Vacuum lamination device and lamination method for a circuit board

Abstract

The present application relates to a kind of vacuum film pressing device and film pressing method for circuit board, comprising: feed assembly, including feed piece;Material receiving assembly, including material receiving piece, feed piece and material receiving piece between being provided with feeding path;Vacuum film pressing assembly, including working space, feeding path passes through working space;First clamping assembly, including movable first clamping mechanism, the clamping end of first clamping mechanism can be moved to working space, feeding path is located between working space and first clamping mechanism;Second clamping assembly, in the feed end of feeding path, second clamping assembly includes movable second clamping mechanism, and feeding path passes through the clamping space of second clamping mechanism;Third clamping assembly, in the material receiving end of feeding path, third clamping assembly includes movable third clamping mechanism, and feeding path passes through the clamping space of third clamping mechanism.The vacuum film pressing device and film pressing method for circuit board of the present application can improve the overall film pressing efficiency of circuit board.

Description

Technical Field

[0001] This invention relates to the field of vacuum pressing technology, and in particular to a vacuum pressing device and pressing method for circuit boards. Background Technology

[0002] Vacuum airbag presses use vacuum airbags as the power source for pressing, achieving rapid pressing of workpieces by controlling the inflation and deflation of the vacuum airbags. Currently, when laminating flexible circuit boards, thin films are applied to both sides of the flexible circuit board coated with adhesive. The flexible circuit board with the films is then placed in the working position of the vacuum press. After the vacuum press completes the pressing, the adhesive is evenly covering the surface of the adhesive-coated area on the flexible circuit board. The flexible circuit board is then removed, and finally, the films on both sides of the flexible circuit board are peeled off. Because applying and peeling the films to the flexible circuit board takes a long time, the overall lamination efficiency of the circuit board is low. Summary of the Invention

[0003] Therefore, the technical problem to be solved by the present invention is to provide a vacuum lamination device and lamination method for circuit boards, which can improve the overall lamination efficiency of circuit boards.

[0004] To solve the above-mentioned technical problems, the present invention provides a vacuum laminating device for circuit boards, comprising: a feeding assembly including a feeding element; a receiving assembly including a receiving element, wherein a feeding path is provided between the feeding element and the receiving element; a vacuum laminating assembly including a working space, wherein the feeding path passes through one end of the working space; a first clamping assembly including a movable first clamping mechanism, wherein the clamping end of the first clamping mechanism is movable toward the working space, and the feeding path is located between the working space and the first clamping mechanism; a second clamping assembly located at the feeding end of the feeding path, wherein the second clamping assembly includes a movable second clamping mechanism, and the feeding path passes through the clamping space of the second clamping mechanism; and a third clamping assembly located at the receiving end of the feeding path, wherein the third clamping assembly includes a movable third clamping mechanism, and the feeding path passes through the clamping space of the third clamping mechanism.

[0005] In one embodiment of the present invention, the movement paths of the first clamping mechanism, the second clamping mechanism, and the third clamping mechanism are parallel to each other, and the workspace is located between the extension lines of the movement paths of the second clamping mechanism and the movement paths of the three clamping mechanisms.

[0006] In one embodiment of the present invention, the first clamping assembly further includes a mounting base, a first driving member, and a first movable base. The first clamping mechanism includes a second driving member, a first clamping plate, and a second clamping plate. The first driving member is connected to the mounting base, the first movable base is slidably connected to the mounting base, the first clamping plate and the second driving member are both connected to the first movable base, the second clamping plate is connected to the output end of the second driving member, and the second clamping plate is movable toward the first clamping plate.

[0007] In one embodiment of the present invention, the mounting base includes a mounting plate, the first movable seat is slidably connected to the mounting plate, the mounting plate is provided with a plurality of clearance holes parallel to the moving path of the first movable seat, and the connection position of the first clamping plate and the first movable seat and the driving path of the second driving member both pass through the clearance holes.

[0008] In one embodiment of the present invention, the feeding assembly further includes a first guide roller, a second guide roller, and a third guide roller, the extension line of the moving path of the second clamping mechanism is located between the second guide roller and the third guide roller, and the feeding path passes through the first guide roller, the second guide roller, the second clamping mechanism, and the third guide roller in sequence.

