Two-phase cooling method and related apparatus

Abstract

The application discloses a two-phase cooling method and related equipment, relates to the technical field of two-phase cooling, and relates to a two-phase cooling device which comprises a two-phase cooling plate, the two-phase cooling plate comprises an evaporation cavity and a gas-liquid separation cavity, the evaporation cavity comprises spaces between each fin of radiating fins, microchannels exist at the bottom of the radiating fins, holes exist between the microchannels and the evaporation cavity, the microchannels are used for flowing in first liquid working medium to supply liquid to the evaporation cavity through the holes, the evaporation cavity is used for partially phase changing the first liquid working medium flowing in from the holes into gaseous working medium to cool a heat source, the gaseous working medium is mixed with part of the first liquid working medium to form a gas-liquid two-phase mixed flow, and the gas-liquid two-phase mixed flow flows from the evaporation cavity to the gas-liquid separation cavity. According to the application, liquid working medium is input through the microchannels at the bottom of the radiating fins, the bottom of the radiating fins is completely immersed, then liquid is supplied to the evaporation cavity through the pre-set holes, dry burning caused by lack of liquid is avoided, and exhaust resistance is reduced.

Description

Technical Field

[0001] This application relates to the field of two-phase cooling technology, and more particularly to two-phase cooling methods and related equipment. Background Technology

[0002] In related technologies, two-phase liquid cooling utilizes the latent heat of vaporization of the medium and has a uniform saturation temperature, giving it a significant advantage over single-phase liquid cooling in cooling high-heat-density chips. However, existing two-phase cooling solutions have obvious limitations: immersion cooling requires the chip and server to be directly immersed in the medium, imposing stringent requirements on compatibility, data center load-bearing capacity, and maintenance; while traditional two-phase cold plates avoid these problems, they generally face challenges such as increased vapor resistance after vaporization and localized dry burning of the heat source substrate under high power. In particular, existing cold plates often employ a top-spray or top-cover exhaust channel design, with the spray holes and exhaust ports on the same side, making it difficult for the liquid to fully reach the bottom of the fins. Furthermore, the flow channels encroach on the exhaust area, resulting in high outlet resistance and reduced heat exchange efficiency. In addition, the fin height is limited by the liquid supply capacity, restricting the expansion of the heat exchange area, requiring high liquid supply pressure and flow rate, and resulting in high power consumption. Therefore, there is an urgent need for a new cold plate structure that balances the temperature uniformity of immersion cooling with the compatibility of cold plate cooling, and effectively solves the problems of insufficient liquid for dry burning and exhaust resistance. Summary of the Invention

[0003] The main purpose of this application is to provide a two-phase cooling method and related equipment, which aims to solve the technical problems of insufficient liquid and dry burning and large exhaust resistance in existing two-phase cooling plates.

[0004] To achieve the above objectives, this application proposes a two-phase cooling device, the two-phase cooling device comprising: A two-phase cooling plate includes an evaporation chamber and a gas-liquid separation chamber. The evaporation chamber includes the space between each fin of a heat dissipation fin. A microchannel exists at the bottom of the heat dissipation fin. There are holes between the microchannel and the evaporation chamber. The microchannel is used to allow a first liquid working fluid to flow in, so as to supply liquid to the evaporation chamber through the holes. The evaporation chamber is used to partially convert the first liquid working fluid flowing in from the holes into a vapor working fluid to cool the heat source. The vapor working fluid mixes with a portion of the first liquid working fluid to form a vapor-liquid two-phase mixed flow. The vapor-liquid two-phase mixed flow flows from the evaporation chamber to the gas-liquid separation chamber.

[0005] In one embodiment, the gas-liquid separation chamber includes a gas-liquid separation filter screen for separating the gas-liquid two-phase mixed flow flowing from the evaporation chamber into a second liquid working fluid and the gaseous working fluid. The second liquid working fluid flows back to the evaporation chamber to participate in heat exchange again, and the gaseous working fluid is discharged from the exhaust port.

