Instrument end conductor alignment method and device based on rotation stop locking position

Abstract

The application discloses an instrument end conductor alignment method and equipment based on rotation stop locking, and relates to the technical field of electrical connectors. The method comprises the following steps: S1, collecting rotation stop assembly track data in the process of twice forward rotation and reverse retreat of a connector base, identifying mechanical stop position, and generating three track sequences, twice locking regression records and locking regression rigid body transformation records; S2, constructing hole position containing pipe bundle, calculating conductor containing residual value, generating first break track anchor point and first break migration evidence frame; S3, generating first break state node and first break migration edge based on the first break migration evidence frame, and screening minimum locking error closed chain; S4, generating rotation stop alignment token based on the minimum locking error closed chain, adjusting the pose of a PCB (Printed Circuit Board), performing conductor hole entry and locking re-inspection, generating rotation stop locking closed record and welding. The application solves the problem that the position of the conductor at the instrument end connector after rotation stop locking is affected by thread regression, resulting in hole entry alignment deviation and insufficient welding assembly stability.

Description

Technical Field

[0001] This invention relates to the field of electrical connector technology, specifically to a method and device for aligning instrument end conductors based on a rotary locking position. Background Technology

[0002] As smart meters develop towards miniaturization, modularization, and high sealing, the assembly relationship between the internal PCB circuit board, conductors, and external connection interfaces of the meter is becoming increasingly close. In addition to undertaking the function of electrical conduction, connectors also need to take into account housing positioning, sealing and locking, and conductor entry hole connection, so that the connection structure of the meter end can adapt to different installation spaces and usage environments.

[0003] For example, application CN103928789B discloses an instrument with a novel circuit board module structure, including an instrument housing and a circuit board assembly disposed within the housing. The circuit board assembly is characterized in that it comprises four circuit boards assembled in relative positions of upper, lower, front, and rear to form a square frame structure. The mating parts of adjacent circuit boards are connected by plug-in connectors, and are provided with interlocking slots and slot flange structures for secure connection.

[0004] For example, application CN109473807B relates to a nuclear-grade instrument connector assembly and a nuclear-grade instrument cable assembly with a plug. The nuclear-grade instrument cable assembly with a plug includes a cable with a core wire, a cable shielding layer, and an outer sheath. A plug is located at the front end of the cable. The plug includes a plug housing, within which a plug insulator is positioned. A plug contact is located within the plug insulator. The front end of the plug contact is a insertion end, and its rear end is electrically connected to the core wire. An external potting sealant, molded with adhesive and wrapped around the outer sheath of the cable, is located between the plug housing and the cable. In the nuclear-grade instrument cable assembly with a plug provided by this invention, the external potting sealant is formed by potting adhesive between the cable and the plug housing. This external potting sealant not only improves the sealing effect, effectively enhancing the sealing effect at the connection between the nuclear-grade instrument cable and the plug, but also provides support and positioning for the cable.

[0005] However, existing technologies mainly focus on circuit board assembly connections, plug sealing, and cable support. They lack joint identification and compensation methods for thread backlash, lock return, and seal springback caused by the connector base being screwed into the mechanical stop position. It is difficult to determine the actual offset of the conductor relative to the communication welding hole position, which can easily lead to conductor entry into the hole being obstructed and insufficient welding alignment stability.

[0006] Therefore, in order to address the above problems, there is an urgent need to provide a method and equipment for aligning instrument end conductors based on the rotary locking position. Summary of the Invention

[0007] Technical problems to be solved

[0008] To address the shortcomings of existing technologies, this invention provides a method and device for aligning instrument end conductors based on screw locking, which solves the problem that the conductor position after the instrument end connector is screwed and locked is affected by the thread backlash, resulting in misalignment of the inlet hole and insufficient stability of welding assembly.

[0009] Technical solution

[0010] To achieve the above objectives, the present invention provides the following technical solution: a method for aligning instrument end conductors based on a screw-locking mechanism, comprising: S1, acquiring screw-locking assembly trajectory data of the connector base during the first forward screw-in, reverse screw-out, and second forward screw-in processes, identifying the mechanical stop position, and generating a first forward screw-in trajectory sequence, a reverse screw-out trajectory sequence, a second forward screw-in trajectory sequence, two lock-locking regression records, and a lock-locking backlash rigid body transformation record; S2, constructing a hole-position accommodating tube bundle, based on the first forward screw-in trajectory sequence, the reverse screw-out trajectory sequence, and the second forward screw-in trajectory sequence... S3. Calculate the conductor capacity margin value based on the first break trajectory anchor point and the first break migration evidence frame, and generate the first break status node and the first break migration edge. Based on the first break migration evidence frame, determine the common lock back stripping operation and the PCB board pose adjustment operation, generate the first break status node and the first break migration edge, and screen the minimum lock error closed chain. Based on the minimum lock error closed chain, generate the rotation stop alignment token, verify the actual lock return status and adjust the PCB board pose, perform conductor entry hole and lock verification layer by layer, generate the rotation stop lock closure record and perform welding connection.

[0011] Further, the specific steps for collecting the rotation and stopping assembly trajectory data of the connector base during the first forward screwing in, reverse retraction, and the second forward screwing in are as follows: Taking the center of the end face of the instrument housing's outlet hole near the PCB circuit board as the origin, the direction of the outlet hole's central axis towards the PCB circuit board as the positive Z-axis, and the radial direction of the starting end of the stop thread as the positive X-axis, the positive Y-axis direction is determined according to the right-hand coordinate rule to establish the instrument end assembly coordinate system; and reading the conductor number, communication welding hole number, conductor radius value, communication welding hole radius value, PCB circuit board thickness value, conductor hole connection definition, and allowable range of silicone sealing ring compression; inserting the connector base with the silicone sealing ring and conductor installed into the instrument housing's outlet hole, taking the axial position when the silicone sealing ring contacts the sealing receiving surface as the zero point of axial entry; controlling the connector base to screw in forward for the first time, collecting rotation angle values, rotation torque values, conductor end center coordinate values, and conductor base center coordinate values ​​at fixed angle intervals to generate rotation and stopping assembly trajectory data.

[0012] Further, the specific steps for identifying the mechanical stop position and generating the first forward rotation trajectory sequence, the retraction trajectory sequence, the second forward rotation trajectory sequence, two lock-in regression records, and the lock-in backlash rigid body transformation record are as follows: Calculate the axial entry increment value and rotational torque increment value of adjacent sampling positions. Determine the first position where the axial entry increment value is not greater than the stop axial increment threshold and the rotational torque increment value is not less than the stop torque increment threshold after N consecutive sampling positions are identified as the mechanical stop position; after releasing the driving force, collect the first lock-in regression angle value, the first lock-in regression axial entry value, and the first lock-in regression coordinate value of each conductor. Then control the connector base to retract in the reverse direction and rotate into the mechanical stop position for the second time in the forward direction. After releasing the driving force, collect the first lock-in regression angle value, the first lock-in regression axial entry value, and the first lock-in regression coordinate value of each conductor. The system collects the second lock-in regression angle value, the second lock-in regression axial entry value, and the second lock-in regression coordinate values ​​of each conductor to generate a first positive spiral trajectory sequence, a backtracking trajectory sequence, a second positive spiral trajectory sequence, a first lock-in regression record, and a second lock-in regression record. The axial entry values ​​of the two lock-in regressions are used as the corresponding silicone seal compression values. The system pairs the sampling records in the first positive spiral trajectory sequence and the backtracking trajectory sequence where the rotation angle difference does not exceed the angle matching threshold. Least square rigid body registration is performed on all conductor coordinates in the two sets of sampling records to generate a lock-in backtracking rigid body transformation record. The lock-in backtracking rigid body transformation record includes the X-axis backtracking displacement value, the Y-axis backtracking displacement value, the Z-axis backtracking displacement value, and the backtracking angle value around the Z-axis.

[0013] Further, the specific steps for constructing the hole-accommodating tube bundle are as follows: Collect the PCB circuit board positioning reference coordinate values, the center coordinate values ​​of each communication welding hole opening, and the PCB circuit board normal vector pointing from the hole opening to the bottom of the hole; convert the center coordinate values ​​of each communication welding hole opening to the instrument end assembly coordinate system; using the center coordinate values ​​of the communication welding hole opening as the starting point, the PCB circuit board normal vector as the central axis direction, the PCB circuit board thickness as the axial length, and the difference between the radius value of the communication welding hole and the radius value of the corresponding conductor as the cross-sectional radius, construct the hole-accommodating tube bundle corresponding to each communication welding hole; stop assembly when the radius value of the communication welding hole is not greater than the radius value of the corresponding conductor.

[0014] Further, based on the first positive spiral trajectory sequence, the backtracking trajectory sequence, the second positive spiral trajectory sequence, and the second locking regression record, the specific steps for calculating the conductor accommodation margin value and generating the first breakage trajectory anchor point and the first breakage migration evidence frame are as follows: Divide the PCB circuit board from the hole opening to the hole bottom into multiple entry hole depth layers according to a fixed depth interval; for each connector base rotation angle value and the second locking regression record in the three trajectory sequences, generate the conductor center axis based on the conductor end center coordinate value and the conductor base center coordinate value; extend the conductor center axis to each entry hole depth layer to generate the conductor cross-section center coordinate value; for each conductor number, calculate the perpendicularity between the conductor cross-section center coordinate value of each entry hole depth layer and the corresponding hole-position accommodation tube bundle center axis based on each connector base rotation angle value and the second locking regression record in the three trajectory sequences. The distance value is calculated by subtracting the vertical distance value from the cross-sectional radius of the tube bundle at the hole location to generate the conductor accommodation margin value. The conductor accommodation margin value is read from small to large according to the hole depth layer number. The hole depth layer with the first conductor accommodation margin value not greater than zero is determined as the first breakage trajectory anchor point. For the same conductor number and the same connector base rotation angle value, the first breakage hole depth layer number corresponding to the first positive rotation trajectory sequence, the backtracking trajectory sequence and the second positive rotation trajectory sequence are read respectively. If no first breakage trajectory anchor point is generated, the first breakage hole depth layer number is recorded as the total number of hole depth layers plus one. The difference between the first positive rotation first breakage hole depth layer number and the backtracking first breakage hole depth layer number is calculated to generate the backtracking first breakage migration value. The difference between the first positive rotation first breakage hole depth layer number and the second positive rotation first breakage hole depth layer number is calculated to generate the re-rotation first breakage re-display value and written into the first breakage migration evidence frame.

[0015] Further, based on the first break migration evidence frame, the specific steps for generating the first break state node and the first break migration edge are as follows: Read the allowable displacement range in the X direction, Y direction, allowable rotation range around the X axis, allowable rotation range around the Y axis, allowable rotation range around the Z axis, and corresponding minimum adjustment step size of the PCB circuit board from the PCB assembly parameter table; when the first break migration values ​​of at least two conductors forming the first break trajectory anchor points have the same sign and the absolute value of the first break re-display value does not exceed the first break re-display threshold, add the common locking backscatter stripping operation; calculate the offset vector from the center axis of the hole-accommodating tube bundle in the depth layer where each first break trajectory anchor point is located to the center of the conductor cross-section; when the X-axis component, Y-axis component, or tangential component relative to the center of the communication welding hole array of each offset vector has the same sign, add the PCB circuit board X-axis translation, Y-axis translation, or rotation around the Z axis operation respectively; the first break entry hole depth layer numbers are sorted in ascending order of the X-coordinate and Y-coordinate values ​​of the communication welding hole positions, and adjacent... When the absolute value of the difference in the number is not greater than 1, it is treated as zero; when all differences after processing are not less than zero or not greater than zero, and at least one difference is not zero, PCB circuit board rotation operations around the Y-axis and around the X-axis are added respectively; the initial first break state node is generated using the first break trajectory anchor point in the second lock-up return state, and the number of first break trajectory anchor points, the minimum first break entry hole depth layer number, and the minimum conductor capacity margin value of all conductors in all entry hole depth layers are recorded; for the added common lock-up backlash stripping operation, the coordinates of all conductors are corrected according to the inverse transformation recorded by the lock-up backlash rigid body transformation, and the PCB circuit board translation and rotation operations are increased by their respective minimum adjustment step size each time, and the first break trajectory anchor point and the minimum conductor capacity margin value are recalculated to generate adjacent first break state nodes; when comparing the two first break state nodes, the number of first break trajectory anchor points of the subsequent first break state node decreases, or the number is the same and the minimum first break entry hole depth layer number increases, or the number and the minimum first break entry hole depth layer number are the same and the minimum conductor capacity margin value increases, a first break migration edge is generated.

