Wiring board device

Abstract

A wiring board device includes a multilayer board structure and a differential pair trace. The multilayer board structure includes two board layers and a core layer sandwiched between the board layers. The differential pair trace includes a first signal via and a second signal via. The first signal via includes a first through-hole and a first laser via, and the first laser via is electrically connected to the first through-hole. The second signal via includes a second through-hole and a second laser via, and the first through-hole and the second through-hole are located in the core layer, and the second laser via is electrically connected to the second through-hole. The first through-hole is parallel to the second through-hole and has a first spacing therebetween. The first laser via and the second laser via are completely located between the imaginary extension lines of the first through-hole and the second through-hole, respectively, and the first laser via and the second laser via have a second spacing therebetween, which is smaller than the first spacing. In the above structure, the wiring board device of the present application can reduce the crosstalk effect in the signal transmission process and improve the signal integrity.

Description

Technical Field

[0001] This invention relates to a patch panel device, and more particularly to a patch panel device that provides differential signal transmission. Background Technology

[0002] As electronic products become increasingly diverse in functionality, system design faces growing challenges in balancing performance, size, speed, and cost. Modern integrated circuit (IC) packaging designs must not only accommodate high-density layouts but also meet stringent signal integrity (SI) and power integrity (PI) requirements for high-speed data transmission.

[0003] However, as the components on the circuit board of electronic products are increasingly densely packed, high-speed and high-frequency signals within the circuit board are affected by crosstalk during transmission, such as far-end crosstalk, which affects signal integrity.

[0004] It is evident that the aforementioned technology still has inconveniences and shortcomings, requiring further improvement. Therefore, effectively addressing these inconveniences and shortcomings is a crucial research and development issue and a pressing goal for improvement in related fields. Summary of the Invention

[0005] One object of the present invention is to provide a wiring board device to solve the difficulties mentioned in the prior art.

[0006] An embodiment of the present invention provides a wiring board device. The wiring board device includes a multilayer board structure and a plurality of differential pair traces. The multilayer board structure includes a core layer, at least one first board layer, and a plurality of second board layers stacked on top of each other. The core layer is sandwiched between the first board layers and the second board layers. Each differential pair trace includes a first signal via and a second signal via. The first signal via includes a first through-hole and a first laser via. The first through-hole is located within the core layer, and the first laser via is sequentially disposed within the second board layers and electrically connected to the first through-hole. The second signal via includes a second through-hole and a second laser via. The second through-hole is located within the core layer, and the second laser via is sequentially disposed within the second board layers and electrically connected to the second through-hole.

[0007] Thus, viewed in cross-section: the patterns of the first signal via and the second signal via are mirror symmetrical to each other; the first and second vias are parallel to each other and have a first distance between them; the first and second laser vias are both located between the imaginary extension lines of the first and second vias; and there is a second distance between the first and second laser vias that is smaller than the first distance.

[0008] According to one or more embodiments of the present invention, in the above-described wiring board device, the first laser guide hole and the second laser guide hole are parallel to each other or gradually approach or gradually move away from each other from the core layer to these second board layers.

[0009] According to one or more embodiments of the present invention, in the above-described wiring board device, the patterns of the first laser guide hole and the second laser guide hole are both close to each other.

[0010] According to one or more embodiments of the present invention, in the above-described wiring board device, the first laser guide hole includes a first segment and a second segment, the first segment connecting the second segment and a first through hole; the second laser guide hole includes a third segment and a fourth segment, the third segment connecting the fourth segment and the second through hole; a first through-hole spacing is provided between the first segment and the third segment; and a second through-hole spacing is provided between the second segment and the fourth segment. The first through-hole spacing is greater than the second through-hole spacing, or the second through-hole spacing is greater than the first through-hole spacing.

[0011] According to one or more embodiments of the present invention, in the above-described wiring board device, the patterns of the first laser guide hole and the second laser guide hole are both straight lines, and the first laser guide hole is parallel to the first through hole, and the second laser guide hole is parallel to the second through hole.

[0012] According to one or more embodiments of the present invention, in the above-described wiring board device, the first signal via further includes a first solder ball through-hole, which is located within the second substrate layers and is used to connect a first solder ball. The second signal via further includes a second solder ball through-hole, which is located within the second substrate layers and is used to connect a second solder ball. A first laser via connects the first through-hole and the first solder ball through-hole, and a second laser via connects the second through-hole and the second solder ball through-hole, wherein the first solder ball through-hole and the second solder ball through-hole have a first interval greater than a first spacing between them.