[0006] In one embodiment, the two-phase cooling device further includes a condensation circuit, and the two-phase cold plate further includes a liquid inlet and an exhaust port. The liquid inlet is located at the bottom of the two-phase cold plate and is used to input the first liquid working fluid and input the first liquid working fluid into the microchannel. The exhaust port is located at the top of the two-phase cold plate and is used to discharge the gaseous working fluid into the condensation circuit for condensation reflux. The condensation circuit is used to condense the gaseous working fluid discharged from the two-phase cold plate into the first liquid working fluid, and input the condensed first liquid working fluid into the liquid inlet based on the working fluid pump.

[0007] In one embodiment, the two-phase cold plate further includes a volumetric flow sensor, which is used to collect the volumetric flow rate of the first liquid working fluid input from the inlet, so as to adjust the speed of the working fluid pump in the condensation circuit.

[0008] To achieve the above objectives, this application proposes a two-phase cooling method applied to the two-phase cooling equipment, the two-phase cooling method comprising: The liquid density and first enthalpy of the first liquid working fluid input to the two-phase cold plate are obtained, as are the dryness and second enthalpy of the gaseous working fluid output by the two-phase cold plate, and the load heat dissipation of the heat source corresponding to the two-phase cold plate are obtained. The theoretical volumetric flow rate is calculated based on the liquid density, the first enthalpy value, the dryness fraction, the second enthalpy value, the load heat dissipation, and a preset calculation formula. Based on the theoretical volumetric flow rate, the rotational speed of the working fluid pump in the condensation circuit is adjusted to adjust the flow rate of the first liquid working fluid input to the two-phase cold plate.

[0009] In one embodiment, the preset calculation formula is: ,in, Indicates the heat dissipation of the load. Represents the theoretical volumetric flow rate. Indicates the density of the liquid. Indicates dryness. Indicates the second enthalpy value. This represents the first enthalpy value.

[0010] In one embodiment, the step of adjusting the rotational speed of the working fluid pump in the condensation circuit based on the theoretical volumetric flow rate further includes: Based on the volumetric flow sensor in the two-phase cold plate, the actual volumetric flow rate of the first liquid working fluid input from the inlet is collected; Based on the actual volumetric flow rate and the theoretical volumetric flow rate, adjust the speed of the working fluid pump in the condensation circuit.

[0011] Furthermore, to achieve the above objectives, this application also proposes a two-phase cooling device, which includes: The acquisition module is used to acquire the liquid density and first enthalpy value of the first liquid working fluid input to the two-phase cold plate, acquire the dryness and second enthalpy value of the gaseous working fluid output by the two-phase cold plate, and acquire the load heat dissipation corresponding to the heat source. The calculation module is used to calculate the theoretical volumetric flow rate based on the liquid density, the first enthalpy value, the dryness fraction, the second enthalpy value, the load heat dissipation, and a preset calculation formula. An adjustment module is used to adjust the rotational speed of the working fluid pump in the condensation circuit based on the theoretical volumetric flow rate, so as to adjust the flow rate of the first liquid working fluid input to the two-phase cold plate.

[0012] In addition, to achieve the above objectives, this application also proposes a two-phase cooling device, the device comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, the computer program being configured to implement the steps of the two-phase cooling method as described above.

[0013] In addition, to achieve the above objectives, this application also proposes a storage medium, which is a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the steps of the two-phase cooling method described above.

[0014] In addition, to achieve the above objectives, this application also provides a computer program product, which includes a computer program that, when executed by a processor, implements the steps of the two-phase cooling method described above.

[0015] One or more technical solutions proposed in this application have at least the following technical effects: This application discloses a two-phase cooling method and related equipment, relating to the field of two-phase cooling technology. Compared to existing two-phase cooling solutions, which have significant limitations—immersion cooling requires direct immersion of the chip and server in the medium, imposing stringent requirements on compatibility, data center load-bearing capacity, and maintenance—traditional two-phase cold plates, while avoiding these problems, generally face challenges such as increased vapor resistance after vaporization and localized dry burning of the heat source substrate under high power. Furthermore, fin height is limited by liquid supply capacity, limiting heat exchange area expansion, requiring high liquid supply pressure and flow rate, and resulting in significant power consumption. In contrast, the two-phase cooling method described in this application… The cooling device includes a two-phase cold plate, which includes an evaporation chamber and a gas-liquid separation chamber. The evaporation chamber includes the space between each fin of the heat dissipation fins. There are microchannels at the bottom of the heat dissipation fins, and there are holes between the microchannels and the evaporation chamber. The microchannels are used to allow a first liquid working fluid to flow in, so as to supply liquid to the evaporation chamber through the holes. The evaporation chamber is used to partially convert the first liquid working fluid flowing in from the holes into a vapor working fluid to cool the heat source. The vapor working fluid and part of the first liquid working fluid are mixed to form a vapor-liquid two-phase mixed flow, which flows from the evaporation chamber to the gas-liquid separation chamber.

