Shielding structure and electronic device

Abstract

Embodiments of the present application provide a shielding structure and an electronic device, and relate to the technical field of electronic devices. The electronic device comprises a circuit board, a shielding frame, a first shielding layer and at least one second shielding layer. The surface of the circuit board is provided with a plurality of electronic devices. The shielding frame is connected to the surface of the circuit board. The first shielding layer covers and is connected to the side of the shielding frame away from the circuit board, and the circuit board, the first shielding layer and the shielding frame enclose a first shielding cavity. The plurality of electronic devices are arranged in the first shielding cavity. The at least one second shielding layer is arranged in a stack with the first shielding layer; the at least one second shielding layer is arranged in the first shielding cavity and on the side of at least one electronic device away from the circuit board; and the second shielding layer is coupled to the circuit board. The embodiments of the present application can improve the shielding capability against electromagnetic interference without increasing the planar design space of the circuit board.

Description

[0001] This application is a divisional application. The original application has the application number 202410066099.9 and the original application date is January 16, 2024. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic equipment technology, and more particularly to a shielding structure and electronic equipment. Background Technology

[0003] With the rapid development of electronic technology, electronic devices have more and more functions, and the integration of electronic components in electronic devices is becoming higher and higher.

[0004] To ensure smooth data transmission in electronic devices, it is necessary to improve electromagnetic interference in the environment in which the electronic devices are located, such as reducing mutual interference between electronic devices.

[0005] With the increasing integration of electronic devices, the problem of interference between electronic devices in electronic devices urgently needs to be solved. Summary of the Invention

[0006] This application provides a shielding structure and an electronic device, the purpose of which is to improve the shielding capability against electromagnetic interference in electronic devices without increasing the planar design space.

[0007] To achieve the above objectives, the embodiments of this application adopt the following technical solutions: In a first aspect, an electronic device is provided, comprising a circuit board, a shielding frame, a first shielding layer, and at least one second shielding layer.

[0008] The circuit board has multiple electronic components mounted on its surface. A shielding frame is attached to the surface of the circuit board. A first shielding layer covers and is attached to the side of the shielding frame away from the circuit board, wherein the circuit board, the first shielding layer, and the shielding frame form a first shielding cavity; the multiple electronic components are located within the first shielding cavity. At least one second shielding layer is stacked on top of the first shielding layer; the at least one second shielding layer is located within the first shielding cavity, and the second shielding layer is located on the side of at least one electronic component away from the circuit board, and the orthographic projection of the first shielding layer on the circuit board at least partially overlaps with the orthographic projection of the at least one electronic component on the circuit board; the second shielding layer is coupled to the circuit board.

[0009] In the electronic device provided in this application embodiment, by providing at least one second shielding layer in the first shielding cavity, at least one smaller second shielding cavity can be formed in the first shielding cavity. On the one hand, increasing the smaller second shielding cavity can increase the cutoff frequency of the electronic device and improve the shielding effect of the electronic device. On the other hand, interference signals such as electromagnetic waves can be significantly attenuated during transmission in multiple cavities (including the first shielding cavity and the second shielding cavity), which can also effectively improve the shielding effect of the electronic device against interference signals such as electromagnetic waves.

[0010] Furthermore, the grounded and smaller-area second shielding layer has a better suppression effect on lower-frequency electromagnetic interference. That is, on the basis of the first shielding cavity shielding multiple electronic devices, the second shielding layer can additionally increase the shielding effect against low-frequency electromagnetic interference. As the integration of electronic devices becomes higher and higher, and the low-frequency interference signals generated by electronic devices become more and more numerous, the embodiments of this application can shield against low-frequency electromagnetic interference, which is conducive to achieving shielding against electromagnetic waves across the entire frequency band, thereby significantly improving the overall shielding effect of electronic devices against electromagnetic interference.

[0011] Furthermore, in the electronic device provided in this application embodiment, the technical means of improving the shielding effect of the electronic device by setting at least one second shielding layer does not increase the design space occupied by the second shielding layer in the direction parallel to the surface of the circuit board, thereby avoiding encroaching on the design space for setting other structures such as electronic devices on the circuit board, which is conducive to realizing the miniaturization design of the electronic device.

[0012] In one possible implementation of the first aspect, the second shielding layer includes a plurality of first sub-layers spaced apart in a first direction; the first direction is parallel to the circuit board; the first sub-layers are disposed on the side of at least one electronic device away from the circuit board, and the orthographic projection of the first sub-layers on the circuit board at least partially overlaps with the orthographic projection of at least one electronic device on the circuit board, and each first sub-layer is coupled to the circuit board.

[0013] By setting multiple first sub-layers, the second shielding cavity can be further divided into multiple smaller shielding cavities, thereby further increasing the cutoff frequency and optimizing the shielding effect of electronic devices.

[0014] In one possible implementation of the first aspect, at least two adjacent first sub-layers are electrically connected. This solves the resonance problem between two adjacent first sub-layers and improves the reliability of the electronic device.

[0015] In one possible implementation of the first aspect, at least a portion of the side of the second shielding layer is in contact with the shielding frame. By setting the second shielding layer in direct contact with the shielding frame, an electrical connection can be achieved between the second shielding layer and the circuit board through the shielding frame. That is, the second shielding layer can be grounded by directly contacting the shielding frame, eliminating the need for a separate grounding structure and reducing the manufacturing difficulty of electronic devices.

[0016] In one possible implementation of the first aspect, the electronic device further includes a first connecting portion. One end of the first connecting portion is electrically connected to the second shielding layer, and the other end is electrically connected to the circuit board. That is, the second shielding layer can be electrically connected to the circuit board through the first connecting portion to achieve grounding.

[0017] In one possible implementation of the first aspect, the electronic device further includes a second connecting part, one end of which is electrically connected to the second shielding layer, and the other end of which is electrically connected to the shielding frame. That is, the second shielding layer passes sequentially through the second connecting part and the shielding frame before being electrically connected to the circuit board to achieve grounding.

[0018] In one possible implementation of the first aspect, the second shielding layer includes at least one connection point, which is the portion of the second shielding layer that connects to the circuit board. If the second shielding layer includes multiple connection points, these points are located on both sides of the electronic device covered by the second shielding layer in a first direction; the first direction is parallel to the circuit board. This allows the second shielding cavity formed by the second shielding layer to cover the electronic device corresponding to the electromagnetic interference to be shielded.

[0019] In one possible implementation of the first aspect, the first shielding layer is spaced apart from at least one second shielding layer; and / or, in the case where the electronic device includes multiple second shielding layers, at least two adjacent second shielding layers are spaced apart. This makes the first shielding cavity and the second shielding cavity independent of each other, that is, each of the first and second shielding cavities independently performs its shielding function, maximizing the utilization of their respective shielding functions and further improving the overall electromagnetic shielding effect of the electronic device.

[0020] In one possible implementation of the first aspect, the electronic device further includes a first insulating layer. The first insulating layer is disposed between the second shielding layer and the first shielding layer.

[0021] That is, the first shielding layer and the second shielding layer are insulated from each other, so that the first shielding cavity and the second shielding cavity are independent of each other. In other words, the first shielding cavity and the second shielding cavity can each play a shielding role independently, thereby maximizing the utilization of their respective shielding functions and further improving the overall electromagnetic shielding effect of the electronic device.

[0022] In one possible implementation of the first aspect, where the shielding structure includes multiple second shielding layers, the electronic device further includes a fourth insulating layer disposed between at least two adjacent second shielding layers. The insulating effect of the fourth insulating layer between adjacent second shielding layers is similar to the effect of the first insulating layer in the aforementioned embodiments.

[0023] In one possible implementation of the first aspect, the electronic device further includes a third shielding layer and a second insulating layer. The third shielding layer is disposed on one side of the second shielding layer, and the third shielding layer and the second shielding layer at least partially overlap in a direction perpendicular to the circuit board; the third shielding layer is electrically connected to the circuit board. The second insulating layer is disposed between the second shielding layer and the third shielding layer.

[0024] By setting a third shielding layer, and having the second shielding layer capacitively coupled to the circuit board through the third shielding layer, the capacitance of the capacitor structure formed by the second and third shielding layers can be adjusted by changing the area of ​​the third shielding layer. This allows for frequency selection, enabling shielding and suppression of electromagnetic interference at specific frequencies. Consequently, electronic devices can be flexibly applied in various scenarios. In a possible implementation of the first aspect, where the second shielding layer comprises a plurality of first sublayers: each first sublayer at least partially overlaps with the third shielding layer in a direction perpendicular to the circuit board; or, the third shielding layer comprises a plurality of second sublayers spaced apart in a first direction, the first sublayers at least partially overlapping with corresponding second sublayers in a direction perpendicular to the circuit board; the first direction is parallel to the circuit board.

[0025] That is, multiple first sub-layers can each correspond to a separate second sub-layer, thus forming multiple independent capacitor structures, avoiding mutual interference during frequency selection, thereby further improving the flexibility of frequency selection in electronic devices.

[0026] In one possible implementation of the first aspect, the shielding frame includes a first bracket; the first bracket is arranged around a plurality of electronic devices; a first side of the first bracket is connected to the surface of a circuit board, and a second side of the first bracket is electrically connected to a first shielding layer; the first side and the second side are arranged opposite to each other. The first bracket has at least one first opening that extends through the first bracket in a direction parallel to the circuit board, and the first opening interrupts the first side of the first bracket.