[0009] In one embodiment of the present invention, the second clamping assembly further includes a third driving member and a second movable seat. The second clamping mechanism includes a fourth driving member, a third clamping plate and a first limiting roller. The second movable seat is connected to the output end of the third driving member. The first limiting roller is rotatably connected to the second movable seat. The fourth driving member is connected to the second movable seat. The third clamping plate is connected to the output end of the fourth driving member. The third clamping plate is movable toward the first limiting roller. The feeding path is located between the third clamping plate and the first limiting roller.

[0010] In one embodiment of the present invention, the receiving assembly further includes a fourth guide roller and a fifth guide roller, the feeding path passes sequentially through the fourth guide roller and the fifth guide roller, the third clamping mechanism is located between the fourth guide roller and the fifth guide roller, the third clamping assembly further includes a fifth driving member and a third movable seat, the third clamping mechanism includes a sixth driving member and a fourth clamping plate, the third movable seat is connected to the output end of the fifth driving member, the sixth driving member is connected to the third movable seat, the fourth clamping plate is connected to the output end of the sixth driving member, the fourth clamping plate is movable toward the third movable seat, and the feeding path is located between the third movable seat and the fourth clamping plate.

[0011] In one embodiment of the present invention, a limiting component is further included. The limiting component includes a connecting frame, a limiting mechanism, and a fourth clamping mechanism. The limiting mechanism includes a seventh driving member, a fourth movable seat, and a second limiting roller. The fourth movable seat is slidably connected to the connecting frame, and the second limiting roller is rotatably connected to the fourth movable seat. The seventh driving member is connected to the connecting frame, and the output end of the seventh driving member is connected to the fourth movable seat. The fourth clamping mechanism includes a sixth guide roller rotatably connected to the connecting frame, and the second limiting roller is movable toward the sixth guide roller.

[0012] In one embodiment of the present invention, the fourth clamping mechanism further includes an eighth driving member, a third limiting roller, a seventh guide roller, and a fifth movable seat. The fifth movable seat is slidably connected to the connecting frame. The eighth driving member is connected to the connecting frame, and the output end of the eighth driving member is connected to the fifth movable seat. The third limiting roller is rotatably connected to the fifth movable seat and is movable towards the sixth guide roller. The seventh guide roller is rotatably connected to the connecting frame and is located between the seventh guide roller and the vacuum pressing assembly. The limiting assembly further includes an eighth guide roller rotatably connected to the fourth movable seat. The feeding path passes sequentially between the eighth guide roller, the seventh guide roller, and the third limiting roller and the sixth guide roller.

[0013] The present invention also provides a method for laminating circuit boards, using the above-mentioned vacuum laminating device for circuit boards, comprising the following steps: Step S1: pushing the film towards the working space until the film bends within the working space, placing the circuit board within the space enclosed by the film; Step S2: the vacuum laminating assembly presses the film and the circuit board until lamination is completed; Step S3: a second clamping mechanism clamps the film, a third clamping mechanism clamps the film, the second clamping mechanism and the third clamping mechanism move away from each other simultaneously, while the film pushes the circuit board towards the first clamping mechanism; Step S4: the first clamping mechanism clamps the circuit board and drives the circuit board out of the working space.

[0014] The technical solution of the present invention has the following advantages compared with the prior art: The present invention discloses a vacuum laminating device and method for circuit boards. Through the cooperation of a feeding component and a receiving component, the film is automatically fed, thus eliminating the need to apply the film to the circuit board during the lamination process. Through the cooperation of a second clamping mechanism and a third clamping mechanism, the film can push the circuit board towards the first clamping mechanism, thereby achieving automatic unloading of the circuit board. The first clamping mechanism is movable, allowing it to move the circuit board out of the working space, thereby realizing automatic film conveying and automatic circuit board unloading, improving the overall lamination efficiency of the circuit board. Attached Figure Description

[0015] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0016] Figure 1 This is a schematic diagram of the structure of a vacuum lamination device for circuit boards according to the present invention; Figure 2 yes Figure 1 Partial structural diagram; Figure 3 This is a schematic diagram of the vacuum film pressing assembly; Figure 4 This is a schematic diagram of the structure of the first clamping component; Figure 5 This is a schematic diagram of the structure of the feeding assembly and the second clamping assembly; Figure 6 This is a schematic diagram of the structure of the receiving component and the third clamping component; Figure 7 This is a schematic diagram of the limit component; Figure 8 This is a schematic diagram of the film feeding path.