[0016] It is understandable that this application introduces liquid working fluid through microchannels at the bottom of the heat sink fins, so that the bottom of the heat sink fins is completely submerged, and then supplies liquid to the evaporation chamber through pre-set holes, so as to avoid dry burning due to lack of liquid and reduce exhaust resistance. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a front view of the two-phase cooling plate provided in Embodiment 1 of the two-phase cooling device of this application; Figure 2 This is a side view of the two-phase cold plate provided in Embodiment 1 of the two-phase cooling device of this application; Figure 3 This is a schematic diagram of the vertically arranged two-phase cooling plates provided in Embodiment 1 of the two-phase cooling device of this application; Figure 4 This is a schematic flowchart of Embodiment 2 of the two-phase cooling method of this application; Figure 5 This is a schematic diagram of the module structure of the two-phase cooling device according to an embodiment of this application.

[0020] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of this application and are not intended to limit this application.

[0022] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0023] The main solution in this application embodiment is: In this embodiment, for ease of description, a two-phase cooling device will be used as the subject of the description.

[0024] Based on this, the present application provides a two-phase cooling device, referring to... Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a front view of the two-phase cold plate provided in the first embodiment of the two-phase cooling device of this application. Figure 2 This is a side view of the two-phase cold plate provided in the first embodiment of the two-phase cooling device of this application. Figure 3 This is a schematic diagram of the vertically arranged two-phase cooling plates provided in the first embodiment of the two-phase cooling device of this application.

[0025] In this embodiment, the two-phase cooling device includes: A two-phase cooling plate includes an evaporation chamber and a gas-liquid separation chamber. The evaporation chamber includes the space between each fin of a heat dissipation fin. A microchannel exists at the bottom of the heat dissipation fin. There are holes between the microchannel and the evaporation chamber. The microchannel is used to allow a first liquid working fluid to flow in, so as to supply liquid to the evaporation chamber through the holes. The evaporation chamber is used to partially convert the first liquid working fluid flowing in from the holes into a vapor working fluid to cool the heat source. The vapor working fluid mixes with a portion of the first liquid working fluid to form a vapor-liquid two-phase mixed flow. The vapor-liquid two-phase mixed flow flows from the evaporation chamber to the gas-liquid separation chamber.

[0026] It should be noted that two-phase cooling equipment refers to an overall system used to dissipate heat from heat-generating components (such as chips), which utilizes the liquid-gas phase change of the working fluid to transfer heat.

[0027] It should be noted that the two-phase cold plate refers to the core heat exchange component of the equipment, which is internally encapsulated with working fluid and is installed directly or indirectly above the heat source.

[0028] It should be noted that the evaporation chamber refers to the main spatial region inside the cold plate where the working fluid undergoes a phase change (from liquid to gaseous state after absorbing heat).

[0029] It should be noted that the gas-liquid separation chamber refers to the space inside the cold plate that is connected to the evaporation chamber, and is used to separate the gas and liquid in the mixed fluid flowing out of the evaporation chamber.

[0030] It should be noted that the heat dissipation fins are located at the bottom of the evaporation chamber, where multiple thin plate-like metal structures are used to expand the heat exchange area and enhance heat transfer.

[0031] It should be noted that a fin refers to a single heat dissipation fin, and the gaps between multiple fins form fluid channels.

[0032] It should be noted that microchannels refer to tiny flow channels (usually in the millimeter range) formed in the bottom region of the fins, which allow the liquid working fluid to flow and fully contact the heated surface.

[0033] A hole refers to a through-hole opened between the bottom of the fin and the evaporation chamber, used to connect the microchannel and the evaporation chamber.

[0034] The first liquid working medium refers to the initial liquid cooling medium (such as refrigerant) supplied to the cold plate from the outside.

