Manufacturing method of novel integrated intelligent vehicle lamp rigid-flex combined board and rigid-flex combined board

Abstract

The application discloses a kind of novel integrated wisdom car light rigid-flex combination plate manufacturing method, by design and manufacture form split rigid plate and flexible plate, first connecting area and second connecting area are respectively set, through adhesive adhesion combined tin paste welding composite connection mode form rigid-flex combination plate, realize rigid plate and flexible plate independent processing and split assembly;Not only reduce overall design and processing difficulty, rigid plate or flexible plate can also be disassembled, repaired and replaced, by setting rigid plate positioning hole and flexible plate positioning hole, and according to the higher rigid plate positioning hole as reference data to make flexible plate positioning hole, form the unified positioning system with rigid plate positioning hole as core, realize rigid plate and flexible plate accurate alignment, solve the core problem of rigid-flex combination plate expansion difference, finally realize the rigid-flex combination plate manufacturing of adaptation wisdom car light high requirement.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing, and in particular to a method for manufacturing a novel integrated intelligent vehicle light rigid-flex board and a rigid-flex board. Background Technology

[0002] With the development of intelligent connected vehicle technology, the interactive functions of automotive lights are constantly being upgraded, and the degree of integration and high integration of supporting integrated circuit or chip functions are constantly improving. This places more stringent and complex requirements on circuit board products used in automotive lighting systems, especially automotive lighting systems composed of LED light groups. Traditional circuit boards are limited by their own structural characteristics and are difficult to adapt to the complex non-planar shape of automotive lights. At the same time, they cannot meet the high integration and high density assembly requirements of LED beads, integrated circuits and other components in a limited space.

[0003] Therefore, rigid-flex boards combine the structural support of rigid boards with the flexible bending characteristics of flexible boards, making them an ideal solution for solving the application challenges of smart automotive lighting circuit boards.

[0004] However, there are still many pain points in the manufacturing and application of traditional rigid-flex PCBs. Traditional rigid-flex PCBs adopt an integrated manufacturing method of directly stacking and pressing rigid and flexible boards. Not only are the compatibility requirements of the two extremely high during the processing, but the material matching difference between the layers is also prone to occur because the flexible core board layer is integrated into the rigid board stack structure, which directly affects the expansion and contraction stability of the board.

[0005] Furthermore, in assembly requiring high integration, the flexible board in the traditional structure only serves as a functional component for bending and flexing, making it difficult to form an independent assembly function. This leads to the need to design the rigid-flexible board as a multi-unit structure where multiple areas of the flexible board are connected to multiple areas of the rigid board, which significantly increases the design and manufacturing difficulty of the product. Moreover, in the integrated structure formed by pressing the rigid and flexible boards together, it is impossible to disassemble, repair, or replace the flexible or rigid board separately when local damage occurs. Only the entire circuit board module can be replaced, which significantly increases the cost of use and maintenance.

[0006] Based on the above background and problems, there is a need to provide a novel manufacturing method for a new type of integrated intelligent vehicle lighting rigid-flex plate and the rigid-flex plate itself. Summary of the Invention

[0007] This invention aims to solve the comprehensive problems of high processing difficulty and poor assemblability of existing intelligent vehicle headlight rigid-flex bonding plates, and provides a novel integrated intelligent vehicle headlight rigid-flex bonding plate manufacturing method and rigid-flex bonding plate. The rigid-flex bonding plate is processed according to design data, and the manufacturing method includes the following steps: S10: A rigid core board is manufactured according to the design data. A first connection area is designed on the edge region of one side of the rigid core board, and a rigid board positioning hole is provided on the edge region of the first connection area. A solder resist layer is formed on the surface of the rigid core board. A solder resist window is formed on the solder resist layer corresponding to the position of the first connection area to form a solder resist window pattern. Then, an adhesive layer is formed on the first connection area. An opening is formed on the adhesive layer corresponding to the solder resist window pattern to form an adhesive layer window pattern. The whole board is formed into a rigid board. S20: A flexible board is fabricated according to the design data, and a second connection area is designed on one edge of the flexible board; then the rigid board is baked, and then the size and position data of the positioning holes of the rigid board are measured. Based on the data, the flexible board positioning holes are made, and then the flexible board is positioned according to the positioning holes. Then the circuit pattern of the flexible board is made, and the circuit pattern includes a second pad pattern; a window is made on the cover film corresponding to the position of the second pad pattern to form a windowed cover film, and then the windowed cover film is attached to the surface of the flexible board to form a cover flexible board. S30: The first connecting area of ​​the rigid plate and the second connecting area of ​​the flexible covering plate are aligned and stacked, pressed together, and then solder paste is printed onto the opening position of the opening covering film and reflow soldered to form the rigid-flex board; wherein, the positioning hole of the rigid plate corresponds to the positioning hole of the flexible plate.