[0016] Further, the specific steps for selecting the minimum locking error closed chain are as follows: Expand the first break state node level by level along the first break migration edge, and determine the first break state node with zero first break trajectory anchor points as the first break closed state node; when no first break closed state node is formed, stop the PCB board through-hole operation; when the first break closed state node is formed, extract candidate locking error closed chains from the initial first break state node to each first break closed state node, and sort them in ascending order by the number of adjustment operation types, ascending order by the total number of steps, and descending order by the minimum conductor capacity margin value of the final first break closed state node, and determine the candidate locking error closed chain at the top of the sorted list as the minimum locking error closed chain.

[0017] Further, based on the minimum locking error closed chain, the specific steps for generating a rotation stop alignment token, verifying the actual locking return state, and adjusting the PCB board pose are as follows: When the absolute value of the Z-axis hysteresis displacement in the locking hysteresis rigid body transformation record does not exceed the axial hysteresis threshold, and the compression value of the silicone seal ring in the second locking return is within the allowable range of silicone seal ring compression, the minimum locking error closed chain is read; the common locking hysteresis stripping operation in the chain is converted into the X-axis reverse displacement, Y-axis reverse displacement, and Z-axis reverse rotation of the PCB board, and merged with the cumulative adjustment values ​​of each translation and rotation operation in the minimum locking error closed chain according to the operation order to generate a rotation stop alignment token; the connector base is again controlled to rotate into the mechanical stop position in the forward direction and the driving force is released, and the actual position is collected. The actual locking return angle value, the actual locking return axial entry value, and the coordinate values ​​of the actual locking return end and base center of each conductor are calculated. The actual silicone seal compression value is generated by the difference between the actual locking return axial entry value and the zero point of the axial entry value. The actual locking trajectory reproduction residual value is generated by the Euclidean distance between the actual locking return coordinate values ​​of each conductor and the locking return coordinate values ​​of the same conductor number in the second locking return record. When the actual locking return angle value is within the closed interval formed by the first locking return angle value and the second locking return angle value, the actual silicone seal compression value is within the allowable range of silicone seal compression, and the actual locking trajectory reproduction residual value of each conductor does not exceed the trajectory reproduction threshold, the position and angle of the PCB circuit board are adjusted according to the rotation of the alignment token.

[0018] Further, the specific steps for performing conductor insertion and locking verification layer by layer, generating a locking closure record, and performing welding connections are as follows: Control the PCB circuit board to descend layer by layer along the negative Z-axis of the instrument end assembly coordinate system according to the insertion depth layer. Collect the real-time pose value of the PCB circuit board at each insertion depth layer. Calculate the actual allowance value for each conductor based on the actual locking regression coordinate value, conductor center axis, and the real-time pose value of the PCB circuit board. Stop the descent when any actual allowance value is not greater than zero. The PCB circuit board descends to the bottom of the hole and all conductors are within the actual insertion depth layer. When the actual allowance values ​​are all greater than zero, a locking retest torque value less than the reverse unlocking torque threshold is applied to the connector base. After the locking retest torque value is reached, the retest torque is released, and the connector base inspection regression angle value and the inspection regression coordinate value of each conductor are re-acquired. The inspection allowance value is calculated based on the inspection regression coordinate value, the conductor center axis and the final pose value of the PCB circuit board. When the inspection regression angle value is within the closed interval formed by the two locking regression angle values ​​and all inspection allowance values ​​are greater than zero, a rotation lock closure record is generated, and the welding connection between the conductor and the communication welding hole is performed.

[0019] The second aspect of this invention provides an instrument end conductor alignment device based on rotation lock-in, comprising: a rotation trajectory acquisition module, a hole position accommodating first break module, a first break closure solution module, and a lock-in alignment execution module, wherein: the rotation trajectory acquisition module is used to acquire rotation assembly trajectory data of the connector base during the first forward rotation, reverse retraction, and second forward rotation processes, identify the mechanical stop position, and generate a first forward rotation trajectory sequence, a retraction trajectory sequence, a second forward rotation trajectory sequence, two lock-in return records, and a lock-in return rigid body transformation record; the hole position accommodating first break module is used to construct a hole position accommodating tube bundle, based on the first forward rotation trajectory sequence, the retraction trajectory sequence, the first break closure solution module, and the lock-in alignment execution module. The system calculates the conductor capacity margin value using the retreat trajectory sequence, the second positive rotation trajectory sequence, and the second lock-in regression record, generating the first break trajectory anchor point and the first break migration evidence frame. The first break closure solution module is used to determine the common lock-in backlash stripping operation and PCB board pose adjustment operation based on the first break migration evidence frame, generating the first break status node and the first break migration edge, and filtering the minimum lock-in error closed chain. The lock-in alignment execution module is used to generate a rotation stop alignment token based on the minimum lock-in error closed chain, verify the actual lock-in regression state and adjust the PCB board pose, execute conductor entry holes and lock-in verification layer by layer, generate a rotation stop lock-in closure record, and execute welding connections.

[0020] Beneficial effects

[0021] The present invention has the following beneficial effects:

[0022] (1) Instrument end conductor alignment method and equipment based on screw locking position, the screw locking position is completed in the outlet hole of the instrument housing through the connector base, and the assembly load during the screwing process is borne by the instrument housing and the connector base. Then, the PCB board position is adjusted according to the screw locking position token, which reduces the warping and hole position offset caused by the PCB board directly bearing the screwing load, and improves the assembly reliability of the instrument end connection structure.

[0023] (2) Instrument end conductor alignment method and equipment based on screw lock position: By collecting the screw assembly trajectory data of two forward screw-in and reverse retraction processes, and combining the lock position backlash rigid body transformation record and the first break migration evidence frame to identify thread backlash, sealing ring springback and conductor lock position return offset, the conductor position error can be quantified and converted into PCB circuit board pose adjustment amount, thereby improving the alignment accuracy of conductor and communication welding hole position.

[0024] (3) Instrument end conductor alignment method and equipment based on screw locking position, by constructing a hole position accommodating tube bundle and calculating the conductor accommodating allowance value along the hole depth layer, screening the minimum locking error closed chain before the conductor enters the hole, and performing locking re-verification and inspection of accommodating allowance after the conductor enters the hole, so that the welding connection is established under the condition that the locking state is stable and the conductor can be accommodated throughout the entire process, reducing the risk of thread retraction and connection loosening after welding.

[0025] (4) Instrument end conductor alignment method and equipment based on rotary locking position, by using the conductor hole connection definition, conductor center axis and hole accommodating tube bundle as a unified calculation basis, different conductor arrangement directions can use the same first break identification, closure solution and alignment execution process; when the external interface model changes, there is no need to change the internal conductor alignment main line, providing an extended basis for adapting to different female plugs and instrument appearance structure. Attached Figure Description

[0026] Figure 1 The flowchart shows the instrument end conductor alignment method based on the rotary locking position.

[0027] Figure 2 This is a structural diagram of an instrument end conductor alignment device based on a rotary lock position;

[0028] Figure 3 A schematic diagram of the cable outlet hole and stop thread structure of the instrument housing;

[0029] Figure 4 This is a schematic diagram of the connector base structure;

[0030] Figure 5 This is a schematic diagram of the connector assembly relationship at the instrument end;

[0031] Figure 6 A diagram illustrating an embodiment of the coil-locking conductor alignment.

[0032] Wherein: 1 is the connector base; 2 is the silicone sealing ring; 3 is the conductor; 4 is the instrument housing; 5 is the PCB circuit board; 6 is the upper end of the connector base; 7 is the lower end of the connector base; 8 is the stop thread on the connector base; 9 is the stop thread in the cable outlet hole of the instrument housing; 10 is the communication soldering hole on the PCB circuit board. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Please see Figures 1-6This invention provides a technical solution: a method for aligning instrument-end conductors based on a screw-locking mechanism, comprising: S1, acquiring screw-locking assembly trajectory data of the first forward screw-in, reverse retraction, and second forward screw-in processes of the connector base 1, identifying the mechanical stop position, and generating a first forward screw-in trajectory sequence, a retraction trajectory sequence, a second forward screw-in trajectory sequence, two lock-locking regression records, and a lock-locking backlash rigid body transformation record; S2, constructing a hole-position accommodating tube bundle, calculating the conductor accommodating margin value based on the first forward screw-in trajectory sequence, the retraction trajectory sequence, the second forward screw-in trajectory sequence, and the second lock-locking regression record, and generating the first break trajectory anchor point and the first break migration evidence frame; S3, determining the common lock-locking backlash stripping operation and the PCB circuit board pose adjustment operation based on the first break migration evidence frame, generating the first break state node and the first break migration edge, and screening the minimum lock-locking error closed chain; S4, generating a screw-locking alignment token based on the minimum lock-locking error closed chain, verifying the actual lock-locking regression state and adjusting the PCB circuit board pose, performing conductor entry hole and lock-locking verification layer by layer, generating a screw-locking closure record, and performing welding connection.

[0035] Specifically, the steps for collecting the rotation and stopping assembly trajectory data of the connector base 1 during the first forward screwing in, reverse retraction, and the second forward screwing in are as follows: Taking the center of the end face of the instrument housing's outlet hole near the PCB circuit board 5 as the origin, the direction of the outlet hole's central axis towards the PCB circuit board 5 as the positive Z-axis, and the radial direction of the starting end of the stop thread as the positive X-axis, the positive Y-axis is determined according to the right-hand coordinate rule to establish the instrument end assembly coordinate system; in specific implementation, a binocular industrial camera is used to collect the end face contour of the instrument housing's outlet hole and the starting end contour of the stop thread. Least square plane fitting is performed on the outlet hole end face contour, and least square circle fitting is performed on the outlet hole circumferential contour. The center of the fitted circle is determined as the origin. A straight line passing through the center of the fitting circle and parallel to the normal vector of the fitting plane is determined as the central axis of the outlet hole. The direction towards PCB board 5 is determined as the positive Z-axis. The radial vector pointing from the origin to the center of the starting end of the stop thread is determined as the positive X-axis. The positive Y-axis is determined based on the cross product of the positive Z-axis unit vector and the positive X-axis unit vector, so that the rotation angle value, axial entry value, and conductor coordinates adopt a unified spatial reference. In this embodiment, the circumferential extension angle of the stop thread is 270 degrees. The circumferential extension angle value and the pitch value of the stop thread are read from the connector base assembly parameter table. The conductor number, communication soldering hole number, conductor radius value, communication soldering hole radius value, and PCB circuit are also read. The system includes information on board thickness, conductor hole connection definitions, and allowable compression ranges for silicone seals. The connector base assembly parameter table is stored in a structured table, recording the connector base number, conductor number, conductor radius, maximum allowable conductor tilt angle, allowable conductor bending load, stop thread circumferential extension angle, and stop thread pitch. The conductor radius and stop thread pitch are displayed as floating-point fields in millimeters, the maximum allowable conductor tilt angle and stop thread circumferential extension angle in degrees, and the allowable conductor bending load in Newtons. The communication welding hole number, communication welding hole center coordinates, and communication welding hole radius are retrieved from the PCB board in Excellon format. The drilling file is read, the PCB board thickness value is read from the PCB board stack-up parameter table, and the conductor hole connection definition is read from the electrical connection table. The electrical connection table stores mapping records according to conductor number and communication soldering hole number. The allowable range of silicone seal ring compression is read from the silicone seal ring material compression test record and connector waterproof rating verification record, and recorded using floating-point fields with two millimeter units: lower limit and upper limit of compression. A one-to-one correspondence between conductor number and communication soldering hole number is established according to the conductor hole connection definition. The connector base 1 with silicone seal ring 2 and conductor 3 installed is inserted into the outlet hole of the instrument housing, and the axial position when silicone seal ring 2 contacts the sealing surface is taken as the zero point of axial entry.In specific implementation, a linear displacement sensor and an axial force sensor are installed on the axial drive end of the connector base 1. When the axial force value first reaches the contact force threshold and remains continuously for no less than three sampling cycles, the current position of the linear displacement sensor is zeroed, and the zeroed position is determined as the zero point of the axial entry amount. The contact force threshold is set to 0.5 N to 1.5 N, determined by the axial force range when no measurable compressive deformation occurs during the initial contact test of the silicone seal ring 2, to avoid misjudging the insertion gap of the connector base 1 as the compression amount of the silicone seal ring; controlling the first positive contact of the connector base 1... As the conductor is screwed in, rotational angle, rotational torque, conductor end center coordinates, and conductor base center coordinates are collected at fixed angular intervals. The fixed angular intervals range from 1 to 3 degrees. Specifically, the theoretical axial advance per cycle, calculated by dividing the product of the stop thread pitch and the fixed angular interval by 360, should not exceed half of the stop axial increment threshold. Furthermore, the product of the radial distance from the outermost conductor center to the Z-axis and the corresponding radian value at the fixed angular interval should not exceed half of the minimum hole radial clearance value. The minimum hole radial clearance value is determined by the radius of each communication welding hole. The minimum value is obtained by subtracting the corresponding conductor radius value from the value. The maximum value is selected from the angle values ​​that meet the conditions as the fixed angle interval to balance the efficiency of the rotation stop assembly trajectory data acquisition and the accuracy of mechanical stop position recognition. A servo rotary driver drives the connector base 1 to rotate in the forward direction. An absolute rotary encoder is used to collect the rotation angle value, a series torque sensor is used to collect the rotation torque value, and a linear displacement sensor is used to collect the current axial position value relative to the zero point of axial entry. The current axial position value is determined as the axial entry value. At each fixed angle sampling position, a binocular industrial camera is triggered to expose synchronously and extract the outer contour of each conductor 3. Ellipse fitting is performed on the conductor end contour and conductor base contour respectively. The centers of the two fitted ellipses are transformed to the instrument end assembly coordinate system to generate the conductor end center coordinate value and conductor base center coordinate value. The rotation angle value is used as the data index for the same sampling position. The rotation torque value, axial entry value, conductor end center coordinate value, and conductor base center coordinate value are written into the same sampling record. The sampling records are arranged in ascending order of rotation angle value to generate the rotation stop assembly trajectory data.