[0035] A gaseous working fluid refers to a gas that forms after the first liquid working fluid absorbs heat and undergoes a phase change.

[0036] The heat source refers to the heat-generating element to be cooled (such as a server chip), whose heat is transferred to the working fluid through the cold plate base.

[0037] A vapor-liquid two-phase mixed flow refers to a mixed fluid composed of unevaporated liquid working fluid and generated vapor working fluid after partial vaporization of the working fluid.

[0038] In this embodiment, the first liquid working fluid first flows into the microchannel at the bottom of the heat dissipation fins, and then enters the interior of the evaporation chamber (i.e., the space between the fins) through the holes between the microchannels and the evaporation chamber. The liquid working fluid entering the evaporation chamber absorbs the heat transferred by the heat source, and a portion of it undergoes a phase change to become a vaporized working fluid. This vaporized working fluid mixes with the remaining liquid working fluid to form a vapor-liquid two-phase mixed flow, which then flows from the evaporation chamber toward the gas-liquid separation chamber.

[0039] Understandably, this step involves supplying liquid to the evaporation chamber through microchannels to ensure that the liquid working fluid can reach the bottom heated surface of the fins and avoid localized liquid shortages. The boiling phase change in the evaporation chamber efficiently removes heat, and the resulting two-phase flow is led out to the separation chamber to prepare for subsequent gas-liquid separation.

[0040] Specifically, the gas-liquid separation chamber includes a gas-liquid separation filter screen, which is used to separate the gas-liquid two-phase mixed flow flowing from the evaporation chamber into a second liquid working fluid and the gaseous working fluid. The second liquid working fluid flows back to the evaporation chamber to participate in heat exchange again, and the gaseous working fluid is discharged from the exhaust port.

[0041] It should be noted that a gas-liquid separation filter refers to a porous filtration structure (such as a metal wire mesh) installed in a gas-liquid separation chamber to block liquid from passing through while allowing gas to pass through, thereby achieving gas-liquid separation.

[0042] The second liquid working medium refers to the liquid portion obtained after the gas-liquid two-phase mixture flows through the gas-liquid separation filter (its composition is the same as the first liquid working medium, but it is the reflux liquid after separation).

[0043] The exhaust port refers to the opening on the gas-liquid separation chamber used to discharge the separated gaseous working fluid from the cold plate to the external pipeline.

[0044] In this embodiment, the vapor-liquid two-phase mixed flow flowing from the evaporation chamber enters the gas-liquid separation chamber and passes through the gas-liquid separation filter. The filter traps the liquid in the mixed flow, forming a second liquid working fluid, which flows directly back to the evaporation chamber to participate in the heat exchange process again; while the vapor working fluid in the mixed flow passes smoothly through the filter and is finally discharged from the exhaust port from the cold plate.

[0045] Understandably, this step achieves on-site gas-liquid separation inside the cold plate, allowing the separated liquid working fluid to return directly to the evaporation chamber for replenishment without going through external pipelines, maintaining the wetted state of the fin bottom; at the same time, only the gaseous working fluid is discharged, reducing the amount of working fluid circulating and lowering the probability of liquid being entrained in the exhaust.

[0046] Specifically, the two-phase cooling device further includes a condensation circuit, and the two-phase cold plate further includes a liquid inlet and an exhaust port. The liquid inlet is located at the bottom of the two-phase cold plate and is used to input the first liquid working fluid and input the first liquid working fluid into the microchannel. The exhaust port is located at the top of the two-phase cold plate and is used to discharge the gaseous working fluid into the condensation circuit for condensation and reflux. The condensation circuit is used to condense the gaseous working fluid discharged from the two-phase cold plate into the first liquid working fluid, and input the condensed first liquid working fluid into the liquid inlet based on the working fluid pump.

[0047] Specifically, the two-phase cold plate also includes a volumetric flow sensor, which is used to collect the volumetric flow rate of the first liquid working fluid input from the inlet, so as to adjust the speed of the working fluid pump in the condensation circuit.

[0048] It should be noted that the condensation circuit refers to the circulation pipeline system set outside the cold plate, which is used to cool and condense the discharged gaseous working fluid back into a liquid state.

[0049] The liquid inlet is an interface located at the bottom of the cold plate, used to reintroduce the externally condensed liquid working fluid into the microchannel.