[0008] Furthermore, the first connection area is provided with a plurality of first pad patterns, the first pad patterns corresponding to the solder mask opening patterns; forming the opening cover film includes opening windows corresponding to the positions of the first pad patterns.

[0009] Furthermore, the rigid plate has at least three positioning holes, and the three or more positioning holes are arranged in a non-linear manner.

[0010] Furthermore, the baking process involves baking the rigid plate at a temperature of 160°C to 185°C for 1.5 to 2.5 hours.

[0011] Furthermore, the fabrication of the flexible cover board includes: taking a single-sided flexible copper-clad laminate with a copper layer and an insulating dielectric layer, baking the laminate to create the circuit pattern, forming the second pad pattern, and forming the entire board into a flexible core board; then, creating a plurality of through slots in the insulating dielectric layer of the flexible core board, each through slot corresponding to one of the first pad patterns; then taking a cover film, creating windows corresponding to the second pad pattern and the through slots, and then attaching it to the surface of the flexible core board, forming the entire board into the flexible cover board.

[0012] Furthermore, the size of the through slot is larger on one side than the size of the first pad pattern.

[0013] Furthermore, forming the window cover film includes taking a cover film and two release films, laying the cover film between the two release films, hot pressing, then removing it, and then performing subsequent processes to form the window cover film.

[0014] Furthermore, the baking plate is baked at a temperature of 160°C to 185°C for 1.5 to 2.5 hours.

[0015] Furthermore, forming the rigid-flexible bond plate includes fabricating an auxiliary mold for pressing, the auxiliary mold including a flexible plate placement area, a rigid plate placement area, and a rigid-flexible bond placement area; fabricating a bottom cover plate and a top cover plate according to the design data; the bottom cover plate having a fixing groove matching the size of the rigid plate; the bottom cover plate being provided with positioning pins; and the top cover plate being provided with pin holes corresponding to the positioning pins. The pressing is as follows: The rigid plate is placed in the fixing groove and positioned by the positioning pins of the rigid plate. Then, the cover flexible plate is stacked in the flexible plate placement area, and the top cover plate is stacked accordingly. The bottom cover plate and the top cover plate are fixed by the positioning pins and the pin holes, and then the pressing is performed.

[0016] The present invention also provides a rigid-flexible bonding plate, which is manufactured using the above-described manufacturing method.

[0017] The main beneficial effects of this technical solution include the following: (1) By designing and manufacturing a split rigid plate and a flexible plate, setting a first connection area and a second connection area, and forming a rigid-flex plate by adhesive layer adhesion combined with solder paste welding, the independent processing and separate assembly of the rigid plate and the flexible plate are realized. This not only reduces the overall design and processing difficulty, but also solves the problem of needing to replace the whole structure when the local damage is damaged. The rigid plate or the flexible plate can be disassembled, repaired and replaced separately, which greatly reduces the production and later maintenance costs. (2) By setting up rigid plate positioning holes and flexible plate positioning holes, and using the rigid plate positioning holes with smaller expansion and contraction as the reference data to make flexible plate positioning holes, a unified positioning system with rigid plate positioning holes as the core is formed. The rigid plate positioning holes adopt a non-linear arrangement design of no less than 3, which can achieve precise alignment between the rigid plate and the flexible plate, effectively avoid problems such as pad misalignment and insufficient component assembly accuracy. At the same time, the expansion and contraction data of the rigid-flexible bonded plate can be accurately measured through this positioning system, which is convenient to adjust the processing parameters in time, control the expansion and contraction accuracy of the rigid plate within 1 / 10,000 and the expansion and contraction accuracy of the flexible plate within 4 / 10,000, and achieve precise matching of expansion and contraction between the two, thereby improving the overall processing accuracy. (3) The rigid-flex plate is pressed by a mold. The mold is set with matching rigid plate, flexible plate and rigid-flex plate placement area. With the precise fixing structure of positioning pin and pin hole, the rigid plate and flexible plate can be positioned and pressed in a standardized and regulated manner, avoiding the alignment deviation caused by manual operation and ensuring the pressing accuracy. At the same time, the pressing adopts the local heating pressing method, only the rigid-flex plate is heated and pressed, and the other areas are not affected by high temperature. This minimizes the interference of heat on the expansion and contraction of the plate, especially avoiding the additional expansion and contraction of the flexible plate due to overall heating, further ensuring the dimensional stability and matching accuracy of the rigid-flex plate. In addition, the use of auxiliary mold also improves the standardization and production efficiency of the pressing operation.