[0036] In this implementation plan, by unifying the instrument end assembly coordinate system, the axial entry zero point, and the fixed angle sampling reference, the rotation angle value, rotation torque value, axial entry value, conductor end center coordinate value, and conductor base center coordinate value form a coherent rotation and stop assembly trajectory data. This reduces the impact of coordinate reference offset, sampling timing misalignment, and contact state misjudgment on subsequent calculations, and provides a stable and traceable data foundation for mechanical stop position identification, lock-in backlash rigid body transformation record generation, conductor capacity margin value calculation, and first break trajectory anchor point positioning.

[0037] like Figure 3As shown, the instrument housing 4 has an outlet hole for the connector base 1 to be inserted, and a stop thread D is provided in the outlet hole. The instrument end assembly coordinate system takes the center of the end face of the outlet hole near the PCB circuit board 5 as the origin, the direction of the central axis of the outlet hole toward the PCB circuit board 5 as the positive Z-axis, the radial direction of the starting end of the stop thread D as the positive X-axis, and the positive Y-axis is determined according to the right-hand coordinate rule. After the connector base 1 is inserted into the outlet hole, the stop thread C on the connector base and the stop thread D form a screw-lock fit, and the connector base 1 enters axially along the central axis of the outlet hole; when the axial entry increment value of multiple consecutive sampling positions is not greater than the stop axial increment threshold and the rotational torque increment value is not less than the stop torque increment threshold, the first sampling position is determined as the mechanical stop position.

[0038] like Figure 4 As shown, the connector base 1 includes an upper end 6 and a lower end 7. The upper end 6 is fitted with a conductor 3 and has a stop thread 8 that mates with the stop thread 9 inside the outlet hole of the instrument housing. A silicone sealing ring 2 is installed on the outer periphery of the connector base 1. The lower end 7 is used for mating with an external plug. When the connector base 1 is screwed in forward for the first time, the stop thread 8 moves along the stop thread 9, gradually compressing the silicone sealing ring 2. When the connector base 1 is retracted in reverse, the silicone sealing ring 2 springs back. When the connector base 1 is screwed in forward for the second time to the mechanical stop position, the silicone sealing ring 2 is recompressed. The screwing and stopping assembly trajectory data includes the rotation angle value, rotation torque value, axial insertion amount value of the connector base 1, and the end center coordinate value and base center coordinate value of the conductor 3. After the connector base 1 reaches the mechanical stop position twice and releases the driving force, the first lock-in regression record and the second lock-in regression record are generated respectively. The sampling records in the first positive rotation trajectory sequence and the back track sequence whose rotation angle difference does not exceed the angle matching threshold are paired, and the least squares rigid body registration is performed on all conductor coordinates to generate the lock-in backtracking rigid body transformation record.

[0039] like Figure 5As shown, the PCB circuit board 5, instrument housing 4, silicone sealing ring 2, and connector base 1 are arranged sequentially along the assembly direction. After the silicone sealing ring 2 is installed in the connector base 1, it is inserted into the cable outlet hole of the instrument housing 4. The stop thread 8 on the connector base is tightened with the stop thread 9 in the cable outlet hole of the instrument housing, so that the silicone sealing ring 2 is pressed between the connector base 1 and the instrument housing 4. The PCB circuit board 5 is provided with communication soldering holes 10 that match each conductor 3 according to the conductor hole connection definition. Taking the center coordinate value of the hole of the communication soldering hole 10 as the starting point, the normal vector of the PCB circuit board as the central axis direction, the thickness of the PCB circuit board as the axial length, and the difference between the radius value of the communication soldering hole and the radius value of the corresponding conductor as the cross-sectional radius, the hole receiving tube bundle corresponding to each communication soldering hole 10 is constructed. When the radius value of the communication soldering hole is not greater than the radius value of the corresponding conductor, the assembly stops. After adjusting the position of PCB circuit board 5 according to the positioning token, PCB circuit board 5 descends layer by layer along the negative direction of the Z-axis of the instrument end assembly coordinate system according to the depth of the hole. Each conductor 3 enters the communication welding hole position 10 matched according to the conductor hole position connection definition. The actual accommodation margin of all conductors 3 in each depth of hole is greater than zero. After the locking verification, a locking closure record is generated, and the welding connection between conductor 3 and communication welding hole position 10 is performed.

[0040] Specifically, the steps for identifying the mechanical stop position and generating the first forward rotation trajectory sequence, the backward rotation trajectory sequence, the second forward rotation trajectory sequence, two lock-up regression records, and the lock-up backlash rigid body transformation record are as follows: Perform three-point median filtering on the rotation and stop assembly trajectory data arranged according to rotation angle values ​​to eliminate instantaneous jitter of the rotary encoder, impact spikes from the torque sensor, and sampling noise from the linear displacement sensor; calculate the axial entry increment value and the rotational torque increment value at adjacent sampling positions, where the axial entry increment value is the axial entry value of the later sampling position minus the axial entry value of the previous sampling position, and the rotational torque increment value is the axial entry value of the later sampling position minus the axial entry value of the previous sampling position. The rotational torque value at the sampling position is subtracted from the rotational torque value at the previous sampling position. The first position where the axial entry increment value is not greater than the stop axial increment threshold and the rotational torque increment value is not less than the stop torque increment threshold after N consecutive sampling positions is determined as the mechanical stop position. N is an integer from 3 to 5, the stop axial increment threshold is from 0.005 mm to 0.020 mm, and the stop torque increment threshold is from 0.03 N·m to 0.10 N·m. N, the stop axial increment threshold, and the stop torque increment threshold are determined based on the fixed angle interval, the resolution of the linear displacement sensor, the upper limit of the torque sensor noise, and the stop test of the connector base. The test record confirms that after the stop thread reaches the end of its stroke, the continued rotation of the connector base 1 is restricted, the axial entry increment value approaches zero, and the rotational torque increment value continues to increase. Using N consecutive sampling positions for joint judgment can avoid a single impact sampling position being misidentified as the mechanical stop position. The sampling records between the first positive screw-in starting position and the mechanical stop position are arranged in ascending order of rotation angle value to generate the first positive rotation trajectory sequence. After the driving force is released, the rotational angular velocity value and axial displacement rate value of the connector base are continuously collected. When the absolute value of the rotational angular velocity is not greater than the locking stability angular velocity threshold and the axial displacement rate is... When the absolute value of the rate is not greater than the locking stability axial velocity threshold and is maintained continuously for three sampling cycles, it is determined that the connector base 1 has completed the release of the stop thread clearance and the elastic regression of the silicone seal ring. The first locking regression angle value, the first locking regression axial entry value, and the first locking regression coordinate value of each conductor are collected. The first locking regression coordinate value of each conductor includes the end center coordinate value and the base center coordinate value of the same conductor number. The collected results are written into the first locking regression record. The locking stability angular velocity threshold is taken from 0.02 degrees per second to 0.10 degrees per second, and the locking stability axial velocity threshold is taken from 0.002 mm per second to 0.0.10 mm / s, determined by the resolution of the rotary encoder, the resolution of the linear displacement sensor, and the regression stability test results after the driving force is released; then, the connector base 1 is controlled to retract in the reverse direction to the retraction angle position, which is reduced by 30 to 60 degrees relative to the mechanical stop position. The retraction angle range is determined based on the effective engagement angle range of the stop thread and the backlash re-display test results, so that the connector base 1 maintains thread engagement and releases the stop contact load; during the reverse retraction process, the rotation angle value, rotation torque value, axial entry value, conductor end center coordinate value, and conductor base are collected at the same fixed angle intervals. The center coordinates are collected, and the sampling records are arranged in descending order of rotation angle value to generate a retraction trajectory sequence. The connector base 1 is controlled to rotate into the mechanical stop position for the second time from the retraction angle position. The rotation angle value, rotation torque value, axial entry value, conductor end center coordinate value, and conductor base center coordinate value are collected at the same fixed angle interval. The sampling records are arranged in ascending order of rotation angle value to generate a second forward rotation trajectory sequence. After reaching the mechanical stop position for the second time, the driving force is released, and the locking stability angular velocity threshold, locking stability axial speed threshold, and judgment conditions for three consecutive sampling cycles are applied. Confirm the second locking return status, collect the second locking return angle value, the second locking return axial entry value, and the second locking return coordinate values ​​of each conductor. The second locking return coordinate values ​​of each conductor include the end center coordinate value and the base center coordinate value of the same conductor number, generating a second locking return record. At this point, the first forward spiral trajectory sequence, the retraction trajectory sequence, the second forward spiral trajectory sequence, the first locking return record, and the second locking return record are generated, and the axial entry values ​​of the two locking returns are used as the corresponding silicone seal ring compression values. Since the zero point of the axial entry value is the initial contact of silicone seal ring 2... The axial position during sealing of the bearing surface, and the axial entry values ​​during the two locking return phases respectively reflect the actual compression stroke retained by the silicone seal ring 2 after the driving force is released. Therefore, they can be directly used as the compression values ​​of the silicone seal ring during the first and second locking return phases. The sampling records in the first forward trajectory sequence and the back trajectory sequence whose rotation angle difference does not exceed the angle matching threshold are paired. For each sampling record in the first forward trajectory sequence, the sampling record with the smallest absolute value of the rotation angle difference and not exceeding the angle matching threshold is retrieved from the back trajectory sequence. The angle matching threshold is taken as 0.5 degrees to 1 degree.The 5-degree angle is determined by the rotary encoder's angular resolution and fixed angular interval. Least-squares rigid body registration is performed on all conductor coordinates in the two sets of sampling records. All conductor coordinates are composed of the center coordinates of each conductor end and the center coordinates of its base. Using all conductor coordinates in the first positive spiral trajectory sequence as the registration reference, all conductor coordinates in the retraction trajectory sequence are mapped to the registration reference through rotation around the Z-axis and spatial translations parallel to the X, Y, and Z axes. The solution objective is to minimize the sum of the squared distances between coordinate points of the same conductor number and coordinate type after mapping. Rigid body transformation parameters are jointly solved based on all paired sampling records to generate a locking backlash rigid body transformation record. This record includes X-axis backlash displacement, Y-axis backlash displacement, Z-axis backlash displacement, and backlash angle around the Z-axis, used to characterize the spatial backlash generated by the stop thread between the positive loading state and the reverse unloading state.

[0041] In this implementation scheme, the mechanical stop position, the first forward rotation trajectory sequence, the retraction trajectory sequence, the second forward rotation trajectory sequence, and the two lock-in regression records are incorporated into the same rotation stop assembly trajectory closed loop. The spatial offset caused by the stop thread backlash and the elastic regression of the silicone seal ring is uniformly represented by the lock-in backlash rigid body transformation record. This makes the mechanical stop identification free from the interference of instantaneous impact and single sampling fluctuation. At the same time, it enhances the position comparability between different screw-in directions and different lock-in regression states, and provides a stable and reproducible geometric basis for the calculation of conductor accommodation margin, the identification of the first break trajectory anchor point, and the solution of the minimum lock-in error closed chain.