[0013] According to one or more embodiments of the present invention, in the above-described wiring board device, the imaginary extension lines of the first via and the second via have a configuration area between them. The first signal via and the second signal via do not have any laser vias outside the configuration area.

[0014] According to one or more embodiments of the present invention, in the above-described wiring board device, the axis connecting the first through hole and the second through hole has an extending direction, and the first laser guide hole and the second laser guide hole extend along the extending direction respectively.

[0015] According to one or more embodiments of the present invention, in the above-described wiring board device, any two adjacent laser guide holes of differential pair traces have a trace spacing between each other, and the trace spacing is greater than a second spacing.

[0016] According to one or more embodiments of the present invention, in the above-described wiring board device, the wiring spacing is 6 to 30 times the second spacing.

[0017] According to one or more embodiments of the present invention, in the above-described wiring board device, the patterns of the first laser guide hole and the second laser guide hole are both stepped and symmetrically arranged.

[0018] According to one or more embodiments of the present invention, in the above-described wiring board device, the multilayer board structure further includes a grounding layer, the grounding layer having a plurality of closed openings spaced apart, each closed opening surrounding and exposing the corresponding differential pair trace.

[0019] Thus, through the above architecture, even if the positions of the components on the patch panel become increasingly close, the patch panel device of the present invention can still reduce the crosstalk during signal transmission and improve signal integrity.

[0020] The above description is only used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings. Attached Figure Description

[0021] To make the above and other objects, features, advantages and embodiments of the present invention more apparent and understandable, the accompanying drawings are described below:

[0022] Figure 1 This is a partial top view of a wiring board device according to an embodiment of the present invention;

[0023] Figure 2 for Figure 1 A cross-sectional view of the wiring board assembly along line segment AA;

[0024] Figure 3 This is a side view of a differential pair trace according to an embodiment of the present invention;

[0025] Figure 4 This is a side view of a differential pair trace according to an embodiment of the present invention;

[0026] Figure 5 for Figure 1 A cross-sectional view of the wiring board assembly along line segment BB.

[0027] [Symbol Explanation]

[0028] 10: Wiring board assembly

[0029] 100: Multi-layer board structure

[0030] 110: Core layer

[0031] 120: First board layer

[0032] 130: Second board layer

[0033] 140: Grounding layer

[0034] 141: Closed opening

[0035] 160: Welding spherical surface

[0036] 300, 300a, 300b, 302, 304: Differential pair routing

[0037] 310: First signal through hole

[0038] 311: First upper guide hole

[0039] 312: First through hole

[0040] 313, 317: First laser guide hole

[0041] 313A: First paragraph

[0042] 313B: Second paragraph

[0043] 314: First solder ball through hole

[0044] 315: First solder ball

[0045] 316: First Plane Routing

[0046] 320: Second signal through hole

[0047] 321: Second upper guide hole

[0048] 322: Second via

[0049] 323, 327: Second laser guide hole

[0050] 323A: Third paragraph

[0051] 323B: Fourth paragraph

[0052] 324: Second solder ball through hole

[0053] 325: Second solder ball

[0054] 326: Second Plane Routing

[0055] AA, BB: line segments

[0056] D: Direction

[0057] E: Extension direction

[0058] G1: First spacing

[0059] G2: Second spacing

[0060] G5: First Interval

[0061] G7: Trace spacing

[0062] K: Configuration Area

[0063] L1, L2: Imaginary extension lines

[0064] P1: Spacing between first through holes

[0065] P2: Spacing between second through holes

[0066] X, Y, Z: Axes Detailed Implementation

[0067] Several embodiments of the present invention will be disclosed below with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not essential. Furthermore, for the sake of simplicity, some conventional structures and elements will be illustrated in the drawings in a simple schematic manner, and the same elements in different embodiments will be labeled with the same element symbols.

[0068] Figure 1 This is a partial top view of a wiring board device 10 according to an embodiment of the present invention. Figure 2 for Figure 1 A cross-sectional view of the patch panel assembly 10 along line segment AA. (See attached image.) Figure 1 and Figure 2 As shown, in this embodiment, the wiring board device 10 includes a multilayer board structure 100 and a plurality of differential pair routings 300. The multilayer board structure 100 includes a core layer 110, a plurality of first board layers 120, and a plurality of second board layers 130. The first board layers 120 are stacked sequentially along a vertical direction (e.g., the Z-axis), and the second board layers 130 are stacked sequentially along this vertical direction (e.g., the Z-axis). The surfaces of the first board layers 120 and the second board layers 130 are made of insulating material, on which printed circuit patterns are distributed. The core layer 110 is sandwiched between the first board layers 120 and the second board layers 130. Furthermore, the multilayer board structure 100 also has opposing ball surfaces 160 (BGA) and bump surfaces (not shown). These first board layers 120 are located between the core layer 110 and the bump surfaces, and a second board layer 130 is located between the core layer 110 and the ball surfaces 160. The bump surfaces are used to connect a chip assembly (not shown) via electrical contacts (not shown), and the ball surfaces 160 are used to hold solder balls that can be soldered to a circuit carrier board (not shown).