[0050] A working fluid pump is a power component installed in a condensation circuit to drive the flow of liquid working fluid and provide liquid supply pressure.

[0051] A volumetric flow sensor is a detection element installed on the liquid inlet path to measure the volumetric flow rate of the first liquid working fluid in real time.

[0052] In this embodiment, the gaseous working fluid discharged from the cold plate exhaust port enters the external condensation circuit and is condensed into a first liquid working fluid. Driven by a working fluid pump, this liquid working fluid is then fed back into the microchannel through the liquid inlet at the bottom of the cold plate. Simultaneously, a volumetric flow sensor collects the volumetric flow rate of the first liquid working fluid in real time and automatically adjusts the speed of the working fluid pump in the condensation circuit based on this flow rate value to control the liquid supply.

[0053] Understandably, this step constructs a complete closed loop of working fluid circulation, enabling the reuse of the working fluid; bottom liquid inlet ensures that the liquid working fluid preferentially wets the microchannels; and the flow sensor feedback is used to adjust the pump speed, dynamically matching changes in heat load, avoiding insufficient liquid supply (causing dry burning) or excessive liquid supply (increasing power consumption).

[0054] This application discloses a two-phase cooling method and related equipment, relating to the field of two-phase cooling technology. Compared to existing two-phase cooling solutions, which have significant limitations—immersion cooling requires direct immersion of the chip and server in the medium, imposing stringent requirements on compatibility, data center load-bearing capacity, and maintenance—traditional two-phase cold plates, while avoiding these problems, generally face challenges such as increased vapor resistance after vaporization and localized dry burning of the heat source substrate under high power. Furthermore, fin height is limited by liquid supply capacity, limiting heat exchange area expansion, requiring high liquid supply pressure and flow rate, and resulting in significant power consumption. In contrast, the two-phase cooling method described in this application… The cooling device includes a two-phase cold plate, which includes an evaporation chamber and a gas-liquid separation chamber. The evaporation chamber includes the space between each fin of the heat dissipation fins. There are microchannels at the bottom of the heat dissipation fins, and there are holes between the microchannels and the evaporation chamber. The microchannels are used to allow a first liquid working fluid to flow in, so as to supply liquid to the evaporation chamber through the holes. The evaporation chamber is used to partially convert the first liquid working fluid flowing in from the holes into a vapor working fluid to cool the heat source. The vapor working fluid and part of the first liquid working fluid are mixed to form a vapor-liquid two-phase mixed flow, which flows from the evaporation chamber to the gas-liquid separation chamber.

[0055] It is understandable that this application introduces liquid working fluid through microchannels at the bottom of the heat sink fins, so that the bottom of the heat sink fins is completely submerged, and then supplies liquid to the evaporation chamber through pre-set holes, so as to avoid dry burning due to lack of liquid and reduce exhaust resistance.

[0056] Based on the first embodiment of this application, in the second embodiment of this application, the content that is the same as or similar to that in Embodiment 1 above can be referred to the above description, and will not be repeated hereafter. Based on this, please refer to... Figure 4 , Figure 4This is a flowchart illustrating Embodiment 2 of the pump-driven two-phase cooling method of this application. This embodiment discloses a two-phase cooling method applied to a two-phase cooling device. The two-phase cooling method further includes steps S10 to S30: Step S10: Obtain the liquid density and first enthalpy of the first liquid working fluid input to the two-phase cold plate, obtain the dryness and second enthalpy of the gaseous working fluid output by the two-phase cold plate, and obtain the load heat dissipation of the heat source corresponding to the two-phase cold plate. It should be noted that the first enthalpy value refers to the heat content per unit mass of the first liquid working fluid when it enters the cold plate, reflecting its initial energy state.

[0057] The second enthalpy value refers to the heat content per unit mass of the gaseous working fluid output from the cold plate after heat exchange, reflecting its energy state when it is discharged.

[0058] Dryness fraction refers to the mass fraction of steam in a gaseous working fluid (between 0 and 1), and is used to describe the degree of vaporization of a two-phase mixture.

[0059] Load heat dissipation refers to the heat power currently generated by a heat source (such as a chip) that needs to be carried away by the two-phase cold plate.