[0042] Specifically, the steps for constructing the hole-accommodating tube bundle are as follows: Collect the PCB circuit board positioning reference coordinates, the center coordinates of each communication welding hole opening, and the PCB circuit board normal vector pointing from the hole opening to the bottom of the hole. Transform the center coordinates of each communication welding hole opening to the instrument assembly coordinate system. The PCB circuit board normal vector is a unit normal vector with a modulus of 1. In practice, fix the PCB circuit board 5 to a measuring fixture with repeating positioning pins. Select at least three non-collinear positioning reference points on the PCB circuit board 5. Use a telecentric industrial camera to collect images of each positioning reference point and the opening of each communication welding hole 10. The pixel equivalent of the telecentric industrial camera is set to 0. The distance from 0.005 mm to 0.015 mm is determined by the minimum radial clearance between the communication welding hole 10 and the conductor 3, and the positioning accuracy of the hole center. Canny edge detection is performed on the hole image to extract the edge pixels of each communication welding hole. The center of the fitted circle is calculated using least-squares circle fitting, and the coordinates of the fitted circle center in the local coordinate system of the PCB circuit board are determined as the center coordinates of the communication welding hole. Least-squares plane fitting is performed based on at least three non-collinear PCB circuit board positioning reference coordinates. The normal vector of the fitted plane is normalized, and the direction from the hole opening to the bottom is selected according to the PCB circuit board assembly direction to generate the PCB circuit. The PCB normal vector is obtained by matching the coordinates of the PCB positioning reference points in the local coordinate system with the coordinates in the instrument assembly coordinate system point by point. The spatial rotation matrix and translation vector are solved using least-squares rigid body registration. The spatial rotation matrix and translation vector are used to transform the center coordinates of each communication welding hole. The PCB normal vector is then transformed using the spatial rotation matrix without superimposing the translation vector. The transformed PCB normal vector is then normalized again to ensure that the communication welding hole positions, conductor coordinates, the direction of the hole-accommodating tube bundle center axis, and the connector base rotation trajectory all use the same coordinate reference. Starting from the center coordinates, with the PCB circuit board normal vector as the center axis, the PCB circuit board thickness as the axial length, and the difference between the radius of the communication welding hole and the radius of the corresponding conductor as the cross-sectional radius, a hole-accommodating tube bundle corresponding to each communication welding hole 10 is constructed; assembly stops when the radius of the communication welding hole is not greater than the radius of the corresponding conductor; in specific implementation, the PCB circuit board thickness value is read from the PCB circuit board thickness inspection record, the radius of the communication welding hole is read from the PCB circuit board drilling file, and the corresponding conductor radius value is read from the connector base assembly parameter table, and the conductor number is bound to the communication welding hole number one by one according to the conductor hole connection definition;Along the PCB circuit board normal vector transformed to the instrument assembly coordinate system, a circular cross-section is continuously extended from the center coordinate value of the communication welding hole to the axial endpoint corresponding to the PCB circuit board thickness value. At each axial position, a circular cross-section perpendicular to the PCB circuit board normal vector is constructed. The center of the circular cross-section is located on the central axis of the hole-accommodating tube bundle. The radius of the circular cross-section is the difference between the radius of the communication welding hole and the radius of the corresponding conductor. All circular cross-sections are continuously connected along the central axis to form the hole-accommodating tube bundle. The hole-accommodating tube bundle represents the spatial range that the center of the conductor cross-section can pass through without contacting the wall of the communication welding hole. When the center of the conductor cross-section is inside the hole-accommodating tube bundle, the outer circle of the conductor is inside the wall of the communication welding hole. When the center of the conductor cross-section is at the boundary of the hole-accommodating tube bundle, the outer circle of the conductor is tangent to the wall of the communication welding hole. When the center of the conductor cross-section extends beyond the hole-accommodating tube bundle, spatial interference occurs between the conductor and the wall of the communication welding hole. This provides a unified geometric constraint benchmark for calculating the conductor's capacity allowance and identifying the first break trajectory anchor point.

[0043] In this implementation scheme, by converting the radial gap between the communication welding hole 10 and the conductor 3 into a continuous spatial constraint in the instrument end assembly coordinate system, the passable range of different communication welding holes 10 has a unified and comparable geometric expression, reducing the impact of PCB circuit board positioning deviation and coordinate transformation error on the hole determination, and reflecting the interference risk between the conductor 3 and the hole wall in advance as the hole position accommodating tube bundle boundary, providing an accurate and interpretable spatial reference for conductor accommodating margin value calculation, first break trajectory anchor point identification and PCB circuit board pose adjustment.

[0044] Specifically, the steps for calculating the conductor capacity margin value and generating the first break trajectory anchor point and first break migration evidence frame based on the first positive spiral trajectory sequence, the back trajectory sequence, the second positive spiral trajectory sequence, and the second lock-in regression record are as follows: According to the conductor hole connection definition, each conductor number is bound to the corresponding communication welding hole number, and the PCB board thickness value, the cross-sectional radius of the hole-accommodating tube bundle, and the PCB board normal vector with a modulus of 1 that has been converted to the instrument end assembly coordinate system are read; the PCB board hole opening to the hole bottom is divided into multiple hole depth layers according to a fixed depth interval; the fixed depth interval is 0.2 mm to 0.5 mm, based on the PCB board thickness value, the maximum allowable tilt angle of the conductor, and the radial net clearance of the communication welding hole. The maximum allowable tilt angle of the conductor is determined from the connector base assembly parameter table. The radial clearance of the communication welding hole is the difference between the radius of the communication welding hole and the radius of the corresponding conductor. Specifically, the product of the fixed depth interval and the tangent of the maximum allowable tilt angle of the conductor should not exceed half of the radial clearance of the communication welding hole. The maximum value is selected from the values ​​that meet the conditions. The layer containing the hole opening is set as the first entry depth layer, and the layer containing the hole bottom is set as the last entry depth layer. Entry depth layer numbers and entry depth values ​​are generated sequentially from the hole opening to the hole bottom. If the distance between the last entry depth layer and the previous entry depth layer is less than the fixed depth interval, the hole bottom position is used as the last entry depth layer. Each insertion depth layer is a cross-section passing through the central axis of the corresponding insertion tube bundle and perpendicular to the central axis of the insertion tube bundle. The direction of the central axis of the insertion tube bundle is consistent with the direction of the normal vector of the PCB board. For each connector base rotation angle value and the second locking regression record in the first forward trajectory sequence, the backward trajectory sequence, and the second forward trajectory sequence, a conductor center axis is generated based on the conductor end center coordinate value and the conductor base center coordinate value. The conductor center axis is extended to each insertion depth layer to generate the conductor cross-section center coordinate value. In specific implementation, the conductor base center coordinate value of the conductor with the same conductor number is used as the axis starting point, and the vector obtained by subtracting the conductor base center coordinate value from the conductor end center coordinate value is used as the axis direction to establish the conductor center. Axis; For each entry hole depth layer, a depth section is established with the center axis point of the hole position accommodating tube bundle at the current entry hole depth value. The projection of the difference between the point to be determined on the conductor center axis and the current center axis point in the direction of the PCB circuit board normal vector is zero. The intersection point of the conductor center axis and the depth section is obtained, and the coordinates of the intersection point in the instrument end assembly coordinate system are determined as the center coordinate value of the conductor section, so that the conductor 3 entry hole process can be converted into a layer-by-layer comparable section position according to the continuous spatial axis; The second lock-in regression record uses the center coordinate value of the end of the second lock-in regression and the center coordinate value of the base of the second lock-in regression to generate the conductor center axis in the second lock-in regression state, which is used to form the first break trajectory anchor point corresponding to the initial first break state node;For each conductor number, based on the connector base rotation angle values ​​in the first forward trajectory sequence, the backward trajectory sequence, and the second forward trajectory sequence, and the second locking regression record, the vertical distance between the conductor cross-section center coordinates and the corresponding hole-position receiving tube center axis of each insertion depth layer is calculated. The conductor receiving margin is generated by subtracting the vertical distance from the hole-position receiving tube cross-section radius. In specific implementation, the spatial vector pointing from the hole-position receiving tube center axis point to the conductor cross-section center coordinates is projected onto the current insertion depth layer, and the length of the projection vector is determined as the vertical distance. When the conductor receiving margin is greater than zero, the conductor cross-section center is located inside the hole-position receiving tube, and a radial gap is maintained between the conductor outer circle and the communication welding hole wall; when the conductor receiving margin is zero... At that time, the outer circle of the conductor is tangent to the wall of the communication welding hole; when the conductor's allowance value is less than zero, the outer circle of the conductor enters the interference region corresponding to the wall of the communication welding hole; the conductor's allowance value is read from small to large according to the hole depth layer number, and the hole depth layer where the conductor's allowance value is not greater than zero for the first time is determined as the first breakage trajectory anchor point; the first breakage trajectory anchor point records the conductor number, communication welding hole number, connector base rotation angle value, first breakage hole depth layer number, conductor cross-section center coordinate value, and current conductor allowance value, which is used to identify the earliest spatial position where the conductor changes from the accommodateable state to the hole wall interference state; for the same conductor number and the same connector base rotation angle value, the first breakage trajectory sequence, the return trajectory sequence, and the second positive spiral trajectory sequence corresponding to the first breakage trajectory are read respectively. The depth layer number of the first fracture entry hole is recorded as the total number of entry hole depth layers plus one when no first fracture trajectory anchor point is generated. Increasing the total number of entry hole depth layers by one only indicates that no first fracture has occurred and does not correspond to the actual entry hole depth. In specific implementation, the rotation angle value in the first positive spiral trajectory sequence is used as the angle matching benchmark. Sampling records with the smallest absolute value of the rotation angle difference that does not exceed the angle matching threshold are retrieved from the retraction trajectory sequence and the second positive spiral trajectory sequence, respectively. If no consistent rotation angle value exists, linear interpolation is performed based on two adjacent rotation angle values ​​and the corresponding conductor end center coordinates and conductor base center coordinates to generate the conductor coordinates after angle matching. Then, the corresponding first fracture entry hole depth layer number is calculated. The first positive spiral first fracture entry hole depth layer number and the retraction first fracture entry hole depth layer number are calculated. The difference in hole depth layer numbers generates the first breakage migration value. The difference between the first positive-spin first breakage entry hole depth layer number and the second positive-spin first breakage entry hole depth layer number is calculated to generate the second positive-spin first breakage re-display value, which is written into the first breakage migration evidence frame. When both first breakage entry hole depth layer numbers involved in the difference calculation are the total number of entry hole depth layers plus one, the corresponding migration value is recorded as zero, and the corresponding conductor is excluded in the joint locking backlash stripping operation judgment and the first breakage status node sorting. When only one first breakage entry hole depth layer number is the total number of entry hole depth layers plus one, the difference calculation result is retained to indicate that the first breakage trajectory anchor point has disappeared or reappeared. The corresponding difference value is not involved in the same sign judgment of the joint locking backlash stripping operation. In the calculation of the minimum first breakage entry hole depth layer number, only conductors that have formed the first breakage trajectory anchor point are counted.When both initial breakage entry hole depth layer numbers involved in the difference calculation correspond to the actual initial breakage trajectory anchor point, a reversal initial breakage migration value greater than zero indicates that the initial breakage trajectory anchor point in the reverse reversal state migrates towards the hole opening, while a reversal initial breakage migration value less than zero indicates that the initial breakage trajectory anchor point migrates towards the hole bottom. The smaller the absolute value of the re-rotation initial breakage re-display value, the higher the degree of re-display of the initial breakage position in the second forward rotation state compared to the first forward rotation state. The initial breakage migration evidence frame is indexed according to the conductor number and the connector base rotation angle value, and includes the first forward rotation initial breakage entry hole depth layer number, the reversal initial breakage entry hole depth layer number, the second forward rotation initial breakage entry hole depth layer number, the reversal initial breakage migration value, the re-rotation initial breakage re-display value, and the initial breakage trajectory anchor point corresponding to the second lock-in regression record. This provides a traceable basis for the initial breakage migration for the determination of the common lock-in backlash stripping operation and the generation of PCB board pose adjustment operations.