[0018] (4) The various technical features work together. The structural design of the split rigid board and flexible board lays the foundation for subsequent precise matching. The benchmark setting of the positioning holes of the rigid board, combined with the customized processing of the flexible board according to the actual measurement data of the rigid board, solves the core problem of the expansion and contraction difference of the rigid-flex board. The pre-pressing treatment of the cover film makes up for the potential shortcomings of the split structure in assembly accuracy, and further improves the accuracy of pad docking and circuit forming. The customized auxiliary mold is deeply matched with the positioning hole system. The standardized alignment of the rigid-flex connection area is achieved by pin positioning. Combined with the local heating pressing method, the mold is used to ensure the physical accuracy of pressing, and the local heating reduces the interference of heat on the expansion and contraction of the board. Finally, the connection method of adhesive layer adhesion and solder paste welding is used to finally realize the production of rigid-flex board that meets the high requirements of smart car lights. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 This is a process flow diagram of an embodiment of the present invention; Figure 2 This is a plan view of the rigid plate according to an embodiment of the present invention; Figure 3 for Figure 2 Schematic diagram of AA section; Figure 4 This is a plan view of the flexible plate according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the BB cross-section according to an embodiment of the present invention; Figure 6 This is a plan view of the flexible cover plate according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the CC cross section of an embodiment of the present invention; Figure 8 This is a plan view of the stacked structure according to an embodiment of the present invention; Figure 9 This is a schematic diagram of a cross-section (DD) of the first connection area in an embodiment of the present invention, where no solder resist window pattern has been fabricated. Figure 10 A schematic cross-sectional view of D'-D', which has a solder resist window pattern, for the first connection area of ​​an embodiment of the present invention; Figure 11 This is a plan view of a pressing process using a mold according to an embodiment of the present invention; Figure 12 This is a side view of a pressing process using a mold according to an embodiment of the present invention; Figure 13 This is a side view of the rigid-flexible plate according to an embodiment of the present invention; Figure 14 This is a physical image of the rigid plate according to an embodiment of the present invention; Figure 15 This is a physical image of the flexible plate according to an embodiment of the present invention; Figure 16 This is a partial physical diagram of the rigid-flexible bonding position of the rigid-flexible bonding plate according to an embodiment of the present invention.

[0021] Reference numerals: 10, Rigid plate; 1010, First connection area; 1020, Rigid plate positioning hole; 1030, Solder mask layer; 1040, Solder mask window pattern; 1050, Adhesive layer; 1060, Inner substrate; 1070, Bottom surface wiring; 1080, Bottom surface solder mask layer; 1090, First pad pattern; 20, Flexible plate; 2010, Second connection area; 2020, Flexible plate positioning hole; 2030, Second pad pattern; 2040, Flexible plate substrate; 2050... Through slot; 2060, window cover film; 2070, circuit pattern; 30, flexible cover board; 40, stacked structure; 4010, solder paste; 50, mold; 5010, bottom cover plate; 5020, fixing slot; 5030, flexible board positioning pin; 5040, rigid board positioning pin; 5050, rigid-flex bonding area positioning pin; 5060, top cover plate; 5070, top heating module; 5080, bottom heating module; 5090, pin hole; 60, rigid-flex bonding board.

[0022] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0024] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0025] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0027] To better understand the above technical solution, the following detailed explanation is provided in conjunction with the accompanying drawings.

[0028] Please see Figure 1 , Figure 1 This is a process flow diagram of an embodiment of the present invention.

[0029] A novel method for manufacturing a rigid-flexible integrated plate for intelligent vehicle lights, employing... Figure 1 The manufacturing process involves processing the rigid-flexible plate according to design data, and the manufacturing method includes the following steps: Please see Figure 2 and Figure 3 , Figure 2 This is a plan view of the rigid plate according to an embodiment of the present invention; Figure 3 for Figure 2 A schematic diagram of the AA section.

