A heat-conducting heat dissipation structure

Abstract

The application belongs to the technical field of heat dissipation equipment, and provides a heat conduction heat dissipation structure, which comprises a plurality of heat sources and a heat dissipation piece, the heat sources are spaced apart from each other and form physical isolation or spatial isolation, and the heat radiation intensity of at least two heat sources in the plurality of heat sources is different from each other; the heat dissipation piece is divided into heat dissipation units corresponding to the number of heat sources according to the isolation layout of the heat sources, and each heat source is thermally coupled with a dedicated heat dissipation unit to lead out heat. The application realizes heat source separation through physical isolation or spatial isolation for heat sources with different heat radiation intensities, and matches independent heat dissipation units one by one, completely solves the heat crosstalk problem of the traditional integrated heat dissipation structure, avoids overheating and damage of low-heat-radiation heat sources caused by high-heat-radiation heat sources, and greatly improves the working stability of multi-heat-source integrated devices.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation equipment technology, and specifically relates to a heat conduction and heat dissipation structure. Background Technology

[0002] Existing heat dissipation structures mostly adopt an integrated, one-piece heat dissipation solution, where all heat-generating components share the same heat dissipation cavity or heat dissipation substrate. For example... Figure 1 As shown, assume heat source A (electronic component A) is a temperature-sensitive device such as a chip or laser, and heat source B (electronic component B) is a less temperature-sensitive device such as a Zener diode or inductor, with the latter often having a much greater heat dissipation than the former. Both devices (heat sources) transfer heat to the outside through a heat sink. Due to the large thermal diffusivity of the metal heat sink, the temperature field at that location tends to be uniform; or it can be understood as a shared heat dissipation channel, with each channel allocated almost according to its heat dissipation ratio. Thus, heat source B, due to its greater heat dissipation, occupies a larger proportion of the channel, squeezing out the channel for heat source A, thereby raising the temperature of device A.

[0003] Therefore, a large amount of heat from high-radiation heat sources will be conducted and superimposed on low-radiation heat sources through the integrated heat dissipation structure, causing local overheating and exceeding the operating temperature of low-radiation heat sources. At the same time, the heat from high and low heat sources interferes with each other, resulting in uneven heat dissipation and severe local heat accumulation. This makes it impossible to match the differentiated heat dissipation requirements of different heat sources, significantly reducing the overall working stability and reliability of integrated devices. Summary of the Invention

[0004] To address the problems in the background art, this invention proposes a heat conduction and heat dissipation structure.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A heat conduction and heat dissipation structure, comprising: Several heat sources, which are separated from each other and form physical or spatial isolation, and at least two of the heat sources have different thermal radiation intensities. The heat sink is divided into heat sink units according to the isolation layout of each heat source, and each heat source is thermally coupled to its dedicated heat sink unit to dissipate heat.

[0006] Furthermore, two heat sources with different thermal radiation intensities are provided; A thermal resistance element is provided between the two heat sources. The thermal resistance element is used to separate the two heat sources and to make the heat dissipation element form two heat dissipation units. Alternatively, the two heat sources are spatially separated from each other, and the two heat dissipation units are in a corresponding form that is separated from each other, depending on the heat source.

[0007] Furthermore, the thermal resistance component contacts or is embedded in the heat sink component.

[0008] Furthermore, two symmetrically arranged heat dissipation areas are provided, and each heat dissipation area is provided with two heat sources; The two heat sources are configured as a laser and a Zener diode, and a heat insulation plate is installed between the laser and the Zener diode; The heat dissipation unit used for laser thermal coupling is configured with a metal thermally conductive liner. The heat dissipation unit for the thermal coupling of the Zener diode is configured as a symmetrical first heat dissipation layer; The thermal resistance element is configured as an insulating diaphragm, which separates the thermally conductive metal liner from the first heat dissipation layer.

[0009] Furthermore, the heat dissipation layer is located at both ends of the metal thermally conductive substrate.

[0010] Furthermore, an insulating layer is provided outside the heat dissipation area, and the inner surface of the insulating layer is in contact with the metal thermally conductive liner and the first heat dissipation layer. An outer shell is also installed on the outer surface of the insulation layer.