[0027] That is, the surface of the first bracket facing the circuit board is not entirely in contact with the circuit board. Some of the surface is recessed in the direction away from the circuit board, forming the first window, thereby exposing part of the circuit board. This reduces the space occupied by the shielding frame on the circuit board, so that more components can be placed on the circuit board, which is conducive to the miniaturization of the circuit board and even electronic devices.

[0028] In one possible implementation of the first aspect, the shielding frame further includes a second bracket connected to a second side of the first bracket, and the first bracket is connected to the first shielding layer through the second bracket.

[0029] In one possible implementation of the first aspect, the ratio of the sum of the dimensions of at least one first window along the extension path of the first bracket to the dimensions along the extension path of the first bracket is greater than or equal to 0.7 and less than 1.

[0030] That is, the first window in the first bracket occupies 70% or more of the annular area enclosed by the first bracket, which greatly reduces the design space of the circuit board occupied by the shielding frame.

[0031] In one possible implementation of the first aspect, the area of ​​the second shielding layer is less than or equal to half the area of ​​the first shielding layer.

[0032] In one possible implementation of the first aspect, the conductivity of the second shielding layer is greater than that of the first shielding layer.

[0033] In one possible implementation of the first aspect, the conductivity of the second shielding layer is greater than or equal to 5 × 10⁻⁶. 5 S / m; and / or, the conductivity of the first shielding layer is 0.06 × 10⁻⁶. 5 S / m ~5×10 5 S / m.

[0034] That is, the material of the outer first shielding layer can be set as a high-loss material, and the material of the inner second shielding layer can be set as a high-conductivity material. On the one hand, the high-loss first shielding layer can suppress the occurrence of resonance problems. On the other hand, when the electromagnetic interference generated by the electronic device reaches the second shielding layer, the high-conductivity second shielding layer can block most of the electromagnetic interference. The remaining electromagnetic interference leaks into the first shielding layer and is dissipated during transmission in the high-loss first shielding layer. Under the combined effect of the high-loss first shielding layer and the high-conductivity second shielding layer, the shielding effect of electromagnetic interference in electronic devices is greatly improved.

[0035] In one possible implementation of the first aspect, the thickness of the first shielding layer and / or the thickness of the second shielding layer is less than or equal to 0.15 mm.

[0036] In one possible implementation of the first aspect, the thermal conductivity of the first shielding layer and / or the thermal conductivity of the second shielding layer are greater than or equal to 50 W / (m×K). This achieves both good electromagnetic shielding and good heat dissipation in the electronic device, thus achieving a balance between the two.

[0037] In one possible implementation of the first aspect, the material of the first shielding layer includes at least one of carbon nanotubes, graphene, carbon black, and two-dimensional transition metal carbides (nitrides). This results in the first shielding layer having both high electrical loss and good heat dissipation.

[0038] Secondly, a shielding structure is provided, including a first shielding layer and at least one second shielding layer. The at least one second shielding layer is stacked and connected to the first shielding layer; the area of ​​the second shielding layer is smaller than the area of ​​the first shielding layer.

[0039] In one embodiment, the shielding structure is applied to an electronic device, wherein the electronic device includes a circuit board and a shielding frame, the surface of the circuit board is provided with a plurality of electronic devices; the shielding frame is connected to the surface of the circuit board; a first shielding layer is used to cover and connect to the side of the shielding frame away from the circuit board, and the first shielding layer can be used to form a first shielding cavity with the circuit board and the shielding frame; the plurality of electronic devices are located within the first shielding cavity.

[0040] In one embodiment, at least one second shielding layer is disposed within the first shielding cavity.

[0041] In one embodiment, the second shielding layer is disposed on the side of at least one electronic device away from the circuit board, and the orthographic projection of the second shielding layer on the circuit board at least partially overlaps with the orthographic projection of the at least one electronic device on the circuit board; the second shielding layer is used for coupling connection with the circuit board. In a possible implementation of the second aspect, the second shielding layer includes a plurality of first sub-layers spaced apart in a first direction; the first direction is parallel to the first shielding layer; the first sub-layers are stacked and connected to the first shielding layer.

[0042] In a possible implementation of the second aspect, at least two adjacent first sublayers are electrically connected.

[0043] In a possible implementation of the second aspect, the area of ​​the second shielding layer is less than or equal to half the area of ​​the first shielding layer.

[0044] In a possible implementation of the second aspect, the conductivity of the second shielding layer is greater than that of the first shielding layer.

[0045] In a possible implementation of the second aspect, the conductivity of the second shielding layer is greater than or equal to 5 × 10⁻⁶. 5 S / m; and / or, the conductivity of the first shielding layer is 0.06 × 10⁻⁶. 5 S / m ~5×10 5 S / m.

[0046] In a possible implementation of the second aspect, the thickness of the first shielding layer and / or the thickness of the second shielding layer is less than or equal to 0.15 mm.

[0047] In a possible implementation of the second aspect, the thermal conductivity of the first shielding layer and / or the thermal conductivity of the second shielding layer is greater than or equal to 50 W / (m×K).

[0048] In a possible implementation of the second aspect, the material of the first shielding layer includes at least one of carbon nanotubes, graphene, carbon black, and two-dimensional transition metal carbides (nitrides).

[0049] The technical effects of the shielding structure provided in any of the second aspects can be seen in the technical effects of the electronic device design in the first aspect, and will not be repeated here. Attached Figure Description

[0050] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of this application; Figure 2 For along Figure 1 A cross-sectional view along section line A-A' in the diagram; Figure 3 Exploded view of the structure of the electronic device provided in the embodiments of this application; Figure 4 This is a structural assembly diagram of the electronic device provided in the embodiments of this application; Figure 5 For along Figure 4 A cross-sectional view of section line B-B' in the diagram; Figure 6 Another structural schematic diagram of the electronic device provided in the embodiments of this application; Figure 7 Another structural schematic diagram of the electronic device provided in the embodiments of this application; Figure 8 Another structural schematic diagram of the electronic device provided in the embodiments of this application; Figure 9 Another structural schematic diagram of the electronic device provided in the embodiments of this application; Figure 10 Another structural schematic diagram of the electronic device provided in the embodiments of this application; Figure 11 Another structural schematic diagram of the electronic device provided in the embodiments of this application; Figure 12 For along Figure 4 Another cross-sectional view of section line B-B' in the diagram; Figure 13 Another structural schematic diagram of the electronic device provided in the embodiments of this application; Figure 14 Another structural schematic diagram of the electronic device provided in the embodiments of this application; Figure 15Another structural schematic diagram of the electronic device provided in the embodiments of this application; Figure 16 For along Figure 13 A cross-sectional view along section line C-C' in the diagram; Figure 17 Another structural schematic diagram of the electronic device provided in the embodiments of this application; Figure 18 This is a schematic diagram of the orthographic projection of the first bracket in the shielding frame onto the circuit board. Detailed Implementation

[0051] The technical solutions in some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application are within the scope of protection of this application.

[0052] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0053] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "exemplary," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this application. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, a particular feature, structure, material, or characteristic may be included in any suitable manner in any one or more embodiments or examples.

[0054] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0055] Connection / linking: can refer to a mechanical or physical connection relationship, that is, A and B are connected or linked. It can mean that there are fastened components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and are difficult to separate. A and B can be fixed, detachable, or integrated; they can be directly connected or indirectly connected through an intermediate medium.

[0056] Coupling can be understood as direct coupling and / or indirect coupling. "Coupled connection" can be understood as a direct coupling connection and / or indirect coupling connection. Direct coupling, also known as "electrical connection," refers to components being in direct or indirect physical contact and electrically conductive. For example, in circuit construction, different components are connected through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB). "Indirect coupling" can be understood as two conductors conducting electricity through a gap or without contact. In one embodiment, indirect coupling can also be called capacitive coupling, for example, using the coupling between two conductive parts to form an equivalent capacitance to achieve signal transmission.

[0057] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0058] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0059] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0060] This document describes exemplary embodiments with reference to sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0061] Furthermore, the scenarios described in the embodiments of this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided in the embodiments of this application. As those skilled in the art will know, with the emergence of new scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0062] This application provides an electronic device, which can be, for example, a mobile phone, tablet computer, personal digital assistant (PDA), television, smart wearable products (e.g., smartwatches, smart bracelets), virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, rechargeable small household appliances (e.g., soymilk makers, robot vacuum cleaners), drones, radar, aerospace equipment, in-vehicle equipment, vehicles, and other different types of user equipment or terminal devices; the electronic device can also be a network device such as a base station. This application does not impose any special limitations on the specific form of the electronic device.

[0063] For ease of explanation, we will use a mobile phone as an example to illustrate the following. This should not be considered a specific limitation on the structural form of electronic devices. Figure 1 This is a schematic diagram of the structure of the electronic device 100 provided in the embodiments of this application. Figure 2 For along Figure 1 The cross-sectional view of section line A-A' in the diagram.