[0030] Step S10: A rigid core board is fabricated according to the design data. A first connection area 1010 is designed on the edge area of ​​one side of the rigid core board. A rigid plate positioning hole 1020 is provided on the edge area of ​​the first connection area 1010. A solder resist layer 1030 is fabricated on the surface of the rigid core board. A solder resist window is fabricated on the solder resist layer 1030 corresponding to the position of the first connection area 1010, forming a solder resist window pattern 1040. Then, an adhesive layer 1050 is fabricated on the first connection area 1010. An opening is fabricated on the adhesive layer 1050 corresponding to the solder resist window pattern 1040, forming an adhesive layer window pattern. The whole board forms a rigid board 10 (including an inner substrate 1060, a bottom circuit 1070, and a bottom solder resist layer 1080).

[0031] A dedicated first connection area 1010 is designed on the edge of the rigid core plate, and a rigid plate positioning hole 1020 is provided. This not only defines a fixed connection area for the subsequent precise docking with the cover flexible plate 30, but also uses the rigid plate positioning hole 1020 as the core benchmark for the entire rigid-flexible plate processing. This provides a unified positioning reference for the subsequent processing of the cover flexible plate 30 and the precise alignment of the rigid plate 10, thus controlling the overall precision from the source of processing.

[0032] Optionally, the adhesive layer 1050 can be made of epoxy resin or acrylic resin.

[0033] Optionally, the thickness of the adhesive layer 1050 is 5 μm to 30 μm, preferably 10 μm or 20 μm.

[0034] Optionally, the adhesive layer 1050 can be flexibly manufactured using either bonding or screen printing processes to suit different production needs and processing scenarios: When using the bonding process, the adhesive material is first cut to fit the size of the first connection area 1010, and then the corresponding solder resist window pattern 1040 is opened. The adhesive is then aligned and bonded to the preset position of the first connection area 1010. When using the screen printing process, a matching screen printing dot screen is first made according to the adhesive layer window pattern. The dots on the screen correspond to the positions of the adhesive layer windows. Then, water-based adhesive is used as the adhesive material, and the water-based adhesive is precisely screen-printed onto the first connection area 1010 of the rigid plate 10 using the screen printing dot screen. After baking and curing, the adhesive layer 1050 is finally formed. Both manufacturing methods can ensure the precise correspondence between the adhesive layer windows and the solder resist windows, ensuring that the adhesive layer 1050 adheres only to non-conductive areas.

[0035] Furthermore, the first connection area 1010 is fabricated with a plurality of first pad patterns 1090, the first pad patterns 1090 corresponding to solder mask opening patterns 1040; forming the opening cover film 2060 includes opening windows at positions corresponding to the first pad patterns 1090.

[0036] A solder resist layer 1030 is fabricated on the surface of the rigid core board, and a solder resist window 1040 is opened in the first connection area 1010 to form a solder resist window pattern 1040. This can accurately expose the conductive area of ​​the connection area, which can not only avoid the non-connection area lines being mis-soldered or short-circuited, but also define a clear range for the subsequent adhesive layer 1050 fabrication and pad docking, thereby improving the insulation protection and processing accuracy of the connection area lines.

[0037] Furthermore, the number of rigid plate positioning holes 1020 is greater than or equal to 3, and the three or more rigid plate positioning holes 1020 are arranged in a non-linear manner.

[0038] The use of numerous rigid plate positioning holes 1020 enables the construction of multi-point positioning references, significantly improving the stability and accuracy of positioning, thereby enhancing the machining accuracy of the rigid plate 10 itself and its subsequent alignment with the covering flexible plate 30. Furthermore, the non-linear arrangement of the multiple rigid plate positioning holes 1020 effectively avoids the problem of misleading expansion and contraction caused by all rigid plate positioning holes 1020 expanding and contracting in the same direction when the X and Y axis expansion and contraction areas are consistent. In addition, the multiple rigid plate positioning holes 1020 can also play a role in preventing misalignment, avoiding directional misalignment between the rigid plate 10 and the covering flexible plate 30 during subsequent stacking and pressing, providing reliable positioning assurance for the overall high-precision machining of the rigid-flexible bonded plate 60.

[0039] It is worth noting that the rigid plate 10 structure formed in step S10 can be made into a single-sided, double-sided, or multi-layer board according to actual needs, adapting to different circuit integration requirements of smart vehicle light circuit boards, and greatly improving the adaptability and versatility of the product.

