Flexible circuit boards, display modules and display devices

Abstract

The present application relates to a kind of flexible circuit board, display module and display device, flexible circuit board includes main board, the main board includes the device area of device, first device is provided on the device area, first device is coated with first protective film layer outside, first protective film layer includes the first insulating adhesive layer and first shielding adhesive layer stacked along the direction away from the main board.In the first device outside coating first protective film layer, first protective film layer includes the first insulating adhesive layer and first shielding adhesive layer stacked, insulation protection, shielding etc. are realized by first protective film layer, to replace the adhesive tape in the related art, and relative to the setting mode of adhesive tape, first insulating adhesive layer and first shielding adhesive layer are formed by coating process using flowing glue material, there is no gap in the periphery of device, to solve the pressing noise problem, and there is no problem of sticking stress.

Description

Technical Field

[0001] This invention relates to the field of display product manufacturing technology, and in particular to a flexible circuit board, a display module, and a display device. Background Technology

[0002] The display module includes a display panel and a flexible circuit board bonded to the display panel. Typically, adhesive tape (IC Cover Tape) is used to cover the flexible circuit board for grounding and shielding. However, the following problems exist in the component area of ​​the flexible circuit board:

[0003] 1. Abnormal noise when pressing the whole machine: The tape is not easily activated (not fully adhered) at the components or other height differences. If there are other structural parts of the whole machine at the incompletely activated area, the tape is prone to sticking / detaching when pressing, which can easily produce abnormal noise.

[0004] 2. Molding: The tape application process will apply stress to the device area, causing visible dot-like molding on the front of the OLED MDL.

[0005] 3. Add clearance to the machine frame: Since the tape is attached to the step difference in a sloping shape, the machine structure needs to be specially designed to avoid this slope. Summary of the Invention

[0006] To address the aforementioned technical problems, this invention provides a flexible circuit board, a display module, and a display device, resolving issues such as abnormal pressing noises that occur when using tape for shielding or other functions.

[0007] To achieve the above objectives, the technical solution adopted in the embodiments of the present invention is: a flexible circuit board, including a motherboard, the motherboard including a device area for setting components, a first component being disposed on the device area, the first component being covered with a first protective film layer, the first protective film layer including a first insulating adhesive layer and a first shielding adhesive layer stacked along a direction away from the motherboard.

[0008] Optionally, both the first insulating adhesive layer and the first shielding adhesive layer are formed using a curable adhesive material.

[0009] Optionally, conductive materials or shielding materials may be added to the first shielding adhesive layer.

[0010] Optionally, a second component is disposed on the device area, the second component is covered by a protective cover, and a second protective film layer is disposed between the second component and the protective cover. The second protective film layer includes a second insulating adhesive layer and a second shielding adhesive layer stacked along the direction away from the motherboard.

[0011] Optionally, the top of the protective cover is provided with an opening for filling with adhesive material to form the first protective film layer.

[0012] Optionally, a third component is provided on the device area, the height of the third component is different from the height of the first component, the first protective film layer covers the first component and the third component, and the first protective film layer also includes a limiting adhesive layer surrounding the first insulating adhesive layer.

[0013] The height of the limiting adhesive layer is greater than or equal to the height of the first component, the height of the first component is greater than the height of the third component, or the height of the limiting adhesive layer is greater than or equal to the height of the third component, and the height of the first component is less than the height of the third component.

[0014] Optionally, the viscosity of the limiting adhesive layer is greater than the viscosity of the first insulating adhesive layer.

[0015] Optionally, conductive or shielding materials may be added to the limiting adhesive layer.

[0016] Optionally, the motherboard has an exposed copper area, and the first shielding adhesive layer extends to the exposed copper area and is electrically connected to the exposed copper area to ground.

[0017] This disclosure also provides a display module, including a display panel and the aforementioned flexible circuit board, wherein the flexible circuit board is bonded to the bonding area of ​​the display panel.