[0045] In this implementation scheme, the first positive rotation trajectory sequence, the backtracking trajectory sequence, the second positive rotation trajectory sequence, and the second lock-in regression record are uniformly mapped to the hole depth layer. The conductor's capacity margin value and the first breakage trajectory anchor point are used to characterize the earliest interference position of conductor 3 along the hole depth direction. This allows the conductor's hole entry risk under different rotation states to have a consistent spatial comparison scale. At the same time, the backtracking first breakage migration value and the re-rotation first breakage re-display value are used to distinguish between the common offset caused by lock-in backlash and the offset of a single conductor itself. This provides an accurate, continuous, and traceable first breakage migration basis for common lock-in backlash stripping operations, PCB board pose adjustment operations, and the solution of the minimum lock-in error closed chain.

[0046] Specifically, based on the first-break migration evidence frame, the steps for determining the common locking backlash stripping operation and the PCB board pose adjustment operation, and generating the first-break state node and the first-break migration edge are as follows: Read the PCB board assembly parameter table for the allowable displacement range in the X-axis, Y-axis, X-axis, Y-axis, and Z-axis directions, and the corresponding minimum adjustment step size. The PCB board assembly parameter table includes the PCB board model field, the lower limit of allowable displacement in the X-axis, the upper limit of allowable displacement in the X-axis, the lower limit of allowable displacement in the Y-axis, the upper limit of allowable displacement in the Y-axis, the lower limit of allowable rotation around the X-axis, the upper limit of allowable rotation around the X-axis, and the upper limit of allowable rotation around the Y-axis. The allowable displacement range, allowable rotation range, and corresponding minimum adjustment step size in the PCB assembly parameter table are determined by the PCB positioning fixture travel, the pose adjustment mechanism resolution, the radial clearance of the communication soldering holes, and the PCB boundary clearance. The minimum allowable displacement value in the X-axis, the minimum allowable rotation value in the Y-axis, the minimum allowable rotation value in the Z-axis, the minimum adjustment step size in the X-axis, the minimum adjustment step size in the Y-axis, and the minimum adjustment step size in the Z-axis are all specified. All displacement values ​​are expressed as floating-point fields in millimeters, and all rotation values ​​are expressed as floating-point fields in degrees. The upper limit of the value is set to 0.2 mm to 1.0 mm, the minimum adjustment step size in the X and Y directions is set to 0.01 mm to 0.05 mm, the upper limit of the absolute value of the allowable rotation around the X-axis, the Y-axis, and the Z-axis is set to 0.2 degrees to 2.0 degrees, and the corresponding minimum rotation step size is set to 0.02 degrees to 0.10 degrees. Each allowable range is written into the PCB circuit board assembly parameter table according to the positive and negative directions of the instrument end assembly coordinate system, so that subsequent counterfactual operations are constrained by the actual adjustable stroke of PCB circuit board 5; the retraction first break migration values ​​of at least two conductors 3 forming the first break trajectory anchor point have the same sign, and the absolute values ​​of the re-rotation first break re-display values ​​do not exceed the first break re-display threshold. At the same time, a common locking backlash stripping operation is added; the common locking backlash stripping operation refers to the reverse correction of the center coordinate values ​​of all conductor ends and the center coordinate values ​​of conductor base based on the inverse transformation of the locking backlash rigid body transformation record, so as to eliminate the common spatial offset formed by the stop thread backlash; for the same connector base rotation angle value, the retraction first breakage migration value and the re-rotation first breakage re-display value corresponding to each conductor 3 are read, the first breakage re-display threshold is 1, which is determined by the fixed depth interval and the repeated sampling error of the three trajectory sequences; the same sign of the retraction first breakage migration value means that the retraction first breakage migration values ​​participating in the judgment are all greater than zero or all less than zero, and the retraction first breakage migration value is zero, which means that the corresponding first breakage position has not undergone directional migration and does not participate in the same sign judgment;When the migration values ​​of the first breakage of two or more conductors 3 are all greater than zero, it is determined that the anchor points of the first breakage trajectory of multiple conductors 3 migrate together towards the orifice in the reverse retraction state. When the migration values ​​of the first breakage of two or more conductors 3 are all less than zero, it is determined that the anchor points of the first breakage trajectory migrate together towards the bottom of the orifice. The absolute value of the first breakage re-display value does not exceed the first breakage re-display threshold, indicating that the second positive spiral trajectory sequence can reproduce the first breakage position in the first positive spiral trajectory sequence. When multiple conductors 3 exhibit the same migration direction and stable re-display characteristics, the spatial offset is attributed to the common offset caused by the stop thread backlash, and the common lock-lock backlash stripping operation and the corresponding lock-lock backlash rigid body transformation record number are recorded. If only one conductor 3 forms the first breakage trajectory anchor point, or if there are fewer than one conductor 3 that meets the same number condition, the spatial offset is determined to be greater than zero. In both cases, without adding a common locking hysteresis stripping operation, the PCB board pose adjustment operation is continued based on the offset vector of the first break trajectory anchor point, so that when a single conductor 3 experiences hole wall interference, it can still enter the subsequent first break state node solution process; calculate the offset vector from the center axis point of the hole position receiving tube bundle in the depth layer of each first break trajectory anchor point to the center of the conductor cross section. When the X-axis component, Y-axis component, or tangential component relative to the center of the communication welding hole position array of each offset vector has the same sign, the PCB board X-axis translation, Y-axis translation, or rotation around the Z-axis is added respectively; the vector pointing from the center axis point of the hole position receiving tube bundle to the coordinate value of the center of the conductor cross section is determined as the offset vector, and the offset vector is projected onto the X-axis and Y-axis of the instrument end assembly coordinate system respectively, generating The X and Y components are generated. The arithmetic mean of the X, Y, and Z coordinate values ​​of the center coordinates of all communication welding hole positions is calculated, and the coordinate point formed by the three arithmetic means is determined as the center of the communication welding hole position array. The spatial vector pointing from the center of the communication welding hole position array to the center axis of the current hole-accommodating tube bundle is projected onto a plane perpendicular to the Z-axis of the instrument end assembly coordinate system. The projected vector is normalized to generate a radial unit vector. The radial unit vector is rotated 90 degrees around the positive Z-axis to generate a tangential unit vector, and the dot product of the offset vector and the tangential unit vector is determined as the tangential component. When the X-components of each offset vector are all greater than zero or all less than zero, the opposite direction of the X-components is determined as the X-axis plane of the PCB circuit board. When the Y-axis component of each offset vector is greater than zero or less than zero, the opposite direction of the Y-axis component is determined as the Y-axis translation direction of the PCB circuit board. When the tangential component is greater than zero or less than zero, the opposite direction of the tangential component is determined as the rotation direction of the PCB circuit board around the Z-axis. Components with zero values ​​are not included in the same sign judgment, so that the PCB circuit board pose adjustment direction is towards the direction of reducing the common offset of multiple conductors. The depth layer number of the first hole is sorted in ascending order according to the X-coordinate value and Y-coordinate value of the communication welding hole position. When the absolute value of the difference between adjacent numbers is not greater than 1, it is treated as zero. When all the differences after processing are not less than zero or not greater than zero, and at least one difference is not zero, the PCB circuit board rotation operation around the Y-axis and around the X-axis is added respectively.Arrange the depth layer numbers of each first break-through hole in ascending order of the X-coordinate value of the communication welding hole position and calculate the difference between adjacent numbers. Set the difference between adjacent numbers with an absolute value not greater than 1 to zero. When all the processed differences are not less than zero or not greater than zero and at least one difference is not zero, perform counterfactual calculations by adding a minimum adjustment step around the Y-axis in both the positive and negative Y-axis directions. Write the rotation direction with fewer first break-through trajectory anchor points into the PCB board's rotation operation around the Y-axis. When the number of first break-through trajectory anchor points is the same in both rotation directions, select the rotation direction with the larger minimum first break-through hole depth layer number. When both the number of first break-through trajectory anchor points and the minimum first break-through hole depth layer number are the same, select the minimum conductor capacity margin value. The larger rotation direction; the depth layer numbers of each first break entry hole are arranged in ascending order according to the Y coordinate value of the communication welding hole position, and the same difference processing method is used to determine the rotation direction of the PCB board around the X axis, so that the change of the first break position along the hole position array coordinate direction can characterize the tilt state of the PCB board 5 relative to the conductor array; the initial first break state node is generated by the first break trajectory anchor point in the second lock-in return state, and the number of first break trajectory anchor points, the minimum first break entry hole depth layer number, and the minimum conductor accommodation margin value of all conductors 3 in all entry hole depth layers are recorded; the initial first break state node also writes the second lock-in return record number, the mark added by the common lock-in backlash stripping operation, the current X-direction displacement value of the PCB board, and the current Y-direction displacement value. Displacement values, current rotation values ​​around the X-axis, current rotation values ​​around the Y-axis, and current rotation values ​​around the Z-axis are added as markers to generate first-break state node numbers, ensuring that each counterfactual pose corresponds to a unique first-break state node. For the added common-lock backlash stripping operation, all conductor coordinates are corrected according to the inverse transformation of the lock backlash rigid body transformation record. Each translation and rotation operation of PCB board 5 adds a corresponding minimum adjustment step size, recalculates the first-break trajectory anchor point and minimum conductor accommodation margin value, and generates adjacent first-break state nodes. When executing the common-lock backlash stripping operation, a backlash rotation matrix is ​​generated based on the backlash angle value around the Z-axis, and the transpose of the backlash rotation matrix is ​​used as the reverse rotation matrix. The back displacement values ​​in the X, Y, and Z directions are combined to form a back displacement vector. The back displacement vector is multiplied by the reverse motion matrix and the negative is taken to generate an inverse translation vector. The inverse motion matrix and the inverse translation vector are then used to correct the center coordinate values ​​of the conductor ends and the center coordinate values ​​of the conductor base. When performing X-axis translation, Y-axis translation, rotation around the X-axis, rotation around the Y-axis, and rotation around the Z-axis of the PCB circuit board, the geometric center of the PCB circuit board positioning reference coordinate value is used as the rotation center. The center coordinate values ​​of the communication welding hole positions and the normal vector of the PCB circuit board are updated, and the hole position accommodating tube bundle is reconstructed. Then, the conductor accommodating margin value and the first break trajectory anchor point of all conductors 3 in all hole depth layers are recalculated.When the displacement value reaches the boundary of the allowable displacement range, the rotation value reaches the boundary of the allowable rotation range, or the first break state node number already exists, the generation of the corresponding adjacent first break state node stops, thereby limiting the counterfactual search scale and avoiding repeated state loops. When, compared to the previous two first break state nodes, the number of first break trajectory anchor points in the subsequent first break state node decreases, or the number is the same and the minimum first break entry hole depth layer number increases, or the number and minimum first break entry hole depth layer number are the same and the minimum conductor capacity margin increases, a first break migration edge is generated. The first break migration edge records the initial first break state node number, the subsequent first break state node number, the adjustment operation type, the operation direction, the single adjustment step size, and the cumulative adjustment value, and points from the initial first break state node to the subsequent first break state node. This ensures that the first break migration process proceeds unidirectionally according to the priority order of decreasing the number of first break trajectory anchor points, migrating the first break position towards the bottom of the hole, and increasing the minimum conductor capacity margin, providing a non-cyclic and traceable state connection relationship for screening the minimum locking error closed chain.

[0047] In this implementation scheme, the common migration features, offset direction features, and first-break depth gradient in the first-break migration evidence frame are uniformly transformed into a counterfactual adjustment path constrained by the allowable pose range of the PCB board. This allows the common locking backlash stripping operation and the PCB board pose adjustment operation to be solved separately in the same first-break state node sequence. Furthermore, a unidirectional improvement criterion is formed using the number of first-break trajectory anchor points, the minimum first-break entry hole depth layer number, and the minimum conductor capacity margin value. This avoids repeated states, invalid back-cuts, and local trial adjustments, improving the convergence, interpretability, and traceability of the first-break migration edge generation, and providing a stable state basis for the minimum locking error closed-loop screening.

