Circuit component and method for manufacturing the same

Abstract

Circuit assemblies and methods of manufacturing the same are provided. The circuit assemblies include a first circuit substrate and at least a first surface mount pad. The first surface mount pad can be disposed on a first surface of the first circuit substrate, where the first surface mount pad includes a base surface mount pad and a supplemental conductive element fabricated on the base surface mount pad such that the base surface mount pad is disposed between the first circuit substrate and the supplemental conductive element, which is fabricated, for example, from metal. The first circuit substrate can also include a second surface mount pad. The height of the first surface mount pad can be greater than the height of the second surface mount pad. The high profile height of the first surface mount pad supports a higher current throughput than the low profile height of the second surface mount pad.

Description

Technical Field

[0001] This invention relates to circuit components and methods of manufacturing the same, and also to high-current surface mount pads. Background Technology

[0002] Conventional circuits typically include one or more surface mount pads. Surface mount pads provide connections between circuit components and traces in or on the corresponding circuit board.

[0003] More specifically, a surface mount pad can be a reserved area on the surface of a printed circuit board (PCB), through which surface mount components are directly soldered to the PCB surface. Compared to through-hole mounting technology, surface mount technology enables a higher density of connecting circuit components to the circuit board, resulting in a smaller overall circuit assembly.

[0004] Therefore, a typical surface mount pad is usually a flat surface area on a circuit board, where the surface mount pad is made of a metal such as copper or other suitable metal. During the fabrication of the corresponding circuit assembly, a fabrication tool applies solder paste to the surface mount pad and / or the corresponding pins of the surface mount component. The fabrication tool brings the corresponding pins of the surface mount component into contact with the surface mount pad, where solder paste is located between the surface mount pad and the corresponding pins. The fabrication tool then applies sufficient heat to temporarily melt the solder paste. After cooling, the remaining homogeneous solder mass between the corresponding pins and the surface mount pad of the circuit board ensures that the surface mount component is firmly attached to the circuit board. The remaining solder mass also provides electrical connection between the surface mount pad and the pins of the surface mount component. Summary of the Invention

[0005] This disclosure includes the following observation: conventional surface mounts on conventional circuit boards do not support the delivery of sufficiently high currents between the circuit and the corresponding circuit components.

[0006] The examples in this paper provide a novel and improved connection between surface-mount components and corresponding circuitry.

[0007] More specifically, as discussed herein, a manufacturing entity fabricates a circuit assembly to include a first circuit substrate (e.g., any circuit component, circuit assembly, circuit, circuit board, etc.) and one or more surface mount pads, said one or more surface mount pads including, for example, at least a first surface mount pad. The first surface mount pad of the first circuit substrate may be disposed on a first surface of the first circuit substrate. The first surface mount pad may be made of a homogeneous block of conductive material. In such a case, the homogeneous block of conductive material represents the first surface mount pad disposed on the first surface of the first circuit substrate. Alternatively, the first surface mount pad may be manufactured to include a base surface mount pad and supplementary conductive elements manufactured on the base surface mount pad. In the latter case, the base surface mount pad is disposed between the first circuit substrate and the supplementary conductive element, for example, made of metal.

[0008] It should also be noted that the first circuit board may further include a second surface mounting pad disposed on a first surface of the first circuit board, wherein the first surface mounting pad may be configured to include supplementary conductive material applied to the substrate surface mounting pad to increase its height. The height of the first surface mounting pad (e.g., a combination of the substrate surface mounting pad and supplementary conductive elements or materials) may be greater than the height of the second surface mounting pad. In such a case, the first circuit board may include multiple surface mounting pads, wherein the first surface mounting pad may be manufactured to be greater in height than the second surface mounting pad.

[0009] Therefore, the apparatus discussed herein may include: a first circuit board; a first surface mount pad; and a second surface mount pad. The first surface mount pad may be disposed on a first surface of the first circuit board, wherein the first surface mount pad is manufactured according to a first height relative to the first surface; the second surface mount pad may be disposed on the first surface of the first circuit board, wherein the second surface mount pad is manufactured according to a second height relative to the first surface, the first height being greater than the second height.

[0010] The manner in which the first surface disk (a higher-profile surface disk with heterogeneous or homogeneous material relative to the second surface mounting disk) is manufactured and implemented supports a higher current flow capability than that supported by the second surface disk (e.g., a lower-profile surface disk).

[0011] It should also be noted that each of the surface mount pads (e.g., including the first surface mount pad) disposed on the first circuit board can be configured to include at least one gap, wherein the at least one gap can be configured to include a first gap disposed in the middle of the first surface mount pad.

[0012] Furthermore, the first surface mount pad can be configured to include a first gap extending between a first side and a second side of the first surface mount pad. The first gap can be configured to provide separation between a first portion and a second portion of the first surface mount pad.

[0013] In yet another example, the component as discussed herein may be configured to include an insulating material layer disposed on a first surface of a first circuit board, wherein the material layer at least partially covers a first portion of the top surface of the second surface mount pad. The insulating material layer may be configured to include a first opening. The first surface mount pad may be configured to extend through the first opening in the insulating material. The insulating material layer may be configured to include a second opening, wherein the second opening exposes a second portion of the top surface of the second surface mount pad.

[0014] In other examples, a device such as a component or other suitable entity, as discussed herein, may be configured to include a first solder material block in contact with a first surface mount pad and a second solder material block in contact with a second surface mount pad. At least a portion of the first solder material block contacts the top surface and side surfaces of the first surface mount pad. The second solder block contacts the top surface of the second surface mount pad.

[0015] Other examples of the apparatus discussed herein include a second circuit board, wherein the second circuit board may be configured to include a third surface mount pad and a fourth surface mount pad. The third and fourth surface mount pads may be disposed on a first surface of the second circuit board. The apparatus may also include a first solder joint extending between the first and third surface mount pads. The apparatus may also include a second solder joint extending between the second and fourth surface mount pads.