[0040] Please see Figure 4 , Figure 5 , Figure 6 and Figure 7 , Figure 4 This is a plan view of the flexible plate according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the BB cross-section according to an embodiment of the present invention; Figure 6 This is a plan view of the flexible cover plate according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the CC cross section of an embodiment of the present invention.

[0041] Step S20: A flexible board 20 (including a flexible board substrate 2040) is fabricated according to the design data. A second connection area 2010 is designed on one edge of the flexible board 20. The rigid board 10 is then baked. The size and position of the positioning holes 1020 of the rigid board are measured. Based on the data, the flexible board positioning holes 2020 are fabricated on the flexible board 20. The flexible board positioning holes 2020 are then positioned. The circuit pattern 2070 of the flexible board 20 is then fabricated. The circuit pattern includes a second pad pattern 2030. A window is made in the cover film corresponding to the position of the second pad pattern 2030 to form a windowed cover film 2060. The windowed cover film 2060 is then attached to the surface of the flexible board 20 to form a cover flexible board 30.

[0042] By first baking the rigid plate 10 at high temperature and then measuring the data of the positioning hole 1020 of the rigid plate, the internal stress and moisture generated during the processing of the rigid plate 10 are effectively eliminated, ensuring the authenticity and stability of the measured data of the positioning hole 1020 of the rigid plate. This provides an accurate and reliable benchmark for the production of the positioning hole 2020 of the flexible plate, and avoids positioning deviations caused by the expansion and contraction of the rigid plate 10 itself.

[0043] Then, based on the measured data of the rigid plate positioning hole 1020, the flexible plate positioning hole 2020 is made to achieve a precise match between the positioning system of the cover flexible plate 30 and the rigid plate 10. This ensures that the processing accuracy of the cover flexible plate 30 is completely consistent with the actual size of the rigid plate 10, and controls the expansion and contraction accuracy of the cover flexible plate 30 to within 0.04%, which is highly compatible with the expansion and contraction accuracy of the rigid plate to within 1 / 100,000. This fundamentally avoids problems such as pad pattern misalignment and insufficient component assembly accuracy.

[0044] Finally, the cover film is precisely opened and aligned with the second pad pattern 2030. This not only provides insulation protection and structural reinforcement for the circuit pattern 2070, but also ensures that the second pad pattern 2030 is fully exposed, reserving a complete and clear soldering area for subsequent solder paste 4010 soldering. This avoids the cover film obscuring the second pad pattern 2030 and affecting the soldering effect, laying a high-precision structural foundation for the subsequent rigid-flex bonding pressing and soldering processes.

[0045] Optionally, the dimensions of the positioning hole 1020 in the rigid plate can be measured using a 2D or 3D measuring machine.

[0046] Optionally, baking is performed by baking the rigid plate 10 at a temperature of 160°C to 185°C for 1.5 to 2.5 hours.

[0047] Optionally, the fabrication of the flexible cover board 30 includes: taking a single-sided flexible copper-clad laminate with a copper layer and an insulating dielectric layer, baking the laminate to create a circuit pattern 2070, forming a second pad pattern 2030, and forming a flexible core board from the whole board; then creating a number of through slots 2050 on the insulating dielectric layer of the flexible core board, each through slot corresponding to a first pad pattern 1090; then taking a cover film, creating openings corresponding to the second pad pattern 2030 and the through slots 2050, and then attaching it to the surface of the flexible core board, forming the flexible cover board 30 from the whole board.

[0048] Furthermore, the size of the through slot 2050 is larger on one side than the size of the first pad pattern 1090, preferably by 10μm to 20μm on one side.

[0049] When there is a slight misalignment between the rigid board 10 and the cover flexible board 30 during their alignment and stacking, a tolerance space is reserved for the docking of the first pad pattern 1090 and the second pad pattern 2030. This effectively avoids the problem of insufficient overlap area of ​​the pads due to misalignment, ensures the effective welding area of ​​the first pad pattern 1090 and the second pad pattern 2030 on the rigid board, ensures the electrical conductivity stability of the rigid-flex connection, and also reduces the high requirements for precise alignment in subsequent solder paste 4010 printing and reflow soldering processes, thereby improving the overall processing yield.

[0050] Furthermore, forming the window cover film 2060 includes taking a cover film and two release films, laying the cover film between the two release films, hot pressing, then taking it out, and then performing subsequent processes to form the window cover film 2060.