[0060] In this embodiment, the density and first enthalpy of the liquid working fluid entering the cold plate are obtained through sensors or a system parameter table. Simultaneously, the dryness and second enthalpy of the vaporized working fluid at the cold plate outlet, as well as the actual heating power (load heat dissipation) of the current heat source, are also obtained. These data provide the basic input for the next calculation.

[0061] Understandably, this step involves collecting key thermodynamic parameters of the cooling system under its current operating conditions, providing an accurate data basis for dynamically calculating the required liquid supply flow rate.

[0062] Step S20: Calculate the theoretical volumetric flow rate based on the liquid density, the first enthalpy value, the dryness fraction, the second enthalpy value, the load heat dissipation, and a preset calculation formula; Specifically, the preset calculation formula is as follows: ,in, Indicates the heat dissipation of the load. Represents the theoretical volumetric flow rate. Indicates the density of the liquid. Indicates dryness. Indicates the second enthalpy value. This represents the first enthalpy value.

[0063] It should be noted that the preset calculation formula refers to the mathematical relationship established and solidified in the controller in advance, which is used to calculate the ideal liquid supply flow rate required to maintain heat exchange based on the principle of energy conservation, the load heat dissipation, liquid density and inlet and outlet enthalpy difference.

[0064] Theoretical volumetric flow rate refers to the volumetric flow rate of the first liquid working fluid required at the inlet of the cold plate under ideal heat exchange conditions in order to remove the heat dissipation of the current load.

[0065] In this embodiment, the liquid density, first enthalpy, second enthalpy, and load heat dissipation obtained in step S10 are substituted into a preset calculation formula to calculate the theoretical volumetric flow rate. The dryness information can be used to correct the value of the second enthalpy (e.g., to distinguish the actual enthalpy value in a pure gaseous state or a two-phase mixed state).

[0066] Understandably, this step calculates the ideal liquid supply required under the current heat load, providing a target value for subsequent adjustment of the working fluid pump speed, and ensuring that the liquid supply is precisely matched with the heat dissipation requirements.

[0067] Step S30: Based on the theoretical volumetric flow rate, adjust the rotational speed of the working fluid pump in the condensation circuit to adjust the flow rate of the first liquid working fluid input to the two-phase cold plate.

[0068] In this embodiment, the theoretical volumetric flow rate calculated in step S20 is used as the control target. By adjusting the speed of the working fluid pump in the condensation circuit, the output capacity of the pump is changed, thereby adjusting the actual flow rate of the first liquid working fluid input to the two-phase cold plate to make it approach the theoretical value.

[0069] Understandably, this step executes the flow regulation action, transforming the previous calculation results into physical control commands to ensure that the cold plate receives an appropriate liquid supply.

[0070] Specifically, the step of adjusting the speed of the working fluid pump in the condensation circuit based on the theoretical volumetric flow rate further includes steps S31 to S32: Step S31: Based on the volumetric flow sensor in the two-phase cold plate, collect the actual volumetric flow rate of the first liquid working fluid input from the inlet; It should be noted that the actual volumetric flow rate refers to the volumetric flow rate of the first liquid working fluid that actually flows into the cold plate at the current moment, as measured in real time by a volumetric flow sensor.

[0071] In this embodiment, a volumetric flow sensor installed near the liquid inlet (i.e., the condensate return inlet) is used to continuously collect the current actual flow rate of the liquid working fluid entering the cold plate and feed it back to the control system.

[0072] Understandably, obtaining real-time feedback from the system's operation is used to compare with theoretical target values, forming the basis of closed-loop control.

[0073] Step S32: Adjust the rotational speed of the working fluid pump in the condensation circuit based on the actual volumetric flow rate and the theoretical volumetric flow rate.

[0074] In this embodiment, the difference between the actual volumetric flow rate and the theoretical volumetric flow rate is compared. If the actual flow rate is too small, the speed of the working fluid pump is increased to increase the liquid supply; if the actual flow rate is too large, the speed of the working fluid pump is decreased to reduce the liquid supply, so that the actual flow rate dynamically follows the theoretical target value.

[0075] Understandably, this step completes closed-loop regulation, eliminates deviations, and ensures that the cold plate always works in the theoretically optimal liquid supply state, avoiding dry burning due to insufficient liquid supply or energy waste due to excessive liquid supply.