[0018] Optionally, a fourth component is provided in the bonding area, and the fourth component is covered with a third protective film layer, which includes a third insulating adhesive layer and a third shielding adhesive layer stacked on top of each other.

[0019] This disclosure also provides a display device, including the display module described above.

[0020] The beneficial effects of the present invention are as follows: a first protective film layer is wrapped around the first component. The first protective film layer includes a first insulating adhesive layer and a first shielding adhesive layer stacked on top of each other. The first protective film layer achieves insulation protection and shielding functions, replacing the tape in related technologies. Moreover, compared with the tape setting method, the first insulating adhesive layer and the first shielding adhesive layer are formed by a coating process using flowing adhesive material. There will be no gaps around the component, thereby solving the problem of abnormal noise when pressing and eliminating the problem of adhesion stress. Attached Figure Description

[0021] Figure 1 A schematic diagram of a flexible circuit board in related technologies;

[0022] Figure 2 A schematic diagram illustrating a flexible circuit board in an embodiment of this disclosure;

[0023] Figure 3 A schematic diagram illustrating a flexible circuit board in an embodiment of this disclosure;

[0024] Figure 4 A schematic diagram illustrating the protective shield in an embodiment of this disclosure;

[0025] Figure 5 A schematic diagram illustrating flexible circuit boards in related technologies;

[0026] Figure 6 A schematic diagram illustrating a flexible circuit board in an embodiment of this disclosure;

[0027] Figure 7 A schematic diagram illustrating a flexible circuit board in an embodiment of this disclosure;

[0028] Figure 8 A schematic diagram illustrating a flexible circuit board in an embodiment of this disclosure;

[0029] Figure 9 This is a schematic diagram illustrating the display module in an embodiment of the present disclosure. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0031] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0032] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of said value.

[0033] Furthermore, throughout this document, unless otherwise defined, the terms “substantially,” “essentially,” “approximately,” and “about” are used to describe and explain small variations. When used with an event or situation, these terms can cover situations where the event or situation occurs precisely or approximately. For example, when used with a numerical value, these terms can include a range of variation of the numerical value less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term “substantially coplanar” can refer to two surfaces arranged along the same plane within a micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.

[0034] The flexible circuit board 10 includes a main board, which includes a substrate layer and a conductive layer disposed on the substrate layer. The substrate layer can be a flexible resin layer, such as polyimide (PI), polyethylene terephthalate (PET), or polyethylene naphthalate (PEN). The main board can be a single-layer board structure or a multi-layer board structure, that is, the main board includes multiple alternating substrate layers and multiple conductive layers, meaning the flexible circuit board can have two or more conductive layers. The conductive layer can be made of a conductive metal, such as copper. The desired circuit pattern is formed on the conductive layer through etching or other processes. The main board also includes electronic components 20, such as TIC (touch circuit chip). In related technologies, an IC cover tape 30 is used to cover the main board to achieve insulation protection and shielding. However, since the assembly of the tape 30 and the main board is done by bonding, stress is generated on the main board during the bonding process, causing visible dot-like imprints to appear on the front side of the OLED MDL. Furthermore, there are step differences at the locations of electronic components, and gaps exist in the adhesive tape. If this location corresponds to a pressing component in the overall structure, an abnormal noise will occur when pressing. (Refer to...) Figure 1 .

[0035] refer to Figures 2-4 ,as well as Figures 6-9 To address the aforementioned issues, this disclosure provides a flexible circuit board, including a motherboard 1. The motherboard 1 includes a device region 12 for setting components. A first component 120 is disposed on the device region 12. The first component 120 is covered with a first protective film layer 2. The first protective film layer 2 includes a first insulating adhesive layer 21 and a first shielding adhesive layer 22 stacked along a direction away from the motherboard 1.