[0016] In one example, a third surface mounting pad is manufactured according to a third height relative to a first surface of the second circuit board; a fourth surface mounting pad is manufactured according to a fourth height relative to the first surface of the second board. In one example, the third height is substantially equal to the fourth height. Alternatively, the third height may be greater than the fourth height.

[0017] The apparatus may further include a first gap filled with a first solder block between the first surface mount pad and the third surface mount pad. The apparatus may also include a second gap filled with a second solder block between the second surface mount pad and the fourth surface mount pad. The first gap may be smaller than the second gap for many reasons. For example, recalling that the first surface mount pad may be higher than the second surface mount pad. Additionally, the third surface mount pad may be higher than the fourth surface mount pad.

[0018] In another example, the device further includes a second circuit board, a first solder joint, and a second solder joint. The second circuit board may be configured to include a third surface mount pad and a fourth surface mount pad, wherein the third and fourth surface mount pads are disposed on a first surface of the second circuit board. The first solder joint may be configured to extend between the first and third surface mount pads. The second solder joint may be configured to extend between the second and fourth surface mount pads. The first circuit board and its corresponding first surface may be spaced apart from the second circuit board and its corresponding first surface by a distance X. The magnitude of a first height of the first surface mount pad may be between 50% and 90% of the distance X. The increased height of the first surface mount pad replaces what would otherwise be part of the first solder joint.

[0019] In another example implementation, the first circuit board can be configured to include any suitable circuit system. In one example, the first circuit board includes an embedded voltage regulator circuit (e.g., a power converter circuit or other suitable entity) for: i) receiving an input voltage from a first surface mounting pad, ii) converting the input voltage into an output voltage, and iii) outputting the output voltage from a second surface of the first circuit board to a load, wherein the second surface of the first circuit board faces a direction opposite to the first surface of the first circuit board.

[0020] Other examples discussed herein include methods of manufacturing one or more surface mount pads and corresponding circuit assemblies. In one example, as further discussed herein, a method of manufacturing a circuit assembly includes: receiving a first circuit board; manufacturing a first surface mount pad on a first surface of the first circuit board, the first surface mount pad being manufactured according to a first height relative to the first surface of the first circuit board; and manufacturing a second surface mount pad on the first surface of the first circuit board, the second surface mount pad being manufactured according to a second height relative to the first surface of the first circuit board. The second height may be greater than the first height.

[0021] As previously discussed, the initial height of the second surface mount pad (or the base portion of the second surface mount pad) relative to the first surface is substantially equal to the first height of the first surface mount pad. Manufacturing the second surface mount pad may further include: via a manufacturing system: applying a mask layer to a first surface of the first circuit board, wherein the mask layer may cover the first surface mount pad, the mask layer may include openings exposing the second surface mount pad; and applying a conductive material in the openings to increase the height of the second surface mount pad relative to the first surface, wherein the mask layer prevents the application of conductive material to the first surface mount pad. Additionally, the manufacturer removes the mask layer from the first surface to expose the first and second surface mount pads.

[0022] Furthermore, if desired, the manufacturer may manufacture the second surface mounting disc to include at least one void to increase the exposed surface area of ​​the second surface mounting disc.

[0023] These and other more specific examples are presented in more detail below.

[0024] It should also be noted that while the examples discussed herein are applicable to the fabrication of circuit components such as power converter components, the concepts disclosed herein can be advantageously applied to any other suitable topology.

[0025] Additionally, it should be noted that although each of the different features, techniques, configurations, etc., described herein may be discussed in different places, it is intended that each conception in the present invention may optionally be implemented independently of each other or in combination with each other, where appropriate. Therefore, one or more of the inventions as described herein can be practiced and viewed in many different ways.

[0026] Furthermore, it should be noted that this initial discussion of the examples (a brief description of the examples) is intentionally not intended to specify every example and / or incremental novel aspect of this disclosure or the claimed invention. Rather, this brief description presents only general examples and corresponding novel points relative to conventional techniques. For additional details and / or possible perspectives (variations) of the invention, the reader refers to the detailed embodiments of this disclosure (which are a summary of the examples) and corresponding drawings discussed further below. Attached Figure Description

[0027] Figure 1 This is an example diagram showing a side view of a circuit assembly as discussed herein, which includes multiple raised surface mount pads and multiple different types of surface mount pad implementations.

[0028] Figure 2 This is an example side view illustrating the implementation of different types of surface mount pads and corresponding solder joints that provide a low-impedance connection between the first and second circuits as discussed herein.

[0029] Figure 3 This is an example side view illustrating implementations of different types of surface mount pads and solder joints that provide connections between multiple pins of the main circuit board and the power converter circuit assembly, as discussed herein.

[0030] Figure 4 This is an example side view illustrating the fabrication of multiple high-current surface disks on a circuit board as discussed herein.

[0031] Figure 5 This is an example side view illustrating an implementation of multiple high-current surface disks on a substrate as discussed herein.

[0032] Figure 6 This is an example side view showing the different shapes of multiple high-current surface disks and multiple low-current surface disks disposed on the respective circuit boards as discussed herein.

[0033] Figure 7A is an example side view illustrating the implementation of the circuit path between the first standard surface disk and the second standard surface disk as discussed herein.

[0034] Figure 7B is an example side view illustrating an implementation of the circuit path between a standard surface disk and a high-current surface disk as discussed herein.

[0035] Figure 7C This is an example side view illustrating an implementation of a circuit path between a first high-current surface disk disposed on a first circuit board and a second high-current surface disk disposed on a second circuit board, as discussed herein.

[0036] Figure 8 This is an example top view showing different configurations of the surface mounting disks discussed in this article.

[0037] Figure 9 and Figure 10 This is an example side view illustrating the process of providing circuit path connections between multiple circuit components as discussed herein.

