Rail transit electronic product heat dissipation structure

Abstract

The present application relates to rail transit electronic product heat dissipation technical field, especially to a kind of rail transit electronic product heat dissipation structure.It include mainboard and radiator, the mainboard is equipped with heating device, internal temperature sensor and buzzer early warning module, the mainboard is fixed with hook assembly symmetrically, the radiator includes heat dissipation copper pipe and equidistantly installed heat dissipation fin on heat dissipation copper pipe, the bottom end center of heat dissipation copper pipe is fixedly connected with the heat conduction plate that is contacted with heating device, heat conduction silicone layer is arranged between heat conduction plate and heating device, one side of heat dissipation fin is fixed with heat dissipation fan, the both sides of heat dissipation fan are equipped with locking assembly that is matched with hook assembly.The present application realizes the tool-free disassembly of radiator by the quick cooperation of hook assembly and locking assembly, two sides locking assembly realizes synchronous locking and unlocking by U-shaped driving arm, avoid to cause oblique extrusion to heating device, combine temperature sensor and buzzer to realize overheating early warning, heat dissipation is uniform and reliable.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for rail transit electronic products, specifically a heat dissipation structure for rail transit electronic products. Background Technology

[0002] With the development of the semiconductor industry, the integration level inside chips is becoming increasingly higher, and the functions of rail transit electronic products are becoming increasingly complex. The heat generated during the operation of electronic products increases significantly. If the heat cannot be dissipated in time, it will cause the operating temperature of the equipment to rise, thereby reducing operating efficiency, shortening service life, and in severe cases, even causing equipment failure, burning out components, and affecting the normal operation of trains.

[0003] Existing heat dissipation structures for electronic products are mainly divided into passive and active heat dissipation structures. Passive heat dissipation relies on heat conduction and radiation from metal heat sinks. Chips and other heat-generating components are in direct contact with the heat sink. While simple in structure, its heat dissipation efficiency and area are limited, failing to meet the heat dissipation requirements of high-performance equipment. Active heat dissipation often employs fans and water cooling. Water cooling occupies a large space, has difficulty in obtaining coolant, and leaks can affect other equipment. Existing fan cooling devices have significant drawbacks: First, most fans operate at a fixed speed, maintaining a constant cooling output regardless of changes in actual heat generation or ambient temperature, leading to energy waste at low loads and insufficient cooling at high loads; second, some adjustable-speed cooling devices can only be adjusted based on a single temperature parameter, resulting in low precision and inability to adapt to dynamic cooling needs; third, fans are prone to failure after prolonged operation, affecting heat dissipation performance.

[0004] Furthermore, traditional methods of fixing heatsinks to motherboards often use screws, which are inconvenient to install and remove, especially when maintaining or replacing the heatsink, requiring tools and being time-consuming and laborious. Moreover, traditional locking methods are usually single-sided, requiring screws to be tightened on both sides separately. This is not only cumbersome but also prone to causing the heatsink to tilt due to uneven tightening force on both sides, resulting in oblique pressure on heat-generating components. This could damage the heatsink or cause uneven distribution of the thermal paste layer, affecting heat dissipation. Summary of the Invention

[0005] To solve the above-mentioned technical problems, the present invention provides a heat dissipation structure for rail transit electronic products. This invention provides a heat dissipation structure for rail transit electronic products, comprising a motherboard and a heat sink. The motherboard is characterized by having a heat-generating device, an internal temperature sensor, and a buzzer warning module mounted on it. Hook assemblies are symmetrically fixed to the motherboard. The heat sink includes heat dissipation copper pipes and heat dissipation fins equidistantly mounted on the copper pipes. A heat-conducting plate, in contact with the heat-generating device, is fixedly connected to the center of the bottom end of each copper pipe. A thermally conductive silicone layer is provided between the heat-conducting plate and the heat-generating device. A cooling fan is fixed to one side of each heat dissipation fin, and locking assemblies that cooperate with the hook assemblies are mounted on both sides of the cooling fan.

[0006] Preferably, the hook assembly includes a mounting base that is fixedly connected to the motherboard, and the mounting base is integrally provided with a hook.

[0007] Preferably, the locking assembly includes a mounting plate, with one mounting plate on each side of the cooling fan. A vertical groove is formed on the mounting plate, and a slider is slidably connected within the vertical groove. A rotating plate is hinged to the slider, and a hanging groove that mates with a hook is provided on the rotating plate. A turntable is rotatably connected to one side of the mounting plate via a rotating shaft. The turntable has an involute groove and an arc-shaped groove, with one end of the involute groove communicating with one end of the arc-shaped groove. A drive rod is fixed to the slider, and the drive rod mates with the involute groove and the arc-shaped groove.