[0017] Explanation of reference numerals in the accompanying drawings: 1. Support frame; 2. First clamping assembly; 3. Receiving assembly; 4. Third clamping assembly; 5. Limiting assembly; 6. Feeding assembly; 7. Second clamping assembly; 8. Vacuum film pressing assembly; 9. Film; 21. Mounting plate; 22. Clearance hole; 23. Mounting base; 24. First driving component; 25. First movable base; 26. First clamping plate; 27. Second driving component; 28. Second clamping plate; 31. Receiving component; 32. Fourth guide roller; 33. Fifth guide roller; 41. Fifth driving component; 42. Third movable base; 43. Sixth driving component; 44. 51. Fourth clamping plate; 52. Connecting frame; 53. Seventh driving component; 54. Fourth movable seat; 55. Second limiting roller; 56. Eighth guide roller; 57. Eighth driving component; 58. Fifth movable seat; 59. Third limiting roller; 60. Seventh guide roller; 61. Feeding component; 62. First guide roller; 63. Second guide roller; 64. Third guide roller; 71. Third driving component; 72. Second movable seat; 73. Fourth driving component; 74. Third clamping plate; 75. First limiting roller; 81. First mold body; 82. Second mold body; 83. Working space; 581. Sixth guide roller. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0019] Reference Figures 1 to 6As shown, a vacuum laminating device for circuit boards according to the present invention includes: a feeding assembly 6, including a feeding element 61; a receiving assembly 3, including a receiving element 31, wherein a feeding path is provided between the feeding element 61 and the receiving element 31; a vacuum laminating assembly 8, including a working space 83, wherein the feeding path passes through one end of the working space 83; a first clamping assembly 2, including a movable first clamping mechanism, wherein the clamping end of the first clamping mechanism is movable toward the working space 83, and the feeding path is located between the working space 83 and the first clamping mechanism; a second clamping assembly 7, located at the feeding end of the feeding path, wherein the second clamping assembly 7 includes a movable second clamping mechanism, and the feeding path passes through the clamping space of the second clamping mechanism; and a third clamping assembly 4, located at the receiving end of the feeding path, wherein the third clamping assembly 4 includes a movable third clamping mechanism, and the feeding path passes through the clamping space of the third clamping mechanism.

[0020] In this embodiment, a vacuum laminating device for a circuit board performs vacuum lamination on the circuit board. First, an external robotic arm transfer mechanism pushes the film 9 towards the working space 83 until the film 9 bends within the working space 83, placing the circuit board within the space enclosed by the film 9. Then, the vacuum laminating assembly 8 presses the film 9 and the circuit board. After lamination is completed, a second clamping mechanism clamps the film 9, and a third clamping mechanism clamps the film 9. The second and third clamping mechanisms move away from each other simultaneously, while the film 9 pushes the circuit board towards the first clamping mechanism. That is, the bent portion of the film 9 within the working space 83 gradually decreases towards the first clamping mechanism and pushes the circuit board towards the first clamping mechanism until the end of the circuit board protrudes out of the working space 83. Finally, the first clamping mechanism clamps the circuit board and pulls the circuit board away from the working space 83. By cooperating with the feeding component 61 and the receiving component 31, the film 9 is automatically fed, so that the circuit board does not need to be covered with the film 9 during the lamination process. By cooperating with the second clamping mechanism and the third clamping mechanism, the film 9 can push the circuit board to move towards the first clamping mechanism, thereby realizing the automatic unloading of the circuit board. By being movable, the first clamping mechanism can drive the circuit board away from the working space 83, thereby realizing the automatic conveying of the film 9 and the automatic unloading of the circuit board, improving the overall lamination efficiency of the circuit board.

