisition element through the camera main control unit; and when the camera main control unit is powered on, acquire the second temperature acquired by the second temperature acquisition element through the camera main control unit.

[0197] In some embodiments, the temperature mapping module 5552 is further configured to acquire multiple historical operating conditions of the camera device and temperature mapping relationships corresponding to the multiple historical operating conditions; if a target historical operating condition matching the current operating condition exists among the multiple historical operating conditions, the temperature mapping relationship corresponding to the target historical operating condition is determined as the temperature mapping relationship corresponding to the current operating condition; if no target historical operating condition matching the current operating condition exists among the multiple historical operating conditions, for the current operating condition, a first temperature and a second temperature are acquired multiple times at a preset time interval, and the difference between the first temperature and the second temperature acquired multiple times is calculated respectively; if the difference between the maximum and minimum values ​​among the differences of a consecutive preset number of times is less than or equal to a preset stable threshold, the temperature mapping relationship corresponding to the current operating condition is determined based on the difference.

[0198] In some embodiments, the temperature mapping module 5552 is further configured to calculate the difference between the second temperature and the first temperature at preset time intervals to obtain a first temperature difference; when the first temperature difference is greater than zero and less than a preset temperature difference threshold, the first temperature is mapped to the mapped temperature corresponding to multiple target temperature control zones using the temperature mapping relationship corresponding to the current operating condition; when the first temperature difference is less than or equal to zero, or the first temperature difference is greater than or equal to the preset temperature difference threshold, the second temperature is mapped to the mapped temperature corresponding to multiple target temperature control zones using the temperature mapping relationship corresponding to the current operating condition.

[0199] In some embodiments, the temperature control device 555 of the camera device further includes: an offset calculation module 5554, configured to calculate the difference between the second temperature and the first temperature at preset time intervals when at least one of the multiple heating elements is in the on state, to obtain a first temperature difference; obtain a reference temperature difference corresponding to the current operating condition, and calculate the difference between the first temperature difference and the reference temperature difference to obtain a first difference offset; and a heating control module 5553, configured to adjust the output power of the multiple heating elements using a temperature control unit when the first difference offset is greater than or equal to a preset aging threshold.

[0200] In some embodiments, the camera device includes a protection switch, and the temperature mapping module 5552 is further configured to acquire a third temperature acquired by a third temperature acquisition device, wherein the third temperature acquisition device is disposed on a heat transfer path from multiple heating elements to multiple target temperature control areas; when the third temperature is greater than or equal to a preset operating temperature, the protection switch restricts the temperature control unit's control over the multiple heating elements to keep the multiple heating elements in an off state; the heating control module 5553 is further configured to release the protection switch's control over the temperature control unit when the third temperature is less than or equal to a preset recovery temperature, to restore the temperature control unit's control over the multiple heating elements; wherein the preset recovery temperature is lower than the preset operating temperature.

[0201] This application provides a computer program product, which includes a computer program or computer-executable instructions stored in a computer-readable storage medium. The processor of an electronic device reads the computer-executable instructions from the computer-readable storage medium and executes the computer-executable instructions, causing the electronic device to perform the temperature control method for a camera device described in this application embodiment.

[0202] This application provides a computer-readable storage medium storing computer-executable instructions or a computer program. When the computer-executable instructions or the computer program are executed by a processor, the processor will execute the temperature control method for the camera device provided in this application. For example, ... Figure 4 The temperature control method of the camera equipment is shown.

[0203] In summary, this application provides a highly reliable, adaptive temperature control solution for camera equipment with multiple safety redundancies. This effectively solves the problems of inaccurate temperature control and hardware damage caused by temperature sensor failure, variable workload, and extreme thermal shock in extremely cold environments. Overall, this application overcomes the limitations of static mapping models through dynamic operating condition matching and self-calibration mechanisms, achieving high-precision temperature extrapolation from a limited number of temperature measurement nodes to multiple core target areas. By constructing a dual-reference redundancy architecture where external environmental temperature measurement and internal junction temperature mutually verify each other, it accurately isolates data distortion caused by single device failure or localized thermal interference, ensuring the continuity of the temperature control reference under abnormal operating conditions. Simultaneously, by combining feedforward power intervention based on thermal gradient offset and differentiated start-stop logic decoupled from each temperature control region, it achieves refined thermal compensation allocated on demand, eliminating the contradiction between ineffective heating and insufficient defrosting. Finally, relying on independent temperature measurement along the heat transfer path and hardware protection switches with hysteresis characteristics, it constructs a low-level overheat protection line independent of conventional software calculations.

[0204] This application transforms the complex thermodynamic disturbances in extremely cold scenarios into a standardized control process that is quantifiable, self-correcting, and highly fault-tolerant. This not only significantly improves the all-weather operational stability of camera equipment in harsh natural environments and the service life of core components, but also provides reliable technical support for the efficient thermal management architecture design of outdoor precision electronic equipment.

[0205] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, and improvements made within the spirit and scope of this application are included within the scope of protection of this application.