[0048] Specifically, the steps for selecting the minimum lock-up error closed chain are as follows: Read the initial first-break state node number, all first-break state nodes, and the first-break migration edge. Using the initial first-break state node as the zeroth expansion layer, write the subsequent first-break state nodes directly reachable from the initial first-break state node into the first expansion layer, and continue generating the next expansion layer in the same way. Based on the current pose value of the PCB board, each allowable displacement range, each allowable rotation range, and the corresponding minimum adjustment step size limiting the expansion range, calculate the distance from the current pose value to the boundary of the corresponding allowable range along each adjustment operation direction. Divide the distance by the corresponding minimum adjustment step size and round down to generate the maximum X-axis translation step size. The maximum number of steps for translation in the Y direction, rotation around the X axis, rotation around the Y axis, and rotation around the Z axis are all recorded. The common locking backlash stripping operation is executed at most once within the same expansion path. The sum of each maximum number of steps and the maximum number of executions of the common locking backlash stripping operation is determined as the maximum expansion layer. During each expansion, the current first break state node number, the predecessor first break state node number, the first break migration edge number, the adjustment operation type, the operation direction, the single adjustment step size, and the cumulative adjustment value are recorded. First break state node numbers already appearing within the same expansion path are not repeated. The cumulative displacement value reaches the corresponding allowable displacement range boundary, and the cumulative rotation value reaches the corresponding allowable rotation value. When the boundary of the moving range is reached, the current expansion layer reaches the maximum number of expansion layers, and the current first break state node has no unvisited first break migration edge, the corresponding expansion path is stopped, and the first break closed state node is no longer used as the starting point for further expansion; the first break state node is expanded level by level along the first break migration edge, and the first break state node with zero first break trajectory anchor points is determined as the first break closed state node; the first break closed state node indicates that the conductor accommodation margin of all conductors 3 in all hole depth layers is greater than zero, and when the connector base 1 is in the second lock position return state, the central axis of each conductor can continuously pass through the corresponding hole position to accommodate the tube bundle; when the first break closed state node is not formed, the PCB board hole operation is stopped; During implementation, when all expansion paths reach the corresponding allowable range boundary, maximum expansion layer number, or there are no unvisited first break migration edges, and a first break closed state node has not yet been formed, the current position of the PCB board is maintained and further descent is prohibited to avoid interference between conductor 3 and the wall of the communication soldering hole. When a first break closed state node is formed, candidate locking error closed chains are extracted from the initial first break state node to each first break closed state node. In specific implementation, each first break closed state node is traced back along the predecessor first break state node number to the initial first break state node, and the backtracking results are arranged according to the forward connection order of the first break migration edges to generate the corresponding candidate locking error closed chains.For each candidate locking error closed chain, the number of different adjustment operation types appearing within the chain is counted. Common locking backlash stripping, PCB X-axis translation, PCB Y-axis translation, PCB rotation around the X-axis, PCB rotation around the Y-axis, and PCB rotation around the Z-axis are each counted as one adjustment operation type. The number of first-break migration edges within the chain is determined as the total number of steps. The minimum conductor capacity margin of the first-break closure state node at the endpoint of the candidate locking error closed chain is read and sorted in ascending order by the number of adjustment operation types, then in ascending order by the total number of steps, and finally in descending order by the minimum conductor capacity margin of the first-break closure state node at the endpoint. The candidate locking error closed chain ranking first is determined as the minimum locking error closed chain. This sorting relationship prioritizes reducing the types of pose adjustments, then reducing the number of executions, and finally, under the condition of the same adjustment complexity, retains the closure result with a larger safety margin for the conductor inlet, so that the minimum locking error closed chain balances execution simplicity and conductor inlet stability.

[0049] In this implementation plan, candidate locking error closed chains corresponding to each first-break closed state node are included in a unified screening criterion. The number of adjustment operation types, total number of steps, and minimum conductor capacity margin of the final first-break closed state node are used as the basis for hierarchical evaluation. This ensures that the closed path prioritizes reducing the types and number of pose adjustments while ensuring that all conductors 3 are continuously inserted into the hole. This reduces invalid expansion, repeated adjustments, and insufficient safety margin, thereby improving the execution efficiency, stability, and reproducibility of the minimum locking error closed chain. At the same time, it promptly blocks the PCB board insertion operation before the first-break closed state node is formed, reducing the risk of interference between conductor 3 and the wall of the communication soldering hole.

[0050] Specifically, the steps for generating a rotation stop alignment token based on the minimum locking error closed chain, verifying the actual locking return state, and adjusting the PCB board pose are as follows: When the absolute value of the Z-axis hysteresis displacement in the locking hysteresis rigid body transformation record does not exceed the axial hysteresis threshold, and the compression value of the silicone seal ring during the second locking return is within the allowable range of silicone seal ring compression, the minimum locking error closed chain is read. The axial hysteresis threshold is taken from 0.02 mm to 0.10 mm, determined jointly by the lower limit of the allowable range of silicone seal ring compression, the PCB board thickness, and the measurement error of the linear displacement sensor. When the Z-axis hysteresis displacement value exceeds the axial hysteresis threshold, the current axial locking state is deemed unacceptable. The PCB circuit board undergoes lateral pose adjustment compensation, stopping the generation of rotation stop alignment tokens; the second locking return silicone seal compression value is within the allowable range of silicone seal compression, used to confirm that the connector base 1 has formed an axial pre-tightened state that meets the sealing requirements, avoiding conductor alignment under insufficient or excessive compression of the silicone seal 2; the common locking backlash stripping operation in the chain is converted into reverse displacement of the PCB circuit board in the X direction, reverse displacement in the Y direction, and reverse rotation around the Z axis, and merged with the cumulative adjustment values ​​of each translation and rotation operation in the minimum locking error closed chain in the order of operation to generate rotation stop alignment tokens; in specific implementation, the X direction in the locking backlash rigid body transformation record is... The hysteresis displacement value, the Y-axis hysteresis displacement value, and the Z-axis hysteresis displacement value constitute the hysteresis displacement vector. The hysteresis angle value around the Z-axis is denoted as the hysteresis angle value, and a hysteresis rotation matrix around the Z-axis is constructed based on the hysteresis angle value. The transpose of the hysteresis rotation matrix around the Z-axis is used as the reverse rotation matrix. The reverse rotation matrix is ​​multiplied by the hysteresis displacement vector and then negative to generate the inverse transformation displacement vector. The X-axis component in the inverse transformation displacement vector is determined as the X-axis reverse displacement value of the PCB circuit board, and the Y-axis component is determined as the Y-axis reverse displacement value of the PCB circuit board. The negative hysteresis angle value is determined as the reverse rotation value of the PCB circuit board around the Z-axis. The Z-axis component in the inverse transformation displacement vector is not written into the rotation vector. The Z-axis hysteresis displacement value of the stop alignment token is only used for comparison with the axial hysteresis threshold. No Z-axis position compensation of the PCB circuit board is performed to avoid changing the actual silicone seal compression value and the axial locking state of the connector base 1. According to the arrangement order of the first broken migration edge in the minimum locking error closed chain, the X-axis translation value, Y-axis translation value, rotation value around the X-axis, rotation value around the Y-axis, and rotation value around the Z-axis of the PCB circuit board are accumulated in sequence. The reverse X-axis displacement value, reverse Y-axis displacement value, and reverse rotation value around the Z-axis of the PCB circuit board corresponding to the common locking hysteresis stripping operation are written into the position of the common locking hysteresis stripping operation to form the operation sequence in the rotation stop alignment token.The alignment token is written with the token number, minimum locking error closed chain number, second locking return record number, operation sequence number, operation type, operation direction, cumulative adjustment value, allowed pose range, and execution completion mark, so that the PCB board pose adjustment can be reproduced item by item according to the solution order of the minimum locking error closed chain; the connector base 1 is controlled to rotate into the mechanical stop position in the forward direction again and the driving force is released, and the actual locking return angle value, the actual locking return axial entry value, and the actual locking return end and base center coordinate values ​​of each conductor are collected; in specific implementation, the same rotation speed, fixed angle interval, and mechanical stop position judgment conditions as the second forward rotation are used to drive the connection. After the connector base 1 reaches the mechanical stop position, the rotational driving force is cut off. When the absolute value of the rotational angular velocity is not greater than the locking stability angular velocity threshold and the absolute value of the axial displacement rate is not greater than the locking stability axial rate threshold, and three consecutive sampling cycles are maintained, the actual locking regression angle value and the actual locking regression axial entry value are collected. Simultaneously, the binocular industrial camera is triggered to collect the end contour and base contour of each conductor, ellipse fitting is performed and the fitting center is transformed to the instrument end assembly coordinate system, generating the actual locking regression end center coordinate value and the actual locking regression base center coordinate value of each conductor, and the two center coordinate values ​​of the same conductor number are aggregated into the actual locking regression coordinate value. The actual silicone seal compression value is generated by the difference between the actual locking return axial entry value and the zero point of the axial entry value. The actual locking trajectory reproduction residual value is generated by the Euclidean distance between the actual locking return coordinate values ​​of each conductor and the locking return coordinate values ​​of the same conductor number in the second locking return record. In specific implementation, the end Euclidean distance between the actual locking return end center coordinate value and the second locking return end center coordinate value of the same conductor number, and the base Euclidean distance between the actual locking return base center coordinate value and the second locking return base center coordinate value are calculated respectively. The larger value between the end Euclidean distance and the base Euclidean distance is determined as the actual locking of the corresponding conductor 3. The trajectory reproduction residual value allows both the translational and tilt deviations of the conductor axis to be included in the reproduction verification. The trajectory reproduction threshold is set between 0.03 mm and 0.15 mm, determined by the coordinate measurement error of the binocular industrial camera, the radial net gap between the communication welding hole 10 and the conductor 3, and the discrete range of the locking coordinates in the repeated rotation test. When the actual locking regression angle value is within the closed interval formed by the first and second locking regression angle values, the actual silicone seal compression value is within the allowable range of silicone seal compression, and the actual locking trajectory reproduction residual value of each conductor 3 does not exceed the trajectory reproduction threshold, the position and angle of the PCB circuit board are adjusted according to the rotation alignment token.The judgment range for the actual locking return angle value is limited by the smaller of the first and second locking return angle values, with the larger value as the upper limit. The rotation angle value, actual locking return angle value, and verification return angle value are all continuously accumulated angle values. When the rotary encoder output value crosses 0 degrees, it is continuously expanded 360 degrees according to the screw-in direction of connector base 1 before performing a closed-range judgment. A micro-position adjustment stage with X-axis translation, Y-axis translation, rotation around the X-axis, rotation around the Y-axis, and rotation around the Z-axis is used to support the PCB circuit board 5, according to the rotation and alignment... The operation sequence number in the token is used to execute each cumulative adjustment value sequentially. After each operation is completed, the real-time pose value of the PCB board is collected and compared with the current operation target value. If the translation deviation does not exceed half of the corresponding minimum adjustment step size and the rotation deviation does not exceed half of the corresponding minimum rotation step size, the execution completion flag of the current operation is written. After all operations are marked as execution completion, the real-time pose value of the PCB board is determined as the adjusted PCB board pose, providing an actual assembly state consistent with the minimum locking error closed chain for subsequent layer-by-layer execution of conductor entry holes.

[0051] In this implementation scheme, the minimum locking error closed chain is transformed into an executable rotation and alignment token. The actual locking return angle value, the actual silicone seal compression value, and the actual locking trajectory reproduction residual value are used to verify the current locking state of the connector base 1. This ensures that the PCB board posture adjustment is based on a reproducible rotation and locking state and a stable sealing pre-tightening state. This avoids incorrect compensation caused by excessive locking backlash, abnormal silicone seal compression, and conductor coordinate drift. At the same time, it ensures that the displacement and rotation values ​​in the rotation and alignment token can be accurately executed, providing a reliable and consistent actual assembly benchmark for subsequent conductor layer-by-layer insertion, locking verification, and welding connection.

[0052] In this embodiment, an instrument-end connector with four conductors is used as the object. The four conductors are respectively connected to four communication soldering holes on a PCB circuit board. The PCB circuit board thickness is 2.4 mm, the conductor radius is 0.45 mm, and the communication soldering hole radius is 0.70 mm. The PCB circuit board is divided into nine insertion depth layers from the hole opening to the bottom. The control connector base 1 sequentially performs the first forward screw-in, the reverse retraction, and the second forward screw-in, generating the first forward rotation trajectory sequence, the retraction trajectory sequence, the second forward rotation trajectory sequence, two lock-in return records, and the lock-in return rigid body transformation record. Based on the communication soldering hole parameters, a four-hole-accommodating tube bundle is constructed, and the conductor accommodation margin value is calculated based on the second lock-in return record. Conductor D1 forms the first breakage trajectory anchor point at the seventh insertion depth layer, conductor D2 forms the first breakage trajectory anchor point at the eighth insertion depth layer, and conductors D3 and D4 do not form first breakage trajectory anchor points. Based on the first-break migration evidence frame, the minimum locking error closed chain is selected and a rotation stop alignment token is generated. After the rotation stop alignment token is executed, the minimum conductor capacity of the four conductors in all the depth layers of the hole is greater than zero, which satisfies the condition of executing conductor hole entry layer by layer.