[0038] Figure 11 This is an example side view illustrating different implementations of surface disks and corresponding solder joints on multiple circuit boards for providing connections, as discussed herein.

[0039] Figure 12 This is an example diagram illustrating a method for implementing one or more surface mount disks as discussed in this article.

[0040] The foregoing and other objects, features, and advantages illustrated herein will become apparent from the following more specific description, as shown in the accompanying drawings, in which similar reference numerals refer to the same parts throughout different views. The drawings are not necessarily drawn to scale, but are intended to illustrate examples, principles, concepts, etc. Detailed Implementation

[0041] The circuit assembly includes a first circuit board and at least a first surface mount pad. The first surface mount pad may be disposed on a first surface of the first circuit board or in another relationship relative to the first circuit board, wherein the first surface mount pad (e.g., a high-profile surface mount pad) may be configured to include a base surface mount pad and a supplementary conductive element manufactured on the base surface mount pad, such that the base surface mount pad is disposed between the first circuit board and the supplementary conductive element, for example, made of metal. Alternatively, if desired, the first surface mount pad having an increased height relative to a standard surface mount pad may be manufactured as a homogeneous element, rather than as a combination of a base surface mount pad and a supplementary conductive element. It should also be noted that the first circuit board may also include a second surface mount pad. The height of the first surface mount pad may be greater than the height of the second surface mount pad. Therefore, in some cases, the circuit board substrate may be configured to include surface mount pads with different heights.

[0042] As further discussed herein, implementations of one or more high-profile surface mount pads are useful in applications requiring high current delivery and low power loss, resulting in less unwanted heat dissipation. Therefore, the novel surface mount pad implementations discussed herein result in higher power conversion efficiency due to the reduced losses associated with power delivery through the high-profile surface mount pads.

[0043] Now, more specifically, refer to the attached diagram. Figure 1 This is an example diagram showing a side view of a circuit assembly that includes implementations of various different types of surface mount pads as discussed herein.

[0044] like Figure 1 As shown, the manufacturing apparatus 150 manufactures component 110. Component 110 includes a substrate 121 and a plurality of surface mounting pads 131, 132, 133, 134, etc. disposed on the surface 171 of the substrate 121.

[0045] Note that substrate 121 can be any suitable entity, such as circuit board assembly, semiconductor chip, circuit component, electronic part, circuit device, etc.

[0046] Furthermore, in this example, the plurality of surface mount pads include surface mount pad 131 (also referred to as a conductive element), surface mount pad 132 (also referred to as a conductive element), surface mount pad 133 (also referred to as a conductive element) and surface mount pad 134 (also referred to as a conductive element).

[0047] Component 110 may include any number of surface mount pads. Component 110 also includes an insulating material 141 disposed on surface 171 of substrate 121. As its name suggests, the effect of material 141 is to provide electrical isolation between surface mount pads.

[0048] Note again that the circuit board 121 can be any suitable entity on which a surface mount pad is fabricated, such as a circuit, component, circuit part, etc. As its name suggests, the surface mount pad of the corresponding board 121 of component 110 provides a way to connect board 121 and corresponding traces in board 121 to another circuit (hardware, device, part, circuit board, etc.) coupled to surface 171 of board 121.

[0049] In yet another example, note that the surface mount pad 132 may be a two-part (or any number of layers or portions) component comprising a combination of a base surface mount pad 132-1 and a supplementary conductive element 132-2 (e.g., made of copper or other suitable metal or metal alloy). For example, a fabricator 150 may be configured to fabricate the base surface mount pad 132-1 on surface 171 of substrate 121.

[0050] Each of the substrate surface mount pads 132-1 and 133-1 may have a height H2 similar to that of the surface mount pads 131 and 134. In other words, the fabricator 150 may be configured to first fabricate a plurality of surface mount pads, including surface mount pads 131, 132-1, 133-1 and 134, onto the substrate 121.

[0051] After manufacturing the substrate surface mounting pads 131, 132-1, 133-1, 134, etc., the fabricator 150 applies or attaches a supplementary conductive element 132-2 (e.g., made of one or more layers of copper or other suitable metal or metal alloy applied to the top surface 192) to the top surface 192 of the surface mounting pad 132-1. The exposed top surface 193 and one or more side surfaces of the supplementary conductive element 132-2 (also referred to as the surface mounting pad) support connection to any suitable entity, for example, via welding or other techniques.

[0052] The supplementary conductive element 132-2 can be manufactured based on any suitable shape or size. The surface mount pad 132 can also be manufactured as a homogeneous element of metal or metal alloy.

[0053] The surface mounting pad 133 can be a two-part component (a multi-part component having any number of layers to extend to a corresponding height), the two parts comprising a base surface mounting pad 133-1 and a supplementary conductive element 133-2 (e.g., made of copper or other suitable metal or metal alloy). For example, a fabricator 150 can be configured to fabricate the base surface mounting pad 133-1 on a substrate 121. The fabricator 150 applies or attaches the supplementary conductive element 133-2 to the top surface of the surface mounting pad 133-1. The exposed top surface of the supplementary conductive element 133-2 is an extended surface pad supporting connection to any suitable entity.

[0054] The supplementary conductive element 133-2 can be manufactured based on any suitable shape or size. The surface mount pad 133 can also be manufactured as a homogeneous element of metal or metal alloy.

[0055] Therefore, note that the higher surface mounting pads disposed on the substrate 121, such as surface mounting pad 132, surface mounting pad 133, etc., can be manufactured as homogeneous conductive elements (e.g., via a first metal or metal alloy). This means that surface mounting pad 132 can be manufactured as a single homogeneous component or multiple components.

[0056] Higher surface mount pads (higher profile surface mount pads), such as surface mount pad 132, surface mount pad 133, etc., can be manufactured as heterogeneous conductive elements (e.g., via multiple metals or multiple metal alloys). Therefore, the manufacturer 150 can be configured to manufacture surface mount pad 132 by first manufacturing surface mount pad 132-1 and then applying supplementary conductive elements 132-2 to produce surface mount pad 132.