[0076] It should be noted that the above examples are only for understanding this application and do not constitute a limitation on the two-phase cooling method of this application. Any simple modifications based on this technical concept are within the protection scope of this application.

[0077] This application also provides a two-phase cooling device, please refer to... Figure 5 The two-phase cooling device includes: The acquisition module 10 is used to acquire the liquid density and first enthalpy value of the first liquid working fluid input to the two-phase cold plate, acquire the dryness and second enthalpy value of the gaseous working fluid output by the two-phase cold plate, and acquire the load heat dissipation corresponding to the heat source. The calculation module 20 is used to calculate the theoretical volumetric flow rate based on the liquid density, the first enthalpy value, the dryness fraction, the second enthalpy value, the load heat dissipation, and a preset calculation formula. Adjustment module 30 is used to adjust the rotational speed of the working fluid pump in the condensation circuit based on the theoretical volumetric flow rate, so as to adjust the flow rate of the first liquid working fluid input to the two-phase cold plate.

[0078] The two-phase cooling device provided in this application, employing the two-phase cooling method described in the above embodiments, can solve the technical problem of two-phase cooling. Compared with related technologies, the beneficial effects of the two-phase cooling device provided in this application are the same as those of the two-phase cooling method described in the above embodiments, and other technical features of the two-phase cooling device are the same as those disclosed in the methods of the above embodiments, and will not be repeated here.

[0079] This application provides a computer-readable storage medium having computer-readable program instructions (i.e., a computer program) stored thereon, the computer-readable program instructions being used to perform the two-phase cooling method described in the above embodiments.

[0080] The computer-readable storage medium provided in this application may be, for example, a USB flash drive, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems or devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0081] The aforementioned computer-readable storage medium may be included in a two-phase cooling device; or it may exist independently and not assembled into a two-phase cooling device.

[0082] The aforementioned computer-readable storage medium carries one or more programs that, when executed by the two-phase cooling device, cause the two-phase cooling device to: The liquid density and first enthalpy of the first liquid working fluid input to the two-phase cold plate are obtained, as are the dryness and second enthalpy of the gaseous working fluid output by the two-phase cold plate, and the load heat dissipation of the heat source corresponding to the two-phase cold plate are obtained. The theoretical volumetric flow rate is calculated based on the liquid density, the first enthalpy value, the dryness fraction, the second enthalpy value, the load heat dissipation, and a preset calculation formula. Based on the theoretical volumetric flow rate, the rotational speed of the working fluid pump in the condensation circuit is adjusted to adjust the flow rate of the first liquid working fluid input to the two-phase cold plate.

[0083] Computer program code for performing the operations of this application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a Local Area Network (LAN) or a Wide Area Network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0084] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0085] The modules described in the embodiments of this application can be implemented in software or hardware. The names of the modules do not necessarily limit the functionality of the unit itself.

[0086] The readable storage medium provided in this application is a computer-readable storage medium that stores computer-readable program instructions (i.e., a computer program) for executing the above-described two-phase cooling method, thereby solving the technical problem of two-phase cooling. Compared with related technologies, the beneficial effects of the computer-readable storage medium provided in this application are the same as those of the two-phase cooling method provided in the above embodiments, and will not be repeated here.

[0087] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the two-phase cooling method described above.

[0088] The computer program product provided in this application can solve the technical problem of two-phase cooling. Compared with related technologies, the beneficial effects of the computer program product provided in this application are the same as those of the two-phase cooling method provided in the above embodiments, and will not be repeated here.

[0089] The above description is only a part of the embodiments of this application and does not limit the scope of protection of this application. All equivalent structural transformations made under the technical concept of this application and using the content of this application specification and drawings, or direct / indirect applications in other related technical fields, are included in the scope of protection of this application.

Claims

1. A two-phase cooling device, characterized in that, The two-phase cooling device includes: A two-phase cooling plate includes an evaporation chamber and a gas-liquid separation chamber. The evaporation chamber includes the space between each fin of a heat dissipation fin. A microchannel exists at the bottom of the heat dissipation fin. There are holes between the microchannel and the evaporation chamber. The microchannel is used to allow a first liquid working fluid to flow in, so as to supply liquid to the evaporation chamber through the holes. The evaporation chamber is used to partially convert the first liquid working fluid flowing in from the holes into a vapor working fluid to cool the heat source. The vapor working fluid mixes with a portion of the first liquid working fluid to form a vapor-liquid two-phase mixed flow. The vapor-liquid two-phase mixed flow flows from the evaporation chamber to the gas-liquid separation chamber.