[0011] Furthermore, the inner surface of the first heat dissipation layer is a stepped surface, which is used to install the voltage regulator tube.

[0012] Furthermore, two heat sources are provided, and the two heat sources are configured as a laser and a Zener diode; The two heat dissipation units are configured as two symmetrically arranged second heat dissipation layers, and the two second heat dissipation layers are spatially isolated.

[0013] Furthermore, an insulating layer and an outer shell are provided, with the outer shell installed on the outer surface of the insulating layer; The second heat dissipation layer is located inside the insulating layer, and the surface away from the laser or Zener diode is in contact with the inner surface of the insulating layer.

[0014] Furthermore, the inner surface of the second heat dissipation layer is set as a stepped surface, which is used to install the voltage regulator tube.

[0015] The beneficial effects of this invention are: 1. This invention addresses heat sources with different thermal radiation intensities by physically or spatially isolating them and matching them with corresponding independent heat dissipation units. This completely solves the problem of heat crosstalk in traditional integrated heat dissipation structures, prevents high-radiation heat sources from causing overheating damage to low-radiation heat sources, and significantly improves the working stability of multi-heat source integrated devices. 2. The present invention matches the heat dissipation structure with the heat generation power and heat radiation intensity of different heat sources. High heat flux heat sources use high thermal conductivity metal lining for rapid heat dissipation, while low heat flux heat sources use an appropriate heat dissipation layer for stable heat dissipation. The heat dissipation efficiency is high, and the problems of local heat accumulation and uneven temperature are effectively avoided. 3. The present invention uses an embedded structure to embed thermal resistance components into heat sinks, dividing the originally integrated heat sink into independent heat sink units without thermal connection, thereby further blocking cross-regional thermal crosstalk from the root of heat conduction.

[0016] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description and the drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of a heat conduction and heat dissipation structure according to the present invention is shown; Figure 2 A schematic diagram of the heat conduction and heat dissipation structure of the embedded thermal resistor of the present invention is shown; Figure 3 A schematic diagram of the first heat conduction and heat dissipation structure of the submarine repeater of the present invention is shown; Figure 4 A schematic diagram of a second heat conduction and heat dissipation structure for the submarine repeater of the present invention is shown.

[0019] In the diagram: 1. Laser; 2. Zener diode; 3. Metal thermal conductive liner; 4. First heat dissipation layer; 5. Thermal insulation membrane; 6. Insulation layer; 7. Outer shell; 8. Second heat dissipation layer; 9. Heat insulation board; 10. Fiber optic coil. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] This embodiment discloses a heat conduction and heat dissipation structure, including a plurality of heat sources and heat dissipation components. The heat sources are spaced apart from each other and form physical or spatial isolation, and at least two of the heat sources have different thermal radiation intensities. The heat dissipation components are divided into heat dissipation units corresponding to the number of heat sources according to the isolation layout of each heat source. Each heat source is thermally coupled to its own dedicated heat dissipation unit to independently dissipate its own working heat.

[0022] It should be noted that, based on the different characteristics of heat radiation intensity and heat generation power of different heat sources, this embodiment completely isolates high and low heat radiation heat sources through physical barriers or spatial separation, blocking the lateral conduction and crosstalk of heat between heat sources; at the same time, each heat source is matched with a dedicated heat dissipation unit, and each heat dissipation unit works independently and does not interfere with each other. High heat radiation heat sources quickly dissipate concentrated heat through corresponding large heat dissipation capacity units, while low heat radiation heat sources dissipate heat smoothly through adaptation units, fundamentally solving the problems of heat accumulation, temperature drift, and heat interference in multi-heat source integrated scenarios.

[0023] like Figure 1 As shown, this embodiment sets up two heat sources (heat source A and B) with different thermal radiation intensities. Heat source A has a lower temperature, with a temperature range of 35-38 degrees Celsius during heat dissipation, while heat source B has a higher temperature, with a temperature range of 39-57 degrees Celsius during heat dissipation. For the dual-heat source structure, this embodiment provides a physically isolated heat dissipation layout, which places a thermal resistance component between the two heat sources. This thermal resistance component is a plate-like structure with high thermal resistance. The thermal resistance component achieves a physical separation between the two heat sources. Simultaneously, due to the barrier effect of the thermal resistance component, the complete heat dissipation component can be divided into two independent heat dissipation units, each corresponding to one of the two heat sources, achieving structural zoning and heat dissipation zoning.