[0057] Note that surface 171 and substrate 121 may be configured to include any number of surface mount pads (e.g., having a first surface mount pad type as indicated by surface mount pads 131, 134, etc.) or (e.g., having a second surface mount pad type as indicated by surface mount pads 132, 133, etc.) for connecting corresponding traces on substrate 121 to other circuit hardware. Figure 2 An example of providing a connection between substrate 121 and another substrate is shown.

[0058] Refer again Figure 1 Note that the fabricator 150 can be configured to fabricate each of the surface mount pads to have a specific desired height, for example, relative to the base surface mount pad or relative to the surface 171 of the substrate 121.

[0059] For example, such as Figure 1As shown, and as previously discussed, the fabricator 150 can be configured to initially fabricate surface mounting discs 131, 132-1, 133-1, 134, etc., with a height H2 (low height) relative to surface 171.

[0060] Additionally, the manufacturer 150 selects one or more surface mounting disks and increases the height of the selected surface mounting disk relative to the height H2 of the base surface mounting disk (surface mounting disks 131, 132-1, 133-1, 134, etc.).

[0061] For example, the fabricator 150 can be configured to select surface pads 132-1 and 133-1 to produce surface pads with a higher profile having a height H1. In other words, in this example, the fabricator 150 selects to produce surface mounting pads 132 and 133 to support higher currents compared to surface mounting pads 131 and 134. In such a case, the fabricator 150 fabricates surface mounting pad 132 to include supplementary conductive elements 132-2 directly coupled to the top surface 192 or possibly the side surface of surface mounting pad 132-1. For example, the exposed surface of supplementary conductive element 132-2 associated with surface mounting pad 132 is located at a height H1 relative to the surface 171 of circuit board 121 on the top side 193 of supplementary conductive element 132-2. Therefore, applying one or more layers of metal or other suitable material to the top surface 192 by the fabricator 150 to fabricate surface mounting pad 132-2 increases the total height of surface mounting pad 132 to height H1.

[0062] Additionally, through one or more layers of applied metal or other suitable material, the fabricator 150 further fabricates the surface mount pad 133 to include a supplementary conductive element 133-2 directly coupled to the top surface of the surface mount pad 133-1. The exposed surface on the top side of the supplementary conductive element 133-2 is located at a height H1 relative to the surface 171 of the circuit board 121.

[0063] In this case, surface mount disks 132 and 133 both have a higher height profile than surface mount disks 131 and 134.

[0064] As discussed elsewhere herein, modified (higher profile or higher) surface mount pads, such as surface mount pads 132 and 133, provide higher current flow capability than standard surface mount pads 131 and 134. This is because supplementary conductive elements 132-2 and 133-2 are made of metal and replace the solder that would have provided the connection between the substrate 121 and another circuit component / circuit assembly.

[0065] In other words, the metal or metal alloy used to manufacture the supplementary conductive elements 132-2 and 133-2 can be configured to have a resistivity lower than that of the solder. In other words, and as further shown herein, the metal or metal alloy used to manufacture the supplementary conductive elements 132-2 and 133-2 provides a higher conductivity than that of the solder.

[0066] In summary, the examples herein include component 110, which includes a first circuit board 121 and a surface mount pad 132. Component 110 may also include a surface mount pad 131, which is substantially similar to a substrate surface mount pad 132-1. The height H1 of the surface mount pad 132 (e.g., a combination of the substrate surface mount pad 132-1 and supplementary conductive element 132-2) may be greater than the height H2 of the surface mount pad 131.

[0067] Additionally, the apparatus discussed herein may include a first circuit board 121; a first surface mount pad 132; and a second surface mount pad 131. The first surface mount pad 132 may be disposed on a first surface 171 of the first circuit board 121, wherein the first surface mount pad 132 is manufactured according to a first height H1 relative to the first surface 171; the second surface mount pad 131 may be disposed on the first surface 171 of the first circuit board 121, wherein the second surface mount pad 131 is manufactured according to a second height H2 relative to the first surface 171. The height H2 of the surface mount pad 131 is less than the height H1 of the surface mount pad 132.

[0068] As previously discussed, the manufacture and implementation of surface disk 132 (a higher height profile surface disk with heterogeneous or homogeneous material) supports a higher current flow capability than that supported by a second surface disk (e.g., a lower height profile surface disk H2).

[0069] In yet another example, component 110, as discussed herein, may be configured to include an insulating material layer 141 disposed on a first surface 171 of the first circuit board 121, wherein the insulating material layer 141 at least partially covers a first portion of the top surface of surface mounting pads 131, 134, etc. The insulating material layer 141 may be configured to include openings 191 and 192 in any number of openings. Surface mounting pad 132 may be configured to extend from surface 171 and through openings 192 of the insulating material 141. As previously discussed, the insulating material 141 (also referred to as an insulating material, such as a non-conductive material) may be as follows: Figure 1 The first portion of the top surface of the second surface mounting disk 131 is shown to be partially covered. An opening 191 in the insulating layer 141 can be configured to expose a second portion of the top surface of the second surface mounting disk 131.

[0070] Figure 2 This is an example side cross-sectional view illustrating different types of surface mount pads and solder joints that provide a connection between the first and second circuits as discussed herein.

[0071] In this example, fabricator 150 provides solder connections between substrate 121 and substrate 122 to produce assembly 200. Substrate 122 can be any suitable entity, such as a circuit board, circuit component, device, etc.

[0072] For example, such as Figure 2 As shown, the fabricator 150 receives the substrate 121 (as previously described in...). Figure 1 (discussed in the following text) and receiving substrate 122. Substrate 122 includes a plurality of surface mounting pads 231, 232, 233 and 234 disposed on surface 271 of substrate 122. Substrate 122 can be configured to include any number of surface mounting pads. Each surface mounting pad on substrate 122 may have the same or different heights relative to surface 271.