[0008] Preferably, the two turntables are fixedly connected by a U-shaped drive arm.

[0009] Preferably, the bottom of the slider is provided with symmetrical ear plates, and a fixed shaft is fixed between the two ear plates, and the rotating plate is hinged to the fixed shaft.

[0010] Preferably, a torsion spring is sleeved on the fixed shaft, and the two ends of the torsion spring are respectively engaged with the slider and the rotating plate.

[0011] Preferably, an external temperature sensor is mounted on the heat dissipation fins.

[0012] Preferably, the vertical groove extends to the bottom end of the mounting plate.

[0013] Preferably, when the drive rod is located in the arc-shaped groove, the locking assembly and the hook assembly are in a locked state.

[0014] Compared with related technologies, the present invention provides the following beneficial effects: By using the hook assembly and locking assembly, rotating the U-shaped drive arm can lock or disengage the suspension slot on the rotating plate from the hook, allowing the radiator to be installed and removed without tools, facilitating maintenance and replacement.

[0015] Two turntables are fixedly connected by a U-shaped drive arm. When the U-shaped drive arm is rotated, the locking components on both sides move synchronously, achieving simultaneous locking or unlocking. Compared to the traditional method of locking with a single screw, this invention avoids the heat sink tilting due to uneven locking force on both sides, thus preventing oblique compression of the heat-generating device and protecting it from damage. At the same time, it ensures uniform adhesion between the heat-conducting plate and the heat-generating device, ensuring consistent thickness of the thermally conductive silicone layer and improving heat dissipation.

[0016] Multiple copper heat pipes are used to connect to the heat conduction plate, which evenly conducts heat to each heat dissipation fin. Combined with the cooling fan for forced air cooling, it avoids local overheating.

[0017] An internal temperature sensor monitors the temperature of the heating element in real time, while an external temperature sensor monitors the ambient temperature. When the temperature is abnormal or the fan malfunctions, the buzzer warning module will sound an alarm to remind the operator to handle the situation in time and prevent the equipment from being damaged due to overheating.

[0018] After the drive rod enters the arc-shaped groove, it forms a self-locking state, ensuring that the cooling fan and the motherboard are firmly fixed and do not loosen. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram showing the relative positions of the turntable and the mounting plate of the present invention; Figure 3 This is a schematic diagram showing the distribution of the two mounting plates of the present invention; Figure 4 This is a schematic diagram of the mounting plate structure of the present invention; Figure 5 This is a schematic diagram of the rotating plate structure of the present invention.

[0020] The following components are labeled in the diagram: 1. Mainboard; 2. Heat sink; 3. Heating element; 4. Internal temperature sensor; 5. Buzzer warning module; 6. Hook assembly; 7. Copper heat pipe; 8. Heat sink fins; 9. Heat conduction plate; 10. Cooling fan; 11. Locking assembly; 12. Mounting base; 13. Hook; 14. Mounting plate; 15. Vertical slide; 16. Slider; 17. Rotating plate; 18. Suspension groove; 19. Shaft; 20. Turntable; 21. Involute groove; 22. Arc groove; 23. Drive rod; 24. U-shaped drive arm; 25. Ear plate; 26. Fixed shaft; 27. Torsion spring; 28. External temperature sensor. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] Please refer to the following: Figures 1 to 5A heat dissipation structure for rail transit electronic products includes a motherboard 1 and a heat sink 2. The motherboard 1 is the core circuit board of the electronic product, on which heat-generating devices 3 (such as power chips, processors, etc.), an internal temperature sensor 4, and a buzzer warning module 5 are mounted. The internal temperature sensor 4 is positioned close to or near the heat-generating device 3 to detect the temperature of the heat-generating device 3 in real time. The buzzer warning module 5 is used to issue an audible alarm in abnormal situations.

[0023] Hook assemblies 6 are symmetrically fixed on the motherboard 1. Specifically, the hook assembly 6 includes a fixing base 12 fixedly connected to the motherboard 1, and a hook 13 is integrally provided on the fixing base 12. The opening of the hook 13 faces the installation direction of the heat sink 2.