[0064] In some embodiments, such as Figure 1 As shown, the electronic device 100 may include a cover plate 1, a display screen 2, a mid-frame 3, and a rear shell 4. The display screen 2 has opposing light-emitting and non-light-emitting sides. The light-emitting side refers to the side where the display surface of the display screen 2 is located (e.g., ...). Figure 1 (Left side of the display screen 2), the non-light-emitting side refers to the side opposite to the light-emitting side (e.g., the side opposite to the light-emitting side). Figure 1(Right side of the display screen 2). The aforementioned cover plate 1 is located on the light-emitting side of the display screen 2 and is attached to the display screen 2. The middle frame 3 and the rear shell 4 are located on the non-light-emitting side of the display screen 2, and the rear shell 4 and the display screen 2 are located on both sides of the middle frame 3, and the middle frame 3 and the display screen 2 are located inside the rear shell 4.

[0065] For example, see Figure 1 The aforementioned middle frame 3 may include a support plate and a border around the support plate. The electronic device 100 may also include structures such as a battery and a camera disposed on the support plate.

[0066] like Figure 1 As shown, the electronic device 100 may also include a circuit board 5.

[0067] For example, see Figure 1 The circuit board 5 can be located on the non-light-emitting side of the display screen 2. For example, the circuit board 5 can be located between the carrier plate and the back cover 4.

[0068] like Figure 1 and Figure 2 As shown, the circuit board 5 has multiple electronic components 6.

[0069] For example, multiple electronic devices 6 can be disposed on one side of the circuit board 5, or electronic devices 6 can be disposed on both sides of the circuit board 5. Figure 2 The illustration only uses the example of setting electronic device 6 on one side of circuit board 5, and does not impose any restrictions on the specific placement of electronic device 6.

[0070] For example, circuit board 5 includes a main circuit board and a sub-circuit board. Multiple electronic devices 6 are disposed on the main circuit board and / or the sub-circuit board.

[0071] For example, the main circuit board in circuit board 5 can be used to integrate electronic devices 6 such as control chips. These control chips include, but are not limited to, system-on-chip (SOC), charging management chips, power management units (PMUs), radio frequency (RF) chips, display chips, application processors (APs), double data rate synchronous dynamic random access memory (DDR), and universal flash storage (UFS). The RF chip can also be called a radio frequency power amplifier (RF PA). For example, the main circuit board is electrically connected to the display screen 2, and the main circuit board is used to control the display screen 2 to display images or videos.

[0072] The main circuit board can be a printed circuit board (PCB). Of course, the main circuit board can also be a flexible circuit board, a rigid-flex circuit board, etc. Optionally, the main circuit board can be fixed between the middle frame 3 and the rear shell 4 by means of threaded connection, snap-fit, adhesive, etc.

[0073] For example, the sub-circuit board of circuit board 5 can integrate electronic devices 6 such as a universal serial bus (USB) device. This USB device can be a USB Type-C interface device, a USB Type-A interface device, a USB Type-Micro-B interface device, or a USB Type-B interface device. A port is provided on the frame corresponding to the USB device's location. Accessories such as chargers, headphones, and data cables can be electrically connected to the USB device via this port to achieve power, signal, and data transmission.

[0074] The secondary circuit board can be a printed circuit board. Of course, the primary circuit board can also be a flexible circuit board, a rigid-flex circuit board, etc. The secondary circuit board can also be fixed between the middle frame 3 and the rear shell 4 by means of threaded connection, snap-fit, adhesive bonding, or soldering. The secondary circuit board and the primary circuit board are spaced apart, and the two are electrically connected.

[0075] During the operation of electronic device 100, electronic components 6 on circuit board 5 (e.g., on main circuit board and / or sub-circuit board) generate a large amount of electromagnetic interference (e.g., ... Figure 2 As indicated by the arrow in the diagram), this affects the normal operation of other structures of the electronic device 100 (such as the display screen 2). Simultaneously, a significant amount of electromagnetic interference (such as...) exists in the surrounding environment of the electronic device 6. Figure 2 The lightning bolt icon in the image can easily affect electronic device 6, resulting in poor performance of electronic device 6 (for example, signal transmission deviation may occur), or even cause electronic device 100 to malfunction.

[0076] In order to ensure the normal operation of electronic devices 6 in electronic device 100, the aforementioned electromagnetic interference needs to be shielded by a shielding structure.

[0077] In some embodiments, the shielding structure includes a shielding frame and a shielding cover. The shielding frame is soldered onto the circuit board 5, and the side of the shielding frame away from the circuit board 5 is fastened to the shielding cover, thereby forming a shielding cavity with Faraday shielding effect.

[0078] This shielding structure is used to cover the electronic devices 6 on the circuit board 5. For example, all the electronic devices 6 on the same side of the circuit board 5 are covered in the shielding cavity. This shields against electromagnetic interference from the external environment, preventing external electromagnetic interference from being transmitted to the electronic devices 6 covered in the shielding cavity, thus avoiding any impact on the normal operation of the electronic devices 6. On the other hand, it shields against the electromagnetic interference generated by the electronic devices 6, blocking the electromagnetic interference generated by the electronic devices 6 covered in the shielding cavity, thus avoiding any impact on the functionality of the external devices.

[0079] However, as the integration of electronic devices 6 gradually increases, the electromagnetic interference generated by electronic devices 6 on circuit board 5 gradually increases. With the development of electronic technology, the sources of electromagnetic interference (i.e. noise sources) in the external environment of electronic devices 6 also gradually increase, and the frequencies of electromagnetic waves from the two sources mentioned above also gradually diversify, resulting in more and more electromagnetic interference leaking from the shielding cavity. In this embodiment, the shielding effect of the shielding structure gradually becomes difficult to meet the shielding requirements, reducing the reliability of electronic device 100.

[0080] To solve the above technical problems, such as Figure 3 As shown, this application provides a shielding structure 200, including a first shielding layer 10 and at least one second shielding layer 20.

[0081] like Figure 3 or Figure 4 As shown, at least one second shielding layer 20 is stacked and connected to the first shielding layer 10; wherein the area of ​​the second shielding layer 20 is smaller than the area of ​​the first shielding layer 10.

[0082] In one embodiment, the shielding structure 200 provided in this application can be applied to an electronic device 100. The electronic device 100 includes a circuit board 5 and a shielding frame 40. The surface of the circuit board 5 is provided with a plurality of electronic devices 6; the shielding frame 40 is connected to the surface of the circuit board 5.

[0083] The first shielding layer 10 of the shielding structure 200 can be used to cover and connect to the side of the shielding frame 40 away from the circuit board 5, and the first shielding layer 10 can be used to form a first shielding cavity with the circuit board 5 and the shielding frame 40; a plurality of electronic devices 6 are located in the first shielding cavity Q1.

[0084] At least one second shielding layer 20 of the shielding structure 200 is disposed within the first shielding cavity Q1.

[0085] In one embodiment, a second shielding layer 20 is disposed on the side of at least one electronic device 6 away from the circuit board 5, and the orthographic projection of the second shielding layer 20 on the circuit board 5 at least partially overlaps with the orthographic projection of the at least one electronic device 6 on the circuit board 5. The second shielding layer 20 is used for coupling connection with the circuit board 5.

[0086] This application also provides an electronic device 100.

[0087] Figure 3 This is an exploded view of the structure of the electronic device 100 provided in the embodiments of this application. Figure 4 This is a structural assembly diagram of an electronic device 100 provided in an embodiment of this application.

[0088] like Figure 3 and Figure 4 As shown, the electronic device 100 includes a shielding frame 40, a first shielding layer 10, and at least one second shielding layer 20.

[0089] The shielding frame 40, the first shielding layer 10, and at least one second shielding layer 20 are used to cover the surface of the circuit board 5 and cover multiple electronic devices 6 on the circuit board 5.

[0090] See Figure 3 and Figure 4 The shielding frame 40 is connected to the surface of the circuit board 5.

[0091] For example, see Figure 3 and Figure 4 The shielding frame 40 is roughly ring-shaped (i.e., a hollow frame structure) to surround multiple electronic devices 6, thereby reducing the probability that electromagnetic interference generated by the electronic devices 6 will leak out in a direction parallel to the circuit board 5.

[0092] For example, the shielding frame 40 can be circular, square, or other shapes of rings depending on the design of the circuit board 5. This application does not limit the shape of the ring.

[0093] Figure 5 For along Figure 4 A cross-sectional view of section line B-B' in the diagram.

[0094] For example, the shielding frame 40 can be soldered to the surface of the circuit board 5, or it can be fixed to the circuit board 5 by other connection methods, such as snap-fit, bolt connection or adhesive, etc. This application does not limit this.

[0095] It is understood that the shielding frame 40 is electrically connected to the circuit board 5, for example, to a location on the circuit board 5 where no electronic components or signal lines are installed, thereby facilitating the grounding of the shielding frame 40, the first shielding layer 10, and at least one second shielding layer 20, thereby eliminating electromagnetic interference and realizing the electromagnetic shielding and electrostatic discharge functions of the electronic device 100.

[0096] For example, the material of the shielding frame 40 may include a conductive material, such as a metal material, such as copper or silver, or a material such as nickel silver or stainless steel.

[0097] For example, see Figure 5 The shielding frame 40 may include a first bracket 41 and a second bracket 42.

[0098] The first bracket 41 is used to fix the circuit board 5, and the second bracket 42 is used to fix the first shielding layer 10.

[0099] For example, both the first bracket 41 and the second bracket 42 can be arranged in a ring.