[0053] like Figure 6 As shown, the three outer arc-shaped trajectories represent the first forward spiral trajectory sequence formed by the first forward screwing in of the connector base 1, the retraction trajectory sequence formed after reaching the mechanical stop position, and the second forward spiral trajectory sequence formed by the second forward screwing in. The star-shaped mark indicates the mechanical stop position identified based on the axial entry increment value and the rotational torque increment value. D1 to D4 represent the four conductors and the communication soldering holes matched according to the conductor hole connection definition, respectively. The four semi-transparent columnar areas represent the hole-accommodating tube bundle constructed with the center coordinate value of the communication soldering hole opening as the starting point and the PCB circuit board normal vector as the central axis. The dashed line represents the conductor trajectory corresponding to the second locking regression record. The conductor D1 first appears to have a conductor accommodation margin value of not greater than zero in the seventh insertion hole depth layer and the conductor D2 first appears to have a conductor accommodation margin value of not greater than zero in the eighth insertion hole depth layer. The blue cross mark indicates the corresponding first break trajectory anchor point; the conductors D3 and D4 do not form a first break trajectory anchor point in all insertion hole depth layers. The solid lines represent the conductor trajectories formed after adjusting the PCB board orientation according to the rotation positioning token. All four solid lines are located inside the corresponding hole positions to accommodate the tube bundle, indicating that the original first break state has been eliminated and all four conductors meet the layer-by-layer entry conditions within the range from the hole opening to the hole bottom.

[0054] Specifically, the steps for performing conductor insertion and locking verification layer by layer, generating a rotation lock closure record, and performing welding connections are as follows: Control the PCB circuit board 5 to descend layer by layer along the negative Z-axis of the instrument end assembly coordinate system according to the insertion depth layer. Collect the real-time pose value of the PCB circuit board at each insertion depth layer. Calculate the actual allowance value for each conductor based on the actual locking regression coordinate value, the conductor's central axis, and the real-time pose value of the PCB circuit board. In practice, the PCB circuit board 5, after completing the rotation lock alignment token execution, is fixed to a device with an X-axis translation axis, a Y-axis translation axis, a Z-axis lifting axis, and a rotation axis around the X-axis. The micro-pose adjustment stage, consisting of a moving axis, a rotation axis around the Y-axis, and a rotation axis around the Z-axis, uses a Z-axis lifting axis to drive the PCB circuit board 5 downwards in ascending order of the in-hole depth layer number. The descent distance for each step is based on a fixed depth interval between adjacent in-hole depth layers. The descent speed is between 0.2 mm / s and 0.8 mm / s, determined by the conductor's allowable bending load, the PCB circuit board thickness, and the braking distance of the Z-axis lifting axis. After reaching the current in-hole depth layer, the PCB circuit board 5 remains stationary for 100 to 300 milliseconds, provided that the Z-axis position change is no greater than 0.005 mm and the angular changes of all three rotation axes are no greater than 0.At 02 degrees, the feedback values ​​of each translation axis encoder and each rotation axis encoder are read to generate real-time pose values ​​for the PCB circuit board, including real-time displacement values ​​in the X, Y, and Z directions, as well as real-time rotation values ​​around the X, Y, and Z axes. The center coordinates of each communication welding hole opening and the PCB circuit board normal vector are updated according to the real-time pose values ​​of the PCB circuit board, and the center axis point of the hole-accommodating tube bundle is generated at the current insertion depth layer. The conductor center axis is updated according to the actual locking return end center coordinates and the actual locking return base center coordinates of the same conductor number. The intersection point of the conductor center axis and the plane at the current insertion depth layer is calculated, and the intersection point is determined as the center coordinate of the conductor cross-section. The value is then used to calculate the vertical distance between the center coordinates of the conductor cross-section and the center axis of the hole-accommodating tube bundle. The actual accommodation margin of the current conductor 3 is generated by subtracting the vertical distance from the cross-sectional radius of the hole-accommodating tube bundle. An actual accommodation margin greater than zero indicates that a radial gap is maintained between the outer circle of the conductor and the wall of the communication welding hole. An actual accommodation margin not greater than zero indicates that the outer circle of the conductor has reached the boundary of the hole wall and entered an interference risk state. The descent stops when any actual accommodation margin is not greater than zero. In specific implementation, the micro-pose adjustment stage cuts off the Z-direction descent command within 20 milliseconds and records the conductor number, communication welding hole number, current hole depth layer number, current real-time pose value of the PCB board, and minimum actual accommodation margin value not greater than zero. The PCB board 5 is retracted along the positive Z-axis of the instrument end assembly coordinate system to the nearest in-hole depth layer where all actual allowance values ​​are greater than zero. If an in-hole depth layer where all actual allowance values ​​are greater than zero has not been formed, the PCB board 5 is retracted to the starting position before entering the first in-hole depth layer. During the retraction process, the real-time displacement values ​​in the X and Y directions, the real-time rotation values ​​around the X-axis, the real-time rotation values ​​around the Y-axis, and the real-time rotation values ​​around the Z-axis remain unchanged. After the retraction is completed, an in-hole abnormality record is generated and written to the in-hole termination mark, prohibiting the execution of the next in-hole depth layer, lock-in verification, and welding connection, so that the conductor 3 exits the hole wall interference position before continuous extrusion occurs. As the PCB board 5 descends... When the actual allowance of all conductors 3 at each depth layer of the insertion hole is greater than zero, a locking retest torque value less than the reverse unlocking torque threshold is applied to the connector base 1. After reaching the locking retest torque value, the retest torque is released, and the inspection regression angle value of the connector base 1 and the inspection regression coordinate value of each conductor are re-acquired. In specific implementation, the reverse unlocking torque threshold is read from the torque test record of the connector base, and 40% to 70% of the reverse unlocking torque threshold is determined as the locking retest torque value. A rotary actuator with torque closed-loop control is used to apply the locking retest torque value along the reverse unlocking direction. The torque rise rate is 0.02 N·m / s to 0.08 N·m / s, and is kept at 0 after reaching the locking retest torque value.From 5 seconds to 2 seconds, the torque is reduced to zero; the locking retest, without triggering the reverse unlocking of the stop thread, applies the stop thread clearance, the elastic return of the silicone seal ring, and the pre-welding assembly load together to the connector base 1 to check whether the conductor alignment can be maintained after the PCB circuit board 5 is completed and the insertion hole is completed; after releasing the retest torque, when the absolute value of the connector base rotational angular velocity is not greater than the locking stable angular velocity threshold and is maintained for three consecutive sampling cycles, the rotary encoder angle value is read as the test regression angle value, and the center coordinate values ​​of the test regression end and the center coordinate values ​​of the test regression base of each conductor are collected simultaneously and collected into the test regression coordinate values ​​of each conductor according to the conductor number; The inspection allowance is calculated based on the inspection regression coordinate values, conductor center axis, and final PCB board orientation. Specifically, the conductor center axis under inspection is updated based on the inspection regression end center coordinate values ​​and inspection regression base center coordinate values ​​for the same conductor number. The conductor center axis under inspection is extended to all via depth layers. The vertical distance between the conductor cross-section center coordinate values ​​and the corresponding via-position accommodating tube center axis is calculated for each via depth layer. The inspection allowance is generated by subtracting the vertical distance from the via-position accommodating tube cross-sectional radius. The inspection regression angle values ​​must be within the closed interval formed by the two locking regression angle values, and all inspection allowance values ​​must be greater than [value missing]. At zero time, a lock-up closure record is generated, and the welding connection between conductor 3 and communication welding hole 10 is performed. The smaller of the two lock-up return angle values ​​is used as the lower limit of the inspection return angle, and the larger value is used as the upper limit of the inspection return angle, to confirm that the connector base 1 after the lock-up retest is still within the angle range covered by the two reproducible lock-up states. The lock-up closure record is written with the connector base number, mechanical stop position, actual lock-up return angle value, actual silicone seal compression value, PCB final pose value, minimum actual allowance value of all conductors 3, lock-up retest torque value, inspection return angle value, and minimum inspection allowance value of all conductors 3. A positioning fixture is used to maintain the final orientation of the PCB circuit board. Conductor numbers and communication soldering hole numbers are positioned one by one according to the conductor hole connection definition. Selective soldering equipment is used to perform the soldering connection. The soldering temperature is between 330°C and 380°C, and the heating duration for a single soldering position is between 1 and 3 seconds. The soldering temperature and heating duration are determined by the conductor material, solder melting temperature, PCB circuit board pad heat resistance time, and solder joint pull-out force test results. This ensures that the soldering connection, with the lock in the closed position, fixes the relative position of conductor 3 and communication soldering hole 10, reducing the risk of connector base 1 retraction and conductor misalignment caused by subsequent external plug mating loads.

[0055] In this implementation scheme, by incorporating layer-by-layer hole verification, locking re-verification, and welding connection into the same closure judgment process, the actual allowance value and the inspection allowance value can continuously reflect the safety status of conductor 3 in the hole before and after the assembly load changes. The final position value of the PCB circuit board and the locking result of the connector base 1 are recorded and solidified by the screw-locking closure, which reduces connection failures caused by conductor extrusion, hole wall interference, and post-welding retraction, and improves the alignment accuracy, welding stability, and long-term connection reliability of the instrument end conductor.

[0056] like Figure 2 As shown, the second aspect of the present invention provides an instrument end conductor alignment device based on rotation lock, comprising: a rotation trajectory acquisition module, a hole position accommodating first break module, a first break closure solution module, and a lock alignment execution module, wherein: the rotation trajectory acquisition module is used to acquire rotation assembly trajectory data of the first forward rotation, reverse retraction, and second forward rotation of the connector base 1, identify the mechanical stop position, and generate a first forward rotation trajectory sequence, a retraction trajectory sequence, a second forward rotation trajectory sequence, two lock alignment return records, and a lock alignment backlash rigid body transformation record; the hole position accommodating first break module is used to construct a hole position accommodating tube bundle based on the first forward rotation trajectory sequence. The system calculates the conductor capacity margin value using the backtrack sequence, the second positive rotation trajectory sequence, and the second lock-in regression record, generating the first break trajectory anchor point and the first break migration evidence frame. The first break closure solution module is used to determine the common lock-in backlash stripping operation and PCB board pose adjustment operation based on the first break migration evidence frame, generating the first break status node and the first break migration edge, and filtering the minimum lock-in error closed chain. The lock-in alignment execution module is used to generate a rotation stop alignment token based on the minimum lock-in error closed chain, verify the actual lock-in regression state and adjust the PCB board pose, execute conductor entry holes and lock-in verification layer by layer, generate a rotation stop lock-in closure record and execute welding connection.

[0057] In this implementation scheme, by connecting the screw-stop assembly trajectory data, hole position accommodating tube bundle, first break migration evidence frame, minimum locking error closed chain, and screw-stop alignment token into a verifiable conductor alignment closed loop, the connector base locking backlash, silicone seal ring return offset, and PCB board pose deviation can be uniformly identified and reduced before soldering. This avoids relying on manual trial insertion to judge the conductor insertion status and solidifies the final assembly result with the screw-stop locking closure record, thereby improving alignment consistency, soldering stability, assembly traceability, and long-term connection reliability under different conductor arrangements and interface structures.

[0058] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0059] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A method for aligning instrument end conductors based on a rotary locking position, characterized in that, Includes the following steps: S1, collect the rotation and assembly trajectory data of the first forward rotation, reverse retraction and the second forward rotation of the connector base (1), identify the mechanical stop position, and generate the first forward rotation trajectory sequence, the retraction trajectory sequence, the second forward rotation trajectory sequence, the two lock-in regression records and the lock-in backlash rigid body transformation record; S2, construct the hole position accommodating tube bundle, calculate the conductor accommodating margin value based on the first positive spiral trajectory sequence, the back trajectory sequence, the second positive spiral trajectory sequence and the second lock-in regression record, and generate the first break trajectory anchor point and the first break migration evidence frame; S3, based on the first break migration evidence frame, determine the common lock-in backlash stripping operation and PCB board pose adjustment operation, generate the first break state node and the first break migration edge, and filter the minimum lock-in error closed chain. S4 generates a rotation stop alignment token based on the minimum locking error closed chain, verifies the actual locking return state and adjusts the PCB board pose, performs conductor entry hole and locking verification layer by layer, generates a rotation stop locking closure record and performs soldering connection.