Claims

1. A temperature control method for a camera device, characterized in that, The camera device includes a temperature control unit, a camera main control unit, and multiple heating elements respectively disposed in multiple target temperature control zones; the method includes: The system acquires a first temperature from a first temperature acquisition device and a second temperature from a second temperature acquisition device, wherein the first temperature acquisition device is located outside the camera main control unit and the second temperature acquisition device is located inside the camera main control unit. The current operating condition of the camera device is obtained, and based on the current operating condition, the temperature mapping relationship corresponding to the current operating condition is determined. The temperature mapping relationship includes the mapping relationship between the first temperature and the mapping temperature corresponding to the plurality of target temperature control areas, and the mapping relationship between the second temperature and the mapping temperature corresponding to the plurality of target temperature control areas. Based on the temperature mapping relationship, the first temperature, and the second temperature, the corresponding mapped temperatures of the plurality of target temperature control zones are determined. Using the temperature control unit, the working state of the multiple heating elements is adjusted according to the mapped temperature corresponding to the multiple target temperature control zones.

2. The method according to claim 1, characterized in that, The acquisition of the second temperature collected by the second temperature acquisition device includes: If the continuous on time of the plurality of heating elements exceeds a preset time threshold and the first temperature does not reach the preset start temperature when the camera main control unit is not powered on, the temperature control unit is used to control the camera main control unit to be powered on, and the second temperature collected by the second temperature acquisition element is obtained through the camera main control unit. When the camera control unit is powered on, the second temperature collected by the second temperature acquisition device is obtained through the camera control unit.

3. The method according to claim 1, characterized in that, The step of determining the temperature mapping relationship corresponding to the current operating condition based on the current operating condition includes: Obtain multiple historical operating conditions of the camera device, and the temperature mapping relationship corresponding to the multiple historical operating conditions; If there is a target historical operating condition that matches the current operating condition among the multiple historical operating conditions, the temperature mapping relationship corresponding to the target historical operating condition is determined as the temperature mapping relationship corresponding to the current operating condition. If no target historical operating condition matching the current operating condition exists among the multiple historical operating conditions, for the current operating condition, the first temperature and the second temperature are acquired multiple times at preset time intervals, and the difference between the first temperature and the second temperature acquired multiple times is calculated respectively; if the difference between the maximum and minimum values ​​among the differences for a consecutive preset number of times is less than or equal to a preset stable threshold, the temperature mapping relationship corresponding to the current operating condition is determined based on the difference.

4. The method according to claim 1, characterized in that, The step of determining the mapped temperature corresponding to the plurality of target temperature control zones based on the temperature mapping relationship, the first temperature, and the second temperature includes: At preset time intervals, the difference between the second temperature and the first temperature is calculated to obtain the first temperature difference. When the first temperature difference is greater than zero and less than the preset temperature difference threshold, the first temperature is mapped to the mapped temperature corresponding to the multiple target temperature control zones by utilizing the temperature mapping relationship corresponding to the current operating condition. When the first temperature difference is less than or equal to zero, or when the first temperature difference is greater than or equal to a preset temperature difference threshold, the second temperature is mapped to the mapped temperature corresponding to the multiple target temperature control zones by utilizing the temperature mapping relationship corresponding to the current operating condition.

5. The method according to claim 1, characterized in that, The method further includes: When at least one of the plurality of heating elements is in the on state, the difference between the second temperature and the first temperature is calculated at preset time intervals to obtain the first temperature difference. Obtain the reference temperature difference corresponding to the current operating condition, and calculate the difference between the first temperature difference value and the reference temperature difference to obtain the first difference offset; When the first difference offset is greater than or equal to a preset aging threshold, the output power of the plurality of heating elements is adjusted using the temperature control unit.

6. The method according to any one of claims 1 to 5, characterized in that, The camera device includes a protection switch, and the method further includes: A third temperature is acquired by a third temperature acquisition device, wherein the third temperature acquisition device is disposed on the heat transfer path from the plurality of heating elements to the plurality of target temperature control areas; When the third temperature is greater than or equal to the preset operating temperature, the protection switch restricts the temperature control unit's control over the plurality of heating elements, so that the plurality of heating elements are in an off state; If the third temperature is less than or equal to the preset recovery temperature, the protection switch releases control of the temperature control unit to restore control of the multiple heating elements by the temperature control unit. The preset recovery temperature is lower than the preset action temperature.

7. A camera device, characterized in that, The camera device includes: The system comprises a first temperature acquisition unit, a second temperature acquisition unit, a temperature control unit, a camera main control unit, and multiple heating elements. The first temperature acquisition device is disposed outside the camera main control unit and is used to acquire the first temperature; The second temperature acquisition device is installed inside the camera main control unit and is used to acquire a second temperature. The plurality of heating elements are respectively arranged in multiple target temperature zones; The temperature control unit is configured to adjust the working state of the plurality of heating elements based on the temperature mapping relationship between the first temperature, the second temperature and the current operating condition of the camera device. The temperature mapping relationship includes the mapping relationship between the first temperature and the mapping temperature corresponding to the plurality of target temperature control areas, and the mapping relationship between the second temperature and the mapping temperature corresponding to the plurality of target temperature control areas.

8. An electronic device, characterized in that, The electronic device includes: Memory is used to store executable instructions or computer programs. A processor, when executing computer-executable instructions or computer programs stored in the memory, implements the method according to any one of claims 1 to 6.

9. A computer-readable storage medium storing computer-executable instructions or a computer program, characterized in that, When the computer-executable instructions or computer program are executed by a processor, they implement the method described in any one of claims 1 to 6.

10. A computer program product comprising computer-executable instructions or a computer program, characterized in that, When the computer-executable instructions or computer program are executed by a processor, they implement the method according to any one of claims 1 to 6.

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