[0024] It should be noted that this embodiment utilizes physical barriers to prevent heat conduction paths between different heat sources, thus avoiding heat accumulation and crosstalk from high-radiation heat sources to low-radiation heat sources. Simultaneously, through a one-to-one matched independent heat dissipation unit, heat sources with different power and radiation intensities can be matched with suitable heat dissipation areas. High-heat-flux heat sources quickly dissipate concentrated heat, while low-heat-flux heat sources steadily dissipate small amounts of heat. Structurally, this avoids the problems of uneven temperature and localized overheating caused by multiple heat sources sharing a heat dissipation structure.

[0025] Alternatively, in addition to physical isolation, a spatial isolation layout can be adopted, in which the two heat sources are not physically separated by any structure. They are spatially isolated from each other by spatial misalignment and spacing. The heat dissipation components are divided into two separate heat dissipation units according to the spatial distribution of the two heat sources, and the heat dissipation units correspond one-to-one with the positions and shapes of the heat sources.

[0026] Furthermore, in order to separate two or more heat sources with different thermal radiation and to separate two or more heat dissipation units, this embodiment provides two assembly structure forms, namely a contact assembly structure and an embedded assembly structure.

[0027] For example, Figure 1 It adopts a contact assembly structure, in which the thermal resistance component is integrally attached to the surface of the heat sink. There are two independent heat dissipation units on each side of the thermal resistance component. The thermal resistance component is in close contact with the surface of the heat sink, realizing the physical isolation between the two heat dissipation units and blocking the lateral conduction of heat inside the heat sink. Figure 1 In this structure, the heat dissipation components for both heat sources are the same heat sink housing. The thermal resistance component is in contact with the heat sink housing but does not completely separate it. Therefore, there is slight heat dissipation interference between the two heat dissipation units. Figure 2 The structure has been optimized to address this problem.

[0028] like Figure 2 As shown, in its embedded assembly structure, the thermal resistance component is partially or completely embedded in the internal area of ​​the heat sink, forming a complete high thermal resistance isolation barrier inside the heat sink body, dividing the heat sink into two completely independent heat dissipation areas from the inside, further improving the isolation effect.

[0029] It should be noted that, Figure 2 By using contact-type or embedded thermal resistance structures, the thermal resistance difference between the two heat dissipation units is significantly increased, maximizing the prevention of heat flow within the heat dissipation unit. Compared to simple external isolation, the embedded structure can achieve thermal isolation from the core heat dissipation area, completely preventing heat from the high-heat-radiation side heat dissipation unit from being conducted to the low-heat-radiation side through the heat dissipation unit body, further enhancing the independent heat dissipation effect of differentiated heat sources and reducing interference between the heat dissipation processes of the two heat sources.

[0030] like Figure 3 As shown in the figure, this embodiment is a submarine repeater. As can be seen from its cross-section, the repeater is symmetrically arranged with two identical heat dissipation areas. Each heat dissipation area is equipped with two heat sources. The two heat sources are laser 1 and voltage regulator 2, respectively. Laser 1 is a high-heat radiation, high-intensity heat source, and voltage regulator 2 is a low-heat radiation, low-intensity heat source.

[0031] In addition, the heat dissipation unit for the laser 1 is a metal thermally conductive substrate 3. The metal thermally conductive substrate 3 has the characteristics of high thermal conductivity and high heat diffusion efficiency. The laser 1 is mounted on its surface. Considering cost, a suitable metal material can be selected, preferably copper. The heat dissipation unit for the Zener diode 2 is a first heat dissipation layer 4. Two sets of first heat dissipation layers 4 are arranged symmetrically, and together with the metal thermally conductive substrate 3, they complete the dual heat source partitioned heat dissipation. In this embodiment, the thermal resistance component is specifically selected as a thermal insulation membrane 5. The thermal insulation membrane 5 (such as an aerogel pad) is arranged between the metal thermally conductive substrate 3 and the first heat dissipation layer 4 to separate the two heat dissipation units and realize the thermal isolation between the laser 1 and the Zener diode 2. Preferably, the first heat dissipation layer 4 is symmetrically arranged at both ends of the metal thermally conductive substrate 3.