[0036] A first protective film layer 2 is used to replace the adhesive tape in related technologies to achieve insulation protection and shielding functions. In this embodiment, the first protective film layer 2 includes a first insulating adhesive layer 21 and a first shielding adhesive layer 22 stacked on top of each other. Both the first insulating adhesive layer 21 and the second insulating adhesive layer 31 are made of adhesive material and are formed directly on the motherboard 1, rather than being assembled after molding. This eliminates the stress generated when applying adhesive tape. Specifically, the first insulating adhesive layer 21 is formed directly on the corresponding position of the first component 120 using a certain fluid adhesive material through a coating process. The first shielding adhesive layer 22 is formed directly on the first insulating adhesive layer 21 using a certain fluid adhesive material through a coating process. Compared to adhesive tape bonding, the fluid adhesive material can better achieve seamless connection with the components, thereby avoiding problems such as pressing noise and space avoidance caused by gaps in the adhesive tape bonding.

[0037] In an exemplary embodiment, both the first insulating adhesive layer 21 and the first shielding adhesive layer 22 are formed using a curable adhesive material. This allows the adhesive material to be cured and molded after application, thus completing the fabrication of either the first insulating adhesive layer 21 or the first shielding adhesive layer 22.

[0038] In an exemplary embodiment, the main material of the first shielding adhesive layer 22 is glue. In order to achieve the shielding and other functions of the first shielding adhesive layer 22, conductive materials or shielding materials are added to the adhesive material forming the first shielding adhesive layer 22.

[0039] For example, the conductive material can be metallic conductive particles, such as nickel, copper, silver, or gold.

[0040] The shielding material can be an absorbing material, which refers to a type of material that can absorb or significantly reduce the electromagnetic wave energy projected onto its surface, thereby reducing electromagnetic interference. In this embodiment, the absorbing material can be graphite, ferrite, barium titanate, etc. Exemplarily, the absorbing material in this embodiment can be a colloidal solid powder material; specifically, the solid powder can be iron oxide powder or magnetic iron nanoparticles.

[0041] For example, the main material of the first insulating adhesive layer 21 and the first shielding adhesive layer 22 is glue, and the components of the glue may include acrylic acid or epoxy resin.

[0042] For example, the materials of the first insulating adhesive layer 21 and the first shielding adhesive layer 22 may also include a diluent to increase their flow properties.

[0043] For example, the materials of the first insulating adhesive layer 21 and the first shielding adhesive layer 22 may also include a curing agent to give them curable properties.

[0044] It should be noted that the material of the first insulating adhesive layer 21 includes adhesive, thinner, and curing agent, and the material of the first shielding adhesive layer 22 includes adhesive, thinner, curing agent, and conductive or shielding material. In some embodiments, to simplify the process, the adhesive, thinner, and curing agent of the first insulating adhesive layer 21 and the first shielding adhesive layer 22 are made of the same material. That is, the material of the first shielding adhesive layer 22 is based on the material of the first insulating adhesive layer 21 with the addition of conductive or shielding material. This makes the curing conditions of the first insulating adhesive layer 21 and the first shielding adhesive layer 22 the same.

[0045] For example, in order to avoid the coating range of the first insulating adhesive layer 21 or the first shielding adhesive layer 22 being uncontrollable, the viscosity of the first insulating adhesive layer 21 or the first shielding adhesive layer 22 can be adjusted to regulate the flow properties of the adhesive material forming the first insulating adhesive layer 21 or the first shielding adhesive layer 22 when it is not cured.

[0046] For example, without changing the type of material of the adhesive material forming the first insulating adhesive layer 21 or the first shielding adhesive layer 22, the viscosity of the adhesive material forming the first insulating adhesive layer 21 or the first shielding adhesive layer 22 can be adjusted by adjusting the proportion of at least one of the various materials constituting the first insulating adhesive layer 21 or the first shielding adhesive layer 22. For example, the viscosity of the first insulating adhesive layer 21 or the first shielding adhesive layer 22 can be adjusted by adjusting the viscosity (content) of the epoxy resin in the adhesive material.