[0021] Reference Figure 1 As shown, the vacuum laminating device for circuit boards also includes a support frame 1, which supports the feeding assembly 6, the receiving assembly 3, the vacuum laminating assembly 8, the first clamping assembly 2, the second clamping assembly 7, and the third clamping assembly 4.

[0022] Reference Figure 3As shown, the vacuum film pressing assembly 8 can be considered as a vacuum airbag compressor, and the vacuum film pressing assembly 8 is connected to the support frame 1. The vacuum film pressing assembly 8 includes a first mold 81 and a second mold 82. The first mold 81 is located above the second mold 82, and the second mold 82 can be raised and lowered. The first mold 81 and the second mold 82 form a working space 83. When the circuit board and the film 9 are located in the working space 83, they are pressed onto the circuit board by the second mold 82 rising.

[0023] Reference Figure 2 and Figure 4 As shown, the first clamping assembly 2 includes a movable first clamping mechanism, the clamping end of which can move toward the workspace 83.

[0024] Specifically, the first clamping assembly 2 further includes a mounting base 23, a first driving member 24, and a first movable base 25. The first clamping mechanism includes a second driving member 27, a first clamping plate 26, and a second clamping plate 28. The mounting base 23 is connected to the support frame 1, and the first driving member 24 is a linear driving member and is connected to the mounting base 23. The first movable base 25 is slidably connected to the mounting base 23. The first clamping plate 26 and multiple second driving members 27 are all connected to the first movable base 25. The first clamping plate 26 is located above the second driving member 27, and the second clamping plate 28 is connected to the output end of the second driving member 27. The second driving member 27 can drive the second clamping plate 28 to rise and fall, thereby enabling the second clamping plate 28 to move toward the first clamping plate 26. The first clamping plate 26 and the second clamping plate 28 can clamp the circuit board.

[0025] Mounting base 23 includes a mounting plate 21 at the top. A first movable seat 25 is slidably connected to the bottom of mounting plate 21 via a slide rail. Mounting plate 21 has multiple clearance holes 22 parallel to the movement path of the first movable seat 25. The connection position of the first clamping plate 26 to the first movable seat 25 and the drive path of the second drive member 27 both pass through the clearance holes 22. That is, the first clamping plate 26 and the second clamping plate 28 are both located above mounting plate 21. The mounting plate 21 can prevent debris from affecting the movement of the first clamping mechanism. The first drive member 24 can drive the first clamping mechanism to move towards the workspace 83 until the first clamping plate 26 and the second clamping plate 28 clamp the end of the circuit board. Then, the first drive member 24 drives the first clamping mechanism to move away from the workspace 83, so that the circuit board is removed from the workspace 83.

[0026] Reference Figure 5 As shown, the feeding assembly 6 includes a feeding component 61, which is rotatably connected to the support frame 1. The feeding component 61 is used to carry the raw material roll of the film 9, and the feeding of the raw material roll is realized by rotating the feeding component 61.

[0027] Reference Figure 6As shown, the take-up assembly 3 includes a take-up member 31, which is rotatably connected to the support frame 1 and can rotate via a motor. The take-up member 31 is used to carry the take-up roll, and the take-up roll is taken up by the rotation of the take-up member 31. A feeding path is provided between the feeder 61 and the take-up member 31, that is, the two ends of the film 9 are respectively wound on the raw film roll and the take-up roll, and the film 9 can move towards the take-up roll along the feeding path. The feeding path passes through one end of the working space 83 and is located between the working space 83 and the first clamping mechanism.