[0100] For example, see Figure 5 The plane containing the first support 41 intersects with the plane containing the second support 42, for example, they are perpendicular to each other. See, for example... Figure 5 The first bracket 41 can be perpendicular to the surface of the circuit board 5 to provide a certain height for the electronic device 100, so as to avoid direct contact between the first shielding layer 10 and the electronic device 6. The second bracket 42 can be parallel to the surface of the circuit board 5, so as to facilitate the connection between the shielding frame 40 and the first shielding layer 10 (for example, it can be an electrical connection).

[0101] For example, the width of the second bracket 42 may be greater than or equal to 0.4 mm.

[0102] For example, see Figure 3 and Figure 4 The shielding frame 40 may also include an intermediate support 43, which may be disposed between two adjacent electronic devices 6 in order to achieve mutual shielding between the two adjacent electronic devices 6.

[0103] For example, the intermediate support 43 can be arranged on the same layer as the second support 42.

[0104] For example, the first bracket 41, the second bracket 42 and the intermediate bracket 43 can be installed as a single unit.

[0105] See Figure 3 , Figure 4 and Figure 5 As shown, the first shielding layer 10 covers and connects to the side of the shielding frame 40 away from the circuit board 5. That is, the first shielding layer 10 is fastened to an opening on one side of the shielding frame 40, so that the first shielding layer 10, the circuit board 5, and the shielding frame 40 form a first shielding cavity Q1 (see reference). Figure 5 ).

[0106] See Figure 4 and Figure 5Multiple electronic devices 6 are located within the first shielding cavity Q1 formed by the shielding frame 40 and the first shielding layer 10, thereby blocking the electromagnetic interference generated by the multiple electronic devices 6 within the first shielding cavity Q1, and also blocking the electromagnetic interference from the external environment from being conducted to the multiple electronic devices 6, thus achieving an electromagnetic shielding effect.

[0107] In addition, the first shielding cavity Q1 can also eliminate static electricity in the electronic device 100, thereby improving the reliability of the electronic device 100.

[0108] It is understandable that, with the support of the shielding frame 40, there is a gap between the first shielding layer 10 and the electronic device 6, thereby avoiding short circuits and other problems caused by the first shielding layer 10 coming into contact with the electronic device 6.

[0109] For example, an insulating layer can also be provided between the first shielding layer 10 and the electronic device 6, which can also prevent electrical connection between the two. For example, thermally conductive adhesive (not shown in the figure) can be provided between the first shielding layer 10 and the electronic device 6 to achieve heat dissipation while achieving insulation between the two.

[0110] For example, see Figure 4 The shape of the first shielding layer 10 can match the shape of the shielding frame 40 so that the two can be connected.

[0111] For example, the first shielding layer 10 and the shielding frame 40 can be integrally formed, or they can be assembled together. For example, the edge of the first shielding layer 10 can be provided with flaps (not shown in the figure) so as to be inserted into the shielding frame 40.

[0112] See Figure 3 , Figure 4 and Figure 5 As shown, at least one second shielding layer 20 is stacked with the first shielding layer 10.

[0113] It is understood that, in the embodiments of this application, the electronic device 100 may include one or more second shielding layers 20, for example, see [reference]. Figure 5 The electronic device 100 may include a second shielding layer 20, which is stacked with the first shielding layer 10, or, for example, see the following description. Figure 12 The electronic device 100 may include multiple layers of second shielding 20 ( Figure 12 (Taking two layers of second shielding layer 20 as an example for illustration), the multiple layers of second shielding layer 20 are stacked together and are stacked together with the first shielding layer 10.

[0114] See Figure 3 , Figure 4 and Figure 5The at least one second shielding layer 20 is disposed in the first shielding cavity Q1, that is, the area of ​​the second shielding layer 20 is smaller than the area of ​​the first shielding layer 10, and the second shielding layer 20 is disposed on the side of the first shielding layer 10 closer to the circuit board 5.

[0115] For example, see Figure 4 The area of ​​the second shielding layer 20 is less than half the area of ​​the first shielding layer 10.

[0116] For example, the ratio of the area of ​​the second shielding layer 20 to the area of ​​the first shielding layer 10 can be 0.0625 to 0.5. For example, the ratio can be 0.0625, 0.1, 0.175, or 0.5. For example, both the first shielding layer 10 and the second shielding layer 20 can be squares, and the side length of the first shielding layer 10 can be 4 cm, while the side length of the second shielding layer 20 can be 1 cm.

[0117] For example, the second shielding layer 20 may be spaced apart from and stacked with the first shielding layer 10.

[0118] For example, the second shielding layer 20 may have an air gap with the first shielding layer 10.

[0119] Alternatively, for example, the second shielding layer 20 may be spaced apart from the first shielding layer 10 by an insulating material or other material.

[0120] For example, the second shielding layer 20 may be connected to the first shielding layer 10.

[0121] For example, adhesive can be applied between the second shielding layer 20 and the first shielding layer 10 to achieve the connection between the two, or the two can be integrated as one piece, or the two can be directly bonded together. This application does not limit this.

[0122] See Figure 3 , Figure 4 and Figure 5 The second shielding layer 20 is also disposed on the side of at least one electronic device 6 away from the circuit board 5, and the orthographic projection of the second shielding layer 20 on the circuit board 5 at least partially overlaps with the orthographic projection of the at least one electronic device 6 on the circuit board 5.

[0123] That is, when the circuit board 5 includes multiple electronic devices 6, the second shielding layer 20 can cover one or more of the multiple electronic devices 6. Alternatively, it can be understood that the second shielding layer 20 is disposed above the surface of at least one electronic device 6 that is away from the circuit board 5. For example, the second shielding layer 20 can be suspended on the surface of the electronic device 6 that is away from the circuit board 5, or it can be insulatingly attached to the surface of the electronic device 6 that is away from the circuit board 5.

[0124] For example, the second shielding layer 20 can cover (including suspended coverage or insulating attachment coverage) the electronic device 6 with strong electromagnetic interference among the multiple electronic devices 6. For example, the second shielding layer 20 can cover the surface of at least one of the system-on-chip (SOC), power management unit (PMU), charging chip and radio frequency chip that is away from the circuit board 5.

[0125] It is understandable that the area of ​​the second shielding layer 20 can depend on the area and number of electronic devices 6 it is to cover, and the shape of the second shielding layer 20 also depends on the placement of the electronic devices 6 it is to cover.

[0126] For example, the second shielding layer 20 can be applied to the surface-insulated electronic device 6 by spraying, electroplating or sputtering, or it can be adsorbed onto the surface-insulated electronic device 6 by negative pressure suction, or it can be suspended or stacked on the electronic device 6, or the second shielding layer 20 can be integrally applied with the first shielding layer 10, and the area of ​​the second shielding layer 20 can be cut so that it is smaller than the area of ​​the first shielding layer 10.

[0127] For example, the at least one second shielding layer 20 is insulated from the electronic device 6.

[0128] For example, the at least one second shielding layer 20 can be spaced apart from the electronic device 6. For example, the at least one second shielding layer 20 can be connected to the first shielding layer 10, so that the second shielding layer 20 can be suspended by fixing it to the first shielding layer 10, avoiding direct contact between the second shielding layer 20 and the electronic device 6, which could lead to short circuits and other problems.

[0129] Alternatively, for example, the at least one second shielding layer 20 can be insulated from the electronic device 6 by providing an insulating layer.

[0130] See Figure 5 The second shielding layer 20 disposed between the circuit board 5 and the first shielding layer 10 can form at least one smaller second shielding cavity Q2 within the first shielding cavity Q1 (e.g., Figure 12 Two second shielding cavities Q2 are formed in the middle, and the second shielding cavity Q2 surrounds a portion of the electronic devices 6, thereby realizing electromagnetic shielding or electrostatic dissipation of the portion of electronic devices 6.

[0131] See Figure 5The second shielding layer 20 is coupled to the circuit board 5. For example, the second shielding layer 20 and the circuit board 5 are directly coupled, such as by electrical connection, or they can be indirectly coupled, such as by capacitive coupling, so as to ground the second shielding layer 20 in order to dissipate the interference electromagnetic or static electricity in the second shielding cavity Q2.

[0132] In the electronic device 100 provided in this application embodiment, by providing at least one second shielding layer 20 in the first shielding cavity Q1, at least one smaller second shielding cavity Q2 can be formed in the first shielding cavity Q1. On the one hand, increasing the smaller second shielding cavity Q2 can increase the cutoff frequency of the electronic device 100 and improve the shielding effect of the electronic device 100. On the other hand, interference signals such as electromagnetic waves can be significantly attenuated during transmission in multiple cavities (including the first shielding cavity Q1 and the second shielding cavity Q2), which can also effectively improve the shielding effect of the electronic device 100 against interference signals such as electromagnetic waves.

[0133] Furthermore, the grounded and relatively small second shielding layer 20 has a better suppression effect on lower frequency electromagnetic interference. That is, on the basis of the first shielding cavity Q1 shielding the multiple electronic devices 6, the second shielding layer 20 can additionally increase the shielding effect on low frequency electromagnetic interference. As the integration of electronic devices 6 becomes higher and higher and the low frequency interference signals generated by electronic devices 100 increase, the embodiments of this application can shield low frequency electromagnetic interference, which is conducive to achieving shielding of electromagnetic waves across the entire frequency band, thereby significantly improving the overall shielding effect of electronic devices 100 against electromagnetic interference.