[0069] Reference Figure 1 and Figure 2In this embodiment, these differential pair traces 300 are spaced apart from each other along the XY axis on the multilayer board structure 100. More specifically, structurally, each differential pair trace 300 is a pair (two, a pair) of differential signal traces, meaning that each differential pair trace 300 includes two differential vias (e.g., a first signal via 310 and a second signal via 320) representing the P and N poles respectively, for providing differential signal transmission. As mentioned above, the two signal vias of the differential pair trace 300 have substantially the same or similar routing layout. That is, the lengths of the two signal vias are substantially similar, and the routing directions are substantially mirror-symmetrical.

[0070] For example, the first signal via 310 includes a first through-hole 312, a first laser via 313, and a first solder ball via 314. The first through-hole 312 is located within the core layer 110, and the first laser via 313 is sequentially disposed within these second substrate layers 130 and electrically connected to the first through-hole 312 and the first solder ball via 314. The first solder ball via 314 is located within these second substrate layers 130 and is used to connect a first solder ball 315. The second signal via 320 includes a second through-hole 322, a second laser via 323, and a second solder ball via 324. The second through-hole 322 is located within the core layer 110, and the second laser via 323 is sequentially disposed within these second substrate layers 130 and electrically connected to the second through-hole 322 and the second solder ball via 324. The second solder ball through-hole 324 is located within the second plate layer 130 and is used to connect a second solder ball 325.

[0071] Furthermore, the first signal through-hole 310 also includes a first upper guide hole 311, which is sequentially disposed within these first plate layers 120 and electrically connected to the first through-hole 312. The second signal through-hole 320 also includes a second upper guide hole 321, which is sequentially disposed within these first plate layers 120 and electrically connected to the second through-hole 322.

[0072] More specifically, any two adjacent of the first upper via 311, the first through-hole 312, the first laser via 313, and the first solder ball via 314 are provided with an interface layer (not shown), and are connected to each other through a first planar trace 316 in the interface layer. Any two adjacent of the second upper via 321, the second through-hole 322, the second laser via 323, and the second solder ball via 324 are provided with an interface layer (not shown), and are connected to each other through a second planar trace 326 in the interface layer. The first through-hole 312 and the second through-hole 322 can be collectively referred to as a via pair, and the first laser via 313 and the second laser via 323 can be collectively referred to as a laser via pair.

[0073] Thus, as Figure 2As shown, the patterns of the first signal via 310 and the second signal via 320 are mirror-symmetrical. The first through-hole 312 and the second through-hole 322 are parallel to each other, that is, the first through-hole 312 and the second through-hole 322 are linear columnar. The first laser guide hole 313 and the second laser guide hole 323 are respectively moved inward from between the imaginary extension line L1 of the first through-hole 312 and the imaginary extension line L2 of the second through-hole 322. That is, the patterns of the first laser guide hole 313 and the second laser guide hole 323 are stepped or straight, and are symmetrically arranged with each other, and both move closer to each other, so that the first laser guide hole 313 and the second laser guide hole 323 are completely located between the imaginary extension line L1 of the first through-hole 312 and the imaginary extension line L2 of the second through-hole 322.

[0074] like Figure 1 As shown, viewed from above, the line connecting the axes of the first through hole 312 and the second through hole 322 has an extending direction E, for example, parallel to the Y-axis. Figure 2 The first laser guide hole 313 and the second laser guide hole 323 shown are respectively based on this extension direction E (referencing the Y-axis). Figure 2 ) Extend from the first through hole 312 and the second through hole 322 toward each other.

[0075] It must be understood that Figure 1 To allow viewing of the differential pair traces 300, a portion of the first board layer 120 of the transparent wiring board device 10 is provided. Figure 2 The quantity of the first board layer 120 is omitted.

[0076] Thus, as Figure 2 As shown, a first spacing G1 exists between the first via 312 and the second via 322, and a second spacing G2, smaller than the first spacing G1, exists between the first laser guide via 313 and the second laser guide via 323. A first solder ball via 314 and a second solder ball via 324 exist between each other with a first interval G5, greater than the first spacing G1. More specifically, the first spacing G1 is the minimum linear distance along the Y-axis between the first via 312 and the second via 322. The first interval G5 is the minimum linear distance along the Y-axis between the first solder ball via 314 and the second solder ball via 324.