[0028] Reference Figure 5 As shown, the feeding assembly 6 is located above the vacuum film pressing assembly 8. The feeding assembly 6 also includes a first guide roller 62, a second guide roller 63, and a third guide roller 64, which are rotatably connected to the support frame 1 and parallel to each other. The height of the first guide roller 62 is slightly higher than the height of the feeding component 61, and the first guide roller 62 corresponds vertically to the end of the moving path of the second clamping mechanism. The extension line of the moving path of the second clamping mechanism is located between the second guide roller 63 and the third guide roller 64, thereby achieving tensioning of the film 9 through the second guide roller 63 and the third guide roller 64. The height of both the second guide roller 63 and the third guide roller 64 is lower than the height of the feeding component 61, and the third guide roller 64 corresponds to the top edge of the vacuum film pressing assembly 8. The feeding path passes through the first guide roller 62, the second guide roller 63, the second clamping mechanism, and the third guide roller 64 in sequence. That is, during the movement of the film 9, it is successively covered with the first guide roller 62, the second guide roller 63, the second clamping mechanism, and the third guide roller 64, thereby achieving guidance and tensioning of the film 9's movement path.

[0029] The second clamping assembly 7 is located at the feeding end of the feeding path. The second clamping assembly 7 includes a movable second clamping mechanism, and the feeding path passes through the clamping space of the second clamping mechanism.

[0030] Specifically, the second clamping assembly 7 is located above the vacuum pressing assembly 8 and corresponds to the position of the feeding assembly 6. The second clamping assembly 7 also includes a third driving member 71 and a second movable seat 72. The second clamping mechanism includes a fourth driving member 73, a third clamping plate 74, and a first limiting roller 75. The third driving member 71 is a linear driving member and is connected to the support frame 1. The second movable seat 72 is connected to the output end of the third driving member 71. The third driving member 71 can drive the second movable seat 72 to move closer to or away from the second guide roller 63. The first limiting roller 75 is rotatably connected to the second movable seat 72, and the first limiting roller 75 is parallel to the second guide roller 63. The fourth driving member 73 is a linear driving member and is connected to the second movable seat 72. The third clamping plate 74 is connected to the output end of the fourth driving member 73. The fourth driving member 73 can drive the third clamping plate 74 to move closer to or further away from the first limiting roller 75. The third clamping plate 74 and the first limiting roller 75 form a clamping space. The feeding path is located between the third clamping plate 74 and the first limiting roller 75, so that the film 9 can be clamped between the third clamping plate 74 and the first limiting roller 75.

[0031] Reference Figure 6 As shown, the receiving assembly 3 also includes a fourth guide roller 32 and a fifth guide roller 33 that are rotatably connected to the support frame 1 and parallel to each other. The bottom of the fourth guide roller 32 and the top of the fifth guide roller 33 are on the same horizontal plane. The feeding path passes through the fourth guide roller 32 and the fifth guide roller 33 in sequence, that is, the film 9 is in contact with the fourth guide roller 32 and the fifth guide roller 33 in sequence during the movement.

[0032] The third clamping component 4 is located at the receiving end of the feeding path. The third clamping component 4 includes a movable third clamping mechanism, and the feeding path passes through the clamping space of the third clamping mechanism.

[0033] Specifically, the height of the third clamping mechanism is lower than the height of the workspace 83, and the third clamping mechanism corresponds to the position of the receiving assembly 3. The third clamping mechanism is located between the fourth guide roller 32 and the fifth guide roller 33. The third clamping assembly 4 also includes a fifth drive member 41 and a third movable seat 42. The third clamping mechanism includes a sixth drive member 43 and a fourth clamping plate 44. The fifth drive member 41 is a linear drive member and is connected to the support frame 1. The third movable seat 42 is connected to the output end of the fifth drive member 41. The fifth drive member 41 can drive the third movable seat 42 to move closer to or further away from the fourth guide roller 32. The sixth drive member 43 is a linear drive member and is connected to the third movable seat 42. The fourth clamping plate 44 is connected to the output end of the sixth drive member 43. The sixth drive member 43 can drive the fourth clamping plate 44 to rise and fall, so that the fourth clamping plate 44 can move towards the third movable seat 42. The feeding path is located between the third movable seat 42 and the fourth clamping plate 44, so that the film 9 can be clamped between the fourth clamping plate 44 and the third movable seat 42.