[0047] It should be noted that in embodiments where the adhesive material of the first insulating adhesive layer 21 or the first shielding adhesive layer 22 is epoxy resin adhesive, the epoxy resin adhesive is mainly composed of epoxy resin, curing agent, filler and other components. Increasing the viscosity of epoxy resin is equivalent to increasing the viscosity of epoxy resin. Increasing the viscosity of a single component can increase the viscosity of the mixed epoxy resin adhesive.

[0048] For example, inorganic materials can be added to the material of the first insulating adhesive layer 21 or the first shielding adhesive layer 22 to increase the viscosity of the first insulating adhesive layer 21 or the first shielding adhesive layer 22. The inorganic material can be calcium carbonate or silicon dioxide, but is not limited to these.

[0049] The principle of increasing the viscosity of adhesives (which consist of resin, curing agent, fillers, etc., where fillers are inorganic materials) by adding inorganic fillers is as follows:

[0050] 1. The friction between fillers or between fillers and resin can physically impede liquid flow and increase viscosity. This effect is particularly pronounced with fillers that are irregularly shaped or have a large specific surface area.

[0051] 2. The fillers can form a three-dimensional network structure with each other through van der Waals forces or hydrogen bonds. The flow of the adhesive requires the disruption of this structure, which leads to increased resistance and increased viscosity.

[0052] 3. Increasing the filler ratio will correspondingly reduce the proportion of epoxy resin, thus decreasing the flowable components and increasing the overall viscosity. Some porous fillers can adsorb liquid components, preventing them from flowing freely, resulting in a more significant increase in viscosity.

[0053] refer to Figure 3 and Figure 4 In an exemplary embodiment, a second component 121 is disposed on the device region 12, and a protective cover 4 is provided on the outside of the second component 121. A second protective film layer 3 is disposed between the second component 121 and the protective cover 4. The second protective film layer 3 includes a second insulating adhesive layer 31 and a second shielding adhesive layer 32 stacked along the direction away from the motherboard 1.

[0054] The second component 121 can be a TIC (touch IC), but is not limited to this.

[0055] In related technologies, to achieve better shielding and mechanical reliability, a protective cover 4 is installed outside the TIC. For enhanced all-around protection, a dispensing opening is often provided above the protective cover 4 for applying sealant. Furthermore, to achieve even better shielding, an EMI shielding film is attached above the dispensing opening after the sealant application. Taking the second component 121 as the TIC as an example, in this embodiment, the second protective film layer 3 is filled between the TIC and the protective cover 4, replacing the sealant filled inside the protective cover 4 and the EMI shielding film attached to the outside of the protective cover 4 in related technologies. The second insulating adhesive layer 31 can perform the same function as the sealant in related technologies, namely, insulation protection and waterproofing. The second shielding adhesive layer 32 can perform the same shielding function as the EMI shielding film in related technologies. Furthermore, using the second protective film layer 3 in this embodiment instead of the sealant and EMI shielding film in related technologies eliminates the need for the EMI shielding film, saving on process and cost. The second protective film layer 3 in this embodiment also achieves better shielding, with stronger sealing and stability.

[0056] For example, the adhesive material used in the second insulating layer may be the same as that used in the first insulating layer, and the adhesive material of the second shielding adhesive layer 32 may be the same as that of the first shielding adhesive layer 22, but this is not a limitation.

[0057] For example, the top of the protective cover 4 is provided with an opening 41 for filling with adhesive material to form the first protective film layer 2.

[0058] For example, the protective cover 4 has an observation window 42 on its side. The second protective film layer 3 is applied by dripping adhesive material into the opening 41 after the protective cover 4 is placed on the second component 121. The observation window 42 facilitates observation of the filling state of the adhesive material in the second insulating adhesive layer 31 and the second shielding adhesive layer 32.