[0073] The fabricator 150 produces the assembly 200 into a substrate 121 including a solder joint coupled to a substrate 122 via solder connections between surface mount pads. For example, the fabricator 150 supplies solder block 251 and then heats the solder block 251 (above its respective melting point) between surface mount pads 131 and 231; the subsequently cooled solder block 251 (now a homogeneous solid) provides a conductive path between the surface mount pads 131 of the substrate 121 and the surface mount pads 231 of the substrate 122.

[0074] Additionally, the fabricator 150 supplies solder block 252 and then heats solder block 252 (above its corresponding melting point) between surface mount pad 132 and surface mount pad 232; the subsequently cooled solder block 252 provides a conductive path between surface mount pad 132 of substrate 121 and surface mount pad 232 of substrate 122.

[0075] Additionally, the fabricator 150 supplies solder block 253 between surface mount pad 133 and surface mount pad 233 and then heats the solder block 253; the cooled solder block 253 provides a conductive path between surface mount pad 133 of substrate 121 and surface mount pad 233 of substrate 122.

[0076] Additionally, the fabricator 150 supplies solder block 254 between surface mount pad 134 and surface mount pad 234 and then heats solder block 254; solder block 254 provides a conductive path between surface mount pad 134 of substrate 121 and surface mount pad 234 of substrate 122.

[0077] Therefore, in this example, the device such as component 200 also includes substrate 121, substrate 122, a first solder joint (251), and a second solder joint (252). Substrate 121 includes surface disks 131 (height H2) and 132 (height H1), each with different heights. Substrate 122 can be configured to include surface disks 231 and 232 disposed on surface 271 of substrate 122. Surface disks 231 and 232 may have the same height, or, as discussed later in this specification, may have different heights.

[0078] The first solder joint (251) can be configured to extend between the surface mount pad (131) and the surface mount pad (231). The second solder joint (252) can be configured to extend between the surface mount pad (132) and the surface mount pad (232).

[0079] Surface 171 or corresponding surface pad 131 of the first circuit board 121 can be spaced apart from the first surface 271 or corresponding surface pad 231 of the second circuit board 122 by a distance D1 or D2 (X). The first height H1 of the surface mounting pad 132 can be between 50% and 90% of the distance X (D1 and D2). In this case, the presence of the surface pad 132 with height H1 significantly reduces the corresponding remaining gap between the bottom surface (surface 193) of the surface pad 132 and the top surface of the surface pad 232. Therefore, in general, the raised surface pad 132 provides a lower resistivity path between the surface pads 132 and 232 because the supplementary conductive material used to manufacture the surface pads 132-2 has a lower resistivity than the solder block 252.

[0080] The raised profile of surface mount pad 132, such as surface mount pad 132-2, also includes an exposed side surface to which a corresponding portion of solder 252 is attached. In other words, the raised profile of surface mount pad 132 provides additional exposed surface area of ​​the corresponding metal associated with surface mount pad 132-2 to provide connectivity.

[0081] Therefore, in one example, at least a portion of the first solder material block (252) contacts the top surface of the surface disk 232 and the bottom surface (193) and side surface of the surface disk 132-2.

[0082] Figure 3 This is an example side view illustrating an implementation of different types of surface mount pads and solder joints that provide connections between multiple pins of the host circuit board and the power converter circuit assembly, as discussed herein.

[0083] In another example implementation, the first circuit board 121 may be configured to include an embedded voltage regulator circuit 120-X for: i) receiving an input voltage Vin from a first surface mount pad 132, ii) converting the input voltage Vin into an output voltage 123, and iii) outputting the output voltage 123 from a second surface 710-1 of the first circuit board 121 to a load 118, the second surface 710-1 of the first circuit board 121 facing in a direction opposite to the first surface 171 of the first circuit board 121.

[0084] In this example, one or more instances of the power converter assembly 120-X are disposed in a respective package substrate 710. The package substrate 710 (also referred to as substrate 121) may be configured to include a respective cavity in which the power converter assembly is disposed between the top surface 710-1 and the bottom surface 710-2 (also referred to as surface 171) of the package substrate 710 (121). It should also be noted that the power converter assembly associated with the package substrate 710 (substrate 121) is disposed between the sides 710-3 and 710-4 of the package substrate 710. Thus, the cavity in which one or more instances of the power converter assembly reside is disposed between the top surface 710-1, the bottom surface 710-2 (171), and the sides 710-3 and 710-4 of the package substrate 710.

[0085] As otherwise shown, note that an output capacitor, for example, represented at least in part by one or more capacitors COUTX, may be disposed in a redistribution layer 135, which is disposed between the load 118 and the top surface 710-1 of the package substrate 710.

[0086] Furthermore, as shown, the packaging substrate 710 (substrate 121) can be configured to include a conductive path 721 extending between the power converter assembly and the redistribution layer 135. A first portion of the conductive path 721 can be configured to supply the output voltage generated from the power converter assembly. A second portion of the conductive path can be configured to support a return path for current to the ground (GND) node of the power converter assembly.

[0087] It should also be noted that the package substrate 710 (substrate 121) can be configured to include one or more conductive paths 722 extending between the power converter assembly and the connection interface 780. A first portion of the conductive path 722 can be configured to receive an input voltage Vin from one or more surface mount pads 132, 133, etc., and supply one or more input voltages to the power converter assembly 120-X, which converts the received input voltage into an output voltage 123 supplied to the load 118. A second portion of the conductive path can be configured to provide a return path for current to the ground (GND) node of the power converter assembly.

[0088] Additionally, as shown, the package substrate 710 can be configured to include one or more conductive paths 723, wherein the conductive paths extend through the cavity of the package substrate 710, and as shown, the nodes of the connection interface 780 are directly connected to the nodes on the redistribution layer 135.