[0034] Reference Figure 7 and Figure 8 As shown, the vacuum laminating device for circuit boards also includes a limiting component 5, which is located between the vacuum laminating component 8 and the first clamping component 2. The limiting component 5 includes a connecting frame 51, a limiting mechanism, and a fourth clamping mechanism. The connecting frame 51 is connected to the support frame 1. The limiting mechanism includes a seventh drive member 52, a fourth movable seat 53, and second limiting rollers 54. The fourth movable seat 53 is slidably connected to the connecting frame 51. Multiple second limiting rollers 54 arranged horizontally are rotatably connected to the fourth movable seat 53. The seventh drive member 52 is a linear drive member and is connected to the connecting frame 51. The output end of the seventh drive member 52 is connected to the fourth movable seat 53, and the seventh drive member 52 can drive the fourth movable seat 53 to rise and fall. The fourth clamping mechanism includes a sixth guide roller 581 rotatably connected to the connecting frame 51. The second limiting rollers 54 can move towards or away from the sixth guide roller 581. After the vacuum lamination assembly 8 completes lamination of the circuit board, the second mold 82 descends. To prevent the circuit board from shifting due to the film 9 tearing apart after sticking to the circuit board during the descent of the second mold 82, the second limiting roller 54 descends with the second mold 82, keeping the circuit board adhered to the film 9 on both sides until the circuit board and the moving path of the first clamping mechanism are at the same height. When the second clamping mechanism and the third clamping mechanism move in opposite directions, the second limiting roller 54 guides the movement of the film 9.

[0035] The fourth clamping mechanism also includes an eighth drive member 56, a third limiting roller 58, a seventh guide roller 59, and a fifth movable seat 57. The fifth movable seat 57 is slidably connected to the connecting frame 51. The eighth drive member 56 is a linear drive member and is connected to the connecting frame 51. The output end of the eighth drive member 56 is connected to the fifth movable seat 57, and the eighth drive member 56 can drive the fifth movable seat 57 to rise and fall. The third limiting roller 58 is rotatably connected to the fifth movable seat 57 and can move towards or away from the sixth guide roller 581. The seventh guide roller 59 is rotatably connected to the connecting frame 51. The sixth guide roller 581 is located between the seventh guide roller 59 and the vacuum film pressing assembly 8, so that the seventh guide roller 59 is farther away from the vacuum film pressing assembly 8 than the sixth guide roller 581. The limiting assembly 5 also includes an eighth guide roller 55 rotatably connected to the fourth movable seat 53. The eighth guide roller 55 corresponds to the second limiting roller 54 that is farthest from the vacuum film pressing assembly 8 among the plurality of second limiting rollers 54. The feeding path passes sequentially between the eighth guide roller 55, the seventh guide roller 59, the third limiting roller 58, and the sixth guide roller 581. That is, during the movement of the film 9, it is sequentially covered with the eighth guide roller 55, the seventh guide roller 59, the sixth guide roller 581, and the third limiting roller 58. The film 9 can be clamped between the third limiting roller 58 and the sixth guide roller 581 by the lifting and lowering of the third limiting roller 58. When the film 9 bends into the receiving space, the film 9 is also covered with the second limiting roller 54.

[0036] The present invention also provides a method for laminating circuit boards, using the above-mentioned vacuum laminating device for circuit boards, comprising the following steps: Step S1: Pushing the film 9 towards the working space 83 until the film 9 bends within the working space 83, placing the circuit board within the space enclosed by the film 9; Step S2: The vacuum laminating assembly 8 presses the film 9 and the circuit board until lamination is completed; Step S3: The second clamping mechanism clamps the film 9, the third clamping mechanism clamps the film 9, the second clamping mechanism and the third clamping mechanism move away from each other simultaneously, while the film 9 pushes the circuit board towards the first clamping mechanism; Step S4: The first clamping mechanism clamps the circuit board and drives the circuit board away from the working space 83.