[0024] The heat sink 2 includes multiple copper heat pipes 7 and heat dissipation fins 8 equidistantly mounted on the copper heat pipes 7. A heat-conducting plate 9 is fixedly connected to the center of the bottom end of each copper heat pipe 7, and the heat-conducting plate 9 contacts and engages with the heat-generating device 3. To ensure good heat conduction, a thermally conductive silicone layer (used to fill tiny gaps) is provided between the heat-conducting plate 9 and the heat-generating device 3. A cooling fan 10 is fixed to one side of the heat dissipation fins 8, and the air outlet of the cooling fan 10 faces the heat dissipation fins 8. Locking components 11 that engage with the hook assembly 6 are installed on both sides of the cooling fan 10.

[0025] The locking assembly 11 has the following specific structure: it includes a mounting plate 14, with one mounting plate 14 on each side of the cooling fan 10. A vertical groove 15 is provided on the mounting plate 14, and a slider 16 is slidably connected within the vertical groove 15. A rotating plate 17 is hinged to the slider 16, and a hanging groove 18 is provided on the rotating plate 17 to cooperate with the hook 13. To achieve the hinge, symmetrical ear plates 25 are provided at the bottom of the slider 16, and a fixed shaft 26 is fixed between the two ear plates 25. The rotating plate 17 is hinged to the fixed shaft 26. A torsion spring 27 is sleeved on the fixed shaft 26, and both ends of the torsion spring 27 are respectively engaged with the slider 16 and the rotating plate 17, so that the rotating plate 17 maintains a downward tilt angle in its free state, facilitating the hook 13 to enter the hanging groove 18.

[0026] A turntable 20 is rotatably connected to one side of the mounting plate 14 via a pivot 19. The turntable 20 has an involute groove 21 and an arc-shaped groove 22, with one end of the involute groove 21 communicating with one end of the arc-shaped groove 22. A drive rod 23 is fixed to the slider 16, extending into and engaging with the involute groove 21 and the arc-shaped groove 22. The two turntables 20 are fixedly connected by a U-shaped drive arm 24, and rotating the U-shaped drive arm 24 synchronously drives the two turntables 20 to rotate. This design ensures that the actions of the locking components 11 on both sides are completely synchronized, avoiding the locking asynchrony problem that may occur when operating them separately.

[0027] In addition, to further optimize temperature monitoring, an external temperature sensor 28 is installed on the heat sink 8 to detect the ambient temperature or the temperature of the heat sink fins. A vertical slide 15 extends to the bottom of the mounting plate 14 to facilitate the insertion and removal of the slider 16.

[0028] It should be emphasized that the curvature of the arc-shaped groove 22 is sufficient to prevent the locking assembly 11 from being unlocked due to slight accidental contact with the U-shaped drive arm 24. The cooling fan 10 and the heat sink fins 8 are fixedly connected by spring clips.

[0029] The working principle of the heat dissipation structure for this rail transit electronic product is as follows: Installation Process: The operator holds the heatsink 2 and aligns the mounting plates 14 on both sides of the cooling fan 10 with the hook assembly 6 on the motherboard 1. The heatsink 2 is lowered so that the end of the hook 13 enters the vicinity of the suspension groove 18 on the rotating plate 17. Then, the U-shaped drive arm 24 is rotated, causing the two turntables 20 to rotate synchronously. The involute groove 21 on the turntable 20 pushes the slider 16 upward along the vertical slide groove 15 via the drive rod 23. The slider 16 causes the rotating plate 17 to rise, and the suspension groove 18 gradually hooks the hook 13. Because the two turntables 20 are rigidly connected by the U-shaped drive arm 24, the sliders 16 on both sides rise at the same distance, ensuring that the heatsink 2 moves downward in parallel and the heat-conducting plate 9 is evenly pressed onto the heat-generating device 3 without tilting. When the drive rod 23 enters the arc-shaped groove 22, the position of the slider 16 is locked. At this time, the suspension groove 18 and the hook 13 are tightly engaged, and the heatsink 2 is firmly pressed onto the motherboard 1. The heat-conducting plate 9 is in close contact with the heat-generating device 3 through the thermally conductive silicone layer.