[0051] Because the cover film has its own adhesive layer (usually an acrylic adhesive layer), and the fluidity of this adhesive layer has a significant impact on the expansion and contraction of the flexible board, the cover film is first sandwiched between two release films and hot-pressed. This effectively reduces the fluidity of the adhesive layer 1050 without damaging the original performance of the cover film. When the cover film is subsequently processed to open windows and pressed with the flexible board, the amount of adhesive overflow in the windowed area of ​​the cover film can be precisely controlled, keeping the amount of adhesive overflow within the range of ≤0.15mm. This avoids the adhesive overflow from obscuring the solder pads and affecting the conductivity of the subsequent solder paste 4010 soldering, and also prevents the adhesive overflow from spilling onto the circuit pattern 2070 and causing a short circuit. At the same time, it also reduces the interference of uneven flow of the cover film adhesive layer on the expansion and contraction accuracy of the cover flexible board 30, ensuring the dimensional stability and processing accuracy of the cover flexible board 30.

[0052] Specifically, the pressing process parameters are: temperature 160℃-180℃, pressure 50kgf / cm²-100kgf / cm², and time 30 to 100 seconds.

[0053] Furthermore, the baking plate is baked at a temperature of 160°C to 185°C for 1.5 to 2.5 hours.

[0054] It can effectively remove stress and residual moisture inside the board, reduce various expansion and contraction factors from the source, improve the dimensional stability of the flexible board substrate 2040, provide a high-precision substrate foundation for subsequent circuit pattern 2070 production and second pad pattern 2030 processing, and ensure the overall processing accuracy of the flexible board 30 and the expansion and contraction matching of the rigid board 10.

[0055] Please see Figure 8 , Figure 9 and Figure 10 , Figure 8 This is a plan view of the stacked structure according to an embodiment of the present invention; Figure 9 This is a schematic diagram of a cross-section (DD) of the first connection area in an embodiment of the present invention, where no solder resist window pattern has been fabricated. Figure 10 A schematic cross-sectional view of D'-D', which has a solder resist window pattern, for the first connection area of ​​an embodiment of the present invention.

[0056] Step S30: The first connecting area 1010 of the rigid plate 10 and the second connecting area 2010 of the cover flexible plate 30 are aligned and stacked to form a stacked structure 40. After pressing, solder paste 4010 is printed onto the window position of the window cover film 2060 and reflow soldered to form a rigid-flex board 60. The positioning hole 1020 of the rigid plate corresponds to the positioning hole 2020 of the flexible plate.

[0057] During stacking, the precise correspondence between the positioning holes 1020 of the rigid plate and the positioning holes 2020 of the flexible plate is used as a benchmark to ensure the precise docking of the first pad pattern 1090 and the second pad pattern 2030 in the rigid-flex connection area, ensuring the electrical conductivity of subsequent welding. Then, the adhesive layer 1050 is effectively adhered, laying a flat and tight structural foundation for the solder paste 4010 welding. The connection between the rigid plate 10 and the covering flexible plate 30 is a composite structure of adhesive layer 1050 adhesion and solder paste 4010 welding. Compared with the traditional single pressing, it greatly improves the structural strength and connection stability of the rigid-flex connection. Then, reflow soldering is used to cure the solder paste 4010, realizing electrical integration. This allows the split-design rigid-flex board 60 to retain the advantages of independent disassembly and maintenance, while also having electrical conductivity.

[0058] Please see Figure 11 , Figure 12 , Figure 13 , Figure 14 and Figure 15 , Figure 11 This is a plan view of a pressing process using a mold according to an embodiment of the present invention; Figure 12 This is a side view of a pressing process using a mold according to an embodiment of the present invention; Figure 13 This is a side view of the rigid-flexible plate according to an embodiment of the present invention.

[0059] Furthermore, forming the rigid-flexible bond plate includes fabricating an auxiliary mold 50 for pressing, the auxiliary mold 50 including a flexible plate placement area, a rigid plate placement area, and a rigid-flexible bond placement area; fabricating a bottom cover plate 5010 and a top cover plate according to design data; the bottom cover plate 5010 having a fixing groove 5020 matching the size of the rigid plate 10; the bottom cover plate 5010 is provided with positioning pins (including flexible plate positioning pins 5030, rigid plate positioning pins 5040, and rigid plate positioning pins 5050). The flexible bonding area positioning pin 5050) and the top cover plate 5060 are provided with pin holes 5090 corresponding to the positioning pins; the pressing process is as follows: the rigid plate 10 is placed in the fixing groove 5020 and positioned by the rigid plate positioning pin 5040, then the flexible plate 30 is stacked on the flexible plate placement area, and then the top cover plate 5060 is stacked accordingly. The bottom cover plate 5010 and the top cover plate 5060 are fixed by the positioning pins and pin holes 5090, and then the pressing is performed.