2. The instrument end conductor alignment method based on rotary locking according to claim 1, characterized in that: The specific steps for collecting the rotation and assembly trajectory data of the connector base during the first forward screwing-in, reverse retraction, and second forward screwing-in processes are as follows: The instrument housing end assembly coordinate system is established with the center of the end face of the outlet hole near the PCB circuit board (5) as the origin, the direction of the outlet hole center axis toward the PCB circuit board (5) as the positive direction of the Z axis, the radial direction of the starting end of the stop thread as the positive direction of the X axis, and the positive direction of the Y axis determined according to the right-hand coordinate rule. The conductor number, communication welding hole number, conductor radius value, communication welding hole radius value, PCB circuit board thickness value, conductor hole connection definition and silicone sealing ring compression allowable range are read. Insert the connector base (1) with silicone sealing ring (2) and conductor (3) installed into the outlet hole of the instrument housing. Take the axial position when the silicone sealing ring (2) contacts the sealing bearing surface as the zero point of axial entry. Control the connector base (1) to be screwed in in the positive direction for the first time. Collect the rotation angle value, rotation torque value, conductor end center coordinate value and conductor base center coordinate value at fixed angle intervals to generate rotation stop assembly trajectory data.

3. The instrument end conductor alignment method based on rotary locking according to claim 2, characterized in that: The specific steps for identifying the mechanical stop position and generating the first positive rotation trajectory sequence, the return trajectory sequence, the second positive rotation trajectory sequence, two lock-up regression records, and the lock-up backlash rigid body transformation record are as follows: Calculate the axial entry increment and rotational torque increment of adjacent sampling positions. The first position where the axial entry increment is not greater than the stop axial increment threshold and the rotational torque increment is not less than the stop torque increment threshold is determined as the mechanical stop position. After the driving force is released, the first locking return angle value, the first locking return axial entry value and the first locking return coordinate value of each conductor are collected. Then, the connector base (1) is controlled to retract in the reverse direction and rotate into the mechanical stop position for the second time in the forward direction. After the driving force is released, the second locking return angle value, the second locking return axial entry value and the second locking return coordinate value of each conductor are collected. The first forward rotation trajectory sequence, the retraction trajectory sequence, the second forward rotation trajectory sequence, the first locking return record and the second locking return record are generated. The two locking return axial entry values ​​are used as the corresponding silicone seal compression values. Pair the sampling records in the first positive spiral trajectory sequence with the back trajectory sequence whose rotation angle difference does not exceed the angle matching threshold, perform least squares rigid body registration on all conductor coordinates in the two sets of sampling records, and generate a locked back rigid body transformation record. The locked back rigid body transformation record includes the X-axis back displacement value, the Y-axis back displacement value, the Z-axis back displacement value, and the back displacement angle value around the Z-axis.

4. The instrument end conductor alignment method based on rotary locking according to claim 3, characterized in that: The specific steps for constructing the aperture-accommodating tube bundle are as follows: Collect the PCB circuit board positioning reference coordinate values, the center coordinate values ​​of each communication welding hole position, and the PCB circuit board normal vector pointing from the hole position to the bottom of the hole, and convert the center coordinate values ​​of each communication welding hole position to the instrument end assembly coordinate system; Starting from the center coordinates of the communication welding hole, with the PCB circuit board normal vector as the central axis direction, the PCB circuit board thickness as the axial length, and the difference between the communication welding hole radius value and the corresponding conductor radius value as the cross-sectional radius, construct the hole-accommodating tube bundle corresponding to each communication welding hole (10); when the communication welding hole radius value is not greater than the corresponding conductor radius value, stop the assembly.

5. The instrument end conductor alignment method based on rotary locking according to claim 4, characterized in that: The specific steps for calculating the conductor's capacity margin value and generating the first fracture trajectory anchor point and the first fracture migration evidence frame based on the first positive spiral trajectory sequence, the backtracking trajectory sequence, the second positive spiral trajectory sequence, and the second lock-in regression record are as follows: The PCB circuit board (5) is divided into multiple in-hole depth layers according to a fixed depth interval from the hole opening to the hole bottom; for each connector base rotation angle value and the second lock position regression record in the three trajectory sequences, the conductor center axis is generated according to the conductor end center coordinate value and the conductor base center coordinate value, and the conductor center axis is extended to each in-hole depth layer to generate the conductor cross section center coordinate value; For each conductor number, based on the rotation angle values ​​of each connector base in the three trajectory sequences and the second locking regression record, the vertical distance between the center coordinate value of the conductor cross section of each hole depth layer and the center axis of the corresponding hole position accommodating tube bundle is calculated. The vertical distance value is subtracted from the cross section radius of the hole position accommodating tube bundle to generate the conductor accommodating margin value. The conductor accommodating margin value is read from small to large according to the hole depth layer number. The hole depth layer where the conductor accommodating margin value is not greater than zero for the first time is determined as the first break trajectory anchor point. For the same conductor number and the same connector base rotation angle value, the first breakage entry hole depth layer number corresponding to the first positive rotation trajectory sequence, the backtracking trajectory sequence and the second positive rotation trajectory sequence are read respectively. When no first breakage trajectory anchor point is generated, the first breakage entry hole depth layer number is recorded as the total number of entry hole depth layers plus one. The difference between the first positive rotation first breakage entry hole depth layer number and the backtracking first breakage entry hole depth layer number is calculated to generate the backtracking first breakage migration value. The difference between the first positive rotation first breakage entry hole depth layer number and the second positive rotation first breakage entry hole depth layer number is calculated to generate the re-rotation first breakage re-display value and write it into the first breakage migration evidence frame.

6. The instrument end conductor alignment method based on rotary locking according to claim 5, characterized in that: The specific steps for generating the first break state node and the first break migration edge based on the first break migration evidence frame to determine the common locking backlash stripping operation and the PCB circuit board pose adjustment operation are as follows: Read the allowable displacement range in the X direction, allowable displacement range in the Y direction, allowable rotation range around the X axis, allowable rotation range around the Y axis, allowable rotation range around the Z axis and corresponding minimum adjustment step size from the PCB assembly parameter table; when the retreat first break migration values ​​of at least two conductors (3) forming the first break trajectory anchor point have the same sign and the absolute value of the re-rotation first break re-display value does not exceed the first break re-display threshold, add a common locking back-drop operation; Calculate the offset vector from the center axis of the hole-accommodating tube bundle in the depth layer of each first break trajectory anchor point to the center of the conductor cross section. When the X-axis component, Y-axis component, or tangential component relative to the center of the communication welding hole array of each offset vector has the same sign, add X-axis translation, Y-axis translation, or rotation around the Z-axis of the PCB circuit board respectively. The depth layer numbers of the first break are sorted in ascending order according to the X-coordinate value and Y-coordinate value of the communication welding hole. When the absolute value of the difference between adjacent numbers is not greater than 1, it is treated as zero. When all differences after processing are not less than zero or not greater than zero, and at least one difference is not zero, add rotation around the Y-axis and rotation around the X-axis of the PCB circuit board respectively. The initial first break state node is generated by the first break trajectory anchor point in the second lock-back return state. The number of first break trajectory anchor points, the minimum first break entry hole depth layer number, and the minimum conductor capacity margin of all conductors (3) in all entry hole depth layers are recorded. For the common lock-back backstripping operation that has been added, the coordinates of all conductors are corrected according to the inverse transformation recorded by the lock-back back rigid body transformation. The translation and rotation operations of the PCB circuit board are increased by a minimum adjustment step each time. The first break trajectory anchor point and the minimum conductor capacity margin are recalculated to generate adjacent first break state nodes. When the number of anchor points for the first break trajectory of the subsequent first break state node decreases, or the number is the same and the minimum first break entry hole depth layer number increases, or the number and the minimum first break entry hole depth layer number are the same and the minimum conductor capacity margin value increases, a first break migration edge is generated.

7. The instrument end conductor alignment method based on rotary locking according to claim 6, characterized in that: The specific steps for selecting the closed chain with the minimum locking error are as follows: The first fault state node is expanded step by step along the migration edge of the first fault, and the first fault state node with zero anchor points of the first fault trajectory is determined as the first fault closed state node. If the first break closure state node is not formed, stop the PCB board through-hole operation; if the first break closure state node is formed, extract candidate locking error closed chains from the initial first break state node to each first break closure state node, sort them in ascending order by the number of adjustment operation types, ascending order by the total number of steps, and descending order by the minimum conductor capacity margin value of the final first break closure state node, and determine the candidate locking error closed chain at the top of the sorted list as the minimum locking error closed chain.

8. The instrument end conductor alignment method based on rotary locking according to claim 7, characterized in that: The specific steps for generating a rotation stop token based on the minimum locking error closed chain, verifying the actual locking regression state, and adjusting the PCB circuit board pose are as follows: When the absolute value of the Z-axis hysteresis displacement in the lock-in hysteresis rigid body transformation record does not exceed the axial hysteresis threshold, and the compression value of the silicone seal ring during the second lock-in regression is within the allowable range of silicone seal ring compression, the minimum lock-in error closed chain is read; the common lock-in hysteresis stripping operation in the chain is converted into reverse displacement of the PCB circuit board in the X-axis, reverse displacement in the Y-axis, and reverse rotation around the Z-axis, and merged with the cumulative adjustment values ​​of each translation and rotation operation in the minimum lock-in error closed chain in the order of operation to generate a rotation stop alignment token; Control the connector base (1) to screw into the mechanical stop position again and release the driving force. Collect the actual locking return angle value, the actual locking return axial entry value, and the coordinate values ​​of the actual locking return end and base center of each conductor. Generate the actual silicone seal compression value by the difference between the actual locking return axial entry value and the zero point of the axial entry. Generate the actual locking trajectory reproduction residual value by the Euclidean distance between the actual locking return coordinate values ​​of each conductor and the locking return coordinate values ​​of the same conductor number in the second locking return record. When the actual locking return angle value is within the closed interval formed by the first locking return angle value and the second locking return angle value, the actual silicone seal compression value is within the allowable range of silicone seal compression, and the actual locking trajectory reproduction residual value of each conductor does not exceed the trajectory reproduction threshold, adjust the position and angle of the PCB circuit board according to the rotation stop alignment token.

9. The instrument end conductor alignment method based on rotary locking according to claim 8, characterized in that: The specific steps for performing layer-by-layer conductor entry hole and locking position verification, generating a rotation lock position closure record, and performing welding connection are as follows: The control PCB circuit board (5) descends layer by layer along the negative direction of the Z-axis of the instrument end assembly coordinate system according to the hole depth layer. The real-time pose value of the PCB circuit board is collected at each hole depth layer. The actual accommodation margin value of each conductor is calculated based on the actual locking regression coordinate value of each conductor, the conductor center axis and the real-time pose value of the PCB circuit board. The descent stops when any actual capacity margin value is not greater than zero. When the PCB circuit board (5) descends to the bottom of the hole and all conductors (3) have a greater than zero actual capacity in each hole depth layer, apply a locking retest torque value less than the reverse unlocking torque threshold to the connector base (1). After the locking retest torque value is reached, release the retest torque and re-collect the connector base inspection regression angle value and the inspection regression coordinate value of each conductor. The inspection allowance value is calculated based on the inspection regression coordinate value, the conductor center axis and the final pose value of the PCB circuit board. When the inspection regression angle value is within the closed interval formed by the two locking regression angle values ​​and each inspection allowance value is greater than zero, a rotation lock closure record is generated and the welding connection between the conductor (3) and the communication welding hole (10) is performed.

10. An instrument end conductor alignment device based on a rotary locking position, characterized in that, include: The system includes a rotation trajectory acquisition module, a hole position accommodating first break module, a first break closure solution module, and a locking and alignment execution module, among which: The rotation trajectory acquisition module is used to acquire the rotation assembly trajectory data of the connector base (1) during the first forward rotation, reverse retraction and the second forward rotation process, identify the mechanical stop position, and generate the first forward rotation trajectory sequence, the retraction trajectory sequence, the second forward rotation trajectory sequence, the two lock-in regression records and the lock-in backlash rigid body transformation record. The hole position accommodating first break module is used to construct a hole position accommodating tube bundle, calculate the conductor accommodating margin value based on the first positive spiral trajectory sequence, the back trajectory sequence, the second positive spiral trajectory sequence and the second lock-in regression record, and generate the first break trajectory anchor point and the first break migration evidence frame. The first break closure solution module is used to determine the common locking back peeling operation and PCB circuit board pose adjustment operation based on the first break migration evidence frame, generate the first break state node and the first break migration edge, and filter the minimum locking error closed chain. The locking and alignment execution module is used to generate a rotation stop alignment token based on the minimum locking error closed chain, verify the actual locking return state and adjust the PCB circuit board posture, perform conductor entry hole and locking verification layer by layer, generate a rotation stop locking closure record and perform welding connection.

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