[0134] In addition, see Figure 4 and Figure 5 In the electronic device 100 provided in this application embodiment, the technical means of improving the shielding effect of the electronic device 100 by setting at least one second shielding layer 20 does not increase the design space occupied by the second shielding layer 20 in the direction parallel to the surface of the circuit board 5, thereby avoiding squeezing the design space for setting other structures such as electronic devices 6 on the circuit board 5, which is conducive to realizing the miniaturization design of the electronic device 100.

[0135] In summary, the electronic device 100 provided in this application embodiment can enhance the shielding effect of the electronic device 100 without increasing the design space of the electronic device 100, which is conducive to the continued evolution of electronic technology.

[0136] The aforementioned second shielding layer 20 can be electrically connected to the circuit board 5 in various ways. That is, the second shielding layer 20 can be grounded in various ways. The following will provide an exemplary description of the grounding methods of the second shielding layer 20 using some embodiments.

[0137] Figures 6-11 These are some structural schematic diagrams of the electronic device 100 provided in the embodiments of this application. It can be understood that, in order to avoid obstruction, Figures 6-11 The fact that the first shielding layer 10 is not shown does not mean that the first shielding layer 10 does not exist.

[0138] In some embodiments, such as Figure 6 As shown, at least a portion of the side of the second shielding layer 20 is in contact with the shielding frame 40.

[0139] For example, see Figure 6 The side of the second shielding layer 20 closest to the shielding frame 40 is in contact with the shielding frame 40. For example, see... Figure 5 and Figure 6 The right side of the second shielding layer 20 can contact the shielding frame 40.

[0140] "Contact" can be understood as the second shielding layer 20 abutting against the shielding frame 40, or it can be understood as the side of the second shielding layer 20 being fixedly connected to the shielding frame 40, for example, by welding or other connection methods.

[0141] By setting the second shielding layer 20 to be in direct contact with the shielding frame 40, the second shielding layer 20 and the circuit board 5 can be electrically connected through the shielding frame 40. That is, the second shielding layer 20 can be grounded by directly contacting the shielding frame 40, without the need to design a separate grounding structure, which reduces the manufacturing difficulty of the electronic device 100.

[0142] In some embodiments, such as Figure 7 As shown, the electronic device 100 may also include a first connecting part 51.

[0143] See Figure 7 One end of the first connecting part 51 is electrically connected to the second shielding layer 20, and the other end is electrically connected to the circuit board 5.

[0144] That is, the second shielding layer 20 can be electrically connected to the circuit board 5 through the first connection part 51 in order to achieve grounding.

[0145] For example, the first connecting portion 51 can be solder, conductive adhesive, or it can be a metal flap integrally formed with the second shielding layer 20, or it can be a wire electrically connecting the second shielding layer 20 to the circuit board 5. That is, the first connecting portion 51 can be any structure that can realize the electrical connection between the second shielding layer 20 and the circuit board 5. The embodiments of this application do not limit the specific structure, material, etc. of the first connecting portion 51.

[0146] In some embodiments, such as Figure 8 and Figure 9 As shown, the electronic device 100 may also include a second connection portion 52.

[0147] See Figure 8 and Figure 9 One end of the second connecting part 52 is electrically connected to the second shielding layer 20, and the other end is electrically connected to the shielding frame 40.

[0148] That is, the second shielding layer 20 is connected to the shielding frame 40 through the second connecting part 52, and is electrically connected to the circuit board 5 through the shielding frame 40. In other words, the second shielding layer 20 is connected to the circuit board 5 and grounded after passing through the second connecting part 52 and the shielding frame 40 in sequence.

[0149] For example, the structure or material of the second connecting portion 52 can be referred to the description of the first connecting portion 51 in the foregoing embodiments, and will not be repeated here.

[0150] For example, see Figure 8 and Figure 9 The location and design of the second connecting part 52 can be changed (the same applies to the first connecting part 51), for example, see [reference]. Figure 8 The electronic device 100 may include two second connecting portions 52, and the two second connecting portions 52 may be disposed above and below the left side of the second shielding layer 20, or, for example, see [reference missing]. Figure 9 The second connecting part 52 can be electrically connected to the entire side of the left side of the second shielding layer 20.

[0151] For example, the location of the second connection part 52 can be changed according to the frequency of electromagnetic interference generated by the electronic device 6 covered by the second shielding layer 20, thereby controlling the size and shape of the second shielding cavity Q2 formed by the second shielding layer 20, the second connection part 52 and the shielding frame 40, so as to shield electromagnetic interference in a specific range (the location of the first connection part 51 is similar).

[0152] It is understood that the embodiments of this application do not limit the location and shape of the first connecting part 51 and the second connecting part 52. Any arrangement of the first connecting part 51 and the second connecting part 52 that enables the second shielding layer 20 to be grounded is within the protection scope of the embodiments of this application.

[0153] In some embodiments, the electrical connection between the second shielding layer 20 and the circuit board 5 may include any one or a combination of the aforementioned connection methods. For example, see... Figure 6 The second shielding layer 20 can be grounded simply by contacting the shielding frame 40 on its right side. Or, for example, see [link to relevant documentation]. Figure 9The left side of the second shielding layer 20 can be electrically connected to the shielding frame 40 through the second connecting part 52, and the right side can be directly in contact with the shielding frame 40.

[0154] In some embodiments, the second shielding layer 20 includes at least one connection point, which is the portion of the second shielding layer 20 that connects to the circuit board 5. That is, the connection point is the grounding location of the second shielding layer 20, for example, see [reference needed]. Figure 5 The connection point is the right side of the second shielding layer 20, for example, see [reference]. Figure 6 The connection points include the right side of the second shielding layer 20 and the position on the left side where it connects to the first connection part 51.

[0155] In the case where the second shielding layer 20 includes multiple connection points, the multiple connection points are located on both sides of the electronic device 6 covered by the second shielding layer 20 in the first direction.

[0156] The first direction is any direction parallel to the circuit board 5.

[0157] For example, see Figure 9 The left side of the second shielding layer 20 is connected to the shielding frame 40 via the second connecting part 52 and then grounded, and the right side is in contact with the shielding frame 40 and then grounded. That is, the left side and the right side of the second shielding layer 20 serve as connection points, and the two connection points are arranged opposite to each other, so that the second shielding cavity Q2 formed by the second shielding layer 20 can cover the electronic device 6 corresponding to the electromagnetic interference to be shielded.

[0158] In some embodiments, such as Figure 10 As shown, each second shielding layer 20 includes a plurality of first sub-layers 21 spaced apart in a first direction. The first sub-layers 21 are disposed on the side of at least one electronic device 6 away from the circuit board 5, and the orthographic projection of the first sub-layers 21 on the circuit board 5 at least partially overlaps with the orthographic projection of at least one electronic device 6 on the circuit board 5.

[0159] For example, the first sublayer 21 is suspended on the surface of the electronic device 6 away from the circuit board 5, or is insulatingly attached to the surface of the electronic device 6 away from the circuit board 5, so as to cover the at least one electronic device 6.

[0160] See Figure 10 Each first sublayer 21 is coupled to the circuit board 5. For example, each first sublayer 21 is electrically connected (directly coupled) or indirectly coupled to the circuit board 5 to ground the first sublayer 21.

[0161] By setting multiple first sub-layers 21, the second shielding cavity Q2 can be further divided into multiple smaller shielding cavities, thereby further improving the cutoff frequency and optimizing the shielding effect of the electronic device 100.

[0162] For example, the areas of different first sub-layers 21 can be different, so that electromagnetic interference of different frequencies can be shielded respectively, and electromagnetic interference of some frequency bands can be prevented from leaking.

[0163] For example, the size of the first sublayer 21 or the grounding position of the first sublayer 21 can be adjusted according to the frequency of electromagnetic interference generated by the electronic device 6 covered by the first sublayer 21.

[0164] For example, the connection method between the first sub-layer 21 and the circuit board 5 can be referred to the description of the connection method between the second shielding layer 20 and the circuit board 5 in the foregoing embodiments. For example, the first sub-layer 21 can also be grounded by contacting the shielding frame 40, or it can be grounded through the first connection part 51 and / or the second connection part 52, which will not be elaborated here.

[0165] For example, the spacing between two adjacent first sub-layers 21 can be less than or equal to 1 cm.

[0166] In some embodiments, different first sublayers 21 can be grounded independently of each other, for example, see [reference]. Figure 10 The two first sub-layers 21 can be connected to the shielding frame 40 and grounded through different second connection parts 52, thereby forming independent shielding cavities and enhancing the shielding effect against electromagnetic interference.

[0167] In some embodiments, such as Figure 11 As shown, two adjacent first sub-layers 21 can be electrically connected. For example, see [reference needed]. Figure 11 The two adjacent first sub-layers 21 can be electrically connected through the third connecting part 53.

[0168] There may be a resonance problem between two adjacent first sub-layers 21. This resonance problem can be solved by setting an electrical connection between the two adjacent first sub-layers 21, thereby improving the reliability of the electronic device 100.

[0169] For example, the aforementioned resonance problem can also be solved in other ways. For instance, the spacing between two adjacent first sub-layers 21 can be increased to reduce interference between them and avoid resonance. Alternatively, for example, the grounding point of the first sub-layer 21 can be adjusted so that the frequencies of electromagnetic interference shielded by different first sub-layers 21 are matched, which can also avoid the resonance problem.