[0077] Thus, since the first laser via 313 and the second laser via 323 of each differential pair trace 300 are moved inward from between the first through hole 312 and the second through hole 322 respectively, even if the positions of the components on the wiring board are gradually close together, the differential signals transmitted on adjacent differential pair traces 300 will not be severely affected by crosstalk, thereby improving signal integrity.

[0078] More specifically, such as Figure 2As shown, the first laser guide hole 313 and the second laser guide hole 323 gradually move away from each other in the direction D from the core layer 110 to these second plate layers 130, but do not separate from the imaginary extension line L1 of the first through hole 312 and the imaginary extension line L2 of the second through hole 322. More specifically, the first laser via 313 includes a first segment 313A and a second segment 313B. The first segment 313A connects the second segment 313B to the first through-hole 312, and the second segment 313B connects to the first solder ball through-hole 314. The second laser via 323 includes a third segment 323A and a fourth segment 323B. The third segment 323A connects the fourth segment 323B to the second through-hole 322, and the fourth segment 323B connects to the second solder ball through-hole 324. A first through-hole spacing P1 exists between the first segment 313A and the third segment 323A, and a second through-hole spacing P2 exists between the second segment 313B and the fourth segment 323B. The second through-hole spacing P2 is greater than the first through-hole spacing P1 and is the same as the second spacing G2. More specifically, the second spacing G2 is the minimum straight-line distance along the Y-axis between the second segment 313B of the first laser via 313 and the fourth segment 323B of the second laser via 323.

[0079] It should be understood that each differential pair trace 300 has only a laser via between the first via 312 and the second via 322. In other words, the imaginary extension line L1 of the first via 312 and the imaginary extension line L2 of the second via 322 have a configuration area K between them. The first signal via 310 and the second signal via 320 do not have any laser vias outside the configuration area K.

[0080] Reference Figure 1 and Figure 2 The multilayer board structure 100 also includes a ground plane 140. The ground plane 140 is planarly disposed within the multilayer board structure 100 and has a plurality of spaced closed openings 141. Each closed opening 141 surrounds and exposes one differential pair trace 300. For example, the ground plane 140 is a copper foil ground located within any of the first board layer 120 and the second board layer 130 and extending along the XY axis.

[0081] Figure 3 This is a side view of a differential pair trace 302 according to an embodiment of the present invention. Figure 3As shown, the differential pair trace 302 in this embodiment is largely the same as the differential pair trace 300 described above. The difference lies in that the first laser via 313 and the second laser via 323 do not gradually move away from each other in the direction D from the core layer 110 to these second substrate layers 130, but rather gradually approach each other, without disengaging from the imaginary extension line L1 of the first via 312 and the imaginary extension line L2 of the second via 322. More specifically, there is a first via spacing P1 between the first segment 313A and the third segment 323A of the first laser via 313, and a second via spacing P2 between the second segment 313B and the fourth segment 323B. The first via spacing P1 is greater than the second via spacing P2 and is the same as the second spacing G2.

[0082] Figure 4 This is a side view of a differential pair trace 304 according to an embodiment of the present invention. Figure 4 As shown, the differential pair trace 304 in this embodiment is largely the same as the differential pair trace 300 described above. The difference lies in that the first laser via 317 and the second laser via 327 are not gradually moving away from each other in the direction D from the core layer 110 to these second substrate layers 130, but are parallel to each other. In other words, the patterns of the first laser via 317 and the second laser via 327 are not stepped, but straight, and the first laser via 317 is parallel to the first via 312, and the second laser via 327 is parallel to the second via 322. More specifically, the minimum straight-line distance between the first laser via 317 and the second laser via 327 is the same as the second spacing G2.

[0083] In addition, such as Figure 1 and Figure 2 As shown, the spacing between adjacent laser guide holes of two adjacent differential pair traces 300 is greater than the second spacing G2, which can be more than 6 times the second spacing G2 depending on the design requirements.

[0084] Figure 5 for Figure 1 A cross-sectional view of the patch panel assembly 10 along segment BB. More specifically, as shown... Figure 5 As shown, in two adjacent differential pair traces 300a and 300b, the second laser guide hole 323 of one differential pair trace 300a and the first laser guide hole 313 of the other differential pair trace 300b are separated by a trace spacing G7, which is greater than the second spacing G2. According to design requirements, this trace spacing G7 is set to 6 to 30 times the second spacing G2. However, the present invention is not limited to this.