[0037] Specifically, when the vacuum laminating device for the circuit board is in standby mode, the first clamping mechanism, the second clamping mechanism, and the third clamping mechanism are all open. The third limiting roller 58 and the sixth guide roller 581 clamp the film 9. In step S1, the external robotic arm transfer mechanism pushes the film 9 towards the working space 83 until the film 9 bends within the working space 83. After the circuit board moves to the designated position, it is placed within the space surrounding the film 9 and adheres to it. The robotic arm transfer mechanism then resets. In step S2, the second mold 82 rises. The second mold 82 and the first mold 81 work together by vacuuming and air pumping to compress the film 9 and the circuit board. Then, the second clamping mechanism moves away from the second guide roller 63 to the designated position, and the third limiting roller 58 resets until the lamination is completed. In step S3, the third limiting roller 58 and the sixth guide roller 581 clamp the film 9. The second clamping mechanism clamps the film 9 and moves it towards the second guide roller 63 to a designated position. Then, the second limiting roller 54 descends along with the second mold body 82, keeping the circuit board adhered to the film 9 on both sides until the circuit board and the moving path of the first clamping mechanism are at the same height. Then, the third clamping mechanism clamps the film 9, the third limiting roller 58 resets, and the second and third clamping mechanisms move away from each other simultaneously. At the same time, the film 9 pushes the circuit board towards the first clamping mechanism until the end of the circuit board protrudes out of the working space 83. In step S4, the first clamping mechanism clamps the circuit board and moves it. The second and third clamping mechanisms move to a set position until the circuit board is removed from the working space 83. Then, the second limiting roller 54 resets. The process also includes step S5, where the third limiting roller 58 and the sixth guide roller 581 clamp the film 9, and both the second and third clamping mechanisms are in an open state and move away from each other. Step S6: The third limiting roller 58 resets, the third clamping mechanism clamps the film 9 and moves the film 9 toward the take-up member 31, while the take-up member 31 rotates to wind the film 9 onto the take-up roll. Step S7: The third limiting roller 58 and the sixth guide roller 581 clamp the film 9, the third clamping mechanism releases, and the third clamping mechanism and the second clamping mechanism reset.

[0038] The present invention discloses a vacuum laminating device and laminating method for circuit boards. Through the cooperation of the feeding component 61 and the receiving component 31, the film 9 is automatically fed, so that the film 9 does not need to be applied to the circuit board during the laminating process. Through the cooperation of the second clamping mechanism and the third clamping mechanism, the film 9 can push the circuit board to move towards the first clamping mechanism, thereby realizing the automatic unloading of the circuit board. The first clamping mechanism is movable, so that the first clamping mechanism can drive the circuit board away from the working space 83, thereby realizing the automatic conveying of the film 9 and the automatic unloading of the circuit board, improving the overall laminating efficiency of the circuit board.

[0039] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A vacuum lamination device for circuit boards, characterized in that, include: Feeding assembly, including feeding components; A receiving assembly includes a receiving component, and a feeding path is provided between the feeding component and the receiving component; A vacuum pressing assembly includes a working space, and the feeding path passes through one end of the working space; The first clamping assembly includes a movable first clamping mechanism, the clamping end of the first clamping mechanism being movable toward the workspace, and the feeding path being located between the workspace and the first clamping mechanism; The second clamping assembly is located at the feeding end of the feeding path. The second clamping assembly includes a movable second clamping mechanism, and the feeding path passes through the clamping space of the second clamping mechanism. The third clamping assembly is located at the receiving end of the feeding path. The third clamping assembly includes a movable third clamping mechanism, and the feeding path passes through the clamping space of the third clamping mechanism.

2. The vacuum lamination device for circuit boards according to claim 1, characterized in that: The movement paths of the first clamping mechanism, the second clamping mechanism, and the third clamping mechanism are parallel to each other, and the workspace is located between the extension lines of the movement paths of the second clamping mechanism and the movement paths of the three clamping mechanisms.

3. The vacuum lamination device for circuit boards according to claim 1, characterized in that: The first clamping assembly further includes a mounting base, a first driving member, and a first movable seat. The first clamping mechanism includes a second driving member, a first clamping plate, and a second clamping plate. The first driving member is connected to the mounting base, and the first movable seat is slidably connected to the mounting base. The first clamping plate and the second driving member are both connected to the first movable seat. The second clamping plate is connected to the output end of the second driving member, and the second clamping plate is movable toward the first clamping plate.