2. The two-phase cooling device as described in claim 1, characterized in that, The gas-liquid separation chamber includes a gas-liquid separation filter screen, which is used to separate the gas-liquid two-phase mixed flow flowing from the evaporation chamber into a second liquid working fluid and the gaseous working fluid. The second liquid working fluid flows back to the evaporation chamber to participate in heat exchange again, and the gaseous working fluid is discharged from the exhaust port.

3. The two-phase cooling device as described in claim 1, characterized in that, The two-phase cooling device further includes a condensation circuit, and the two-phase cold plate further includes a liquid inlet and an exhaust port. The liquid inlet is located at the bottom of the two-phase cold plate and is used to input the first liquid working fluid and input the first liquid working fluid into the microchannel. The exhaust port is located at the top of the two-phase cold plate and is used to discharge the gaseous working fluid into the condensation circuit for condensation and reflux. The condensation circuit is used to condense the gaseous working fluid discharged from the two-phase cold plate into the first liquid working fluid, and input the condensed first liquid working fluid into the liquid inlet based on the working fluid pump.

4. The two-phase cooling device as described in claim 1, characterized in that, The two-phase cold plate also includes a volumetric flow sensor, which is used to collect the volumetric flow rate of the first liquid working fluid input from the inlet, so as to adjust the speed of the working fluid pump in the condensation circuit.

5. A two-phase cooling method, characterized in that, Applied to the two-phase cooling device as described in any one of claims 1 to 4, the two-phase cooling method comprises: The liquid density and first enthalpy of the first liquid working fluid input to the two-phase cold plate are obtained, as are the dryness and second enthalpy of the gaseous working fluid output by the two-phase cold plate, and the load heat dissipation of the heat source corresponding to the two-phase cold plate are obtained. The theoretical volumetric flow rate is calculated based on the liquid density, the first enthalpy value, the dryness fraction, the second enthalpy value, the load heat dissipation, and a preset calculation formula. Based on the theoretical volumetric flow rate, the rotational speed of the working fluid pump in the condensation circuit is adjusted to adjust the flow rate of the first liquid working fluid input to the two-phase cold plate.

6. The two-phase cooling method as described in claim 5, characterized in that, The preset calculation formula is: ,in, Indicates the heat dissipation of the load. Represents the theoretical volumetric flow rate. Indicates the density of the liquid. Indicates dryness. Indicates the second enthalpy value. This represents the first enthalpy value.

7. The two-phase cooling method as described in claim 5, characterized in that, The step of adjusting the speed of the working fluid pump in the condensation circuit based on the theoretical volumetric flow rate further includes: Based on the volumetric flow sensor in the two-phase cold plate, the actual volumetric flow rate of the first liquid working fluid input from the inlet is collected; Based on the actual volumetric flow rate and the theoretical volumetric flow rate, adjust the speed of the working fluid pump in the condensation circuit.

8. A two-phase cooling device, characterized in that, The two-phase cooling device includes: The acquisition module is used to acquire the liquid density and first enthalpy value of the first liquid working fluid input to the two-phase cold plate, acquire the dryness and second enthalpy value of the gaseous working fluid output by the two-phase cold plate, and acquire the load heat dissipation corresponding to the heat source. The calculation module is used to calculate the theoretical volumetric flow rate based on the liquid density, the first enthalpy value, the dryness fraction, the second enthalpy value, the load heat dissipation, and a preset calculation formula. An adjustment module is used to adjust the rotational speed of the working fluid pump in the condensation circuit based on the theoretical volumetric flow rate, so as to adjust the flow rate of the first liquid working fluid input to the two-phase cold plate.

9. A storage medium, characterized in that, The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, it implements the steps of the two-phase cooling method as described in any one of claims 5 to 7.

10. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by a processor, implements the steps of the two-phase cooling method as described in any one of claims 5 to 7.

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