[0030] Heat dissipation: The heat generated by the heat-generating device 3 during operation is transferred to the heat dissipation copper pipe 7 via the thermally conductive silicone layer and heat-conducting plate 9. The heat dissipation copper pipe 7 then rapidly conducts the heat to the heat dissipation fins 8. The cooling fan 10 operates, forcing airflow across the surface of the heat dissipation fins 8 to carry away the heat. An internal temperature sensor 4 monitors the temperature of the heat-generating device 3 in real time, while an external temperature sensor 28 monitors the ambient temperature. A controller on the motherboard 1 (such as a CPU integrated on the motherboard, not shown in the figure) can dynamically adjust the speed of the cooling fan 10 based on the temperature data, achieving a balance between energy saving and heat dissipation.

[0031] Temperature monitoring and early warning: When the temperature detected by the internal temperature sensor 4 or the external temperature sensor 28 exceeds the set threshold (e.g., internal temperature ≥ 85℃), or when the controller detects that the speed of the cooling fan 10 is abnormal (e.g., below the preset value, stuck, or stopped), the motherboard 1 controls the buzzer early warning module 5 to sound an alarm, reminding the operator to check and handle it in time to avoid damage to the equipment due to overheating.

[0032] Disassembly process: When it is necessary to disassemble the radiator 2, rotate the U-shaped drive arm 24 in the opposite direction. The drive rod 23 exits from the arc-shaped groove 22 and moves in the opposite direction along the involute groove 21. The slider 16 drives the rotating plate 17 to descend synchronously. The suspension groove 18 disengages from the hook 13, and the radiator 2 can be removed upwards. The entire process unlocks simultaneously on both sides, without the need for individual operation.

[0033] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A heat dissipation structure for rail transit electronic products, comprising a motherboard (1) and a heat sink (2), characterized in that, The motherboard (1) is equipped with a heating device (3), an internal temperature sensor (4) and a buzzer warning module (5). Hook assemblies (6) are symmetrically fixed on the motherboard (1). The heat sink (2) includes a heat dissipation copper pipe (7) and heat dissipation fins (8) installed at equal intervals on the heat dissipation copper pipe (7). A heat-conducting plate (9) that contacts and cooperates with the heating device (3) is fixedly connected at the bottom center of the heat dissipation copper pipe (7). A heat-conducting silicone layer is provided between the heat-conducting plate (9) and the heating device (3). A cooling fan (10) is fixed on one side of the heat dissipation fins (8). Locking assemblies (11) that cooperate with the hook assembly (6) are installed on both sides of the cooling fan (10).

2. The heat dissipation structure for rail transit electronic products according to claim 1, characterized in that, The hook assembly (6) includes a fixing seat (12) fixedly connected to the main board (1), and the fixing seat (12) is integrally provided with a hook (13).

3. The heat dissipation structure for rail transit electronic products according to claim 2, characterized in that, The locking assembly (11) includes a mounting plate (14). The mounting plate (14) is provided on both sides of the cooling fan (10). A vertical groove (15) is provided on the mounting plate (14). A slider (16) is slidably connected in the vertical groove (15). A rotating plate (17) is hinged on the slider (16). A hanging groove (18) that cooperates with the hook (13) is provided on the rotating plate (17). A turntable (20) is rotatably connected to one side of the mounting plate (14) through a rotating shaft (19). An involute groove (21) and an arc groove (22) are provided on the turntable (20). One end of the involute groove (21) is connected to one end of the arc groove (22). A drive rod (23) is fixed on the slider (16). The drive rod (23) cooperates with the involute groove (21) and the arc groove (22).

4. The heat dissipation structure for rail transit electronic products according to claim 3, characterized in that, The two turntables (20) are fixedly connected by a U-shaped drive arm (24).

5. A heat dissipation structure for rail transit electronic products according to claim 3, characterized in that, The bottom of the slider (16) is symmetrically provided with ear plates (25), and a fixed shaft (26) is fixed between the two ear plates (25). The rotating plate (17) is hinged to the fixed shaft (26).

6. The heat dissipation structure for rail transit electronic products according to claim 3, characterized in that, A torsion spring (27) is sleeved on the fixed shaft (26), and the two ends of the torsion spring (27) are respectively engaged with the slider (16) and the rotating plate (17).

7. The heat dissipation structure for rail transit electronic products according to claim 1, characterized in that, An external temperature sensor (28) is installed on the heat dissipation fins (8).

8. The heat dissipation structure for rail transit electronic products according to claim 3, characterized in that, The vertical groove (15) extends to the bottom of the mounting plate (14).

9. A heat dissipation structure for rail transit electronic products according to claim 3, characterized in that, When the drive rod (23) is located in the arc groove (22), the locking assembly (11) and the hook assembly (6) are in a locked state.

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