[0059] For example, in a direction perpendicular to the motherboard 1, one end of the observation window 42 extends to the top of the protective cover 4, and the other end of the observation window 42 extends to the bottom of the protective cover 4.

[0060] For example, the thickness of the second insulating adhesive layer 31 and the second shielding adhesive layer 32 can be set according to actual needs. The height of the side of the second protective film layer 3 away from the motherboard 1 is greater than the height of the side of the second component 121 away from the motherboard 1, so that the second protective film layer 3 completely covers the second component 121.

[0061] The height of the side of the second insulating adhesive layer 31 away from the motherboard 1 can be lower than the height of the side of the second component 121 away from the motherboard 1, or the height of the side of the second insulating adhesive layer 31 away from the motherboard 1 can be greater than or equal to the height of the side of the second component 121 away from the motherboard 1. Figure 3 In this configuration, the height of the second insulating adhesive layer 31 is lower than the height of the second component 121, and the second shielding adhesive layer 32 covers both the second insulating adhesive layer 31 and the second component 121 to ensure the thickness of the second shielding adhesive layer 32 and thus ensure the shielding effect.

[0062] refer to Figure 3 The second component 121 is electrically connected to the motherboard 1 via a solder pad. The height of the second insulating adhesive layer 31 is higher than the height of the solder pad, so that the second insulating adhesive layer 31 completely covers the solder pad to ensure insulation. In some embodiments, the height of the second insulating adhesive layer 31 in the direction perpendicular to the motherboard 1 is 0.2-0.5 mm, but it is not limited to this.

[0063] In some embodiments, the height of the second shielding adhesive layer 32 in the direction perpendicular to the motherboard 1 is 0.2-0.8 mm, but it is not limited thereto.

[0064] exist Figure 3 In this process, the second insulating adhesive layer 31 and the second shielding adhesive layer 32 work together to completely fill the space formed by the protective cover 4 and the motherboard 1.

[0065] refer to Figures 6-8 In an exemplary embodiment, a third component 122 is provided on the device region 12. The height of the third component 122 is different from the height of the first component 120. The first protective film layer 2 covers the first component 120 and the third component 122. The first protective film layer 2 also includes a limiting adhesive layer 23 surrounding the first insulating adhesive layer 21.

[0066] The height of the limiting adhesive layer 23 is greater than or equal to the height of the first component 120, and the height of the first component 120 is greater than the height of the third component 122; or, the height of the limiting adhesive layer 23 is greater than or equal to the height of the third component 122, and the height of the first component 120 is less than the height of the third component 122.

[0067] Multiple components are disposed in the device area 12 on the motherboard 1. The heights of these components are not entirely identical. To save on manufacturing processes and improve efficiency, multiple components can share a single first protective film layer 2, meaning the first protective film layers 2 corresponding to multiple components are connected as a single unit, which can be formed through a synchronous process. However, due to the difference in height between the first component 120 and the third component 122, the adhesive material above the taller component is thicker, resulting in a greater thickness difference. (Refer to...) Figure 5 To reduce thickness differences, a high-temperature resistant insulating film is used for lamination in related technologies. In this embodiment, to address the issue of varying adhesive thicknesses caused by components of different heights, a limiting adhesive layer 23 is provided. When fabricating the first protective film layer 2, the limiting adhesive layer 23 is first fabricated to limit the adhesive coating range. Then, the first insulating adhesive layer 21 is coated within the space defined by the limiting adhesive layer 23 to control the coating range of the first insulating adhesive layer 21. In this embodiment, when the height of the first component 120 is greater than the height of the third component 122, the height of the limiting adhesive layer 23 is greater than or equal to the height of the first component 120; when the height of the first component 120 is less than the height of the third component 122, the height of the limiting adhesive layer 23 is greater than or equal to the height of the third component 122. This allows the height of the first insulating adhesive layer 21 to be controlled by the height of the limiting adhesive layer 23, ensuring that the first insulating adhesive layer 21 completely covers both the first component 120 and the third component 122. It also reduces the difference between the height of the top surface of the first insulating adhesive layer 21 corresponding to the position of the first component 120 and the height of the top surface of the first insulating adhesive layer 21 corresponding to the position of the third component 122. In some embodiments, the top surface of the first insulating adhesive layer 21 away from the motherboard 1 can be a plane parallel to the motherboard 1. This eliminates the need for the high-temperature resistant insulating film used in related technologies for pressure adhesion.