[0089] Therefore, higher profile surface mount pads, such as surface mount pad 132, surface mount pad 133, etc., provide a lower resistance path between substrate 122 and substrate 121 and the corresponding power converter 120-X therein.

[0090] Figure 4 This is an example diagram illustrating the fabrication of multiple high-current surface disks on a substrate (i.e., circuit components) as discussed herein.

[0091] In processing operation 410, the fabricator 150 receives a substrate 121. The substrate 121 includes a surface disk 131 and a surface disk 132-1.

[0092] In processing operation 121, the fabricator 150 applies a corresponding mask material layer 415 covering the surface disk 131. The corresponding mask material layer 415 includes a corresponding opening 432 that provides a passage to the substrate surface disk 132-1.

[0093] In processing operation 430, the fabricator 150 applies one or more layers of conductive material to the top surface of the surface disk 132-1 through the opening 432 to produce the surface disk 132-2 on the surface mounting disk 132-1.

[0094] As shown, the fabricator 150 can be configured to produce any number of high-profile surface mount pads on the substrate 121.

[0095] Figure 5 This is an example diagram illustrating how multiple high-current surface disks on a substrate, as discussed herein, are implemented.

[0096] In processing operation 440, the fabricator 150 removes the mask material layer 415 to expose the top surfaces of surface disk 131 and surface disk 132.

[0097] In processing operation 450, the fabricator 150 applies a layer of solder material 510 to one or more exposed surface pads on surface 171.

[0098] Figure 6 These are example diagrams illustrating different shapes of surface disks as discussed in this article.

[0099] As previously discussed, the surface disk disposed on the substrate 121 can be any suitable size or shape.

[0100] In one example, the shape of the surface disk can be a mixture of striped and random shapes (e.g., a wider surface disk where W2 > W1, and / or a taller surface disk where H1 > H2) to accommodate high current transfer between the substrate 121 and another component. More specifically, a surface disk 631 disposed on surface 171 of the substrate 121 has a width W2; a surface disk 632 disposed on surface 171 of the substrate 121 has a width W1. In this example, the width W2 is greater than the width W1.

[0101] Figure 7A is an example diagram illustrating the implementation of the circuit path between the first standard surface disk and the second standard surface disk as discussed herein.

[0102] As previously discussed, electrical connections between the surface mount pad 131 (e.g., having a height H2) and the surface mount pad 231 (e.g., having a height H1 or other suitable height) on the substrate 121 can be achieved via a solder block 251 disposed between the bottom surface of the surface mount pad 131 and the top surface of the surface mount pad 231. The solder block 251 is generally elliptical. In this case, solder fills the gap between the bottom surface of the surface mount pad 131 and the top surface of the surface mount pad 231. Note that the amount of solder 251 is greater than that shown in FIG. 7B. Figure 7C The amount of solder 252 in the sample is because surface pads 131 and 231 are low profile.

[0103] Figure 7B is an example diagram illustrating the implementation of the circuit path between the standard surface disk and the high-current surface disk as discussed herein.

[0104] As shown, the surface disk 132 disposed on the substrate 121 (e.g., a combination of surface disk 132-1 and surface disk 132-2) can be configured according to any suitable shape.

[0105] For example, the surface disk 132 disposed on the substrate 121 can be manufactured with a height H1 (high profile surface mount disk) as previously discussed. The surface disk 232 disposed on the substrate 122 can be manufactured with a height H2 (low profile surface mount disk). As further shown, solder blocks 252 fill the gap between the bottom surface and the top surface of the surface disk 132. Solder blocks 252 have a different shape than solder blocks 251. Advantageously, solder blocks 252 contact the bottom surface and the sides of the surface disk 132.

[0106] In addition, the surface mount pad 132-2 occupies the volume that would have been solder 252.

[0107] Figure 7C This is an example diagram illustrating the implementation of the circuit path between the first and second surface disks as discussed in this paper.

[0108] As shown in this example, the surface disk 132 disposed on the substrate 121 (e.g., a combination of surface disk 132-1 and surface disk 132-2) can be configured according to any suitable shape and height.

[0109] For example, the surface disk 132 disposed on the substrate 121 (via the fabricator 150) can be manufactured to have a height H3 (e.g., a height relative to the intermediate profile of the surface 171 of the substrate). The surface disk 232 disposed on the substrate 122 can be manufactured to a height H4 (e.g., a height relative to the intermediate profile of the surface 171 of the substrate). As further shown, solder blocks 252 fill the gap between the bottom surface of the surface disk 132 and the top surface of the surface disk 232. Figure 7C The solder block 252 in the figure has a different shape than the solder block 251 in Figure 7A. This is because of the supplementary conductive material used to manufacture the surface disk 132-2 and the supplementary conductive material used to manufacture the surface disk 232-2 on the substrate surface disk 232-1, thereby causing an increase in the height (H4) of the surface disk 232.

[0110] Advantageously, solder block 252 contacts the bottom surface and side surface of surface disk 132; solder block 252 contacts the top surface and side surface of surface disk 232. Additionally, surface mount disk 132-2 occupies the volume that would otherwise be solder 252; surface mount disk 232-2 occupies the volume that would otherwise be solder 252.

[0111] Figure 8 This is an example top view showing different configurations of the surface mounting disks discussed in this article.

[0112] In this example, surface disk 132-A (a first example instance of surface disk 132) does not include a void.

[0113] Surface disk 132-B (a second example instance of surface disk 132) includes a void 821 (also referred to as a cavity).

[0114] The surface disk 132-C (a third example instance of the surface disk 132) includes a gap 822 in the middle of the surface disk 132-C and extending to the side of the surface disk 132-C.