[0032] Furthermore, the inner surface of the first heat dissipation layer 4 is set as a stepped surface, which serves as a dedicated installation position for positioning and installing the voltage regulator tube 2. This ensures that the voltage regulator tube 2 is fully in contact with the first heat dissipation layer 4, effectively reducing contact thermal resistance and ensuring efficient heat conduction. Simultaneously, an insulating layer 6 is installed on the exterior of the heat dissipation area, creating a sealed space inside. The inner surface of the insulating layer 6 is in close contact with both the outer surface of the metal thermally conductive liner 3 and the outer surface of the first heat dissipation layer 4. The outer shell 7 is fixedly installed on the outer surface of the insulating layer 6.

[0033] It should be noted that in this embodiment, the heat sink is divided into two heat sink units, and the heat sink units have different thermal conductivity. Therefore, in the actual manufacturing process, the heat sink units can be made of materials with higher thermal conductivity and diffusion coefficient, such as copper, to further improve the heat dissipation capacity.

[0034] It should be noted that during operation, the concentrated high heat flux generated by the laser 1 is rapidly conducted to the highly thermally conductive metal heat-conducting substrate 3 for rapid heat dissipation. The small amount of heat generated by the Zener diode 2 is completely introduced into the first heat dissipation layer 4 through the stepped surface bonding structure for stable heat dissipation. The intermediate thermal insulation membrane 5 forms a high thermal resistance isolation barrier, blocking the heat exchange between the metal heat-conducting substrate 3 and the first heat dissipation layer 4, preventing the high-temperature heat from the laser 1 from interfering with the Zener diode 2 area, and preventing the Zener diode 2 from overheating and drifting. The external insulating layer 6 and the outer shell 7 achieve structural insulation and protection without affecting heat dissipation, ensuring the long-term stable operation of the device. After isolation, even in the event of a disaster recovery situation, if the heat dissipation of the circuit represented by the Zener diode 2 increases dramatically, its heat dissipation channel is still confined within its own conduction channel. Due to the low thermal conductivity and low thermal diffusivity of the insulating layer 6, the heat from the circuit is difficult to affect the laser 1 through the insulating layer 6. In some scenario tests, the temperature difference between the channels is about 1℃.

[0035] Furthermore, Figure 3 A heat insulation plate 9 is also provided between the laser 1 and the voltage regulator 2, which can isolate the heat flow between the laser 1 and the voltage regulator 2.

[0036] like Figure 4 As shown, this embodiment also sets two heat sources with different thermal radiation, namely laser 1 and voltage regulator 2. The heat dissipation unit corresponding to the two heat sources is set as two symmetrically arranged second heat dissipation layers 8. The two second heat dissipation layers 8 are arranged in a completely spatially separated manner, with no physical contact or connection structure between them. They rely on the spatial gap to form a natural heat insulation isolation area, thus constituting two independent heat dissipation systems.

[0037] This structure is equipped with an insulating layer 6 and a housing 7. The housing 7 is fixedly installed on the outer surface of the insulating layer 6 to achieve overall encapsulation and protection. Two second heat dissipation layers 8 are arranged in the internal cavity of the insulating layer 6. The outer surface of the second heat dissipation layer 8 away from the heat source is tightly attached to the inner surface of the insulating layer 6. The insulating layer 6 is used to position, fix and electrically insulate the second heat dissipation layer 8, so as to avoid the heat dissipation structure from conducting electricity and interfering with the operation of the components.

[0038] In terms of assembly structure, the inner surface of the second heat dissipation layer 8 is set as a stepped surface. This stepped surface is a dedicated installation position for the voltage regulator tube 2, which can realize the precise installation and tight fit of the voltage regulator tube 2, reduce the contact thermal resistance, and ensure that the heat of the voltage regulator tube 2 is quickly transferred to the second heat dissipation layer 8. On the other side, the second heat dissipation layer 8 is thermally coupled to the laser 1 to meet the high heat flow heat dissipation requirements of the laser 1.