[0068] In an exemplary embodiment, the viscosity of the limiting adhesive layer 23 is greater than the viscosity of the first insulating adhesive layer 21.

[0069] The limiting adhesive layer 23 is made of a high-viscosity adhesive material, which can effectively control the coating range and height of the first insulating adhesive layer 21. The first insulating adhesive layer 21 is made of a low-viscosity adhesive material, which allows it to have good fluidity, so as to effectively seal and protect the corresponding components.

[0070] For example, the viscosity of the adhesive material of the limiting adhesive layer 23 is greater than 20 Pa·s, and the viscosity of the first insulating adhesive layer 21 is less than 5 Pa·s, but this is not a limitation.

[0071] For example, the adhesive material of the first insulating adhesive layer 21 and the adhesive material of the second insulating adhesive layer 31 can be the same, so that they can be formed by a synchronous process, thereby improving efficiency.

[0072] For example, the types of materials included in the adhesive material of the limiting adhesive layer 23 can be the same as those included in the adhesive material of the first insulating adhesive layer 21. The viscosity of the limiting adhesive layer 23 can be increased by adjusting the content of at least one material included in the adhesive material (e.g., adjusting the content of epoxy resin). Therefore, during curing, the limiting adhesive layer 23 and the first insulating adhesive layer 21 can be cured simultaneously, saving processes and improving efficiency.

[0073] In an exemplary embodiment, conductive or shielding materials are added to the limiting adhesive layer 23 to improve the shielding effect.

[0074] In an exemplary embodiment, the motherboard 1 has an exposed copper area 11, and the first shielding adhesive layer 22 extends to the exposed copper area 11 and is electrically connected to the exposed copper area 11 for grounding. (Refer to...) Figure 2 .

[0075] For example, the motherboard 1 also includes shielding areas that require protection, in addition to the device area 12 and the exposed copper area 11. These shielding areas can be protected using shielding tape (i.e., IC cover tape). That is, the tape is partially replaced by the first protective film layer 2 and the second protective film layer 3. (Refer to...) Figure 9 Alternatively, the first protective film layer 2 can cover all areas on the flexible circuit board that require protection and shielding, thus completely replacing the tape.

[0076] It should be noted that multiple first components can be disposed on the device area 12 of the motherboard 1. The flexible circuit board may include at least one first protective film layer 2, and each first protective film layer 2 may cover at least one first component. The specific number of first components covered by the first protective film layer 2 can be set according to actual needs. Figure 9 In this context, the first protective film layer 2 disposed on the device region 12 is not an integral structure, but this is not a limitation.

[0077] This disclosure also provides a display module, including a display panel and the aforementioned flexible circuit board, wherein the flexible circuit board is bonded to the bonding area of ​​the display panel.

[0078] refer to Figure 9The display panel 200 includes a display area, a bonding area 201, and a bending area located between the display area and the bonding area. The bending area is bent such that the bonding area bends towards the backlight side of the display area. When the bending area is in a bent state, the bonding portion of the bonding area is located on the side of the bonding area away from the display panel to bond and connect with the flexible circuit board. A support structure is provided between the bonding area and the display panel 200. The support structure is provided to ensure the bending shape of the bending area, so that the bending area has a preset bending radius to avoid the circuit in the bending area from being broken.

[0079] In an exemplary embodiment, a fourth component 2001 is provided in the bonding area, and a third protective film layer 5 is provided on the outside of the fourth component 2001. The third protective film layer 5 includes a third insulating adhesive layer and a third shielding adhesive layer stacked on top of each other.