[0115] Surface disk 132-D (a fourth example instance of surface disk 132) includes a gap 823 disposed in the middle of surface disk 132-D and extending from the left side of surface disk 132-D to the right side of surface disk 132-D. This latter instance of surface disk 132-D provides separation between the first portion 132-D1 and the second portion 132-D2 of surface disk 132-D.

[0116] Therefore, it should also be noted that each of the surface mount pads (e.g., one or more of surface mount pads 132, 133, 232, 233, etc.) disposed on the circuit board 121 or the substrate 122 as discussed herein may be configured to include at least one gap (e.g., any of gaps 821, 822 or 823), wherein at least one gap may also include a cavity disposed in the middle or side of the respective surface mount pad.

[0117] In addition, the surface mounting disks (132, 133, 232, 232, etc.) can be configured to include a first gap 823 (cavity) extending between a first side 132-D1 of the surface mounting disk 132 and a second side 132-D2 of the surface mounting disk 132.

[0118] Each of the gaps 821, 822, 823, etc., can be configured to provide complete or partial separation between a first portion of the first surface mount pad and a second portion of the first surface mount pad. The separation in the surface mount pad and the corresponding one or more gaps or cavities increase the corresponding surface area of ​​the solder block 252 attached to the corresponding surface pad 132 or surface pad 232.

[0119] Figure 9 and Figure 10 This is an example diagram illustrating the process of providing circuit path connections between multiple circuit components, as discussed herein.

[0120] In this example, in such Figure 9 In the processing operations 910 and 920 shown, the fabricator 150 applies corresponding solder blocks to each of the surface mount pads 911 (911-1, 911-2, etc.) disposed on the substrate 121. Each of the surface mount pads 911 can be manufactured in a similar manner to the surface mount pads 131, 132, 133, etc.

[0121] As shown, the fabricator 150 applies solder blocks 912-1 (e.g., solder paste) to surface disks 911-1 disposed on the surface of substrate 121. The fabricator 150 also applies corresponding solder blocks 912-2 (e.g., solder paste) to surface disks 911-2 disposed on the surface of substrate 121, and so on. As previously discussed, each of one or more surface disks may be configured to include one or more corresponding gaps or not include gaps, if desired.

[0122] like Figure 10 As further shown in processing operation 930, the fabricator 150 applies solder block 1012-1 to surface mount pad 1011-1. The fabricator 150 applies solder block 1012-2 to surface mount pad 1011-2. In a similar manner, the fabricator 150 applies corresponding solder blocks 1012 to each of the surface pads 1011 disposed on the substrate 122. Each of the surface pads 1011 can be manufactured in a manner similar to that of surface pads 231, 232, 233, 234, etc.

[0123] In processing operation 940, the fabricator 150 provides a connection between corresponding surface disks on each of the substrates 121 and 122.

[0124] For example, the fabricator 150 moves the substrate 121 closer to the substrate 122, so that the solder block 912-1 disposed on the first surface disk 911-1 physically contacts the solder block 1012-1 disposed on the surface disk 1011-1; the fabricator 150 moves the substrate 121 closer to the substrate 122, so that the solder block 912-2 disposed on the surface disk 911-2 physically contacts the solder block 1012-2 disposed on the surface disk 1011-2; and so on.

[0125] Additionally, after contact, the fabricator 150 applies appropriate heat to the respective solder blocks to a temperature above the corresponding melting point associated with the solder paste. This liquefies the solder paste. The subsequent cooling of the liquid solder creates corresponding paths of remaining solid solder extending between each of the surface disks 911 disposed on the substrate 121 and each of the surface disks 1011 disposed on the substrate 122.

[0126] Figure 11 This is an example side view illustrating different implementations of the surface disk and corresponding solder joints used to provide electrical connections, as discussed in this article.

[0127] As previously discussed, as shown in configuration 1120, the electrical connection between the surface mount pad 131 (e.g., having a height H2) and the surface mount pad 132 (e.g., having a height H2) on the substrate 121 can be achieved via a solder block 251 disposed between the bottom surface of the surface mount pad 131 and the top surface of the surface mount pad 132. The solder block 251 is generally elliptical. In this case, solder fills the entire gap X1 between the bottom surface of the surface mount pad 131 and the top surface of the surface mount pad 132.

[0128] In contrast, the surface disk 132-D disposed on the substrate 121 can be configured according to any suitable shape, for example, as previously described in Figure 8 The surface disk 132-D disposed on substrate 121 may be configured in the manner discussed herein or in other configurations. For example, the surface disk 232-D disposed on substrate 122 may be manufactured to have a height H3. The surface disk 232-D disposed on substrate 122 may be manufactured to have a height H4. The height H4 may be equal to or different from the height H3.

[0129] If desired, surface disk 132-D can be configured to include gap 1151. Surface disk 232-D can be configured to include gap 1152.

[0130] As further shown, solder block 252 fills the gap X2 between the bottom surface of surface disk 132-D and the top surface of surface disk 232-D. As previously discussed, the presence of gap 1151 in surface disk 132-D and gap 1152 in surface disk 232-D provides a larger surface area in which solder block 252 is attached to each of surface disks 132-D and 232-D.

[0131] As previously discussed, surface disk 132 can be implemented without gaps. Surface disk 232 can be implemented without gaps.

[0132] Figure 12 This is an example diagram illustrating a method of manufacturing one or more surface mount disks in an implementation circuit assembly as discussed herein.

[0133] In the processing operation 1210 of flowchart 1200, the manufacturer 150 receives the first circuit board 121.

[0134] In processing operation 1220, the manufacturer 150 manufactures a first surface mount pad (132) on a first surface of the first circuit board (121), wherein the first surface mount pad is manufactured according to a first height H1.

[0135] In processing operation 1230, the manufacturer 150 manufactures a second surface mount pad (131) on a first surface of the first circuit board, wherein the second surface mount pad (131) is manufactured according to a second height H2. The height H1 is greater than the height H2.

[0136] This implementation allows for the delivery of higher currents via the surface mount panel 132.