[0170] For example, see Figure 11After different first sublayers 21 are electrically connected, grounding can be achieved through one of the first sublayers 21. That is, the grounding method of the first sublayer 21 can be flexibly changed according to the application scenario, and the embodiments of this application do not limit it.

[0171] Figure 12 For along Figure 4 Another cross-sectional view of section line B-B' in the diagram.

[0172] In some embodiments, such as Figure 12 As shown, when the electronic device 100 includes multiple layers of second shielding layers 20, there is an electrical connection between two adjacent layers of second shielding layers 20.

[0173] Alternatively, you can refer to Figure 5 The first shielding layer 10 is electrically connected to the second shielding layer 20 that is closest to the first shielding layer 10.

[0174] For example, electrical connections can be achieved by directly bonding multiple layers of the second shielding layer 20 together, and by directly bonding the second shielding layer 20 to the first shielding layer 10. Alternatively, electrical connections can be achieved through conductive adhesive, conductive paste, potting compound, or electroplating.

[0175] In this embodiment, while increasing the shielding cavity to enhance the shielding effect of the electronic device 100, the manufacturing process of the electronic device 100 can be simplified, without the need to add a process step to prepare the insulating layer, thus reducing the manufacturing difficulty of the electronic device 100.

[0176] In other embodiments, when the electronic device 100 includes multiple layers of second shielding layers 20, at least two adjacent layers of second shielding layers 20 are spaced apart. For example, air or insulating material may be spaced between them.

[0177] Alternatively, the first shielding layer 10 may be spaced apart from at least one second shielding layer 20 (e.g., the second shielding layer 20 closest to the first shielding layer 10). For example, air or insulating material may be spaced between them.

[0178] By spacing the first shielding layer 10 and the second shielding layer 20, or by spacing adjacent second shielding layers 20, the first shielding cavity Q1 and the second shielding cavity Q2 become independent of each other. That is, the first shielding cavity Q1 and the second shielding cavity Q2 each play a shielding role independently, thereby maximizing the utilization of their respective shielding functions and further improving the overall electromagnetic shielding effect of the electronic device 1000.

[0179] In some embodiments, such as Figure 12 As shown, the electronic device 100 may also include a first insulating layer 61.

[0180] See Figure 12 The first insulating layer 61 can be disposed between the second shielding layer 20 and the first shielding layer 10.

[0181] That is, the first shielding layer 10 and the second shielding layer 20 are insulated and spaced apart by the first insulating layer 61, so that the first shielding cavity Q1 and the second shielding cavity Q2 are independent of each other, that is, the first shielding cavity Q1 and the second shielding cavity Q2 each play a shielding role independently, thereby maximizing the utilization of their respective shielding functions and further improving the overall electromagnetic shielding effect of the electronic device 100.

[0182] For example, when the first shielding layer 10 and the second shielding layer 20 are insulated from each other, after the electromagnetic wave is conducted to the second shielding layer 20, most of the electromagnetic wave will be directly transmitted along the second shielding layer 20 to the grounding position and dissipate. Since the first shielding layer 10 and the second shielding layer 20 are insulated from each other, it is more difficult for the electromagnetic wave to be conducted from the second shielding layer 20 to the first shielding layer 10, thereby reducing electromagnetic leakage and improving the electromagnetic shielding effect.

[0183] In some embodiments, such as Figure 12 As shown, when the electronic device 100 includes multiple layers of second shielding layers 20, the electronic device 100 may also include a fourth insulating layer 64.

[0184] The fourth insulating layer 64 is disposed between at least two adjacent second shielding layers 20. Similar to the description in the previous embodiment, this also allows the multiple second shielding cavities Q2 formed by the multiple second shielding layers 20 to be independent of each other, reducing the probability of electromagnetic wave leakage and further improving the overall electromagnetic shielding effect of the electronic device 100.

[0185] For example, the thickness of the first insulating layer 61 and / or the fourth insulating layer 64 can be 1 μm to 100 μm.

[0186] For example, the materials of the first insulating layer 61 and / or the fourth insulating layer 64 may include polyethylene glycol terephthalate (PET) or polyimide (PI).

[0187] For example, the material of the first insulating layer 61 and / or the fourth insulating layer 64 may be a high magnetic loss material (e.g., a wave absorbing material, such as a magnetic permeability greater than or equal to 1), a high electrical loss material (e.g., a dielectric constant greater than or equal to 1), or an ultra-low electrical conductivity material (e.g., less than or equal to 1 S / m).

[0188] Figure 13 , Figure 14 and Figure 15Here are some other structural diagrams showing the arrangement of electronic device 100 on circuit board 5. Figure 16 For along Figure 13 The cross-sectional view of section line C-C' in the figure.

[0189] Understandably, in order to avoid obstruction, Figure 13 , Figure 14 and Figure 15 The fact that the first shielding layer 10 is not shown does not mean that the first shielding layer 10 does not exist. Figure 16 As shown, the first shielding layer 10 still exists on the side of the second shielding layer 20 away from the circuit board 5.

[0190] In some embodiments, such as Figures 13-16 As shown, the electronic device 100 may also include a third shielding layer 30 and a second insulating layer 62.

[0191] See Figure 16 The third shielding layer 30 is disposed on one side of the second shielding layer 20.

[0192] For example, the third shielding layer 30 may be disposed on the side of the second shielding layer 20 near the circuit board 5, or it may be disposed on the side of the second shielding layer 20 near the first shielding layer 10 (see [reference]). Figure 16 Alternatively, it can be simultaneously located on both the side of the second shielding layer 20 closest to the circuit board 5 and the side of the first shielding layer 10.

[0193] See Figure 13 , Figure 14 and Figure 15 The third shielding layer 30 and the second shielding layer 20 at least partially overlap in a direction perpendicular to the circuit board 5, see reference. Figure 16 The second insulating layer 62 is disposed between the second shielding layer 20 and the third shielding layer 30.

[0194] That is, a capacitor structure can be formed between the third shielding layer 30, the second insulating layer 62, and the second shielding layer 20.

[0195] It should be noted that "at least partially overlapping" here means that the third shielding layer 30 and the second shielding layer 20 have a facing area (i.e., effective capacitance area). For example, on the orthographic projection of the circuit board 5, the orthographic projection of the third shielding layer 30 and the orthographic projection of the second shielding layer 20 at least partially overlap to form a capacitor structure.

[0196] See Figure 16 The third shielding layer 30 is electrically connected to the circuit board 5.

[0197] That is, the third shielding layer 30 is used for electrical connection with the circuit board 5, and a capacitor structure is formed between the second shielding layer 20 and the third shielding layer 30, so that the second shielding layer 20 can achieve capacitive coupling connection with the circuit board 5 through the third shielding layer 30. In other words, the second shielding layer 20 can be grounded through the third shielding layer 30.

[0198] For example, the third shielding layer 30 can be directly electrically connected to the circuit board 5 (not shown in the figure, see the description of the first connection part 51 in the foregoing embodiment).

[0199] Alternatively, by way of example, the third shielding layer 30 may also overlap the shielding frame 40 so as to achieve electrical connection with the circuit board 5 through the shielding frame 40. For example, see Figure 13 and Figure 14 The third shielding layer 30 can be directly attached to the shielding frame 40, or, for example, see [reference needed]. Figure 15 The third shielding layer 30 can be electrically connected to the shielding frame 40 through a connecting part (similar to the second connecting part 52 in the aforementioned embodiment, which will not be described again here). This application embodiment does not limit this.

[0200] For example, see Figure 13 and Figure 14 The range of electromagnetic interference frequencies that the second shielding layer 20 can shield can be adjusted by changing the overlapping position of the third shielding layer 30 and the shielding frame 40.

[0201] For example, see Figure 13 The right side of the second shielding layer 20 contacts the shielding frame 40, forming a connection point (i.e., a grounding point). The left side of the second shielding layer 20 is coupled to the third shielding layer 30, and the left side of the third shielding layer 30 overlaps with the shielding frame 40, so that the other grounding point of the second shielding layer 20 can extend to the left side of the shielding frame 40. The distance between the two connection points (grounding points) of the second shielding layer 20 is relatively large, so that the second shielding cavity Q2 formed by the second shielding layer 20 can shield electromagnetic interference with higher frequencies.

[0202] Or, for example, see Figure 14 The third shielding layer 30 can also overlap with the lower frame of the shielding frame 40 or with the middle support 43 of the shielding frame 40, thereby reducing the difficulty of electrical connection between the third shielding layer 30 and the circuit board 5. Alternatively, it can adjust the frequency range of electromagnetic interference that the second shielding cavity Q2 formed by the second shielding layer 20 can shield.

[0203] In the electronic device 100 provided in this application embodiment, by setting a third shielding layer 30 and setting a second shielding layer 20 to achieve capacitive coupling connection (i.e. coupling ground) with the circuit board 5 through the third shielding layer 30, the capacitance of the capacitor structure formed by the second shielding layer 20 and the third shielding layer 30 can be adjusted by adjusting the area of ​​the third shielding layer 30, thereby forming a frequency selection effect, which can shield and suppress electromagnetic interference of specific frequencies, thereby enabling the electronic device 100 to be flexibly applied in different scenarios.