[0080] The third insulating layer and the first insulating layer 21 can be made of the same material, so that the third insulating layer and the first insulating layer 21 can be formed in a simultaneous process. The third shielding layer and the first shielding layer 22 can be made of the same material, so that the third shielding layer and the first shielding layer 22 can be formed in a simultaneous process, improving efficiency.

[0081] The fourth component 2001 can be a driver IC. The third protective film layer 5 can solve problems such as abnormal noise and mold marks caused by uneven tape adhesion.

[0082] It should be noted that, in Figure 9 In this case, the third protective film layer covering the fourth component 2001 extends to the flexible circuit board.

[0083] This disclosure also provides a display device, including the display module described above.

[0084] The display device includes, but is not limited to, components such as: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. Those skilled in the art will understand that the above-described structure of the display device does not constitute a limitation on the display device; the display device may include more or fewer of the aforementioned components, or combine certain components, or arrange different components. In embodiments of the present invention, the display device includes, but is not limited to, a monitor, a mobile phone, a tablet computer, a television set, a wearable electronic device, a navigation display device, etc.

[0085] The display device can be any product or component with display function, such as a television, monitor, digital photo frame, mobile phone, or tablet computer. The display device also includes a flexible circuit board, a printed circuit board, and a backplate.

[0086] The following points need to be explained:

[0087] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0088] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0089] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0090] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A flexible circuit board, characterized in that, The device includes a motherboard, which includes a device area for setting components. A first component is disposed on the device area. The first component is covered with a first protective film layer. The first protective film layer includes a first insulating adhesive layer and a first shielding adhesive layer stacked along a direction away from the motherboard.

2. The flexible circuit board according to claim 1, characterized in that, Both the first insulating adhesive layer and the first shielding adhesive layer are formed using curable adhesive materials.

3. The flexible circuit board according to claim 2, characterized in that, Conductive or shielding materials are added to the first shielding adhesive layer.

4. The flexible circuit board according to claim 2, characterized in that, A second component is disposed on the device area, and a protective cover is provided on the outer surface of the second component. A second protective film layer is disposed between the second component and the protective cover. The second protective film layer includes a second insulating adhesive layer and a second shielding adhesive layer stacked along the direction away from the motherboard.

5. The flexible circuit board according to claim 4, characterized in that, The top of the protective cover is provided with an opening for filling with adhesive material to form the second protective film layer.

6. The flexible circuit board according to claim 1, characterized in that, A third component is provided on the device area. The height of the third component is different from that of the first component. The first protective film layer covers the first component and the third component. The first protective film layer also includes a limiting adhesive layer surrounding the first insulating adhesive layer. The height of the limiting adhesive layer is greater than or equal to the height of the first component, the height of the first component is greater than the height of the third component, or the height of the limiting adhesive layer is greater than or equal to the height of the third component, and the height of the first component is less than the height of the third component.

7. The flexible circuit board according to claim 6, characterized in that, The viscosity of the limiting adhesive layer is greater than the viscosity of the first insulating adhesive layer.

8. The flexible circuit board according to claim 7, characterized in that, Conductive or shielding materials are added to the limiting adhesive layer.

9. The flexible circuit board according to claim 7, characterized in that, The motherboard has an exposed copper area, and the first shielding adhesive layer extends to the exposed copper area and is electrically connected to the exposed copper area to ground.

10. A display module, characterized in that, It includes a display panel and a flexible circuit board as described in any one of claims 1-9, wherein the flexible circuit board is bonded to the bonding area of ​​the display panel.

11. The display module according to claim 10, characterized in that, The bonding area is provided with a fourth component, and the fourth component is covered with a third protective film layer, which includes a third insulating adhesive layer and a third shielding adhesive layer stacked on top of each other.

12. A display device, characterized in that, Includes the display module as described in claim 10 or 11.

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