[0085] It should be understood that the differential pair traces 300a and 300b mentioned above have the same structure as the differential pair trace 300. Please refer to the above text for details, which will not be repeated here.

[0086] Thus, by designing the pattern of the differential pair traces to increase the spacing between two adjacent differential pair traces 300 (such as 300a, 300b), crosstalk generated when the signal is transmitted between the two adjacent differential pair traces 300 is reduced, thereby improving signal integrity.

[0087] With the above architecture, even if the positions of the components on the patch panel become increasingly close, the patch panel device of the present invention can still reduce the impact of crosstalk and improve signal integrity.

[0088] Finally, the embodiments described above are not intended to limit the invention. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the invention, and all such modifications and refinements are protected under this invention. Therefore, the scope of protection of this invention shall be determined by the appended claims.

Claims

1. A wiring board device, characterized in that, Include: A multilayer board structure comprising a core layer, at least one first board layer, and a plurality of second board layers stacked on top of each other, the core layer being sandwiched between the first board layer and the plurality of second board layers; and Multiple differential pair traces, each of the multiple differential pair traces comprising: A first signal via includes a first through-hole and a first laser via. The first through-hole is located within the core layer, and the first laser via is sequentially disposed within the plurality of second plate layers and electrically connected to the first through-hole. A second signal via includes a second through-hole and a second laser via. The second through-hole is located within the core layer, and the second laser via is sequentially disposed within the plurality of second plate layers and electrically connected to the second through-hole. Among them, a anatomical view is taken as follows: The pattern of the first signal via is mirror-symmetrical to the pattern of the second signal via. The first through hole and the second through hole are parallel to each other and have a first distance between them. The first laser via and the second laser via are both located between the imaginary extension lines of the first and second through holes, and there is a second distance between the first laser via and the second laser via that is smaller than the first distance.

2. The patch panel device as described in claim 1, characterized in that, The first laser guide hole and the second laser guide hole are parallel to each other or gradually approach or gradually move away from each other in the direction from the core layer to the plurality of second plate layers.

3. The wiring board device as described in claim 1, characterized in that, The patterns of the first laser guide hole and the second laser guide hole are both close to each other.

4. The patch panel device as described in claim 3, characterized in that, The first laser guide hole includes a first segment and a second segment, the first segment connecting the second segment and the first through hole. The second laser guide hole includes a third segment and a fourth segment, the third segment connecting the fourth segment and the second through hole. A first through-hole spacing is provided between the first segment and the third segment, and a second through-hole spacing is provided between the second segment and the fourth segment. Wherein the first through hole spacing is greater than the second through hole spacing, or the second through hole spacing is greater than the first through hole spacing.

5. The wiring board device as described in claim 1, characterized in that, The patterns of the first laser guide hole and the second laser guide hole are both straight lines, and the first laser guide hole is parallel to the first through hole, and the second laser guide hole is parallel to the second through hole.

6. The patch panel device as claimed in claim 1, characterized in that, The first signal via further includes a first solder ball through-hole, which is located within the plurality of second plate layers and is used to connect a first solder ball; and The second signal via also includes a second solder ball via, which is located within the plurality of second plate layers and is used to connect a second solder ball. The first laser guide hole connects the first through hole and the first solder ball through hole, the second laser guide hole connects the second through hole and the second solder ball through hole, and the first solder ball through hole and the second solder ball through hole have a first interval greater than the first spacing between them.

7. The patch panel device as claimed in claim 1, characterized in that, The imaginary extension line of the first through-hole and the imaginary extension line of the second through-hole have a configuration area between them. The first signal via and the second signal via do not have any laser guide holes outside the configuration area.

8. The patch panel device as claimed in claim 1, characterized in that, The first through hole and the second through hole have an extension direction along their respective axial lines, and the first laser guide hole and the second laser guide hole extend along the extension direction.

9. The patch panel device as claimed in claim 1, characterized in that, The adjacent laser vias of any two adjacent differential pairs of traces have a trace spacing that is greater than the second spacing.

10. The patch panel device as claimed in claim 9, characterized in that, The spacing between the traces is 6 to 30 times that of the second spacing.

11. The patch panel device as claimed in claim 1, characterized in that, The patterns of the first laser guide hole and the second laser guide hole are both stepped and symmetrically arranged.

12. The patch panel device as claimed in claim 1, characterized in that, The multilayer board structure also includes a grounding layer with multiple closed openings spaced apart, each of which surrounds and exposes the corresponding differential pair trace.

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