[0060] On the one hand, the expansion and contraction of the rigid plate 10 can be measured using the rigid plate positioning hole 1020, thereby calculating the actual expansion and contraction data of the plate. If the expansion and contraction deviation is found to exceed the preset range, the processing parameters can be adjusted in time. On the other hand, positioning pins (including flexible plate positioning pins 5030, rigid plate positioning pins 5040, and rigid-flexible joint area positioning pins 5050) are used; the rigid plate positioning pins 5040 cooperate with the rigid plate positioning hole 1020 to position the rigid plate 10, and the flexible plate positioning pins 5030 cooperate with the flexible plate positioning hole 2020. The rigid board 10 and the flexible board 30 are positioned using positioning pins 5050 to fix the bottom and top cover plates to achieve alignment of the rigid-flex bonding area. With the dedicated placement area and fixing groove 5020 of the mold 50, the rigid board 10 and the flexible board 30 are positioned in a standardized manner, allowing the first connection area 1010 and the second connection area 2010 to be accurately stacked. This ensures the precise correspondence of the pads and circuits during the pressing process, achieving high-precision positioning and pressing of the rigid-flex board 60, and laying a perfect structural foundation for subsequent solder paste 4010 soldering.

[0061] Optionally, if the pin diameter is set to S mm, then the diameter of the rigid plate positioning hole 1020 is (S+0.025mm)±0.025mm, and the diameter of the flexible plate positioning hole 2020 is (S+0.05mm)±0.025mm.

[0062] Furthermore, the pressing process employs a localized heating pressing method, heating and pressing only the rigid-flex bonding area (corresponding to the top heating module 5070 and bottom heating module 5080 in the mold 50) to keep the non-bonding areas of the rigid-flex board 60 at room temperature. This significantly reduces the interference of heat on the overall expansion and contraction of the board, effectively maintaining the calibrated dimensional accuracy of the flexible board 30 and ensuring its expansion and contraction matching with the rigid board 10. At the same time, it also prevents the non-bonding areas of the rigid board 10 from deforming due to heat. From the perspective of temperature control, this further consolidates the processing accuracy of the rigid-flex board 60, laying a stable structural foundation for subsequent solder paste 4010 welding and component assembly.

[0063] Optionally, the pressing parameters are: temperature 160°C to 190°C, pressure 80 kg / cm² to 120 kg / cm², and time 40 minutes to 80 minutes.

[0064] Alternatively, the pressing can be performed manually using a manual pressing machine.

[0065] Please see Figure 13 It is worth noting that, due to the high precision of the circuit boards in actual design and manufacturing processes, the actual structural diagrams and dimensions such as the thickness of each layer and the width of the lines are at the micrometer level. For example, the thickness of each layer is generally between 5μm and 50μm. If the accompanying drawings in the instruction manual were made to scale, the illustrations would be unclear. Therefore, in order to more clearly illustrate the implementation process of the manufacturing method, this embodiment includes... Figure 13 The accompanying drawings are enlarged schematic diagrams of the technical features and do not represent the actual structural diagram dimensions, nor are they enlarged diagrams of the actual structural diagram at the same scale.

[0066] Please see Figures 14 to 16 ; Figure 14 This is a partial physical image of the rigid plate according to an embodiment of the present invention; Figure 15 This is a partial physical image of the flexible plate according to an embodiment of the present invention. Figure 16 This is a partial physical diagram of the rigid-flexible bonding position of the rigid-flexible bonding plate according to an embodiment of the present invention.

[0067] This embodiment provides a rigid-flexible bonding plate 60, which is manufactured using the method described above.

[0068] from Figure 14 , Figure 15 and Figure 16 As can be seen, this embodiment first produces... Figure 14 The rigid plate shown and Figure 15 The flexible plate shown is then manufactured. Figure 16 The rigid-flexible plate 60 shown has good processing effect, and the rigid plate 10 and the flexible plate have a good bonding effect.