4. The vacuum laminating device for circuit boards according to claim 3, characterized in that: The mounting base includes a mounting plate, the first movable seat is slidably connected to the mounting plate, the mounting plate is provided with a plurality of clearance holes parallel to the moving path of the first movable seat, and the connection position of the first clamping plate to the first movable seat and the driving path of the second driving member both pass through the clearance holes.

5. The vacuum lamination device for circuit boards according to claim 1, characterized in that: The feeding assembly further includes a first guide roller, a second guide roller, and a third guide roller. The extension line of the moving path of the second clamping mechanism is located between the second guide roller and the third guide roller. The feeding path passes through the first guide roller, the second guide roller, the second clamping mechanism, and the third guide roller in sequence.

6. The vacuum laminating device for circuit boards according to claim 1, characterized in that: The second clamping assembly further includes a third driving member and a second movable seat. The second clamping mechanism includes a fourth driving member, a third clamping plate, and a first limiting roller. The second movable seat is connected to the output end of the third driving member. The first limiting roller is rotatably connected to the second movable seat. The fourth driving member is connected to the second movable seat. The third clamping plate is connected to the output end of the fourth driving member. The third clamping plate is movable toward the first limiting roller. The feeding path is located between the third clamping plate and the first limiting roller.

7. The vacuum laminating device for circuit boards according to claim 1, characterized in that: The receiving assembly further includes a fourth guide roller and a fifth guide roller. The feeding path passes through the fourth guide roller and the fifth guide roller in sequence. The third clamping mechanism is located between the fourth guide roller and the fifth guide roller. The third clamping assembly further includes a fifth driving member and a third movable seat. The third clamping mechanism includes a sixth driving member and a fourth clamping plate. The third movable seat is connected to the output end of the fifth driving member. The sixth driving member is connected to the third movable seat. The fourth clamping plate is connected to the output end of the sixth driving member. The fourth clamping plate can move towards the third movable seat. The feeding path is located between the third movable seat and the fourth clamping plate.

8. The vacuum laminating device for circuit boards according to claim 1, characterized in that: It also includes a limiting assembly, which includes a connecting frame, a limiting mechanism, and a fourth clamping mechanism. The limiting mechanism includes a seventh driving member, a fourth movable seat, and a second limiting roller. The fourth movable seat is slidably connected to the connecting frame, and the second limiting roller is rotatably connected to the fourth movable seat. The seventh driving member is connected to the connecting frame, and the output end of the seventh driving member is connected to the fourth movable seat. The fourth clamping mechanism includes a sixth guide roller rotatably connected to the connecting frame, and the second limiting roller is movable toward the sixth guide roller.

9. The vacuum laminating apparatus for circuit boards according to claim 8, characterized in that: The fourth clamping mechanism further includes an eighth driving member, a third limiting roller, a seventh guide roller, and a fifth movable seat. The fifth movable seat is slidably connected to the connecting frame. The eighth driving member is connected to the connecting frame, and its output end is connected to the fifth movable seat. The third limiting roller is rotatably connected to the fifth movable seat and can move towards the sixth guide roller. The seventh guide roller is rotatably connected to the connecting frame and is located between the seventh guide roller and the vacuum pressing assembly. The limiting assembly also includes an eighth guide roller rotatably connected to the fourth movable seat. The feeding path passes sequentially between the eighth guide roller, the seventh guide roller, and the third limiting roller and the sixth guide roller.

10. A method for laminating circuit boards, using the vacuum laminating apparatus for circuit boards according to any one of claims 1-9, comprising the following steps: Step S1: Push the film towards the workspace until it bends within the workspace, and place the circuit board within the space enclosed by the film; Step S2: The vacuum lamination assembly presses the film and circuit board until lamination is completed; Step S3: The second clamping mechanism clamps the film, the third clamping mechanism clamps the film, the second clamping mechanism and the third clamping mechanism move away from each other at the same time, and the film pushes the circuit board to move towards the first clamping mechanism; Step S4: The first clamping mechanism clamps the circuit board and drives the circuit board out of the working space.

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