[0204] For example, see Figure 16 The third shielding layer 30 can also be set inside the first shielding cavity Q1 so as to form a capacitor structure with the second shielding layer 20, while avoiding occupying too much design space on the circuit board 5.

[0205] For example, see Figure 16 When the third shielding layer 30 is disposed between the first shielding layer 10 and the second shielding layer 20, the third shielding layer 30 is connected to the first shielding layer 10.

[0206] For example, the third shielding layer 30 and the first shielding layer 10 can be directly bonded together, or they can be bonded together with adhesive, or, for example, see [reference needed] Figure 16 The electronic device 100 may also include a third insulating layer 63 disposed between the first shielding layer 10 and the third shielding layer 30 to achieve electrical insulation between the two.

[0207] In some embodiments, where the second shielding layer 20 includes a plurality of first sub-layers 21, such as Figure 13 and Figure 14 As shown, each first sub-layer 21 overlaps at least partially with the third shielding layer 30 in a direction perpendicular to the circuit board 5.

[0208] That is, multiple first sub-layers 21 can share a third shielding layer 30, and multiple first sub-layers 21 can form a capacitor structure with the same third shielding layer 30, thereby simplifying the structure of the electronic device 100 and reducing its manufacturing difficulty.

[0209] Or, such as Figure 15 As shown, the third shielding layer 30 may also include a plurality of second sub-layers 31 spaced apart along the first direction (any direction parallel to the circuit board 5), wherein the first sub-layer 21 and the corresponding second sub-layer 31 at least partially overlap in the direction perpendicular to the circuit board 5.

[0210] That is, multiple first sub-layers 21 can each correspond to a separate second sub-layer 31, thereby forming multiple independent capacitor structures, avoiding mutual interference during frequency selection, and further improving the flexibility of frequency selection of electronic device 100.

[0211] Figure 17 This application provides a structural diagram of the electronic device 100 and some corresponding enlarged partial views. Figure 18 This is a schematic diagram of the orthographic projection of the first bracket 41 of the shielding frame 40 onto the circuit board 5.

[0212] In some embodiments, the shielding structure includes only a shielding frame and a shielding cover. In order to ensure the shielding effect, more than 90% of the surface area of ​​the shielding frame facing the circuit board 5 is connected (e.g., soldered) to the circuit board, which occupies a large amount of board surface design space and is not conducive to the miniaturization design of the electronic device 100.

[0213] In some embodiments provided in this application, such as Figure 17 As shown, the shielding frame 40 includes a first bracket 41.

[0214] See Figure 17 The first bracket 41 is arranged around a plurality of electronic devices 6. The first side of the first bracket 41 (the side closer to the circuit board 5) is connected to the surface of the circuit board 5, and the second side of the first bracket 41 (the side away from the circuit board 5, i.e. the first side and the second side are arranged opposite to each other) is electrically connected to the first shielding layer 10.

[0215] The first bracket 41 is provided with at least one first window K spaced apart. The first window K passes through the first bracket 41 in a direction parallel to the circuit board 5, and the first window K breaks the first side of the first bracket 41.

[0216] That is, the surface of the first bracket 41 facing the circuit board 5 is not entirely in contact with the circuit board 5. A portion of the surface is recessed away from the circuit board 5, forming a first window K, thereby exposing a portion of the circuit board 5. This reduces the space occupied by the shielding frame 40 on the circuit board 5, allowing more components to be placed on the circuit board 5. For example, see [reference needed]. Figure 17 Pin P (or other electronic components that meet the avoidance requirements) can be set at the position corresponding to the first window K on the circuit board 5, which is conducive to the miniaturization design of the circuit board 5 and even the electronic device 100.

[0217] For example, the sum of the dimensions of at least one first window K (e.g., multiple first windows K) on the extension path of the first bracket 41 is greater than or equal to 0.7 and less than 1 compared with the dimension of the first bracket 41 on the extension path.

[0218] For example, see Figure 18Multiple first windows K can divide the first bracket 41 into multiple components 41'. The size of each first window K on the extension path of the first bracket 41 is the distance d1 between two adjacent components 41'. The sum of the sizes of multiple first windows K on the extension path of the first bracket 41 is the sum of multiple distances d1. The size of the first bracket 41 on the extension path is the sum of the lengths d2 of multiple components 41' in its extension direction.

[0219] That is, the first window K in the first bracket 41 occupies 70% or more of the annular area enclosed by the first bracket 41, which greatly reduces the design space of the circuit board 5 occupied by the shielding frame 40.

[0220] For example, the length d2 of each component 41' in its extending direction may be less than or equal to 20 mm.

[0221] In the electronic device 100 provided in this application embodiment, by setting a second shielding layer 20, most of the electromagnetic interference generated by the electronic device 6 can be grounded and eliminated by the second shielding layer 20, thereby greatly reducing the electromagnetic interference transmitted to the first shielding layer 10. Therefore, a large space is reserved for the first opening K of the shielding frame 40 connected to the first shielding layer 10. Since most of the electromagnetic interference in the first shielding cavity Q1 formed by the first shielding layer 10 and the shielding frame 40 has been blocked by the second shielding layer 20, even if the first opening K of the shielding frame 40 is increased, the shielding effect can still be enhanced, thus taking into account both the improvement of the shielding effect of the electronic device 100 and the reduction of the design space occupied.

[0222] For example, such as Figure 17 As shown, the shielding frame 40 also includes a second bracket 42, which is connected to the second side of the first bracket 41 (e.g., electrically connected), and the first bracket 41 is connected to the first shielding layer 10 through the second bracket 42.

[0223] For example, the first bracket 41 is perpendicular to the circuit board 5, and the second bracket 42 is parallel to the circuit board 5.

[0224] In some embodiments, the material of the first shielding layer 10 and / or the second shielding layer 20 may include a conductive material, for example, a metallic material, such as copper or silver, or a material such as nickel silver or stainless steel.

[0225] For example, the material selection for the first shielding layer 10 and the second shielding layer 20 in the foregoing embodiments can follow the following rules: In some embodiments, the conductivity of the second shielding layer 20 is greater than the conductivity of the first shielding layer 10.

[0226] For example, in the case where the electronic device 100 includes multiple layers of second shielding layer 20, the conductivity of the second shielding layer 20 gradually decreases along the direction away from the circuit board 5.

[0227] For example, the conductivity of the second shielding layer 20 is greater than or equal to 5 × 10⁻⁶. 5 S / m; and / or, the conductivity of the first shielding layer 10 is 0.06 × 10⁻⁶. 5 S / m ~5×10 5 S / m.

[0228] For example, when the thickness of the first shielding layer 10 and the second shielding layer 20 is less than or equal to 0.15 mm, the conductivity of the second shielding layer 20 is greater than or equal to 5 × 10⁻⁶ mm. 5 The conductivity of the first shielding layer 10 is 0.06 × 10⁻⁶ S / m. 5 S / m ~5×10 5 S / m.

[0229] For example, the conductivity of the second shielding layer 20 can be 5 × 10⁻⁶. 5 S / m, 7.5×10 5 S / m or 11×10 6 S / m, etc. For example, the conductivity of the first shielding layer 10 can be 0.06 × 10⁻⁶. 5 S / m, 1.053×10 5 S / m, 2.3×10 5 S / m, 2.57×10 5 S / m or 5×10 5 S / m, etc.

[0230] That is, the material of the outer first shielding layer 10 can be set as a high-loss material (i.e., low conductivity), and the material of the inner second shielding layer 20 can be set as a high-conductivity material (i.e., high conductivity). On the one hand, the first shielding layer 10 with high-loss characteristics can suppress the generation of resonance problems. On the other hand, when the electromagnetic interference generated by the electronic device 6 reaches the second shielding layer 20, the second shielding layer 20 with high conductivity can block most of the electromagnetic interference. The remaining electromagnetic interference leaks into the first shielding layer 10 and is dissipated during transmission in the high-loss first shielding layer 10. Under the combined action of the high-loss first shielding layer 10 and the high-conductivity second shielding layer 20, the shielding effect of electromagnetic interference in the electronic device 100 is greatly improved.

[0231] For example, when the material of the first shielding layer 10 is a high-loss material and the material of the second shielding layer 20 is a high-conductivity material, the size of the first window K of the first bracket 41 in the shielding frame 40 can be further increased, thereby further reducing the design space of the circuit board 5 occupied by the shielding frame 40.

[0232] For example, when the material of the first shielding layer 10 is a high-loss material and the material of the second shielding layer 20 is a high-conductivity material, the first shielding layer 10 and the second shielding layer 20 can be directly bonded together. When the electromagnetic wave is transmitted to the second shielding layer 20, since the conductivity of the second shielding layer 20 is much greater than that of the first shielding layer 10, the electromagnetic wave will still be transmitted along the second shielding layer 20 with higher conductivity, and will be transmitted to the circuit board 5 through the grounding position of the second shielding layer 20 and dissipated, without leaking into the first shielding layer 10.

[0233] In some embodiments, the thickness of the second shielding layer 20 and / or the thickness of the third shielding layer 30 may be less than or equal to 0.15 mm. For example, the thickness of the second shielding layer 20 and / or the thickness of the third shielding layer 30 may be 0.001 mm to 0.15 mm, such as 0.001 mm, 0.015 mm, 0.08 mm, or 0.15 mm.