[0069] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made under the inventive concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing a novel integrated intelligent vehicle light rigid-flexible bonding plate, wherein the rigid-flexible bonding plate is processed according to design data, characterized in that, The manufacturing method includes the following steps: S10: A rigid core plate is manufactured according to the design data. One edge region of the rigid core plate is designed with a first connecting area, and the edge region of the first connecting area is provided with a rigid plate positioning hole. The surface of the rigid core board is provided with a solder resist layer, and a solder resist window is provided on the solder resist layer corresponding to the position of the first connection area to form a solder resist window pattern. Then, an adhesive layer is made on the first connection area, and the adhesive layer is made to make a window corresponding to the solder resist window pattern to form an adhesive layer window pattern, and the whole board is formed into a rigid board. S20: A flexible board is manufactured according to the design data, wherein a second connection area is designed on one edge of the flexible board; The rigid plate is then baked, and the size and position of the positioning holes on the rigid plate are measured. Based on the data, the positioning holes on the flexible plate are made. The flexible plate is then positioned according to the positioning holes, and the circuit pattern of the flexible plate is then made. The circuit pattern includes a second pad pattern. Make a window in the cover film corresponding to the position of the second pad pattern to form a windowed cover film, and then attach the windowed cover film to the surface of the flexible board to form a cover flexible board. S30: Align and stack the first connection area of ​​the rigid plate and the second connection area of ​​the cover flexible plate, press them together, then print solder paste onto the opening position of the window cover film, and reflow solder to form the rigid-flex board. The positioning holes in the rigid plate correspond to the positioning holes in the flexible plate.

2. The method for manufacturing a novel integrated intelligent vehicle light rigid-flexible bonding plate as described in claim 1, characterized in that, The first connection area is provided with a plurality of first pad patterns, the first pad patterns corresponding to the solder mask opening patterns; Forming the windowed cover film includes creating a window corresponding to the position of the first pad pattern.

3. The method for manufacturing a novel integrated intelligent vehicle light rigid-flexible bonding plate as described in claim 1, characterized in that, The rigid plate has three or more positioning holes, and these three or more positioning holes are arranged in a non-linear manner.

4. The method for manufacturing a novel integrated intelligent vehicle light rigid-flexible bonding plate as described in claim 1, characterized in that, The baking process involves baking the rigid plate at a temperature of 160°C to 185°C for 1.5 to 2.5 hours.

5. The method for manufacturing a novel integrated intelligent vehicle light rigid-flexible bonding plate as described in claim 2, characterized in that, The fabrication of the flexible cover includes: A single-sided flexible copper-clad laminate with a copper layer and an insulating dielectric layer is baked to create the circuit pattern, forming the second pad pattern, and the whole board is formed into a flexible core board. Then, several through slots are made on the insulating dielectric layer of the flexible core board, and each through slot corresponds to the first pad pattern. Next, take the cover film, make a window corresponding to the second pad pattern and the through slot, and then attach it to the surface of the flexible core board to form the cover flexible board.

6. The method for manufacturing a novel integrated intelligent vehicle light rigid-flexible bonding plate as described in claim 5, characterized in that, The size of the through slot is larger on one side than the size of the first pad pattern.

7. The method for manufacturing a novel integrated intelligent vehicle light rigid-flexible bonding plate as described in claim 5, characterized in that, The process of forming the window cover film includes taking a cover film and two release films, laying the cover film between the two release films, hot pressing, removing it, and then performing subsequent processes to form the window cover film.

8. The method for manufacturing a novel integrated intelligent vehicle light rigid-flexible bonding plate as described in claim 5, characterized in that, The baking plate is used to bake at a temperature of 160°C to 185°C for 1.5 to 2.5 hours.

9. A method for manufacturing a novel integrated intelligent vehicle light rigid-flexible bonding plate as described in claim 1 or 5, characterized in that, Forming the rigid-flexible plate includes manufacturing an auxiliary mold for pressing. The auxiliary mold includes a flexible plate placement area, a rigid plate placement area, and a rigid-flexible joint placement area. Fabricate the bottom cover plate and top cover plate according to the design data. The bottom cover plate has a fixing groove that matches the size of the rigid plate; The bottom cover plate is provided with a positioning pin, and the top cover plate is provided with a pin hole corresponding to the positioning pin; The pressing is as follows: The rigid plate is placed in the fixing groove and positioned by the positioning pins of the rigid plate. Then, the cover flexible plate is stacked in the flexible plate placement area, and the top cover plate is stacked accordingly. The bottom cover plate and the top cover plate are fixed by the positioning pins and the pin holes, and then the pressing is performed.

10. A rigid-flexible composite plate, characterized in that, The rigid-flexible plate is manufactured using the manufacturing method described in any one of claims 1 to 9.

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