[0039] It should be noted that by utilizing the structural characteristics of complete spatial isolation, the heat conduction channel between the two second heat dissipation layers 8 is completely cut off. The high heat generated by the laser 1 can only diffuse outward independently through the corresponding second heat dissipation layer 8, and the low-power heat of the Zener diode 2 can only be dissipated through the other independent second heat dissipation layer 8. The high and low temperature heat dissipation areas are independent of each other.

[0040] In addition, such as Figure 3 , Figure 4 As shown, the central area of ​​the submarine repeater is also equipped with a fiber optic box 10, and optical fibers are laid inside the box; the optical fibers include multiple paths, one of which originates from the laser 1, and another is an external access optical fiber.

[0041] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat conduction and heat dissipation structure, characterized in that, include: A plurality of heat sources, wherein each heat source is spaced apart from the others and forms a physical or spatial isolation, and at least two of the heat sources have different thermal radiation intensities. The heat sink is divided into heat sink units corresponding to the number of heat sources according to the isolation layout of each heat source. Each heat source is thermally coupled to its dedicated heat sink unit to dissipate heat.

2. The heat conduction and heat dissipation structure according to claim 1, characterized in that, Two heat sources with different thermal radiation intensities are set up; A thermal resistance element is provided between the two heat sources. The thermal resistance element is used to separate the two heat sources and to make the heat dissipation element form two heat dissipation units. Alternatively, the two heat sources are spatially separated from each other, and the two heat dissipation units are in a corresponding form that is separated from each other along with the corresponding heat sources.

3. The heat conduction and heat dissipation structure according to claim 2, characterized in that, The thermal resistance element is in contact with or embedded in the heat dissipation element.

4. The heat conduction and heat dissipation structure according to claim 2, characterized in that, The system provides two symmetrically arranged heat dissipation areas, and each heat dissipation area is provided with two heat sources. The two heat sources are configured as a laser (1) and a Zener diode (2), and a heat insulation plate (9) is provided between the laser (1) and the Zener diode (2). The heat dissipation unit for thermal coupling of the laser (1) is configured as a metal thermally conductive substrate (3). The heat dissipation unit for thermal coupling of the Zener diode (2) is configured as a symmetrical first heat dissipation layer (4). The thermal resistance element is configured as a thermal insulation membrane (5), which is used to separate the metal thermally conductive liner (3) and the first heat dissipation layer (4).

5. The heat conduction and heat dissipation structure according to claim 4, characterized in that, The heat dissipation layer (4) is located at both ends of the metal thermally conductive liner (3).

6. A heat conduction and heat dissipation structure according to claim 4 or 5, characterized in that, An insulating layer (6) is also provided outside the heat dissipation area, and the inner surface of the insulating layer (6) is in contact with the metal thermally conductive liner (3) and the first heat dissipation layer (4). The outer surface of the insulating layer (6) is also fitted with a shell (7).

7. A heat conduction and heat dissipation structure according to claim 4 or 5, characterized in that, The inner surface of the first heat dissipation layer (4) is a stepped surface, which is used to install the voltage regulator tube (2).

8. The heat conduction and heat dissipation structure according to claim 2, characterized in that, There are two heat sources, and the two heat sources are configured as a laser (1) and a Zener diode (2). The two heat dissipation units are configured as two symmetrically arranged second heat dissipation layers (8), and the two second heat dissipation layers (8) are spatially isolated.

9. A heat conduction and heat dissipation structure according to claim 8, characterized in that, It is also provided with an insulating layer (6) and a housing (7), the housing (7) being installed on the outer surface of the insulating layer (6); The second heat dissipation layer (8) is located inside the insulating layer (6), and the surface away from the laser (1) or the voltage regulator (2) is in contact with the inner surface of the insulating layer (6).

10. A heat conduction and heat dissipation structure according to claim 8 or 9, characterized in that, The inner surface of the second heat dissipation layer (8) is set as a stepped surface, which is used to install the voltage regulator tube (2).

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