[0137] Again, it should be noted that the techniques described herein are well-suited for use in circuit assemblies requiring higher current throughput through one or more surface-mount pads. However, it should be understood that the techniques described herein are not limited to such applications, and are well-suited for other applications as well.

[0138] Although the invention has been specifically shown and described with reference to preferred examples, those skilled in the art will understand that various changes in form and detail may be made to the invention without departing from the spirit and scope of the invention as defined by the appended claims. Such variations are intended to be covered by the scope of this application. Therefore, the foregoing description of the examples of this application is not intended to be limiting. Rather, any limitation on the invention is set forth in the appended claims.

Claims

1. A circuit component, comprising: First circuit board; A first surface mounting pad is disposed on a first surface of the first circuit board, and the first surface mounting pad is manufactured according to a first height. as well as A second surface mount pad is disposed on the first surface of the first circuit board, and the second surface mount pad is manufactured according to a second height, wherein the first height is greater than the second height.

2. The circuit assembly according to claim 1, wherein, The first surface mount disk includes at least one gap, the at least one gap including a first cavity disposed in the middle of the first surface mount disk.

3. The circuit assembly according to claim 1, wherein, The first surface mount pad includes a first gap extending between a first side of the first surface mount pad and a second side of the first surface mount pad, the first gap serving to provide separation between a first portion of the first surface mount pad and a second portion of the first surface mount pad.

4. The circuit assembly according to claim 1, further comprising: An insulating material layer is disposed on the first circuit board, the insulating material layer at least partially covering a first portion of the top surface of the second surface mounting pad.

5. The circuit assembly according to claim 4, further comprising: The first opening in the insulating material layer, the first surface mounting disk extending through the first opening in the insulating material layer; as well as The second opening in the insulating material layer exposes a second portion of the top surface of the second surface mounting disk.

6. The circuit assembly according to claim 1, further comprising: An insulating material layer is disposed on the first surface of the first circuit board; Wherein, the height of the insulating material layer relative to the first surface of the first circuit substrate is less than the first height; and Wherein, the height of the insulating material layer relative to the first surface of the first circuit substrate is greater than the second height.

7. The circuit assembly according to claim 1, further comprising: A first block of solder material in contact with the first surface mount plate; A second block of solder material in contact with the second surface mount disk; and At least a portion of the first solder material block contacts the top surface of the first surface mount pad and the side surface of the first surface mount pad.

8. The circuit assembly according to claim 1, further comprising: The second circuit board includes a third surface mounting pad and a fourth surface mounting pad, which are disposed on a first surface of the second circuit board. A first solder joint extends between the first surface mount pad and the third surface mount pad; as well as The second solder joint extends between the second surface mount pad and the fourth surface mount pad.

9. The circuit assembly according to claim 8, wherein, The third surface mounting plate is manufactured according to the third height; The fourth surface mounting plate is manufactured according to the fourth height; and The third height is greater than the fourth height.

10. The circuit assembly according to claim 9, wherein, The first gap filled with solder between the first surface mount pad and the third surface mount pad is smaller than the second gap filled with solder between the second surface mount pad and the fourth surface mount pad.

11. The circuit assembly of claim 8, wherein, The first surface of the first circuit substrate is spaced apart from the first surface of the second circuit substrate by a distance X; and The first height of the first surface mounting plate is between 50% and 90% of the distance X.

12. The circuit assembly according to claim 1, wherein, The first circuit board includes an embedded voltage regulator circuit for: i) receiving an input voltage from the first surface mounting pad, ii) converting the input voltage into an output voltage, and iii) outputting the output voltage from a second surface of the first circuit board to a load, the second surface of the first circuit board facing in a direction opposite to the first surface of the first circuit board.

13. The circuit assembly according to claim 1, wherein, The first surface mount pad includes a base surface mount pad and a supplementary conductive element manufactured on the base surface mount pad, the base surface mount pad being disposed between the first circuit board and the supplementary conductive element; and The height of the mounting plate on the base surface is substantially equal to the second height.

14. A circuit assembly comprising: First circuit board; as well as A first surface mount pad is disposed on a first surface of the first circuit board. The first surface mount pad includes a base surface mount pad and a supplementary conductive element manufactured on the base surface mount pad, such that the base surface mount pad is disposed between the first circuit board and the supplementary conductive element.

15. The circuit assembly of claim 14, further comprising: A second surface mount disk disposed on a second circuit board; A solder block that provides a conductive path between the second surface mount pad and the supplementary conductive element; and The presence of the supplementary conductive element is used to replace the solder originally required to electrically connect the substrate surface mounting pad to the second surface mounting pad.

16. A method of manufacturing a circuit assembly, comprising: Receive the first circuit board; A first surface mount pad is manufactured on a first surface of the first circuit board, and the first surface mount pad is manufactured according to a first height relative to the first surface. as well as A second surface mount pad is manufactured on the first surface of the first circuit board, and the second surface mount pad is manufactured according to a second height relative to the first surface, the second height being greater than the first height.

17. The method according to claim 16, wherein, The initial height of the second surface mounting plate relative to the first surface is substantially equal to the first height of the first surface mounting plate; and Manufacturing the second surface mounting plate further includes: A mask layer is applied to the first surface of the first circuit board, the mask layer covering the first surface mount pad, the mask layer including an opening exposing the second surface mount pad; and Conductive material is applied through the opening to increase the height of the second surface mount pad relative to the first surface, and the mask layer prevents the conductive material from being applied to the first surface mount pad.

18. The method according to claim 17, wherein, Manufacturing the second surface mount disk also includes: Remove the mask layer from the first surface to expose the first surface mounting pad and the second surface mounting pad.

19. The method of claim 16, wherein, Manufacturing the second surface mount disk includes: The second surface mount disk is manufactured to include at least one void to increase the exposed surface area of ​​the second surface mount disk.

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