[0234] In some embodiments, the thermal conductivity of the second shielding layer 20 and / or the thermal conductivity of the third shielding layer 30 are greater than or equal to 50 W / (m×K). This achieves both good electromagnetic shielding and good heat dissipation in the electronic device 100, thus achieving a balance between the two.

[0235] In some embodiments, the material of the first shielding layer 10 includes at least one of carbon nanotubes (CNTs), graphene, carbon black, and two-dimensional transition metal carbides (MXene). This results in the first shielding layer 10 having high electrical loss, good heat dissipation, and reduced weight of the electronic device 100.

[0236] The electronic device 100 provided in the foregoing embodiments of this application can achieve an electromagnetic shielding effectiveness of 60dB or more, reduce the design area of ​​the circuit board 5 occupied by the shielding frame 40 by more than 70%, significantly reduce the temperature (for example, it can be reduced to 52°C), and reduce the overall weight of the electronic device 100 by more than 50%, which has significant beneficial effects.

[0237] like Figure 3 , Figure 5 and Figure 17 As shown in the figure, this application embodiment also provides a shielding structure 200, which includes a first shielding layer 10 and at least one second shielding layer 20.

[0238] The first shielding layer 10 is used to connect with the shielding frame 40 and form a first shielding cavity Q1.

[0239] like Figure 3 , Figure 5 and Figure 17 As shown, at least one second shielding layer 20 is stacked and connected to the first shielding layer 10. For example, the two are directly bonded and electrically connected, or bonded by adhesive, or connected by an insulating layer, thereby achieving the fixation between the second shielding layer 20 and the first shielding layer 10.

[0240] like Figure 3 , Figure 5 and Figure 17 As shown, the area of ​​the second shielding layer 20 is smaller than the area of ​​the first shielding layer 10. This allows the second shielding layer 20 to form a second shielding cavity Q2 with a volume smaller than the first shielding cavity Q1, thereby improving the shielding effect against electromagnetic interference.

[0241] It should be noted that the specific configuration of the first shielding layer 10, the second shielding layer 20, the shielding frame 40, the first shielding cavity Q1 and the second shielding cavity Q2 in this embodiment can refer to any of the foregoing embodiments, and will not be repeated here.

[0242] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed herein should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: A circuit board, the surface of which is provided with multiple electronic components; A shielding frame is attached to the surface of the circuit board, and the shielding frame is ring-shaped. A first shielding layer covers and connects to the side of the shielding frame away from the circuit board, wherein the circuit board, the first shielding layer, and the shielding frame enclose a first shielding cavity; the plurality of electronic devices are located within the first shielding cavity; A second shielding layer is stacked on top of the first shielding layer; the second shielding layer is at least partially disposed within the first shielding cavity, and the second shielding layer is disposed on the side of at least one electronic device away from the circuit board, and the orthographic projection of the second shielding layer on the circuit board at least partially overlaps with the orthographic projection of the at least one electronic device on the circuit board; the second shielding layer is coupled to the circuit board.

2. The electronic device according to claim 1, characterized in that, The second shielding layer includes a plurality of first sub-layers spaced apart in a first direction; the first direction is parallel to the circuit board; the first sub-layers are disposed on the side of at least one electronic device away from the circuit board, and the orthographic projection of the first sub-layers on the circuit board at least partially overlaps with the orthographic projection of at least one electronic device on the circuit board, and each first sub-layer is coupled to the circuit board.

3. The electronic device according to claim 2, characterized in that, At least two adjacent first sub-layers are electrically connected.

4. The electronic device according to any one of claims 1 to 3, characterized in that, At least a portion of the side of the second shielding layer is in contact with the shielding frame.

5. The electronic device according to any one of claims 1 to 4, characterized in that, Also includes: The first connecting part has one end electrically connected to the second shielding layer and the other end electrically connected to the circuit board.

6. The electronic device according to any one of claims 1 to 5, characterized in that, Also includes: The second connecting part has one end electrically connected to the second shielding layer and the other end electrically connected to the shielding frame.

7. The electronic device according to any one of claims 1 to 6, characterized in that, The second shielding layer includes at least one connection point, which is the portion of the second shielding layer that connects to the circuit board; In the case where the second shielding layer includes multiple connection points, the multiple connection points are respectively located on both sides of the electronic device covered by the second shielding layer in a first direction; the first direction is parallel to the circuit board.

8. The electronic device according to any one of claims 1 to 7, characterized in that, The first shielding layer and the second shielding layer are spaced apart; and / or, In the case where the electronic device includes at least two layers of the second shielding layer, the at least two layers of the second shielding layer are adjacent and disposed thereon.

9. The electronic device according to claim 8, characterized in that, Also includes: A first insulating layer is disposed between the second shielding layer and the first shielding layer.

10. The electronic device according to claim 9, characterized in that, In the case where the electronic device includes the at least two second shielding layers, the electronic device further includes: a fourth insulating layer disposed between the at least two second shielding layers.

11. The electronic device according to any one of claims 1 to 10, characterized in that, Also includes: A third shielding layer is disposed on one side of the second shielding layer, and the third shielding layer and the second shielding layer overlap at least partially in a direction perpendicular to the circuit board; The third shielding layer is electrically connected to the circuit board; A second insulating layer is disposed between the second shielding layer and the third shielding layer.

12. The electronic device according to claim 11, characterized in that, In the case where the second shielding layer comprises multiple first sublayers: Each first sublayer at least partially overlaps with the third shielding layer in a direction perpendicular to the circuit board; or, The third shielding layer includes a plurality of second sub-layers spaced apart in a first direction, wherein the first sub-layers and corresponding second sub-layers at least partially overlap in a direction perpendicular to the circuit board; the first direction is parallel to the circuit board.

13. The electronic device according to any one of claims 1 to 12, characterized in that, The shielding frame includes a first bracket; the first bracket is arranged around the plurality of electronic devices; a first side of the first bracket is connected to the surface of the circuit board, and a second side of the first bracket is electrically connected to the first shielding layer; The first bracket is provided with at least one first window, which penetrates the first bracket in a direction parallel to the circuit board, and the first window breaks through the first side of the first bracket.

14. The electronic device according to claim 13, characterized in that, The shielding frame further includes a second bracket, which is connected to the second side of the first bracket, and the first bracket is connected to the first shielding layer through the second bracket.

15. The electronic device according to claim 13 or 14, characterized in that, The sum of the dimensions of the at least one first window along the extension path of the first bracket is greater than or equal to 0.7 and less than 1, compared with the dimension along the extension path of the first bracket.

16. The electronic device according to any one of claims 1 to 15, characterized in that, The area of ​​the second shielding layer is less than or equal to half the area of ​​the first shielding layer.

17. The electronic device according to any one of claims 1 to 16, characterized in that, The conductivity of the second shielding layer is greater than that of the first shielding layer.

18. The electronic device according to any one of claims 1 to 17, characterized in that, The conductivity of the second shielding layer is greater than or equal to 5 × 10⁻⁶. 5 S / m; and / or, The conductivity of the first shielding layer is 0.06 × 10⁻⁶. 5 S / m ~5×10 5 S / m.

19. The electronic device according to any one of claims 1 to 18, characterized in that, The thickness of the first shielding layer and / or the thickness of the second shielding layer is less than or equal to 0.15 mm.

20. The electronic device according to any one of claims 1 to 19, characterized in that, The thermal conductivity of the first shielding layer and / or the thermal conductivity of the second shielding layer is greater than or equal to 50 W / (m×K).

21. The electronic device according to any one of claims 1 to 20, characterized in that, The material of the first shielding layer includes at least one of carbon nanotubes, graphene, carbon black, and two-dimensional transition metal carbides (nitrides).

22. A shielding structure, characterized in that, include: First shielding layer; The second shielding layer is stacked and connected to the first shielding layer; The area of ​​the second shielding layer is smaller than the area of ​​the first shielding layer.

23. The shielding structure according to claim 22, characterized in that, The second shielding layer includes a plurality of first sub-layers spaced apart in a first direction; the first direction is parallel to the first shielding layer; the first sub-layers are stacked and connected to the first shielding layer.

24. The shielding structure according to claim 23, characterized in that, At least two adjacent first sub-layers are electrically connected.

25. The shielding structure according to any one of claims 22 to 24, characterized in that, The area of ​​the second shielding layer is less than or equal to half the area of ​​the first shielding layer.

26. The shielding structure according to any one of claims 22 to 25, characterized in that, The conductivity of the second shielding layer is greater than that of the first shielding layer.

27. The shielding structure according to any one of claims 22 to 26, characterized in that, The conductivity of the second shielding layer is greater than or equal to 5 × 10⁻⁶. 5 S / m; and / or, The conductivity of the first shielding layer is 0.06 × 10⁻⁶. 5 S / m ~5×10 5 S / m.

28. The shielding structure according to any one of claims 22 to 27, characterized in that, The thickness of the first shielding layer and / or the thickness of the second shielding layer is less than or equal to 0.15 mm.

29. The shielding structure according to any one of claims 22 to 28, characterized in that, The thermal conductivity of the first shielding layer and / or the thermal conductivity of the second shielding layer is greater than or equal to 50 W / (m×K).

30. The shielding structure according to any one of claims 22 to 29, characterized in that, The material of the first shielding layer includes at least one of carbon nanotubes, graphene, carbon black, and two-dimensional transition metal carbides (nitrides).

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